CN102610583A - 封装载板及其制作方法 - Google Patents
封装载板及其制作方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 33
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- 239000002184 metal Substances 0.000 claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 230000004888 barrier function Effects 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 9
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
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- 238000005553 drilling Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 51
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
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- 239000004065 semiconductor Substances 0.000 description 3
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Abstract
本发明公开一种封装载板及其制作方法。该制作方法提供一包括一第一金属层、一第二金属层及一配置于第一金属层与第二金属层之间的绝缘层的基板。第二金属层的厚度大于第一金属层的厚度。第二金属层具有彼此相对的一顶面以及一底面。形成一贯穿第一金属层与绝缘层的第一开口。第一开口暴露出第二金属层的部分顶面。图案化第一金属层,以形成一图案化导电层。形成多个第二开口于第二金属层的底面上。第二开口将第二金属层区分为多个散热区块。第二开口不连通第一开口。形成一表面保护层于图案化导电层以及第一开口所暴露出的第二金属层的部分顶面上。
Description
技术领域
本发明涉及一种半导体结构及其制作方法,且特别是涉及一种封装载板及其制作方法。
背景技术
芯片封装的目的是提供芯片适当的信号路径、导热路径及结构保护。传统的打线(wire bonding)技术通常采用导线架(leadframe)作为芯片的承载器(carrier)。随着芯片的接点密度逐渐提高,导线架已无法再提供更高的接点密度,故可利用具有高接点密度的封装基板(package substrate)来取代之,并通过金属导线或凸块(bump)等导电媒体,将芯片封装至封装基板上。
以目前常用的发光二极管封装结构来说,由于发光二极管芯片在使用前需先进行封装,且发光二极管芯片在发出光线时会产生大量的热能。倘若热能无法逸散而不断地堆积在发光二极管封装结构内,则发光二极管封装结构的温度会持续地上升。如此一来,发光二极管芯片可能会因为过热而导致亮度衰减及使用寿命缩短,严重者甚至造成永久性的损坏。因此,现今采用的发光二极管封装结构都会配置散热块(heat sink)以对发光二极管芯片进行散热。
现有的封装基板主要是由多层图案化导电层与至少一绝缘层所构成,其中绝缘层配置于相邻的二图案化导电层之间用以达到绝缘的效果。散热块是通过粘着层而固定于封装基板的下表面上。一般来说,发光二极管芯片与封装基板电连接,而发光二极管芯片所产生的热可经由图案化导电层、绝缘层而传递至散热块以进行导热。然而,由于粘着层与绝缘层的导热率较差,所以发光二极管芯片所产生的热经由绝缘层、粘着层而传递至散热块时,会造成热阻(thermal resistance)增加,进而导致导热不易。因此,如何使发光二极管芯片所产生热能够更有效率地传递至外界,俨然成为设计者在研发上关注的议题之一。
发明内容
本发明的目的在于提供一种封装载板,适于承载一发热元件。
本发明提供一种封装载板的制作方法,用以制作上述的封装载板。
