TWI773488B - Display panel and manufacturing method thereof - Google Patents

Abstract

A display panel includes a first device substrate, a second device substrate, a plurality of first sealing materials, and first color conversion materials. The first device substrate includes a circuit substrate, a first bank structure, and light emitting devices. The first bank structure and the light emitting devices are located above the circuit substrate. The second device substrate is overlapping with the first device substrate. The first sealing materials are located between the first device substrate and the second device substrate. The first bank structure is in contact with the second device substrate to define closed channels between the first device substrate and the second device substrate. One side of each of a first part of the closed channels has a first opening sealed by a corresponding first sealing material. The first color conversion materials are located in the first part of the closed channels.

Description

Display panel and manufacturing method thereof

The present invention relates to a display panel, and more particularly, to a display panel including a color conversion material and a method of manufacturing the same.

Quantum dot (QD) material is a nano-scale semiconductor material, and in the optoelectronic industry, quantum dot material is getting more and more attention. Quantum dot materials are roughly divided into two categories: photoluminescence (PL) materials and electroluminescence (EL) materials. The photoluminescent quantum dot material can emit high-purity color light after absorbing the light emitted by the light source. Electroluminescent quantum dot material is energized to make electrons and holes recombine in the quantum dot material, thereby emitting light.

Common methods of making quantum dot materials include inkjet printing. For example, the ink droplets containing the solvent and the quantum dot material are sprayed to a desired position by a spray head, so as to form a quantum dot material layer at the desired position.

The present invention provides a display panel, which can avoid the problem of uneven distribution of the first color conversion material.

The present invention provides a method for manufacturing a display panel, which can avoid the problem of uneven distribution of the first color conversion material.

At least one embodiment of the present invention provides a display panel. The display panel includes a first element substrate, a second element substrate, a plurality of first sealing materials, and a plurality of first color conversion materials. The first element substrate includes a circuit substrate, a first retaining wall structure, and a plurality of light-emitting elements. The first blocking wall structure and the light emitting element are located on the circuit substrate. The second element substrate overlaps the first element substrate. The first sealing material is located between the first element substrate and the second element substrate. The first retaining wall structure contacts the second element substrate, so as to define a plurality of closed channels between the first element substrate and the second element substrate. One side of the closed channel of the first portion each has a first opening closed by a corresponding first sealing material. The first color converting material is located in the closed channel of the first portion.

At least one embodiment of the present invention provides a method for manufacturing a display panel, including: providing a first element substrate, wherein the first element substrate includes a circuit substrate, a first barrier wall structure, and a plurality of light-emitting elements, the first barrier wall structure and a plurality of light emitting elements. Each light-emitting element is located on the circuit substrate; the second element substrate is overlapped on the first element substrate, wherein the first retaining wall structure contacts the second element substrate, so as to define a plurality of light-emitting elements between the first element substrate and the second element substrate channel, wherein at least one side of the channel of the first part has a first opening; the first retaining wall structure part is immersed in the first solution, and the first solution enters the channel of the first part from the first opening; the channel of the first part is cured forming a plurality of first color conversion materials; forming a plurality of first sealing materials in the first openings to close the channels of the first part.

1A , FIG. 2A , FIG. 3 , FIG. 4 , FIG. 5A , FIG. 6 , FIG. 7 and FIG. 8A are schematic diagrams of a manufacturing method of a display panel according to an embodiment of the present invention. Figures 1B, 2B, 5B, and 8B are schematic cross-sectional views taken along the line a-a' of Figures 1A, 2A, 5A, and 8A, respectively. Figures 1C, 2C, 5C, and 8C are schematic cross-sectional views taken along the line b-b' of Figures 1A, 2A, 5A, and 8A, respectively. Fig. 2D is a schematic cross-sectional view along line c-c' of Fig. 2A.

Referring to FIG. 1A , FIG. 1B and FIG. 1C , a first element substrate 10 is provided. The first element substrate 10 includes a circuit substrate 100 , a first barrier wall structure 110 and a plurality of light emitting elements 120 . In this embodiment, the first element substrate 10 further includes a second blocking wall structure 130 and a transparent optical material 140 .

