WO2020258878A1 - 显示面板、显示装置及显示面板的制备方法 - Google Patents

显示面板、显示装置及显示面板的制备方法 Download PDF

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Publication number
WO2020258878A1
WO2020258878A1 PCT/CN2020/072967 CN2020072967W WO2020258878A1 WO 2020258878 A1 WO2020258878 A1 WO 2020258878A1 CN 2020072967 W CN2020072967 W CN 2020072967W WO 2020258878 A1 WO2020258878 A1 WO 2020258878A1
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WIPO (PCT)
Prior art keywords
light
display panel
emitting diode
layer
encapsulation
Prior art date
Application number
PCT/CN2020/072967
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English (en)
French (fr)
Chinese (zh)
Inventor
郭恩卿
王程功
李之升
Original Assignee
成都辰显光电有限公司
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Application filed by 成都辰显光电有限公司 filed Critical 成都辰显光电有限公司
Priority to KR1020217038599A priority Critical patent/KR102553837B1/ko
Publication of WO2020258878A1 publication Critical patent/WO2020258878A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • This application relates to the field of display technology, and in particular to a display panel, a display device, and a manufacturing method of the display panel.
  • Micro-Light Emitting Diode (Micro-LED) display technology uses a high-density integrated micro-light-emitting diode array as pixels on the backplane to realize light-emitting display.
  • Micro-LED technology has gradually become a research hot spot, and the industry is looking forward to high-quality Micro-LED products entering the market.
  • High-quality Micro-LED display products are expected to become very promising display solutions following the existing market such as Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) displays.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • the embodiment of the present application provides a display panel, a display device, and a manufacturing method of the display panel.
  • the encapsulation layer in the display panel can uniformly distribute the light emitted by the light-emitting diode, thereby increasing the light-emitting area, reducing the screen window effect, and improving the screen display effect.
  • the first aspect of the present application provides a display panel, including:
  • the light emitting diode array layer is located on the driving backplane, and the light emitting diode array layer includes a plurality of light emitting diodes;
  • a retaining wall is located between adjacent light-emitting diodes, the retaining wall defines a plurality of accommodating parts, and the accommodating parts are used to accommodate the light-emitting diodes;
  • the packaging layer is arranged on the side of the light emitting diode array layer away from the driving backplane, the packaging layer includes a plurality of packaging units, each packaging unit is isolated by a black matrix, and the packaging unit is arranged corresponding to the light emitting diode;
  • At least one packaging unit is distributed with astigmatism particles.
  • an embodiment of the present application provides a display device, including the display panel of any one of the foregoing embodiments in the first aspect of the present application.
  • an embodiment of the present application provides a method for manufacturing a display panel, including:
  • the light-emitting diode array includes a plurality of light-emitting diodes, and a barrier wall is arranged between adjacent light-emitting diodes;
  • a light-transmitting substrate is provided, a patterned black matrix is formed on the light-transmitting substrate, the mixed glue of astigmatizing particles and light-transmitting adhesive is placed in the channel formed by the black matrix, and the mixed liquid is cured to form a plurality of packages Encapsulation layer of the unit;
  • the encapsulation layer and the light-emitting diode array are aligned and bonded in a manner that the encapsulation unit and the light-emitting diode correspond up and down.
  • the display panel provided by the embodiment of the present application after the light emitted by the light-emitting diode reaches the encapsulation layer, the original path of the light is disrupted by the astigmatic particles in the encapsulation layer, and the encapsulation layer makes the light emitted by the light-emitting diode evenly distributed, thereby increasing the light output Area, reduce the screen window effect, improve the screen display effect.
  • the display panel provided by the embodiment of the present application there is no need to add additional components to the display panel, only astigmatism particles are mixed in the encapsulation layer of the display panel, which can reduce the screen window effect in a simple and easy-to-operate process. effect.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • FIG. 4 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • a layer or an area when referred to as being “on” or “above” another layer or another area, it can mean that it is directly on the other layer or area, or is in contact with it. There are other layers or regions between another layer and another area. Moreover, if the component is turned over, the layer or area will be “below” or “below” the other layer or area.
  • FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • the display panel provided by the embodiment of the present application includes a driving backplane 10; a light emitting diode array layer on the driving backplane 10; the light emitting diode array layer includes a plurality of light emitting diodes 20; Between the light-emitting diodes 20, the barrier wall 30 defines a plurality of accommodating portions for accommodating the light-emitting diodes 20; an encapsulation layer 40 disposed on the side of the LED array layer away from the driving backplane 10, the encapsulation layer 40 includes There are a plurality of packaging units 41. Each packaging unit 41 is isolated by a black matrix 50, and the packaging unit 41 is arranged corresponding to the light emitting diode 20, wherein at least one packaging unit 41 is distributed with astigmatizing particles 44.
  • the display panel provided by the embodiment of the present application after the light emitted by the light-emitting diode reaches the encapsulation layer, the original path of the light is disrupted by the astigmatic particles in the encapsulation layer, and the light from the encapsulation layer changes from a point-like distribution to a planar distribution. Thereby increasing the light output area, greatly reducing the screen window effect, and improving the picture display effect. Further, according to the display panel provided by the embodiment of the present application, no additional components are required to be added to the display panel, only astigmatism particles are mixed in the encapsulation layer of the display panel, and the screen window effect can be reduced in a simple and easy-to-operate process. Effect.
  • the packaging layer 40 includes a transparent packaging material.
  • the light scattering particles 44 are uniformly distributed in the transparent packaging material.
  • the encapsulation layer 40 uses a transparent encapsulation material as a matrix, and evenly distributes the astigmatism particles 44 in the matrix.
  • the transparent packaging material is a translucent adhesive.
  • the transparent packaging material includes one or more of epoxy resin, polycarbonate, polymethyl methacrylate, and silicone.
  • the light emitting diode array layer includes a plurality of red light emitting diodes 201, a plurality of green light emitting diodes 202, and a plurality of blue light emitting diodes 203, which constitute sub-pixels of different colors of the display panel.
  • the packaging layer 40 has multiple red packaging units 411, multiple green packaging units 412, and multiple blue light emitting diodes 201, multiple green light emitting diodes 202, and multiple blue light emitting diodes 203, respectively. Through the packaging unit 413.
  • the encapsulation layer 40 includes a plurality of red encapsulation units 411, a plurality of green encapsulation units 412, and a plurality of blue light-transmitting encapsulation units 413 are based on a transparent encapsulation material, and the scattering particles 44 are uniformly distributed in the substrate.
  • the transparent packaging material is a translucent adhesive.
  • the transparent packaging material includes one or more of epoxy resin, polycarbonate, polymethyl methacrylate, and silicone.
  • the light emitting diode array layer includes a plurality of red light emitting diodes 201, a plurality of green light emitting diodes 202, and a plurality of blue light emitting diodes 203, which constitute sub-pixels of different colors of the display panel.
  • the packaging layer 40 has multiple red packaging units 411, multiple green packaging units 412, and multiple blue light emitting diodes 201, multiple green light emitting diodes 202, and multiple blue light emitting diodes 203, respectively.
  • the red packaging unit 411 further includes a red filter material
  • the green packaging unit 412 further includes a green filter material.
  • the multiple red packaging units 411, the multiple green packaging units 412, and the multiple blue light transmitting packaging units 413 in the packaging layer 40 may correspond to multiple red light emitting diodes 201 and multiple green light emitting diodes, respectively. 202 and a plurality of blue light emitting diodes 203, for example, one red package unit 411 corresponds to two red light emitting diodes 201. This correspondence relationship can be adjusted according to actual conditions, and is not limited here.
  • the red filter material has a high transmittance to red light and can absorb green and blue light; the green filter material has a high transmittance to green light and can absorb red and blue light.
  • the blue light transmission package unit does not contain filter materials to prevent the display panel from appearing blue.
  • the encapsulation layer containing the filter material can reduce cross-color, thereby improving the color gamut of the display panel and reducing the screen window effect.
  • the red filter material and the light scattering particles 44 of the red packaging unit 411 are mixed and arranged.
  • the red filter material and the light scattering particles 44 are mixed and cured to form the red packaging unit 411.
  • the red filter material and light scattering particles 44 of the red packaging unit 411 are arranged in layers in the thickness direction of the packaging layer 40.
  • the red packaging unit 411 includes two layers in the thickness direction of the packaging layer 40, and the red filter material is located in In the first layer, the scattering particles 44 are located in the second layer above the first layer.
