CN114038871A - Packaging method and packaging structure of display panel - Google Patents
Packaging method and packaging structure of display panel Download PDFInfo
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- CN114038871A CN114038871A CN202110596636.7A CN202110596636A CN114038871A CN 114038871 A CN114038871 A CN 114038871A CN 202110596636 A CN202110596636 A CN 202110596636A CN 114038871 A CN114038871 A CN 114038871A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 149
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000003292 glue Substances 0.000 claims abstract description 106
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 86
- 238000006243 chemical reaction Methods 0.000 claims description 70
- 238000005538 encapsulation Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 18
- 238000002955 isolation Methods 0.000 claims description 16
- 238000009792 diffusion process Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 5
- 239000002096 quantum dot Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 description 6
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- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
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- 230000005540 biological transmission Effects 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
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- 238000012986 modification Methods 0.000 description 2
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- 238000012536 packaging technology Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a packaging method and a packaging structure of a display panel. The packaging method comprises the following steps: providing a display back plate, wherein light-emitting devices are arranged on one side of the display back plate at intervals, and a light-emitting surface is arranged on the surface of one side, far away from the display back plate, of each light-emitting device; controlling the packaging glue solution to cover the surface of the display back plate with the light-emitting device, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution; and curing the packaging glue solution to form a packaging layer, and packaging the light-emitting device on the display back plate through the packaging layer. When the light-emitting device is packaged by the packaging method, the packaging glue solution is covered on the surface, provided with the light-emitting device, of the display back plate, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution, and the packaging glue solution can be prevented from covering the light-emitting surface while having better joint filling capacity based on the fluidity of the packaging glue solution, so that the packaging of the light-emitting device on the display back plate is completed by curing the packaging glue solution, and the packaging effect of the light-emitting device and the efficient light emitting of the light-emitting device are ensured.
Description
Technical Field
The present invention relates to the field of light emitting device packaging technologies, and in particular, to a packaging method and a packaging structure for a display panel.
Background
At present, Micro-Light Emitting diodes (Micro-LEDs) as a new generation display technology have the advantages of high brightness, high color gamut, high contrast, higher viewing angle display and the like, and have become a research focus at present, and various large display technology companies strive for the fear and the subsequent layout of Micro-LEDs, which have broad application prospects in the outdoor fields such as wearing, vehicle-mounted and the like.
It is known that the package of the light emitting device serves as a necessary process for supporting and protecting the light emitting device. When the light emitting device is a Micro-LED, the size of the light emitting device is reduced to the level less than or equal to 50 mu m, and the problem of high difficulty in packaging and filling caused by small pixel pitch and small gap is inevitable.
In order to promote the industrialization of Micro-LEDs, various large packaging manufacturers in the industry begin to actively arrange the packaging schemes and the industry chain, and the current results are very little. The big technologies have the difficulty that the technologies are difficult to overcome, such as: the plastic packaging (Molding) technology has the advantages of low penetration rate, hard damage, poor joint filling capability of a vacuum film, substandard precision of ink jet technology equipment and the like, and has urgent requirements on a novel packaging technology and a packaging scheme which meets the requirements of higher precision and high excellent joint filling capability.
Meanwhile, the above-mentioned packaging process in the prior art is difficult to strictly control the height distance between the packaging layer and the light emitting device, thereby affecting the light emitting penetration effect of the packaged light emitting device and causing the packaging structure to be difficult to realize the characteristic of high brightness.
Disclosure of Invention
In view of the foregoing disadvantages of the prior art, an object of the present application is to provide a method and a structure for packaging a display panel, which are used to solve the problems that the difficulty of filling the package of the light emitting device is high and the package structure is difficult to achieve high brightness in the prior art.
A packaging method of a display panel comprises the following steps:
providing a display back plate, wherein light-emitting devices are arranged on one side of the display back plate at intervals, and a light-emitting surface is arranged on the surface of one side, far away from the display back plate, of each light-emitting device;
controlling the packaging glue solution to cover the surface of the display back plate with the light-emitting device, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution;
and curing the packaging glue solution to form a packaging layer, and packaging the light-emitting device on the display back plate through the packaging layer.
