WO2021024571A1 - Dispositif d'aide au montage de composants et système de montage de composants - Google Patents

Dispositif d'aide au montage de composants et système de montage de composants Download PDF

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Publication number
WO2021024571A1
WO2021024571A1 PCT/JP2020/019153 JP2020019153W WO2021024571A1 WO 2021024571 A1 WO2021024571 A1 WO 2021024571A1 JP 2020019153 W JP2020019153 W JP 2020019153W WO 2021024571 A1 WO2021024571 A1 WO 2021024571A1
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WIPO (PCT)
Prior art keywords
component
board
alternative
information
unit
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PCT/JP2020/019153
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English (en)
Japanese (ja)
Inventor
山崎　琢也
敬明 横井
憲一郎 石本
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to DE112020003728.2T priority Critical patent/DE112020003728T5/de
Priority to CN202080045958.6A priority patent/CN114026974A/zh
Priority to JP2021537586A priority patent/JP7261963B2/ja
Publication of WO2021024571A1 publication Critical patent/WO2021024571A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates

Definitions

  • This disclosure relates to a component mounting support device and a component mounting system that support component mounting work for mounting components on a board.
  • the component mounting device produces a mounting board by mounting multiple types of components on the board.
  • the component mounting device mounts a specified type of component at a predetermined mounting position on the board according to a mounting program created in advance, including information such as the type and mounting position of the component to be mounted on the board.
  • parts of the same type may be supplied by multiple parts manufacturers.
  • the same type of general-purpose parts may be purchased from a plurality of component manufacturers and stored, and used for mounting board production while appropriately switching according to the number of stocks.
  • general-purpose parts from different parts manufacturers are managed by changing the part name. Then, when changing the component manufacturer of the general-purpose component mounted on the board, the component name of the corresponding component in the mounting program is changed.
  • Patent Document 1 Since changing the mounting program is a complicated task, a method for easily replacing parts has been proposed (see, for example, Patent Document 1).
  • Patent Document 1 information in which the part names of substitutable parts are associated with each part is prepared in advance, and the part names of the mounting program are changed based on the number of parts used and the number of stocks. , It is possible to replace parts automatically.
  • the component mounting support device of the present disclosure includes a component information storage unit, a board information storage unit, and an alternative component extraction unit.
  • the component information storage unit stores information on at least one alternative component in association with the designated component mounted on the board.
  • the board information storage unit stores the required conditions required for the board for each type of board on which the designated component is mounted.
  • the alternative component extraction unit extracts alternative components that can be mounted on the board based on the requirements stored in the board information storage unit when the designated components are insufficient.
  • the component mounting support device of another aspect of the present disclosure includes a board information storage unit and an alternative component extraction unit.
  • the board information storage unit stores information on alternative parts that can be mounted for each type of board on which the designated parts are mounted.
  • the substitute parts extraction unit extracts the substitute parts that can be mounted on the board based on the information of the substitute parts stored in the board information storage unit.
  • the component mounting system of the present disclosure includes at least one component mounting device, a component information storage unit, a board information storage unit, and an alternative component extraction unit.
  • the component mounting device mounts the component on the board.
  • the component information storage unit stores information on at least one alternative component in association with the designated component mounted on the board.
  • the board information storage unit stores the required conditions required for the board for each type of board on which the designated component is mounted.
  • the alternative component extraction unit extracts alternative components that can be mounted on the board based on the requirements stored in the board information storage unit when the designated components are insufficient.
  • Another aspect of the component mounting system of the present disclosure includes at least one component mounting device, a board information storage unit, and an alternative component extraction unit.
  • the component mounting device mounts the component on the board.
  • the board information storage unit stores information on alternative parts that can be mounted for each type of board on which the designated parts are mounted.
  • the substitute parts extraction unit extracts the substitute parts that can be mounted on the board based on the information of the substitute parts stored in the board information storage unit.
  • FIG. 1 is a configuration explanatory view of the component mounting system of the embodiment.
  • FIG. 2 is a configuration explanatory view of the component mounting device of the embodiment.
  • FIG. 3A is a diagram showing an example of a mounting board produced in the component mounting system of the embodiment.
