CN114447188B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN114447188B CN114447188B CN202210055322.0A CN202210055322A CN114447188B CN 114447188 B CN114447188 B CN 114447188B CN 202210055322 A CN202210055322 A CN 202210055322A CN 114447188 B CN114447188 B CN 114447188B
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- 239000002096 quantum dot Substances 0.000 claims abstract description 118
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000004806 packaging method and process Methods 0.000 claims abstract description 35
- 238000005538 encapsulation Methods 0.000 claims description 25
- 239000000565 sealant Substances 0.000 claims description 13
- 239000011358 absorbing material Substances 0.000 claims description 7
- 230000004308 accommodation Effects 0.000 description 33
- 239000000976 ink Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a display panel and a display device. The display panel comprises a driving substrate, a plurality of light emitting diodes, a packaging layer and a quantum dot part; a plurality of light emitting diodes are arranged on the driving substrate; the packaging layer covers the light emitting diodes, and the side of the packaging layer, which is far away from the driving substrate, is provided with accommodating grooves which are in one-to-one correspondence with the light emitting diodes; the quantum dot part is arranged in the accommodating groove, and the orthographic projection of the quantum dot part on the plane of the driving substrate is at least partially overlapped with the orthographic projection of the light emitting diode on the plane of the driving substrate. The application of the quantum dot in the direct display field is realized.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
The Mini Light-Emitting Diode (Mini led) display technology and the Micro led display technology are superior to the liquid crystal display technology and the organic Light-Emitting Diode technology in terms of brightness, lifetime, contrast, response time, energy consumption, visual angle, resolution, etc., and have advantages of self-luminescence, simple structure, small volume, energy saving, etc., and are gradually regarded as the next generation display technology, and have been paid attention to.
At present, the quantum dot is widely applied to Mini LED or micro LED backlight products due to the characteristic of improving the color gamut of the LED, such as application of a quantum dot film in a Mini LED or micro LED backlight structure. However, in the direct display field, quantum dots are difficult to directly combine with LEDs, thereby greatly limiting the application of quantum dots.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, so as to realize the application of quantum dots in the direct display field.
The embodiment of the application provides a display panel, which comprises:
a driving substrate;
a plurality of light emitting diodes disposed on the driving substrate;
the packaging layer is covered on the light emitting diode, and one side of the packaging layer, which is far away from the driving substrate, is provided with accommodating grooves which are in one-to-one correspondence with the light emitting diode; and
the quantum dot part is arranged in the accommodating groove, and the orthographic projection of the quantum dot part on the plane of the driving substrate and the orthographic projection of the light emitting diode on the plane of the driving substrate are at least partially overlapped.
Optionally, in some embodiments of the present application, a distance from a bottom of the accommodating groove to the light emitting diode is 10 μm to 50 μm.
Optionally, in some embodiments of the present application, the encapsulation layer is doped with a light absorbing material in a portion between adjacent ones of the quantum dot portions.
Optionally, in some embodiments of the present application, the light absorbing material is dispersed in the encapsulation layer, the accommodating groove exposes the light emitting diode, and the quantum dot portion is in contact with the light emitting diode.
Optionally, in some embodiments of the present application, an orthographic projection of a surface of the quantum dot portion, which is far away from the light emitting diode, on a plane of the driving substrate is located in an orthographic projection of the light emitting diode on the plane of the driving substrate.
Optionally, in some embodiments of the present application, a grooved area of the accommodating groove is greater than or equal to an orthographic projection area of the light emitting diode on a plane where the driving substrate is located.
Optionally, in some embodiments of the present application, the vertical cross-sectional shape of the accommodating groove is one or more of a semi-ellipse, a square, a positive trapezoid, and an inverted trapezoid.
Optionally, in some embodiments of the present application, the light emitting diode includes a red light emitting diode, a green light emitting diode, and a blue light emitting diode, the accommodating groove includes a first accommodating groove, a second accommodating groove, and a third accommodating groove, the quantum dot portion includes a red quantum dot portion, a green quantum dot portion, and a blue quantum dot portion, the red quantum dot portion is located in the first accommodating groove, the green quantum dot portion is located in the second accommodating groove, and the blue quantum dot portion is located in the third accommodating groove.
