WO2020230473A1 - 応力発光測定装置、応力発光測定方法および応力発光測定システム - Google Patents

応力発光測定装置、応力発光測定方法および応力発光測定システム Download PDF

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Publication number
WO2020230473A1
WO2020230473A1 PCT/JP2020/015557 JP2020015557W WO2020230473A1 WO 2020230473 A1 WO2020230473 A1 WO 2020230473A1 JP 2020015557 W JP2020015557 W JP 2020015557W WO 2020230473 A1 WO2020230473 A1 WO 2020230473A1
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WIPO (PCT)
Prior art keywords
holder
stress
sample
measuring device
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/015557
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English (en)
French (fr)
Japanese (ja)
Inventor
智生 篠山
利久 中川
智哉 津田
直継 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Clip Corp
Original Assignee
Shimadzu Corp
Yuasa System Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp, Yuasa System Co Ltd filed Critical Shimadzu Corp
Priority to JP2021519302A priority Critical patent/JPWO2020230473A1/ja
Priority to CN202080035888.6A priority patent/CN113825990A/zh
Publication of WO2020230473A1 publication Critical patent/WO2020230473A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/70—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light mechanically excited, e.g. triboluminescence

Definitions

  • the present disclosure relates to a mechanoluminescent measuring device, a mechanoluminescent measuring method, and a mechanoluminescent measuring system.
  • Patent Document 1 JP-A-2015-75477 discloses a mechanoluminescent evaluation device that measures and evaluates the mechanoluminescent intensity of a mechanoluminescent body.
  • a mechanoluminescence evaluation device is used to detect defects in a structure (for example, a large outdoor structure such as a building or a bridge) to which a load is randomly applied from the outside.
  • the stress-stimulated luminescence evaluation device shifts the stress-stimulated luminescent material to a light-emitting state by irradiating the stress-luminescent body arranged on the surface of the sample structure with pulsed light.
  • an imaging device is used as a detection unit that detects the luminescence intensity due to the load applied to the stress luminescent material.
  • the shape of the object changes freely when stress is applied to the object. Therefore, the shape of the stress-stimulated luminescent material arranged on the surface of such an object can be freely changed according to the applied stress.
  • the shape of the central portion of the bending of the object changes significantly, so that the shape of the stress-stimulated luminescent material arranged in the portion also changes significantly. Therefore, there arises a problem that it is difficult for the image pickup device to capture the mechanoluminescence at the central portion of the bending of the object.
  • the present disclosure has been made to solve such a problem, and an object thereof is a mechanoluminescent measuring device, a mechanoluminescent measuring device, which can capture the mechanoluminescence of a mechanoluminescent body when a flexible object is bent. It is to provide a luminescence measurement method and a mechanoluminescence measurement system.
  • the mechanoluminescent measuring device is a mechanoluminescent measuring device that measures the mechanoluminescence of a stress luminescent material.
  • the stress-stimulated luminescent material is arranged in at least a predetermined region of the flexible sample.
  • the stress luminescence measuring device moves a holder configured to support a sample, a light source configured to irradiate a stress luminescent material with excitation light, and a holder from a first holder state to a second holder state.
  • the sample is provided with a first driver configured to bend the sample at a predetermined bending angle.
  • the first holder state corresponds to the first bending state in which the bending angle of the sample is less than a predetermined bending angle
  • the second holder state corresponds to the second bending in which the bending angle of the sample is a predetermined bending angle.
  • the stress-stimulated luminescence measuring device further includes a camera configured to image the luminescence of the stress-stimulated luminescent material at a predetermined bending angle.
  • FIG. 1 is a block diagram showing an overall configuration of the stress luminescence measuring device according to the embodiment.
  • the stress luminescence measuring device 100 according to the present embodiment is a device that measures the stress applied to an object having flexibility by utilizing the luminescence phenomenon of the stress luminescent material.
  • the mechanoluminescence measuring device 100 can be used to test the durability of an object against stress.
  • the stress luminescence measuring device 100 is also simply referred to as "device 100".
  • the object having flexibility is, for example, a flexible sheet or a flexible fiber.
  • the object is formed of glass, resin, or the like.
  • the flexible sheet can form, for example, a part of a flexible display or a wearable device of a communication terminal such as a smartphone or a tablet.
  • the flexible fiber can form, for example, a part of an optical fiber cable.
  • the object is a rectangular flexible sheet, and has a first surface Sa and a second surface Sb opposite to the first surface Sa.
  • a predetermined region of the first surface Sa of the object to be measured (hereinafter, also simply referred to as “sample”) S is covered with a mechanoluminescent film made of a stress-stimulated luminescent material.
  • the "predetermined region” can be set to include the central portion of bending of the object when bending stress is applied.
  • the stress luminescent material is a material that emits light by a mechanical stimulus from the outside, and conventionally known materials can be used.
  • the stress-stimulated luminescent material has a property of emitting light by deformation energy applied from the outside, and its emission intensity changes according to the deformation energy.
  • the stress luminescent material includes, for example, a substance selected from the group consisting of strontium aluminate, zinc sulfide, barium titanate, silicate and phosphate.
  • the luminescent film can be formed, for example, by applying a resin material containing a stress-stimulated luminescent material to a predetermined region of the first surface Sa of the object to be sample S and drying it.
  • a method for forming the light emitting film a spray method, screen printing, or the like can be used.
  • the stress luminescent material is brought into an excited state by irradiating the light emitting film with excitation light.
  • bending stress is applied to the object.
  • compressive stress is applied to the first surface Sa and tensile stress is applied to the second surface Sb.
  • compressive stress is applied to the second surface Sb and tensile stress is applied to the first surface Sa.
  • the device 100 shown in FIG. 1 has a "stress application mechanism" for applying bending stress to the sample S.
  • stress application mechanism When bending stress is applied by the stress application mechanism, stress is also applied to the light emitting film covering the first surface Sa of the sample S, so that the stress luminescent material contained in the light emitting film emits light.
