CN114335294A - Display panel and method for manufacturing the same - Google Patents

Display panel and method for manufacturing the same Download PDF

Info

Publication number
CN114335294A
CN114335294A CN202111652278.3A CN202111652278A CN114335294A CN 114335294 A CN114335294 A CN 114335294A CN 202111652278 A CN202111652278 A CN 202111652278A CN 114335294 A CN114335294 A CN 114335294A
Authority
CN
China
Prior art keywords
channels
retaining wall
wall structure
substrate
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202111652278.3A
Other languages
Chinese (zh)
Other versions
CN114335294B (en
Inventor
陈弘胤
蔡正晔
刘品妙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AU Optronics Corp
Original Assignee
AU Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AU Optronics Corp filed Critical AU Optronics Corp
Publication of CN114335294A publication Critical patent/CN114335294A/en
Application granted granted Critical
Publication of CN114335294B publication Critical patent/CN114335294B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

A display panel and a manufacturing method thereof are provided, the display panel comprises a first element substrate, a second element substrate, a plurality of first sealing materials and a plurality of first color conversion materials. The first element substrate comprises a circuit substrate, a first retaining wall structure and a plurality of light-emitting elements. The first retaining wall structure and the light-emitting element are positioned on the circuit substrate. The second element substrate is overlapped with the first element substrate. The first sealing material is positioned between the first element substrate and the second element substrate. The first retaining wall structure contacts the second element substrate to define a plurality of closed channels between the first element substrate and the second element substrate. One side of the closed channel of the first part is provided with a first opening which is closed by the corresponding first sealing material. The first color converting material is located in the closed channel of the first portion.

