WO2021017494A8 - 一种掩模组件以及一种显示装置 - Google Patents

一种掩模组件以及一种显示装置 Download PDF

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Publication number
WO2021017494A8
WO2021017494A8 PCT/CN2020/080836 CN2020080836W WO2021017494A8 WO 2021017494 A8 WO2021017494 A8 WO 2021017494A8 CN 2020080836 W CN2020080836 W CN 2020080836W WO 2021017494 A8 WO2021017494 A8 WO 2021017494A8
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WO
WIPO (PCT)
Prior art keywords
display area
display
transition
display device
area
Prior art date
Application number
PCT/CN2020/080836
Other languages
English (en)
French (fr)
Other versions
WO2021017494A1 (zh
Inventor
彭兆基
刘明星
甘帅燕
张志远
李伟丽
Original Assignee
昆山国显光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Priority to KR1020227000784A priority Critical patent/KR20220019037A/ko
Priority to EP20846269.7A priority patent/EP3985142B1/en
Priority to JP2022502299A priority patent/JP2022541025A/ja
Publication of WO2021017494A1 publication Critical patent/WO2021017494A1/zh
Priority to US17/395,474 priority patent/US11957035B2/en
Publication of WO2021017494A8 publication Critical patent/WO2021017494A8/zh
Priority to JP2023122276A priority patent/JP2023159097A/ja

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/822—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

本申请提供的一种掩模组件和显示装置，其中显示装置包括显示区和至少一个非显示区，所述显示区围绕所述非显示区设置；还包括过渡显示区，所述过渡显示区与所述非显示区和所述显示区分别邻接，所述显示区和所述过渡显示区均用于显示静态或动态画面；所述过渡显示区的第一电极的厚度小于等于所述显示区的第一电极的厚度。由于过渡显示区的存在避免了显示装置中的因蒸镀材料未全面覆盖而导致的不完整显示，例如连桥所在区域形成黑边显示等，提高了显示的完整性。
PCT/CN2020/080836 2019-07-31 2020-03-24 一种掩模组件以及一种显示装置 WO2021017494A1 (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020227000784A KR20220019037A (ko) 2019-07-31 2020-03-24 마스크 어셈블리 및 표시 장치
EP20846269.7A EP3985142B1 (en) 2019-07-31 2020-03-24 Method of manufacturing a display device using a mask assembly and display device
JP2022502299A JP2022541025A (ja) 2019-07-31 2020-03-24 マスクアセンブリ及び表示装置
US17/395,474 US11957035B2 (en) 2019-07-31 2021-08-06 Mask assembly and display device including island shelters contacting substrate through mounting holes
JP2023122276A JP2023159097A (ja) 2019-07-31 2023-07-27 マスクアセンブリ及び表示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910704909.8 2019-07-31
CN201910704909.8A CN110438446B (zh) 2019-07-31 2019-07-31 一种掩模组件以及一种显示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/395,474 Continuation US11957035B2 (en) 2019-07-31 2021-08-06 Mask assembly and display device including island shelters contacting substrate through mounting holes

Publications (2)

Publication Number Publication Date
WO2021017494A1 WO2021017494A1 (zh) 2021-02-04
WO2021017494A8 true WO2021017494A8 (zh) 2022-01-20

Family

ID=68432789

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/080836 WO2021017494A1 (zh) 2019-07-31 2020-03-24 一种掩模组件以及一种显示装置

Country Status (7)

