WO2021027147A1 - 时序控制板及显示装置 - Google Patents

时序控制板及显示装置 Download PDF

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Publication number
WO2021027147A1
WO2021027147A1 PCT/CN2019/117789 CN2019117789W WO2021027147A1 WO 2021027147 A1 WO2021027147 A1 WO 2021027147A1 CN 2019117789 W CN2019117789 W CN 2019117789W WO 2021027147 A1 WO2021027147 A1 WO 2021027147A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
timing control
control board
terminal
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/117789
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English (en)
French (fr)
Inventor
方晓莉
肖光星
刘克远
谢剑军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
TCL China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCL China Star Optoelectronics Technology Co Ltd filed Critical TCL China Star Optoelectronics Technology Co Ltd
Priority to US16/616,505 priority Critical patent/US20210043157A1/en
Publication of WO2021027147A1 publication Critical patent/WO2021027147A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped

Definitions

  • This application relates to the field of display, and in particular to a timing control board and a display device.
  • TCON Timing Control
  • QFP Plastic Quad Flat Package
  • the existing timing control board has a problem of poor heat dissipation performance, which needs to be solved.
  • the present application provides a timing control board to alleviate the problem of poor heat dissipation performance of the existing timing control board.
  • This application provides a timing control board, including:
  • the timing control chip includes a first signal terminal and at least two first heat dissipation terminals;
  • the control board includes a second signal terminal corresponding to the first signal terminal and a second heat dissipation terminal corresponding to the first heat dissipation terminal;
  • a first connecting member for connecting the first signal terminal and the second signal terminal
  • the second connecting member is used to connect the first heat dissipation terminal and the second heat dissipation terminal.
  • the first heat dissipation terminal is located in the middle area of the timing control chip.
  • the side length of the middle area is half of the side length of the timing control chip.
  • the distance between two adjacent first heat dissipation terminals is 0.8-1 mm.
  • the distance between two opposite sides of the first heat dissipation terminal is 1.8 to 2.0 mm.
  • timing control board there are at least two of the first heat dissipation terminals that have different sizes.
  • the first heat dissipation terminals are arranged in an array.
  • the first heat dissipation terminal is arranged axially symmetrically.
  • the shape of the first heat dissipation terminal is one or more of octagonal, quadrilateral or circular.
  • the present application provides a display device, including a timing control board, and the timing control board includes:
  • the timing control chip includes a first signal terminal and at least two first heat dissipation terminals;
  • the control board includes a second signal terminal corresponding to the first signal terminal and a second heat dissipation terminal corresponding to the first heat dissipation terminal;
  • a first connecting member for connecting the first signal terminal and the second signal terminal
  • the second connecting member is used to connect the first heat dissipation terminal and the second heat dissipation terminal.
  • the first heat dissipation terminal is located in the middle area of the timing control chip.
  • the side length of the middle area is half of the side length of the timing control chip.
  • the distance between two adjacent first heat dissipation terminals is 0.8-1 mm.
  • the distance between two opposite sides of the first heat dissipation terminal is 1.8 to 2.0 mm.
  • all the first heat dissipation terminals have the same size.
  • At least two of the first heat dissipation terminals have different sizes.
  • the first heat dissipation terminals are arranged in an array.
  • the first heat dissipation terminal is arranged axially symmetrically.
  • the shape of the first heat dissipation terminal is one or more of octagonal, quadrilateral, and circular.
  • the application provides a timing control board.
  • the timing control board includes a timing control chip and a control board.
  • the timing control chip is provided with at least two first heat dissipation terminals
  • the control board is provided with a second heat dissipation terminal corresponding to the first heat dissipation terminal. Terminal, and the first heat dissipation terminal and the second heat dissipation terminal are connected.
  • FIG. 1 is a schematic structural diagram of a timing control board provided by an embodiment of the application.
  • FIG. 2(a) is a schematic diagram of the timing control chip of the first timing control board provided by an embodiment of the application.
  • FIG. 2(b) is a schematic diagram of the control board of the first timing control board provided by an embodiment of the application.
  • Fig. 3 (a) is a schematic diagram of a second timing control chip of a timing control board provided by an embodiment of the application.
  • FIG. 3(b) is a schematic diagram of the control board of the second timing control board provided by the embodiment of the application.
  • FIG. 4(a) is a schematic diagram of a timing control chip of a third timing control board provided by an embodiment of the application.
  • FIG. 4(b) is a schematic diagram of the control board of the third timing control board provided by the embodiment of the application.
  • Figure 5 (a) is a schematic diagram of a fourth timing control chip of a timing control board provided by an embodiment of the application.
  • Fig. 5(b) is a schematic diagram of the control board of the fourth timing control board provided by the embodiment of the application.
  • the timing control board provided in this application can alleviate this problem.
  • the timing control board provided by the embodiment of the present application includes:
  • the timing control chip 10 includes a first signal terminal 101 and at least two first heat dissipation terminals 102;
  • the control board 20 includes a second signal terminal 201 corresponding to the first signal terminal 101 and a second heat dissipation terminal 202 corresponding to the first heat dissipation terminal 102;
  • the first connecting member 30 is used to connect the first signal terminal 101 and the second signal terminal 201;
  • the second connecting member 40 is used to connect the first heat dissipation terminal 102 and the second heat dissipation terminal 202.