Optionally, in some embodiments of the present application, the display panel further includes a sealant and a packaging cover plate, where the sealant is disposed on a side of the packaging layer away from the driving substrate, and surrounds the packaging layer on a peripheral side of the packaging layer, and the packaging cover plate is disposed on a side of the sealant away from the driving substrate, and is attached to the sealant.
The application also provides a display device comprising the display panel according to any of the foregoing embodiments.
Compared with the display panel in the prior art, the display panel provided by the application is provided with the accommodating groove corresponding to the light-emitting diode in the packaging layer, and the quantum dot part is arranged in the accommodating groove. The orthographic projection of the quantum dot part on the plane of the driving substrate and the orthographic projection of the light emitting diode on the plane of the driving substrate are at least partially overlapped, so that light emitted by the light emitting diode can penetrate through the quantum dot part, the color gamut of the display panel is improved through the quantum dots in the quantum dot part, and the application of the quantum dots in the direct display field is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a display panel according to a first embodiment of the present application.
Fig. 2A to 2D are schematic structural views sequentially obtained from each step in the manufacturing method of the display panel shown in fig. 1.
Fig. 3 is a schematic structural diagram of a display panel according to a second embodiment of the present application.
Fig. 4 is a schematic structural diagram of a display panel according to a third embodiment of the present application.
Fig. 5 is a schematic structural diagram of a display panel according to a fourth embodiment of the present application.
Fig. 6 is a schematic structural diagram of a display panel according to a fifth embodiment of the present application.
Fig. 7A to 7E are schematic structural views sequentially obtained from steps in the manufacturing method of the display panel shown in fig. 6.
Fig. 8 is a schematic structural diagram of a display panel according to a sixth embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The application provides a display panel and a display device. The following will describe in detail.
The application provides a display panel, which comprises a driving substrate, a plurality of light emitting diodes, a packaging layer and a quantum dot part. The light emitting diodes are arranged on the driving substrate; the packaging layer covers the light emitting diodes, and one side of the packaging layer, which is far away from the driving substrate, is provided with accommodating grooves which are in one-to-one correspondence with the light emitting diodes; the quantum dot part is arranged in the accommodating groove, and the orthographic projection of the quantum dot part on the plane of the driving substrate and the orthographic projection of the light emitting diode on the plane of the driving substrate are at least partially overlapped.
Therefore, in the display panel provided by the application, the accommodating groove corresponding to the light emitting diode is formed in the packaging layer, and the quantum dot part is arranged in the accommodating groove, namely, the quantum dot is integrated in the packaging layer, so that the combination of the quantum dot and the light emitting diode is realized. The orthographic projection of the quantum dot part on the plane of the driving substrate and the orthographic projection of the light emitting diode on the plane of the driving substrate are at least partially overlapped, so that light emitted by the light emitting diode can penetrate through the quantum dot part, the color gamut of the display panel is improved through the quantum dots in the quantum dot part, and the application of the quantum dots in the direct display field is realized.
The display panel provided in the present application is described in detail below by way of specific embodiments. The following description of the embodiments is not intended to limit the preferred embodiments.
Referring to fig. 1, a first embodiment of the present application provides a display panel 100. The display panel 100 includes a driving substrate 10, a plurality of light emitting diodes 20, an encapsulation layer 30, and a quantum dot portion 40.
The driving substrate 10 is used for driving the light emitting diode 20 to emit light. The driving substrate 10 may include a thin film transistor, a pad, and other structures (not shown in the drawings), which are all related art and are not described herein.
The plurality of light emitting diodes 20 are disposed on the driving substrate 10. Specifically, the light emitting diode 20 may be a Mini LED or a Micro LED, and the type of the light emitting diode 20 is not particularly limited in this embodiment.
The light emitting diodes 20 include a red light emitting diode 21, a green light emitting diode 22, and a blue light emitting diode 23. A red light emitting diode 21, a green light emitting diode 22 and a blue light emitting diode 23 are sequentially arranged on the driving substrate 10 and constitute a repeating unit (not shown).
The encapsulation layer 30 covers the light emitting diode 20. Specifically, the encapsulation layer 30 covers the surface of the light emitting diode 20 away from the driving substrate 10, and is filled between two adjacent light emitting diodes 20. In this embodiment, the material of the encapsulation layer 30 may be a glue material with a water-oxygen barrier effect.