Description

Display panel and method for manufacturing the same
Technical Field
The present invention relates to a display panel, and more particularly, to a display panel including a color conversion material and a method of manufacturing the same.
Background
Quantum Dot (QD) materials are a nanoscale semiconductor material, and are increasingly gaining attention in the photovoltaic industry. Quantum dot materials are broadly classified into two types, i.e., Photoluminescent (PL) materials and Electroluminescent (EL) materials. The photoluminescence quantum dot material can absorb light emitted by a light source and then emit high-purity colored light. The electroluminescent quantum dot material is electrified to ensure that electron holes are compounded in the quantum dot material, thereby emitting light.
A common method of manufacturing quantum dot materials includes inkjet printing. For example, an ink droplet containing a solvent and a quantum dot material is ejected to a desired position through a nozzle to form a quantum dot material layer at the desired position.
Disclosure of Invention
The invention provides a display panel which can avoid the problem of uneven distribution of a first color conversion material.
The invention provides a manufacturing method of a display panel, which can avoid the problem of uneven distribution of a first color conversion material.
At least one embodiment of the present invention provides a display panel. The display panel comprises a first element substrate, a second element substrate, a plurality of first sealing materials and a plurality of first color conversion materials. The first element substrate comprises a circuit substrate, a first retaining wall structure and a plurality of light-emitting elements. The first retaining wall structure and the light-emitting element are positioned on the circuit substrate. The second element substrate is overlapped with the first element substrate. The first sealing material is positioned between the first element substrate and the second element substrate. The first retaining wall structure contacts the second element substrate to define a plurality of closed channels between the first element substrate and the second element substrate. One side of the closed channel of the first part is provided with a first opening which is closed by the corresponding first sealing material. The first color converting material is located in the closed channel of the first portion.
At least one embodiment of the present invention provides a method for manufacturing a display panel, including: providing a first element substrate, wherein the first element substrate comprises a circuit substrate, a first retaining wall structure and a plurality of light-emitting elements, and the first retaining wall structure and the plurality of light-emitting elements are positioned on the circuit substrate; overlapping the second element substrate on the first element substrate, wherein the first retaining wall structure contacts the second element substrate to define a plurality of channels between the first element substrate and the second element substrate, wherein at least one side of each channel of the first part is provided with a first opening; immersing the first retaining wall structure portion in a first solution, the first solution entering the channel of the first portion from the first opening; curing the first solution in the first portion of channels to form a plurality of first color converting materials; a plurality of first sealing materials are formed in the first openings to seal the first portion of the channel.
Drawings
Fig. 1A, fig. 2A, fig. 3, fig. 4, fig. 5A, fig. 6, fig. 7, and fig. 8A are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention.
FIGS. 1B, 2B, 5B, 8B are schematic cross-sectional views taken along line a-a' of FIGS. 1A, 2A, 5A, 8A, respectively.
FIGS. 1C, 2C, 5C, 8C are schematic cross-sectional views taken along the line b-b' of FIGS. 1A, 2A, 5A, 8A, respectively.
Fig. 2D is a schematic sectional view along the line c-c' of fig. 2A.
Fig. 9 to 11A are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention.
Fig. 11B is a schematic sectional view taken along line d-d' of fig. 11A.
Fig. 12 to 13 are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention.
Fig. 14A is a top view of a display panel according to an embodiment of the invention.
Fig. 14B is a schematic sectional view taken along line a-a' of fig. 14A.
Fig. 14C is a schematic sectional view taken along line b-b' of fig. 14A.
Fig. 15 is a top view of a display panel according to an embodiment of the invention.
Description of reference numerals:
1,2,3,4: display panel
10: first element substrate
20: second element substrate
100: circuit board
110: first retaining wall structure
120,120a,120 b: light emitting element
130: second retaining wall structure
140: transparent optical material
200: support plate
210: black matrix
310: first sealing material
320: second sealing material
330: third seal material
a-a ', b-b', c-c ', d-d': thread
CH1, CH2, CH 3: channel
CV 1: first color conversion material
CV 2: second color conversion material
CV 3: third color conversion material
D1: first arrangement direction
D2: second arrangement direction
E1: direction of extension
G1, G2, G3: groove
H1, H2: height
O1: first opening
O2: second opening
O3: third opening
S1: a first direction
S2: second direction
S3: third direction
S4: fourth direction
SLU 1: first solution
SLU 2: second solution
SLU 3: the third solution
W1, W2, W3, W4, W5: width of
Detailed Description
Fig. 1A, fig. 2A, fig. 3, fig. 4, fig. 5A, fig. 6, fig. 7, and fig. 8A are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention. FIGS. 1B, 2B, 5B, 8B are schematic cross-sectional views taken along line a-a' of FIGS. 1A, 2A, 5A, 8A, respectively. FIGS. 1C, 2C, 5C, 8C are schematic cross-sectional views taken along the line b-b' of FIGS. 1A, 2A, 5A, 8A, respectively. Fig. 2D is a schematic sectional view along the line c-c' of fig. 2A.
Referring to fig. 1A, fig. 1B and fig. 1C, a first device substrate 10 is provided. The first device substrate 10 includes a circuit substrate 100, a first retaining wall structure 110, and a plurality of light emitting devices 120. In the present embodiment, the first device substrate 10 further includes a second barrier structure 130 and a transparent optical material 140.