  • the device 100 is configured to measure the light emitting state of the stress-stimulated luminescent material at least when bending stress is applied.
  • the apparatus 100 includes a holder 10 that supports the sample S, a light source 30, a camera 40, a first driver 20, a second driver 42, and a third driver 32. , And a controller 50.
  • the holder 10 is configured to support the sample S by contacting at least two points of the sample S.
  • the holder 10 is configured to support the first end S1 and the second end S2 of the sample S that face each other.
  • the first driver 20 is connected to the holder 10 and moves the holder 10 between the "first holder position (first holder state)" and the "second holder position (second holder state)". As a result, the distance between the first end portion S1 and the second end portion S2 can be expanded and contracted.
  • the first driver 20 has an actuator 21 that is connected to the holder 10 and reciprocates the second end S1 of the sample S.
  • the actuator 21 is, for example, a cylinder.
  • the sample S can be bent by reducing the distance between the first end portion S1 and the second end portion S2 by the first driver 20 and the holder 10. Further, the sample S can be extended by extending the distance between the first end portion S1 and the second end portion S2 by the first driver 20 and the holder 10.
  • the holder 10 and the first driver 20 form a "stress application mechanism".
  • FIG. 2 is a perspective view of the holder 10.
  • FIG. 3 is a side view of the holder 10.
  • the holder 10 includes a frame 1, a fixed wall 2, a moving wall 3, mounting portions 5 and 6, holding plates 7 and 8, hinges 9, leaf springs 12, and connecting portions. It has 13, a rail 14, sliders 15A and 15B, bars 16 and 17, brackets 18, and top plates 22 and 23.
  • the frame 1 has a box shape with each surface open.
  • the width direction is the X-axis direction
  • the depth direction is the Y-axis direction
  • the height direction is the Z-axis direction.
  • the fixed wall 2 and the moving wall 3 are installed inside the frame 1 so as to face each other in the X-axis direction.
  • the fixed wall 2 is arranged close to the first side 1A extending in the Y-axis direction of the frame 1, and the moving wall 3 is arranged with the first side 1A.
  • the fixed wall 2 is fixed to the frame 1.
  • the moving wall 3 is configured to be able to move closer to or away from the fixed wall 2 by receiving an external force from the first driver 20 (see FIG. 1).
  • rails 14 are installed on each of the third side 1C and the fourth side 1D extending in the X-axis direction.
  • Two sliders 15A and 15B are movably assembled on each rail 14.
  • the first slider 15A is installed between the fixed wall 2 and the first side 1A of the frame 1.
  • the second slider 15B is installed between the moving wall 3 and the second side 1B of the frame 1.
  • a bar 16 is connected between the first slider 15A on the third side 1C of the frame 1 and the first slider 15A on the fourth side 1D.
  • the bar 16 is connected to the fixed wall 2.
  • the bracket 18 is arranged so as to extend from both ends of the bar 16 in the Y-axis direction toward the frame 1.
  • the first end of the bracket 18 in the Y-axis direction is fixed to the bar 16, and the second end is fixed to the frame 1.
  • the first slider 15 is fixed to the rail 14, so that the fixing wall 2 can be fixed to the frame 1.
  • a bar 17 is connected between the second slider 15B on the third side 1C of the frame 1 and the second slider 15B on the fourth side 1D.
  • the bar 17 is connected to the moving wall 3. Since the bar 17 is not fixed to the frame 1, the second slider 15B can move on the rail 14. As a result, the moving wall 3 can be moved relative to the fixed wall 2 in the X-axis direction.
  • the downward hanging 3a of the moving wall 3 is provided with a connecting portion 13 for connecting the first driver 20 (see FIG. 1).
  • the first driver 20 has an actuator 21.
  • the actuator 21 is, for example, a cylinder. By reciprocating the piston in the cylinder along the X-axis direction, the moving wall 3 can be brought closer to the fixed wall 2 or the moving wall 3 can be moved away from the fixed wall 2.
  • a top plate 22 is attached to the upper end of the fixed wall 2 in the Z-axis direction.
  • the top plate 22 extends perpendicular to the fixed wall 2.
  • the mounting portion 5 is rotatably connected to the top plate 22 by a hinge 9.
  • the mounting portion 5 is configured to be rotatable between a position horizontal to the top plate 22 and a position perpendicular to the top plate 22 in conjunction with the movement of the moving wall 3. ..
  • the presser plate 7 is detachably configured with respect to the mounting portion 5. By mounting the presser plate 7 to the mounting portion 6 with the first end portion S1 of the sample S sandwiched between the mounting portion 5 and the pressing plate 7, the mounting portion 5 becomes the first end portion of the sample S. S1 can be gripped.
  • the mounting portion 5 and the holding plate 7 correspond to one embodiment of the “first gripper”.
  • the first end portion S1 may be fixed to the mounting portion 5 by using an adhesive tape or the like.
  • a top plate 23 is attached to the upper end of the moving wall 3 in the Z-axis direction.
  • the top plate 23 extends perpendicular to the moving wall 3.
  • the mounting portion 6 is rotatably connected to the top plate 23 by a hinge 9.
  • the mounting portion 6 is configured to be rotatable between a position horizontal to the top plate 23 and a position perpendicular to the top plate 23 in conjunction with the movement of the moving wall 3. ..
  • the presser plate 8 is detachably configured with respect to the mounting portion 6. By mounting the presser plate 8 to the mounting portion 6 with the second end portion S2 of the sample S sandwiched between the mounting portion 6 and the pressing plate 8, the mounting portion 6 becomes the second end portion of the sample S. S2 can be gripped.
  • the mounting portion 6 and the holding plate 8 correspond to one embodiment of the “second gripper”. Instead of the pressing plate 8, the second end portion S2 may be fixed to the mounting portion 6 by using an adhesive tape or the like.
  • FIG. 3 shows the state of the gripper and the sample S when the moving wall 3 is moved so as to approach the fixed wall 2 in three stages.
  • the position X1 indicates the position of the moving wall 3 in the X-axis direction when the sample S is extended
  • the positions X2 and X3 indicate the position of the moving wall 3 in the X-axis direction when the sample S is bent.
  • the position X0 indicates the position of the fixed wall 2 in the X-axis direction.
  • the mounting portions 5 and 6 are all located horizontally to the top plates 22 and 23. Therefore, no stress is applied to the sample S.
  • the distance between the position X1 of the moving wall 3 and the position X0 of the fixed wall 2 is determined according to the length of the sample S in the X-axis direction.
  • the position X1 corresponds to one embodiment of the "first holder position" or the "first holder state”.
  • the moving wall 3 When the moving wall 3 is moved from the position X1 to the position X2 along the X-axis direction, the distance between the moving wall 3 and the fixed wall 2 is shortened, and bending stress is applied to the sample S. At this time, the mounting portion 5 rotates toward the fixed wall 2, and the mounting portion 6 rotates toward the moving wall 3.
  • the range of rotation angles of the mounting portions 5 and 6 is 0 rad or more and ⁇ / 2 rad or less.
  • the load applied to the sample S is only the bending stress, and other stresses (for example, frictional force or tensile force) are the sample S. It is possible to suppress the action on. Therefore, the bending stress applied to the sample S can be accurately measured.
  • the first driver 20 can periodically move the holder 10 by periodically operating the actuator 21. Specifically, the first driver 20 moves the moving wall 3 from the first holder position X1 to the second halter position X3 in the first half of one operation cycle of the holder 10. As a result, the sample S is bent at a bending angle and a bending radius according to the second holder position X3. Further, the first driver 20 can move the moving wall 3 from the second holder position X3 to the first holder position X1 in the latter half of one operation cycle of the holder 10.
  • FIG. 4 is a diagram for explaining the bending angle and bending radius of the sample S.
  • the bending angle of the sample S corresponds to the magnitude of the angle formed by the straight portions of the first end S1 and the second end S2 of the sample S changed from 180 ° ( ⁇ rad). ..
  • the bending radius of the sample S corresponds to the radius of a circle C that draws a curve having the same size as the central portion of the bending of the sample S.
  • the bending angle of the sample S increases. Further, as the bending radius of the sample S becomes smaller, the bending stress applied to the sample S becomes larger.
  • at least one of the bending angle and the bending radius of the sample S can be changed by changing the second holder position X3 of the holder 10. That is, the magnitude of the bending stress applied to the sample S can be changed by changing the second holder position X3.
  • leaf springs 12 having the same length in the X-axis direction as the sample S are connected between both ends of the mounting portion 5 in the Y-axis direction and both ends of the mounting portion 6 in the Y-axis direction. ing.
  • the leaf spring 12 has a property of tending to have a uniform radius of curvature when bent. As a result, when the sample S is bent, the sample S can be uniformly bent following the bending of the leaf spring 12.
  • the sample S is supported by the holder 10 so that the first surface Sa is on the upper side.
  • a predetermined region of the first surface Sa is covered with a light emitting film.
  • the light source 30 is arranged above the sample S in the Z-axis direction, and is configured to irradiate the light emitting film on the first surface Sa of the sample S with excitation light.
  • the stress-stimulated luminescent material contained in the luminescent film transitions to a luminescent state.
  • the excitation light is, for example, ultraviolet light or near infrared light.
  • the first surface Sa of the sample S is irradiated with the excitation light from two directions, but the light source 30 emits the excitation light to the sample S from one direction or three or more directions. It may be configured to irradiate.
  • the third driver 32 supplies electric power for driving the light source 30.
  • the third driver 32 can control the amount of excitation light emitted from the light source 30, the irradiation time of the excitation light, and the like by controlling the electric power supplied to the light source 30 in response to a command received from the controller 50.
  • the camera 40 is arranged above the sample S in the Z-axis direction so as to include at least a predetermined region of the first surface Sa in the imaging field of view. Specifically, the camera 40 is arranged so that the focus position is located at at least one point within a predetermined region of the first surface Sa. At least one point in the predetermined region is preferably located at the center of bending of the sample S.
  • the camera 40 includes an optical system such as a lens and an image sensor.
  • the image sensor is realized by, for example, a CCD (Charge Coupled Device) sensor, a CMOS (Complementary Metal Oxide Semiconductor) sensor, or the like.
  • the image pickup device generates an image pickup image by converting the light incident from the first surface Sa via the optical system into an electric signal.
  • the camera 40 is configured to capture the light emission of the light emitting film on the first surface Sa at least when stress is applied to the sample S.
  • the image data generated by the imaging of the camera 40 is transmitted to the controller 50.
  • the second driver 42 is configured to be able to change the focus position of the camera 40 in response to a command received from the controller 50.
  • the second driver 42 can adjust the focus position of the camera 40 by moving the camera 40 along the Z-axis direction and the X-axis direction.
  • the second driver 42 has a motor that rotates a feed screw that moves the camera 40 in the Z-axis direction and the X-axis direction, and a motor driver that drives the motor.
  • the feed screw is rotationally driven by the motor, so that the camera 40 is positioned at a designated position within a predetermined range in each of the Z-axis and X-axis directions.
  • the second driver 42 transmits the position information indicating the position of the camera 40 to the controller 50.
  • the controller 50 controls the entire device 100.
  • the controller 50 has a processor 501, a memory 502, an input / output interface (I / F) 503, and a communication I / F 504 as main components. Each of these parts is communicably connected to each other via a bus (not shown).
  • the processor 501 is typically an arithmetic processing unit such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit).
  • the processor 501 controls the operation of each part of the device 100 by reading and executing the program stored in the memory 502. Specifically, the processor 501 realizes each of the processes of the device 100 described later by executing the program.
  • the controller 50 may be configured to have a plurality of processors.
  • the memory 502 is realized by a non-volatile memory such as a RAM (Random Access Memory), a ROM (Read Only Memory), and a flash memory.
  • the memory 502 stores a program executed by the processor 501, data used by the processor 501, and the like.
  • the input / output I / F 503 is an interface for exchanging various data between the processor 501 and the first driver 20, the third driver 32, the camera 40, and the second driver 42.
  • the communication I / F 504 is a communication interface for exchanging various data between the device 100 and another device, and is realized by an adapter or a connector.
  • the communication method may be a wireless communication method using a wireless LAN (Local Area Network) or the like, or a wired communication method using USB (Universal Serial Bus) or the like.
  • a display 60 and an operation unit 70 are connected to the controller 50.
  • the display 60 is composed of a liquid crystal panel or the like capable of displaying an image.
  • the operation unit 70 receives a user's operation input to the device 100.
  • the operation unit 70 is typically composed of a touch panel, a keyboard, a mouse, and the like.
  • the controller 50 is communicated with the first driver 20, the third driver 32, the camera 40, and the second driver 42. Communication between the controller 50 and the first driver 20, the third driver 32, the camera 40, and the second driver 42 may be realized by wireless communication or wired communication.
  • FIG. 5 is a block diagram for explaining the functional configuration of the controller 50.
  • the controller 50 includes a stress control unit 51, a light source control unit 52, an imaging control unit 53, a measurement control unit 54, a data acquisition unit 55, and a data processing unit 56. These are functional blocks realized based on processor 501 executing a program stored in memory 502.
  • the stress control unit 51 controls the operation of the first driver 20. Specifically, the stress control unit 51 controls the operating speed, operating time, and the like of the first driver 20 according to preset measurement conditions. By controlling the operating speed and operating time of the first driver 20, the moving speed, moving time, moving distance, and the like of the moving wall 3 (see FIGS. 2 and 3) in the holder 10 can be adjusted.
  • the light source control unit 52 controls the drive of the light source 30 by the third driver 32. Specifically, the light source control unit 52 generates a command for instructing the magnitude of the electric power supplied to the light source 30 and the supply time of the electric power to the light source 30 based on the preset measurement conditions. , The generated command is output to the third driver 32. By controlling the electric power supplied to the light source 30 by the third driver 32 in accordance with the command, the amount of excitation light emitted from the light source 30, the irradiation time of the excitation light, and the like can be adjusted.
  • the image pickup control unit 53 controls the movement of the camera 40 by the second driver 42. Specifically, the image pickup control unit 53 follows the movement of the predetermined region of the sample S based on the preset measurement conditions and the position information of the camera 40 input from the second driver 42, and causes the camera 40 to move. Generate a command to move. The image pickup control unit 53 outputs the generated command to the second driver 42. By moving the camera 40 according to the command, the second driver 42 can maintain the focus position of the camera 40 at at least one point in the predetermined region of the sample S.
  • the image pickup control unit 53 further controls the image pickup by the camera 40. Specifically, the image pickup control unit 53 controls the camera 40 so as to image the light emitted from the light emitting film at least when stress is applied, according to preset measurement conditions.
  • the measurement conditions related to imaging include the frame rate of the camera 40.
  • the data acquisition unit 55 acquires the image data generated by the imaging of the camera 40, and transfers the acquired image data to the data processing unit 56.
  • the data processing unit 56 measures the stress distribution on the first surface Sa of the sample S by performing known image processing on the image data obtained by imaging the camera 40.
  • the data processing unit 56 generates, for example, an image showing the stress distribution on the first surface Sa.
  • the data processing unit 56 can display the measurement result including the image captured by the camera 40 and the image showing the stress distribution on the first surface Sa on the display 60.
  • the measurement control unit 54 comprehensively controls the stress control unit 51, the light source control unit 52, the image pickup control unit 53, the data acquisition unit 55, and the data processing unit 56. Specifically, the measurement control unit 54 gives a control command to each unit based on the measurement conditions input to the operation unit 70 and the information of the device to be the sample S.
  • FIG. 6 is a diagram schematically showing a part of the sample S and the holder 10.
  • FIG. 6A shows a sample S before stress is applied
  • FIG. 6B shows a sample S when stress is applied.
  • the first and second ends S1 and S2 of the sample S in the X-axis direction are gripped by the mounting portions 5 and 6 of the holder 10 and the pressing plates 7 and 8.
  • a light emitting film LF is arranged on a predetermined region of the first surface Sa of the sample S.
  • the light source 30 excites the stress-stimulated luminescent material contained in the light-emitting film LF by irradiating the light-emitting film LF with excitation light.
  • FIG. 6B shows how the mounting portion 6 and the holding plate 8 move in the direction of the arrow A in conjunction with the movement of the moving wall 3.
  • the camera 40 images a predetermined region (including the central portion of bending) of the sample S in accordance with the timing of applying stress to the sample S. That is, the camera 40 captures the light emission of the stress-stimulated luminescent material in the light-emitting film LF.
  • the sample S is subjected to.
  • the bending stress can be repeatedly applied.
  • the durability against the repeated stress applied to the sample S can be evaluated by imaging the light emission of the stress-stimulated luminescent material during the repeated bending and stretching operation with the camera 40.
  • the central portion of the bending of the sample S moves in the Z-axis direction and the X-axis direction.
  • the central portion of the bending moves in the direction approaching the fixed wall 2 along the X-axis direction and in the direction away from the camera 40 along the Z-axis direction.
  • the central portion of the bending moves in the direction away from the fixed wall 2 along the X-axis direction and in the direction approaching the camera 40 along the Z-axis direction.
  • the relative position between the camera 40 and the predetermined area changes according to the movement of the predetermined area of the sample S.
  • the distance between the camera 40 and at least one point in the predetermined area also fluctuates. Since the focus position of the camera 40 at this time is fixed, if the distance between the camera 40 and the at least one point fluctuates, the camera 40 cannot focus on the at least one point, and as a result. There is concern that it will be difficult to obtain an image in focus at at least one point.
  • the controller 50 controls at least one of the first driver 20 and the second driver 42 so as to maintain the focus position of the camera 40 at at least one point in a predetermined region of the sample S at least during imaging by the camera 40. It is composed of.
  • the controller 50 controls the second driver 42 so as to maintain the focus position of the camera 40 at at least one point in a predetermined region of the sample S.
  • the second driver 42 moves the camera 40 according to the movement of the predetermined area of the sample S according to the command received from the controller 50, so that the focus position of the camera 40 is at least one in the predetermined area. It is configured to maintain a point.
  • FIG. 7 is a diagram for explaining the positional relationship between the sample S and the camera 40.
  • X0 indicates the X coordinate of the first end S1 of the sample S
  • X1 to X6 indicate the X coordinate of the second end S2 of the sample S
  • Z0 indicates the Z coordinates of the first and second ends S1 and S2 of the sample S.
  • the first end S1 of the sample S is a fixed end and the second end S2 is a free end.
  • the rotation angle ⁇ can be changed within the range of 0 rad or more and ⁇ / 2 rad or less.
  • the rotation angle ⁇ changes from 0 rad to ⁇ / 2 rad
  • the second end S2 moves toward the first end S1, so that the bending angle of the sample S becomes large and the bending radius becomes small. ..
  • the bending radius of the sample S becomes further smaller.
  • the bending stress applied to the sample S gradually increases as the X coordinate of the second end S2 changes in the order of X1 ⁇ X2 ⁇ ... ⁇ X6.
  • Point R also moves in the X-axis direction and the Z-axis direction.
  • the X coordinate of the point R approaches X0, and the Z coordinate of the point R moves away from Z0.
  • the second driver 42 moves the camera 40 according to the movement of the point R in the predetermined region of the sample S. Specifically, the second driver 42 moves the camera 40 in the X-axis direction so that the X coordinate of the position of the camera 40 (point C in the figure) matches the X coordinate of the point R.
  • the X coordinate of the second end S2 of the sample S changes in the order of X1 ⁇ X2 ⁇ ... ⁇ X6
  • the X coordinate of the position (point C) of the camera 40 is X1 / 2 ⁇ X2.
  • the transition is in the order of / 2 ⁇ ... ⁇ X6 / 2.
  • the second driver 42 also aligns the camera 40 with the Z axis so that the distance D between the Z coordinate of the position (point C) of the camera 40 and the Z coordinate of the point R in the predetermined region of the sample S maintains a predetermined distance. Move in the direction.
  • the Z coordinate of the position (point C) of the camera 40 is Z1 ⁇ Z2 ⁇ ... ⁇ ⁇ Transitions in the order of ⁇ Z6.
  • the predetermined distance is determined according to the focus position of the camera 40.
  • the positions (X1 / 2, Z1) of the camera 40 corresponding to the positions (X1, Z0) of the second end S2 correspond to the "first camera position”.
  • the position (X6 / 2, Z6) of the camera 40 corresponding to the position (X6, Z0) of the second end S2 corresponds to the "second camera position”.
  • the focus position of the camera 40 is always moved by moving the camera 40 from the first camera position to the second camera position in conjunction with the movement of the holder 10. It can be focused on the point R in a predetermined region of the sample S. Therefore, when the sample S is bent at a predetermined bending angle, the focus position of the camera 40 can be focused on at least one point in the predetermined region of the sample S. As a result, the camera 40 can accurately image the light emission of the predetermined region at the predetermined bending angle, so that the bending stress applied to the predetermined region can be accurately measured.
  • the focus position of the camera 40 is set to the predetermined region of the sample S at least at a predetermined bending angle.
  • FIG. 8 is a flowchart illustrating a processing procedure of the stress luminescence measurement method using the apparatus 100.
  • a device to be sample S is prepared.
  • the device is, for example, a flexible sheet or flexible fiber.
  • a light emitting film LF (see FIG. 6A) is formed on the first surface Sa of the flexible sheet.
  • the luminescent film can be formed, for example, by applying a resin material containing a stress-stimulated luminescent material to a predetermined region of the first surface Sa of the sample S and drying it.
  • a spray method, screen printing, or the like can be used as a method for forming the light emitting film.
  • step S20 the sample S is set in the holder 10 (see FIG. 1).
  • the holder 10 is configured to support at least two points of the sample S.
  • the holder 10 grips the first end S1 and the second end S2 of the sample S facing each other by the first gripper and the second gripper, respectively.
  • step S30 the controller 50 irradiates the first surface Sa of the sample S with excitation light from the light source 30.
  • the luminescent film arranged in the predetermined region of the first surface Sa of the sample S with excitation light By irradiating the luminescent film arranged in the predetermined region of the first surface Sa of the sample S with excitation light, the stress luminescent material contained in the luminescent film is brought into an excited state.
  • step S40 the controller 50 bends the sample S at a predetermined bending angle by driving the first driver 20 to move the holder 10 from the first holder position to the second holder position. Bending stress is applied to the sample S and the light emitting film.
  • the moving wall 3 of the holder 10 is moved relative to the fixed wall 2 by driving the cylinder 21 included in the first driver 20.
  • the sample S can be bent at a predetermined bending angle by reducing the distance between the first end portion S1 and the second end portion S2 of the sample S by moving the holder 10.
  • step S50 the controller 50 uses the camera 40 to image the light emission of the stress-stimulated luminescent material contained in the light-emitting film on the first surface Sa of the sample S at least at a predetermined bending angle.
  • step S60 the controller 50 measures the distribution of the emission intensity in a predetermined region of the first surface Sa of the sample S by performing known image processing on the image data captured by the camera 40.
  • the controller 50 can display an image captured by the camera 40 and an image showing the measured emission intensity distribution on the display 60 (see FIG. 1).
  • FIG. 9 is an example of an image showing the distribution of emission intensity in a predetermined region of sample S.
  • the image shown in FIG. 9 represents the intensity of light emission intensity in color on a two-dimensional plane.
  • the image of FIG. 9 is also referred to as a "color map".
  • a color bar showing a range of colors assigned according to the intensity of emission intensity is shown.
  • the color bar is divided into a plurality of segments between the maximum value “strong” and the minimum value “weak” of the emission intensity, and different colors are set among the plurality of segments.
  • the image shown on the left side of FIG. 9, according to this color bar the image is color-coded according to the intensity of emission intensity.
  • FIG. 9 a color map in which the intensity of emission intensity is expressed by color is illustrated, but the controller 50 expresses the intensity of emission intensity only in white, black, and gray in a plurality of stages in between. It is also possible to create an image showing the distribution of emission intensity on a scale. In this case, different gradations of gray are set among the plurality of segments. Alternatively, the controller 50 can also create a three-dimensional image showing the distribution of emission intensity.
  • the distribution of stress in the predetermined region of the sample S can be known. Specifically, the portion of the image having a high emission intensity indicates a portion having a large stress, and the portion having a low emission intensity indicates a portion having a small stress.
  • the controller 50 can generate an image showing the distribution of stress applied to a predetermined region of the sample S based on the distribution of the emission intensity based on the correlation between the emission intensity and the stress obtained in advance.
  • the user who performs the mechanoluminescence measurement described above can input the measurement conditions to the operation unit 70 (see FIG. 1) of the apparatus 100.
  • the user can set the measurement conditions.
  • the measurement conditions are the moving time of the holder 10, the moving distance of the holder 10, the moving speed of the holder 10, the length of the sample S (corresponding to the length in the X-axis direction), and the width of the sample S (the length in the Y-axis direction).
  • the "movement time of the holder 10" is a predetermined start time when the moving wall 3 of the holder 10 is in the first holder state (first holder position, position X1 in FIG. 3, position X1 in FIG. 7). Corresponds to the time difference from the predetermined end time when the moving wall 3 is in the second holder state (second holder position, position X2 in FIG. 3, position X6 in FIG. 7). That is, the moving time of the holder 10 corresponds to the time required to move the holder 10 from the first holder position to the second holder position.
  • the "moving distance of the holder 10" corresponds to the distance between the first holder position and the second holder position.
  • the “moving speed of the holder 10" corresponds to the quotient when the moving distance of the holder 10 is divided by the moving time.
  • the "predetermined bending angle” corresponds to the bending angle of the sample S when the holder 10 is in the second holder position.
  • the “predetermined bending radius” corresponds to the bending radius of the sample S when the holder 10 is in the second holder position.
  • the bending angle of the sample S depends on the rotation angle of the grippers (mounting portions 5, 6 and pressing plates 7, 8) that grip the ends S1 and S2 of the sample S.
  • the bending radius of the sample S depends on the rotation angle of the gripper and the moving distance of the holder 10.
  • the "length of sample S” corresponds to the length of sample S in the X-axis direction
  • the "width of sample S” corresponds to the length of sample S in the Y-axis direction.
  • the moving distance of the holder 10 is determined according to the length of the sample S, the predetermined bending angle of the sample S, and the predetermined bending radius.
  • the length of the sample S can be, for example, 0.06 m or more and 0.4 m or less, and the bending angle of the sample S can be, for example, 0 rad or more and 3.5 rad or less.
  • the moving distance of the holder 10 can be, for example, 0.04 m or more and 0.24 m or less.
  • the moving speed of the holder 10 can be, for example, 0.0006 m / sec or more and 0.32 m / sec or less, and the moving time of the holder 10 can be, for example, 0.25 second or more and 60 seconds or less.
  • the width of the sample S can be, for example, 0.0001 m or more and 0.4 m or less.
  • both the first end portion S1 and the second end portion S2 of the sample S are set to free ends, and the relative positions of these two free ends are set by the first driver 20.
  • a bending stress may be applied to the sample S by changing the sample S.
  • the predetermined region (including the central portion of bending) of the sample S moves along the Z-axis direction. Therefore, when the second driver 42 moves the camera 40 along the Z-axis direction, the distance D between at least one point (point R in the figure) in the predetermined region of the sample S and the camera 40 is set to a predetermined distance. Can be kept in. According to this, the focus position of the camera 40 can always be focused on the at least one point while the sample S is bent and stretched. Therefore, the camera 40 can accurately image the light emission in the predetermined region of the sample S.
  • the stress applying mechanism can apply stress other than bending stress.
  • a torsional stress can be applied to the sample S by rotating two grippers that grip both ends of the sample S in opposite directions.
  • tensile stress can be applied to the sample S by moving the two grippers away from each other.
  • Second driver 42 In the above-described embodiment, the configuration in which the second driver 42 changes the focus position of the camera 40 by moving the position of the camera 40 in conjunction with the movement of the holder 10 (see FIGS. 7 and 10) is illustrated.
  • the second driver 42 may be configured to be realized by the autofocus circuit built in the camera 40. Specifically, the second driver 42 adjusts the relative position of the image sensor inside the camera 40 and the optical system to focus the focus position of the camera 40 on at least one point within a predetermined region of the sample S. It is configured as follows.
  • First driver 20 In the above-described embodiment, the configuration in which the second driver 42 changes the focus position of the camera 40 to maintain the focus position of the camera 40 at at least one point within the predetermined region of the sample S has been illustrated.
  • the first driver 20 moves the holder 10 relative to the camera 40 so that the position of the camera 40 is fixed and the focus position of the camera 40 is maintained at at least one point in the predetermined area of the sample S. May be good.
  • the first driver 20 and the second driver 42 cooperate to move the camera 40 and the holder 10 relatively so as to maintain the focus position of the camera 40 at at least one point in the predetermined region of the sample S. It may be configured. That is, by controlling at least one of the first driver 20 and the second driver 42 to move the camera 40 and the holder 10 relatively, the focus position of the camera 40 is maintained at at least one point within the predetermined region of the sample S. can do.
  • a mechanoluminescent film is arranged on the first surface Sa to which compressive stress is applied when the sample S is bent, and stress luminescence when compressive stress is applied.
  • An example of the configuration for imaging the light emission of the body has been described, but the configuration is such that a light emitting film is arranged on the second surface Sb to which the tensile stress is applied and the light emission of the stress-stimulated luminescent material when the tensile stress is applied is imaged. You can also do it. Specifically, in the example of FIG.
  • a predetermined region of the second surface Sb of the sample S is covered with a light emitting film, and the light source 30 is arranged below the Z-axis direction of the sample S.
  • the camera 40 is arranged below the sample S in the Z-axis direction so as to include at least a predetermined region of the second surface Sb in the imaging field of view.
  • the second driver 42 is configured to be able to move the camera 40 so that at least one point in a predetermined region of the second surface Sb of the sample S is located at the focus position.
  • the configuration may include a second holder configured to hold the position of the camera 40 so as to maintain a relative position with respect to the predetermined area.
  • Mechanoluminescence measurement system In the mechanoluminescence measurement device according to the above-described embodiment, at least one processor among the plurality of processors 501, the memory 502, and the memory 502 stored in the controller 50 and the plurality of processors 501 is stored. At least one program executed by the mechanoluminescent measurement system can be configured.
  • the stress luminescence measuring device is configured to measure the luminescence of a stress luminescent material arranged in at least a predetermined region of a flexible sample.
  • the stress luminescence measuring device moves a holder configured to support a sample, a light source configured to irradiate a stress luminescent material with excitation light, and a holder from a first holder state to a second holder state.
  • the sample is provided with a first driver configured to bend the sample at a predetermined bending angle.
  • the first holder state corresponds to the first bending state in which the bending angle of the sample is less than a predetermined bending angle
  • the second holder state corresponds to the second bending in which the bending angle of the sample is a predetermined bending angle.
  • the stress-stimulated luminescence measuring device further includes a camera configured to image the luminescence of the stress-stimulated luminescent material at a predetermined bending angle.
  • the mechanoluminescent measuring device when a flexible sample in which a mechanoluminescent body is arranged in a predetermined region is bent at a predetermined bending angle, the mechanoluminescent material arranged in the predetermined region is bent.
  • the light emitted from the body can be captured by a camera. Therefore, the stress distribution in the predetermined region due to the applied bending stress can be measured based on the image captured by the camera.
  • the mechanoluminescent measuring device has a second driver configured to change the focus position of the camera and at least the focus position of the camera in the predetermined region at least during imaging by the camera. It further comprises a controller configured to control at least one of a first driver and a second driver so as to maintain one point.
  • the focus position of the camera can be focused on at least one point in a predetermined region of the sample. It is possible to accurately image the light emission in the region.
  • the second driver sets the camera in the first camera position when the holder is in the first holder state, and the holder is in the second holder state. At this time, by setting the camera to the second camera position and moving the camera from the first camera position to the second camera position, the focus position of the camera is set to at least one point after the holder is moved. Configured to maintain.
  • the focus position of the camera can be focused on at least one point in a predetermined region of the sample. It is possible to accurately image the light emission in the region.
  • the sample changes from the first bending state to the first bending state through the second bending state in one operation cycle of the holder. Configured to return.
  • the first driver transitions the holder from the first holder state to the second holder state in the first half of one operation cycle of the holder.
  • the first driver further moves the holder from the second holder state to the first holder state.
  • bending stress can be repeatedly applied to the sample by periodically moving the holder by the first driver.
  • imaging the light emission of the stress-stimulated luminescent material during this repetitive operation with a camera it is possible to evaluate the durability against the repetitive stress applied to the sample.
  • one operation cycle of the holder may be 0.5 seconds or more and 120 seconds or less.
  • the sample may be a flexible sheet.
  • the sample may be a flexible fiber.
  • the sample may form a part of a flexible display.
  • the sample may form a part of a wearable device.
  • the stress luminescence measuring device according to paragraphs 1 to 11 further includes a display configured to display an image of the luminescence intensity of the stress luminescent material.
  • the user can easily grasp the stress distribution in a predetermined region based on the image displayed on the display.
  • the controller includes a processor configured to operate the holder according to preset conditions.
  • the stress applied to the device can be accurately adjusted by setting the conditions according to the type, shape, mode of use, etc. of the sample device. It can be measured well.
  • the preset conditions are the moving time of the holder, the moving distance of the holder, the moving speed of the holder, and the sample in the moving direction of the holder. It includes at least one of the length, the width of the sample in the direction perpendicular to the direction of movement of the holder, the predetermined bending angle, the frame rate of the camera, and the irradiation time of the excitation light at the light source.
  • stress luminescence can be measured by appropriately applying stress to each sample device.
  • the movement time of the holder is a predetermined start time when the holder is in the first holder state and a predetermined end when the holder is in the second holder state. Equal to the time difference from the time.
  • the moving speed of the holder may be 0.0006 m / sec or more and 0.32 m / sec or less.
  • the movement time of the holder may be 0.25 seconds or more and 60 seconds or less.
  • the moving distance of the holder may be 0.04 m or more and 0.24 m or less.
  • the length of the sample may be 0.06 m or more and 0.4 m or less.
  • the width of the sample may be 0.0001 m or more and 0.4 m or less.
  • the predetermined bending angle may be 0 rad or more and 3.5 rad or less.
  • the stress luminescent material is selected from the group consisting of strontium aluminate, zinc sulfide, barium titanate, silicate and phosphate. Includes substances.
  • the holder is configured to support the sample by contacting the sample at at least two points.
  • the sample can be bent at a predetermined bending angle by changing the relative positions of at least two points of the sample by the first driver.
  • the holder has a first gripper that rotatably grips the first end portion of the sample and a first gripper facing the first end portion of the sample. Includes a second gripper that rotatably grips the end of 2.
  • the sample is bent at a predetermined bending angle by changing the relative positions of the first end and the second end of the sample by the first driver. Can be done.
  • the first driver is connected to the holder and is configured to move the holder between the first holder state and the second holder state.
  • the first gripper and the second gripper are configured to rotate in conjunction with the operation of the actuator.
  • the bending angle and bending radius of the sample change due to the rotation of the first gripper and the second gripper in conjunction with the movement of the holder.
  • the load applied to the sample is only bending stress, and it is possible to suppress the action of other stresses (for example, frictional force or tensile force) on the sample. Therefore, it is possible to accurately measure the bending stress applied to the sample.
  • the stress luminescent material is arranged in at least a predetermined region of a sample having flexibility.
  • the stress luminescence measuring method includes a step of bending a sample at a predetermined bending angle, a step of irradiating the stress luminescent material with excitation light, and a step of imaging the light emission of the stress luminescent material at a predetermined bending angle.
  • the stress luminescence measurement method described in Item 27 when a sample in which a stress luminescent material is arranged in a predetermined region is bent at a predetermined bending angle, the light emission of the stress luminescent material arranged in the predetermined region is captured by a camera. Can be imaged with. Therefore, the stress distribution in a predetermined region when bending stress is applied can be measured based on the image captured by the camera.
  • a mechanoluminescent measurement system wherein a plurality of processors, a memory, and at least one program stored in the memory and executed by at least one processor among the plurality of processors are used. Be prepared.
  • the stress-stimulated luminescent material is arranged in at least a predetermined region of the flexible sample.
  • At least one program has a step of bending the sample at a predetermined bending angle, a step of irradiating the stress-stimulated luminescent material with excitation light, and a step of imaging the light emission of the stress-stimulated luminescent material at a predetermined bending angle in at least one processor. Let it run.
  • the stress luminescence measurement system described in Item 28 when a sample in which a stress luminescent material is arranged in a predetermined region is bent at a predetermined bending angle, the light emission of the stress luminescent material arranged in the predetermined region is captured by a camera. Can be imaged with. Therefore, the stress distribution in a predetermined region when bending stress is applied can be measured based on the image captured by the camera.
  • the stress luminescent material is arranged in at least a predetermined region of a sample having flexibility.
  • the mechanoluminescence measuring device bends the sample at a predetermined bending angle by moving the first holder configured to support the sample and the first holder from the first holder state to the second holder state.
  • the first driver configured in the above, the light source configured to irradiate the stress-stimulated luminescent material with excitation light, and at least one point in the predetermined region are arranged so as to be located at the focus position, and the stress-stimulated luminescent material emits light. It includes a camera configured to image the image and a second holder configured to hold the position of the camera so as to maintain a relative position between the camera and the predetermined area.
  • the focus position of the camera can be focused on at least one point in a predetermined region of the sample. It is possible to accurately image the light emission in the region.

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003253261A (ja) * 2001-12-28 2003-09-10 Sony Corp 蛍光性物質、複合材料、コート材料、塗料、インク、人工皮膚、人工皮膚の接触情報処理方法、人工発光皮膚、人工発光毛髪、発光素子、電子装置、発光システム、表示システム、フレキシブル発光材料、超音波発光性物質、交通標識、発光方法、複合材料の製造方法および発光素子の製造方法
JP2010190865A (ja) * 2009-02-20 2010-09-02 National Institute Of Advanced Industrial Science & Technology 応力発光解析装置、応力発光解析方法、応力発光解析プログラムおよび記録媒体
WO2015038594A1 (en) * 2013-09-10 2015-03-19 The University Of Akron Mechanoluminescence paint sensor for stress and crack visualizations

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015075477A (ja) * 2013-10-11 2015-04-20 独立行政法人産業技術総合研究所 応力発光評価装置並びに応力発光評価方法
JP6346036B2 (ja) * 2014-09-09 2018-06-20 株式会社日立ハイテクサイエンス 蛍光ｘ線分析装置及びその測定位置調整方法
CN105865673B (zh) * 2016-04-09 2019-01-22 南昌航空大学 一种单光谱实现多点应力分布监测的方法
JP6786990B2 (ja) * 2016-09-20 2020-11-18 日本電産トーソク株式会社 三次元形状測定装置
CN108732179A (zh) * 2017-04-14 2018-11-02 中国科学院城市环境研究所 一套无线智能应力发光结构健康监测系统
JP2019002702A (ja) * 2017-06-12 2019-01-10 株式会社トヨタプロダクションエンジニアリング 歪み量算出装置、歪み量算出方法及び歪み量算出プログラム
JP6912790B2 (ja) * 2017-08-24 2021-08-04 ユアサシステム機器株式会社 変形試験器
JP6470864B1 (ja) * 2018-08-31 2019-02-13 株式会社トヨタプロダクションエンジニアリング 応力発光計測装置及び応力発光計測方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003253261A (ja) * 2001-12-28 2003-09-10 Sony Corp 蛍光性物質、複合材料、コート材料、塗料、インク、人工皮膚、人工皮膚の接触情報処理方法、人工発光皮膚、人工発光毛髪、発光素子、電子装置、発光システム、表示システム、フレキシブル発光材料、超音波発光性物質、交通標識、発光方法、複合材料の製造方法および発光素子の製造方法
JP2010190865A (ja) * 2009-02-20 2010-09-02 National Institute Of Advanced Industrial Science & Technology 応力発光解析装置、応力発光解析方法、応力発光解析プログラムおよび記録媒体
WO2015038594A1 (en) * 2013-09-10 2015-03-19 The University Of Akron Mechanoluminescence paint sensor for stress and crack visualizations

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HAYATO IZUMI; YOKO HAGA; NOBUYUKI SHISHIDO; SHOJI KAMIYA: "Evaluation of Bending Durability of LaminateFilm and Stress Sensing using Mechanoluminecence", PROCEEDINGS OF THE 67TH TOKAI ENGINEERING COMPLEX CONFERENCE, no. 183-1, 1 January 2018 (2018-01-01), pages 1 - 2, XP009524737, ISSN: 2424-2748, DOI: 10.1299/jsmetokai.2018.67.722 *

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