In the present embodiment, the side of the encapsulation layer 30 away from the driving substrate 10 is provided with the accommodating grooves 301 corresponding to the leds 20 one by one. Wherein, the vertical cross section shape of the accommodating groove 301 is a semi-ellipse. In the above arrangement, since the bottom surface of the accommodating groove 301 is an arc surface, when light emitted from the light emitting diode 20 enters the arc surface, an outgoing angle of light on the arc surface can be increased, so that outgoing uniformity of the display panel 100 can be improved. In some embodiments, the vertical cross-section of the accommodating groove 301 may be semicircular, or may be other shapes with irregular surfaces, such as a wave shape, which is not described herein.
Specifically, the accommodation groove 301 includes a first accommodation groove 3011, a second accommodation groove 3012, and a third accommodation groove 3013. The first accommodation groove 3011 is provided corresponding to the red light emitting diode 21. The second accommodation groove 3012 is provided corresponding to the green light emitting diode 22. The third accommodation groove 3013 is provided corresponding to the blue light emitting diode 23.
Further, the front projection of the groove wall of the accommodating groove 301 on the plane of the driving substrate 10 at least partially overlaps with the front projection of the light emitting diode 20 on the plane of the driving substrate 10. In the present embodiment, the orthographic projection of the groove wall of the accommodating groove 301 on the plane of the driving substrate 10 is located in the orthographic projection of the light emitting diode 20 on the plane of the driving substrate 10. Specifically, the orthographic projection of the groove wall of the first accommodating groove 3011 on the plane of the driving substrate 10 is located in the orthographic projection of the red light emitting diode 21 on the plane of the driving substrate 10. The orthographic projection of the groove wall of the second accommodating groove 3012 on the plane of the driving substrate 10 is located in the orthographic projection of the green light emitting diode 22 on the plane of the driving substrate 10. The orthographic projection of the groove wall of the third accommodating groove 3013 on the plane of the driving substrate 10 is located in the orthographic projection of the blue light emitting diode 23 on the plane of the driving substrate 10.
In the present embodiment, the distance L1 from the surface of the encapsulation layer 30 away from the driving substrate 10 to the light emitting diode 20 is 50 μm to 150 μm. In some embodiments, the distance L1 may be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm. The distance L2 from the bottom of the accommodating groove 301 to the light emitting diode 20 is 10 μm to 50 μm. In some embodiments, the distance L2 may be 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm.
In this embodiment, the shape and size of the first accommodation groove 3011, the second accommodation groove 3012, and the third accommodation groove 3013 are the same, that is, the shape and size of the accommodation groove 301 are described for the first accommodation groove 3011, the second accommodation groove 3012, and the third accommodation groove 3013. In some embodiments, the first accommodating groove 3011, the second accommodating groove 3012 and the third accommodating groove 3013 may be designed differently in shape and size according to practical application, which should not be construed as limiting the present application.
The quantum dot portion 40 is disposed in the accommodation groove 301. The quantum dot portion 40 includes a red quantum dot portion 41, a green quantum dot portion 42, and a blue quantum dot portion 43. The red quantum dot portion 41 is located in the first accommodation groove 3011. The green quantum dot part 42 is located in the second accommodation groove 3012. The blue quantum dot portion 43 is located in the third accommodation groove 3013. The front projection of the quantum dot portion 40 on the plane of the driving substrate 10 and the front projection of the light emitting diode 20 on the plane of the driving substrate 10 are at least partially overlapped, so that the light emitted by the light emitting diode 20 can be emitted through the quantum dot portion 40.
For display products that emit light by means of the light emitting diodes 20 of three colors of red, green and blue, the conventional design is usually a manner of packaging the light emitting diodes 20 and then preparing the quantum dot layer on the packaging layer 30, but the above manner has complex process and increases the process cost of the display product.
In the present embodiment, by integrating the quantum dot part 40 in the encapsulation layer 30, the process can be simplified while the bonding between the quantum dot and the light emitting diode 20 is achieved. Since the light emitted by the light emitting diode 20 can be emitted through the quantum dot portion 40, the color gamut of the display panel 100 can be improved by the quantum dots in the quantum dot portion 40, and thus the application of the quantum dots in the direct display field is realized.
