WO2020228738A1 - 压敏元件、压敏元件的制备方法和压力传感器 - Google Patents

压敏元件、压敏元件的制备方法和压力传感器 Download PDF

Info

Publication number
WO2020228738A1
WO2020228738A1 PCT/CN2020/090028 CN2020090028W WO2020228738A1 WO 2020228738 A1 WO2020228738 A1 WO 2020228738A1 CN 2020090028 W CN2020090028 W CN 2020090028W WO 2020228738 A1 WO2020228738 A1 WO 2020228738A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive element
connecting portion
housing
detection
Prior art date
Application number
PCT/CN2020/090028
Other languages
English (en)
French (fr)
Inventor
聂泳忠
Original Assignee
西人马联合测控（泉州）科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 西人马联合测控（泉州）科技有限公司 filed Critical 西人马联合测控（泉州）科技有限公司
Publication of WO2020228738A1 publication Critical patent/WO2020228738A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G01L1/183—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material by measuring variations of frequency of vibrating piezo-resistive material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
    • G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
    • G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning

Definitions

  • This application relates to the technical field of sensors, and in particular to a pressure sensitive element, a method for preparing the pressure sensitive element, and a pressure sensor.
  • the embodiments of the present application provide a pressure-sensitive element, a method for preparing the pressure-sensitive element, and a pressure sensor, wherein the pressure-sensitive element can realize a large range of pressure measurement, and the measurement accuracy is high.
  • a pressure-sensitive element including: a base, including a housing and a signal output member, the housing has a housing chamber, and the signal output member is connected to the housing and at least partially extends into the housing chamber;
  • the sensing element is connected to the base and closes the accommodating chamber.
  • the sensing element has a predetermined cushioning deformation capacity.
  • the sensing element includes a body and a connecting part that are connected to each other. The body is connected to the housing and the connecting part is located in the accommodating chamber, the connecting part and the connecting part At least part of the connected body is made of stainless steel; the detection component is arranged in the accommodating chamber and connected to the signal output part and the sensing component.
  • the detection component includes a vibration beam and a detection electrode. The detection electrode is arranged on the surface of the vibration beam facing the sensing component. It is electrically connected with the signal output part, and the vibration beam is bonded and connected with the connection part.
  • the detection component is made of quartz material, and the vibrating beam and the connecting part are connected by glass paste bonding.
  • the number of the connecting portions is two or more, and the two or more connecting portions are arranged at intervals, and the surface of the connecting portion facing the accommodating chamber and the surface of the body overlapping the connecting portion A predetermined distance apart; wherein, the predetermined distance is greater than or equal to 100 ⁇ m.
  • the connecting portion is a bump structure; the connecting portion starts from the end surface of the main body facing the receiving cavity and extends into the receiving cavity in a direction away from the end surface; or, the main body is provided with a concave portion, the concave portion It is formed from the end surface of the main body facing the containing chamber and recessed in a direction away from the containing chamber, and the connecting part is arranged in the recess and the end facing the containing chamber is coplanar with the end surface.
  • the detection assembly further includes a lead electrode, which is disposed on the vibrating beam and is electrically connected to the detection electrode.
  • the vibration beam includes a main beam and an auxiliary beam.
  • the auxiliary beams are arranged at both ends of the main beam in the length direction, the detection electrodes are arranged at both ends of the main beam in the width direction, and the detection electrodes are arranged along the length.
  • the lead electrode is arranged on the auxiliary beam; wherein, the number of auxiliary beams is two, the auxiliary beam has a U-shaped structure, and the openings of the two auxiliary beams are arranged opposite to each other.
  • the base further includes an insulating member, the signal output member is electrically connected to the lead electrode, and the insulating member is sleeved on the signal output member and arranged in contact with the housing.
  • a protruding part is provided on the outer peripheral surface of one end of the sensing element away from the detection component, and the protruding part is connected with the housing in a limit position.
  • Another aspect of the present application provides a method for preparing a pressure-sensitive element, including: providing a sensing element, the sensing element having a predetermined cushioning deformation capacity, including a body and a connecting portion that are connected to each other, and the connecting portion extends away from the body from the body;
  • the connecting part and at least part of the body connected with the connecting part are made of stainless steel;
  • a detection component is provided, the detection component includes a vibrating beam and a detection electrode, the detection electrode is arranged on the surface of the vibrating beam facing the sensing part; the detection component is turned over to vibrate The beam and the connecting part are bonded and connected;
  • a base is provided, the base includes a housing and a signal output part, the housing has a containing chamber, and the signal output part is connected to the housing and at least partially extends into the containing chamber; the detection component and the signal are located Connect and connect the base and the sensing element and seal the containing chamber, wherein the detection component is arranged in the containing chamber, where
  • a pressure sensor including: the pressure-sensitive element described above; and a processing module connected to the pressure-sensitive element.
  • the pressure-sensitive element provided by the embodiment of the present application is made of stainless steel by making the connecting part and at least part of the body connected to the connecting part, which can withstand a relatively large pressure, so the measurement range of the pressure-sensitive element can be significantly increased; through the vibration beam
  • the bonding connection with the connecting part enables the vibrating beam of the detection component to vibrate when the sensing element is compressed and deformed.
