CN112151567A - Display panel, display device and preparation method of display panel - Google Patents
Display panel, display device and preparation method of display panel Download PDFInfo
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- CN112151567A CN112151567A CN201910580227.0A CN201910580227A CN112151567A CN 112151567 A CN112151567 A CN 112151567A CN 201910580227 A CN201910580227 A CN 201910580227A CN 112151567 A CN112151567 A CN 112151567A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel includes: driving the back plate; the light emitting diode array layer is positioned on the driving back plate and comprises a plurality of light emitting diodes; the retaining wall is positioned between the adjacent light-emitting diodes, and defines a plurality of accommodating parts for accommodating the light-emitting diodes; the packaging layer is arranged on one side, away from the driving back plate, of the light emitting diode array layer and comprises a plurality of packaging units, the packaging units are isolated through black matrixes, and the packaging units are arranged corresponding to the light emitting diodes; wherein, the light scattering particles are distributed in at least one packaging unit. According to the display panel provided by the embodiment of the invention, the screen window effect can be reduced, and the picture display effect is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a display device and a preparation method of the display panel.
Background
The Micro-Light Emitting Diode (Micro-LED) technology is a technology for realizing Light Emitting display by using a high-density integrated Micro-LED array as pixels on a back panel. Currently, Micro-LED technology is becoming a popular research, and industry expects high-quality Micro-LED products to enter the market. High quality Micro-LED products have a great impact on the Display products such as Liquid Crystal Displays (LCDs), Organic Light-Emitting diodes (OLEDs), etc. existing in the market.
In the prior art, when the Micro-LED is applied to a large-size display panel, an obvious screen window effect exists, and the display effect of a picture is seriously influenced.
Disclosure of Invention
The embodiment of the invention provides a display panel, a display device and a preparation method of the display panel. The packaging layer in the display panel can enable light emitted by the light emitting diode to be uniformly distributed, so that the light emitting area is increased, the screen window effect is reduced, and the picture display effect is improved.
In a first aspect, an embodiment of the present invention provides a display panel, including:
driving the back plate;
the light emitting diode array layer is positioned on the driving back plate and comprises a plurality of light emitting diodes;
the retaining wall is positioned between the adjacent light-emitting diodes, and defines a plurality of accommodating parts for accommodating the light-emitting diodes;
the packaging layer is arranged on one side, away from the driving back plate, of the light emitting diode array layer and comprises a plurality of packaging units, the packaging units are isolated through black matrixes, and the packaging units are arranged corresponding to the light emitting diodes;
wherein, the light scattering particles are distributed in at least one packaging unit.
In a possible implementation manner, in the display panel provided by the embodiment of the present invention, the encapsulation layer includes a transparent encapsulation material, and the light scattering particles are uniformly distributed in the transparent encapsulation material. The astigmatic particles of the packaging layer are uniformly distributed in the transparent material, so that the light-emitting area can be further increased, and the screen window effect is reduced.
In a possible implementation manner, in the display panel provided in an embodiment of the present invention, the package layer includes a plurality of red package units, a plurality of green package units, and a plurality of blue light transmission package units, at least a portion of the red package units further include a red filter material, and at least a portion of the green package units further include a green filter material. The red filter material has high transmittance to red light and can absorb green light and blue light; the green filter material has high transmittance for green light and can absorb red light and blue light. The blue light transmitting packaging unit does not contain a filtering material, so that the display panel is prevented from being blue. The packaging layer containing the filter material can reduce color crosstalk, thereby improving the color gamut of the display panel and reducing the screen window effect.
And/or the red filter material and the light scattering particles in the red packaging unit are arranged in a mixed manner or in a layered manner in the thickness direction of the packaging layer; the green filter material and the light scattering particles are mixed in the green encapsulation unit or layered in the thickness direction of the encapsulation layer. No matter the red filter material and the astigmatic particles of the red packaging unit and the green packaging unit are arranged in a mixed manner or in a layered manner, cross color can be reduced, so that the color gamut of the display panel is improved, and the screen window effect is reduced.
