CN114447188A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN114447188A CN114447188A CN202210055322.0A CN202210055322A CN114447188A CN 114447188 A CN114447188 A CN 114447188A CN 202210055322 A CN202210055322 A CN 202210055322A CN 114447188 A CN114447188 A CN 114447188A
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- display panel
- emitting diode
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- 239000002096 quantum dot Substances 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 238000005538 encapsulation Methods 0.000 claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- 239000000565 sealant Substances 0.000 claims description 11
- 239000011358 absorbing material Substances 0.000 claims description 9
- 239000000976 ink Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 11
- 230000004308 accommodation Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a display panel and a display device. The display panel comprises a driving substrate, a plurality of light emitting diodes, an encapsulation layer and a quantum dot part; the plurality of light emitting diodes are arranged on the driving substrate; the packaging layer covers the light emitting diodes, and accommodating grooves corresponding to the light emitting diodes one by one are formed in one side, away from the driving substrate, of the packaging layer; the quantum dot portion is arranged in the accommodating groove, and the orthographic projection of the quantum dot portion on the plane where the driving substrate is located is at least partially overlapped with the orthographic projection of the light-emitting diode on the plane where the driving substrate is located. The application realizes the application of the quantum dots in the direct display field.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
The Mini Light-Emitting Diode (MiniLED) display technology and the Micro Light-Emitting Diode (Micro led) display technology are superior to the liquid crystal display technology and the organic Light-Emitting Diode technology in terms of brightness, life, contrast, response time, energy consumption, viewing angle, resolution, and the like, have the advantages of self-luminescence, simple structure, small volume, energy saving, and the like, are gradually regarded as the next generation display technology, and have gained wide attention.
At present, quantum dots are widely applied to Mini LED or micro LED backlight products due to the characteristic that the color gamut of the LEDs can be improved, for example, the quantum dot film is applied to a Mini LED or micro LED backlight structure. However, in the direct display field, the quantum dots are difficult to be directly combined with the LED, and thus the application of the quantum dots is greatly limited.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, and aims to realize application of quantum dots in the field of direct display.
The embodiment of the application provides a display panel, it includes:
a drive substrate;
a plurality of light emitting diodes disposed on the driving substrate;
the packaging layer covers the light emitting diodes, and accommodating grooves which correspond to the light emitting diodes one by one are formed in one side, away from the driving substrate, of the packaging layer; and
and the quantum dot part is arranged in the accommodating groove, and the orthographic projection of the quantum dot part on the plane where the driving substrate is located is at least partially overlapped with the orthographic projection of the light-emitting diode on the plane where the driving substrate is located.
Optionally, in some embodiments of the present application, a distance from the bottom of the accommodating groove to the light emitting diode is 10 μm to 50 μm.
Optionally, in some embodiments of the present application, a portion of the encapsulation layer between adjacent quantum dot portions is doped with a light absorbing material.
Optionally, in some embodiments of the present application, the light absorbing material is dispersed in the encapsulation layer, the accommodating groove exposes the light emitting diode, and the quantum dot portion is in contact with the light emitting diode.
Optionally, in some embodiments of the present application, an orthogonal projection of one surface of the quantum dot portion, which is far away from the light emitting diode, on a plane where the driving substrate is located in an orthogonal projection of the light emitting diode on the plane where the driving substrate is located.
Optionally, in some embodiments of the present application, an area of the groove of the accommodating groove is greater than or equal to an area of an orthographic projection of the light emitting diode on a plane where the driving substrate is located.
Optionally, in some embodiments of the present application, the vertical cross-sectional shape of the receiving groove is one or more of a semi-ellipse, a square, a regular trapezoid, and an inverted trapezoid.
Optionally, in some embodiments of the present application, the light emitting diode includes a red light emitting diode, a green light emitting diode, and a blue light emitting diode, the accommodating grooves include a first accommodating groove, a second accommodating groove, and a third accommodating groove, the quantum dot portion includes a red quantum dot portion, a green quantum dot portion, and a blue quantum dot portion, the red quantum dot portion is located in the first accommodating groove, the green quantum dot portion is located in the second accommodating groove, and the blue quantum dot portion is located in the third accommodating groove.
Optionally, in some embodiments of the present application, the display panel further includes a frame adhesive and a package cover plate, the frame adhesive is disposed on one side of the package layer away from the driving substrate and surrounds the periphery of the package layer, and the package cover plate is disposed on one side of the frame adhesive away from the driving substrate and is attached to the frame adhesive.