  • FIG. 3B is a diagram showing an example of a mounting board produced in the component mounting system of the embodiment.
  • FIG. 4 is a block diagram showing the configuration of the component mounting system of the embodiment.
  • FIG. 5 is a diagram showing an example of component information used in the management computer (component mounting support device) of the embodiment.
  • FIG. 6A is a diagram showing an example of required conditional board information used in the management computer (component mounting support device) of the embodiment.
  • FIG. 6B is a diagram showing an example of required conditional board information used in the management computer (component mounting support device) of the embodiment.
  • FIG. 7A is a diagram showing an example of board information with alternative information used in the management computer (component mounting support device) of the embodiment.
  • FIG. 7B is a diagram showing an example of board information with alternative information used in the management computer (component mounting support device) of the embodiment.
  • FIG. 8 is a diagram showing an example of an alternative component selection screen displayed on a display unit included in the management computer (component mounting support device) of the embodiment.
  • FIG. 9 is a diagram showing an example of an alternative component supply support screen displayed on a mobile terminal included in the component mounting system of the embodiment.
  • FIG. 10 is a flow chart of the component mounting method of the embodiment.
  • the embodiments of the present disclosure will be described in detail below with reference to the drawings.
  • the configurations, shapes, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting system, the component mounting device, and the management computer.
  • the corresponding elements are designated by the same reference numerals in all the drawings, and duplicate description will be omitted.
  • the two axial directions orthogonal to each other in the horizontal plane are the X direction of the substrate transport direction (horizontal direction in FIG. 2) and the Y direction orthogonal to the substrate transport direction (vertical direction in FIG. 2). Is shown.
  • the component mounting system 1 has a function of mounting components on a board to produce a mounting board.
  • the component mounting system 1 is configured by connecting a plurality of component mounting devices M1 to M3.
  • the component mounting devices M1 to M3 are connected to the management computer 3 via the communication network 2.
  • the management computer 3 integrates and manages the production of the mounting board by the component mounting system 1, and also creates various parameters used in the component mounting devices M1 to M3.
  • the component mounting device included in the component mounting system 1 is not limited to three, and may be one, two, or four or more. That is, the component mounting system 1 has at least one component mounting device for mounting components on a board.
  • the component mounting system 1 has a mobile terminal T used by an operator.
  • the mobile terminal T has a terminal-side communication unit Ta that wirelessly communicates with the management computer 3 to exchange information, and a touch panel Tb that has a display function and an input function.
  • the mobile terminal T receives various information transmitted from the management computer 3, processes it, and displays it on the touch panel Tb. Further, the mobile terminal T transmits various information input from the touch panel Tb to the management computer 3.
  • a substrate transfer mechanism 5 is installed in the X direction at the center of the base 4.
  • the board transport mechanism 5 transports the board B carried in from the upstream side in the X direction, positions it at the mounting work position by the mounting head, and holds it. Further, the board transfer mechanism 5 carries out the board B for which the component mounting work has been completed to the downstream side.
  • Parts supply units 6 are installed on both sides (front and back) of the board transfer mechanism 5.
  • a plurality of tape feeders 7 are mounted in parallel in the X direction on the component supply units 6 on both sides.
  • the mounting head picks up the components by feeding the carrier tape having the pockets for storing the components from the outside of the component supply unit 6 in the direction toward the substrate transport mechanism 5 (tape feed direction). Parts are supplied to the parts removal position.
  • Y-axis tables 8 having a linear drive mechanism are arranged at both ends in the X direction on the upper surface of the base 4.
  • a beam 9 similarly provided with a linear mechanism is movably coupled to the Y-axis table 8 in the Y direction.
  • a mounting head 10 is mounted on the beam 9 so as to be movable in the X direction.
  • the mounting head 10 has a plurality of suction units (not shown) that can hold parts, move up and down, and rotate around a vertical axis (Z axis).
  • a suction nozzle (not shown) for sucking and holding a component is attached to each lower end of the suction unit.
  • the Y-axis table 8 and the beam 9 constitute a mounting head moving mechanism that moves the mounting head 10 in the horizontal direction (X direction, Y direction).