When the light-emitting device is packaged by the packaging method, the packaging glue solution is covered on the surface, provided with the light-emitting device, of the display back plate, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution, and the packaging glue solution can be prevented from covering the light-emitting surface while having better joint filling capacity based on the fluidity of the packaging glue solution, so that the packaging of the light-emitting device on the display back plate is completed by curing the packaging glue solution, the packaging effect of the light-emitting device is ensured, and the high-efficiency light emitting of the light-emitting device is also ensured.
Optionally, the controlling the encapsulation glue solution to cover the surface of the display back plate with the light emitting device so that the light emitting surface is not lower than the liquid surface of the encapsulation glue solution includes: providing a container containing the packaging glue solution, and transferring the display back plate into the container so that the light emitting surface is not lower than the liquid surface of the packaging glue solution; or transferring the display back plate into a container, and injecting packaging glue solution into the container so that the light emergent surface is not lower than the liquid level of the packaging glue solution. The two modes can both realize the covering of the packaging glue solution on the display back plate, and a person skilled in the art can adopt any mode to implement according to actual requirements.
Optionally, curing the encapsulation glue to form an encapsulation layer includes: curing at least part of the packaging glue solution in the container to form a packaging layer, and then transferring the display back plate out of the container; or at least part of the packaging glue solution in the container is cured for the first time to form a semi-cured layer covering the surface of the display back plate, the display back plate is transferred to the outside of the container, and the semi-cured layer is cured for the second time to form a packaging layer; or transferring the display back plate to the outside of the container, adhering packaging glue solution to the surface of the display back plate, and curing at least part of the packaging glue solution to form a packaging layer. According to the difference of the viscosity and the curing performance of the packaging glue solution, any one of the curing modes can be selected to realize the packaging of the light-emitting device on the display back plate, for example, the packaging glue solution can be semi-cured in the container and then transferred to the outside of the container for complete curing, or the substrate can be directly transferred to the outside of the container for curing of the packaging glue solution, and the curing treatment outside the container is not influenced by the size of the container, so that the curing efficiency and the curing effect can be improved.
Optionally, before the step of controlling the encapsulation glue to cover the surface of the display backplane with the light emitting device, the encapsulation method further includes the following steps: and arranging a protection structure on one side of the light-emitting device with the light-emitting surface. The protection structure can prevent the pollution of the light-emitting surface of the light-emitting device in the moving process or the packaging process, thereby avoiding the influence of impurities on the visual effect, and meanwhile, the protection structure covers the light-emitting surface, thereby not influencing the flowing space of the packaging glue solution between the light-emitting devices.
Optionally, the protective structure includes a transparent support layer, an antireflection layer, and a transparent protective layer sequentially stacked in a direction away from the light exit surface. The above protective structure satisfies high penetration, high hardness, and low reflection characteristics. The transparent protective layer prevents the substrate from being scratched and polluted in the packaging and transportation processes; the anti-reflection layer has high hardness/low reflection property, and the display capability of the display screen is improved; the transparent supporting layer is used for improving the strength of the film and can be made of PMMA, TAC, PET, PC and other materials.
Optionally, the light emitting device is a plurality of blue light chips arranged at intervals, and the protection structure includes a light conversion structure. Because the protection structure comprises the light conversion structure, monochromatic light of at least one blue light chip can be converted into other color light such as red light, green light and the like through the light conversion structure, and therefore the display back plate can be a display back plate with multicolor light emitting, such as an RGB display back plate.
Optionally, the light conversion structure includes: the transparent substrate is arranged opposite to the display back plate; the light conversion units are arranged on one side of the transparent base material close to the light emitting devices, and the light conversion units and the light emitting devices are arranged in a one-to-one correspondence mode; and the optical isolation structure is arranged between the adjacent optical conversion units. The optical isolation structure is used for blocking mixed color between adjacent light conversion units, and the optical isolation structure can be black photoresist, white photoresist, transparent material doped with scattering material, transparent material coated with reflecting film or spacer (photo spacer).
Optionally, the light conversion unit includes a wavelength conversion material layer and a light diffusion layer, which are stacked, and the light diffusion layer is disposed on a side of the wavelength conversion material layer away from the light emitting device. The wavelength converting material in the wavelength converting material layer may be phosphor or Quantum Dots (QDs) for converting the light converted by the wavelength converting material layer in the light converting unit from a point light source to a larger area light source.