  • the timing control board is connected to the timing control chip and the control board by arranging multiple heat dissipation terminals, which increases the overall contact area between the timing control chip and the control board, and improves the heat dissipation of the timing control chip Efficiency; at the same time, multiple heat dissipation terminals greatly reduce the virtual connection rate, and even if a heat dissipation terminal point does not form a real effective connection point, it will not affect the connection of other heat dissipation terminal points, thereby avoiding the heat dissipation performance of the entire timing control chip The impact of the electrical performance and the existing timing control board is alleviated.
  • the first heat dissipation terminal 102 is located in the middle area 1 of the timing control chip.
  • the size of the middle area 1 is determined by the size of the timing control chip.
  • the size of the middle area 1 is approximately
  • the timing control chip size is one-half.
  • the setting area of the middle area 1 is too small, and the setting area of the first heat dissipation terminal 102 is correspondingly small, resulting in a small contact area between the timing control chip 10 and the ground, which is not conducive to the timing control chip 10 being dissipated through the ground covered with a large area of copper.
  • the setting area of the middle area 1 is too large, which may make the boundary between the middle area 1 and the timing control chip 10 too close, resulting in edges
  • the first heat dissipation terminal 102 and the first signal terminal 101 are bridged.
  • the first heat dissipation terminal 102 is arranged in a different manner, and the connection effect between the control board 20 and the timing control chip 10 is also different, which in turn has different effects on the electrical performance and heat dissipation performance of the timing control chip 10.
  • the sizes of the connected first heat dissipation terminal 102 and the second heat dissipation terminal 202 are set to be the same.
  • the size and number of the first heat dissipation terminals 102 are mainly determined by the size of the middle area 1. According to the size of the middle area 1 and the power size and electrical performance requirements of the timing control chip 10, the distribution of the first heat dissipation terminals 102, the size of the first heat dissipation terminals 102, and the number of the first heat dissipation terminals 102 are set to be as large as possible.
  • the coverage rate of the second connecting member 40 increases the contact area between the first heat dissipation terminal 102 and the ground, and improves the heat dissipation performance and electrical performance of the timing control chip 10.
  • the second connecting member 40 is solder, and the material of the solder is one of tin-lead alloy solder, antimony solder, cadmium solder, silver solder or copper solder.
  • Solder includes solder wire, solder bar, solder paste, and solder ball.
  • the adjacent first heat dissipation terminals 102 should avoid sharp angles or large-area copper foils as much as possible. The acute angles of the adjacent first heat dissipation terminals 102 will cause difficulty in wave soldering and risk of bridging. , And large-area copper foil will be difficult to solder due to excessive heat dissipation.
  • the point stress and the surface tension of the flux are improved, which greatly reduces the false solder rate, reduces the risk of solder paste collapsing to form a false solder, and effectively improves the overall mechanical performance of the first heat dis
  • the distance between adjacent first heat dissipation terminals 102 and the distance between the opposite sides of the first heat dissipation terminals 102 are determined according to the power size and electrical performance requirements of the timing control chip 10. As shown in FIGS. 2 to 5, the distance Lout between two adjacent first heat dissipation terminals 102 is usually 0.8-1 mm. If Lout is too small, it is easy for two adjacent first heat dissipation terminals 102 to be connected together, which will cause the gas and stress to affect each other, thereby losing the purpose of improvement; if Lout is too large, the first heat dissipation terminal 102 will be connected to the ground. The contact area is too small, which affects the heat dissipation performance and electrical performance of the timing control chip 10.
  • the distance Lin between the opposite sides of the same first heat dissipation terminal 102 is 1.8 ⁇ 2.0mm. If Lin is too small, it is prone to problems such as defective solder, insufficient solder joint strength and false soldering; if Lin is too large, empty solder, solder balls and stress will occur Issues such as increasing influencing factors.
  • the distance Lout between adjacent first heat dissipation terminals 102 and the distance Lin between two opposite sides of the same first heat dissipation terminal 102 need to be set so that the contact area between the timing control chip 10 and the ground is large, and at the same time, it is affected by the stress of the solder joint and the surface tension of the flux. Small, so that there is a better balance between the two, so as to finally achieve the goal of improving the heat dissipation performance and electrical performance of the timing control chip 10.
  • the first heat dissipation terminals 102 are arranged in a 3*3 array, and the shapes and sizes of the first heat dissipation terminals 102 are the same.
  • the shape of the first heat dissipation terminal is a regular octagon, the distance Lin between two opposite sides of the same regular octagonal first heat dissipation terminal is 1.8 mm, and the distance Lout between two adjacent regular octagonal first heat dissipation terminals is 0.8 mm.
  • This embodiment satisfies that on the basis of avoiding the difficulty of wave soldering and bridging risks, the size of the middle area is maximized, the total area occupied by the first heat dissipation terminal is increased, the coverage of solder paste is increased, and the The contact area between the first heat dissipation terminal and the ground is improved, and the heat dissipation and grounding performance of the timing control chip is improved; at the same time, the size of the opposite side of the first heat dissipation terminal is taken to the minimum, which is beneficial to the release of gas and stress and improves the mechanical stability of the first heat dissipation terminal It improves the thermal conductivity and electrical performance of the timing control chip.
  • the shape of the first heat dissipation terminal may also be one of other polygons such as a quadrilateral, a circle, an ellipse, and the like.