The present application further provides a display device comprising the display panel according to any of the foregoing embodiments.
Compared with a display panel in the prior art, the display panel provided by the application is provided with the accommodating groove corresponding to the light-emitting diode in the packaging layer, and the quantum dot portion is arranged in the accommodating groove. Because the orthographic projection of the quantum dot part on the plane of the driving substrate is at least partially overlapped with the orthographic projection of the light-emitting diode on the plane of the driving substrate, the light emitted by the light-emitting diode can penetrate through the quantum dot part, so that the color gamut of the display panel is improved through the quantum dots in the quantum dot part, and the application of the quantum dots in the field of direct display is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to a first embodiment of the present application.
Fig. 2A to 2D are schematic structural diagrams sequentially obtained through steps in the manufacturing method of the display panel shown in fig. 1.
Fig. 3 is a schematic structural diagram of a display panel according to a second embodiment of the present application.
Fig. 4 is a schematic structural diagram of a display panel according to a third embodiment of the present application.
Fig. 5 is a schematic structural diagram of a display panel according to a fourth embodiment of the present application.
Fig. 6 is a schematic structural diagram of a display panel according to a fifth embodiment of the present application.
Fig. 7A to 7E are schematic structural views sequentially obtained in steps of the method for manufacturing the display panel shown in fig. 6.
Fig. 8 is a schematic structural diagram of a display panel according to a sixth embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The application provides a display panel and a display device. The following are detailed below.
The application provides a display panel, which comprises a driving substrate, a plurality of light emitting diodes, an encapsulation layer and a quantum dot part. The plurality of light emitting diodes are arranged on the driving substrate; the packaging layer covers the light-emitting diodes, and accommodating grooves which correspond to the light-emitting diodes one by one are formed in one side, away from the driving substrate, of the packaging layer; the quantum dot portion is arranged in the accommodating groove, and the orthographic projection of the quantum dot portion on the plane where the driving substrate is located is at least partially overlapped with the orthographic projection of the light-emitting diode on the plane where the driving substrate is located.
Therefore, in the display panel provided by the application, the accommodating groove corresponding to the light emitting diode is formed in the packaging layer, and the quantum dot portion is arranged in the accommodating groove, namely, the quantum dot is integrated in the packaging layer, so that the combination of the quantum dot and the light emitting diode is realized. Because the orthographic projection of the quantum dot part on the plane of the driving substrate is at least partially overlapped with the orthographic projection of the light-emitting diode on the plane of the driving substrate, the light emitted by the light-emitting diode can penetrate through the quantum dot part, so that the color gamut of the display panel is improved through the quantum dots in the quantum dot part, and the application of the quantum dots in the field of direct display is realized.
The display panel provided by the present application is explained in detail by specific embodiments below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1, a display panel 100 is provided in a first embodiment of the present application. The display panel 100 includes a driving substrate 10, a plurality of light emitting diodes 20, an encapsulation layer 30, and a quantum dot part 40.
The driving substrate 10 is used to drive the light emitting diodes 20 to emit light. The driving substrate 10 may include a thin film transistor, a pad, and other structures (not shown), and related technologies are all related art and are not described herein.
The plurality of light emitting diodes 20 are disposed on the driving substrate 10. Specifically, the light emitting diode 20 may be a Mini LED or a Micro LED, and the type of the light emitting diode 20 is not specifically limited in this embodiment.
The light emitting diodes 20 include a red light emitting diode 21, a green light emitting diode 22, and a blue light emitting diode 23. A red led 21, a green led 22 and a blue led 23 are sequentially arranged on the driving substrate 10 to form a repeating unit (not shown).
The encapsulation layer 30 covers the light emitting diode 20. Specifically, the encapsulation layer 30 covers the surface of the light emitting diode 20 away from the driving substrate 10, and is filled between two adjacent light emitting diodes 20. In the present embodiment, the material of the encapsulation layer 30 may be a glue material with a water and oxygen barrier effect.
In the present embodiment, the package layer 30 has accommodating grooves 301 corresponding to the light emitting diodes 20 on a side thereof away from the driving substrate 10. The vertical cross-sectional shape of the accommodating groove 301 is a semi-ellipse. Under the above arrangement, since the bottom surface of the accommodating groove 301 is an arc surface, when light emitted from the light emitting diode 20 enters the arc surface, the emitting angle of the light on the arc surface can be increased, and the uniformity of the emitted light from the display panel 100 can be improved. In some embodiments, the vertical cross-sectional shape of the receiving groove 301 may also be a semi-circle, or may also be other shapes with irregular surfaces, such as a wave shape, and the like, which are not described herein again.