  • the mounting head moving mechanism and the mounting head 10 constitute a component mounting mechanism 11 that executes a component mounting operation of taking out a component from the component supply unit 6 and mounting the component at a mounting position of the board B.
  • the mounting head 10 moves above the component supply unit 6, picks up a predetermined component with a suction nozzle, moves above the substrate B, rotates in a predetermined direction, and mounts at a mounting position. Repeat the turn.
  • the beam 9 is equipped with a head camera 12 that is located on the lower surface side of the beam 9 and moves integrally with the mounting head 10.
  • the head camera 12 moves above the board B positioned at the mounting work position of the board transport mechanism 5 and images a board mark (not shown) provided on the board B. Recognizes the position of the substrate B.
  • a parts recognition camera 13 is installed between the parts supply unit 6 and the board transfer mechanism 5.
  • the component recognition camera 13 takes an image of the component held by the suction nozzle from below.
  • the mounting position is corrected in consideration of the recognition result of the board B by the head camera 12 and the recognition result of the component by the component recognition camera 13.
  • a device touch panel 14 operated by the operator is installed at a position where the operator works in front of the component mounting device M1.
  • Various information is displayed on the display unit of the device touch panel 14. Further, the operator performs data input and operation of the component mounting device M1 by using the operation buttons displayed on the display unit of the device touch panel 14.
  • the substrate B1 shown in FIG. 3A and the substrate B2 shown in FIG. 3B have the same electrical function but different sizes.
  • On the board B1 one large component D1 and four small components D2 to D5 are mounted at mounting positions P1 to P5, respectively.
  • the size of the substrate B2 is smaller than that of the substrate B1, and the distance between the components D6 to D10 is also narrower than that of the components D1 to D5. That is, the substrate B1 is a low-priced mounting substrate, and the substrate B2 is a high-density mounting substrate.
  • the management computer 3 has a processing unit 20, a component information storage unit 27 which is a storage device, a board information storage unit 28, a production information storage unit 29, an input unit 30, a display unit 31, and a wireless communication unit 32.
  • the processing unit 20 is a data processing device such as a CPU (Central Processing Unit), and as an internal processing unit, a parts inventory quantity acquisition unit 21, an alternative part extraction unit 22, an alternative part determination unit 23, a display processing unit 24, and a supply position determination unit. 25, has a transmission processing unit 26.
  • the management computer 3 does not have to be configured by one computer, and may be configured by a plurality of devices. For example, all or part of the storage device may be provided in the cloud via a server.
  • the input unit 30 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting operation commands and data.
  • the display unit 31 is a display device such as a liquid crystal panel, and displays various data stored in each storage unit. In addition, the display unit 31 displays various information such as an operation screen for operation by the input unit 30.
  • the wireless communication unit 32 is a wireless communication processing device, and wirelessly transmits and receives data and the like to and from the mobile terminal T.
  • the component information storage unit 27 stores component information 27a and the like.
  • the part information 27a includes “part number” 40, “electrical characteristic (type)” 41, “electrical characteristic (characteristic)” 42, “part size” 43, “electrical special rank” 44, and “shape rank” 45.
  • "Cost rank” 46, "Manufacturer number” 47, "Alternative part number” 48 are included.
  • the "part number” 40 is information for specifying the type of the part D.
  • the “electrical characteristic (type)” 41 is information for specifying the type of the electrical characteristic of the component D.
  • MPU microprocessor
  • resistor resistor
  • capacity capacitor
  • component D is a general term for the components D1 to D10 in FIGS. 3A and 3B, for example.
  • “Electrical characteristics (characteristics)” 42 indicates the value (center value) of the electrical characteristics of the component D.
  • Part size” 43 is information for specifying the shape and size of the part D.
  • the part number 40 "E002” indicates that the resistance is 10 k ⁇
  • the part size 43 "0603" indicates that the chip component has a length of 0.6 mm and a width of 0.3 mm.
  • the part numbers 40 "E001” and “E006” are microprocessors of "MPU1” having the same electrical characteristics (characteristics) 42
  • the part size 43 "QFP20 * 20" is a QFP of 20 mm x 20 mm. It indicates that it is a package (Quad Flat Package), and that "BGA20 * 20” is a 20 mm ⁇ 20 mm BGA (Ball Grid Array) package.