  • the arrangement of the first heat dissipation terminal array of the same size is adopted, and the first heat dissipation terminal has a single structure, which is beneficial to simple operation.
  • the first heat dissipation terminals 102 are arranged in a 3*3 array, and the first heat dissipation terminals 102 include regular octagonal first heat dissipation terminals 1021 and the circular first heat dissipation terminal 1022, the regular octagonal first heat dissipation terminal 1 and the circular first heat dissipation terminal 2 are arranged alternately in rows.
  • the distance Lin1 between two opposite sides of the regular octagonal first heat dissipation terminal 1021 is 1.8mm
  • the diameter Lin2 of the circular first heat dissipation terminal 1022 is 1.8mm
  • the distance Lout1 between two adjacent regular octagonal first heat dissipation terminals 1021 is 0.8 mm
  • the distance Lout2 between two adjacent circular first heat dissipation terminals 1022 is 0.8 mm
  • the distance Lout3 between the adjacent regular octagonal first heat dissipation terminals 1021 and the circular first heat dissipation terminal 1022 is also 0.8 mm.
  • This embodiment also satisfies the problem of avoiding the difficulty of wave soldering and bridging risks, and the arrangement of regular octagonal first heat dissipation terminals and circular first heat dissipation terminal arrays, which maximizes the use of the size of the middle area and increases
  • the total area occupied by the first heat dissipation terminal is increased, the coverage of the solder paste is increased, the contact area between the first heat dissipation terminal and the ground is increased, and the heat dissipation and grounding performance of the timing control chip are improved; at the same time, the size of the opposite side of the first heat dissipation terminal
  • the minimum value is beneficial to the release of gas and stress, improves the mechanical stability of the first heat dissipation terminal, and improves the thermal conductivity and electrical performance of the timing control chip.
  • the shape of the first heat dissipating terminal can also be any two or more of other polygons such as quadrilateral, circular, elliptical, etc., and the arrangement of the first heat dissipating terminal can be the same shape and size.
  • the rows of heat dissipation terminals are arranged at intervals, which can be that the first heat dissipation terminals of the same shape and size, different shapes and sizes are arranged at intervals, or the first heat dissipation terminals of different shapes and sizes are arranged randomly.
  • the first heat dissipation terminals 102 are arranged axially symmetrically, and the shapes and sizes of the first heat dissipation terminals 102 are the same.
  • the shape of the terminal 102 is a regular octagon, the distance Lin between two opposite sides of the same regular octagonal first heat dissipation terminal 102 is 1.8mm, the distance between two adjacent regular octagonal first heat dissipation terminals 102 is 0.8mm, Lout2 is 1.0mm, Lout3 is 0.8mm.
  • This embodiment satisfies that on the basis of avoiding the difficulty of wave soldering and the risk of bridging, the axisymmetric arrangement of 7 first heat dissipation terminals of the same size is satisfied, which greatly utilizes the size of the middle area and increases the area occupied by the first heat dissipation terminal.
  • the total area increases the coverage of the solder paste, increases the contact area between the first heat dissipation terminal and the ground, and improves the heat dissipation and grounding performance of the timing control chip; at the same time, the large gap space between the first heat dissipation terminals is beneficial to gas and stress
  • the release of improves the mechanical stability of the first heat dissipation terminal, and improves the thermal conductivity and electrical performance of the timing control chip.
  • the shape of the first heat dissipation terminal may also be one of other polygons such as a quadrilateral, a circle, an ellipse, and the like.
  • the arrangement of the first heat dissipation terminal array of the same size is adopted, and the first heat dissipation terminal has a single structure, which is beneficial to simple operation.
  • the first heat dissipation terminals 102 are arranged axially symmetrically, and the first heat dissipation terminals 102 include regular octagonal first heat dissipation terminals 1021 and a circle. -Shaped first heat dissipation terminal 1022.
  • the distance Lin1 between the two opposite sides of the regular octagonal first heat dissipation terminal 1021 is 2.0 mm
  • the diameter of the circular first heat dissipation terminal 1022 is 1.8 mm
  • the distance between two adjacent regular octagonal first heat dissipation terminals 1021 is Lout1 1.0 mm
  • the distance Lout2 between two adjacent circular heat dissipation terminals 1022 is 0.8 mm
  • the distance Lout3 between adjacent regular octagonal first heat dissipation terminals 1021 and circular first heat dissipation terminals 1022 is also 0.8 mm.
  • This embodiment also satisfies the problem of avoiding the difficulty of wave soldering and bridging risks, and the axially symmetrical arrangement of the regular octagonal first heat dissipation terminal and the circular first heat dissipation terminal, which maximizes the use of the size of the middle area , Increase the size of the total area occupied by the first heat dissipation terminal, increase the solder paste coverage, increase the contact area between the first heat dissipation terminal and the ground, and improve the heat dissipation and grounding performance of the timing control chip; at the same time between the first heat dissipation terminals
  • the large gap space is conducive to the release of gas and stress, improves the mechanical stability of the first heat dissipation terminal, and improves the thermal conductivity and electrical performance of the timing control chip.
  • the shape of the first heat dissipation terminal may also be any two or more of other polygons such as a quadrilateral, a circle, an ellipse, and the like
  • the arrangement of the first heat dissipation terminal can be regular arrangement in other ways, or irregular arrangement, and is not limited to the four arrangement ways in the above embodiment.