The circuit substrate 110 is, for example, a pixel array substrate. In some embodiments, the circuit substrate 110 includes a substrate and a plurality of active elements, a plurality of signal lines, and a plurality of insulating layers formed on the substrate. For the convenience of description, the circuit substrate 110 is omitted in FIGS. 1A , 1B and 1C components in .

The first retaining wall structure 110 is located on the circuit substrate 100 . In some embodiments, the first retaining wall structure 110 includes a light absorbing material. For example, the first blocking wall structure 110 includes a black photoresist material, such as a black photoresist material with an OD value greater than 1 and a reflectivity of less than 10%. In some embodiments, the reflectivity of the first retaining wall structure 110 is greater than 50%, and the transmittance is less than 10%.

The light emitting element 120 is located on the circuit substrate 100 . In some embodiments, the light-emitting element 120 is a light-emitting diode (eg, a micro-LED, an organic light-emitting diode (OLED), or other types of light-emitting diodes. The light-emitting element 120 is electrically connected to to the active elements and/or signal lines in the circuit substrate 100. In this embodiment, the light-emitting elements 120 are arranged in several rows along the first arrangement direction D1, wherein each row of the light-emitting elements 120 includes an arrangement along the second arrangement direction D2 The plurality of light-emitting elements 120

The second blocking wall structure 130 is located on the circuit substrate 100 and between the light emitting elements 120 . The second blocking wall structure 130 is suitable for preventing the light emitted by different sub-pixels from interfering with each other. In some embodiments, the second retaining wall structure 130 includes a light absorbing material. For example, the second blocking wall structure 130 includes a black photoresist material, such as a black photoresist material with an OD value greater than 1 and a reflectivity of less than 10%. The material of the first retaining wall structure 110 and the material of the second retaining wall structure 130 are the same or different from each other. In some embodiments, the material of the first retaining wall structure 110 and the material of the second retaining wall structure 130 are the same as each other, and the material of the first retaining wall structure 110 and the second retaining wall structure 130 are simultaneously processed by a lithography process form. In some embodiments, the reflectivity of the second retaining wall structure 130 is greater than 50%, and the transmittance is less than 10%. In some embodiments, the height H2 of the second retaining wall structure 130 is equal to the height H1 of the first retaining wall structure 110 . Although in this embodiment, the first element substrate 10 includes the second retaining wall structure 130 , the invention is not limited thereto. In other embodiments, the first element substrate 10 may selectively not include the second retaining wall structure 130 .

In this embodiment, two adjacent rows of light-emitting elements 120 in the first arrangement direction D1 are separated by the first barrier wall structure 110, and two adjacent light-emitting elements 120 in the same row of light-emitting elements 120 are separated by a second light-emitting element 120. The retaining wall structure 130 is separated. In this embodiment, the first retaining wall structure 110 has a plurality of grooves G1, G2, G3 extending along the second arrangement direction D2, wherein the light emitting elements 120 and the second retaining wall structure 130 in the same row are in corresponding In a groove G1, G2, G3. In the horizontal direction (parallel to the surface of the first element substrate 10 ), the groove G1 has an opening toward the first direction S1 , and the groove G2 has an opening toward the second direction S2 . The groove G3 is closed in the horizontal direction. The transparent optical material 140 is located in the groove G3 and covers the light emitting element 120 in the groove G3. In FIG. 1B , the top surface of the transparent optical material 140 is flat, but the invention is not limited thereto. The top surface of the transparent optical material 140 can also be a concave or convex surface. In addition, the thickness of the transparent optical material 140 may be less than, the same as or greater than the height H1 of the first blocking wall structure 110 .

The second element substrate 20 of FIG. 2A is superimposed on the first element substrate 10 of FIG. 1A . Please refer to FIG. 1A , FIG. 2A , FIG. 2B , FIG. 2C and FIG. 2D , the first retaining wall structure 110 contacts the second element substrate 20 to define a plurality of channels between the first element substrate 10 and the second element substrate 20 CH1, CH2, CH3. In this embodiment, both the first blocking wall structure 110 and the second blocking wall structure 130 are in contact with the second element substrate 20 .

