CN112151567A - 显示面板、显示装置及显示面板的制备方法 - Google Patents

显示面板、显示装置及显示面板的制备方法 Download PDF

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Publication number
CN112151567A
CN112151567A CN201910580227.0A CN201910580227A CN112151567A CN 112151567 A CN112151567 A CN 112151567A CN 201910580227 A CN201910580227 A CN 201910580227A CN 112151567 A CN112151567 A CN 112151567A
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China
Prior art keywords
layer
light emitting
light
emitting diode
display panel
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Pending
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CN201910580227.0A
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English (en)
Chinese (zh)
Inventor
郭恩卿
王程功
李之升
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Vistar Optoelectronics Co Ltd
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Chengdu Vistar Optoelectronics Co Ltd
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Application filed by Chengdu Vistar Optoelectronics Co Ltd filed Critical Chengdu Vistar Optoelectronics Co Ltd
Priority to CN201910580227.0A priority Critical patent/CN112151567A/zh
Priority to PCT/CN2020/072967 priority patent/WO2020258878A1/zh
Priority to KR1020217038599A priority patent/KR102553837B1/ko
Publication of CN112151567A publication Critical patent/CN112151567A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
CN201910580227.0A 2019-06-28 2019-06-28 显示面板、显示装置及显示面板的制备方法 Pending CN112151567A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201910580227.0A CN112151567A (zh) 2019-06-28 2019-06-28 显示面板、显示装置及显示面板的制备方法
PCT/CN2020/072967 WO2020258878A1 (zh) 2019-06-28 2020-01-19 显示面板、显示装置及显示面板的制备方法
KR1020217038599A KR102553837B1 (ko) 2019-06-28 2020-01-19 표시 패널, 표시 장치 및 표시 패널의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910580227.0A CN112151567A (zh) 2019-06-28 2019-06-28 显示面板、显示装置及显示面板的制备方法

Publications (1)

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CN112151567A true CN112151567A (zh) 2020-12-29

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Country Link
KR (1) KR102553837B1 (ko)
CN (1) CN112151567A (ko)
WO (1) WO2020258878A1 (ko)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112786760A (zh) * 2020-12-31 2021-05-11 厦门天马微电子有限公司 一种显示面板、制备方法及显示装置
CN113471187A (zh) * 2021-06-30 2021-10-01 Tcl华星光电技术有限公司 发光二极管显示面板及发光二极管显示装置
CN113659058A (zh) * 2021-08-20 2021-11-16 京东方科技集团股份有限公司 一种发光器件及其制备方法、显示装置
CN113903729A (zh) * 2021-09-29 2022-01-07 北海惠科光电技术有限公司 Micro LED显示装置及其制造方法
CN114023899A (zh) * 2021-10-25 2022-02-08 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
CN114141809A (zh) * 2021-11-30 2022-03-04 深圳市华星光电半导体显示技术有限公司 一种显示面板的制备方法及显示面板
CN114242874A (zh) * 2021-12-14 2022-03-25 惠州华星光电显示有限公司 显示屏、显示装置及显示屏的制作方法
CN114335294A (zh) * 2021-08-18 2022-04-12 友达光电股份有限公司 显示面板及其制造方法
CN114582915A (zh) * 2022-02-17 2022-06-03 Tcl华星光电技术有限公司 封装盖板、显示面板及显示面板的制造方法
WO2022222258A1 (zh) * 2021-04-21 2022-10-27 Tcl华星光电技术有限公司 显示面板
US20220352428A1 (en) * 2021-04-30 2022-11-03 Samsung Display Co., Ltd. Display device
WO2023070798A1 (zh) * 2021-10-28 2023-05-04 武汉华星光电半导体显示技术有限公司 发光基板及显示装置
WO2024000377A1 (zh) * 2022-06-30 2024-01-04 京东方科技集团股份有限公司 显示面板及其制备方法
US11971623B2 (en) 2021-12-14 2024-04-30 Huizhou China Star Optoelectronics Display Co., Ltd. Display screen, display device and method for manufacturing display screen
JP7529702B2 (ja) 2021-12-08 2024-08-06 ティーシーエル チャイナスター オプトエレクトロニクス テクノロジー カンパニー リミテッド 表示パネル及びその製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113488501B (zh) * 2021-06-30 2023-12-19 上海天马微电子有限公司 显示面板及显示装置
CN114023867B (zh) * 2021-10-19 2024-07-26 江苏穿越光电科技有限公司 一种全彩化Micro-LED显示面板及其制造方法
CN114975392A (zh) * 2022-04-26 2022-08-30 湖北长江新型显示产业创新中心有限公司 显示面板的制作方法及显示面板
CN115933234B (zh) * 2022-11-08 2024-04-19 Tcl华星光电技术有限公司 拼接显示屏
WO2024106573A1 (ko) * 2022-11-18 2024-05-23 엘지전자 주식회사 디스플레이 장치 및 디스플레이 장치의 제조 방법
CN117613061B (zh) * 2023-12-12 2024-09-10 惠科股份有限公司 显示面板及其制备方法、电子设备