Specifically, in the present embodiment, the red quantum dot portion 41 can generate red light with purer chromaticity under the excitation of the red light emitted by the red light emitting diode 21, the green quantum dot portion 42 can generate green light with purer chromaticity under the excitation of the green light emitted by the green light emitting diode 22, and the blue quantum dot portion 43 can generate blue light with purer chromaticity under the excitation of the blue light emitted by the blue light emitting diode 23, so that the color gamut of the display panel 100 is improved as a whole by improving the color purity of the red light, the green light, and the blue light.
In the present embodiment, the orthographic projection of the surface of the quantum dot portion 40 away from the light emitting diode 20 on the plane of the driving substrate 10 is located in the orthographic projection of the light emitting diode 20 on the plane of the driving substrate 10, and this arrangement increases the overlapping area of the quantum dot portion 40 and the light emitting diode 20, so as to increase the light efficiency of the light emitting diode 20. Specifically, the orthographic projection of the surface of the red quantum dot portion 41 away from the red light emitting diode 21 on the plane of the driving substrate 10 is located in the orthographic projection of the red light emitting diode 21 on the plane of the driving substrate 10. The orthographic projection of the surface of the green quantum dot portion 42 away from the green light emitting diode 22 on the plane of the driving substrate 10 is located in the orthographic projection of the green light emitting diode 22 on the plane of the driving substrate 10. The front projection of the surface of the blue quantum dot portion 43 away from the blue light emitting diode 23 on the plane of the driving substrate 10 is located in the front projection of the blue light emitting diode 23 on the plane of the driving substrate 10.
Referring to fig. 2A to 2D, a method for manufacturing the display panel 100 according to the present embodiment is described in detail below.
Step S11: a driving substrate 10 is provided, and a plurality of light emitting diodes 20 and an encapsulation layer 30 are sequentially formed on the driving substrate 10 as shown in fig. 2A.
The light emitting diodes 20 include a red light emitting diode 21, a green light emitting diode 22, and a blue light emitting diode 23.
Step S12: the encapsulation layer 30 is patterned to form a plurality of accommodating grooves 301, as shown in fig. 2B.
Specifically, the surface of the encapsulation layer 30 is treated by using a mold, so as to form a receiving groove 301 on a portion of the encapsulation layer 30 corresponding to each light emitting diode 20. The accommodating grooves 301 include a first accommodating groove 3011, a second accommodating groove 3012, and a third accommodating groove 3013. The first accommodation groove 3011 corresponds to the red light emitting diode 21. The second accommodation groove 3012 corresponds to the green light emitting diode 22. The third accommodation groove 3013 corresponds to the blue light emitting diode 23.
Step S13: the red quantum dot ink 41a is placed in the first accommodation groove 3011, the green quantum dot ink 42a is placed in the second accommodation groove 3012, and the blue quantum dot ink 43a is placed in the third accommodation groove 3013 using an inkjet printing process, as shown in fig. 2C.
Step S14: the red, green and blue quantum dot inks 41a, 42a and 43a are cured to form the red, green and blue quantum dot portions 41, 42 and 43, respectively, as shown in fig. 2D.
Specifically, the solution is left for a period of time until the quantum dot ink in the accommodating groove 301 is solidified and molded. Wherein, the red quantum dot ink 41a in the first accommodating groove 3011 is solidified to form a red quantum dot portion 41, the green quantum dot ink 42a in the second accommodating groove 3012 is solidified to form a green quantum dot portion 42, and the blue quantum dot ink 43a in the third accommodating groove 3013 is solidified to form a blue quantum dot portion 43.
Referring to fig. 3, a second embodiment of the present application provides a display panel 200. The display panel 200 provided in the second embodiment of the present application is different from the first embodiment in that: the vertical cross-sectional shape of the accommodation groove 301 is square.
Specifically, the slot area of the accommodating slot 301 is equal to the orthographic projection area of the bottom of the accommodating slot 301 on the plane of the driving substrate 10, which is equal to the orthographic projection area of the slot wall of the accommodating slot 301 on the plane of the driving substrate 10.
When the orthographic projection area of the groove wall of the accommodating groove 301 on the plane of the driving substrate 10 is fixed, the volume of the accommodating groove 301 can be increased in this embodiment, so that the accommodating amount of the quantum dot portion 40 in the accommodating groove 301 can be increased, and the utilization space of the accommodating groove 301 can be optimized.