The second element substrate 20 includes a carrier board 200 and a black matrix 210 . The black matrix 210 is located on the carrier board 200 . In this embodiment, both the first retaining wall structure 110 and the second retaining wall structure 130 are in contact with the black matrix 210 . In this embodiment, since at least one side of the second retaining wall structure 130 is separated from the first retaining wall structure 110 , the channels CH1 , CH2 , CH3 extend along the second arrangement direction D2 and will not be blocked by the second retaining wall structure 130 interrupted. In this embodiment, the left and right sides of the second blocking wall structure 130 are separated from the first blocking wall structure 110 .

The channel CH1 of the first part corresponds to the groove G1 of the first retaining wall structure 110 , and at least one side of the channel CH1 of the first part has a first opening O1 respectively. The channel CH2 of the second portion corresponds to the groove G2 of the first retaining wall structure 110 , and at least one side of the channel CH2 of the second portion each has a second opening O2 . The first opening O1 and the second opening O2 face in different directions. For example, the first opening O1 faces the first direction S1 and the second opening O2 faces the second direction S2. The channel CH3 of the third part is a closed channel, and the transparent optical material 140 is located in the channel CH3 of the third part.

For convenience of description, the second element substrate 20 is omitted in FIGS. 3 to 5A and FIGS. 7 to 8A .

Referring to FIG. 3, the first retaining wall structure 110 is partially immersed in the first solution SLU1. In this embodiment, when the first retaining wall structure 110 is immersed in the first solution SLU1, the first opening O1 of the channel CH1 of the first part faces downward and faces the first solution SLU1. In some embodiments, the width W3 of the first opening O1 is greater than the width of the light-emitting element 120 and less than or equal to the width of the sub-pixel.

In this embodiment, before partially immersing the first retaining wall structure 110 in the first solution SLU1, a vacuum process is performed to remove the air in the first part of the channel CH1. In this embodiment, when the aforementioned vacuum process is performed, the air in the first part of the channel CH1 and the air in the second part of the channel CH2 are removed together.

In this embodiment, the first solution SLU1 includes an organic solvent and a quantum dot material dispersed in the organic solvent. In other embodiments, the first solution SLU1 includes an organic light-emitting material.

Referring to FIG. 4 , after partially immersing the first retaining wall structure 110 in the first solution SLU1 , the vacuum is broken so that the atmospheric pressure pushes the first solution SLU1 into the first opening O1 . The first solution SLU1 enters into the channel CH1 of the first part from the first opening O1 and covers the light emitting element 120 in the channel CH1 of the first part.

In this embodiment, since the first solution SLU1 will only enter the channel CH1 of the first part, but will not enter the channel CH2 of the second part and the channel CH3 of the third part, it is possible to reduce the amount of time spent by the first solution SLU1 in the manufacturing process. losses, thereby reducing manufacturing costs.

Referring to FIGS. 5A , 5B and 5C, lay the first element substrate 10 and the second element substrate 20 flat so that the first opening O1 faces the horizontal direction or turn the first element substrate 10 and the second element substrate 20 so that the first element substrate 10 and the second element substrate 20 are turned An opening O1 faces upwards.

The first solution SLU1 in the channel CH1 of the first portion is cured to form a plurality of first color conversion materials CV1.

A plurality of first sealing materials 310 are formed in the first opening O1 to close the first part of the channel CH1. The first sealing material 310 is, for example, a thermosetting polymer material or a photosetting polymer material.

Referring to FIG. 6 , after closing the first part of the channel CH1 , part of the first retaining wall structure 110 is immersed in the second solution SLU2 . In this embodiment, when the first retaining wall structure 110 is partially immersed in the second solution SLU2, the second opening O2 of the channel CH2 of the second part faces downward and faces the second solution SLU2.

In some embodiments, the width W4 of the second opening O2 is greater than the width of the light-emitting element 120 and less than or equal to the width of the sub-pixel.

In this embodiment, before partially immersing the first retaining wall structure 110 in the second solution SLU2, a vacuum process is performed to remove the air in the second part of the channel CH2.