Specifically, the receiving grooves 301 include first receiving grooves 3011, second receiving grooves 3012 and third receiving grooves 3013. The first receiving slot 3011 is disposed corresponding to the red led 21. The second receiving grooves 3012 are disposed corresponding to the green leds 22. The third receiving slot 3013 corresponds to the blue led 23.
Further, an orthogonal projection of the groove wall of the accommodating groove 301 on the plane where the driving substrate 10 is located and an orthogonal projection of the light emitting diode 20 on the plane where the driving substrate 10 is located are at least partially overlapped. In the present embodiment, an orthogonal projection of the groove wall of the accommodating groove 301 on the plane of the driving substrate 10 is located in an orthogonal projection of the light emitting diode 20 on the plane of the driving substrate 10. Specifically, an orthogonal projection of the groove wall of the first accommodating groove 3011 on the plane where the driving substrate 10 is located in an orthogonal projection of the red light emitting diode 21 on the plane where the driving substrate 10 is located. The orthogonal projection of the walls of the second receiving slot 3012 on the plane of the driving substrate 10 is located in the orthogonal projection of the green led 22 on the plane of the driving substrate 10. The orthogonal projection of the groove wall of the third receiving groove 3013 on the plane where the driving substrate 10 is located in the orthogonal projection of the blue light-emitting diode 23 on the plane where the driving substrate 10 is located.
In the present embodiment, the distance L1 between the side of the encapsulation layer 30 away from the driving substrate 10 and the light emitting diode 20 is 50 μm to 150 μm. In some embodiments, the distance L1 may be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm. The distance L2 from the bottom of the receiving groove 301 to the light emitting diode 20 is 10 μm to 50 μm. In some embodiments, the distance L2 may be 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm.
It should be noted that, in the embodiment, only the shapes and sizes of the first receiving grooves 3011, the second receiving grooves 3012 and the third receiving grooves 3013 are the same as each other for illustration, that is, the description of the shapes and sizes of the receiving grooves 301 in the embodiment is directed to the first receiving grooves 3011, the second receiving grooves 3012 and the third receiving grooves 3013 at the same time. In some embodiments, the first receiving grooves 3011, the second receiving grooves 3012 and the third receiving grooves 3013 may be designed differently in shape and size according to practical application, and this embodiment cannot be construed as a limitation to the present application.
The quantum dot portion 40 is disposed in the accommodating groove 301. The quantum dot section 40 includes a red quantum dot section 41, a green quantum dot section 42, and a blue quantum dot section 43. The red quantum dot portion 41 is located in the first accommodation slot 3011. The green quantum dot portions 42 are located in the second receiving slots 3012. The blue quantum dot portion 43 is located in the third receiving slot 3013. The orthogonal projection of the quantum dot portion 40 on the plane of the driving substrate 10 and the orthogonal projection of the light emitting diode 20 on the plane of the driving substrate 10 are at least partially overlapped, so that the light emitted by the light emitting diode 20 can be emitted through the quantum dot portion 40.
For a display product that simultaneously depends on the light emitting diodes 20 of three colors, red, green and blue, the existing design usually adopts a method of firstly completing the encapsulation on the light emitting diodes 20 and then preparing the quantum dot layer on the encapsulation layer 30, but the above method has a complicated process and increases the process cost of the display product.
In the present embodiment, by integrating the quantum dot portion 40 into the encapsulation layer 30, the process can be simplified while achieving the coupling between the quantum dot and the light emitting diode 20. Since the light emitted from the light emitting diode 20 can be emitted through the quantum dot portion 40, the color gamut of the display panel 100 can be improved by the quantum dots in the quantum dot portion 40, and thus, the application of the quantum dots in the direct display field is realized.
Specifically, in the present embodiment, the red quantum dot portion 41 can generate red light with relatively pure chromaticity under the excitation of red light emitted by the red light emitting diode 21, the green quantum dot portion 42 can generate green light with relatively pure chromaticity under the excitation of green light emitted by the green light emitting diode 22, and the blue quantum dot portion 43 can generate blue light with relatively pure chromaticity under the excitation of blue light emitted by the blue light emitting diode 23, so that the color gamut of the display panel 100 is improved as a whole by improving the color purities of red light, green light, and blue light.