  • the first heat dissipation terminal may be a single-layer metal or a multi-layer metal, and its material may be titanium (Ti), tungsten (W), aluminum (Al), copper (Cu), nickel ( Any one or multiple alloys of Ni), platinum (Pt), silver (Ag), and gold (Au).
  • the second connecting member 40 is a connecting material with a heat conduction function, generally a heat-dissipating silicone grease.
  • the timing control board using heat dissipation silicone grease as the second connecting member 40 is similar in principle to the timing control board using solder as the second connecting member 40 in the above embodiment.
  • the distance between adjacent first heat dissipation terminals is the same as the first
  • the setting of the distance between the two opposite sides of the heat dissipation terminal needs to make the contact area between the timing control chip and the ground large, and at the same time make the mechanical properties of the heat dissipation silicone grease and the bonding effect good, so that there is a good balance between the two, so as to finally improve the timing
  • an embodiment of the present application provides a display device, which includes the timing control board described in any one of the above embodiments, and the timing control board includes:
  • the timing control chip includes a first signal terminal and at least two first heat dissipation terminals;
  • the control board includes a second signal terminal corresponding to the first signal terminal and a second heat dissipation terminal corresponding to the first heat dissipation terminal;
  • a first connecting member for connecting the first signal terminal and the second signal terminal
  • the second connecting member is used to connect the first heat dissipation terminal and the second heat dissipation terminal.
  • An embodiment of the present application provides a display device that includes a timing control board, which is connected to the timing control chip and the control board by arranging a plurality of heat dissipation terminals to increase the overall contact area between the timing control chip and the control board , Improve the heat dissipation efficiency of the timing control chip; at the same time, multiple heat dissipation terminals greatly reduce the virtual connection rate, and even if a heat dissipation terminal point does not form a real effective connection point, it will not affect the connection of other heat dissipation terminal points, thereby avoiding The effect on the heat dissipation performance and electrical performance of the entire timing control chip is reduced, and the problem of poor heat dissipation performance of the existing timing control board is alleviated.
  • the first heat dissipation terminal is located in the middle area of the timing control chip.