Optionally, the light conversion structure further includes a light-transmitting layer, at least a portion of the light-transmitting layer is disposed between the light conversion unit and the light-emitting device, and a surface of one side of the light-transmitting layer, which is far away from the light conversion unit, covers the light-emitting surface. In order to better prevent color mixing between adjacent light conversion units, the optical isolation structure in the light conversion structure is usually disposed to protrude from the light conversion units, and the light transmission layer is disposed between the light conversion units and the light emitting device, so as to flatten the light conversion units and the optical isolation structure, thereby facilitating installation on the light emitting surface of the display back plate.
Optionally, transferring the display backplane into a container, comprising: clamping the display back plate into a container; or an adsorption protection structure to transfer the display backplane into the container. By adopting any transfer mode, the display back plate can be simply and efficiently transferred to the container.
Optionally, a plurality of light emitting devices are fixedly arranged on the surface of the display back plate, an accommodating space is formed between adjacent light emitting devices, and in the step of covering the packaging glue solution on the surface of the display back plate with the light emitting devices, the packaging glue solution is kept standing so as to flow into each accommodating space. The packaging glue solution can fully flow by standing for a period of time, so that after the gaps between the light-emitting devices are completely filled, the curing treatment is carried out to improve the packaging effect.
Optionally, the pitch between adjacent light emitting devices is 3 to 50 μm. Because the surface of the display back plate with the light-emitting devices is covered with the packaging glue solution, better gap filling capacity can be realized based on the fluidity of the packaging glue solution, so that the light-emitting devices which are transferred on the display back plate in large quantity have the smaller space, and the packaging density is improved.
Optionally, the optical density of the encapsulation glue solution under 1 μm is greater than or equal to 1. The Optical Density (OD) range enables the encapsulation glue to have a lower reflectivity, thereby further ensuring the light-emitting efficiency of the light-emitting device.
Optionally, the viscosity of the encapsulation glue solution is less than or equal to 300 cp. The packaging glue solution meeting the viscosity range can have higher fluidity, so that better joint filling capability is realized.
Based on the same inventive concept, the present application also provides a display panel, including: a display backplane; the plurality of light emitting devices are arranged on one side of the display back plate at intervals; and the packaging layer is formed on one side of the display back plate close to the light-emitting device, and is obtained by adopting the packaging method.
The packaging structure is obtained by packaging the light-emitting device by adopting the packaging method, in the packaging method, the packaging glue solution is covered on the surface of the display back plate with the light-emitting device, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution, and the packaging glue solution is prevented from covering the light-emitting surface while having better filling capacity based on the fluidity of the packaging glue solution, so that the packaging of the light-emitting device on the display back plate is completed by curing the packaging glue solution, thereby not only ensuring the packaging effect of the light-emitting device, but also ensuring the high-efficiency light emission of the light-emitting device.
Drawings
Fig. 1 is a schematic cross-sectional view illustrating a substrate after a display backplate is provided in a packaging method of a display panel according to an embodiment of the present invention, wherein a light emitting device is fixedly disposed on a surface of the display backplate;
fig. 2 is a schematic cross-sectional view of the substrate after the protective structure is attached to the light-emitting surface of the light-emitting device shown in fig. 1;
FIG. 3 is a schematic diagram of a split cross-sectional structure of a protection structure and a display backplane, wherein the protection structure includes a light conversion structure;
FIG. 4 is a schematic view of another protection structure and a display backplane in a split cross-sectional configuration, wherein the protection structure includes a light conversion structure;
FIG. 5 is a schematic view of another protection structure and a display backplane in a split cross-sectional configuration, wherein the protection structure includes a light conversion structure;
FIG. 6 is a schematic cross-sectional view of the substrate after the display backplane of FIG. 2 has been transferred into a container;
FIG. 7 is a schematic cross-sectional view of a substrate after a package layer is formed by curing the package glue solution shown in FIG. 3; and
FIG. 8 is a schematic cross-sectional view of the substrate after the protective structure shown in FIG. 4 is removed.
Description of reference numerals:
10-a display backplane; 20-a light emitting device; 210-a light-emitting surface; 30-a protective structure; 40-packaging glue solution; 410-an encapsulation layer; 50-a container; 60-a transparent substrate; 70-a light conversion unit; 710-a layer of wavelength converting material; 720-light diffusion layer; 80-an optical isolation structure; 90-light transmitting layer.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
As described in the background art, the problems of the prior art that the difficulty of filling the package of the light emitting device is high and the package structure has difficulty in realizing high brightness are solved.