  • the red packaging unit 411 includes multiple layers in the thickness direction of the packaging layer, and the red filter material and the light scattering particles 44 are stacked in the thickness direction of the packaging layer 40.
  • a layer of red filter material a layer of scattering particles, a layer of red filter material, and so on.
  • the light scattering particles can be mixed with the packaging material to form a layer
  • the red filter material can be a red filter film layer.
  • the green filter material and the light scattering particles 44 of the green packaging unit 412 are mixed and arranged.
  • the green filter material and the light scattering particles 44 are mixed and cured to form the green packaging unit 412.
  • the green filter material and light scattering particles 44 of the green packaging unit 412 are arranged in layers in the thickness direction of the packaging layer.
  • the green packaging unit 411 includes two layers in the thickness direction of the packaging layer 40, and the green filter material is located in the first layer.
  • the layer and scattering particles 44 are located in a second layer above the first layer.
  • the green packaging unit 412 includes multiple layers in the thickness direction of the packaging layer 40, and the green filter material and light scattering particles are stacked in the thickness direction of the packaging layer 40.
  • a layer of green filter material a layer of scattering particles, a layer of green filter material, and so on.
  • the light-scattering particles can be mixed with the light-transmitting adhesive to form a layer
  • the green filter material can be a green filter film.
  • cross-color can be reduced, thereby increasing the color gamut of the display panel and reducing the screen window effect.
  • the light emitting diode array layer only includes a plurality of blue light emitting diodes.
  • the encapsulation layer 40 has a plurality of red encapsulation units 411, a plurality of green encapsulation units 412, and a plurality of blue light-transmitting encapsulation units 413 corresponding to the plurality of blue light emitting diodes.
  • the red packaging unit 411 further includes a red light conversion material
  • the green packaging unit 412 further includes a green light conversion material
  • the blue light transmission packaging unit 413 does not include a light conversion material.
  • Multiple red packaging units 411, multiple green packaging units 412, and multiple blue light transmitting packaging units 413 constitute sub-pixels of different colors of the display panel.
  • the light conversion material converts the blue light emitted by the blue light emitting diode into light of the target color to achieve Color display of the display panel.
  • the light emitting diode array layer includes only a plurality of blue light emitting diodes, or only a plurality of ultraviolet light emitting diodes, or includes a plurality of blue light emitting diodes and a plurality of ultraviolet light emitting diodes.
  • a light conversion layer may be provided between the light emitting diode array layer and at least part of the packaging unit.
  • the light conversion layer is formed of light conversion materials, such as quantum dots or phosphors. The light conversion material can convert the light emitted by the light-emitting diode into the light of the target color, so as to realize the color display.
  • This application does not limit the arrangement of the light emitting diodes.
  • one red light-emitting diode 201, one green light-emitting diode 202, and one blue light-emitting diode 203 can be used as repeating units, and multiple repeating units are repeatedly arranged on the driving backplane 10 in a predetermined pattern to form light Diode array.
  • the repeating unit may also include other combinations, so that the display panel has a higher resolution.
  • Each package unit corresponds to at least one light emitting diode.
  • the packaging unit and the light emitting diode are arranged in one-to-one correspondence.
  • the number of light emitting diodes corresponding to each packaging unit is the same. This application does not limit the specific number of light emitting diodes corresponding to the packaging unit.
  • multiple light-emitting diodes are arranged in a positive matrix, and the number of rows and columns of the light-emitting diodes can be specifically set according to actual conditions.
  • the multiple packaging units of the packaging layer are also arranged in a positive matrix.
  • FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • the display panel further includes a first reflective layer 60 located on the side of the light emitting diode 20 away from the driving backplane 10, and the first reflective layer 60 is used to reflect the light emitted by the light emitting diode 20.
  • the first reflective layer 60 may be provided on the side of at least part of the light emitting diode 20 away from the driving backplane 10.
  • the first reflective layer 60 may be a structure with a horizontal surface, or a structure with a curved surface, which is not limited in the present application.
  • a first reflective layer is provided on the upper surface of the light-emitting diode to reflect the light emitted upward from the light-emitting diode so that the light is emitted from the side of the light-emitting diode, avoiding the light from perpendicularly entering the packaging layer, and helping the packaging layer to further evenly distribute light.
