WO2020232761A1 - 高导热线路板基材 - Google Patents

高导热线路板基材 Download PDF

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Publication number
WO2020232761A1
WO2020232761A1 PCT/CN2019/090479 CN2019090479W WO2020232761A1 WO 2020232761 A1 WO2020232761 A1 WO 2020232761A1 CN 2019090479 W CN2019090479 W CN 2019090479W WO 2020232761 A1 WO2020232761 A1 WO 2020232761A1
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layer
substrate
thermal conductivity
circuit board
substrate layer
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PCT/CN2019/090479
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English (en)
French (fr)
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程建文
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昆山欧贝达电子科技有限公司
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Publication of WO2020232761A1 publication Critical patent/WO2020232761A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details

Definitions

  • the utility model belongs to the technical field of printed circuit boards, in particular to a high thermal conductivity circuit board substrate.
  • circuit board area Due to the shrinkage of the circuit board area, its surface heat dissipation effect also deteriorates, resulting in that the heat generated by the components on the circuit board cannot be quickly dissipated, which affects the reliability of the circuit board and greatly affects the circuit board.
  • the working temperature rises sharply, which affects the normal operation of components. More seriously, circuit boards, especially multilayer boards, will experience undesirable phenomena such as interlayer blistering and faults, which directly lead to the failure of electronic products.
  • the main technical problem solved by the utility model is to provide a high thermal conductivity circuit board base material, which can effectively conduct heat and dissipate heat generated by the electronic components on the circuit board and improve the working performance of the circuit board.
  • a technical solution adopted by the present utility model is: a high thermal conductivity circuit board substrate, including a substrate layer, electronic components, a thermal conductivity layer and a heat dissipation layer;
  • the substrate layer has opposing upper and lower surfaces, a number of electronic components are fixed on the upper surface of the substrate layer, and a first heat conduction layer and a heat dissipation layer are sequentially arranged on the lower surface of the substrate layer.
  • the first heat conduction layer Located between the lower surface of the substrate layer and the heat dissipation layer;
  • a plurality of bumps are provided on the lower surface of the substrate layer, a plurality of blind holes are formed in the first heat-conducting layer, and the bumps are matched and clamped with the blind holes;
  • a second thermally conductive layer and a first insulating layer are sequentially coated between the adjacent electronic components, and the second thermally conductive layer is located between the first insulating layer and the upper surface of the substrate layer;
  • the two ends of the substrate layer are coated with a second insulating layer.
  • the heat dissipation layer is a honeycomb heat dissipation layer.
  • honeycomb heat dissipation layer is formed by arranging several regular hexagonal grids.
  • the plurality of bumps and the plurality of blind holes are respectively arranged in an array.
  • the cross section of the bump is circular, square, rhombus, triangle or hexagon
  • the cross section of the blind hole is circular, square, rhombus, triangle or hexagon.
  • the heat dissipation layer is made of aluminum alloy metal material.
  • first thermal conductive layer and the second thermal conductive layer are both polyimide thermal conductive layers.
  • first insulating layer and the second insulating layer are both epoxy resin layers.
  • the substrate layer is a ceramic substrate layer or an aluminum substrate layer.
  • the lower surface of the substrate layer of the present invention is sequentially provided with a first heat conduction layer and a heat dissipation layer, which can promptly transfer the heat generated by the electronic components to the heat dissipation layer through the first heat conduction layer and quickly volatilize away, avoiding the length of the electronic components on the substrate layer. Time is damaged by heat;