本发明提出一种封装载板的制作方法,其包括下列步骤。提供一基板。基板包括一第一金属层、一第二金属层以及一配置于第一金属层与第二金属层之间的绝缘层。第二金属层的厚度大于第一金属层的厚度,且第二金属层具有彼此相对的一顶面以及一底面。形成一贯穿第一金属层与绝缘层的第一开口,其中第一开口暴露出第二金属层的部分顶面。图案化第一金属层,以形成一图案化导电层。形成多个第二开口于第二金属层的底面上,其中第二开口将第二金属层区分为多个散热区块,且第二开口不连通第一开口。形成一表面保护层于图案化导电层以及第一开口所暴露出的第二金属层的部分顶面上。
在本发明的一实施例中,上述的提供基板的步骤,包括:提供绝缘层以及位于绝缘层相对两侧边的第一金属层以及第二金属层。进行一热压合制作工艺,以使第一金属层、绝缘层以及第二金属层结合为一体而构成基板。
在本发明的一实施例中,上述的形成第一开口的方法包括冲切、开槽(routing)或激光钻孔。
在本发明的一实施例中,上述的第二金属层的厚度为第一金属层的厚度的1倍至100倍之间。
在本发明的一实施例中,上述的第一金属层的材质为铜箔。
在本发明的一实施例中,上述的第二金属层的材质包括铜、铜合金、铝或铝合金。
在本发明的一实施例中,上述的绝缘层的材质包括树脂、液晶高分子(liquid crystal polymer,LCP)或聚亚酰胺(Polyimide,PI)。
在本发明的一实施例中,上述的形成第二开口的方法包括光刻蚀刻法、机械钻孔法或雷射钻孔法。
在本发明的一实施例中,上述的形成表面保护层的方法包括电镀法。
本发明还提出一种封装载板,其适于承载一发热元件。封装载板包括一绝缘层、一图案化导电层、一散热块以及一表面保护层。绝缘层具有一上表面、一相对于上表面的下表面以及一连通上表面与下表面的第一开口。图案化导电层配置于绝缘层的上表面上且暴露出第一开口。散热块配置于绝缘层的下表面上,且具有一顶面、一相对于顶面的底面以及多个第二开口。第一开口暴露出部分顶面,以定义出一元件接合区,而第二开口不连通第一开口。表面保护层配置于图案化导电层上以及第一开口所暴露出的部分顶面上。发热元件配置于对应元件接合区的上方的表面保护层上。
在本发明的一实施例中,上述的图案化导电层的材质为铜箔。
在本发明的一实施例中,上述的散热块的材质包括铜、铜合金、铝或铝合金。
在本发明的一实施例中,上述的绝缘层的材质包括树脂、液晶高分子或聚亚酰胺。
基于上述,由于本发明是采用具有两种不同金属层厚度的基板来制作封装载板,因此可将厚度较厚的金属层视为一种散热块,并通过开口来暴露出较厚金属层的表面来作为一元件接合区。当将一发热元件配置于封装载板上时,发热元件是配置于散热块的表面上(意即元件接合区中),所以发热元件所产生的热可直接通过散热块而快速地传递至外界,而不会被绝缘层与粘着层所阻挡。如此一来,本发明的封装载板可以有效地排除发热元件所产生的热,进而改善发热元件的使用效率与使用寿命。
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附附图作详细说明如下。
附图说明
图1A至图1E为本发明的一实施例的一种封装载板的制作方法的剖面示意图;
图2为图1E的封装载板承载一发热元件的剖面示意图。
主要元件符号说明
20:发热元件
22:焊线
24:封装胶体
100:封装载板
101:基板
110:第一金属层
110’:图案化导电层
120:第二金属层
120’:散热块
122:顶面
123:元件接合区
124:底面
126:散热区块
130:绝缘层
132:上表面
134:下表面
140:表面保护层
S1:第一开口
S2:第二开口
T1、T2:厚度
具体实施方式
图1A至图1E为本发明的一实施例的一种封装载板的制作方法的剖面示意图。请先参考图1A,依照本实施例的封装载板的制作方法,首先,提供一第一金属层110、一第二金属层120以及一配置于第一金属层110与第二金属层120之间的绝缘层130。其中,第二金属层120具有彼此相对的一顶面122以及一底面124,而绝缘层130具有彼此相对的一上表面132以及一下表面134。特别是,在本实施例中,第二金属层120的厚度T2大于第一金属层110的厚度T1,较佳地,第二金属层120的厚度为第一金属层110的厚度的1倍至100倍之间。此外,第一金属层110的材质例如是铜箔,第二金属层120的材质例如是铜、铜合金、铝、铝合金或其他导热性佳的金属,而绝缘层130的材质例如是树脂、液晶高分子(liquid crystal polymer,LCP)或聚亚酰胺(Polyimide,PI)。
接着,请参考图1B,进行一热压合制作工艺,以使第一金属层110、绝缘层130以及第二金属层120结合为一体而构成一基板101。也就是说,通过热压合制作工艺,使第一金属层110固着于绝缘层130的上表面132上,而第二金属层120固着于绝缘层130的下表面134上。