In a possible implementation manner, in the display panel provided in an embodiment of the present invention, the package layer includes a plurality of red package units, a plurality of green package units, and a plurality of blue light transmission package units, at least a portion of the red package units further include a red light conversion material, and at least a portion of the green package units further include a green light conversion material; and/or a light conversion layer is arranged between at least part of the packaging unit and the light emitting diode array layer. The light conversion material or the light conversion layer can convert light emitted by the light emitting diode into light of a target color to realize colorized display.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the display panel further includes: the first reflecting layer is positioned on one surface of the light emitting diode, which is far away from the driving back plate, and is used for reflecting light emitted by the light emitting diode;
preferably, when the area of the first reflective layer is larger than the area of the side of the light emitting diode far away from the driving backplane, the display panel further includes:
and the transparent supporting layer is positioned at the periphery of the light emitting diode and used for supporting the first reflecting layer extending out of the light emitting diode.
The first reflecting layer is arranged on the upper surface of the light emitting diode, and reflects light emitted upwards from the light emitting diode to enable the light to be emitted from the side surface of the light emitting diode, so that the light is prevented from being vertically incident to the packaging layer, and the light is further uniformly distributed by the packaging layer. The transparent supporting layer can directly penetrate through light emitted by the light emitting diode, and the transparent supporting layer supports the first reflecting layer extending out of the light emitting diode, so that the first reflecting layer is prevented from falling off when the display panel is shaken vigorously, and the stable work of the light emitting diode is facilitated.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, a surface of the transparent supporting layer away from the driving backplane is a roughened surface, and/or a surface of the encapsulation layer close to the led array layer is a roughened surface.
The roughened surface is arranged in the path of the light emitted by the light-emitting diode, so that the original path of the light is further disturbed, and the light can be further uniformly distributed.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the light emitting diode is a vertical light emitting diode, and the first reflective layer is an N electrode or a P electrode of the vertical light emitting diode.
The light-emitting diode with the vertical structure is adopted, and only the N electrode or the P electrode of the light-emitting diode with the vertical structure needs to be arranged to reflect the light emitted by the light-emitting diode, so that the process is simplified, the light emitted by the light-emitting diode is emitted from the side surface of the light-emitting diode, the light is prevented from being vertically incident to the packaging layer, and the light is further uniformly distributed by the packaging layer.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, a cross section of the accommodating portion perpendicular to the driving backplane has an inverted trapezoidal structure; a second reflecting layer is arranged on at least part of the surface of the retaining wall facing the accommodating part;
and/or a third reflecting layer is arranged on at least part of the surface of the black matrix facing the packaging unit;
and/or, the display panel further comprises:
and the fourth reflecting layer is positioned between the light-emitting diode and the retaining wall, and is positioned on the driving backboard.
The second reflecting layer is arranged on the side wall of the retaining wall, so that the light reflection of the light emitting diode is improved, and the light emitted by the light emitting diode can finally reach the packaging layer above the light emitting diode, thereby improving the utilization rate of the light. The black matrix can prevent crosstalk of light of each package unit, and the third reflective layer can further disturb an original path of light, thereby further improving uniformity of light distribution. The fourth reflecting layer is used for reflecting the light reaching the upper surface of the driving back plate, so that the utilization rate of the light can be improved.
In a second aspect, an embodiment of the present invention provides a display device, including the display panel according to the first aspect.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including: providing a driving back plate bound with a light emitting diode array, wherein the light emitting diode array comprises a plurality of light emitting diodes, and a retaining wall is arranged between every two adjacent light emitting diodes;
providing a transparent substrate, forming a graphical black matrix on the transparent substrate, placing mixed glue of light scattering particles and transparent glue into a groove formed by the black matrix, and curing the mixed glue to form a packaging layer with a plurality of packaging units;
and aligning and attaching the packaging layer and the light emitting diode array according to the corresponding mode of the packaging unit and the light emitting diode.
