WO2021044506A1 - 作業機、および部品装着方法 - Google Patents

作業機、および部品装着方法 Download PDF

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Publication number
WO2021044506A1
WO2021044506A1 PCT/JP2019/034523 JP2019034523W WO2021044506A1 WO 2021044506 A1 WO2021044506 A1 WO 2021044506A1 JP 2019034523 W JP2019034523 W JP 2019034523W WO 2021044506 A1 WO2021044506 A1 WO 2021044506A1
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WO
WIPO (PCT)
Prior art keywords
component
lead
spacer
lead wire
led component
Prior art date
Application number
PCT/JP2019/034523
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English (en)
French (fr)
Japanese (ja)
Inventor
広己 鈴木
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2021543830A priority Critical patent/JP7429701B2/ja
Priority to PCT/JP2019/034523 priority patent/WO2021044506A1/ja
Publication of WO2021044506A1 publication Critical patent/WO2021044506A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a working machine for mounting lead components on a substrate and a component mounting method for mounting lead components on a board.
  • Lead components are usually mounted on a substrate by inserting lead wires into through holes formed in the substrate, as described in the following patent documents.
  • An object of the present invention is to properly mount a lead component on a substrate.
  • the present specification includes a holding device for holding a lead component having a lead wire and a component body, and an imaging device for imaging the lead component, and mounts the lead component on a substrate.
  • the image pickup device takes an image of the lead component in a state where the lead wire of the lead component is inserted into an insertion hole formed in a spacer
  • the holding device takes an image of the lead component. Based on the data, a working machine for mounting the lead component in a state where the lead wire is inserted into the insertion hole on the substrate is disclosed.
  • the present specification describes the lead in a working machine provided with a holding device for holding a lead component having a lead wire and a component body, and an imaging device for imaging the lead component.
  • a component mounting method for mounting a component on a substrate wherein the lead wire of the lead component is inserted into an insertion hole formed in a spacer by the holding device, and a lead wire of the lead component held by the holding device. Based on the imaging step of imaging what is inserted into the insertion hole by the imaging device and the imaging data by the imaging device, the lead component in a state where the lead wire is inserted into the insertion hole is attached to the substrate.
  • a method of mounting parts including a mounting process for mounting is disclosed.
  • the lead component is imaged in a state where the lead wire is inserted into the insertion hole formed in the spacer, and the lead wire is inserted into the insertion hole based on the imaging data obtained by the imaging.
  • the lead component in the state of being made is mounted on the substrate.
  • the lead component in which the lead wire is inserted into the insertion hole of the spacer can be appropriately mounted on the substrate.
  • FIG. 1 shows the component mounting machine 10.
  • the component mounting machine 10 is a device for executing component mounting work on the circuit base material 12.
  • the component mounting machine 10 includes an apparatus main body 20, a base material transfer holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a loose component supply device 30, a component supply device 32, and a control device (see FIG. 9) 36.
  • Examples of the circuit board 12 include a circuit board, a base material having a three-dimensional structure, and the like, and examples of the circuit board include a printed wiring board and a printed circuit board.
  • the device main body 20 is composed of a frame 40 and a beam 42 mounted on the frame 40.
  • the base material transfer holding device 22 is arranged at the center of the frame 40 in the front-rear direction, and has a transfer device 50 and a clamp device 52.
  • the transport device 50 is a device that transports the circuit base material 12
  • the clamp device 52 is a device that holds the circuit base material 12.
  • the base material transport / holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position.
  • the transport direction of the circuit base material 12 is referred to as the X direction
  • the horizontal direction perpendicular to that direction is referred to as the Y direction
  • the vertical direction is referred to as the Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.
  • the component mounting device 24 is arranged on the beam 42, and has two work heads 60 and 62 and a work head moving device 64.
  • the work head moving device 64 includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Then, the two work heads 60 and 62 are integrally moved to an arbitrary position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. Further, the work heads 60 and 62 are detachably attached to the sliders 74 and 76, and the Z-direction moving device 72 individually moves the sliders 74 and 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.
  • a component holder 77 is attached to the lower end surfaces of the work heads 60 and 62.
  • the component holder 77 is a so-called chuck, and as shown in FIG. 3, includes a main body portion 78 and a pair of claw portions 79.
  • the pair of claws 79 are arranged so as to extend downward from the lower surface of the main body 78, and slide so as to be close to and separated from each other.