Based on this, the present invention intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The inventor of the present invention has studied the above problems and proposed a method for packaging a display panel, which comprises the steps of:
providing a display back plate, wherein light-emitting devices are arranged on one side of the display back plate at intervals, and a light-emitting surface is arranged on the surface of one side, far away from the display back plate, of each light-emitting device;
controlling the packaging glue solution to cover the surface of the display back plate with the light-emitting device, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution;
and curing the packaging glue solution to form a packaging layer, and packaging the light-emitting device on the display back plate through the packaging layer.
When the light-emitting device is packaged by the packaging method, the packaging glue solution is covered on the surface, provided with the light-emitting device, of the display back plate, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution, and the packaging glue solution can be prevented from covering the light-emitting surface while having better joint filling capacity based on the fluidity of the packaging glue solution, so that the packaging of the light-emitting device on the display back plate is completed by curing the packaging glue solution, the packaging effect of the light-emitting device is ensured, and the high-efficiency light emitting of the light-emitting device is also ensured.
Exemplary embodiments of a method of packaging a display panel provided according to the present application will be described in more detail below with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of these exemplary embodiments to those skilled in the art.
First, a display back plate 10 is provided, a side of the display back plate 10 is provided with light emitting devices 20 at intervals, and a side surface of the light emitting devices 20 away from the display back plate 10 is a light emitting surface 210, as shown in fig. 1. The light emitting device 20 may be fixed to the surface of the display back sheet 10 by mass transfer.
The Light Emitting device 20 may be of a conventional type in the art, such as a micro-Light Emitting Diode (micro-LED).
In some embodiments of the present invention, the display back plate 10 is a glass substrate or a Printed Circuit Board (PCB). But not limited to the above categories, those skilled in the art can reasonably select the display back plate 10 according to the prior art.
In some embodiments of the present invention, before the step of controlling the encapsulating glue 40 to cover the surface of the display backplane 10 having the light emitting devices 20, the encapsulating method further includes the following steps: the protection structure 30 is disposed on the light emitting surface 210, as shown in fig. 2.
The protection structure 30 can prevent the light emitting surface 210 of the light emitting device 20 from being contaminated during the moving process or the packaging process, thereby avoiding the influence of impurities on the visual effect, and meanwhile, the protection structure 30 does not influence the flowing space of the packaging glue solution 40 between the light emitting devices 20 because of covering the light emitting surface 210.
In the above embodiment, the protective structure 30 may include a transparent support layer, an antireflection layer, and a transparent protective layer sequentially stacked in a direction away from the light exit surface. The above protective structure satisfies high penetration, high hardness, and low reflection characteristics. The transparent protective layer prevents the substrate from being scratched and polluted in the packaging and transportation processes; the anti-reflection layer has high hardness/low reflection property, and the display capability of the display screen is improved; the transparent support layer is used to improve the strength of the film, and may be made of polymethyl methacrylate (PMMA), triacetate fiber (TAC), Polyethylene terephthalate (PET), Polycarbonate (PC), or other materials. However, the invention is not limited to the above categories, and those skilled in the art can reasonably select the protection structure 30 according to the prior art, and the protection structure 30 may also be a peelable protection structure, and the peelable protection structure is removed after the step of curing the encapsulation glue to form the encapsulation layer, so that the encapsulation step is simplified, and the protection structure 30 is disposed on the light emitting surface 210 of the light emitting device 20, so as to prevent the encapsulation glue 40 from being stained or coated on the light emitting surface 210 of the light emitting device, so as to avoid the influence on the light emitting effect. The step of removing the encapsulation adhesive layer on the light-emitting surface 210 after the encapsulation adhesive liquid 40 is stained or coated on the light-emitting surface 210 of the light-emitting device is omitted.
The protection structure 30 may be used to protect the light emitting surface 210 of the light emitting device 20 on the display back plate 10 emitting monochromatic light, and may also be used to protect the light emitting surface 210 of the light emitting device 20 on the display back plate 10 emitting multicolor light, and the display back plate emitting multicolor light may be an RGB display back plate.
In some embodiments of the present invention, the light emitting device 20 is a plurality of blue light emitting chips arranged at intervals, and the protection structure 30 includes a light conversion structure. Because the protection structure 30 includes a light conversion structure, monochromatic light of at least one blue light chip can be converted into other color light such as red and green, so that the display backplane can realize full-color display.