  • the "electrical special rank” 44 indicates the accuracy of the electrical characteristics of the component D in three stages from A to C, and "A” indicates that the accuracy is high.
  • “Shape rank” 45 indicates the variation (error) of the outer shape of the component D in three stages of A to C, and “A” indicates that the variation is small.
  • the "cost rank” 46 indicates the price of the part D in three stages from A to C, and "A” indicates that the price is low.
  • the electric special rank 44, the shape rank 45, and the cost rank 46 are not limited to the three stages, and may be five stages or the like. Alternatively, it may be displayed as a numerical value (range of ratio or absolute value) instead of a step.
  • Manufacturer number” 47 is information that identifies the part manufacturer that manufactured the part D.
  • the "substitute part number” 48 indicates the part number 40 of the part D that can be replaced with the part D of the part number 40. That is, the part D shown in the alternative part number 48 is a part D having the same electrical characteristics (type) 41, electrical characteristics (characteristics) 42, and part size 43 as the part D of the part number 40. When there is no substitute part, "-" is displayed in "substitute part number” 48.
  • the board information storage unit 28 stores the board information 28a with required conditions, the board information 28b with alternative information, and the like.
  • the required conditional board information 28a will be described with reference to FIG.
  • FIG. 6A is an example of the required conditional substrate information 28a of the substrate B1 shown in FIG. 3A
  • FIG. 6B is an example of the required conditional substrate information 28a of the substrate B2 shown in FIG. 3B.
  • the required conditional board information 28a includes a "board name” 50, a "required condition” 51, a "mounting position coordinate" 52, and a "designated part number" 53.
  • the “board name” 50 is information for specifying the type of mounting board to be produced.
  • “Requirement condition” 51 indicates the condition required for the mounting board.
  • the requirement 51 for the mounting board with the board name 50 "B1” is “low price”
  • the requirement 51 for the mounting board with the board name 50 "B2” is "high density mounting”.
  • the "mounting position coordinate” 52 indicates the mounting position P on the substrate B on which the component D is mounted in XY coordinates, and is represented by "X coordinate” 52x and "Y coordinate” 52y.
  • the “designated part number” 53 is information for specifying the type of the part D to be mounted at the mounting position P, and is associated with the part number 40 included in the part information 27a shown in FIG.
  • the part D1 whose part number 40 is "E001" is designated as the part D to be mounted at the mounting position P1 (X1, Y1) of the mounting board whose board name 50 is "B1".
  • the board information storage unit 28 includes the requirement condition 51 required for the board B for each type (board name 50) of the board B on which the designated component specified by the designated part number 53 is mounted. Attached board information 28a is stored.
  • FIG. 7A is the substrate information 28b with alternative information of the substrate B1 shown in FIG. 3A.
  • FIG. 7B is the substrate information 28b with alternative information of the substrate B2 shown in FIG. 3B.
  • the board information 28b with alternative information includes a "board name” 50, a "mounting position coordinate” 52, a "designated part number” 53, and a "substitutable part number” 54.
  • the “board name” 50, “mounting position coordinates” 52, and “designated part number” 53 are the same as the above-mentioned required conditional board information 28a, and the description thereof will be omitted.
  • the "substitutable part number" 54 indicates the part number 40 of the substitute part that can be replaced when the part D of the designated part number 53 is out of stock. That is, the part D shown in the substitutable part number 54 is electric among the parts D having the same electrical characteristics (type) 41, electrical characteristics (characteristics) 42, and part size 43 as the part D of the designated part number 53.
  • the special rank 44, the shape rank 45, and the cost rank 46 are the parts D that satisfy the requirement 51 of the substrate B.
  • the board information storage unit 28 includes alternative information (substitutable part number 54) that can be mounted for each type (board name 50) of the board B on which the component D (designated component) is mounted.
  • the attached board information 28b is stored.
  • the board information storage unit 28 may store board information in a format including both the requirement condition 51 and the substitutable part number 54.
  • the production information storage unit 29 stores parts arrangement information 29a, parts inventory information 29b, and the like.