The circuit substrate 110 is, for example, a pixel array substrate. In some embodiments, the circuit substrate 110 includes a substrate, and a plurality of active devices, a plurality of signal lines, and a plurality of insulating layers formed on the substrate, and for convenience of description, components in the circuit substrate 110 are omitted in fig. 1A, 1B, and 1C.
The first retaining wall structure 110 is located on the circuit substrate 100. In some embodiments, the first retaining wall structure 110 includes a light absorbing material. For example, the first retaining wall structure 110 includes a black photoresist material, such as a black photoresist material with an OD greater than 1 and a reflectivity less than 10%. In some embodiments, the reflectivity of the first retaining wall structure 110 is greater than 50%, and the transmittance is less than 10%.
The light emitting element 120 is located on the circuit substrate 100. In some embodiments, the light emitting elements 120 are light emitting diodes (e.g., micro-LEDs, Organic Light Emitting Diodes (OLEDs), or other types of light emitting diodes, the light emitting elements 120 are electrically connected to active devices and/or signal lines in the circuit substrate 100. in the present embodiment, the light emitting elements 120 are arranged in rows along a first arrangement direction D1, wherein each row of the light emitting elements 120 includes a plurality of light emitting elements 120 arranged along a second arrangement direction D2
The second barrier structure 130 is located on the circuit substrate 100 and between the light emitting devices 120. The second barrier structure 130 is suitable for preventing the light emitted by different sub-pixels from interfering with each other. In some embodiments, the second barrier structure 130 includes a light absorbing material. For example, the second barrier wall structure 130 includes a black photoresist material, such as a black photoresist material having an OD value greater than 1 and a reflectivity less than 10%. The material of the first retaining wall structure 110 and the material of the second retaining wall structure 130 are the same or different from each other. In some embodiments, the material of the first retaining wall structure 110 and the material of the second retaining wall structure 130 are the same as each other, and the material of the first retaining wall structure 110 and the material of the second retaining wall structure 130 are formed simultaneously by a photolithography process. In some embodiments, the reflectivity of the second barrier structure 130 is greater than 50% and the transmittance is < 10%. In some embodiments, the height H2 of the second retaining wall structure 130 is equal to the height H1 of the first retaining wall structure 110. Although the first device substrate 10 includes the second barrier structure 130 in the embodiment, the invention is not limited thereto. In other embodiments, the first device substrate 10 may optionally not include the second barrier structure 130.
In the present embodiment, two adjacent rows of light emitting devices 120 in the first arrangement direction D1 are separated by the first retaining wall structure 110, and two adjacent light emitting devices 120 in the same row of light emitting devices 120 are separated by the second retaining wall structure 130. In the embodiment, the first retaining wall structure 110 has a plurality of grooves G1, G2, G3 extending along the second arrangement direction D2, wherein the light emitting devices 120 and the second retaining wall structure 130 in the same row are located in a corresponding one of the grooves G1, G2, G3. In the horizontal direction (parallel to the surface of the first element substrate 10), the groove G1 has an opening toward the first direction S1, and the groove G2 has an opening toward the second direction S2. The groove G3 is then closed in the horizontal direction. The transparent optical material 140 is located in the groove G3 and covers the light emitting element 120 in the groove G3. In fig. 1B, the top surface of the transparent optical material 140 is a plane, but the invention is not limited thereto. The top surface of the transparent optical material 140 may also be a concave or convex surface. In addition, the thickness of the transparent optical material 140 may be smaller than, the same as, or larger than the height H1 of the first bank structure 110.
The second element substrate 20 of fig. 2A is overlapped with the first element substrate 10 of fig. 1A. Referring to fig. 1A, fig. 2B, fig. 2C and fig. 2D, the first retaining wall structure 110 contacts the second device substrate 20 to define a plurality of channels CH1, CH2 and CH3 between the first device substrate 10 and the second device substrate 20. In the present embodiment, the first retaining wall structure 110 and the second retaining wall structure 130 both contact the second device substrate 20.
The second device substrate 20 includes a carrier 200 and a black matrix 210. The black matrix 210 is disposed on the carrier 200. In the present embodiment, the first retaining wall structure 110 and the second retaining wall structure 130 both contact the black matrix 210. In the embodiment, since at least one side of the second retaining wall structure 130 is separated from the first retaining wall structure 110, the channels CH1, CH2, and CH3 extend along the second arrangement direction D2 without being interrupted by the second retaining wall structure 130. In the present embodiment, the left and right sides of the second retaining wall structure 130 are separated from the first retaining wall structure 110.
The channel CH1 of the first portion corresponds to the groove G1 of the first retaining wall structure 110, and at least one side of the channel CH1 of the first portion has a first opening O1. The channel CH2 of the second portion corresponds to the groove G2 of the first retaining wall structure 110, and at least one side of the channel CH2 of the second portion has a second opening O2. The first opening O1 faces a different direction than the second opening O2, for example, the first opening O1 faces the first direction S1, and the second opening O2 faces the second direction S2. The channel CH3 of the third portion is a closed channel, and the transparent optical material 140 is located in the channel CH3 of the third portion.
For convenience of explanation, fig. 3 to 5A and fig. 7 to 8A omit the second element substrate 20.