  • the area of the first reflective layer 60 is not less than the area of the side of the light emitting diode 20 away from the driving backplane 10. 3, when the area of the first reflective layer 60 is larger than the area of the side of the light emitting diode 20 away from the driving backplane 10, the display panel may further include a transparent support layer 70, located around the light emitting diode 20, for supporting and extending to emit light. The first reflective layer 60 outside the diode 20.
  • the transparent support layer 70 can directly transmit the light emitted by the light emitting diode 20, and the transparent support layer 70 supports the first reflective layer 60 extending beyond the light emitting diode 20 to prevent the first reflective layer 60 from falling off when the display panel is shaken vigorously , Which is beneficial to the stable operation of the light emitting diode 20.
  • the surface of the transparent support layer 70 away from the driving backplane 10 is a roughened surface, and/or the surface of the packaging layer 40 close to the light-emitting diode array layer is a roughened surface.
  • a roughened surface can be understood as a rough surface, and the surface can be treated by mechanical or chemical methods to obtain a microscopic rough structure on the surface to form a roughened surface, which is not limited in this application.
  • a roughened surface is provided, which further disrupts the original path of the light and can further uniformize the light distribution.
  • At least part of the light-emitting diode 20 is a light-emitting diode 20 with a vertical structure.
  • the N electrode and the P electrode of the light emitting diode 20 with a vertical structure are respectively located on both sides of the light emitting layer of the light emitting diode 20.
  • the first reflective layer 60 may be an N electrode or a P electrode of the light emitting diode 20 with a vertical structure.
  • the N electrode or the P electrode of the vertical structure of the light-emitting diode 20 can be set to reflect the light emitted by the light-emitting diode 20, which simplifies the process, and also achieves that the light emitted by the light-emitting diode 20 can be removed from the light-emitting diode 20. It emits from the side to avoid perpendicular incidence of light to the encapsulation layer 40, which is beneficial to the effect of the encapsulation layer 40 to further evenly distribute the light.
  • the N electrode or P electrode of the vertical structure of the light emitting diode 20 covers the entire surface thereof, and the contact area is large, which is beneficial to reduce the voltage of the light emitting diode 20 and improve the efficiency of the light emitting diode 20.
  • the retaining wall 30 defines a plurality of accommodating parts, and the cross-section of the accommodating parts perpendicular to the driving back plate 10 is in an inverted trapezoidal structure.
  • the depth of the receiving part may be higher than the thickness of the light emitting diode 20.
  • the side wall of the retaining wall 30 has a second reflective layer 31 at least on a part of the surface facing the receiving portion.
  • the material of the retaining wall 40 may be photoresist, such as SU-8.
  • the second reflective layer 31 on the sidewall of the retaining wall 40 may be formed of metal, for example, Al, Ag, etc.
  • a barrier wall 30 is provided between adjacent light emitting diodes 20 to prevent crosstalk of light emitted by the light emitting diodes 20.
  • a second reflective layer 31 is provided on the side wall of the retaining wall 30 to improve the light reflection of the light emitting diode 20, so that the light emitted by the light emitting diode 20 can finally reach the upper encapsulation layer 40, thereby improving the light utilization rate.
  • a third reflective layer 51 is formed on at least part of the surface of the black matrix 50 facing the packaging unit.
  • the black matrix 50 can prevent the light crosstalk of each package unit, and the third reflective layer 51 can further disrupt the original path of light, and further improve the uniformity of light distribution.
  • the bottom area of the receiving portion defined by the barrier wall 30 is larger than the area occupied by the light-emitting diodes
  • the display panel further includes a fourth reflective layer 32 located between the light-emitting diode 20 and the barrier wall 30, and the fourth reflective layer 32 is located on the drive backplane 10.
  • the fourth reflective layer 32 is used to reflect the light reaching the upper surface of the driving back plate 10, which can improve the light utilization.
  • the display panel also includes a transparent substrate 80 on the packaging layer 40.
  • the light-transmitting substrate 80 covers the packaging layer 40 and the black matrix 50.
  • the driving backplane 10 includes a driving circuit, which is used to drive the corresponding light emitting diode to emit light.