  • the side length of the middle area is half of the side length of the timing control chip.
  • the distance between two adjacent first heat dissipation terminals is 0.8-1 mm.
  • the distance between two opposite sides of the first heat dissipation terminal is 1.8 to 2.0 mm.
  • all the first heat dissipation terminals have the same size.
  • the first heat dissipation terminals are arranged in an array.
  • the first heat dissipation terminal is arranged axially symmetrically.
  • the shape of the first heat dissipation terminal is one or more of octagonal, quadrilateral, or circular.
  • the application provides a timing control board.
  • the timing control board includes a timing control chip and a control board.
  • the timing control chip is provided with at least two first heat dissipation terminals
  • the control board is provided with a second heat dissipation terminal corresponding to the first heat dissipation terminal. Terminals, and the first heat dissipation terminal and the second heat dissipation terminal are connected.

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Abstract

本申请提供一种时序控制板及显示装置，该时序控制板包括时序控制芯片和控制板，通过设置多个散热端子共同连接时序控制芯片和控制板，增大了时序控制芯片与控制板的整体接触面积，提高了时序控制芯片的散热效率；同时，多个散热端子极大地降低了虚接率，从而避免了对整个时序控制芯片散热性能与电性能的影响。

Description

时序控制板及显示装置 技术领域
本申请涉及显示领域，尤其涉及一种时序控制板及显示装置。
 背景技术
目前时序控制芯片（Timing Control，TCON）（针对四面扁平封装（Plastic Quad Flat Package，QFP）形式的芯片）连接在控制板（Control Board，CB）上时仅在TCON底部中央设置有一个第一散热端子，与地（GND）连通。
然而，第一散热端子在真正进行连接时，由于连接技术或连接材料缺陷，会产生虚连或没有形成有效连接点的问题，从而导致TCON散热性能差，甚至与地之间断路而影响芯片的电气性能。
因此，现有时序控制板存在散热性能差的问题，需要解决。
 技术问题
本申请提供一种时序控制板，以缓解现有时序控制板存在散热性能差的问题。
 技术解决方案
为解决以上问题，本申请提供的技术方案如下：
本申请提供一种时序控制板，包括:
时序控制芯片，包括第一信号端子和至少两个第一散热端子；
控制板，包括与所述第一信号端子对应设置的第二信号端子和与所述第一散热端子对应设置的第二散热端子；
第一连接构件，用于连接所述第一信号端子和所述第二信号端子；
第二连接构件，用于连接所述第一散热端子和所述第二散热端子。
在本申请提供的时序控制板中，所述第一散热端子位于时序控制芯片的中间区域。
在本申请提供的时序控制板中，所述中间区域的边长为所述时序控制芯片边长的一半。
在本申请提供的时序控制板中，两个相邻所述第一散热端子之间的距离为0.8~1mm。
在本申请提供的时序控制板中，所述第一散热端子两对边的距离为1.8~2.0mm。
在本申请提供的时序控制板中，所有所述第一散热端子的尺寸均相同。
在本申请提供的时序控制板中，存在至少两个所述第一散热端子的尺寸不相同。
在本申请提供的时序控制板中，所述第一散热端子呈阵列设置。
在本申请提供的时序控制板中，所述第一散热端子呈轴对称设置。
在本申请提供的时序控制板中，所述第一散热端子的形状为八边形、四边形或圆形中的一种或多种。
同时，本申请提供一种显示装置，包括时序控制板，所述时序控制板包括：
时序控制芯片，包括第一信号端子和至少两个第一散热端子；
控制板，包括与所述第一信号端子对应设置的第二信号端子和与所述第一散热端子对应设置的第二散热端子；
第一连接构件，用于连接所述第一信号端子和所述第二信号端子；
第二连接构件，用于连接所述第一散热端子和所述第二散热端子。
在本申请提供的显示装置中，所述第一散热端子位于时序控制芯片的中间区域。
在本申请提供的显示装置中，所述中间区域的边长为所述时序控制芯片边长的一半。
在本申请提供的显示装置中，两个相邻所述第一散热端子之间的距离为0.8~1mm。
在本申请提供的显示装置中，所述第一散热端子两对边的距离为1.8~2.0mm。
在本申请提供的显示装置中，所有所述第一散热端子的尺寸均相同。
在本申请提供的显示装置中，存在至少两个所述第一散热端子的尺寸不相同。
在本申请提供的显示装置中，所述第一散热端子呈阵列设置。
在本申请提供的显示装置中，所述第一散热端子呈轴对称设置。
在本申请提供的显示装置中，所述第一散热端子的形状为八边形、四边形或圆形中的一种或多种。
 有益效果
本申请提供一种时序控制板，该时序控制板包括时序控制芯片和控制板，时序控制芯片上设置有至少两个第一散热端子，控制板上设置有与第一散热端子对应的第二散热端子，且第一散热端子和第二散热端子连接。通过设置多个散热端子共同连接时序控制芯片和控制板，增大了时序控制芯片与控制板的整体接触面积，提高了时序控制芯片的散热效率；同时，多个散热端子极大地降低了虚接率，且即使某一散热端子点没有形成真正有效连接点也不会影响其他散热端子点的连接，从而避免了对整个时序控制芯片散热性能与电性能的影响，缓解了现有时序控制板存在散热性能差的问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的时序控制板的结构示意图。