Referring to fig. 4, a third embodiment of the present application provides a display panel 300. The display panel 300 provided in the third embodiment of the present application is different from the first embodiment in that: the vertical cross-sectional shape of the accommodation groove 301 is a regular trapezoid.
Specifically, an included angle formed between the groove wall of the accommodating groove 301 and the bottom of the accommodating groove 301 is an acute angle. Since the quantum dot portion 40 is formed by printing the quantum dot ink in the accommodation groove 301, the overflow of the quantum dot ink can be prevented in the above arrangement, and the utilization ratio of the material can be improved.
Further, in the present embodiment, the slot area of the accommodating groove 301 is equal to the orthographic projection area of the light emitting diode 20 on the plane of the driving substrate 10, and the orthographic projection area of the bottom of the accommodating groove 301 on the plane of the driving substrate 10 is larger than the orthographic projection area of the light emitting diode 20 on the plane of the driving substrate 10. The above arrangement allows the light emitted directly above the light emitting diode 20 to be emitted through the quantum dot portion 40, so that the light energy utilization rate of the light emitting diode 20 can be improved. In addition, the above arrangement can reduce the occupied space of the accommodating groove 301, so as to avoid influencing the packaging effect of the light emitting diode 20.
Referring to fig. 5, a fourth embodiment of the present application provides a display panel 400. The display panel 400 provided in the fourth embodiment of the present application is different from the first embodiment in that: the vertical cross-sectional shape of the receiving groove 301 is an inverted trapezoid.
Specifically, an included angle formed between the groove wall of the accommodating groove 301 and the bottom of the accommodating groove 301 is an obtuse angle.
Further, in the present embodiment, the slotting area of the accommodating groove 301 is larger than the orthographic projection area of the light emitting diode 20 on the plane of the driving substrate 10, and the orthographic projection area of the bottom of the accommodating groove 301 on the plane of the driving substrate 10 is equal to the orthographic projection area of the light emitting diode 20 on the plane of the driving substrate 10. The above arrangement can improve the exit angle of the light transmitted through the quantum dot portion 40 and reduce the occupied space of the accommodating groove 301, so as to avoid affecting the packaging effect of the light emitting diode 20.
Referring to fig. 6, a fifth embodiment of the present application provides a display panel 500. The display panel 500 provided in the fifth embodiment of the present application is different from the second embodiment in that: the encapsulation layer 30 is doped with a light absorbing material in portions between adjacent quantum dot portions 40.
The present embodiment can reduce the cross color probability of light emitted from two adjacent quantum dot portions 40. Specifically, the above arrangement can avoid cross color between the adjacent red quantum dot portion 41 and green quantum dot portion 42, between the green quantum dot portion 42 and blue quantum dot portion 43, and between the blue quantum dot portion 43 and red quantum dot portion 41, thereby being beneficial to improving the display quality of the display panel.
Further, in the present embodiment, the light absorbing material is dispersed in the encapsulation layer 30. The receiving groove 301 exposes the light emitting diode 20. The quantum dot portion 40 is in contact with the light emitting diode 20. The arrangement can avoid the light absorption material from affecting the light emitting of the light emitting diode 20, so that the cross color probability can be reduced on the premise of ensuring the light emitting effect of the light emitting diode 20.
Note that, the light absorbing material may be a material having a light absorbing effect, such as a black photoresist, and the specific type of the light absorbing material is not specifically limited in this embodiment.
Referring to fig. 7A to 7E, a method for manufacturing the display panel 500 according to the present embodiment is described in detail below.
Step S21: a driving substrate 10 is provided, and a plurality of light emitting diodes 20 and an encapsulation layer 30 are sequentially formed on the driving substrate 10 as shown in fig. 7A.
The light emitting diodes 20 include a red light emitting diode 21, a green light emitting diode 22, and a blue light emitting diode 23.
Step S22: the encapsulation layer 30 is patterned to form a plurality of accommodating grooves 301, and the bottoms of the accommodating grooves 301 cover the light emitting diodes 20, as shown in fig. 7B.
