CN106340500B - 一种具有不同截面直径焊线的功率模块 - Google Patents

一种具有不同截面直径焊线的功率模块 Download PDF

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CN106340500B
CN106340500B CN201610835860.6A CN201610835860A CN106340500B CN 106340500 B CN106340500 B CN 106340500B CN 201610835860 A CN201610835860 A CN 201610835860A CN 106340500 B CN106340500 B CN 106340500B
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bonding wire
terminal
power chip
copper
ceramic substrate
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CN106340500A (zh
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刘斯扬
叶然
魏家行
宋海洋
王宁
孙伟锋
陆生礼
时龙兴
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Southeast University
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Abstract

一种具有不同截面直径焊线的功率模块，具有更低的工作结温以及更均匀的芯片温度分布，包括：散热底板，在散热底板上设有覆铜陶瓷基板，所述覆铜陶瓷基板包括陶瓷基板，在陶瓷基板的下表面上设有覆铜且覆铜设在散热底板的上表面上，在覆铜陶瓷基板上至少设有2个端子，所述端子连接于位于所述端子下方并设在陶瓷基板的上表面上的覆铜片上，在需要实现连接的两个端子中的一个端子下方的覆铜片上连接有功率芯片，所述功率芯片通过一排使用高电导率金属材料的焊线与所述需要实现连接的两个端子中的另一个端子连接，同一功率芯片上的焊线的截面直径反比于所述同一功率芯片上该焊线的端部焊点至与所述同一功率芯片所连接的端子之间的距离。

Description

一种具有不同截面直径焊线的功率模块
技术领域
本发明涉及一种具有不同截面直径焊线的功率模块，尤其涉及焊线的焊接方式。通过使用改善之后的焊线，可以更好地均匀化芯片温度分布，降低功率芯片最高结温，延缓模块的老化速度，增强器件可循环工作次数，提高使用寿命。
背景技术
功率模块由于其功耗低、成本低、可靠性高的优点，在电机系统的应用中呈现出特别的活力。功率模块以其高可靠性、低损耗、低开发成本的优势正赢得越来越大的市场。
功率模块是将多个分立功率器件组合灌装而成的一个整体，通过焊线实现电性连接。实际工作应用中，功率芯片结温过高将导致器件性能降低，而功率芯片整体的温度均匀性直接影响其使用寿命。虽然功率芯片和覆铜陶瓷基板上表面覆铜层的发热量占模块总体发热量的主要部分，但焊线寄生电阻的焦耳热也是造成功率芯片结温上升以及温度不均匀的一个重要原因。
传统功率模块采用具有相同截面直径的焊线，因为不同焊线到功率输入端子的电流路径长度不同，所以不同焊线中电流大小不同。功率模块中的电流路径为：从输入端子进入覆铜陶瓷基板上表面覆铜层，流经焊料、功率芯片再从焊线输出。对于相同的导电材料，电流路径越短，电阻越小，所以越靠近输入端子区域的功率芯片上电流密度越大，热功耗更大，温度更高。截面积相同的传统焊线导通电阻相同，端部焊点与输入端子的距离较小的焊线中电流较大，所以焊线寄生焦耳热大于端部焊点与输入端子距离较大的焊线的寄生焦耳热，这使得靠近输入端子区域的功率芯片工作结温升高，更加容易超出其安全工作区以致失效。而远离输入端子的功率芯片区域电流密度小，热功耗以及焊线寄生焦耳热都较小，导致功率芯片的整体温度范围大，工作寿命低。