  • the component placement information 29a describes the mounting position (slot) of the tape feeder 7 in the component supply unit 6 of the component mounting devices M1 to M3 included in the component mounting system 1 and the type of component D supplied from the mounted tape feeder 7.
  • the component placement information 29a corresponds to the information corresponding to the current state of the component mounting devices M1 to M3 and the state after the setup change work of the component mounting devices M1 to M3 to be set up for the production of the next mounting board. Information to be implemented is included.
  • the component inventory quantity acquisition unit 21 acquires the remaining number of components D supplied by the component mounting devices M1 to M3, and records the production information storage unit as the component inventory information 29b associated with the type of component D (part number 40). Store in 29.
  • the component inventory quantity acquisition unit 21 also acquires the number of component Ds in the component storage, setup workbench, etc. provided in the production factory of the mounting board on which the component mounting devices M1 to M3 are installed, and obtains the type of component D. It is stored in the production information storage unit 29 as the part inventory information 29b associated with (part number 40). That is, the component inventory quantity acquisition unit 21 acquires the inventory quantity of the component D in the production factory.
  • the component inventory quantity acquisition unit 21 acquires the inventory quantity of the component D at a predetermined time (for example, at regular intervals such as 5 minute intervals, or at each event when the mounting of the component D on one board B is completed). .. As a result, the component inventory information 29b is updated to the latest inventory quantity of the component D currently used for the production of the mounting board and the component D available at the production factory.
  • the alternative component extraction unit 22 lacks the designated components when it is found that the designated components are missing or insufficient during the production of the mounting board, or when the setup is changed to produce a new mounting board. If it is found, a substitute part that replaces the specified part is extracted. Specifically, the alternative component extraction unit 22 extracts alternative components based on the component information 27a, the required conditional board information 28a, and the required condition 51.
  • the part number 40 of the part information 27a in FIG. 5 is a candidate for a substitute part of the designated part (E007) mounted at the mounting position P7.
  • E002, E011, and E012 which are indicated by the alternative part number 48 of "E007".
  • the requirement 51 of the substrate whose substrate name 50 is "B2" is "high density mounting”. Therefore, the substitute part extraction unit 22 extracts the part whose shape rank 45 of the required part (E007) is “A” or higher and whose part number 40 is “E012” as a substitute part. That is, the alternative component extraction unit 22 (alternative component extraction means) extracts alternative components that can be mounted on the substrate B2 based on the requirement condition 51 stored in the board information storage unit 28 when there is no designated component.
  • the alternative component extraction unit 22 extracts alternative components based on the board information 28b with alternative information. For example, when the board name 50 shown in FIG. 6A is the board of "B1", the substitute part extraction unit 22 is shown in the replaceable part number 54 as a substitute part of the designated part (E002) mounted at the mounting position P2. Two of E007 and E012 are extracted. That is, the alternative component extraction unit 22 (alternative component extraction means) can be mounted on the substrate B1 based on the information of the alternative component (substitutable part number 54) stored in the board information storage unit 28 when there is no designated component. Extract alternative parts. When there are a plurality of alternative component candidates, the alternative component extraction unit 22 extracts two or more alternative components.
  • the alternative component determination unit 23 (substitute component determination means) has a plurality of mountable alternative components when a plurality of mountable alternative components are extracted by the alternative component extraction unit 22 (replacement component extraction means). One of the alternative parts is determined.
  • the alternative part determination unit 23 has a determination condition storage unit 23a that stores a determination condition for determining an alternative part and a determination unit 23b that determines one alternative part based on the determination condition stored in the determination condition storage unit 23a. It has.
  • As the determination conditions conditions such as "cost priority”, "inventory priority”, and "quality priority" are set for each type of substrate (board name 50).
  • E007 and E012 are extracted by the substitute part extraction unit 22 as substitute parts for the designated part (E002) whose board name 50 is "B1", and "cost priority" is set as a determination condition.
  • the determination unit 23b determines E007, which has a lower price, as the alternative part because the cost rank 46 of the alternative part (E007) is "B” and the cost rank 46 of the alternative part (E012) is "C”. ..