In this embodiment, the second solution SLU2 includes an organic solvent and quantum dot materials dispersed in the organic solvent, and the first solution SLU1 (drawn in FIG. 3 and FIG. 4 ) and the second solution SLU2 include quantum dot materials of different colors . In other embodiments, the first solution SLU1 and the second solution SLU2 include organic light-emitting materials, and the first solution SLU1 (shown in FIG. 3 and FIG. 4 ) and the second solution SLU2 include organic light-emitting materials of different colors.

Referring to FIG. 7 , after the first retaining wall structure 110 is partially immersed in the second solution SLU2 , the vacuum is broken so that the atmospheric pressure pushes the second solution SLU2 into the second opening O2 . The second solution SLU2 enters into the channel CH2 of the second part from the second opening O2, and covers the light-emitting element 120 in the channel CH2 of the second part.

In this embodiment, since the second solution SLU2 will only enter the channel CH2 of the second part, but will not enter the channel CH1 of the first part and the channel CH3 of the third part, the second solution SLU2 can be reduced in the manufacturing process. losses, thereby reducing manufacturing costs.

Referring to FIGS. 8A , 8B and 8C, lay the first element substrate 10 and the second element substrate 20 flat so that the second opening O2 faces the horizontal direction or turn the first element substrate 10 and the second element substrate 20 so that the first element substrate 10 and the second element substrate 20 are turned Two openings O2 face upwards.

The second solution SLU2 in the second portion of the channel CH2 is cured to form a plurality of second color conversion materials CV2.

A plurality of second sealing materials 320 are formed in the second openings O2 to close the second portion of the channels CH2. So far, the display panel 1 is substantially completed. In this embodiment, the second sealing material 320 is located between the first element substrate 10 and the second element substrate 20 . The second sealing material 320 is, for example, a thermosetting polymer material or a photosetting polymer material.

In this embodiment, the display panel 1 includes a first element substrate 10 , a second element substrate 20 , a plurality of first sealing materials 310 , a plurality of second sealing materials 320 , a plurality of first color conversion materials CV1 , and a plurality of first sealing materials 310 . Two color conversion material CV2. The first element substrate 10 includes a circuit substrate 100 , a first blocking wall structure 110 , a plurality of light emitting elements 120 , a second blocking wall structure 130 and a transparent optical material 140 . The second element substrate 20 includes a carrier board 200 and a black matrix 210 . The first sealing material 310 , the second sealing material 320 , the first color conversion material CV1 , the plurality of second color conversion materials CV2 and the transparent optical material 140 are located between the first element substrate 10 and the second element substrate 20 .

The first retaining wall structure 110 contacts the second element substrate 20 to define a plurality of closed channels CH1 , CH2 and CH3 between the first element substrate 10 and the second element substrate 20 . One side of the closed channel CH1 of the first part each has a first opening O1 closed by the corresponding first sealing material 310 . One side of the closed channel CH2 of the second portion each has a second opening O2 closed by the corresponding second sealing material 320 . The first color converting material CV1 is located in the closed channel CH1 of the first portion. The second color converting material CV2 is located in the closed channel CH2 of the second portion. The transparent optical material 140 is located in the closed channel CH3 of the third portion. The first color conversion material CV1 and the second color conversion material CV2 are of different colors. For example, the light-emitting element 120 includes a blue light-emitting diode, the first color conversion material CV1 converts the blue light emitted by the blue light-emitting diode into red light, and the second color conversion material CV2 converts the blue light emitted by the blue light-emitting diode. The blue light emitted by the blue light emitting diode can directly pass through the transparent optical material 140, whereby the display panel 1 can emit red light, blue light and green light.

In this embodiment, the second retaining wall structure 130 contacts the second element substrate 20 and is located in the closed channels CH1 , CH2 and CH3 . At least one side of each second blocking wall structure 130 does not contact the first blocking wall structure 110 .

In this embodiment, the closed channels CH1 , CH2 and CH3 include straight bars, but the present invention is not limited thereto. In other embodiments, the enclosed channels CH1, CH2, CH3 comprise wavy or sawtooth shapes.