为了降低功率芯片的结温，以往方法一般通过选择热导率较大的覆铜陶瓷基板中间陶瓷材料和焊料：例如将覆铜陶瓷基板中间陶瓷材料换成AlN，焊料使用新型的纳米银颗粒焊接；优化底板的形状和体积：在保证模块内部较小应力的条件下，增加底板厚度；减少接触面的数量：例如除去硅脂层和底板；改变封装形式：例如采用双面散热来减小热阻，或者采用更大功率的热沉增加散热能力。但这些方法都只是整体降低功率芯片的温度，没有考虑功率芯片不同区域电流密度不均匀以及不同焊线寄生焦耳热不同的问题，对功率芯片整体温度分布不均匀的情况没有改善。
发明内容
本发明提供一种能够降低芯片工作结温的具有不同截面直径焊线的功率模块，能够改善功率芯片上靠近输入端子的部分与焊线接触的区域温度过高的问题，均匀功率芯片温度分布，保证使用寿命。
为实现上述目的，本发明提供以下技术方案：
一种具有不同截面直径焊线的功率模块，包括：散热底板，在散热底板上设有覆铜陶瓷基板，所述覆铜陶瓷基板包括陶瓷基板，在陶瓷基板的下表面上设有覆铜且覆铜设在散热底板的上表面上，在覆铜陶瓷基板上至少设有2个端子，所述端子连接于位于所述端子下方并设在陶瓷基板的上表面上的覆铜片上，在需要实现连接的两个端子中的一个端子下方的覆铜片上连接有功率芯片，所述功率芯片通过一排焊线与所述需要实现连接的两个端子中的另一个端子连接，同一功率芯片上的焊线的截面直径反比于所述同一功率芯片上该焊线的端部焊点至与所述同一功率芯片所连接的端子之间的距离。
与传统功率模块相比，所述具有不同截面直径焊线的功率模块具有以下优点：
(1)本发明所述的具有不同截面直径焊线的功率模块中同一功率芯片上焊线的截面直径反比于同一功率芯片上该焊线的端部焊点至与同一功率芯片所连接的端子之间的距离。因为电流路径长度不同，端部焊点至与其所在功率芯片所连接的端子较近的焊线，其所在芯片区域电流密度较大，焊线中电流也较大，功率芯片所产生的热量以及焊线产生的焦耳热使功率芯片温度较高。具有不同截面直径焊线的功率模块所用新型结构焊线在越靠近与功率芯片所连接的端子的区域上，焊线的截面直径越大，使焊线的寄生电阻下降，能够有效减少焊线产生的焦耳热，抑制结温过高的问题，改善功率模块性能。
(2)本发明所述的具有不同截面直径焊线的功率模块，至与同一功率芯片所连接的端子距离较远的同一功率芯片区域，因为从端子至该区域电流路径较长，所以芯片上电流密度较小，焊线中电流也较小。截面积相等的传统结构焊线在功率芯片的各区域上电阻相同，由于功率芯片发热较少以及焊线产生的焦耳热较少，至与同一功率芯片所连接的端子距离较远的同一功率芯片区域温度较低，功率芯片整体温度差异较大。新型结构焊线在越远离与功率芯片所连接的端子的区域上，焊线的截面直径越小，相对于与功率芯片所连接的端子距离较近的区域，焊线的寄生电阻较大，由焊线产生的焦耳热较多，缓解了由功率芯片热功耗不均引起的温度不均，增大了功率模块工作的可循环次数，提高了使用寿命。
附图说明
图1为本发明提供的一种具有不同截面直径焊线的功率模块的三维视图。
图2为本发明提供的一种传统结构的功率模块(不含绝缘外壳)的三维视图。
图3为本发明提供的一种传统结构的功率模块(不含绝缘外壳)的主视图。
图4为本发明提供的一种传统结构的功率模块(不含绝缘外壳)的俯视图。
图5为本发明提供的一种具有不同截面直径焊线的功率模块(不含绝缘外壳)的主视图。
图6为本发明提供的一种具有不同截面直径焊线的功率模块(不含绝缘外壳)的俯视图。
图7为本发明提供的一种传统结构的功率模块中第一功率芯片上不同焊线的电流分布图。
图8为本发明提供的一种传统结构的功率模块中第一功率芯片的温度分布图。
图9为本发明提供的一种具有不同截面直径焊线的功率模块中第一功率芯片的温度分布图。
其中，100、功率模块；1、绝缘外壳；2、端子，2.1、第一端子，2.2、第二端子，2.3、第三端子；3、散热底板；4、焊料；5、覆铜陶瓷基板，5.1、上表面覆铜，5.2、陶瓷基板，5.3、下表面覆铜；6、功率芯片，6.1、第一功率芯片，6.2、第二功率芯片；7、焊线，7.1、传统结构焊线，7.2、新型结构焊线，8、端部焊点。
具体实施方式
一种具有不同截面直径焊线的功率模块100，包括：散热底板3，在散热底板3上设有覆铜陶瓷基板5，所述覆铜陶瓷基板5包括陶瓷基板5.2，在陶瓷基板5.2的下表面上设有覆铜5.3且覆铜5.3设在散热底板3的上表面上，在覆铜陶瓷基板5上至少设有2个端子2，所述端子2连接于位于所述端子)下方并设在陶瓷基板5.2的上表面上的覆铜片5.1上，在需要实现连接的两个端子2中的一个端子下方的覆铜片5.1上连接有功率芯片6，所述功率芯片6通过一排焊线7与所述需要实现连接的两个端子2中的另一个端子连接，同一功率芯片6上的焊线的截面积反比于所述同一功率芯片6上该焊线的端部焊点8至与所述同一功率芯片6所连接的端子2之间的距离。