According to the display panel provided by the embodiment of the invention, after the light emitted by the light emitting diode reaches the packaging layer, the original path of the light is disturbed by the light scattering particles in the packaging layer, and the packaging layer enables the light emitted by the light emitting diode to be uniformly distributed, so that the light emitting area is increased, the screen window effect is reduced, and the picture display effect is improved. In addition, according to the display panel provided by the embodiment of the invention, no additional component is required to be added to the display panel, and only the light scattering particles are required to be mixed in the packaging layer of the display panel, so that the effect of reducing the screen window effect can be realized by a simple and easy-to-operate process.
Drawings
In the following, brief descriptions will be given to the drawings required to be used in the embodiments of the present invention, and those skilled in the art can obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 4 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the invention.
Description of reference numerals:
10-driving the back plate; 20-a light emitting diode; 201-red light emitting diode; 202-green light emitting diode; 203-blue light emitting diode; 30-retaining wall; 31-a second reflective layer; 32-a fourth reflective layer;
40-an encapsulation layer; 41-packaging unit; 411-red light packaging unit; 412-green encapsulation unit; 413-blue light transmission packaging unit; 44-light scattering particles;
50-black matrix; 51-a third reflective layer; 60-a first reflective layer; 70-a transparent support layer; 80-light transmissive substrate.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention. As shown in fig. 1, the display panel according to the embodiment of the invention includes a driving backplane 10, and a light emitting diode array layer on the driving backplane 10, where the light emitting diode array layer includes a plurality of light emitting diodes 20. The retaining walls 30 are positioned between the adjacent light emitting diodes 20, and the retaining walls 30 define a plurality of receiving parts for receiving the light emitting diodes 20. The packaging layer 40 is arranged on one side of the light emitting diode array layer, which is far away from the driving back plate 10, the packaging layer 40 comprises a plurality of packaging units 41, each packaging unit 41 is isolated by a black matrix 50, the packaging units 41 are arranged corresponding to the light emitting diodes 20, and light scattering particles 44 are distributed in at least one packaging unit 41.
According to the display panel provided by the embodiment of the invention, after the light emitted by the light emitting diode reaches the packaging layer, the original path of the light is disturbed by the light scattering particles in the packaging layer, and the light emitted from the packaging layer is converted into planar distribution from point distribution, so that the light emitting area is increased, the screen window effect is greatly reduced, and the picture display effect is improved. Furthermore, according to the display panel provided by the embodiment of the invention, no additional component is required to be added to the display panel, and only the light scattering particles are mixed in the packaging layer of the display panel, so that the effect of reducing the screen window effect can be realized by a simple and easy-to-operate process.
In some embodiments, the encapsulation layer 40 comprises a transparent encapsulation material in which the light scattering particles 44 are uniformly distributed. For example, the encapsulation layer 40 uses a transparent encapsulation material as a matrix, and the light scattering particles 44 are uniformly distributed in the matrix. Optionally, the transparent encapsulating material is a light-transmitting glue, and the transparent encapsulating material includes one or more of epoxy resin, polycarbonate, polymethyl methacrylate, silicone, and the like.
In some embodiments, the driving backplane 10 includes a driving circuit for driving the corresponding light emitting diodes to emit light. The light emitting diode can be a Micro-LED, and the Micro-LED has the advantages of low power consumption, high brightness, long service life, quick response time and the like, so that the display panel with the Micro-LED has good display performance. For the Micro-LED, the driving circuit at least comprises a thin film transistor, and the Micro-LED is electrically connected with the thin film transistor.