Referring to fig. 3, the first retaining wall structure 110 is partially immersed in the first solution SLU 1. In this embodiment, when the first retaining wall structure 110 is immersed in the first solution SLU1, the first opening O1 of the channel CH1 of the first portion faces downward and toward the first solution SLU 1. In some embodiments, the width W3 of the first opening O1 is greater than the width of the light emitting element 120 and less than or equal to the width of the sub-pixel.
In this embodiment, before partially immersing the first retaining wall structure 110 in the first solution SLU1, a vacuum process is performed to remove air in the channel CH1 of the first portion. In the present embodiment, the vacuum process is performed to remove the air in the channel CH1 of the first portion and the air in the channel CH2 of the second portion.
In the present embodiment, the first solution SLU1 includes an organic solvent and quantum dot materials dispersed in the organic solvent. In other embodiments, the first solution SLU1 includes an organic light emitting material.
Referring to fig. 4, after the first retaining wall structure 110 is partially immersed in the first solution SLU1, a vacuum is broken to allow atmospheric pressure to push the first solution SLU1 into the first opening O1. The first solution SLU1 enters the channel CH1 of the first portion from the first opening O1 and covers the light emitting element 120 in the channel CH1 of the first portion.
In this embodiment, since the first solution SLU1 only enters the first part channel CH1, but not the second part channel CH2 and the third part channel CH3, the loss of the first solution SLU1 in the process can be reduced, thereby reducing the manufacturing cost.
Referring to fig. 5A, 5B and 5C, the first device substrate 10 and the second device substrate 20 are horizontally placed such that the first opening O1 faces horizontally or the first device substrate 10 and the second device substrate 20 are turned over such that the first opening O1 faces upward.
The first solution SLU1 in the first portion of the channel CH1 is solidified to form a plurality of first color conversion materials CV 1.
A plurality of first sealing materials 310 are formed in the first opening O1 to seal the channel CH1 of the first portion. The first sealing material 310 is, for example, a thermosetting polymer material or a light-curing polymer material.
Referring to fig. 6, after closing the channel CH1 of the first portion, the first retaining wall structure 110 is partially immersed in the second solution SLU 2. In this embodiment, when the first retaining wall structure 110 is partially immersed in the second solution SLU2, the second opening O2 of the channel CH2 of the second portion faces downward and toward the second solution SLU 2.
In some embodiments, the width W4 of the second opening O2 is greater than the width of the light emitting element 120 and less than or equal to the width of the sub-pixel.
In this embodiment, before partially immersing the first retaining wall structure 110 in the second solution SLU2, a vacuum process is performed to remove air in the channel CH2 of the second portion.
In the embodiment, the second solution SLU2 includes an organic solvent and quantum dot materials dispersed in the organic solvent, and the first solution SLU1 (shown in fig. 3 and 4) and the second solution SLU2 include quantum dot materials with different colors. In other embodiments, the first solution SLU1 and the second solution SLU2 include organic light emitting materials, and the first solution SLU1 (shown in fig. 3 and 4) and the second solution SLU2 include organic light emitting materials of different colors.
Referring to fig. 7, after the first retaining wall structure 110 is partially immersed in the second solution SLU2, vacuum is broken to allow atmospheric pressure to push the second solution SLU2 into the second opening O2. The second solution SLU2 enters the channel CH2 of the second portion from the second opening O2 and covers the light emitting element 120 in the channel CH2 of the second portion.
In this embodiment, since the second solution SLU2 only enters the second part channel CH2, but not the first part channel CH1 and the third part channel CH3, the loss of the second solution SLU2 in the process can be reduced, thereby reducing the manufacturing cost.
Referring to fig. 8A, 8B and 8C, the first device substrate 10 and the second device substrate 20 are laid flat such that the second opening O2 faces horizontally or the first device substrate 10 and the second device substrate 20 are turned over such that the second opening O2 faces upward.
The second solution SLU2 in the second portion of the channel CH2 was solidified to form a plurality of second color conversion materials CV 2.
A plurality of second sealing materials 320 are formed in the second opening O2 to seal the channel CH2 of the second portion. By this, the display panel 1 is substantially completed. In the present embodiment, the second sealing material 320 is located between the first device substrate 10 and the second device substrate 20. The second sealing material 320 is, for example, a thermosetting polymer material or a light-curing polymer material.
In the present embodiment, the display panel 1 includes a first element substrate 10, a second element substrate 20, a plurality of first sealing materials 310, a plurality of second sealing materials 320, a plurality of first color conversion materials CV1, and a plurality of second color conversion materials CV 2. The first device substrate 10 includes a circuit substrate 100, a first wall structure 110, a plurality of light emitting devices 120, a second wall structure 130, and a transparent optical material 140. The second device substrate 20 includes a carrier 200 and a black matrix 210. The first sealing material 310, the second sealing material 320, the first color conversion material CV1, the plurality of second color conversion materials CV2, and the transparent optical material 140 are located between the first device substrate 10 and the second device substrate 20.