  • the lower surface of the substrate layer of the utility model is provided with a plurality of bumps, the first heat-conducting layer is formed with a plurality of blind holes, and the bumps and the blind holes are matched and clamped, which can increase the basic area of the heat-conducting layer and the substrate layer To facilitate the conduction of heat;
  • the second thermal conductive layer and the first insulating layer are coated between adjacent electronic components of the present invention.
  • the second thermal conductive layer further improves the volatilization of the heat generated by the electronic components.
  • the first insulating layer can ensure that the adjacent electronic components do not contact each other. Avoid short circuits.
  • Figure 1 is a schematic diagram of the structure of the utility model
  • a high thermal conductivity circuit board substrate as shown in FIG. 1, includes a substrate layer 1, an electronic component 2, a first thermal conductivity layer 3, and a heat dissipation layer 4;
  • the substrate layer 1 has opposite upper and lower surfaces, a number of electronic components 2 are fixed on the upper surface of the substrate layer 1, and the lower surface of the substrate layer 1 is sequentially provided with a first heat conducting layer 3 and a heat dissipation layer 4,
  • the first thermal conductive layer 3 is located between the lower surface of the substrate layer 1 and the heat dissipation layer 4;
  • a plurality of bumps 5 are provided on the lower surface of the substrate layer 1, a plurality of blind holes 6 are formed in the first thermally conductive layer 3, and the bumps 5 are matched and clamped with the blind holes 6;
  • a second thermally conductive layer 7 and a first insulating layer 8 are sequentially coated between the adjacent electronic components 2, and the second thermally conductive layer 7 is located between the first insulating layer 8 and the upper surface of the substrate layer 1. between;
  • the two ends of the substrate layer 1 are coated with a second insulating layer 9.
  • the heat dissipation layer 4 is a honeycomb heat dissipation layer.
  • the honeycomb heat dissipation layer is formed by arranging several regular hexagonal grids.
  • the plurality of bumps 5 and the plurality of blind holes 6 are respectively arranged in an array.
  • the cross section of the bump 5 is round, square, rhombus, triangle or hexagon
  • the cross section of the blind hole 6 is round, square, rhombus, triangle or hexagon.
  • the heat dissipation layer 4 is made of aluminum alloy metal material.
  • the first thermal conductive layer 3 and the second thermal conductive layer 7 are both polyimide thermal conductive layers.
  • the first insulating layer 8 and the second insulating layer 9 are both epoxy resin layers.
  • the substrate layer 1 is a ceramic substrate layer or an aluminum substrate layer.
  • the lower surface of the substrate layer of the present invention is sequentially provided with a first heat conduction layer and a heat dissipation layer, which can promptly transfer the heat generated by the electronic components to the heat dissipation layer through the first heat conduction layer and quickly volatilize away, avoiding the length of the electronic components on the substrate layer. Damaged by heat over time; multiple bumps are provided on the bottom surface of the substrate layer, and multiple blind holes are formed on the first thermal conductive layer. The bumps and the blind holes are matched and clamped, which can increase the basis of the thermal conductive layer and the substrate layer Area to facilitate the conduction of heat; a second thermal conductive layer and a first insulating layer are coated between adjacent electronic components. The second thermal conductive layer further improves the volatilization of the heat generated by the electronic components.
  • the first insulating layer can ensure the adjacent electronic components Do not touch each other to avoid short circuits.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种高导热线路板基材，包括基板层（1）、电子元件（2）、导热层（3, 7）和散热层（4）；所述基板层（1）具有相对的上表面和下表面，所述基板层（1）的上表面固定有若干电子元件（2），所述基板层（1）的下表面依次设置有第一导热层（3）和散热层（4），所述第一导热层（3）位于所述基板层（1）的下表面和所述散热层（4）之间；所述基板层（1）的下表面设有多个凸块（5），所述第一导热层（3）形成有多个盲孔（6），所述凸块（5）与所述盲孔（6）匹配卡接；相邻所述电子元件（2）之间依次涂布有第二导热层（7）和第一绝缘层（8），所述第二导热层（7）位于所述第一绝缘层（8）和所述基板层（1）的上表面之间；所述基板层（1）的两端涂布有第二绝缘层（9）。有效对线路板上的电子元件（2）所产生的热量进行导热散热，提高线路板的工作性能。