In the present embodiment, the orthogonal projection of the surface of the quantum dot portion 40 away from the light emitting diode 20 on the plane of the driving substrate 10 is located in the orthogonal projection of the light emitting diode 20 on the plane of the driving substrate 10, and this arrangement increases the overlapping area between the quantum dot portion 40 and the light emitting diode 20, thereby increasing the light efficiency of the light emitting diode 20. Specifically, an orthogonal projection of the surface of the red quantum dot portion 41 away from the red light emitting diode 21 on the plane where the driving substrate 10 is located within an orthogonal projection of the red light emitting diode 21 on the plane where the driving substrate 10 is located. The orthographic projection of the face of the green quantum dot portion 42 away from the green light emitting diode 22 on the plane of the driving substrate 10 is located in the orthographic projection of the green light emitting diode 22 on the plane of the driving substrate 10. The orthographic projection of the surface of the blue quantum dot portion 43 far away from the blue light-emitting diode 23 on the plane of the driving substrate 10 is positioned in the orthographic projection of the blue light-emitting diode 23 on the plane of the driving substrate 10.
Referring to fig. 2A to fig. 2D, a method for manufacturing the display panel 100 according to the present embodiment is described in detail below.
Step S11: a driving substrate 10 is provided, and a plurality of light emitting diodes 20 and an encapsulation layer 30 are sequentially formed on the driving substrate 10, as shown in fig. 2A.
The light emitting diodes 20 include a red light emitting diode 21, a green light emitting diode 22, and a blue light emitting diode 23.
Step S12: the packaging layer 30 is patterned to form a plurality of receiving grooves 301, as shown in fig. 2B.
Specifically, the surface of the encapsulation layer 30 is processed by a mold, so as to form a receiving groove 301 on a portion of the encapsulation layer 30 corresponding to each light emitting diode 20. The receiving grooves 301 include first receiving grooves 3011, second receiving grooves 3012, and third receiving grooves 3013. The first receiving slot 3011 corresponds to the red led 21. The second receiving grooves 3012 correspond to the green light emitting diodes 22. The third receiving slot 3013 corresponds to the blue led 23.
Step S13: an inkjet printing process is adopted to place the red quantum dot ink 41a in the first accommodation groove 3011, the green quantum dot ink 42a in the second accommodation groove 3012, and the blue quantum dot ink 43a in the third accommodation groove 3013, as shown in fig. 2C.
Step S14: the red, green, and blue quantum dot inks 41a, 42a, and 43a are cured to form a red, green, and blue quantum dot section 41, 42, and 43, respectively, as shown in fig. 2D.
Specifically, the quantum dot ink is kept standing for a period of time until the quantum dot ink in the accommodating groove 301 is cured and molded. The red quantum dot ink 41a in the first receiving slot 3011 is cured to form a red quantum dot portion 41, the green quantum dot ink 42a in the second receiving slot 3012 is cured to form a green quantum dot portion 42, and the blue quantum dot ink 43a in the third receiving slot 3013 is cured to form a blue quantum dot portion 43.
Referring to fig. 3, a display panel 200 is provided according to a second embodiment of the present disclosure. The second embodiment of the present application provides a display panel 200 different from the first embodiment in that: the vertical cross-sectional shape of the accommodating groove 301 is square.
Specifically, the open slot area of the accommodating slot 301 is equal to the orthographic projection area of the bottom of the accommodating slot 301 on the plane where the driving substrate 10 is located, and is equal to the orthographic projection area of the slot wall of the accommodating slot 301 on the plane where the driving substrate 10 is located.
When the area of the forward projection of the groove wall of the accommodating groove 301 on the plane where the driving substrate 10 is located is constant, the volume of the accommodating groove 301 can be increased, and the accommodating amount of the quantum dot portion 40 in the accommodating groove 301 can be increased, so that the utilization space of the accommodating groove 301 can be optimized.
Referring to fig. 4, a display panel 300 is provided according to a third embodiment of the present disclosure. The third embodiment of the present application provides a display panel 300 different from the first embodiment in that: the vertical cross-sectional shape of the accommodation groove 301 is a regular trapezoid.
Specifically, an included angle formed between the groove wall of the accommodating groove 301 and the bottom of the accommodating groove 301 is an acute angle. Since the quantum dot portion 40 is formed by printing the quantum dot ink in the accommodating groove 301, in the above arrangement, the quantum dot ink can be prevented from overflowing, and the material utilization rate can be further improved.