The first retaining wall structure 110 contacts the second device substrate 20 to define a plurality of closed channels CH1, CH2, and CH3 between the first device substrate 10 and the second device substrate 20. One side of the closed channel CH1 of the first part has a first opening O1 closed by the corresponding first sealing material 310. One side of the closed channel CH2 of the second part has a second opening O2 closed by the corresponding second sealing material 320. The first color conversion material CV1 is located in the closed channel CH1 of the first portion. The second color-converting material CV2 is located in the closed channel CH2 of the second portion. The transparent optical material 140 is located in the closed channel CH3 of the third section. The first color conversion material CV1 and the second color conversion material CV2 are different colors, respectively. For example, the light emitting element 120 includes a blue light emitting diode, the first color conversion material CV1 converts blue light emitted from the blue light emitting diode into red light, the second color conversion material CV2 converts blue light emitted from the blue light emitting diode into green light, and the blue light emitted from the blue light emitting diode can directly pass through the transparent optical material 140, so that the display panel 1 can emit red light, blue light, and green light.
In the present embodiment, the second barrier structure 130 contacts the second device substrate 20 and is located in the closed channels CH1, CH2, and CH 3. At least one side of each second retaining wall structure 130 does not contact the first retaining wall structure 110.
In the embodiment, the closed channels CH1, CH2, and CH3 include straight strips, but the invention is not limited thereto. In other embodiments, the enclosed channels CH1, CH2, CH3 comprise undulations or serrations.
Based on the above, the present embodiment can reduce the loss of the first solution SLU1 and the second solution SLU2 during the manufacturing process, thereby reducing the manufacturing cost. In addition, in a general inkjet process, when ink droplets containing quantum dot materials impact a substrate, the quantum dot materials in the ink droplets are stressed to cause a problem of uneven distribution, which causes color shift of a display panel. However, the present embodiment avoids the aforementioned color shift problem by pushing the first solution SLU1 and the second solution SLU2 into the channel CH1 of the first part and the channel CH2 of the second part, respectively, by atmospheric pressure.
Fig. 9 to 11A are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention. Fig. 11B is a schematic sectional view taken along line d-d' of fig. 11A. It should be noted that the embodiment of fig. 9 to 11A follows the element numbers and part of the contents of the embodiment of fig. 1A to 8C, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
For convenience of explanation, fig. 9 to 11A omit the second element substrate 20.
Referring to fig. 9, after forming a plurality of first sealing materials 310 on the first opening O1 (as shown in fig. 5A to 5C) or after forming a plurality of second sealing materials 320 on the second opening O2 (as shown in fig. 8A to 8C), a plurality of third openings O3 are respectively formed on the third portion of the channel CH3 to open the third portion of the channel CH 3. In the embodiment, the third opening O3 and the first opening O1 face the same first direction S1, but the invention is not limited thereto. In other embodiments, the third opening O3 is oriented in the same second direction S2 as the second opening O2. In some embodiments, forming the third opening O3 includes a laser or other etching process. In some embodiments, the width W5 of the third opening O3 is greater than the width of the light emitting element 120 and less than or equal to the width of the sub-pixel.
Referring to fig. 10, the first retaining wall structure 110 is partially immersed in the third solution SLU3, the third opening O3 faces the third solution SLU3, and the third solution SLU3 enters the third portion channel CH3 from the third opening O3.
In the embodiment, the transparent optical material 140 (shown in fig. 1C) is not formed in the channel CH3 of the third portion, and therefore, the third solution SLU3 may directly contact and cover the light emitting element 120 in the channel CH3 of the third portion. In this embodiment, before partially immersing the first retaining wall structure 110 in the third solution SLU3, a vacuum process is performed to remove air in the channel CH3 of the third portion. After the first retaining wall structure 110 is partially immersed in the third solution SLU3, the vacuum is broken to allow atmospheric pressure to push the third solution SLU3 into the third opening O3.
In the present embodiment, the third solution SLU3 includes an organic solvent and quantum dot materials dispersed in the organic solvent, and the first solution SLU1 (shown in fig. 3 and 4), the second solution SLU2 (shown in fig. 6 and 7) and the third solution SLU3 include quantum dot materials with different colors. In other embodiments, the first, second and third solutions SLU1, SLU2, and SLU3 include organic light emitting materials, and the first, second, and third solutions SLU1, SLU2, and SLU3 include organic light emitting materials of different colors.
Referring to fig. 11A, the third solution SLU3 in the third portion of the channel CH3 is solidified to form a plurality of third color-converting materials CV 3. The first, second, and third color-converting materials CV1, CV2, CV3 are different colors, respectively. In some embodiments, the first, second, and third color conversion materials CV1, CV2, CV3 include red, green, and blue quantum dot materials, respectively.
A plurality of third encapsulating materials 330 is formed in the third opening O3 to close the channel CH3 of the third portion. By this, the display panel 2 is substantially completed. In the present embodiment, the third sealing material 330 is located between the first device substrate 10 and the second device substrate 20. The third sealing material 330 is, for example, a thermosetting polymer material or a photo-curing polymer material.
Fig. 12 to 13 are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention. It should be noted that the embodiment of fig. 12 to 13 follows the element numbers and part of the contents of the embodiment of fig. 1A to 8C, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein. For convenience of explanation, fig. 12 to 13 omit the second element substrate 20.
Referring to fig. 12, in the present embodiment, the channel CH2 of the second portion and the channel CH3 of the third portion are surrounded (laterally enclosed) by the first retaining wall structure 110, and the transparent optical material 140 is located in the channel CH2 of the second portion and the channel CH3 of the third portion.