  • the alternative parts determination unit 23 determines the alternative parts based on the number of parts D in stock included in the parts inventory information 29b. For example, when two alternative parts are extracted by the alternative part extraction unit 22, the number of substitute parts (E007) in stock is 100, and the number of substitute parts (E012) in stock is 1000, and the required designated parts ( When the number of E002) is 300, the substitute part determination unit 23 determines the substitute part (E012) having the necessary inventory as the substitute part. When determining a substitute part based on the number of parts in stock, the expiration date of the part D, the number of days elapsed from the start of storage of the part D, and the like may be taken into consideration.
  • the display processing unit 24 displays identification information of a plurality of mountable alternative parts on the display unit 31 to display an alternative part selection screen that allows an operator to select one alternative part.
  • an example of the alternative component selection screen 60 displayed on the display unit 31 will be described with reference to FIG.
  • a "board name” display frame 61, a "designated part number” display frame 62, a “designated part information” display frame 63, an "alternative part information” display frame 64, and an "enter” button 65 are displayed.
  • the board name 50 (B1) is displayed in the "board name” display frame 61.
  • the designated part number 53 (E002) is displayed in the "designated part number” display frame 62.
  • electric special rank 44 (B), shape rank 45 (B), cost rank 46 (A), and manufacturer number 47 (F002) are displayed in the designated part information. It is displayed.
  • the part number 40 (E007, E012), the electric special rank 44 (B, A), the shape rank 45 (A, A), and the cost rank 46 (B, C) of the substitute part are displayed.
  • Manufacturer number 47 (F004, F007), "selection" radio button 64a is displayed.
  • the electric special rank 44, the shape rank 45, the cost rank 46, and the manufacturer number 47 displayed in the “substitute part information” display frame 64 are identification information for identifying the substitute part.
  • the part manufacturer name may be displayed instead of the alternative component manufacturer number 47.
  • the operator uses the input unit 30 to select one of the plurality of "selection" radio buttons 64a displayed in the "alternative part information" display frame 64, and selects an alternative part (here, E007). ..
  • an alternative part here, E007. ..
  • the display processing unit 24 and the display unit 31 constitute an identification information presentation unit that presents identification information of a plurality of mountable alternative parts.
  • the display processing unit 24, the input unit 30, and the display unit 31 form a selection receiving unit that allows one alternative component to be selected from the identification information presented by the identification information presenting unit.
  • the substitute part determination unit 23 determines one substitute part selected by the operator as the substitute part.
  • the replenishment position determining unit 25 determines the replenishment position of the substitute part determined by the alternative part determination unit 23 based on the part arrangement information 29a. That is, the replenishment position determining unit 25 determines which position of the component supply unit 6 of the component mounting devices M1 to M3 to replenish the substitute component. At that time, the replenishment position determining unit 25 also determines the replenishment method of the alternative parts. For example, when the supply position determining unit 25 causes the tape feeder 7 supplying the designated parts to supply the substitute parts following the designated parts, the supply position determining unit 25 substitutes the end of the carrier tape of the designated parts supplied by the tape feeder 7. Determine the replenishment method so that the carrier tapes of the parts are spliced.
  • the transmission processing unit 26 transmits the information of the substitute part determined by the substitute part determination unit 23, the supply position of the substitute part determined by the supply position determination unit 25, and the information including the supply method to the mobile terminal via the wireless communication unit 32. It is displayed on the touch panel Tb of T as a substitute parts supply support screen.
  • a substitute parts supply support screen 70 displayed on the touch panel Tb of the mobile terminal T used by the operator will be described.
  • a "board name” display frame 71, an "alternative part number” display frame 72, an "alternative part supply work information” display frame 73, and an "OK” button 74 are displayed on the alternative part supply support screen 70.
  • the board name 50 (B1) is displayed in the "board name” display frame 71.
  • the part number 40 (E007) (information of the substitute part) of the substitute part is displayed.
  • the replenishment position determination unit 25 determines the 15th slot on the front side of the second component mounting device, which has an empty slot, as the replenishment position of the alternative component.