接着,请参考图1C,形成一贯穿第一金属层110与绝缘层130的第一开口S1,其中第一开口S1暴露出第二金属层120的部分顶面122而定义出一元件接合区123。在本实施例中,形成第一开口S1的方法例如是冲切、开槽(routing)、激光钻孔或其他适当的方式。
接着,请参考图1D,图案化第一金属层110,以形成一图案化导电层110’,其中图案化导电层110’暴露出部分绝缘层130的上表面132。
然后,请再参考图1D,形成多个第二开口S2于第二金属层120的底面124上,其中第二开口S2将第二金属层120区分为多个散热区块126,且第二开口S2不连通第一开口S1。也就是说,第二开口S2并未连接第二金属层120的顶面122。在此,具有第二开口S2的第二金属层120可视为一种散热块120’,而第二开口S2可视为一种流体通道。此外,在本实施例中,形成第二开口S2的方法例如是光刻蚀刻法、机械钻孔法或激光钻孔法。
必须说明的是,本实施例并不限制形成图案化导电层110’与第二开口S2的形成步骤,虽然此处是先形成图案化导电层110’之后,再形成第二开口S2。在另一实施例中,也可先形成第二开口S2之后,在形成图案化导电层110’。在又一实施例中,也可通过蚀刻速率的控制,同时形成图案化导电层110’以及第二开口S2。简言之,上述依序形成图案化导电层110’与配置第二开口S2的步骤仅为举例说明,并不以此为限。
之后,请参考图1E,形成一表面保护层140于图案化导电层110’以及第一开口S1所暴露出的第二金属层120的部分顶面122上。也就是说,表面保护层140是位于图案化导电层110’上以及元件接合区123中。在此,表面保护层140主要是用以保护图案化导电层110’以及被第一开口S1所暴露出的第二金属层120的部分顶面122,以减缓氧化速率。在本实施例中,表面保护层140的材质例如是镍金,而形成表面保护层140的方法例如是电镀法。至此,已完成封装载板100的制作。
在结构上,本实施例的封装载板100包括图案化导电层110’、散热块120’、绝缘层130以及表面保护层140。绝缘层130具有上表面132、下表面134以及连通上表面132与下表面134的第一开口S1。图案化导电层110’配置于绝缘层130的上表面132上且暴露出第一开口S1。散热块120’配置于绝缘层130的下表面134上且具有顶面122、底面124以及多个第二开口S2。特别是,第一开口S1暴露出散热块120’的部分顶面122,以定义出元件接合区123,而第二开口S2不连通第一开口S1。表面保护层140配置于图案化导电层110′上以及第一开口S1所暴露出的散热块120’的部分顶面122上。也就是说,元件接合区123中也有配置表面保护层140。
图2为图1E的封装载板承载一发热元件的剖面示意图。请参考图2,在本实施例中,封装载板100适于承载一发热元件20,其中发热元件20配置于对应元件接合区123的上方的表面保护层140上,而发热元件20例如是一电子芯片或一光电元件,但并不以此为限。举例来说,电子芯片可以是一集成电路芯片,其例如为一绘图芯片、一存储器芯片、一半导体芯片等单一芯片或是一芯片模块。光电元件例如是一发光二极管(LED)、一激光二极管或一气体放电光源等。在此,发热元件20是以一发光二极管(LED)作为举例说明。
详细来说,发热元件20(例如是半导体芯片)可通过多条焊线22以打线接合的方式而电连接至表面保护层140,且也可通过一封装胶体24来包覆发热元件20、这些焊线22以及部分封装载板100,用以保护发热元件20与这些焊线22及封装载板100之间的电连接关系。此外,由于发热元件20可直接配置于对应元件接合区123的上方的表面保护层140上,也就是说,发热元件20是配置于散热块120’上方金属材质(例如是镍金)的表面保护层140上。因此,发热元件20所产生的热可通过金属材质的表面保护层140与散热块120’而快速地传递至外界。相较于现有技术而言,本实施例无须额外通过粘着层而将散热块贴附于封装载板的下方,且发热元件20所产生的热也不用经由绝缘层与粘着层来传递。因此,封装载板100除了可以有效地排除发热元件20所产生的热,进而改善发热元件20的使用效率与使用寿命之外,也可减少生产成本。
值得一提的是,本发明并不限定发热元件20与封装载板100的接合形态以及发热元件20的型态,虽然此处所提及的发热元件20具体化是通过打线接合而电连接至封装载板100的表面保护层140。不过,在另一实施例中,发热元件20也可通过多个凸块(未绘示)以覆晶接合的方式而电连接至位于元件接合区123上方的表面保护层140上。在另一实施例中,发热元件20可为一芯片封装体(未绘示),并以表面粘着技术(SMT)安装至封装载板100。上述的发热元件20与封装载板100的接合形态以及发热元件20的形态仅为举例说明之用,并非用以限定本发明。