In the present embodiment, one side of the channel CH1 of the first part has a first opening O1, respectively, and the other side thereof has a second opening O2, respectively. In other words, the first portion channel CH1 extends through the first wall structure 110.
In the present embodiment, the light emitting element 120a is located in the channel CH1 of the first portion and the channel CH2 of the second portion, and the light emitting element 120b is located in the channel CH3 of the third portion. In the present embodiment, the light emitting elements 120a and 120b include different colors. For example, the light emitting element 120a is a blue light emitting diode, and the light emitting element 120b is a green light emitting diode.
First retaining wall structure 110 is partially immersed in first solution SLU 1. In this embodiment, when the first retaining wall structure 110 is immersed in the first solution SLU1, the first opening O1 of the channel CH1 of the first portion faces downward and toward the first solution SLU 1. In this example, the first solution SLU1 was drawn into channel CH1 of the first section by capillary force.
Next, referring to fig. 13, the first solution SLU1 in the channel CH1 of the first portion is solidified to form a plurality of first color conversion materials CV 1. In some embodiments, the first color conversion material CV1 comprises a red quantum dot material, and the first color conversion material CV1 converts blue light emitted by a blue light emitting diode to red light.
A plurality of first sealing materials 310 are formed in the first opening O1, and a plurality of second sealing materials 320 are formed in the second opening O2 to seal the channel CH1 of the first portion. By this, the display panel 3 is substantially completed.
The first sealing material 310 and the second sealing material 320 are located between the first device substrate 10 and the second device substrate 20 (shown in fig. 2A to 2D). One side of the closed channel CH1 of the first part has a first opening O1 closed by the corresponding first sealing material 310, and the other side has a second opening 320 closed by the corresponding second sealing material 320.
Based on the above, since the first solution SLU1 enters only the first part channel CH1, but not the second part channel CH2 and the third part channel CH3, the loss of the first solution SLU1 in the process can be reduced, thereby reducing the manufacturing cost. In addition, in a general inkjet process, when ink droplets containing quantum dot materials impact a substrate, the quantum dot materials in the ink droplets are stressed to cause a problem of uneven distribution, which causes color shift of a display panel. However, this embodiment draws the first solution SLU1 into the channel CH1 of the first section by capillary force, avoiding the color shift problem described above.
Fig. 14A is a top view of a display panel according to an embodiment of the invention. Fig. 14B is a schematic sectional view taken along line a-a' of fig. 14A. Fig. 14C is a schematic sectional view taken along line b-b' of fig. 14A. It should be noted that the embodiment of fig. 12 to 13 follows the element numbers and part of the contents of the embodiment of fig. 1A to 8C, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
The main differences between the display panel 4 of fig. 14A to 14C and the display panel 1 of fig. 8A are: the light emitting elements 120 of the display panel 1 of fig. 8A are aligned with each other in the first arrangement direction D1, whereas the light emitting elements 120 of the display panel 4 of fig. 14 are arranged offset in the first arrangement direction D1.
Referring to fig. 14A to 14C, in the present embodiment, the sub-pixels of the display panel 4 are substantially hexagonal, thereby increasing the resolution.
In some embodiments, the height H1 of the first wall structure 110 is greater than or equal to the width W1 of the first wall structure 110. In some embodiments, the height H2 of the second barrier wall structure 130 is greater than or equal to the width W2 of the second barrier wall structure 130.
Fig. 15 is a top view of a display panel according to an embodiment of the invention. It should be noted that the embodiment of fig. 15 follows the element numbers and partial contents of the embodiment of fig. 1A to 8C, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
The main differences between the display panel 5 of fig. 15 and the display panel 1 of fig. 8A are: the channels CH1, CH2, and CH3 of the display panel 5 are zigzag.
Referring to fig. 15, in the present embodiment, the width W3 of the first opening O1 of the channel CH1 of the first portion is different from the width W4 of the second opening O2 of the channel CH2 of the second portion. For example, the width W3 of the first opening O1 of the channel CH1 of the first portion is greater than the width W4 of the second opening O2 of the channel CH2 of the second portion.
In the present embodiment, the width W3 of the first opening O1 and the width W4 of the second opening O2 are adjusted according to the viscosity of the first solution and the viscosity of the second solution. In the present embodiment, the viscosity of the first solution entering the first opening O1 is greater than that of the second solution entering the second opening O2, and therefore, the first opening O1 is designed to have a greater width W3 to facilitate the first solution entering the first opening O1. In this embodiment, the first solution in the first portion of the closed channel CH1 solidifies to form the first color conversion material CV1, and the second solution in the second portion of the closed channel CH2 solidifies to form the second color conversion material CV 2. The first color conversion material CV1 and the second color conversion material CV2 are, for example, a red quantum dot material and a green quantum dot material, respectively.
In the present embodiment, the first opening O1 faces the third direction S3, the second opening O1 faces the fourth direction S4, and the third direction S3 and the fourth direction S4 are different from the extending direction E1 of the channels CH1, CH2, and CH 3. Specifically, neither the third direction S3 nor the fourth direction S4 is parallel to the extending direction E1.
In summary, the embodiments of the present invention can reduce the loss of the quantum dot material in the process, thereby reducing the manufacturing cost.