  • the replenishment position determining unit 25 (replenishment position determining means) is based on the information regarding the arrangement of the components (component arrangement information 29a) supplied to the component mounting devices M1 to M3 that mount the component D on the substrate B.
  • the supply position of the substitute component to be mounted on the substrate B is determined.
  • the transmission processing unit 26 and the wireless communication unit 32 constitute a transmission unit that transmits the supply position together with the information of the alternative component mounted on the board B.
  • the transmission processing unit 26 determines the component mounting devices M1 to M3 including the replenishment position. Send a command to mount a substitute part in place of the specified part. That is, when there are no designated parts mounted on the board B, a command is transmitted to the component mounting devices M1 to M3 capable of mounting the substitute parts to mount the substitute parts at the mounting position P of the designated parts on the board B. ..
  • the component mounting system 1 including at least one component mounting devices M1 to M3 for mounting the component D on the substrate B and the management computer 3 (component mounting support device) is one determined by the alternative component determination unit 23.
  • the component mounting devices M1 to M3 mount the substitute component on the substrate B.
  • the designated component D (designated component) can be easily changed to a substitute component that meets the requirements of the mounting board.
  • the component mounting method in the component mounting system 1 will be described with reference to FIG.
  • ST1 component mounting work process
  • the production of all the mounting boards is not completed (No in ST2)
  • the specified component is insufficient. It is determined whether or not there is (ST3). If there are no missing designated parts (No in ST3), the process returns to the part mounting work process (ST1) and the part mounting work is continued.
  • the alternative component extraction unit 22 extracts an alternative component that can be mounted on the substrate B (ST4).
  • the alternative part determination unit 23 determines one of the plurality of alternative parts as a substitute part (ST6).
  • the supply position determining unit 25 determines the supply position of the substitute part (ST7). If the determined supply position is already in a state where the substitute component can be supplied (Yes in ST8), the transmission processing unit 26 transmits a command to mount the substitute component on the component mounting devices M1 to M3 (ST9). ), Returning to the component mounting work process (ST1), the component mounting work is continued. When the determined replenishment position is not in a state where the substitute parts can be supplied (No in ST8), the transmission processing unit 26 transmits information instructing the replenishment work to the mobile terminal T used by the operator (ST10). Returning to the component mounting work process (ST1), the component mounting work is continued.
  • the management computer 3 of the present embodiment has a component information storage unit 27, a board information storage unit 28, and an alternative component extraction unit 22 (alternative component extraction means). Is.
  • the component information storage unit 27 stores information of at least one alternative component in association with a designated component mounted on the board B.
  • the board information storage unit 28 stores the requirement condition 51 required for the board B for each type of the board B on which the designated component is mounted.
  • the alternative component extraction unit 22 (alternative component extraction means) can be mounted on the substrate B based on the requirement condition 51 stored in the substrate information storage unit 28 when there is no designated component (when it is insufficient). Extract the parts.
  • the designated component D (designated component) can be easily changed to a substitute component that meets the requirement 51 of the mounting board.
  • the specified component can be easily changed to an alternative component that meets the requirements of the mounting board.
  • the component mounting support device and the component mounting system of the present disclosure have the effect that the specified component can be easily changed to a substitute component that meets the requirements of the mounting board, and are useful in the field of mounting the component on the board. Is.