  • the component holder 77 holds the parts by the pair of claws 79 by bringing the pair of claws 79 closer to each other, and separates the pair of claws 79 from each other to separate the pair of claws.
  • the parts are separated from between the parts 79.
  • the mark camera 26 is attached to the slider 74 in a downward facing state, and is moved in the X, Y, and Z directions together with the work head 60. As a result, the mark camera 26 images an arbitrary position on the frame 40. Further, as shown in FIG. 1, the parts camera 28 is arranged between the base material transporting and holding device 22 on the frame 40 and the parts supply device 32 in a state of facing upward. As a result, the parts camera 28 images the parts held by the parts holders 77 of the work heads 60 and 62.
  • the loose parts supply device 30 is arranged at one end of the frame 40 in the front-rear direction.
  • the loose parts supply device 30 is a device that aligns a plurality of parts that are scattered apart and supplies the parts in the aligned state. That is, it is a device that aligns a plurality of parts in an arbitrary posture in a predetermined posture and supplies the parts in the predetermined posture.
  • the parts supply device 32 is arranged at the other end of the frame 40 in the front-rear direction.
  • the parts supply device 32 includes a tray-type parts supply device 96 and a feeder-type parts supply device 98.
  • the tray-type component supply device 96 is a device that supplies components in a state of being placed on the tray.
  • the feeder type component supply device 98 is a device that supplies components by the tape feeder 100.
  • the tape feeder 100 will be described in detail below.
  • Examples of the parts supplied by the loose parts supply device 30 and the parts supply device 32 include electronic circuit parts, solar cell components, power module components, and the like. Further, electronic circuit parts include parts having reeds, parts having no reeds, and the like.
  • the tape feeder 100 includes the feeder main body 102, and is detachably attached to the mounting base (see FIG. 1) 104 provided at the end of the frame 40 in the feeder main body 102.
  • the tape feeder 100 is a device that removes the LED component 108 from the taped component 106 and supplies the removed LED component 108.
  • the taped component 106 is composed of a plurality of LED components 108 and a carrier tape 110.
  • the LED component 108 is a kind of radial lead component, and includes a component body 112 and two lead wires 114 extending in the same direction from the bottom surface of the component body 112. Then, the two lead wires 114 of the LED component 108 are taped to the carrier tape 110 at the lower end portion.
  • the carrier tape 110 is formed with a plurality of feed holes 118 at equal pitches. The plurality of LED parts 108 are also taped to the carrier tape 110 at the same pitch as the formation pitch of the feed holes 118.
  • the tape feeder 100 has a guide mechanism 120, a sending device 122, a lead bending device 124, and a lead cutting device 126.
  • the guide mechanism 120, the delivery device 122, the lead bending device 124, and the lead cutting device 126 are arranged inside the feeder main body 102.
  • the side on which the lead cutting device 126 is arranged may be described as the front side, and the side opposite to the front side thereof may be described as the rear side.
  • the guide mechanism 120 is composed of a pair of guide rails 128, and the pair of guide rails 128 are arranged on the upper end surface of the feeder main body 102 so as to extend in the front-rear direction while facing each other. .. Then, the carrier tape 110 of the taped component 106 is inserted between the pair of guide rails 128 in a state in which the width direction of the carrier tape 110 extends in the vertical direction, that is, in an upright state.
  • the state in which the carrier tape 110 is erected is a state in which the carrier tape 110 and the upper surface of the tape feeder 100 intersect at a right angle, and a lead wire 114 taped on the carrier tape 110 extends in the vertical direction. .. Then, the LED component 108 held by the carrier tape 110 extends upward from between the pair of guide rails 128.
  • the delivery device 122 has a claw member (not shown) and a delivery air cylinder 130.
  • the claw members are arranged so as to be slidable in the front-rear direction below the pair of guide rails 128, and slide in the front-rear direction by the operation of the delivery air cylinder 130. Further, the claw member is engaged with the feed hole 118 of the taped component 106 inserted between the pair of guide rails 128. Then, as the claw member slides forward, the taped component 106 is sent forward. The amount of one slide of the claw member is set to be the same length as the formation pitch of the feed hole 118 to the taped component 106. Further, when the claw member slides rearward, the engagement of the claw member with the feed hole 118 is released. As a result, the claw member reciprocates once in the front-rear direction, so that the taped component 106 is fed forward in an amount corresponding to the formation pitch of the feed hole 118.