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CN101764149A (zh) * 2010-01-13 2010-06-30 友达光电股份有限公司 有机发光二极管显示装置
CN103928594A (zh) * 2014-03-21 2014-07-16 京东方科技集团股份有限公司 一种发光装置
CN104538430A (zh) * 2014-12-30 2015-04-22 北京维信诺科技有限公司 一种有机发光显示装置及其制备方法
CN105405982A (zh) * 2015-12-09 2016-03-16 深圳市华星光电技术有限公司 有机发光二极管封装结构、封装方法及有机发光二极管
CN106684108A (zh) * 2015-11-05 2017-05-17 群创光电股份有限公司 发光二极管显示设备
US20170358624A1 (en) * 2016-06-13 2017-12-14 Seoul Semiconductor Co., Ltd. Display apparatus and manufacturing method thereof
CN208722881U (zh) * 2018-06-26 2019-04-09 昆山龙腾光电有限公司 一种有机发光显示面板和显示装置
CN109671365A (zh) * 2019-01-30 2019-04-23 京东方科技集团股份有限公司 Micro-LED显示基板及其制作方法、显示装置

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CN102751447B (zh) * 2012-07-04 2015-08-12 信利半导体有限公司 光学过渡层材料、光学基板/封装层、oled及各自制法
KR101975309B1 (ko) * 2012-07-25 2019-09-11 삼성디스플레이 주식회사 유기 발광 디스플레이 소자 및 그 제조 방법
CN103490018B (zh) * 2013-09-25 2016-03-09 京东方科技集团股份有限公司 有机电致发光器件及其制备方法
US10304813B2 (en) * 2015-11-05 2019-05-28 Innolux Corporation Display device having a plurality of bank structures
CN105489633B (zh) * 2016-01-15 2018-06-29 京东方科技集团股份有限公司 显示基板及其制备方法、oled显示面板及其制备方法
CN106848095A (zh) * 2017-01-24 2017-06-13 上海天马微电子有限公司 一种有机电致发光显示面板及其制备方法和电子设备

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CN101764149A (zh) * 2010-01-13 2010-06-30 友达光电股份有限公司 有机发光二极管显示装置
CN103928594A (zh) * 2014-03-21 2014-07-16 京东方科技集团股份有限公司 一种发光装置
CN104538430A (zh) * 2014-12-30 2015-04-22 北京维信诺科技有限公司 一种有机发光显示装置及其制备方法
CN106684108A (zh) * 2015-11-05 2017-05-17 群创光电股份有限公司 发光二极管显示设备
CN105405982A (zh) * 2015-12-09 2016-03-16 深圳市华星光电技术有限公司 有机发光二极管封装结构、封装方法及有机发光二极管
US20170358624A1 (en) * 2016-06-13 2017-12-14 Seoul Semiconductor Co., Ltd. Display apparatus and manufacturing method thereof
CN208722881U (zh) * 2018-06-26 2019-04-09 昆山龙腾光电有限公司 一种有机发光显示面板和显示装置
CN109671365A (zh) * 2019-01-30 2019-04-23 京东方科技集团股份有限公司 Micro-LED显示基板及其制作方法、显示装置

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112786760A (zh) * 2020-12-31 2021-05-11 厦门天马微电子有限公司 一种显示面板、制备方法及显示装置
WO2022222258A1 (zh) * 2021-04-21 2022-10-27 Tcl华星光电技术有限公司 显示面板
US20220352428A1 (en) * 2021-04-30 2022-11-03 Samsung Display Co., Ltd. Display device
CN113471187A (zh) * 2021-06-30 2021-10-01 Tcl华星光电技术有限公司 发光二极管显示面板及发光二极管显示装置
CN114335294B (zh) * 2021-08-18 2023-05-23 友达光电股份有限公司 显示面板及其制造方法
CN114335294A (zh) * 2021-08-18 2022-04-12 友达光电股份有限公司 显示面板及其制造方法
TWI773488B (zh) * 2021-08-18 2022-08-01 友達光電股份有限公司 顯示面板及其製造方法
CN113659058A (zh) * 2021-08-20 2021-11-16 京东方科技集团股份有限公司 一种发光器件及其制备方法、显示装置
CN113659058B (zh) * 2021-08-20 2023-10-20 京东方科技集团股份有限公司 一种发光器件及其制备方法、显示装置
CN113903729A (zh) * 2021-09-29 2022-01-07 北海惠科光电技术有限公司 Micro LED显示装置及其制造方法
CN114023899A (zh) * 2021-10-25 2022-02-08 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
WO2023070798A1 (zh) * 2021-10-28 2023-05-04 武汉华星光电半导体显示技术有限公司 发光基板及显示装置
CN114141809A (zh) * 2021-11-30 2022-03-04 深圳市华星光电半导体显示技术有限公司 一种显示面板的制备方法及显示面板
JP7529702B2 (ja) 2021-12-08 2024-08-06 ティーシーエル チャイナスター オプトエレクトロニクス テクノロジー カンパニー リミテッド 表示パネル及びその製造方法
CN114242874A (zh) * 2021-12-14 2022-03-25 惠州华星光电显示有限公司 显示屏、显示装置及显示屏的制作方法
US11971623B2 (en) 2021-12-14 2024-04-30 Huizhou China Star Optoelectronics Display Co., Ltd. Display screen, display device and method for manufacturing display screen
CN114582915A (zh) * 2022-02-17 2022-06-03 Tcl华星光电技术有限公司 封装盖板、显示面板及显示面板的制造方法
WO2024000377A1 (zh) * 2022-06-30 2024-01-04 京东方科技集团股份有限公司 显示面板及其制备方法

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Publication number Publication date
KR102553837B1 (ko) 2023-07-10
KR20210151980A (ko) 2021-12-14
WO2020258878A1 (zh) 2020-12-30

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Application publication date: 20201229