综上所述,由于本发明是采用具有两种不同金属层厚度的基板来制作封装载板,因此可将厚度较厚的金属层视为一种散热块,并通过开口来暴露出较厚金属层的表面来作为一元件接合区。当将一发热元件配置于封装载板上时,发热元件是配置于散热块的表面上(意即元件接合区中),所以发热元件所产生的热可直接通过散热块而快速地传递至外界,而不会被绝缘层与粘着层所阻挡。如此一来,本发明的封装载板可以有效地排除发热元件所产生的热,进而改善发热元件的使用效率与使用寿命。
虽然结合以上实施例揭露了本发明,然而其并非用以限定本发明,任何所属技术领域中熟悉此技术者,在不脱离本发明的精神和范围内,可作些许的更动与润饰,故本发明的保护范围应以附上的权利要求所界定的为准。
Claims (13)
1.一种封装载板的制作方法,包括:
提供一基板,该基板包括第一金属层、第二金属层以及配置于该第一金属层与该第二金属层之间的绝缘层,其中该第二金属层的厚度大于该第一金属层的厚度,且该第二金属层具有彼此相对的顶面以及底面;
形成一贯穿该第一金属层与该绝缘层的第一开口,其中该第一开口暴露出该第二金属层的部分该顶面;
图案化该第一金属层,以形成一图案化导电层;
形成多个第二开口于该第二金属层的该底面上,其中该些第二开口将该第二金属层区分为多个散热区块,且该些第二开口不连通该第一开口;以及
形成一表面保护层于该图案化导电层以及该第一开口所暴露出的该第二金属层的部分该顶面上。
2.如权利要求1所述的封装载板的制作方法,其中提供该基板的步骤,包括:
提供该绝缘层以及位于该绝缘层相对两侧边的该第一金属层以及该第二金属层;以及
进行一热压合制作工艺,以使该第一金属层、该绝缘层以及该第二金属层结合为一体而构成该基板。
3.如权利要求1所述的封装载板的制作方法,其中形成该第一开口的方法包括冲切、开槽或激光钻孔。
4.如权利要求1所述的封装载板的制作方法,其中该第二金属层的厚度为该第一金属层的厚度的1倍至100倍之间。
5.如权利要求1所述的封装载板的制作方法,其中该第一金属层的材质为铜箔。
6.如权利要求1所述的封装载板的制作方法,其中该第二金属层的材质包括铜、铜合金、铝或铝合金。
7.如权利要求1所述的封装载板的制作方法,其中该绝缘层的材质包括树脂、液晶高分子或聚亚酰胺。
8.如权利要求1所述的封装载板的制作方法,其中形成该第二开口的方法包括光刻蚀刻法、机械钻孔法或雷射钻孔法。
9.如权利要求1所述的封装载板的制作方法,其中形成该表面保护层的方法包括电镀法。
10.一种封装载板,适于承载一发热元件,该封装载板包括:
绝缘层,具有上表面、相对于该上表面的下表面以及连通该上表面与该下表面的第一开口;
图案化导电层,配置于该绝缘层的该上表面上且暴露出该第一开口;
散热块,配置于该绝缘层的该下表面上,且具有顶面、相对于该顶面的底面以及多个第二开口,其中该第一开口暴露出部分该顶面,以定义出一元件接合区,而该些第二开口不连通该第一开口;以及
表面保护层,配置于该图案化导电层上以及该第一开口所暴露出的部分该顶面上,且该发热元件配置于对应该元件接合区的上方的该表面保护层上。
11.如权利要求10所述的封装载板,其中该图案化导电层的材质为铜箔。
12.如权利要求10所述的封装载板,其中该散热块的材质包括铜、铜合金、铝或铝合金。
13.如权利要求10所述的封装载板,其中该绝缘层的材质包括树脂、液晶高分子或聚亚酰胺。
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US20120181290A1 (en) | 2012-07-19 |
US20130137221A1 (en) | 2013-05-30 |
US8746308B2 (en) | 2014-06-10 |
TWI446495B (zh) | 2014-07-21 |
CN102610583B (zh) | 2015-06-24 |
JP2012151431A (ja) | 2012-08-09 |
TW201232724A (en) | 2012-08-01 |
JP5686672B2 (ja) | 2015-03-18 |
US8624388B2 (en) | 2014-01-07 |
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