Description

高导热线路板基材 技术领域
本实用新型属于印刷电路板技术领域，特别是涉及一种高导热线路板基材。
背景技术
随着科技的发展，电子产品朝向轻薄小化的趋势发展。然而，电子产品核心部件的散热问题制约着轻薄小化的发展，特别线路板因轻薄小化的改变致使其散热面积大幅变小，其可靠性能问题也成为电子产品轻薄小化的制约因素。
因线路板面积的缩小，其表面散热效果也随着变差，导致线路板上的元器件所产生的热量不能快速地散发出去，影响线路板的可靠性能，使其大受影响，导致线路板工作温度大幅上升，影响元器件正常工作，更为严重地，线路板特别是多层板会出现层间起泡、断层等不良现象，直接导致电子产品失效。
实用新型内容
本实用新型主要解决的技术问题是提供一种高导热线路板基材，有效对线路板上的电子元件所产生的热量进行导热散热，提高线路板的工作性能。
为解决上述技术问题，本实用新型采用的一个技术方案是：一种高导热线路板基材，包括基板层、电子元件、导热层和散热层；
所述基板层具有相对的上表面和下表面，所述基板层的上表面固定有若干电子元件，所述基板层的下表面依次设置有第一导热层和散热层，所述第一导热层位于所述基板层的下表面和所述散热层之间；
所述基板层的下表面设有多个凸块，所述第一导热层形成有多个盲孔，所述凸块与所述盲孔匹配卡接；
相邻所述电子元件之间依次涂布有第二导热层和第一绝缘层，所述第二导热层位于所述第一绝缘层和所述基板层的上表面之间；
所述基板层的两端涂布有第二绝缘层。
所述散热层为蜂窝型散热层。
本实用新型为解决其技术问题所采用的进一步技术方案是：
进一步地说，所述蜂窝型散热层是由若干正六边形网格排布而成。
进一步地说，多个所述凸块和多个所述盲孔分别以阵列式排布。
进一步地说，所述凸块的截面为圆形、方形、菱形、三角形或六边形，所述盲孔的截面为圆形、方形、菱形、三角形或六边形。
进一步地说，所述散热层为铝合金金属材料制成。
进一步地说，所述第一导热层和所述第二导热层皆为聚酰亚胺导热层。
进一步地说，所述第一绝缘层和所述第二绝缘层皆为环氧树脂层。
进一步地说，所述基板层为陶瓷基板层或铝基板层。
本实用新型的有益效果：
本实用新型所述基板层的下表面依次设置有第一导热层和散热层，能够及时将电子元件产生的热量通过第一导热层传递到散热层快速挥发掉，避免基板层上的电子元件长时间受热损坏；
本实用新型基板层的下表面设有多个凸块，第一导热层形成有多个盲孔，所述凸块与所述盲孔匹配卡接，能够增大导热层与基板层的基础面积，便于热量的传导；
本实用新型相邻电子元件之间涂布有第二导热层和第一绝缘层，第二导热层进一步提高电子元件产生的热量的挥发，第一绝缘层能够保证相邻电子元件不相互接触，避免短路。
附图说明
图1是本实用新型的结构示意图；
附图中各部分标记如下：
基板层1、电子元件2、第一导热层3、散热层4、凸块5、盲孔6、第二导热层7、第一绝缘层8和第二绝缘层9。
具体实施方式
下面结合附图对本实用新型的较佳实施例进行详细阐述，以使本实用新型的优点和特征能更易于被本领域技术人员理解，从而对本实用新型的保护范围做出更为清楚明确的界定。
实施例：一种高导热线路板基材，如图1所示，包括基板层1、电子元件2、第一导热层3和散热层4；
所述基板层1具有相对的上表面和下表面，所述基板层1的上表面固定有若干电子元件2，所述基板层1的下表面依次设置有第一导热层3和散热层4，所述第一导热层3位于所述基板层1的下表面和所述散热层4之间；
所述基板层1的下表面设有多个凸块5，所述第一导热层3形成有多个盲孔6，所述凸块5与所述盲孔6匹配卡接；
相邻所述电子元件2之间依次涂布有第二导热层7和第一绝缘层8，所述第二导热层7位于所述第一绝缘层8和所述基板层1的上表面之间；
所述基板层1的两端涂布有第二绝缘层9。
所述散热层4为蜂窝型散热层。
所述蜂窝型散热层是由若干正六边形网格排布而成。
多个所述凸块5和多个所述盲孔6分别以阵列式排布。
所述凸块5的截面为圆形、方形、菱形、三角形或六边形，所述盲孔6的截面为圆形、方形、菱形、三角形或六边形。
所述散热层4为铝合金金属材料制成。
所述第一导热层3和所述第二导热层7皆为聚酰亚胺导热层。
所述第一绝缘层8和所述第二绝缘层9皆为环氧树脂层。
所述基板层1为陶瓷基板层或铝基板层。
本实用新型的工作原理如下：
本实用新型所述基板层的下表面依次设置有第一导热层和散热层，能够及时将电子元件产生的热量通过第一导热层传递到散热层快速挥发掉，避免基板层上的电子元件长时间受热损坏；基板层的下表面设有多个凸块，第一导热层形成有多个盲孔，所述凸块与所述盲孔匹配卡接，能够增大导热层与基板层的基础面积，便于热量的传导；相邻电子元件之间涂布有第二导热层和第一绝缘层，第二导热层进一步提高电子元件产生的热量的挥发，第一绝缘层能够保证相邻电子元件不相互接触，避免短路。
以上所述仅为本实用新型的实施例，并非因此限制本实用新型的专利范围， 凡是利用本实用新型说明书及附图内容所作的等效结构变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (8)

  1. 一种高导热线路板基材，其特征在于：包括基板层(1)、电子元件(2)、第一导热层(3)和散热层(4)；
    所述基板层具有相对的上表面和下表面，所述基板层的上表面固定有若干电子元件，所述基板层的下表面依次设置有第一导热层和散热层，所述第一导热层位于所述基板层的下表面和所述散热层之间；
    所述基板层的下表面设有多个凸块(5)，所述第一导热层形成有多个盲孔(6)，所述凸块与所述盲孔匹配卡接；
    相邻所述电子元件之间依次涂布有第二导热层(7)和第一绝缘层(8)，所述第二导热层位于所述第一绝缘层和所述基板层的上表面之间；
    所述基板层的两端涂布有第二绝缘层(9)。
    所述散热层为蜂窝型散热层。
  2. 根据权利要求1所述的高导热线路板基材，其特征在于：所述蜂窝型散热层是由若干正六边形网格排布而成。
  3. 根据权利要求1所述的高导热线路板基材，其特征在于：多个所述凸块和多个所述盲孔分别以阵列式排布。
  4. 根据权利要求1所述的高导热线路板基材，其特征在于：所述凸块的截面为圆形、方形、菱形、三角形或六边形，所述盲孔的截面为圆形、方形、菱形、三角形或六边形。
  5. 根据权利要求1所述的高导热线路板基材，其特征在于：所述散热层为铝合金金属材料制成。
  6. 根据权利要求1所述的高导热线路板基材，其特征在于：所述第一导热层和所述第二导热层皆为聚酰亚胺导热层。
  7. 根据权利要求1所述的高导热线路板基材，其特征在于：所述第一绝缘层和所述第二绝缘层皆为环氧树脂层。
  8. 根据权利要求1所述的高导热线路板基材，其特征在于：所述基板层为陶瓷基板层或铝基板层。
PCT/CN2019/090479 2019-05-22 2019-06-10 高导热线路板基材 WO2020232761A1 (zh)

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