In the above embodiments, the light conversion structure may include a transparent substrate 60, a plurality of light conversion units 70, and an optical isolation structure 80, where the transparent substrate 60 is disposed opposite to the display backplane 10, the light conversion units 70 are disposed on one side of the transparent substrate 60 close to the light emitting devices, and each light conversion unit 70 is disposed in one-to-one correspondence with the light emitting device; the optical isolation structure 80 is disposed between the adjacent light conversion units 70, as shown in fig. 3 to 5.
The optical isolation structure 80 is used to block the color mixing between the adjacent light conversion units 70, and the optical isolation structure 80 may be a black photoresist, a white photoresist, a transparent material doped with a scattering material, a transparent material coated with a reflective film, or a spacer (photo spacer).
In the above-described embodiment, the light conversion unit 70 may include the wavelength conversion material layer 710 and the light diffusion layer 720 that are disposed in a stack, the light diffusion layer 720 being disposed on a side of the wavelength conversion material layer 710 away from the light emitting device, as shown in fig. 3 to 5.
The wavelength conversion material in the wavelength conversion material layer 710 may be phosphor or Quantum Dots (QDs) for changing the light source converted by the wavelength conversion material layer 710 in the light conversion unit 70 from a point light source to a larger area light source.
In the above embodiment, the light conversion structure may further include a light-transmitting layer 90, at least a portion of the light-transmitting layer 90 is disposed between the light conversion unit 70 and the light emitting device, and a side surface of the light-transmitting layer 90 away from the light conversion unit 70 covers the light-emitting surface, as shown in fig. 3 to 5.
In order to better prevent color mixing between adjacent light conversion units 70, the optical isolation structure 80 in the light conversion structure is usually disposed to protrude from the light conversion unit 70, and the light-transmitting layer 90 is disposed between the light conversion unit 70 and the light emitting device, so as to flatten each light conversion unit 70 and the optical isolation structure 80, thereby facilitating installation on the light emitting surface of the display backplane.
Illustratively, the protection structure includes a light conversion structure, the light conversion structure includes a transparent substrate 60, a plurality of light conversion units 70, an optical isolation structure 80 and a light transmission layer 90, the light conversion units 70 are disposed on one side of the transparent substrate 60 close to the light emitting device, and each light conversion unit 70 is disposed in one-to-one correspondence with the light emitting device, the optical isolation structure 80 is disposed between adjacent light conversion units 70, the light conversion unit 70 includes a wavelength conversion material layer 710 and a light diffusion layer 720, which are stacked, the light diffusion layer 720 is disposed on one side of the wavelength conversion material layer 710 away from the light emitting device, and the light transmission layer 90 is disposed between the light conversion unit 70 and the light emitting device, as shown in fig. 3.
In the above example, a light diffusion layer 720 may also be disposed between adjacent light conversion units 70 for amplifying the blue light source that is not converted by the wavelength conversion material layer 710, as shown in fig. 4.
In the above example, the light-transmitting layer 90 may simultaneously cover the light conversion unit 70 and the optical isolation structure 80 as a flat layer, as shown in fig. 5.
After the display back plate 10 is provided, the packaging glue solution 40 is controlled to cover the surface of the display back plate 10 with the light emitting device 20, so that the light emitting surface 210 is not lower than the liquid level of the packaging glue solution 40, as shown in fig. 6.
In order to cover the surface of the display back plate 10 having the light emitting device 20 with the encapsulating glue 40, in an embodiment of the present invention, a container 50 containing the encapsulating glue 40 is provided, and the display back plate 10 is transferred into the container 50, so that the light emitting surface 210 is not lower than the liquid level of the encapsulating glue 40, as shown in fig. 6.
In another embodiment of the present invention, the display back plate 10 is transferred to the container 50, and the encapsulation glue 40 is injected into the container 50, so that the light emitting surface 210 is not lower than the liquid level of the encapsulation glue 40.
The above embodiments can effectively adjust the height relationship between the light emitting surface 210 of the light emitting device 20 and the encapsulation glue 40, so that the light emitting surface 210 is not lower than the liquid level of the encapsulation glue 40.
In order to cover the surface of the display back plate 10 having the light emitting devices 20 with the encapsulating glue 40, in one embodiment of the present invention, the display back plate 10 is clamped into the container 50 to realize the transfer of the display back plate 10 into the container 50.