  • Parts mounting system 1 Parts mounting system 2 Communication network 3 Management computer (Parts mounting support device) 4 Base 5 Board transfer mechanism 6 Parts supply unit 7 Tape feeder 8 Y-axis table 9 Beam 10 Mounting head 11 Parts mounting mechanism 12 Head camera 13 Parts recognition camera 14 Device touch panel 20 Processing unit 21 Parts inventory quantity acquisition unit 22 Substitute parts extraction Part 23 Alternative part determination unit 23a Decision condition storage unit 23b Determination unit 24 Display processing unit 25 Supply position determination unit 26 Transmission processing unit 27 Part information storage unit 27a Part information 28 Board information storage unit 28a Board information 28b Board information 29 Production information storage Part 29a Part placement information 29b Parts inventory information 30 Input part 31 Display part 32 Wireless communication part 40 Part number 43 Part size 44 Electrical special rank 45 Shape rank 46 Cost rank 48 Alternative part number 50 Board name 51 Requirements 53 Designated part number 54 Substitutable part number 60 Substitute part selection screen 61-64 Display frame 64a Radio button 65 button 70 Substitute part replenishment support screen 71-73 Display frame 74 button B board B1 board B2 board D

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention porte sur un dispositif d'aide au montage de composants qui comprend une unité de stockage d'informations de composant, une unité de stockage d'informations de carte et une unité d'extraction de composant de remplacement. L'unité de stockage d'informations de composant stocke des informations sur au moins un composant de remplacement en association avec des composants désignés à monter sur une carte. L'unité de stockage d'informations de carte stocke des conditions d'exigence requises pour une carte, pour chaque type de carte sur laquelle les composants désignés sont montés. L'unité d'extraction de composant de remplacement extrait un composant de remplacement pouvant être monté sur une carte sur la base des conditions d'exigence stockées dans l'unité de stockage d'informations de carte quand les composants désignés sont insuffisants.
PCT/JP2020/019153 2019-08-07 2020-05-13 Dispositif d'aide au montage de composants et système de montage de composants WO2021024571A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112020003728.2T DE112020003728T5 (de) 2019-08-07 2020-05-13 Komponentenmontage-Unterstützungsvorrichtung und Komponentenmontagesystem
CN202080045958.6A CN114026974A (zh) 2019-08-07 2020-05-13 部件安装支援装置以及部件安装系统
JP2021537586A JP7261963B2 (ja) 2019-08-07 2020-05-13 部品実装支援装置および部品実装システム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-145008 2019-08-07
JP2019145008 2019-08-07

Publications (1)

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WO2021024571A1 true WO2021024571A1 (fr) 2021-02-11

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PCT/JP2020/019153 WO2021024571A1 (fr) 2019-08-07 2020-05-13 Dispositif d'aide au montage de composants et système de montage de composants

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Country Link
JP (1) JP7261963B2 (fr)
CN (1) CN114026974A (fr)
DE (1) DE112020003728T5 (fr)
WO (1) WO2021024571A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124693A (ja) * 1998-10-16 2000-04-28 Matsushita Electric Ind Co Ltd 実装データ作成方法及び部品実装方法
JP2003273596A (ja) * 2002-03-18 2003-09-26 Fuji Mach Mfg Co Ltd 電子回路部品装着システム，装着制御プログラムおよび電子回路部品誤搭載防止システム
US20070250201A1 (en) * 2006-04-20 2007-10-25 Valor Computerized Systems Ltd. System and methods for automatic generation of component data
JP2007311546A (ja) * 2006-05-18 2007-11-29 Yamaha Motor Co Ltd 部品実装方法および部品実装装置
JP2016009734A (ja) * 2014-06-24 2016-01-18 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品データ作成方法

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Publication number Priority date Publication date Assignee Title
JP3337604B2 (ja) * 1996-03-15 2002-10-21 富士通テン株式会社 補給部品管理システム
JP4017264B2 (ja) * 1998-10-02 2007-12-05 松下電器産業株式会社 電子部品供給装置
JP6884950B2 (ja) * 2017-05-12 2021-06-09 株式会社Ｆｕｊｉ 部品実装システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124693A (ja) * 1998-10-16 2000-04-28 Matsushita Electric Ind Co Ltd 実装データ作成方法及び部品実装方法
JP2003273596A (ja) * 2002-03-18 2003-09-26 Fuji Mach Mfg Co Ltd 電子回路部品装着システム，装着制御プログラムおよび電子回路部品誤搭載防止システム
US20070250201A1 (en) * 2006-04-20 2007-10-25 Valor Computerized Systems Ltd. System and methods for automatic generation of component data
JP2007311546A (ja) * 2006-05-18 2007-11-29 Yamaha Motor Co Ltd 部品実装方法および部品実装装置
JP2016009734A (ja) * 2014-06-24 2016-01-18 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品データ作成方法

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CN114026974A (zh) 2022-02-08
JPWO2021024571A1 (fr) 2021-02-11
DE112020003728T5 (de) 2022-04-21
JP7261963B2 (ja) 2023-04-21

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