  • the lead bending device 124 is arranged in the direction in which the taped component 106 is sent out by the sending device 122, that is, in front of the sending device 122.
  • the lead bending device 124 includes a fixed block 132, a movable block 134, and a lead bending air cylinder (see FIG. 9) 136.
  • the fixing block 132 is fixed to one upper surface of a pair of guide rails 128 of the guide mechanism 120, and is slightly connected to the lead wire 114 of the LED component 108 extending upward from between the pair of guide rails 128. They face each other with a gap.
  • the fixing block 132 is formed with a recess 138 on the side surface of the LED component 108 facing the lead wire 114.
  • the movable block 134 is arranged on the other upper surface of the pair of guide rails 128 of the guide mechanism 120 so as to face the fixed block 132 with the lead wire 114 of the LED component 108 interposed therebetween. It is slidable toward block 132. Then, by operating the lead bending air cylinder 136, the movable block 134 approaches and separates from the fixed block 132 in a controllable manner.
  • the movable block 134 is formed with a convex portion 140 so as to face the concave portion 138 of the fixed block 132.
  • the movable block 134 approaches the fixed block 132 by the operation of the lead bending air cylinder 136, so that the lead wire 114 of the LED component 108 approaches the fixed block 132 and the movable block as shown in FIG. It is sandwiched by 134.
  • the convex portion 140 of the movable block 134 presses the lead wire 114 of the LED component 108 toward the inside of the concave portion 138 of the fixed block 132.
  • the lead wire 114 of the taped LED component 108 bends in the recess 138 of the fixed block 132.
  • a lead cutting device 126 is arranged on the front side of the lead bending device 124, that is, in the delivery direction of the taped component 106.
  • the lead cutting device 126 includes a fixing member 146, a swing member 148, and a lead cutting air cylinder (see FIG. 9) 150.
  • the fixing member 146 and the swinging member 148 are arranged on the front side of the lead bending device 124 in a state of sandwiching the carrier tape 110 of the taped component 106 sent out by the sending device 122.
  • the fixing member 146 is fixedly arranged in a posture extending in the vertical direction, and the upper end portion of the fixing member 146 faces the lead wire 114 taped on the carrier tape 110.
  • a fixing plate 152 is arranged at the upper end of the fixing member 146.
  • the swing member 148 is arranged so as to extend in the vertical direction while sandwiching the carrier tape 110 and facing the fixing member 146.
  • the swing member 148 is capable of swinging in a direction in which the upper end thereof is approached and separated from the fixing member 146. Further, the swing member 148 swings in a controllable manner by the operation of the lead cutting air cylinder 150. Further, the upper end of the swing member 148 faces the lead wire 114 taped on the carrier tape 110, and the swing side holding plate 154 is arranged at the upper end of the swing member 148.
  • the swing member 148 is oscillated by the operation of the lead cutting air cylinder 150, so that the swing side holding plate 154 of the swing member 148 approaches and separates from the fixed side holding plate 152 of the fixing member 146.
  • a pair of notches 156 are formed on the side edges of the swing-side holding plate 154 facing the fixed-side holding plate 152. The pair of notches 156 are detachably attached in a state where the wire diameter of the pair of lead wires 114 of the LED component 108 and the shape corresponding to the pitch are positioned.
  • the swing member 148 swings in the direction in which the upper end portion approaches the fixing member 146, whereby the pair of lead wires 114 of the LED component 108 taped on the carrier tape 110 are fixed. It is sandwiched between the side sandwiching plate 152 and the swinging side sandwiching plate 154. At this time, the pair of lead wires 114 is inserted into the pair of notches 156 of the swing-side holding plate 154 and positioned. As a result, the LED component 108 having the pair of lead wires 114 is held in a predetermined position.
  • a swing side cutter (not shown) is arranged below the swing side holding plate 154, and below the fixed side holding plate 152, the fixed side is opposed to the swing side cutter.
  • the cutter (not shown) is detachably attached in a positioned state. Therefore, the pair of lead wires 114 sandwiched between the fixed-side holding plate 152 and the swing-side holding plate 154 are cut by the swing-side cutter and the fixed-side cutter. As a result, the LED component 108 is separated from the carrier tape 110, and the LED component 108 is supplied at a position positioned by the swing-side holding plate 154.