In another embodiment of the present invention, the display backplane 10 is transferred into a container 50 by adsorbing the protective structure 30.
Illustratively, the optical density of the encapsulating glue 40 is more than or equal to 1 at 1 μm. The Optical Density (OD) range enables the encapsulation glue 40 to have a lower reflectivity, thereby further ensuring the light-emitting efficiency of the light-emitting device 20.
Illustratively, the viscosity of the encapsulating glue solution 40 is less than or equal to 300 cp. The encapsulating glue solution 40 satisfying the above viscosity range can have a large fluidity, thereby realizing a good caulking capability.
In some embodiments of the present invention, a plurality of light emitting devices 20 are disposed on the surface of the display backplane 10, and a receiving space is formed between adjacent light emitting devices 20, and in the step of covering the surface of the display backplane 10 with the light emitting devices 20 with the encapsulating glue 40, the encapsulating glue 40 is left standing, so that the encapsulating glue 40 flows into each receiving space.
In the above embodiment, the encapsulation glue 40 can flow sufficiently by standing for a period of time or by other means such as driving the display panel to rotate, so that after the gap between the light emitting devices 20 is completely filled, the curing process is performed to improve the encapsulation effect.
The packaging method provided by the invention is more remarkable for a multi-partition Light distribution independent control Light Emitting Diode (U-LED) high pixel density (PPI) product, and the higher the PPI is, the smaller the interval is. Illustratively, the pitch between adjacent light emitting devices 20 is 3 to 50 μm. Because the surface of the display back plate 10 with the light-emitting devices 20 is covered by the packaging glue solution 40, better gap filling capability can be realized based on the fluidity of the packaging glue solution 40, so that the light-emitting devices 20 which are transferred on the display back plate 10 in a large amount have the smaller space, and the packaging density is improved.
After the encapsulation adhesive 40 is coated on the surface of the display back plate 10 having the light emitting device 20, the encapsulation adhesive 40 is cured to form an encapsulation layer 410, and the light emitting device 20 is encapsulated on the display back plate 10 through the encapsulation layer 410, as shown in fig. 7.
In one embodiment of the present invention, curing the encapsulation glue 40 to form the encapsulation layer 410 includes: at least a portion of the encapsulating glue 40 is cured in the container 50 to form an encapsulating layer 410, and then the display backplane 10 is transferred out of the container 50, as shown in fig. 8.
In another embodiment of the present invention, curing the encapsulation glue 40 to form the encapsulation layer 410 includes: and performing primary curing on at least part of the encapsulating glue solution 40 in the container 50 to form a semi-cured layer covering the surface of the display back plate 10, transferring the display back plate 10 to the outside of the container 50, and performing secondary curing on the semi-cured layer to form the encapsulating layer 410.
In another embodiment of the present invention, curing the encapsulation glue 40 to form the encapsulation layer 410 includes: the display back plate 10 is transferred out of the container 50, the packaging glue 40 is adhered to the surface of the display back plate 10, and at least part of the packaging glue 40 is cured to form the packaging layer 410.
According to the difference of the viscosity and the curing performance of the encapsulating glue solution 40, any one of the above curing modes can be selected to realize the encapsulation of the light emitting device 20 on the display back plate 10, for example, the encapsulating glue solution 40 can be semi-cured in the container 50 and then transferred to the outside of the container 50 to be completely cured, or the substrate can be directly transferred to the outside of the container 50 to be cured, and since the curing treatment outside the container 50 is not affected by the size of the container 50, the curing efficiency and the curing effect can be improved.
If the packaging method of the present invention includes the step of attaching the protection structure 30 to the light-emitting surface 210, after the step of curing the packaging glue solution 40 to form the packaging layer 410, the protection structure 30 may be removed to avoid the influence on the light-emitting effect.
It should be noted that the protection structure 30 may not be removed from the light emitting surface 210, and at this time, the protection structure 30 may include a transparent support layer, an anti-reflection layer and a transparent protection layer, which are sequentially stacked, so as to improve the light emitting efficiency through the anti-reflection layer; alternatively, the protection structure 30 may also be a light conversion structure for converting a blue light display backplane into an RGB display backplane.