Further, in the present embodiment, the open slot area of the accommodating slot 301 is equal to the forward projection area of the light emitting diode 20 on the plane of the driving substrate 10, and the forward projection area of the bottom of the accommodating slot 301 on the plane of the driving substrate 10 is larger than the forward projection area of the light emitting diode 20 on the plane of the driving substrate 10. The above arrangement enables light emitted from the light emitting diode 20 to be emitted through the quantum dot portion 40, thereby improving the light energy utilization efficiency of the light emitting diode 20. In addition, the above arrangement can also reduce the occupied space of the accommodating groove 301, so as to avoid the influence on the packaging effect of the light emitting diode 20.
Referring to fig. 5, a display panel 400 is provided according to a fourth embodiment of the present application. The fourth embodiment of the present application provides a display panel 400 different from the first embodiment in that: the vertical cross-sectional shape of the accommodation groove 301 is an inverted trapezoid.
Specifically, an included angle formed between the groove wall of the accommodating groove 301 and the bottom of the accommodating groove 301 is an obtuse angle.
Further, in the present embodiment, the open slot area of the accommodating slot 301 is larger than the forward projection area of the light emitting diode 20 on the plane of the driving substrate 10, and the forward projection area of the bottom of the accommodating slot 301 on the plane of the driving substrate 10 is equal to the forward projection area of the light emitting diode 20 on the plane of the driving substrate 10. The above arrangement can improve the outgoing angle of the light passing through the quantum dot portion 40, and at the same time, reduce the occupied space of the accommodating groove 301, so as to avoid the influence on the packaging effect of the light emitting diode 20.
Referring to fig. 6, a display panel 500 is provided in a fifth embodiment of the present application. The fifth embodiment of the present application provides a display panel 500 different from the second embodiment in that: the portion of the encapsulation layer 30 between adjacent quantum dot portions 40 is doped with a light absorbing material.
This embodiment can reduce the cross color probability of the light emitted from two adjacent quantum dot portions 40. Specifically, the above arrangement can avoid color crosstalk between the adjacent red quantum dot portion 41 and the green quantum dot portion 42, between the green quantum dot portion 42 and the blue quantum dot portion 43, and between the blue quantum dot portion 43 and the red quantum dot portion 41, thereby being beneficial to improving the display quality of the display panel.
Further, in this embodiment, the light absorbing material is dispersed in the encapsulation layer 30. The receiving groove 301 exposes the light emitting diode 20. The quantum dot portion 40 is in contact with the light emitting diode 20. The light-absorbing material can be prevented from influencing the light emitting of the light-emitting diode 20 by the arrangement, and the color mixing probability can be reduced on the premise of ensuring the light emitting effect of the light-emitting diode 20.
The light absorbing material may be a material having a light absorbing effect, such as a black photoresist, and the specific type of the light absorbing material is not particularly limited in this embodiment.
Referring to fig. 7A to 7E, a method for manufacturing the display panel 500 according to the present embodiment is described in detail below.
Step S21: a driving substrate 10 is provided, and a plurality of light emitting diodes 20 and an encapsulation layer 30 are sequentially formed on the driving substrate 10, as shown in fig. 7A.
The light emitting diodes 20 include a red light emitting diode 21, a green light emitting diode 22, and a blue light emitting diode 23.
Step S22: the packaging layer 30 is patterned to form a plurality of receiving grooves 301, and the bottom of the receiving grooves 301 cover the light emitting diodes 20, as shown in fig. 7B.
Specifically, the surface of the encapsulation layer 30 is processed by a mold, so as to form a receiving groove 301 on a portion of the encapsulation layer 30 corresponding to each light emitting diode 20. The receiving grooves 301 include first receiving grooves 3011, second receiving grooves 3012, and third receiving grooves 3013. The first receiving slot 3011 corresponds to the red led 21. The second receiving grooves 3012 correspond to the green light emitting diodes 22. The third receiving slot 3013 corresponds to the blue led 23.
Step S23: the bottom of the receiving cavity 301 is thinned to expose the light emitting diodes 20, as shown in fig. 7C.
Specifically, the patterned encapsulation layer 30 is subjected to a whole plasma surface treatment, so that the encapsulation layer 30 is thinned as a whole, and the bottom of the accommodating groove 301 is exposed out of the light emitting diode 20. The above arrangement can reduce the requirement for the mold forming accuracy in step S22.
Step S24: an inkjet printing process is adopted to place the red quantum dot ink 41a in the first accommodation groove 3011, the green quantum dot ink 42a in the second accommodation groove 3012, and the blue quantum dot ink 43a in the third accommodation groove 3013, as shown in fig. 7D.