  • the lead wire 114 of the LED component 108 is positioned by the pair of notches 156 of the swing-side holding plate 154, and the position sandwiched by the fixed-side holding plate 152 and the swing-side holding plate 154 becomes the supply position. At that supply position, the LED component 108 is supplied.
  • the control device 36 includes a controller 170, a plurality of drive circuits 172, and an image processing device 176.
  • the plurality of drive circuits 172 include the transfer device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray type parts supply device 96, the delivery air cylinder 130, the lead bending air cylinder 136, and the lead cutting. It is connected to the air cylinder 150 and the loose parts supply device 30.
  • the controller 170 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 172. As a result, the operation of the base material transfer holding device 22, the component mounting device 24, and the like is controlled by the controller 170.
  • the controller 170 is also connected to the image processing device 176.
  • the image processing device 176 processes the image data obtained by the mark camera 26 and the parts camera 28, and the controller 170 acquires various information from the image data.
  • components are mounted on the circuit substrate 12 held by the substrate transfer holding device 22 according to the above configuration.
  • the circuit base material 12 is conveyed to a working position, and is fixedly held by the clamp device 52 at that position.
  • the mark camera 26 moves above the circuit base material 12 and images the circuit base material 12.
  • the circuit base material 12 is formed with a plurality of through holes (see FIG. 10) 180 for inserting the lead wires 114 of the LED component 108, and the circuit base material 12 is based on the imaging data of the mark camera 26.
  • the position of the through hole 180 formed in 12 is calculated by the controller 170.
  • the loose parts supply device 30 or the parts supply device 32 supplies parts at a predetermined supply position.
  • the tape feeder 100 supplies the LED component 108 at a position where the lead wire 114 is cut by the lead cutting device 126 and is sandwiched between the fixed side sandwiching plate 152 and the swinging side sandwiching plate 154. ..
  • the tape feeder 100 supplies the LED component 108 in the unbent state of the lead wire 114 without operating the lead bending device 124 will be described.
  • one of the work heads 60 and 62 moves above the lead cutting device 126 of the tape feeder 100, that is, above the supply position, and the component of the LED component 108 is provided by the pair of claws 79 of the component holder 77.
  • the main body 112 is gripped.
  • the work heads 60 and 62 holding the parts move above the parts camera 28, and the LED parts 108 held by the parts holder 77 are imaged by the parts camera 28.
  • the tip position of the lead wire 114 of the LED component 108 is calculated.
  • the X-direction moving device 68 and the Y-direction moving device 70 of the work head moving device 64 overlap so that the calculated tip positions of the pair of lead wires and the positions of the pair of through holes 180 of the circuit base material overlap. Operation is controlled. Then, the component holder 77 holding the LED component 108 is lowered by the operation of the Z-direction moving device 72 of the work head moving device 64. As a result, as shown in FIG. 10, the lead wire of the LED component 108 is inserted into the through hole 180 of the circuit base material 12. In this way, in the component mounting machine 10, the LED component 108 is mounted on the circuit base material 12.
  • the LED component 108 is directly mounted on the circuit base material 12, but may be mounted on the circuit base material 12 via a spacer.
  • the spacer 190 shown in FIG. 11 generally has a cylindrical shape, and the spacer 190 is formed with a through hole 192 penetrating in the axial direction.
  • the inner diameter of the through hole 192 of the spacer 190 is smaller than the outer diameter of the component main body 112 of the LED component 108 and larger than the outer diameter of the pitch of the pair of lead wires 114 which is the a dimension shown in FIG. It is a size that creates a gap when the lead wire 114 is inserted.
  • the height dimension of the spacer 190 is shorter than the length dimension of the lead wire 114.
  • the spacer 200 shown in FIG. 12 generally has a quadrangular prism shape, and four insertion grooves 202 are formed at four equal positions on the four side surfaces of the spacer 200 so as to extend in the axial direction. ing.
  • the width dimension of each of the four insertion grooves 202 is longer than the wire diameter of the lead wire 114 of the LED component 108.
  • the four insertion grooves 202 are cut toward the central portion of the spacer 200, and the bottom portions of the pair of insertion grooves 202 formed on the opposite pair of side surfaces of the spacer 200 face each other.