Country Link
US (1) US11957035B2 (zh)
EP (1) EP3985142B1 (zh)
JP (2) JP2022541025A (zh)
KR (1) KR20220019037A (zh)
CN (1) CN110438446B (zh)
TW (1) TWI736193B (zh)
WO (1) WO2021017494A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110438446B (zh) * 2019-07-31 2020-12-29 昆山国显光电有限公司 一种掩模组件以及一种显示装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7834943B2 (en) * 2006-12-12 2010-11-16 Tpo Displays Corp. Reduction of cross-talk in vertical direction for a dual view display devices
US20130122254A1 (en) * 2011-11-11 2013-05-16 Nai-Yue Liang Method for manufacturing a patterned layer of compressive stress on a glass substrate and the glass substrate manufacturing by the method
JP2013156622A (ja) * 2012-10-19 2013-08-15 Tokai Kogaku Kk 表示装置用カバープレートの透過領域及び不可視領域の設定方法並びに表示装置用カバープレート
US9612492B2 (en) * 2013-11-26 2017-04-04 Apple Inc. Border masking structures for liquid crystal display
CN103985334B (zh) * 2014-05-04 2017-08-29 京东方科技集团股份有限公司 透明显示系统以及设置有该透明显示系统的设备
TW201602851A (zh) * 2014-07-03 2016-01-16 勝華科技股份有限公司 觸控面板與觸控顯示裝置及其製作方法
CN104409472A (zh) * 2014-11-25 2015-03-11 昆山国显光电有限公司 一种有机电致发光显示装置及其制备方法
CN104862647B (zh) * 2015-05-13 2017-10-17 京东方科技集团股份有限公司 一种掩膜板及其制备方法、显示面板、显示装置
KR102632617B1 (ko) * 2016-08-08 2024-02-02 삼성디스플레이 주식회사 마스크 조립체, 이를 이용한 표시 장치의 제조장치, 이를 이용한 표시 장치의 제조방법 및 표시 장치
KR20180083459A (ko) * 2017-01-12 2018-07-23 삼성디스플레이 주식회사 증착용 마스크 어셈블리
CN107236927B (zh) * 2017-06-16 2019-03-15 京东方科技集团股份有限公司 掩膜板模组、有机电致发光显示面板及其制作方法
CN107741870B (zh) * 2017-09-30 2020-07-03 Oppo广东移动通信有限公司 终端、显示屏、以及控制显示屏显示的方法
CN108004504B (zh) 2018-01-02 2019-06-14 京东方科技集团股份有限公司 一种掩膜板
CN108277473B (zh) * 2018-01-22 2020-05-01 京东方科技集团股份有限公司 一种掩膜装置、显示面板及其制作方法、显示装置
CN108648695B (zh) * 2018-05-14 2021-06-11 昆山国显光电有限公司 显示面板、触控显示面板和触控显示设备
CN108559948B (zh) * 2018-06-28 2023-10-24 京东方科技集团股份有限公司 一种掩膜板、有机发光显示面板及显示装置
CN109166976B (zh) 2018-08-29 2020-10-30 上海天马有机发光显示技术有限公司 显示面板、掩膜板、显示面板的制作方法及显示装置
CN209070895U (zh) * 2018-11-07 2019-07-05 云谷（固安）科技有限公司 显示面板和显示终端
CN109860435A (zh) * 2019-01-17 2019-06-07 京东方科技集团股份有限公司 掩模板、显示面板及其封装方法、显示装置
CN110018610A (zh) * 2019-04-25 2019-07-16 武汉天马微电子有限公司 掩模板、显示面板、显示面板的制作方法和显示装置
US20200357869A1 (en) * 2019-05-10 2020-11-12 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
CN110438446B (zh) * 2019-07-31 2020-12-29 昆山国显光电有限公司 一种掩模组件以及一种显示装置

Also Published As

Publication number Publication date
US11957035B2 (en) 2024-04-09
JP2022541025A (ja) 2022-09-21
US20210367218A1 (en) 2021-11-25
EP3985142B1 (en) 2024-04-17
EP3985142A1 (en) 2022-04-20
TW202028857A (zh) 2020-08-01
EP3985142A4 (en) 2022-08-17
KR20220019037A (ko) 2022-02-15
CN110438446A (zh) 2019-11-12
JP2023159097A (ja) 2023-10-31
WO2021017494A1 (zh) 2021-02-04
CN110438446B (zh) 2020-12-29
TWI736193B (zh) 2021-08-11

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