Based on the same inventive concept, the present application also provides a display panel, including: a display backplane; a plurality of light emitting devices 20 spaced apart at one side of the display back plate 10; and an encapsulation layer 410 formed on a side of the display backplane close to the light emitting device, wherein the encapsulation layer is obtained by adopting the encapsulation method. For related effects, refer to related expressions of the encapsulation method, which are not described herein in detail.
Because the light emitting device 20 is packaged by the packaging method, in the packaging method, the packaging glue solution 40 is covered on the surface of the display back plate 10 with the light emitting device 20, so that the light emitting surface 210 is not lower than the liquid level of the packaging glue solution 40, and based on the fluidity of the packaging glue solution 40, the packaging glue solution 40 is prevented from covering the light emitting surface 210 while having better gap filling capability, so that the packaging glue solution 40 is cured to complete the packaging of the light emitting device 20 on the display back plate 10, thereby not only ensuring the packaging effect of the light emitting device 20, but also ensuring the high-efficiency light emitting of the light emitting device 20.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A method for packaging a display panel, comprising the steps of:
providing a display back plate, wherein light-emitting devices are arranged on one side of the display back plate at intervals, and the surface of one side, far away from the display back plate, of each light-emitting device is a light-emitting surface;
controlling a packaging glue solution to cover the surface of the display back plate, which is provided with the light-emitting device, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution;
and curing the packaging glue solution to form a packaging layer, and packaging the light-emitting device on the display back plate through the packaging layer.
2. The packaging method according to claim 1, wherein controlling the packaging glue solution to cover the surface of the display back plate having the light emitting device so that the light emitting surface is not lower than the liquid level of the packaging glue solution comprises:
providing a container containing the packaging glue solution, and transferring the display back plate into the container so that the light emitting surface is not lower than the liquid surface of the packaging glue solution; or
And transferring the display back plate into a container, and injecting the packaging glue solution into the container so that the light emitting surface is not lower than the liquid level of the packaging glue solution.
3. The packaging method according to claim 1 or 2, wherein before the step of controlling the packaging glue to cover the surface of the display backplane having the light emitting device, the packaging method further comprises the steps of:
and arranging a protection structure on one side of the light-emitting device, which is provided with the light-emitting surface.
4. The packaging method according to claim 3, wherein the protective structure comprises a transparent support layer, an antireflection layer, and a transparent protective layer sequentially stacked in a direction away from the light exit surface.
5. The packaging method according to claim 3, wherein the light emitting device is a plurality of blue light emitting chips arranged at intervals, and the protection structure comprises a light conversion structure.
6. The packaging method of claim 5, wherein the light conversion structure comprises:
the transparent substrate is arranged opposite to the display back plate;
the light conversion units are arranged on one side, close to the light emitting devices, of the transparent base material, and the light conversion units and the light emitting devices are arranged in a one-to-one correspondence mode;
and the optical isolation structure is arranged between the adjacent light conversion units.
7. The packaging method according to claim 6, wherein the light conversion unit includes a wavelength conversion material layer and a light diffusion layer that are stacked, the light diffusion layer being provided on a side of the quantum dot layer away from the light emitting device.
8. The packaging method according to claim 6, wherein the light conversion structure further comprises a light-transmitting layer, at least part of the light-transmitting layer is disposed between the light conversion unit and the light emitting device, and a surface of one side of the light-transmitting layer, which is away from the light conversion unit, covers the light-emitting surface.
9. The packaging method of claim 2, wherein transferring the display backplane into the container comprises:
clamping the display back plate into the container; or
Adsorbing the protective structure to transfer the display backplane into the container.
10. A display panel, comprising:
a display backplane;
the plurality of light emitting devices are arranged on one side of the display back plate at intervals;
an encapsulation layer formed on a side of the display backplane adjacent to the light emitting device, the encapsulation layer being obtained by the encapsulation method according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110596636.7A CN114038871A (en) | 2021-05-28 | 2021-05-28 | Packaging method and packaging structure of display panel |
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| CN202110596636.7A CN114038871A (en) | 2021-05-28 | 2021-05-28 | Packaging method and packaging structure of display panel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023208222A1 (en) * | 2022-04-29 | 2023-11-02 | 成都辰显光电有限公司 | Display panel and fabrication method therefor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023208222A1 (en) * | 2022-04-29 | 2023-11-02 | 成都辰显光电有限公司 | Display panel and fabrication method therefor |
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