  • the distance between the bottoms of the pair of insertion grooves 202 is shorter than the inner dimension of the pitch of the pair of lead wires 114 of the LED component 108 having the b dimension shown in FIG. 5, and the pair of lead wires 114. It is a dimension that creates a gap when the LED is inserted. Further, the height dimension of the spacer 200 is shorter than the length dimension of the lead wire 114. Therefore, it is possible to insert the pair of lead wires 114 into the pair of insertion grooves 202 facing each other of the spacer 200, and when the pair of lead wires 114 are inserted into the pair of insertion grooves 202, The bottom surface of the component body 112 is in close contact with one of the pair of end faces of the spacer 200. At this time, the tips of the pair of lead wires 114 of the LED component 108 extend from the other of the pair of end faces.
  • the lead wire 114 extending from the end face of the spacer 190 or the end face of the spacer 200 is inserted into the through hole 180 of the circuit base material 12, so that the LED component 108 can be inserted through the spacer 190 or the spacer 200. It is mounted on the circuit base material 12. Specifically, as shown in FIG. 13, the lead wire 114 inserted into the insertion groove 202 of the spacer 200 extends from the end face of the spacer 200, and the lead wire 114 extends into the through hole 180 of the circuit base material 12.
  • the LED component 108 is mounted on the circuit base material 12 via the spacer 200.
  • the LED component 108 can be mounted on the circuit base material 12 in a raised state, and the position of the LED component 108 on the circuit base material 12 in the vertical direction depends on the height of the spacer 200 used. Can be adjusted arbitrarily.
  • the mounting work of the LED component 108 on the circuit base material 12 via the spacer cannot be automatically performed by the component mounting machine 10, and the operator manually performs the mounting work.
  • an operator holds the spacer 200 and the LED component 108, and inserts the lead wire 114 of the LED component 108 into the insertion groove 202 of the spacer 200.
  • the LED component 108 and the spacer 200 are integrated.
  • the operator holds the integrated LED component 108 and the spacer 200 so that the LED component 108 and the spacer 200 are not separated, and the lead wire 114 extending from the end face of the spacer 200 is attached to the circuit base material 12. Insert into the through hole 180. In this way, the operator manually attaches the LED component 108 to the circuit base material 12 via the spacer 200.
  • the component mounting machine 10 attempts to integrate the LED component 108 and the spacer 200 and mount the integrated LED component 108 and the spacer 200 on the circuit base material 12, they are integrated. There is a risk that the LED component 108 and the spacer 200 will be separated from each other. That is, the above-mentioned two types of spacers and the pair of lead wires 114 of the LED components 108 inserted into the spacers have a dimensional relationship so that a gap is formed so that the lead wires can be easily inserted. Further, as shown in FIG. 13, since the wire diameter A of the lead wire 114 is smaller than the width dimension B of the insertion groove 202, the spacer 200 must be properly held between the integrated LED component 108 and the spacer 200.
  • the circuit base material 12 Place on the top surface. Then, the operator inserts the lead wire 114 of the LED component 108 into the insertion groove 202 of the spacer 200 placed on the upper surface of the circuit base material 12 from the upper end surface of the spacer 200. As a result, the tip of the lead wire 114 extends downward from the lower end surface of the spacer 200 and is inserted into the through hole 180 of the circuit base material 12. In this way, the operator can manually attach the LED component 108 to the circuit base material 12 via the spacer 200 twice.
  • the spacer 200 is executed. If the lead wire 114 is displaced on the upper surface of the circuit base material 12, the lead wire 114 may not be inserted into the through hole 180. That is, between the time when the spacer 200 is placed on the upper surface of the circuit base material 12 and the time when the lead wire 114 of the LED component 108 is inserted into the insertion groove 202 of the spacer 200, the spacer 200 is placed on the upper surface of the circuit base material 12. There may be a gap in.
  • the through hole 180 of the circuit base material 12 and the insertion groove 202 of the spacer 200 do not communicate with each other in the vertical direction, and even if the lead wire 114 is inserted into the insertion groove 202, the lead wire 114 is circuited. It cannot be inserted into the through hole 180 of the base material 12. Therefore, the work of placing the spacer 200 on the upper surface of the circuit base material 12 and inserting the lead wire 114 of the LED component 108 into the insertion groove 202 of the spacer 200 cannot be performed by the component mounting machine 10. Alternatively, when the lead wire 114 of the LED component 108 is inserted into the through hole of the circuit base material 12, the spacer 200 placed on the upper surface of the circuit base material 12 must be held or fixed so as not to move.