In some embodiments, the led array layer includes a plurality of red leds 201, a plurality of green leds 202, and a plurality of blue leds 203, which form sub-pixels of different colors of the display panel, and the corresponding packaging layer 40 has a plurality of red packaging units 411, a plurality of green packaging units 412, and a plurality of blue transmissive packaging units 413 respectively corresponding to the plurality of red leds 201, the plurality of green leds 202, and the plurality of blue leds 203. The red encapsulation units 411, the green encapsulation units 412 and the blue light transmission encapsulation units 413 of the encapsulation layer 40 are made of transparent encapsulation material as a matrix, and the light scattering particles 44 are uniformly distributed in the matrix. Optionally, the transparent encapsulating material is a light-transmitting glue, and the transparent encapsulating material includes one or more of epoxy resin, polycarbonate, polymethyl methacrylate, silicone, and the like.
In some embodiments, as shown in fig. 2, the led array layer includes a plurality of red leds 201, a plurality of green leds 202, and a plurality of blue leds 203, which form sub-pixels of different colors of the display panel, and the corresponding packaging layer 40 has a plurality of red packaging units 411, a plurality of green packaging units 412, and a plurality of blue transmissive packaging units 413 respectively corresponding to the plurality of red leds 201, the plurality of green leds 202, and the plurality of blue leds 203. The red packing unit 411 further includes a red filter material, and the green packing unit 412 further includes a green filter material. In some embodiments, the red encapsulation units 411, the green encapsulation units 412, and the blue light transmission encapsulation units 413 in the encapsulation layer 40 may respectively correspond to the red light emitting diodes 201, the green light emitting diodes 202, and the blue light emitting diodes 203, for example, one red encapsulation unit 411 corresponds to two red light emitting diodes 201, and the corresponding relationship may be adjusted according to actual situations and is not limited herein.
The red filter material has high transmittance to red light and can absorb green light and blue light; the green filter material has high transmittance for green light and can absorb red light and blue light. The blue light transmitting packaging unit does not contain a filtering material, so that the display panel is prevented from being blue. The packaging layer containing the filter material can reduce color crosstalk, thereby improving the color gamut of the display panel and reducing the screen window effect.
In some embodiments, the red filter material and the light scattering particles 44 of the red packaged unit 411 are mixed, for example, the red filter material and the light scattering particles 44 are mixed and cured to form the red packaged unit 411. Alternatively, the red filter material and the light scattering particles 44 of the red packing unit 411 are layered in the thickness direction of the packing layer 40, for example, the red packing unit 411 includes two layers in the thickness direction of the packing layer 40, the red filter material is located in a first layer, and the light scattering particles 44 are located in a second layer above the first layer; for another example, the red packing unit 411 includes a plurality of layers in the thickness direction of the packing layer, and the red filter material and the light scattering particles 44 are stacked in the thickness direction of the packing layer 40, that is, one layer of the red filter material, one layer of the light scattering particles, one layer of the red filter material, and so on. It will be appreciated that in a layered arrangement, the light scattering particles may be mixed with the encapsulant to form a layer and the red filter material may be a red filter film layer.
In some embodiments, the green filter material and the light scattering particles 44 of the green encapsulation unit 412 are mixed, for example, the green filter material and the light scattering particles 44 are mixed and cured to form the green encapsulation unit 412. Alternatively, the green filter material and the light scattering particles 44 of the green encapsulation unit 412 are layered in the thickness direction of the encapsulation layer, for example, the green encapsulation unit 411 includes two layers in the thickness direction of the encapsulation layer 40, the green filter material is located in a first layer and the light scattering particles 44 are located in a second layer above the first layer; for another example, the green encapsulation unit 412 includes a plurality of layers in the thickness direction of the encapsulation layer 40, and the green filter material and the light scattering particles are stacked in the thickness direction of the encapsulation layer 40, that is, one layer of green filter material, one layer of light scattering particles, one layer of green filter material, and so on. It should be understood that when layered, the light scattering particles may be mixed with the light transmissive glue to form a layer, and the green filter material may be a green filter film layer.
No matter the red filter material and the astigmatic particles of the red packaging unit and the green packaging unit are arranged in a mixed manner or in a layered manner, cross color can be reduced, so that the color gamut of the display panel is improved, and the screen window effect is reduced.