Claims (15)

1. A display panel, comprising:
a first device substrate comprising:
a circuit substrate;
a first retaining wall structure located on the circuit substrate; and
a plurality of light emitting elements on the circuit substrate;
a second element substrate overlapping the first element substrate;
a plurality of first sealing materials located between the first component substrate and the second component substrate, wherein the first retaining wall structure contacts the second component substrate to define a plurality of closed channels between the first component substrate and the second component substrate, wherein one side of each of the closed channels of the first portion has a first opening closed by the corresponding first sealing material; and
a plurality of first color conversion materials located in the closed channels of the first portion.
2. The display panel of claim 1, wherein the second element substrate further comprises:
a carrier plate; and
and a black matrix on the carrier, wherein the first retaining wall structure contacts the black matrix.
3. The display panel of claim 1, wherein the first element substrate further comprises:
and a plurality of second retaining wall structures contacting the second element substrate and located in the closed channels, wherein the second retaining wall structures are located between the light-emitting elements, and at least one side of each second retaining wall structure is separated from the first retaining wall structure.
4. The display panel according to claim 1, wherein the height of the first retaining wall structure is greater than or equal to the width of the first retaining wall structure.
5. The display panel of claim 1, further comprising:
and a plurality of second sealing materials located between the first device substrate and the second device substrate, wherein the closed channels of the second portion each have a second opening, the first openings and the second openings face different directions, and the second openings of the closed channels of the second portion are respectively sealed by the corresponding second sealing materials.
6. The display panel of claim 5, further comprising:
a plurality of second color conversion materials located in the closed channels of the second portion, wherein the first color conversion materials and the second color conversion materials are respectively different colors.
7. The display panel of claim 5, further comprising:
and a plurality of transparent optical materials are positioned in the closed channels of the third part.
8. The display panel of claim 5, further comprising:
a plurality of third encapsulant material disposed between the first device substrate and the second device substrate, wherein the third portion of the plurality of closed channels each has a third opening, and wherein the third openings of the third portion of the plurality of closed channels are closed by the corresponding third encapsulant material; and
a plurality of third color conversion materials located in the closed channels of the third portion, wherein the first color conversion materials, the second color conversion materials and the third color conversion materials are respectively different colors.
9. The display panel of claim 1, further comprising:
and a plurality of second sealing materials positioned between the first element substrate and the second element substrate, wherein the other sides of the closed channels of the first part are respectively provided with a second opening closed by the corresponding second sealing materials.
10. The display panel of claim 1, wherein the closed channels comprise a straight stripe shape, a wave shape, or a zigzag shape.
11. A method of manufacturing a display panel, comprising:
providing a first device substrate, wherein the first device substrate comprises:
a circuit substrate;
a first retaining wall structure located on the circuit substrate; and
a plurality of light emitting elements on the circuit substrate;
overlapping a second element substrate on the first element substrate, wherein the first retaining wall structure contacts the second element substrate to define a plurality of channels between the first element substrate and the second element substrate, wherein at least one side of the channels of the first part is respectively provided with a first opening;
immersing the first retaining wall structure portion in a first solution, wherein the first solution enters the channels of the first portion from the first openings;
curing the first solution in the channels of the first portion to form a plurality of first color conversion materials; and
a plurality of first sealing materials are formed in the first openings to seal the channels of the first portion.
12. The manufacturing method according to claim 11, further comprising:
performing a vacuum process to remove air in the channels of the first portion before immersing the first retaining wall structure portion in a first solution; and
after the first retaining wall structure is partially immersed in a first solution, the vacuum is broken to allow atmospheric pressure to push the first solution into the first openings.
13. The method of claim 11, wherein the channels of the second portion each have a second opening, and the first openings and the second openings face in different directions.
14. The method of manufacturing of claim 13, further comprising, after closing the channels of the first portion:
immersing the first retaining wall structure portion in a second solution, wherein the second openings face the second solution, and the second solution enters the channels of the second portion from the second openings; and
curing the second solution in the channels of the second portion to form a plurality of second color conversion materials.
15. The manufacturing method of claim 14, further comprising:
forming a plurality of third openings in the channels of the third portion respectively to open the channels of the third portion;
immersing the first retaining wall structure portion in a third solution, wherein the third openings face the third solution, and the third solution enters the channels of the third portion from the third openings;
curing the third solution in the channels of the third portion to form a plurality of third color-converting materials; and
forming a plurality of third sealing materials in the third openings to seal the channels of the third portion.
CN202111652278.3A 2021-08-18 2021-12-30 Display panel and manufacturing method thereof Active CN114335294B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW110130456 2021-08-18
TW110130456A TWI773488B (en) 2021-08-18 2021-08-18 Display panel and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN114335294A true CN114335294A (en) 2022-04-12
CN114335294B CN114335294B (en) 2023-05-23