  • a bent portion is formed in the lead wire 114 of the LED component 108 in the tape feeder 100. Then, the lead wire 114 is inserted into the insertion groove 202 of the spacer 200, and the bent portion of the lead wire 114 prevents the spacer 200 from coming off from the LED component 108. It is possible to carry out the mounting work on the circuit base material 12 at one time by integrating the component 108.
  • the pair of lead wires 114 taped to the carrier tape 110 is bent by the lead bending device 124, and then the pair of lead wires 114 are cut by the lead cutting device 126.
  • An LED component 108 in which a pair of lead wires 114 is bent is supplied.
  • the bending amount of the lead wire 114 by the lead bending device 124 is C as shown in FIG. 14, and the width dimension of the bent portion 220 of the lead wire 114 is the bending amount C of the lead wire 114 and the lead.
  • a + C is obtained by adding the wire diameter A of the wire 114.
  • the bending amount C of the lead wire 114 is adjusted so that the width dimension (A + C) of the bent portion 220 is slightly larger than the width dimension B of the insertion groove 202 of the spacer 200.
  • the bending amount C of the lead wire 114 is adjusted by the protruding amount of the convex portion 140 of the movable block 134 of the lead bending device 124.
  • the work heads 60 and 62 move above the component supply position of the tape feeder 100, and the component main body of the LED component 108 is supplied.
  • the 112 is gripped by a pair of claws 79 of the component holder 77.
  • the work heads 60 and 62 move above the parts camera 28, and the LED component 108 gripped by the component holder 77 is imaged from below by the parts camera 28.
  • information regarding the tip position of the lead wire 114 of the LED component 108 held by the work heads 60 and 62 is calculated based on the imaging data.
  • the information regarding the tip positions of the lead wires 114 includes the respective tip positions of the pair of lead wires 114, the pitch of the pair of lead wires 114, and the like.
  • the spacer 200 is supplied in the tray (see FIG. 15) 230. Specifically, as shown in FIG. 15, a recess 232 is formed on the upper surface of the tray 230. The inner diameter of the recess 232 is smaller than the outer diameter of the spacer 200 and larger than the width dimension of the insertion groove 202. Then, the spacer 200 is placed on the upper surface of the tray 230 in a state where the spacer 200 is positioned so that the bottom of the insertion groove 202 coincides with the recess 232 in the vertical direction, that is, the bottom of the insertion groove 202 communicates with the recess 232. Has been done.
  • the mark camera 26 moves above the spacer 200 mounted on the tray 230, and the spacer 200 mounted on the tray 230 is imaged by the mark camera 26. Based on this imaging data, information regarding the opening position of the insertion groove 202 to the upper end surface of the spacer 200 is calculated.
  • the LED component 108 on which the bent portion 220 is formed is gripped from the tape feeder 100 by the component holder 77, the work is performed so that the calculated tip position of the lead wire and the opening position of the insertion groove 202 overlap.
  • the operation of the X-direction moving device 68 and the Y-direction moving device 70 of the head moving device 64 is controlled.
  • the component holder 77 holding the LED component 108 is lowered by the operation of the Z-direction moving device 72 of the work head moving device 64.
  • the lead wire 114 of the LED component 108 is inserted into the insertion groove 202 of the spacer 200.
  • the lead wire 114 is inserted into the insertion groove 202 until the lower surface of the component body 112 of the LED component 108 contacts the upper end surface of the spacer 200.
  • the tip end portion of the lead wire 114 extends from the lower end surface of the spacer 200 toward the recess 232 of the tray 230.
  • the width dimension (A + C) of the bent portion 220 of the lead wire 114 inserted into the insertion groove 202 is slightly larger than the width dimension B of the insertion groove 202 of the spacer 200, the lead wire 114 is inserted into the insertion groove 202.
  • the bent portion 220 is elastically deformed. Therefore, the lead wire 114 is fixed inside the insertion groove 202 by the elastic force of the bent portion 220. That is, the lead wire 114 is fixedly held inside the insertion groove 202 of the spacer 200 by the elastic force of the bent portion 220, and the LED component 108 and the spacer 200 are integrated so as not to come off.