In some embodiments, the led array layer only includes a plurality of blue leds, and the corresponding package layer 40 has a plurality of red package units 411, a plurality of green package units 412 and a plurality of blue transmissive package units 413 corresponding to the plurality of blue leds. The red encapsulation unit 411 further includes a red light conversion material, the green encapsulation unit 412 further includes a green light conversion material, and the blue light transmission encapsulation unit 413 does not include a light conversion material. The red encapsulation units 411, the green encapsulation units 412 and the blue light transmission encapsulation units 413 form sub-pixels of different colors of the display panel, and the light conversion material converts the blue light emitted by the blue light emitting diode into light of a target color, so as to realize colorized display of the display panel.
In still other embodiments, the light emitting diode array layer includes only a plurality of blue light emitting diodes, or only a plurality of uv light emitting diodes, or both a plurality of blue light emitting diodes and a plurality of uv light emitting diodes. A light conversion layer may be disposed between the light emitting diode array layer and at least a portion of the encapsulation unit, the light conversion layer being formed of a light conversion material, such as quantum dots or phosphor powder. The light conversion material can convert light emitted by the light emitting diode into light of a target color to realize colorized display.
The arrangement of the light emitting diodes is not limited in the present application. For example, for three-primary-color leds, one red led 201, one green led 202, and one blue led 203 may be used as repeating units, and the repeating units are repeatedly arranged on the driving backplane 10 at a predetermined rule to form an led array. The repeating units may also include other combinations to provide a higher resolution of the display panel.
In some embodiments, each packaging unit corresponds to at least one light emitting diode, for example, the packaging units are arranged in one-to-one correspondence with the light emitting diodes. Preferably, the number of the light emitting diodes corresponding to each packaging unit is the same, and the specific number of the light emitting diodes corresponding to the packaging unit is not limited in the present invention. In addition, the plurality of light emitting diodes are arranged in a positive matrix, and the number of rows and columns of the light emitting diodes can be specifically set according to actual conditions. Correspondingly, a plurality of packaging units of the packaging layer are arranged in a positive matrix.
Fig. 3 is a schematic structural diagram of another display panel according to an embodiment of the invention. As shown in fig. 3, the display panel further includes a first reflective layer 60 located on a side of the light emitting diode 20 away from the driving backplane 10, where the first reflective layer 60 is used for reflecting light emitted from the light emitting diode 20. A first reflective layer 60 may be disposed on a side of at least some of the leds 20 remote from the driving backplane 10.
The first reflective layer 60 may have a horizontal surface or a structure having a horizontal surfaceThe surface of the material is in a curved surface structure,this is not a limitation of the present application.
The first reflecting layer is arranged on the upper surface of the light emitting diode, and reflects light emitted upwards from the light emitting diode to enable the light to be emitted from the side surface of the light emitting diode, so that the light is prevented from being vertically incident to the packaging layer, and the light is further uniformly distributed by the packaging layer.
In some embodiments, the area of the first reflective layer 60 is not less than the area of the side of the light emitting diode 20 away from the driving backplane 10. With continued reference to fig. 3, when the area of the first reflective layer 60 is larger than the area of the side of the light emitting diode 20 away from the driving backplane 10, the display panel may further include a transparent support layer 70 positioned around the light emitting diode 20 for supporting the first reflective layer 60 extending beyond the light emitting diode 20.
The transparent supporting layer 70 can directly transmit the light emitted from the light emitting diode 20, and the first reflective layer 60 extending out of the light emitting diode 20 is supported by the transparent supporting layer 70, so that the first reflective layer 60 is prevented from falling off when the display panel is shaken by a large force, which is beneficial to the stable operation of the light emitting diode 20.
In some embodiments, the side of the transparent support layer 70 away from the driving backplane 10 is roughened, and/or the side of the encapsulation layer 40 close to the led array layer is roughened. Roughened surface is understood to mean that the surface is rough and may be treated mechanically or chemically to provide a micro-rough texture on the surface to form a roughened surface, although the invention is not limited in this respect.