Specifically, the surface of the encapsulation layer 30 is treated by using a mold, so as to form a receiving groove 301 on a portion of the encapsulation layer 30 corresponding to each light emitting diode 20. The accommodating grooves 301 include a first accommodating groove 3011, a second accommodating groove 3012, and a third accommodating groove 3013. The first accommodation groove 3011 corresponds to the red light emitting diode 21. The second accommodation groove 3012 corresponds to the green light emitting diode 22. The third accommodation groove 3013 corresponds to the blue light emitting diode 23.
Step S23: the bottom of the accommodating groove 301 is thinned to expose the light emitting diode 20, as shown in fig. 7C.
Specifically, the entire surface of the patterned encapsulation layer 30 is subjected to plasma surface treatment, so that the encapsulation layer 30 is thinned, and the bottom of the accommodating groove 301 exposes the light emitting diode 20. The above arrangement can reduce the requirement for the molding accuracy of the die in step S22.
Step S24: the red quantum dot ink 41a is placed in the first accommodation groove 3011, the green quantum dot ink 42a is placed in the second accommodation groove 3012, and the blue quantum dot ink 43a is placed in the third accommodation groove 3013 using an inkjet printing process, as shown in fig. 7D.
Step S25: the red, green and blue quantum dot inks 41a, 42a and 43a are cured to form the red, green and blue quantum dot portions 41, 42 and 43, respectively, as shown in fig. 7E.
Specifically, the solution is left for a period of time until the quantum dot ink in the accommodating groove 301 is solidified and molded. Wherein, the red quantum dot ink 41a in the first accommodating groove 3011 is solidified to form a red quantum dot portion 41, the green quantum dot ink 42a in the second accommodating groove 3012 is solidified to form a green quantum dot portion 42, and the blue quantum dot ink 43a in the third accommodating groove 3013 is solidified to form a blue quantum dot portion 43.
Referring to fig. 8, a sixth embodiment of the present application provides a display panel 600. The display panel 600 provided in the sixth embodiment of the present application is different from the first embodiment in that: the display panel 600 further includes a sealant 50 and a packaging cover plate 60, wherein the sealant 50 is disposed on one side of the packaging layer 30 away from the driving substrate 10, and surrounds the packaging layer 30, and the packaging cover plate 60 is disposed on one side of the sealant 50 away from the driving substrate 10 and is attached to the sealant 50.
The sealant 50 is disposed on the upper surface of the encapsulation layer 30, and forms a wall structure. The encapsulation cover 60 is attached to a surface of the frame glue 50 away from the driving substrate 10.
In this embodiment, the frame glue 50 and the packaging cover plate 60 are disposed on the packaging layer 30, so that a good packaging effect can be achieved on the quantum dot portion 40, and the failure probability of the quantum dots in the quantum dot portion 40 is greatly reduced. In addition, by the arrangement of the frame glue 50 and the packaging cover plate 60, the quantum dot portion 40 and the light emitting diode 20 can be packaged at the same time, and thus the packaging requirement on the light emitting diode 20 can be reduced.
The application also provides a display device. The display device can be any product or component with a display function, such as electronic paper, a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. The display device includes a display panel, which may be the display panel described in any of the foregoing embodiments, and the specific structure of the display panel may refer to the description of any of the foregoing embodiments, which is not repeated herein.
The foregoing has described in detail a display panel and a display device provided by embodiments of the present application, and specific examples have been applied herein to illustrate the principles and embodiments of the present application, where the foregoing examples are provided to assist in understanding the methods and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (6)
1. A display panel, comprising:
a driving substrate;
a plurality of light emitting diodes disposed on the driving substrate;
the packaging layer is covered on the light emitting diode, and one side of the packaging layer, which is far away from the driving substrate, is provided with accommodating grooves which are in one-to-one correspondence with the light emitting diode; and
the quantum dot part is arranged in the accommodating groove, and the orthographic projection of the quantum dot part on the plane of the driving substrate and the orthographic projection of the light emitting diode on the plane of the driving substrate are at least partially overlapped;
the vertical section shape of the accommodating groove is a right trapezoid;
when the vertical section shape of the accommodating groove is a regular trapezoid, the grooving area of the accommodating groove is equal to the orthographic projection area of the light emitting diode on the plane of the driving substrate, and the orthographic projection area of the bottom of the accommodating groove on the plane of the driving substrate is larger than the orthographic projection area of the light emitting diode on the plane of the driving substrate;
the distance L1 from one surface of the encapsulation layer far away from the driving substrate to the light emitting diode is 50-150 mu m, and the distance from the bottom of the accommodating groove to the light emitting diode is 10-50 mu m.