  • the light emitting diode may be a Micro-LED.
  • Micro-LED has the advantages of low power consumption, high brightness, long life, fast response time, etc., so that the display panel with Micro-LED has good display performance.
  • the driving circuit includes at least a thin film transistor, and the Micro-LED is electrically connected to the thin film transistor.
  • the embodiment of the present application also provides a display device, including the above-mentioned display panel.
  • the display device can be applied to virtual reality equipment, mobile phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigators, wearable watches, Any product or component with display function such as IoT node. Since the principle of solving the problems of the display device is similar to that of the above-mentioned display panel, the implementation of the display device can refer to the implementation of the above-mentioned display panel, and the repetition will not be repeated.
  • FIG. 4 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application. As shown in FIG. 4, the manufacturing method of the display panel of the embodiment of the present application includes the following steps:
  • the manufacturing method of the display panel provided by the embodiment of the present application, after the light emitted by the light emitting diode 20 reaches the encapsulation layer 40, the original path of the light is disrupted by the astigmatism particles 44 in the encapsulation layer 40, and the light exiting from the encapsulation layer 40 passes through the dots.
  • the shape distribution is transformed into a planar distribution, thereby increasing the light emitting area, greatly reducing the screen window effect and improving the picture display effect.
  • there is no need to add an additional mechanism to the display panel only the astigmatic particles 44 are mixed into the encapsulation layer 40 of the display panel, and the effect of reducing the screen window effect can be achieved by a simple and easy-to-operate process.
  • the order of forming the array of light-emitting diodes 20 and the barrier wall 30 is not limited.
  • the method of implantation in S20 can be printing or spin coating.
  • adhesives can be used for bonding.
  • S10 also includes forming a first reflective layer 60 on the side of the light-emitting diode 20 away from the driving backplane 10; and making the accommodating part formed by the barrier wall 30 a cross-section perpendicular to the driving backplane 10 to have an inverted trapezoidal structure.
  • a second reflective layer 31 is formed on at least part of the surface of the retaining wall 30 facing the receiving portion;
  • a transparent support layer 70 is formed around the light emitting diode 20 to support the first reflective layer 60 extending beyond the light emitting diode 20;
  • a fourth reflective layer 32 is formed on the back plate 10, and the fourth reflective layer 32 is located between the light emitting diode 20 and the retaining wall 30.
  • S20 also includes forming a third reflective layer 51 on at least part of the surface of the black matrix 50 facing the packaging unit 41.
  • At least part of the encapsulation unit 41 is provided with a filter material, and the red filter material and the astigmatic particles can be mixed and arranged into a layer to form the red encapsulation unit 411, or the red filter material and the astigmatism particles can be layered in the thickness direction of the encapsulation layer Set to form a red light package unit 411.
  • the green filter material and the light scattering particles may be mixed and arranged into one layer to form the green light encapsulation unit 412, or the green light filter material and the light scattering particles may be layered in the thickness direction of the encapsulation layer 40 to form the green light encapsulation unit 412.
  • the packaging unit 41 is provided with a light conversion material, or at least part of the packaging unit 41 is provided with a light conversion layer between the light emitting diode.
  • light-emitting diodes 20 with a vertical structure can be selected to form an array of light-emitting diodes 20.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
PCT/CN2020/072967 2019-06-28 2020-01-19 显示面板、显示装置及显示面板的制备方法 WO2020258878A1 (zh)

Priority Applications (1)

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KR1020217038599A KR102553837B1 (ko) 2019-06-28 2020-01-19 표시 패널, 표시 장치 및 표시 패널의 제조 방법

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CN201910580227.0A CN112151567A (zh) 2019-06-28 2019-06-28 显示面板、显示装置及显示面板的制备方法
CN201910580227.0 2019-06-28

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CN113488501A (zh) * 2021-06-30 2021-10-08 上海天马微电子有限公司 显示面板及显示装置
CN114023867A (zh) * 2021-10-19 2022-02-08 武汉大学 一种全彩化Micro-LED显示面板及其制造方法
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CN113192942B (zh) * 2021-04-21 2023-10-17 Tcl华星光电技术有限公司 显示面板
KR20220149864A (ko) * 2021-04-30 2022-11-09 삼성디스플레이 주식회사 표시 장치
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