The roughened surface is arranged in the path of the light emitted by the light-emitting diode, so that the original path of the light is further disturbed, and the light can be further uniformly distributed.
In some embodiments, at least a portion of the light emitting diodes 20 are vertical light emitting diodes 20, the N electrode and the P electrode of the vertical light emitting diodes 20 are respectively located at two sides of the light emitting layer of the light emitting diodes 20, and the first reflective layer 60 may be the N electrode or the P electrode of the vertical light emitting diodes 20. Therefore, only the N electrode or the P electrode of the light emitting diode 20 with the vertical structure needs to be set to reflect the light emitted from the light emitting diode 20, so that the process is simplified, the light emitted from the light emitting diode 20 is emitted from the side surface of the light emitting diode 20, the light is prevented from being vertically incident to the packaging layer 40, and the effect of further uniform distribution of the light by the packaging layer 40 is facilitated. And the N electrode or the P electrode of the light emitting diode 20 with the vertical structure covers the whole surface thereof, so that the contact area is large, thereby being beneficial to reducing the voltage of the light emitting diode 20 and improving the efficiency of the light emitting diode 20.
In some embodiments, with continued reference to fig. 3, the retaining wall 30 defines a plurality of receiving portions having a cross-section perpendicular to the driving back plate 10 in an inverted trapezoidal configuration. The depth of the receiving portion may be higher than the thickness of the light emitting diode 20. The side walls of the retaining wall 30 have a second reflective layer 31 at least on a part of the surface facing the receiving portion. Wherein, the material of the retaining wall 40 may be photoresist, such as SU-8. The second reflective layer 31 on the sidewalls of the retaining walls 40 may be formed of a metal, for example, Al, Ag, etc.
The barriers 30 are disposed between the adjacent light emitting diodes 20 to prevent crosstalk of light emitted from the light emitting diodes 20. The second reflective layer 31 is disposed on the sidewall of the retaining wall 30 to improve the light reflection of the led 20, so that the light emitted from the led 20 can finally reach the upper encapsulation layer 40, thereby improving the light utilization rate.
In some embodiments, with continued reference to fig. 3, the black matrix 40 is formed with a third reflective layer 51 on at least a portion of a surface thereof facing the encapsulation unit. The black matrix 50 can prevent crosstalk of light in each package unit, and the third reflective layer 51 can further disturb an original path of light, thereby further improving uniformity of light distribution.
In some embodiments, with continued reference to fig. 3, the bottom area of the accommodating portion defined by the retaining wall 30 is larger than the area occupied by the light emitting diode, the display panel further includes a fourth reflective layer 32 disposed between the light emitting diode 20 and the retaining wall 30, and the fourth reflective layer 32 is disposed on the driving backplane 10. The fourth reflective layer 32 is used to reflect the light reaching the upper surface of the driving backplate 10, so as to improve the utilization rate of the light.
The display panel further includes a light-transmissive substrate 80 on the encapsulation layer 40. The transparent substrate 80 is used to carry the encapsulation layer 40 and the black matrix 50.
The embodiment of the invention also provides a display device, which comprises the display panel, and the display device can be applied to any product or part with a display function, such as virtual reality equipment, a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a wearable watch, an internet of things node and the like. Since the principle of the display device to solve the problem is similar to that of the display panel, the display device can be implemented by the display panel, and repeated descriptions are omitted.
Referring to fig. 4, an embodiment of the invention further provides a method for manufacturing a display panel. Fig. 4 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention. As shown in fig. 4, the method for manufacturing a display panel according to the embodiment of the present invention includes the following steps:
s10, providing a driving backboard bound with a light emitting diode array, wherein the light emitting diode array comprises a plurality of light emitting diodes, and a retaining wall is arranged between every two adjacent light emitting diodes;
s20, providing a transparent substrate, forming a patterned black matrix on the transparent substrate, placing the mixed glue solution of the light scattering particles and the transparent glue solution into a groove formed by the black matrix, and curing the mixed glue solution to form a packaging layer with a plurality of packaging units;
and S30, aligning and bonding the packaging layer and the light emitting diode array according to the corresponding mode of the packaging units and the light emitting diodes.