Based on the above, the present embodiment can reduce the losses of the first solution SLU1 and the second solution SLU2 during the manufacturing process, thereby reducing the manufacturing cost. In addition, in a general inkjet process, when the ink droplets containing the quantum dot material hit the substrate, the quantum dot material in the ink droplet is unevenly distributed due to force, resulting in color shift in the display panel. However, in this embodiment, the first solution SLU1 and the second solution SLU2 are pushed into the channel CH1 of the first part and the channel CH2 of the second part respectively by atmospheric pressure, so as to avoid the aforementioned color shift problem.

9 to 11A are schematic diagrams of a manufacturing method of a display panel according to an embodiment of the present invention. Fig. 11B is a schematic cross-sectional view taken along line d-d' of Fig. 11A. It must be noted here that the embodiments of FIGS. 9 to 11A use the element numbers and part of the content of the embodiments of FIGS. 1A to 8C , wherein the same or similar numbers are used to represent the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.

For convenience of description, the second element substrate 20 is omitted from FIGS. 9 to 11A .

Please refer to FIG. 9 , after forming a plurality of first sealing materials 310 in the first opening O1 (as shown in FIGS. 5A to 5C ) or after forming a plurality of second sealing materials 320 in the second opening O2 (as shown in FIGS. 8A to 5C ) 8C), respectively forming a plurality of third openings O3 in the channel CH3 of the third part to open the channel CH3 of the third part. In this embodiment, the third opening O3 and the first opening O1 face the same first direction S1, but the invention is not limited to this. In other embodiments, the third opening O3 and the second opening O2 face the same second direction S2. In some embodiments, forming the third opening O3 includes a laser or other etching process. In some embodiments, the width W5 of the third opening O3 is greater than the width of the light emitting element 120 and less than or equal to the width of the sub-pixel.

10, the first retaining wall structure 110 is partially immersed in the third solution SLU3, the third opening O3 faces the third solution SLU3, and the third solution SLU3 enters the third part of the channel CH3 from the third opening O3.

In this embodiment, the transparent optical material 140 is not formed in the channel CH3 of the third part (as shown in FIG. 1C ), therefore, the third solution SLU3 can directly contact and coat the light-emitting element 120 in the channel CH3 of the third part. In this embodiment, before partially dipping the first retaining wall structure 110 into the third solution SLU3, a vacuum process is performed to remove air in the channel CH3 of the third part. After the first retaining wall structure 110 is partially immersed in the third solution SLU3, the vacuum is broken so that the atmospheric pressure pushes the third solution SLU3 into the third opening O3.

In this embodiment, the third solution SLU3 includes an organic solvent and quantum dot materials dispersed in the organic solvent, and the first solution SLU1 (drawn in FIGS. 3 and 4 ) and the second solution SLU2 (drawn in FIGS. 6 and 4 ) 7) and the third solution SLU3 includes quantum dot materials of different colors. In other embodiments, the first solution SLU1 , the second solution SLU2 and the third solution SLU3 include organic light-emitting materials, and the first solution SLU1 , the second solution SLU2 and the third solution SLU3 include organic light-emitting materials of different colors.

Referring to FIG. 11A , the third solution SLU3 in the third portion of the channel CH3 is cured to form a plurality of third color conversion materials CV3 . The first color conversion material CV1, the second color conversion material CV2 and the third color conversion material CV3 are of different colors. In some embodiments, the first color conversion material CV1, the second color conversion material CV2, and the third color conversion material CV3 include red quantum dot material, green quantum dot material, and blue quantum dot material, respectively.

A plurality of third sealing materials 330 are formed in the third openings O3 to close the third portion of the channel CH3. So far, the display panel 2 is substantially completed. In this embodiment, the third sealing material 330 is located between the first element substrate 10 and the second element substrate 20 . The third sealing material 330 is, for example, a thermosetting polymer material or a photosetting polymer material.

12 to 13 are schematic diagrams of a manufacturing method of a display panel according to an embodiment of the present invention. It must be noted here that the embodiments of FIGS. 12 to 13 use the element numbers and part of the content of the embodiment of FIGS. 1A to 8C , wherein the same or similar numbers are used to represent the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here. For convenience of description, the second element substrate 20 is omitted from FIGS. 12 to 13 .