  • the spacer 200 does not fall out of the lead wire 114 and is integrated with the LED component 108. In the modified state, it is lifted by the component holder 77.
  • the operation of the Y-direction moving device 70 is controlled.
  • the component holder 77 holding the LED component 108 is lowered by the operation of the Z-direction moving device 72 of the work head moving device 64.
  • the lead wire 114 of the LED component 108 extending downward from the lower end surface of the spacer 200 is inserted into the pair of through holes 180 of the circuit base material 12.
  • the LED component 108 is mounted on the circuit base material 12 via the spacer 200.
  • the bent portion 220 is formed on the lead wire 114 of the LED component 108, so that the spacer 200 comes off from the lead wire 114 inserted into the insertion groove 202 at the bent portion 220. Is prevented.
  • the mounting operation of the LED component 108 on the circuit base material 12 via the spacer 200 can be automatically and once executed.
  • the LED component 108 in the state where the lead wire 114 is inserted into the insertion groove 202 is imaged by the parts camera 28 and obtained by the imaging.
  • the mounting work of the LED component 108 is executed based on the captured imaging data. That is, the tip position of the lead wire 114 extending from the lower end surface of the spacer 200 of the LED component 108 in the state where the lead wire 114 is inserted into the insertion groove 202 is calculated based on the imaging data.
  • the operation of the work head moving device 64 is controlled so that the calculated tip position of the lead wire 114 and the position of the through hole 180 of the circuit base material 12 coincide with each other in the vertical direction, and the lead wire 114 penetrates. It is inserted into the hole 180.
  • the lead wire 114 of the LED component 108 integrated with the spacer 200 can be appropriately inserted into the through hole 180 of the circuit base material 12.
  • the component mounting machine 10 is an example of a working machine.
  • the parts camera 28 is an example of an imaging device.
  • the component holder 77 is an example of a holding device.
  • the LED component 108 is an example of an LED component and a lead component.
  • the component body 112 is an example of the component body.
  • the lead wire 114 is an example of a lead wire.
  • the spacer 190 is an example of a spacer.
  • the through hole 192 is an example of an insertion hole.
  • the spacer 200 is an example of a spacer.
  • the insertion groove 202 is an example of an insertion hole.
  • the present invention is not limited to the above embodiment, and can be implemented in various modes with various changes and improvements based on the knowledge of those skilled in the art.
  • the spacers 190 and 200 are used for the purpose of adjusting the vertical position of the LED component 108, but are used for another purpose, for example, for decoration and the like. You may.
  • the insertion hole of the spacer into which the lead wire 114 of the LED component 108 is inserted may be a through hole, a groove, a recess, a notch, or the like as long as the lead wire 114 can be inserted.
  • the present invention is applied to a lead component in which a pair of lead wires 114 extend from the component body 112 in the same direction, that is, a radial lead component, but the present invention is applied in the opposite direction from the component body.
  • the present invention may be applied to a lead component in which a pair of lead wires extends, that is, an axial lead component.
  • the present invention is not limited to the LED component 108 as long as it is a component having a lead wire or a pin, and the present invention may be applied to various electric components.
  • the component holder 77 that is, the component is held by the chuck, but if the holding device can hold the component, the component is held in various modes such as a suction nozzle and a robot arm. It is possible to adopt a holding device. Further, when the lead wire 114 of the LED component 108 is inserted into the insertion groove 202 of the spacer 200, the component main body 112 of the LED component 108 is held by the component holder 77, but the lead wire 114 is held by the component holder 77. May be retained.
  • the integrated LED component 108 and the spacer 200 are held in the component body 112. However, it may be held by the lead wire 114 or the spacer 200. That is, while the integrated LED component 108 and the spacer 200 are held by the lead wire 114 or the spacer 200, imaging by the parts camera 28, mounting work on the circuit base material 12, and the like may be executed. ..
  • the present invention is applied to a lead component having a pair of lead wires, but the present invention may be applied to a lead component having three or more lead wires. Further, in the above embodiment, all the lead wires of the lead component are inserted into the insertion holes of the spacer, but some of all the lead wires of the lead component are inserted into the insertion holes of the spacer. May be good.