本实施例可以选择三个端子、两块功率芯片所构成的功率模块，即：所述端子2采用3个且分别为第一端子2.1、第二端子2.2和第三端子2.3，功率芯片6采用2个且分别为第一功率芯片6.1和第二功率芯片6.2，第一功率芯片6.1与第一端子2.1连接并具体通过位于第一功率芯片6.1与第一端子2.1下方的覆铜片连接；第二功率芯片6.2与第二端子2.2连接并具体通过位于第二功率芯片6.2与第二端子2.2下方的覆铜片连接。“同一功率芯片6上焊线的截面直径反比于所述同一功率芯片6上该焊线的端部焊点8至与所述同一功率芯片6所连接的端子2之间的距离”，意味着，第一功率芯片6.1上，焊线的端部焊点8与第一端子2.1的距离越小，其截面直径越大，反之，距离越大，截面直径越小；第二功率芯片6.2上，焊线的端部焊点8与第二端子2.2的距离越小，其截面直径越大，反之，距离越大，截面直径越小。其中，端部焊点8为新型结构焊线7.2在功率芯片6上的顶端焊点。
所述焊线7使用的材质为高电导率金属材料，所述高电导率金属材料包括铝Al，铜Cu，银Ag或金Au，焊线最小截面直径小于等于0.38mm，焊线最大截面直径大于等于0.5mm，相邻焊线的间距大于0.2mm。
散热底板3与覆铜5.3、功率芯片6与覆铜片5.1可以通过焊料4实现电连接。本实施例还可以在散热底板3上设绝缘外壳1。
为了使本发明的目的、技术方案和优点更加清晰，下面结合附图及一优选实例来对本发明的具体实施方式作进一步说明。
图1为本发明提供的一种具有不同截面直径焊线的功率模块的三维视图，图2为本发明提供的一种传统结构的功率模块(不含绝缘外壳)的三维视图，图3为本发明提供的一种传统结构的功率模块(不含绝缘外壳)的主视图，图4为本发明提供的一种传统结构的功率模块(不含绝缘外壳)的俯视图，图5为本发明提供的一种具有不同截面直径焊线的功率模块(不含绝缘外壳)的主视图，图6为本发明提供的一种具有不同截面直径焊线的功率模块(不含绝缘外壳)的俯视图，图7为本发明提供的一种传统结构的功率模块中第一功率芯片上不同焊线的电流分布图，其中焊线m1至焊线m7的端部焊点与第一端子的距离越来越大，图8为本发明提供的一种传统结构的功率模块中第一功率芯片的温度分布图，图9为本发明提供的一种具有不同截面直径焊线的功率模块中第一功率芯片的温度分布图。
如图2至图4所示，传统功率模块采用具有相同截面直径的焊线7.1。第一功率芯片6.1的输入端子和输出端子分别为第一端子2.1和第二端子2.2，第二功率芯片6.2的输入端子和输出端子分别为第二端子2.2和第三端子2.3。由于第一功率芯片6.1上靠近第一端子2.1以及第二功率芯片6.2上靠近第二端子2.2的区域电流密度较大，热功耗大，发热比其他区域高，而且端部焊点8与输入端子的距离较小的焊线产生的焦耳热较多，器件结温被严重抬高。功率芯片6.1上的电流分布是从靠近第一端子2.1的区域到远离第一端子2.1的区域依次递减，功率芯片6.2上的电流分布是从靠近第二端子2.2的区域到远离第二端子2.2的区域依次递减，功率芯片6.1和功率芯片6.2上的焊线中的电流也随着端部焊点8与其各自输入端子的距离的增大而不断减小，在距离输入端子较远的功率芯片区域焊线产生的焦耳热以及芯片发热功耗都较小，这导致第一功率芯片6.1和第二功率芯片6.2整体温差较大，进而导致模块性能退化，寿命降低。图8为本发明提供的一种传统结构的功率模块中第一功率芯片6.1的温度分布图，可以看出芯片6.1的最高结温为54.339℃，温度最高点与温度最低点相差10.826℃。