图2中（a）为本申请实施例提供的第一种时序控制板的时序控制芯片的示意图。
图2中（b）为本申请实施例提供的第一种时序控制板的控制板的示意图。
图3中（a）为本申请实施例提供的第二种时序控制板的时序控制芯片的示意图。
图3中（b）为本申请实施例提供的第二种时序控制板的控制板的示意图。
图4中（a）为本申请实施例提供的第三种时序控制板的时序控制芯片的示意图。
图4中（b）为本申请实施例提供的第三种时序控制板的控制板的示意图。
图5中（a）为本申请实施例提供的第四种时序控制板的时序控制芯片的示意图。
图5中（b）为本申请实施例提供的第四种时序控制板的控制板的示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
针对现有时序控制板存在散热性能差的问题，本申请提供的时序控制板可以缓解这个问题。
如图1所示，本申请实施例提供的时序控制板包括:
时序控制芯片10，包括第一信号端子101和至少两个第一散热端子102；
控制板20，包括与所述第一信号端子101对应设置的第二信号端子201，和与所述第一散热端子102对应设置的第二散热端子202；
第一连接构件30，用于连接所述第一信号端子101和所述第二信号端子201；
第二连接构件40，用于连接所述第一散热端子102和所述第二散热端子202。
本申请实施例提供的时序控制板，该时序控制板通过设置多个散热端子共同连接时序控制芯片和控制板，增大了时序控制芯片与控制板的整体接触面积，提高了时序控制芯片的散热效率；同时，多个散热端子极大地降低了虚接率，且即使某一散热端子点没有形成真正有效连接点也不会影响其他散热端子点的连接，从而避免了对整个时序控制芯片散热性能与电性能的影响，缓解了现有时序控制板存在散热性能差的问题。
下面以时序控制芯片的尺寸为14mm*14mm为例，结合具体实施例对本申请提供的时序控制板做进一步的诠释说明。
在一种实施例中，如图1至图5所示，第一散热端子102位于时序控制芯片的中间区域1，中间区域1的大小由时序控制芯片的大小决定，中间区域1的尺寸大约为时序控制芯片尺寸的二分之一。中间区域1的设置面积太小，第一散热端子102的设置面积相应小，导致时序控制芯片10与地的接触面积小，从而不利于时序控制芯片10通过敷有大面积铜的地散热，不利于时序控制芯片10散热性能的提升，同时也不利于消除静电，防止外部干扰；中间区域1的设置面积过大，可能会使得中间区域1与时序控制芯片10的边界太过靠近，从而造成边缘第一散热端子102与第一信号端子101的桥接。
在中间区域1内，第一散热端子102的设置方式不同，控制板20与时序控制芯片10的连接效果也不同，进而对时序控制芯片10的电气性能与散热性能的影响也不同。在以下实施例中，相连接的第一散热端子102和第二散热端子202的尺寸设置相同。
第一散热端子102的尺寸大小、以及个数的多少主要由中间区域1的大小决定。根据中间区域1的大小、以及时序控制芯片10功率大小和电性能要求，来设置第一散热端子102的分布、第一散热端子102的尺寸、以及第一散热端子102的数量，以尽可能大的第二连接构件40覆盖率，提高第一散热端子102与地接触面积，提高时序控制芯片10的散热性能与电气性能。
在一种实施例中，第二连接构件40为焊接剂，焊接剂的材料为锡铅合金焊锡、加锑焊锡、加镉焊锡、加银焊锡或加铜焊锡中的一种。焊锡又包括焊锡丝、焊锡条、焊锡膏、焊锡球。在本实施例中，需要注意相邻的第一散热端子102要尽可能避免成锐角或大面积的铜箔，相邻的第一散热端子102呈锐角会造成波峰焊困难，且有桥接的危险，而大面积铜箔会因为散热过快而造成不易焊接。
在本实施例中，第一散热端子102占据的总面积越大，时序控制芯片10与地的接触就越大，从而通过敷有大面积铜的地散热的效果就越好。另一方面，在相同的中间区域1内，第一散热端子102的设置数量越多，单个第一散热端子102的尺寸越小，高温焊接过程中焊接剂中的助焊剂裂解产生的气体逸出的路径越短，同时相邻的第一散热端子102之间为气体逸出提供通道的间隙越多，进而促使所述气体能够及时逸出，从而有效减少了气泡的面积和数量，使受焊点应力与焊剂表面张力得到提高，极大地降低虚焊率，减少焊膏塌落形成虚焊的风险，使第一散热端子102的整体机械性能得到有效提高，使时序控制芯片10与地的有效接触面积增大，提高了时序控制芯片10的散热性能；同时，根据导体材料电阻定律：R＝ρL/S，其中ρ为导体材料的电阻率，L为导体长度，S为导体横截面积，由于减少了气泡的面积，使得第一散热端子102形成导体的有效面积增加，降低了时序控制芯片10的接地阻抗，进而提高了时序控制芯片10的电气性能。
相邻第一散热端子间102的距离、第一散热端子102对边距离依据时序控制芯片10的功率大小和电性能要求而定。如图2至图5所示，通常相邻两个第一散热端子间102间的距离Lout为0.8~1mm。Lout偏小，容易出现两相邻第一散热端子102连接在一起，而使得气体和应力等因素相互影响的问题，从而失去改善的目的；Lout偏大，则会使得第一散热端子102与地的接触面积过小，从而影响时序控制芯片10的散热性能与电性能。同一第一散热端子102对边的距离Lin为1.8~2.0mm，Lin偏小，容易出现焊锡不良品、焊接点强度不够和假焊等问题；Lin偏大则会出现空焊、焊球和应力影响因素变大等问题。相邻第一散热端子间102的距离Lout、同一第一散热端子102两对边的距离Lin的设置需使得时序控制芯片10与地的接触面积大，同时使受焊点应力与焊剂表面张力影响小，使得两者有一个较好的平衡，从而最终达到改善时序控制芯片10的散热性能与电性能的目的。
在一种实施例中，如图2中（a）所示，在中间区域1内，第一散热端子102呈3*3的阵列设置，且第一散热端子102的形状大小均相同，所述第一散热端子的形状为正八边形，同一正八边形第一散热端子内两对边的距离Lin为1.8mm，相邻两正八边形第一散热端子间的距离Lout为0.8mm。
本实施例满足了在避免波峰焊困难和桥接风险的基础上，最大限度的利用了中间区域的尺寸，增大了第一散热端子所占总面积的大小，增大了焊膏覆盖率，提高了第一散热端子与地接触面积，提高了时序控制芯片散热与接地性能；同时第一散热端子对边的尺寸取最小值，有利于气体和应力的释放，提高了第一散热端子的机械稳定性，提高了时序控制芯片的导热性能与电气性能。在该实施例中，所述第一散热端子的形状也可以是四边形、圆形、椭圆形等其他多边形中的一种。采用同种尺寸的第一散热端子阵列设置的方式，第一散热端子结构单一，有利于简便操作。