Step S25: the red, green, and blue quantum dot inks 41a, 42a, and 43a are cured to form the red, green, and blue quantum dot sections 41, 42, and 43, respectively, as shown in fig. 7E.
Specifically, the quantum dot ink is kept standing for a period of time until the quantum dot ink in the accommodating groove 301 is cured and molded. The red quantum dot ink 41a in the first receiving slot 3011 is cured to form a red quantum dot portion 41, the green quantum dot ink 42a in the second receiving slot 3012 is cured to form a green quantum dot portion 42, and the blue quantum dot ink 43a in the third receiving slot 3013 is cured to form a blue quantum dot portion 43.
Referring to fig. 8, a display panel 600 is provided according to a sixth embodiment of the present application. The sixth embodiment of the present application provides a display panel 600 that is different from the first embodiment in that: the display panel 600 further includes a sealant 50 and a sealing cover plate 60, the sealant 50 is disposed on one side of the sealing layer 30 away from the driving substrate 10 and surrounds the periphery of the sealing layer 30, and the sealing cover plate 60 is disposed on one side of the sealant 50 away from the driving substrate 10 and is attached to the sealant 50.
The sealant 50 is disposed on the upper surface of the encapsulation layer 30, and forms a fence structure. The encapsulation cover plate 60 is attached to the surface of the sealant 50 away from the driving substrate 10.
In the present embodiment, the sealant 50 and the encapsulation cover plate 60 are disposed on the encapsulation layer 30, so that a good encapsulation effect can be performed on the quantum dot portion 40, and the failure probability of the quantum dots in the quantum dot portion 40 is greatly reduced. In addition, the sealant 50 and the encapsulating cover plate 60 are arranged to encapsulate the quantum dot portion 40 and the light emitting diode 20 at the same time, so that the encapsulating requirement for the light emitting diode 20 can be reduced.
The application also provides a display device. The display device can be any product or component with a display function, such as electronic paper, a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. The display device includes a display panel, the display panel may be the display panel according to any of the foregoing embodiments, and the specific structure of the display panel may refer to the description of any of the foregoing embodiments, which is not described herein again.
The display panel and the display device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are described herein by applying specific examples, and the description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display panel, comprising:
a drive substrate;
a plurality of light emitting diodes disposed on the driving substrate;
the packaging layer covers the light emitting diodes, and accommodating grooves which correspond to the light emitting diodes one by one are formed in one side, away from the driving substrate, of the packaging layer; and
and the quantum dot part is arranged in the accommodating groove, and the orthographic projection of the quantum dot part on the plane where the driving substrate is located is at least partially overlapped with the orthographic projection of the light-emitting diode on the plane where the driving substrate is located.
2. The display panel of claim 1, wherein the distance from the bottom of the receiving groove to the light emitting diode is 10 μm to 50 μm.
3. The display panel of claim 1, wherein the portion of the encapsulation layer between adjacent quantum dot portions is doped with a light absorbing material.
4. The display panel of claim 3, wherein the light absorbing material is dispersed in the encapsulation layer, the receiving groove exposes the light emitting diode, and the quantum dot portion is in contact with the light emitting diode.
5. The display panel according to claim 1, wherein an orthogonal projection of a surface of the quantum dot portion, which is away from the light emitting diode, on a plane of the driving substrate is located within an orthogonal projection of the light emitting diode on the plane of the driving substrate.
6. The display panel according to claim 5, wherein the groove area of the receiving groove is greater than or equal to an orthographic area of the light emitting diode on the plane of the driving substrate.
7. The display panel according to claim 5, wherein the vertical cross-sectional shape of the receiving groove is one or more of a semi-ellipse, a square, a regular trapezoid, and an inverted trapezoid.
8. The display panel of claim 1, wherein the light emitting diodes comprise red light emitting diodes, green light emitting diodes and blue light emitting diodes, the receiving grooves comprise a first receiving groove, a second receiving groove and a third receiving groove, the quantum dot portion comprises a red quantum dot portion, a green quantum dot portion and a blue quantum dot portion, the red quantum dot portion is located in the first receiving groove, the green quantum dot portion is located in the second receiving groove, and the blue quantum dot portion is located in the third receiving groove.
9. The display panel according to claim 1, further comprising a sealant disposed on a side of the encapsulation layer away from the driving substrate and surrounding the periphery of the encapsulation layer, and a packaging cover plate disposed on a side of the sealant away from the driving substrate and attached to the sealant.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
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