According to the method for manufacturing the display panel provided by the embodiment of the invention, after the light emitted by the light emitting diode 20 reaches the packaging layer 40, the original path of the light is disturbed by the light scattering particles 44 in the packaging layer 40, and the light emitted from the packaging layer 40 is converted from point-like distribution to surface-like distribution, so that the light emitting area is increased, the screen window effect is greatly reduced, and the picture display effect is improved. And no additional mechanism is needed to be added to the display panel, and only the light scattering particles 44 are mixed in the packaging layer 40 of the display panel, so that the effect of reducing the screen window effect can be realized by a simple and easy-to-operate process.
In S10, the order of formation of the light emitting diode 20 array and the retaining wall 30 is not limited. The implantation in S20 may be printing, spin coating, or the like. In S30, the attaching may be performed using glue.
Further, S10 includes forming a first reflective layer 60 on a side of the light emitting diode 20 away from the driving back plate 10; a second reflecting layer 31 is formed on at least part of the surface of the retaining wall 30 facing the accommodating part, wherein the section of the accommodating part formed by the retaining wall 30, which is vertical to the driving back plate 10, is in an inverted trapezoidal structure; forming a transparent support layer 70 around the light emitting diode 20 for supporting the first reflective layer 60 extending out of the light emitting diode 20; a fourth reflective layer 32 is formed on the driving back plate 10, and the fourth reflective layer 32 is located between the light emitting diodes 20 and the retaining walls 30.
S20 further includes forming a third reflective layer 51 on at least a portion of a surface of the black matrix 50 facing the encapsulation unit 41. At least part of the packing units 41 is provided with a filter material, and the red filter material and the light scattering particles may be mixed and arranged in a layer to form the red packing unit 411, or the red filter material and the light scattering particles may be layered in the thickness direction of the packing layer to form the red packing unit 411. The green filter material and the light scattering particles may be mixedly disposed in one layer to form the green encapsulation unit 412, or the green filter material and the light scattering particles may be layered in the thickness direction of the encapsulation layer 40 to form the green encapsulation unit 412. In addition, at least a part of the encapsulation unit 41 is provided with a light conversion material, or a light conversion layer is provided between at least a part of the encapsulation unit 41 and the light emitting diode. The specific setting method has been summarized in the foregoing, and is not described herein.
Alternatively, the vertical configuration of the light emitting diodes 20 may form an array of light emitting diodes 20.
It is to be understood that relational terms such as "first," "second," and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation or arrangement in sequences other than those illustrated or otherwise described herein.
The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Also, different features that are present in different embodiments may be combined to advantage. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art upon studying the drawings, the specification, and the claims.
Claims (10)
1. A display panel, comprising:
driving the back plate;
a light emitting diode array layer on the driving backplane, the light emitting diode array layer comprising a plurality of light emitting diodes;
the retaining wall is positioned between the adjacent light-emitting diodes, and defines a plurality of accommodating parts for accommodating the light-emitting diodes;
the packaging layer is arranged on one side, away from the driving back plate, of the light emitting diode array layer and comprises a plurality of packaging units, the packaging units are isolated through black matrixes, and the packaging units are arranged corresponding to the light emitting diodes;
wherein, the light scattering particles are distributed in at least one packaging unit.
2. The display panel of claim 1, wherein the encapsulation layer comprises a transparent encapsulation material, and wherein the light scattering particles are uniformly distributed in the transparent encapsulation material.