  • the lead wire 114 when the lead wire 114 is inserted into the insertion groove 202, the lead wire 114 is inserted until the lower end surface of the component body 112 contacts the upper end surface of the spacer 200, that is, to the root of the lead wire 114. Although it is inserted into the groove 202, the lead wire 114 may be inserted into the insertion groove 202 halfway through the lead wire 114.
  • the lead wire 114 When the integrated LED component 108 and the spacer 200 are mounted on the circuit substrate 12, the component body 112 gripped by the component holder 77 is pushed toward the circuit substrate 12. As a result, the lead wire 114 may be inserted into the insertion groove 202 up to the root, and the tip end portion of the lead wire 114 may be inserted into the through hole 180 of the circuit base material 12.
  • the lead wire 114 is bent by the lead bending device 124 built in the tape feeder 100, but the lead bending device or the component mounting machine arranged outside the tape feeder 100 is used.
  • the lead wire 114 may be bent by a lead bending device provided independently of the tape feeder. Further, even if the lead wire 114 is not bent inside the component mounting machine 10, the LED component in which the lead wire 114 is bent and the lead wire 114 is bent is generated in the component mounting machine 10. It may be supplied.
  • the LED component 108 in which the lead wire 114 is bent may be one in which the operator bends the lead wire 114.
  • the integrated LED component 108 and the spacer 200 are circuited.
  • the LED component 108 and the spacer 200 may be individually mounted on the circuit base material 12. That is, the spacer 200 is gripped by the component holder 77, and the spacer 200 gripped by the component holder 77 is placed on the upper surface of the circuit base material 12 so that the insertion groove 202 and the through hole 180 communicate with each other.
  • the LED component 108 is gripped by the component holder 77, and the tip of the lead wire 114 of the LED component 108 gripped by the component holder 77 is inserted into the insertion groove of the spacer 200 placed on the upper surface of the circuit base material 12. Insert into 202. In this way, the LED component 108 and the spacer 200 may be individually mounted on the circuit base material 12.
  • Parts mounting machine working machine
  • Parts camera imaging device
  • Parts holder holding device
  • LED parts lead parts
  • 112 Parts body
  • Lead wire 190: Spacer 192: Through hole (Insert hole) 200: Spacer 202: Insert groove (insertion hole)

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2019/034523 2019-09-03 2019-09-03 作業機、および部品装着方法 WO2021044506A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021543830A JP7429701B2 (ja) 2019-09-03 2019-09-03 作業機、および部品装着方法
PCT/JP2019/034523 WO2021044506A1 (ja) 2019-09-03 2019-09-03 作業機、および部品装着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/034523 WO2021044506A1 (ja) 2019-09-03 2019-09-03 作業機、および部品装着方法

Publications (1)

Publication Number Publication Date
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JP (1) JP7429701B2 (enrdf_load_stackoverflow)
WO (1) WO2021044506A1 (enrdf_load_stackoverflow)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4606120A (en) * 1983-10-26 1986-08-19 General Electric Company Process for mounting components on a printed circuit board
JPS63170980U (enrdf_load_stackoverflow) * 1987-04-27 1988-11-07
JPH0499600U (enrdf_load_stackoverflow) * 1991-01-28 1992-08-27
JPH098434A (ja) * 1995-06-19 1997-01-10 Nippondenso Co Ltd 電子回路ユニット及びその製造方法
WO2017068638A1 (ja) * 2015-10-20 2017-04-27 富士機械製造株式会社 画像処理装置および部品実装機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61138260U (enrdf_load_stackoverflow) * 1985-02-15 1986-08-27
JP2009064823A (ja) * 2007-09-04 2009-03-26 Fujitsu Telecom Networks Ltd Ｌｅｄ取付用スペーサ
JP6528123B2 (ja) 2015-05-15 2019-06-12 パナソニックＩｐマネジメント株式会社 部品取出し装置および部品取出し方法ならびに部品実装装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4606120A (en) * 1983-10-26 1986-08-19 General Electric Company Process for mounting components on a printed circuit board
JPS63170980U (enrdf_load_stackoverflow) * 1987-04-27 1988-11-07
JPH0499600U (enrdf_load_stackoverflow) * 1991-01-28 1992-08-27
JPH098434A (ja) * 1995-06-19 1997-01-10 Nippondenso Co Ltd 電子回路ユニット及びその製造方法
WO2017068638A1 (ja) * 2015-10-20 2017-04-27 富士機械製造株式会社 画像処理装置および部品実装機

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