Referring to FIG. 12 , in this embodiment, the channel CH2 of the second part and the channel CH3 of the third part are both surrounded (transversely closed) by the first blocking wall structure 110 , and the transparent optical material 140 is located in the channel of the second part CH2 is in the channel CH3 of the third part.

In the present embodiment, one side of the channel CH1 of the first portion each has a first opening O1, and the other side thereof each has a second opening O2. In other words, the first portion of the channel CH1 penetrates through the first retaining wall structure 110 .

In this embodiment, the light emitting element 120a is located in the channel CH1 of the first part and the channel CH2 of the second part, and the light emitting element 120b is located in the channel CH3 of the third part. In this embodiment, the light-emitting element 120a and the light-emitting element 120b include different colors. For example, the light-emitting element 120a is a blue light-emitting diode, and the light-emitting element 120b is a green light-emitting diode.

The first retaining wall structure 110 is partially immersed in the first solution SLU1. In this embodiment, when the first retaining wall structure 110 is immersed in the first solution SLU1, the first opening O1 of the channel CH1 of the first part faces downward and faces the first solution SLU1. In this embodiment, the first solution SLU1 is sucked into the channel CH1 of the first part by capillary force.

Next, referring to FIG. 13 , the first solution SLU1 in the first portion of the channel CH1 is cured to form a plurality of first color conversion materials CV1 . In some embodiments, the first color conversion material CV1 includes red quantum dot material, and the first color conversion material CV1 converts the blue light emitted by the blue light emitting diode into red light.

A plurality of first sealing materials 310 are formed in the first opening O1, and a plurality of second sealing materials 320 are formed in the second opening O2 to close the first part of the channel CH1. So far, the display panel 3 is substantially completed.

The first sealing material 310 and the second sealing material 320 are located between the first element substrate 10 and the second element substrate 20 (drawn in FIGS. 2A to 2D ). One side of the closed channel CH1 of the first part each has a first opening O1 closed by the corresponding first sealing material 310 , and the other side each has a second opening 320 closed by the corresponding second sealing material 320 .

Based on the above, since the first solution SLU1 will only enter the channel CH1 of the first part, but will not enter the channel CH2 of the second part and the channel CH3 of the third part, the loss of the first solution SLU1 in the process can be reduced. , thereby reducing manufacturing costs. In addition, in a general inkjet process, when the ink droplets containing the quantum dot material hit the substrate, the quantum dot material in the ink droplet is unevenly distributed due to force, resulting in color shift in the display panel. However, in this embodiment, the first solution SLU1 is attracted into the channel CH1 of the first part by capillary force, thereby avoiding the aforementioned color shift problem.

14A is a schematic top view of a display panel according to an embodiment of the present invention. Fig. 14B is a schematic cross-sectional view taken along line a-a' of Fig. 14A. Fig. 14C is a schematic cross-sectional view taken along line b-b' of Fig. 14A. It must be noted here that the embodiments of FIGS. 12 to 13 use the element numbers and part of the content of the embodiment of FIGS. 1A to 8C , wherein the same or similar numbers are used to represent the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.

The main difference between the display panel 4 of FIGS. 14A to 14C and the display panel 1 of FIG. 8A is that the light-emitting elements 120 of the display panel 1 of FIG. 8A are aligned with each other in the first arrangement direction D1, while the light-emitting elements 120 of the display panel 4 of FIG. The elements 120 are staggered and arranged in the first arrangement direction D1.

Referring to FIGS. 14A to 14C , in this embodiment, the sub-pixels of the display panel 4 are approximately hexagonal, thereby increasing the resolution.

In some embodiments, the height H1 of the first retaining wall structure 110 is greater than or equal to the width W1 of the first retaining wall structure 110 . In some embodiments, the height H2 of the second retaining wall structure 130 is greater than or equal to the width W2 of the second retaining wall structure 130 .

FIG. 15 is a schematic top view of a display panel according to an embodiment of the present invention. It must be noted here that the embodiment of FIG. 15 uses the element numbers and part of the content of the embodiment of FIG. 1A to FIG. 8C , wherein the same or similar numbers are used to represent the same or similar elements, and the same technical content is omitted. illustrate. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.

The main difference between the display panel 5 of FIG. 15 and the display panel 1 of FIG. 8A is that the channels CH1 , CH2 and CH3 of the display panel 5 are zigzag.