2. The display panel of claim 1, wherein the encapsulation layer is doped with a light absorbing material in a portion between adjacent ones of the quantum dot portions.
3. The display panel of claim 1, wherein an orthographic projection of a side of the quantum dot portion away from the light emitting diode on the plane of the driving substrate is located in an orthographic projection of the light emitting diode on the plane of the driving substrate.
4. The display panel of claim 1, wherein the light emitting diodes comprise a red light emitting diode, a green light emitting diode, and a blue light emitting diode, the receiving slots comprise a first receiving slot, a second receiving slot, and a third receiving slot, the quantum dot portions comprise a red quantum dot portion, a green quantum dot portion, and a blue quantum dot portion, the red quantum dot portion is located in the first receiving slot, the green quantum dot portion is located in the second receiving slot, and the blue quantum dot portion is located in the third receiving slot.
5. The display panel of claim 1, further comprising a sealant and a packaging cover plate, wherein the sealant is disposed on a side of the packaging layer away from the driving substrate and surrounds the packaging layer, and the packaging cover plate is disposed on a side of the sealant away from the driving substrate and is attached to the sealant.
6. A display device comprising the display panel according to any one of claims 1 to 5.
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098697A (en) * | 2016-06-15 | 2016-11-09 | 深圳市华星光电技术有限公司 | Micro-LED display panel and preparation method thereof |
| CN108257949A (en) * | 2018-01-24 | 2018-07-06 | 福州大学 | Light efficiency extraction and color conversion micron order LED display and manufacturing method can be achieved |
| CN110288904A (en) * | 2019-06-28 | 2019-09-27 | 上海天马微电子有限公司 | Display panel and display device |
| CN111627951A (en) * | 2020-06-10 | 2020-09-04 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN111668249A (en) * | 2020-06-02 | 2020-09-15 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN112133718A (en) * | 2019-06-25 | 2020-12-25 | 成都辰显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN212934651U (en) * | 2020-09-07 | 2021-04-09 | 东莞市中麒光电技术有限公司 | Quantum dot LED display device |
| CN112863372A (en) * | 2019-11-27 | 2021-05-28 | 成都辰显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN214226913U (en) * | 2021-03-22 | 2021-09-17 | 滁州惠科光电科技有限公司 | Quantum dot display panel and display device |
| CN113745391A (en) * | 2021-08-26 | 2021-12-03 | 厦门天马微电子有限公司 | Display panel and display device |
| CN215418176U (en) * | 2021-04-29 | 2022-01-04 | 重庆康佳光电技术研究院有限公司 | Display panel and display device |
-
2022
- 2022-01-18 CN CN202210055322.0A patent/CN114447188B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098697A (en) * | 2016-06-15 | 2016-11-09 | 深圳市华星光电技术有限公司 | Micro-LED display panel and preparation method thereof |
| CN108257949A (en) * | 2018-01-24 | 2018-07-06 | 福州大学 | Light efficiency extraction and color conversion micron order LED display and manufacturing method can be achieved |
| CN112133718A (en) * | 2019-06-25 | 2020-12-25 | 成都辰显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN110288904A (en) * | 2019-06-28 | 2019-09-27 | 上海天马微电子有限公司 | Display panel and display device |
| CN112863372A (en) * | 2019-11-27 | 2021-05-28 | 成都辰显光电有限公司 | Display panel, display device and preparation method of display panel |
| CN111668249A (en) * | 2020-06-02 | 2020-09-15 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN111627951A (en) * | 2020-06-10 | 2020-09-04 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN212934651U (en) * | 2020-09-07 | 2021-04-09 | 东莞市中麒光电技术有限公司 | Quantum dot LED display device |
| CN214226913U (en) * | 2021-03-22 | 2021-09-17 | 滁州惠科光电科技有限公司 | Quantum dot display panel and display device |
| CN215418176U (en) * | 2021-04-29 | 2022-01-04 | 重庆康佳光电技术研究院有限公司 | Display panel and display device |
| CN113745391A (en) * | 2021-08-26 | 2021-12-03 | 厦门天马微电子有限公司 | Display panel and display device |
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|---|---|
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