图5和图6所示为所述具有不同截面直径焊线的功率模块100的一具体实施方式。具有不同截面直径焊线的功率模块100所使用的新型结构焊线7.2采用非均等截面直径的焊接方式，第一功率芯片6.1上，端部焊点8与第一端子2.1的距离越小的焊线以及第二功率芯片6.2上，端部焊点8与第二端子2.2的距离越小的焊线，其截面直径越大。第一功率芯片6.1上，端部焊点8与第一端子2.1的距离最大的焊线以及第二功率芯片6.2上，端部焊点8与第二端子2.2的距离最大的焊线与传统焊线7.1的截面直径相同，为0.38mm；第一功率芯片6.1上，端部焊点8与第一端子2.1的距离最小的焊线以及第二功率芯片6.2上，端部焊点8与第二端子2.2的距离最小的焊线的截面直径为0.54mm。端部焊点8至与其所在功率芯片所连接的端子较近的焊线，其所在区域电流密度较大，具有不同截面直径焊线的功率模块100所用新型结构焊线7.2在该区域增大了焊线的截面直径，使焊线的寄生电阻和产生的焦耳热减小，结温下降。在功率芯片6.1和功率芯片6.2上，端部焊点8至与其所在功率芯片所连接的端子较远的焊线，其所在区域电流密度较小，新型结构焊线7.2截面直径较小，寄生电阻较高，焊线产生的焦耳热较多，所以该区域功率芯片的温度与最高结温之间的差值缩小，增大了功率器件可循环工作次数，提高了使用寿命。图9为本发明提供的一种具有不同截面直径焊线的功率模块中第一功率芯片6.1的温度分布图，此时芯片6.1的最高结温为47.901℃，温度最高点与温度最低点相差8.614℃。通过图8和图9所示温度分布图的对比可以看出，具有不同截面直径焊线的功率模块中第一功率芯片6.1的结温明显下降，并且温度分布更加均匀。
如图5和图6所示功率模块所使用的新型结构焊线的具体焊接方法为：利用全自动铝线键合机(OE3600plus)设置焊线截面直径，将焊线焊接在功率芯片和陶瓷基板上表面覆铜层上。
本发明的应用实例并不局限于图示结构的功率模块，它同样适用于其他封装形式的功率模块以及焊线和焊点数量改变的情况。
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步的详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而已，并不限定本发明的保护范围。任何熟悉本领域的技术人员，在不脱离本发明技术方案范围情况下，都可利用上述揭示的方法和技术内容对本发明技术方案做出许多可能的变动和修饰，或修改为等同变化的等效实施例。因此，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (5)

1.一种具有不同截面直径焊线的功率模块(100)，包括：散热底板(3)，在散热底板(3)上设有覆铜陶瓷基板(5)，所述覆铜陶瓷基板(5)包括陶瓷基板(5.2)，在陶瓷基板(5.2)的下表面上设有覆铜(5.3)且覆铜(5.3)设在散热底板(3)的上表面上，在覆铜陶瓷基板(5)上至少设有2个端子(2)，所述端子(2)连接于位于所述端子(2)下方并设在陶瓷基板(5.2)的上表面上的覆铜片(5.1)上，在需要实现连接的两个端子(2)中的一个端子下方的覆铜片(5.1)上连接有功率芯片(6)，所述功率芯片(6)通过一排焊线(7)与所述需要实现连接的两个端子(2)中的另一个端子连接，其特征在于，同一功率芯片(6)上的焊线的截面直径反比于位于所述同一功率芯片(6)上的该焊线的端部焊点(8)至连接于所述同一功率芯片(6)下方覆铜片(5.3)的端子(2)之间的距离。
2.根据权利要求1所述的具有不同截面直径焊线的功率模块，其特征在于，所述端子(2)采用3个且分别为第一端子(2.1)、第二端子(2.2)和第三端子(2.3)，功率芯片(6)采用2个且分别为第一功率芯片(6.1)和第二功率芯片(6.2)，第一功率芯片(6.1)与第一端子(2.1)连接并具体通过位于第一功率芯片(6.1)与第一端子(2.1)下方的覆铜片连接；第二功率芯片(6.2)与第二端子(2.2)连接并具体通过位于第二功率芯片(6.2)与第二端子(2.2)下方的覆铜片连接。
3.根据权利要求书1所述的具有不同截面直径焊线的功率模块，其特征在于，所述焊线(7)使用的材质为高电导率金属材料。
4.根据权利要求3所述的具有不同截面直径焊线的功率模块，其特征在于，所述高电导率金属材料包括铝Al，铜Cu，银Ag或金Au。
5.根据权利要求1所述的具有不同截面直径焊线的功率模块，其特征在于，焊线最小截面直径小于等于0.38mm，焊线最大截面直径大于等于0.5mm，相邻焊线的间距大于0.2mm。
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