Referring to FIG. 15 , in this embodiment, the width W3 of the first opening O1 of the channel CH1 of the first part is different from the width W4 of the second opening O2 of the channel CH2 of the second part. For example, the width W3 of the first opening O1 of the channel CH1 of the first part is larger than the width W4 of the second opening O2 of the channel CH2 of the second part.

In this embodiment, the width W3 of the first opening O1 and the width W4 of the second opening O2 are adjusted according to the viscosity of the first solution and the viscosity of the second solution. In this embodiment, the viscosity of the first solution entering the first opening O1 is higher than that of the second solution entering the second opening O2. Therefore, the first opening O1 is designed to have a larger width W3, so as to Let the first solution enter the first opening O1. In this embodiment, the first solution in the closed channel CH1 of the first part is cured to form the first color conversion material CV1, and the second solution in the closed channel CH2 of the second part is cured to form the second color conversion material CV2 . The first color conversion material CV1 and the second color conversion material CV2 are, for example, red quantum dot materials and green quantum dot materials, respectively.

In this embodiment, the first opening O1 faces the third direction S3, and the second opening O1 faces the fourth direction S4. The third direction S3 and the fourth direction S4 are both different from the extending directions E1 of the channels CH1, CH2, and CH3. Specifically, neither the third direction S3 nor the fourth direction S4 is parallel to the extending direction E1.

To sum up, the embodiments of the present invention can reduce the loss of quantum dot materials in the manufacturing process, thereby reducing the manufacturing cost.

1, 2, 3, 4: Display panel 10: The first element substrate 20: Second component substrate 100: circuit substrate 110: First retaining wall structure 120, 120a, 120b: Light-emitting elements 130: Second retaining wall structure 140: Transparent Optical Materials 200: carrier board 210: Black Matrix 310: The first sealing material 320: Second sealing material 330: The third sealing material a-a', b-b', c-c', d-d': line CH1, CH2, CH3: Channels CV1: First Color Conversion Material CV2: Second Color Conversion Material CV3: Third Color Conversion Material D1: The first arrangement direction D2: The second arrangement direction E1: extension direction G1, G2, G3: Groove H1, H2: height O1: The first opening O2: Second opening O3: The third opening S1: first direction S2: Second direction S3: third direction S4: Fourth direction SLU1: first solution SLU2: Second solution SLU3: Third solution W1, W2, W3, W4, W5: width

1A , FIG. 2A , FIG. 3 , FIG. 4 , FIG. 5A , FIG. 6 , FIG. 7 and FIG. 8A are schematic diagrams of a manufacturing method of a display panel according to an embodiment of the present invention. Figures 1B, 2B, 5B, and 8B are schematic cross-sectional views taken along the line a-a' of Figures 1A, 2A, 5A, and 8A, respectively. Figures 1C, 2C, 5C, and 8C are schematic cross-sectional views taken along the line b-b' of Figures 1A, 2A, 5A, and 8A, respectively. Fig. 2D is a schematic cross-sectional view along line c-c' of Fig. 2A. 9 to 11A are schematic diagrams of a manufacturing method of a display panel according to an embodiment of the present invention. Fig. 11B is a schematic cross-sectional view taken along line d-d' of Fig. 11A. 12 to 13 are schematic diagrams of a manufacturing method of a display panel according to an embodiment of the present invention. 14A is a schematic top view of a display panel according to an embodiment of the present invention. Fig. 14B is a schematic cross-sectional view taken along line a-a' of Fig. 14A. Fig. 14C is a schematic cross-sectional view taken along line b-b' of Fig. 14A. FIG. 15 is a schematic top view of a display panel according to an embodiment of the present invention.