3. The display panel of claim 2, wherein the encapsulation layer comprises a plurality of red encapsulation units, a plurality of green encapsulation units, and a plurality of blue light transmission encapsulation units, at least some of the red encapsulation units further comprise a red filter material, and at least some of the green encapsulation units further comprise a green filter material;
and/or, the red filter material and the light scattering particles are arranged in a mixed manner or in a layered manner in the thickness direction of the packaging layer in the red packaging unit;
the green filter material and the light scattering particles are arranged in the green packaging unit in a mixed mode or in a layered mode in the thickness direction of the packaging layer.
4. The display panel according to claim 1,
the packaging layer comprises a plurality of red packaging units, a plurality of green packaging units and a plurality of blue light transmission packaging units, at least part of the red packaging units also comprise red light conversion materials, and at least part of the green packaging units also comprise green light conversion materials;
and/or a light conversion layer is arranged between at least part of the packaging unit and the light emitting diode array layer.
5. The display panel according to claim 1, characterized in that the display panel further comprises:
the first reflecting layer is positioned on one surface of the light emitting diode, which is far away from the driving back plate, and is used for reflecting light emitted by the light emitting diode;
preferably, when the area of the first reflective layer is larger than the area of the side of the light emitting diode far away from the driving backplane, the display panel further includes:
and the transparent supporting layer is positioned at the periphery of the light emitting diode and used for supporting the first reflecting layer extending out of the light emitting diode.
6. The display panel of claim 5, wherein a surface of the transparent support layer away from the driving backplane is roughened, and/or a surface of the encapsulation layer close to the LED array layer is roughened.
7. The display panel according to any one of claims 5 to 6, wherein the light emitting diode is a vertical light emitting diode, and the first reflective layer is an N electrode or a P electrode of the vertical light emitting diode.
8. The display panel according to claim 1, wherein a cross section of the receiving portion perpendicular to the driving backplane has an inverted trapezoidal structure; a second reflecting layer is arranged on at least part of the surface of the retaining wall facing the accommodating part;
and/or a third reflecting layer is arranged on at least part of the surface of the black matrix facing the packaging unit;
and/or, the display panel further comprises:
and the fourth reflecting layer is positioned between the light-emitting diode and the retaining wall, and the fourth reflecting layer is positioned on the driving backboard.
9. A display device characterized by comprising the display panel according to any one of claims 1 to 8.
10. A method for manufacturing a display panel, comprising:
providing a driving back plate bound with a light emitting diode array, wherein the light emitting diode array comprises a plurality of light emitting diodes, and a retaining wall is arranged between every two adjacent light emitting diodes;
providing a light-transmitting substrate, forming a graphical black matrix on the light-transmitting substrate, placing mixed glue of light scattering particles and light-transmitting glue into a groove formed by the black matrix, and curing the mixed glue to form a packaging layer with a plurality of packaging units;
and aligning and attaching the packaging layer and the light emitting diode array according to the corresponding mode of the packaging unit and the light emitting diode.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910580227.0A CN112151567A (en) | 2019-06-28 | 2019-06-28 | Display panel, display device and preparation method of display panel |
| KR1020217038599A KR102553837B1 (en) | 2019-06-28 | 2020-01-19 | Display panel, display device, and manufacturing method of the display panel |
| PCT/CN2020/072967 WO2020258878A1 (en) | 2019-06-28 | 2020-01-19 | Display panel, display apparatus and method for preparing display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910580227.0A CN112151567A (en) | 2019-06-28 | 2019-06-28 | Display panel, display device and preparation method of display panel |
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| CN112151567A true CN112151567A (en) | 2020-12-29 |
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| CN201910580227.0A Pending CN112151567A (en) | 2019-06-28 | 2019-06-28 | Display panel, display device and preparation method of display panel |
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| KR (1) | KR102553837B1 (en) |
| CN (1) | CN112151567A (en) |
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Also Published As
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| WO2020258878A1 (en) | 2020-12-30 |
| KR20210151980A (en) | 2021-12-14 |
| KR102553837B1 (en) | 2023-07-10 |
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