在一种实施例中，如图3中（a）所示，在中间区域1内，第一散热端子102呈3*3的阵列设置，第一散热端子102包括正八边形的第一散热端子1021和圆形的第一散热端子1022，正八边形第一散热端子1和圆形第一散热端子2呈行交错排列。正八边形第一散热端子1021内两对边的距离Lin1为1.8mm，圆形第一散热端子1022的直径Lin2为1.8mm，相邻两正八边形第一散热端子1021间的距离Lout1为0.8mm，相邻两圆形第一散热端子1022间的距离Lout2为0.8mm，相邻正八边形第一散热端子1021和圆形第一散热端子1022间的距离Lout3也为0.8mm。
本实施例同样满足了在避免波峰焊困难和桥接风险的基础上，以正八边形第一散热端子和圆形第一散热端子阵列设置的方式，最大限度的利用了中间区域的尺寸，增大了第一散热端子所占总面积的大小，增大了焊膏覆盖率，提高了第一散热端子与地接触面积，提高了时序控制芯片散热与接地性能；同时第一散热端子对边的尺寸取最小值，有利于气体和应力的释放，提高了第一散热端子的机械稳定性，提高了时序控制芯片的导热性能与电气性能。在该实施例中，所述第一散热端子的形状也可以是四边形、圆形、椭圆形等其他多边形中的任意两种或多种，其阵列排布的方式可以是同种形状尺寸的第一散热端子行间隔排列，可以是同种形状不同尺寸、不同形状不同尺寸的第一散热端子列间隔排列，也可以不同形状尺寸的第一散热端子杂乱排列。
在一种实施例中，如图4中（a）所示，在中间区域1内，第一散热端子102呈轴对称设置，且第一散热端子102的形状大小均相同，所述第一散热端子102的形状为正八边形，同一正八边形第一散热端子102的两对边的距离Lin为1.8mm，相邻两正八边形第一散热端子102间的距离Lout1为0.8mm，Lout2为1.0mm，Lout3为0.8mm。
本实施例满足了在避免波峰焊困难和桥接风险的基础上，7块同尺寸第一散热端子的轴对称设置，极大限度的利用了中间区域的尺寸，增大了第一散热端子所占总面积的大小，增大了焊膏覆盖率，提高了第一散热端子与地接触面积，提高了时序控制芯片散热与接地性能；同时第一散热端子间大的间隙空间，有利于气体和应力的释放，提高了第一散热端子的机械稳定性，提高了时序控制芯片的导热性能与电气性能。在该实施例中，所述第一散热端子的形状也可以是四边形、圆形、椭圆形等其他多边形中的一种。采用同种尺寸的第一散热端子阵列设置的方式，第一散热端子结构单一，有利于简便操作。
在一种实施例中，如图5中（a）所示，在中间区域1内，第一散热端子102呈轴对称设置，第一散热端子102包括正八边形的第一散热端子1021和圆形的第一散热端子1022。正八边形第一散热端子1021内两对边的距离Lin1为2.0mm，圆形第一散热端子1022的直径为Lin2为1.8mm，相邻两正八边形第一散热端子1021间的距离Lout1为1.0mm，相邻两圆形散热端子1022间的距离Lout2为0.8mm，相邻正八边形第一散热端子1021和圆形第一散热端子1022间的距离Lout3也为0.8mm。
本实施例同样满足了在避免波峰焊困难和桥接风险的基础上，以正八边形第一散热端子和圆形第一散热端子的轴对称设置的方式，极大限度的利用了中间区域的尺寸，增大了第一散热端子所占总面积的大小，增大了焊膏覆盖率，提高了第一散热端子与地接触面积，提高了时序控制芯片散热与接地性能；同时第一散热端子间大的间隙空间，有利于气体和应力的释放，提高了第一散热端子的机械稳定性，提高了时序控制芯片的导热性能与电气性能。在该实施例中，所述第一散热端子的形状也可以是四边形、圆形、椭圆形等其他多边形中的任意两种或多种。
在一种事实例中，所述第一散热端子的设置方式可以是其他方式的规则设置，也可以是无规则设置，不限于以上实施例的四种设置方式。
在一种实施例中，第一散热端子可以是单层金属，也可以是多层金属，其材料可以为钛（Ti）、钨（W）、铝（Al）、铜（Cu）、镍（Ni）、铂（Pt）、银（Ag）、金（Au）中的任意一种或者多种的合金。
在一种实施例中，第二连接构件40为具有导热功能的连接材料，一般为散热硅脂。以散热硅脂为第二连接构件40的时序控制板，其原理与上述实施例中以焊接剂为第二连接构件40的时序控制板相似，相邻第一散热端子间的距离、同一第一散热端子两对边的距离的设置需使得时序控制芯片与地的接触面积大，同时使散热硅脂的机械性能，粘结效果好，使得两者有一个较好的平衡，从而最终达到改善时序控制芯片10的散热性能与电性能的目的；同样也需要防止第一散热端子与第一信号端子的桥接。具体可参照上述实施例，在此不再详细赘述。
同时，本申请实施例提供一种显示装置，该显示装置包括上述任一实施例中所述的时序控制板，该时序控制板包括：
时序控制芯片，包括第一信号端子和至少两个第一散热端子；
控制板，包括与所述第一信号端子对应设置的第二信号端子和与所述第一散热端子对应设置的第二散热端子；
第一连接构件，用于连接所述第一信号端子和所述第二信号端子；
第二连接构件，用于连接所述第一散热端子和所述第二散热端子。
本申请实施例提供一种显示装置，该显示装置包括时序控制板，该时序控制板通过设置多个散热端子共同连接时序控制芯片和控制板，增大了时序控制芯片与控制板的整体接触面积，提高了时序控制芯片的散热效率；同时，多个散热端子极大地降低了虚接率，且即使某一散热端子点没有形成真正有效连接点也不会影响其他散热端子点的连接，从而避免了对整个时序控制芯片散热性能与电性能的影响，缓解了现有时序控制板存在散热性能差的问题。
在一种实施例中，第一散热端子位于时序控制芯片的中间区域。
在一种实施例中，中间区域的边长为时序控制芯片边长的一半。
在一种实施例中，两个相邻第一散热端子之间的距离为0.8~1mm。
在一种实施例中，第一散热端子两对边的距离为1.8~2.0mm。
在一种实施例中，所有第一散热端子的尺寸均相同。
在一种实施例中，存在至少两个第一散热端子的尺寸不相同。
在一种实施例中，第一散热端子呈阵列设置。
在一种实施例中，第一散热端子呈轴对称设置。
在一种实施例中，第一散热端子的形状为八边形、四边形或圆形中的一种或多种。
本申请实施例提供的显示装置，其原理与上述实施例中所述的时序控制板相似，具体可参考上述实施例，在此不再详细赘述。
根据上述实施例可知：