1: Display panel

100: circuit substrate

110: First retaining wall structure

120: Light-emitting element

130: Second retaining wall structure

140: Transparent Optical Materials

310: The first sealing material

320: Second sealing material

a-a', b-b': line

CV1: First Color Conversion Material

CV2: Second Color Conversion Material

D1: The first arrangement direction

D2: The second arrangement direction

Claims (15)

A display panel, comprising: a first element substrate, including: a circuit substrate; a first retaining wall structure located on the circuit substrate; and a plurality of light-emitting elements located on the circuit substrate; a second element substrate , overlapped on the first element substrate; a plurality of first sealing materials are located between the first element substrate and the second element substrate, wherein the first retaining wall structure contacts the second element substrate, so that the first A plurality of closed channels are defined between the element substrate and the second element substrate, wherein one side of the closed channels of the first part each has a first opening closed by the corresponding first sealing material; and a first color converting material in the closed channels of the first portion. The display panel of claim 1, wherein the second element substrate further comprises: a carrier board; and a black matrix located on the carrier board, wherein the first blocking wall structure contacts the black matrix. The display panel according to claim 1, wherein the first element substrate further comprises: A plurality of second blocking wall structures contact the second element substrate and are located in the closed channels, wherein the second blocking wall structures are located between the light-emitting elements, and at least one of the second blocking wall structures One side is separated from the first retaining wall structure. The display panel of claim 1, wherein the height of the first retaining wall structure is greater than or equal to the width of the first retaining wall structure. The display panel of claim 1, further comprising: a plurality of second sealing materials located between the first element substrate and the second element substrate, wherein the closed channels of the second part each have a second sealing material openings, the first openings and the second openings face in different directions, wherein the respective second openings of the closed channels of the second part are closed by the corresponding second sealing material. The display panel of claim 5, further comprising: a plurality of second color conversion materials located in the closed channels of the second part, wherein the first color conversion materials and the second color conversion materials respectively in different colors. The display panel of claim 5, further comprising: a plurality of transparent optical materials located in the closed channels of the third part. The display panel of claim 6, further comprising: a plurality of third sealing materials located between the first element substrate and the second element substrate, wherein the closed channels of the third part each have a third sealing material openings, wherein the respective third openings of the closed channels of the third part are blocked by the corresponding third openings Three sealing materials are closed; and a plurality of third color conversion materials are located in the closed channels of the third part, wherein the first color conversion materials, the second color conversion materials and the third color conversion materials The materials are in different colors. The display panel of claim 1, further comprising: a plurality of second sealing materials located between the first element substrate and the second element substrate, wherein the other side of the closed channels of the first part Each has a second opening closed by the corresponding second sealing material. The display panel of claim 1, wherein the closed channels comprise straight, wavy or sawtooth shapes. A method for manufacturing a display panel, comprising: providing a first element substrate, wherein the first element substrate comprises: a circuit substrate; a first retaining wall structure located on the circuit substrate; and a plurality of light-emitting elements located on the circuit substrate on the circuit substrate; a second element substrate is overlapped on the first element substrate, wherein the first retaining wall structure contacts the second element substrate to define a space between the first element substrate and the second element substrate A plurality of channels, wherein at least one side of the channels of the first part each has a first opening; the first retaining wall structure part is immersed in a first solution, and the first solution enters the first solution from the first openings in those channels of the first part; curing the first solution in the channels of the first part to form a plurality of first color conversion materials; and forming a plurality of first sealing materials in the first openings to close the channels of the first part . The manufacturing method of claim 11, further comprising: before immersing the first retaining wall structure part in a first solution, performing a vacuum process to remove air in the channels of the first part; After the first retaining wall structure is partially immersed in a first solution, the vacuum is broken so that atmospheric pressure pushes the first solution into the first openings. The manufacturing method of claim 11, wherein the channels of the second part each have a second opening, and the first openings and the second openings face in different directions. The manufacturing method of claim 13, after closing the channels of the first part, further comprising: immersing the first retaining wall structure part in a second solution, wherein the second openings face the second solution , and the second solution enters into the channels of the second part from the second openings; and solidifies the second solution in the channels of the second part to form a plurality of second color conversion materials. The manufacturing method of claim 14, further comprising: forming a plurality of third openings in the passages of the third part respectively to open the third openings part of the channels; the first retaining wall structure part is immersed in a third solution, wherein the third openings face the third solution, and the third solution enters the third part from the third openings in the channels; solidify the third solution in the channels of the third portion to form third color conversion materials; and form a plurality of third sealing materials in the third openings to seal the The channels of the third part.

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