Family

ID=81018392

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111652278.3A Active CN114335294B (en) 2021-08-18 2021-12-30 Display panel and manufacturing method thereof

Country Status (2)

Country Link
CN (1) CN114335294B (en)
TW (1) TWI773488B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150261076A1 (en) * 2012-10-01 2015-09-17 Koninklijke Philips N.V. Wavelength converting element comprising ceramic capsule
US20190348480A1 (en) * 2018-05-09 2019-11-14 Au Optronics Corporation Display panel and electronic device comprising thereof
JP2020047852A (en) * 2018-09-20 2020-03-26 豊田合成株式会社 Light-emitting device
US20200119235A1 (en) * 2018-10-11 2020-04-16 Intel Corporation Laser printing of color converter devices on micro led display devices and methods
CN112133734A (en) * 2020-09-29 2020-12-25 湖北长江新型显示产业创新中心有限公司 Display panel and display device
CN112151567A (en) * 2019-06-28 2020-12-29 成都辰显光电有限公司 Display panel, display device and preparation method of display panel
WO2020258864A1 (en) * 2019-06-27 2020-12-30 成都辰显光电有限公司 Color conversion assembly and manufacturing method therefor, and display panel
US20210210558A1 (en) * 2020-01-03 2021-07-08 WuHan Tianma Micro-electronics Co., Ltd Display panel and display device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101241549B1 (en) * 2011-07-18 2013-03-11 엘지이노텍 주식회사 Optical member, display device having the same and method of fabricating the same
CN111952427B (en) * 2020-08-24 2022-05-06 深圳雷曼光电科技股份有限公司 Packaging method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150261076A1 (en) * 2012-10-01 2015-09-17 Koninklijke Philips N.V. Wavelength converting element comprising ceramic capsule
US20190348480A1 (en) * 2018-05-09 2019-11-14 Au Optronics Corporation Display panel and electronic device comprising thereof
JP2020047852A (en) * 2018-09-20 2020-03-26 豊田合成株式会社 Light-emitting device
US20200119235A1 (en) * 2018-10-11 2020-04-16 Intel Corporation Laser printing of color converter devices on micro led display devices and methods
WO2020258864A1 (en) * 2019-06-27 2020-12-30 成都辰显光电有限公司 Color conversion assembly and manufacturing method therefor, and display panel
CN112151567A (en) * 2019-06-28 2020-12-29 成都辰显光电有限公司 Display panel, display device and preparation method of display panel
US20210210558A1 (en) * 2020-01-03 2021-07-08 WuHan Tianma Micro-electronics Co., Ltd Display panel and display device
CN112133734A (en) * 2020-09-29 2020-12-25 湖北长江新型显示产业创新中心有限公司 Display panel and display device

Also Published As

Publication number Publication date
TW202309620A (en) 2023-03-01
CN114335294B (en) 2023-05-23
TWI773488B (en) 2022-08-01

Similar Documents

Publication Publication Date Title
JP6416854B2 (en) Organic light-emitting display device and method for manufacturing the same
CN111326562B (en) Quantum dot display panel and preparation method thereof
US6936856B2 (en) Multi substrate organic light emitting devices
CN111293152B (en) Display substrate, preparation method thereof and electroluminescent display device
CN108258012B (en) Electroluminescent display device
CN107331681B (en) Display substrate, manufacturing method thereof and display device
WO2010004865A1 (en) Organic el display and method for manufacturing same
US11817308B2 (en) Display panel and manufacturing method thereof
KR20180068560A (en) Organic Light Emitting Display Device
KR102147907B1 (en) Optoelectronic device formed with controlled vapor flow
US20210336100A1 (en) Display device and manufacturing method of display device
EP3799139B1 (en) Display device
CN109755413B (en) Display panel and preparation method thereof
KR20180101302A (en) Organic light emitting display device and manufacturing method for the device
US10381400B2 (en) Method of manufacturing light emitting device
KR20180014334A (en) Organic light emitting display device and manufacturing method for the device
CN111063708A (en) Color film substrate and preparation method thereof
JP2023505043A (en) Method of forming stretchable encapsulations for electronic displays
JP2023504394A (en) Extensible polymer and dielectric layers for electronic displays
CN111508998A (en) Organic light emitting display device and method of manufacturing the same
CN111063715B (en) Flexible display panel
CN113053967A (en) Display panel, preparation method thereof and display device
CN114335294B (en) Display panel and manufacturing method thereof
CN114122295B (en) Light emitting device
KR100567223B1 (en) A flat display device and a method for producting the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant