WO2020230468A1 - ダイシングテープ用基材フィルム - Google Patents

ダイシングテープ用基材フィルム Download PDF

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Publication number
WO2020230468A1
WO2020230468A1 PCT/JP2020/014564 JP2020014564W WO2020230468A1 WO 2020230468 A1 WO2020230468 A1 WO 2020230468A1 JP 2020014564 W JP2020014564 W JP 2020014564W WO 2020230468 A1 WO2020230468 A1 WO 2020230468A1
Authority
WO
WIPO (PCT)
Prior art keywords
base film
density polyethylene
linear low
dicing tape
homopolypropylene
Prior art date
Application number
PCT/JP2020/014564
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
享之 石本
陽介 味口
仁美 小野
Original Assignee
タキロンシーアイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タキロンシーアイ株式会社 filed Critical タキロンシーアイ株式会社
Priority to JP2021511007A priority Critical patent/JP6928730B2/ja
Priority to KR1020217037253A priority patent/KR20220008823A/ko
Priority to CN202080034638.0A priority patent/CN113811565B/zh
Publication of WO2020230468A1 publication Critical patent/WO2020230468A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/14—Copolymers of propene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/06—Properties of polyethylene
    • C08L2207/066—LDPE (radical process)

Definitions

  • the present invention relates to a base film for dicing tape (hereinafter, may be simply referred to as a "base film").
  • a wafer circuit in which a circuit is formed on a substantially disk-shaped semiconductor wafer is divided by dicing on a dicing tape for the wafer to obtain individual semiconductor devices.
  • the method is widely used.
  • the dicing tape is stretched to form a gap (that is, expand) between the semiconductor devices, and then each semiconductor device is picked up by a robot or the like.
  • the dicing tape is generally composed of an adhesive layer for fixing a wafer and a base film containing polyolefin or the like.
  • the base film was formed from, for example, a granular thermoplastic acrylic resin composed of a core layer made of a soft acrylic acid ester resin and a shell layer made of a semi-hard to hard methacrylic acid ester resin.
  • a base film (see Patent Document 1) in which a layer and a layer made of a polyethylene resin are laminated has been proposed.
  • a base film in which an outer layer made of an ethylene-methacrylic acid copolymer resin and an inner layer made of an ethylene-vinyl acetate copolymer resin or the like are laminated has been proposed.
  • the direction perpendicular to the mechanical axis (longitudinal) direction of the base film (hereinafter referred to as “MD”).
  • MD the direction perpendicular to the mechanical axis (longitudinal) direction of the base film
  • an object of the present invention is to provide a base film for a dicing tape capable of achieving both heat resistance and isotropic properties.
  • the base film for a dicing tape of the present invention is characterized by containing a linear low-density polyethylene and a block polypropylene copolymerized with ethylene or a homopolypropylene obtained by polymerizing propylene alone. And.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
PCT/JP2020/014564 2019-05-15 2020-03-30 ダイシングテープ用基材フィルム WO2020230468A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021511007A JP6928730B2 (ja) 2019-05-15 2020-03-30 ダイシングテープ用基材フィルム
KR1020217037253A KR20220008823A (ko) 2019-05-15 2020-03-30 다이싱 테이프용 기재 필름
CN202080034638.0A CN113811565B (zh) 2019-05-15 2020-03-30 切割带用基材膜

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019091855 2019-05-15
JP2019-091855 2019-05-15
JP2019-195432 2019-10-28
JP2019195432 2019-10-28

Publications (1)

Publication Number Publication Date
WO2020230468A1 true WO2020230468A1 (ja) 2020-11-19

Family

ID=73289949

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/014564 WO2020230468A1 (ja) 2019-05-15 2020-03-30 ダイシングテープ用基材フィルム

Country Status (4)

Country Link
JP (1) JP6928730B2 (zh)
KR (1) KR20220008823A (zh)
CN (1) CN113811565B (zh)
WO (1) WO2020230468A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7188658B1 (ja) * 2021-09-27 2022-12-13 昭和電工マテリアルズ株式会社 半導体装置の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005297247A (ja) * 2004-04-07 2005-10-27 Sekisui Film Kk 粘着テープ用基材及び粘着シート
JP2013089926A (ja) * 2011-10-21 2013-05-13 Furukawa Electric Co Ltd:The 半導体デバイス用ダイシング加工用粘着テープ
JP2013239502A (ja) * 2012-05-14 2013-11-28 Gunze Ltd ダイシング用基体フィルム
WO2015146596A1 (ja) * 2014-03-28 2015-10-01 リンテック株式会社 ダイシングシート用基材フィルム、当該基材フィルムを備えるダイシングシート、および当該基材フィルムの製造方法
JP2015213096A (ja) * 2012-09-04 2015-11-26 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP2018166148A (ja) * 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
WO2019008809A1 (ja) * 2017-07-03 2019-01-10 リンテック株式会社 ステルスダイシング用粘着シートおよび半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568428A (en) 1978-11-14 1980-05-23 Kamizaki Kokyu Koki Seisakusho Kk Power transmitting device for agricultural tractor, etc.
JP4651472B2 (ja) * 2005-07-26 2011-03-16 アキレス株式会社 半導体製造テープ用基材フィルム
JP2007297507A (ja) * 2006-04-28 2007-11-15 Achilles Corp テープ用基材フィルム
JP5606725B2 (ja) * 2009-11-27 2014-10-15 日東電工株式会社 塗膜保護シート
JP6211771B2 (ja) 2013-02-08 2017-10-11 日東電工株式会社 粘着テープ
KR20240053004A (ko) * 2015-08-31 2024-04-23 도레이 필름 카코우 가부시키가이샤 레토르트 포장용 폴리프로필렌계 실란트 필름 및 그것을 사용한 적층체
CN105172291B (zh) * 2015-09-06 2017-05-03 黄山永新股份有限公司 一种易直线撕裂的聚乙烯膜及其制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005297247A (ja) * 2004-04-07 2005-10-27 Sekisui Film Kk 粘着テープ用基材及び粘着シート
JP2013089926A (ja) * 2011-10-21 2013-05-13 Furukawa Electric Co Ltd:The 半導体デバイス用ダイシング加工用粘着テープ
JP2013239502A (ja) * 2012-05-14 2013-11-28 Gunze Ltd ダイシング用基体フィルム
JP2015213096A (ja) * 2012-09-04 2015-11-26 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
WO2015146596A1 (ja) * 2014-03-28 2015-10-01 リンテック株式会社 ダイシングシート用基材フィルム、当該基材フィルムを備えるダイシングシート、および当該基材フィルムの製造方法
JP2018166148A (ja) * 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
WO2019008809A1 (ja) * 2017-07-03 2019-01-10 リンテック株式会社 ステルスダイシング用粘着シートおよび半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7188658B1 (ja) * 2021-09-27 2022-12-13 昭和電工マテリアルズ株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
CN113811565B (zh) 2024-05-10
KR20220008823A (ko) 2022-01-21
CN113811565A (zh) 2021-12-17
JP6928730B2 (ja) 2021-09-01
JPWO2020230468A1 (ja) 2021-09-13

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