本申请提供一种时序控制板，该时序控制板包括时序控制芯片和控制板，时序控制芯片上设置有至少两个第一散热端子，控制板上设置有与第一散热端子对应的第二散热端子，且第一散热端子和第二散热端子连接。通过设置多个散热端子共同连接时序控制芯片和控制板，增大了时序控制芯片与控制板的整体接触面积，提高了时序控制芯片的散热效率；同时，多个散热端子极大地降低了虚接率，且即使某一散热端子点没有形成真正有效连接点也不会影响其他散热端子点的连接，从而避免了对整个时序控制芯片散热性能与电性能的影响，缓解了现有时序控制板存在散热性能差的问题。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种时序控制板，其包括：
    时序控制芯片，包括第一信号端子和至少两个第一散热端子；
    控制板，包括与所述第一信号端子对应设置的第二信号端子和与所述第一散热端子对应设置的第二散热端子；
    第一连接构件，用于连接所述第一信号端子和所述第二信号端子；
    第二连接构件，用于连接所述第一散热端子和所述第二散热端子。
  2. 如权利要求1所述的时序控制板，其中，所述第一散热端子位于时序控制芯片的中间区域。
  3. 如权利要求2所述的时序控制板，其中，所述中间区域的边长为所述时序控制芯片边长的一半。
  4. 如权利要求2所述的时序控制板，其中，两个相邻所述第一散热端子之间的距离为0.8~1mm。
  5. 如权利要求2所述的时序控制板，其中，所述第一散热端子两对边的距离为1.8~2.0mm。
  6. 如权利要求2所述的时序控制板，其中，所有所述第一散热端子的尺寸均相同。
  7. 如权利要求2所述的时序控制板，其中，存在至少两个所述第一散热端子的尺寸不相同。
  8. 如权利要求2所述的时序控制板，其中，所述第一散热端子呈阵列设置。
  9. 如权利要求2所述的时序控制板，其中，所述第一散热端子呈轴对称设置。
  10. 如权利要求1所述的时序控制板，其中，所述第一散热端子的形状为八边形、四边形或圆形中的一种或多种。
  11. 一种显示装置，其包括时序控制板，所述时序控制板包括：
    时序控制芯片，包括第一信号端子和至少两个第一散热端子；
    控制板，包括与所述第一信号端子对应设置的第二信号端子和与所述第一散热端子对应设置的第二散热端子；
    第一连接构件，用于连接所述第一信号端子和所述第二信号端子；
    第二连接构件，用于连接所述第一散热端子和所述第二散热端子。
  12. 如权利要求11所述的显示装置，其中，所述第一散热端子位于时序控制芯片的中间区域。
  13. 如权利要求12所述的显示装置，其中，所述中间区域的边长为所述时序控制芯片边长的一半。
  14. 如权利要求12所述的显示装置，其中，两个相邻所述第一散热端子之间的距离为0.8~1mm。
  15. 如权利要求12所述的显示装置，其中，所述第一散热端子两对边的距离为1.8~2.0mm。
  16. 如权利要求12所述的显示装置，其中，所有所述第一散热端子的尺寸均相同。
  17. 如权利要求12所述的显示装置，其中，存在至少两个所述第一散热端子的尺寸不相同。
  18. 如权利要求12所述的显示装置，其中，所述第一散热端子呈阵列设置。
  19. 如权利要求12所述的显示装置，其中，所述第一散热端子呈轴对称设置。
  20. 如权利要求11所述的显示装置，其中，所述第一散热端子的形状为八边形、四边形或圆形中的一种或多种。
PCT/CN2019/117789 2019-08-09 2019-11-13 时序控制板及显示装置 Ceased WO2021027147A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020034066A1 (en) * 2000-09-19 2002-03-21 Chien-Ping Huang Heat dissipation ball grid array package
CN105552048A (zh) * 2016-01-28 2016-05-04 珠海格力节能环保制冷技术研究中心有限公司 导热焊盘及具有其的qfp芯片的封装结构
WO2016181628A1 (en) * 2015-05-08 2016-11-17 Canon Kabushiki Kaisha Printed-wiring board, printed-circuit board and electronic apparatus
CN110099505A (zh) * 2019-02-28 2019-08-06 新华三信息技术有限公司 散热结构、电路板组件及其加工工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014877A (ja) * 2002-06-07 2004-01-15 Mitsubishi Electric Corp 半導体パッケージおよび半導体パッケージの実装方法
JP2006210851A (ja) * 2005-01-31 2006-08-10 Toshiba Corp 回路基板
JP2015015387A (ja) * 2013-07-05 2015-01-22 日本特殊陶業株式会社 多数個取り基板及び配線基板の製造方法
WO2017094283A1 (ja) * 2015-11-30 2017-06-08 株式会社村田製作所 パッケージ基板、マザー基板、電子部品及び弾性波装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020034066A1 (en) * 2000-09-19 2002-03-21 Chien-Ping Huang Heat dissipation ball grid array package
WO2016181628A1 (en) * 2015-05-08 2016-11-17 Canon Kabushiki Kaisha Printed-wiring board, printed-circuit board and electronic apparatus
CN105552048A (zh) * 2016-01-28 2016-05-04 珠海格力节能环保制冷技术研究中心有限公司 导热焊盘及具有其的qfp芯片的封装结构
CN110099505A (zh) * 2019-02-28 2019-08-06 新华三信息技术有限公司 散热结构、电路板组件及其加工工艺

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