  • the vibration frequency is converted into an electrical signal through the detection electrode, and the electrical signal is output through the signal output element to achieve the
  • the embodiment of the present application improves the measurement accuracy of the pressure sensitive element through the cooperation of the sensing element and the detection component.
  • FIG. 1 is a schematic cross-sectional structure diagram of a pressure sensitive element provided by an embodiment of the present application
  • FIG. 2 is an exploded schematic diagram of the overall structure of a pressure sensitive element provided by an embodiment of the present application
  • Figure 3 is a perspective view of the overall structure of a pressure sensitive element provided by an embodiment of the present application.
  • FIG. 4 is a first schematic diagram of a structure of a sensing element provided by an embodiment of the present application.
  • FIG. 5 is a second schematic diagram of the structure of the sensing element provided by an embodiment of the present application.
  • Figure 6 is a schematic structural diagram of a detection component provided by an embodiment of the present application.
  • Figure 7 is a schematic structural diagram of a base provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an assembly of a sensing element and a detection component provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of a simulation of a pressure sensitive element provided by an embodiment of the present application.
  • FIG. 10 is a flowchart of a method for preparing a pressure-sensitive element according to an embodiment of the present application.
  • FIG. 11 is a schematic diagram of the connection relationship of the pressure sensor provided by an embodiment of the present application.
  • 1-pressure sensitive element 10-sensor; 11-body; 111-concave part; 112-protrusion part; 113-pressure port; 12-connection part; 20-detection component; 21-vibration beam; 211-main beam; 212-auxiliary beam; 22-detection electrode; 23-lead electrode; 30-base; 31-housing; 32-signal output piece; 33-insulation piece; 40-wire segment
  • 2-pressure sensor 201-power module; 202-micro processing unit; 203-energy harvesting module; 204-wireless module; 205-exciting circuit.
  • Figure 1 shows a schematic cross-sectional structure diagram of a pressure sensitive element according to an embodiment of the present application
  • Figure 2 shows an exploded schematic diagram of the overall structure of the pressure sensitive element according to an embodiment of the present application
  • Figure 3 shows A perspective view of the overall structure of the pressure sensitive element of an embodiment of the present application is shown.
  • the pressure sensitive element 1 provided by the embodiment of the present application includes a base 30, a sensing element 10 and a detection component 20.
  • the base 30 includes a housing 31 and a signal output member 32.
  • the housing 31 has a housing chamber, and the signal output member 32 is connected to the housing 31 and at least partially extends into the housing chamber; the sensing member 10 is connected to the base 30 and closes the housing chamber,
  • the sensing element 10 has a predetermined cushioning deformation capacity.
  • the sensing element 10 includes a body 11 and a connecting portion 12 connected to each other.
  • the body 11 is connected to the housing 31 and the connecting portion 12 is located in the containing chamber.
  • the connecting portion 12 and at least the connecting portion 12 are connected to each other.
  • Part of the body 11 is made of stainless steel;
  • the detection assembly 20 is arranged in the containing chamber and connected with the signal output part 32 and the sensing part 10.
  • the detection assembly 20 includes a vibration beam 21 and a detection electrode 22, and the detection electrode 22 is arranged facing the vibration beam 21
  • the surface of the sensing element 10 is electrically connected to the signal output element 32, and the vibration beam 21 is bonded to
  • the pressure-sensitive element 1 provided by the embodiment of the present application is made of stainless steel by connecting the connecting portion 12 and at least part of the body 11 connected to the connecting portion 12, which can withstand greater pressure, and therefore can significantly improve the measurement of the pressure-sensitive element 1. Range; through the bonding connection of the vibrating beam 21 and the connecting portion 12, when the sensing member 10 is compressed and deformed, the vibrating beam 21 of the detection component 20 can be vibrated, and the vibration frequency is converted into an electrical signal through the detection electrode 22, In addition, the electrical signal is outputted by the signal output element 32 to realize pressure measurement.
  • the embodiment of the present application improves the measurement accuracy of the pressure sensitive element 1 through the cooperation of the sensing element 10 and the detection element.
  • the sensing element 10 is connected to the base 30 and the containing chamber is closed, so that the containing chamber forms a vacuum chamber.
  • the detection assembly 20 and the sensing element 10 can be protected to improve the pressure sensitivity. Reliability of component 1.
  • FIG. 4 shows a first schematic diagram of the sensing element structure of an embodiment of the present application
  • FIG. 5 shows a second schematic diagram of the sensing element structure of an embodiment of the present application
  • the body 11 of the sensing element 10 has a columnar structure.
  • a pressure port 113 is provided at the end of the body 11 of the sensing element 10 away from the connecting portion 12.
  • the pressure port 113 is a recess formed by the end of the body 11 away from the connecting portion 12 facing the inside of the body 11.
  • the groove structure in the embodiment of the present application, the groove structure is arranged at the center of the main body 11, which facilitates the production of the sensing element 10 and can make the stress distribution of the sensing element 10 more uniform when subjected to pressure.
  • the device under test is arranged at the pressure port 113, which facilitates the connection of the pressure-sensitive element 1 and the device under test.
  • the pressure port 113 is set as a groove structure to reduce the force on the pressure-sensitive element 1 The area also ensures the safety of the sensing element 10. It can be understood that the pressure port 113 of the embodiment of the present application may also be arranged at other positions of the main body 11, for example, eccentrically arranged with the main body 11, which is not limited in the present application.
  • the number of the connecting portions 12 is two or more, the two or more connecting portions 12 are arranged at intervals, and the distance between the surface of the connecting portion 12 facing the containing chamber and the surface of the body 11 overlapping the connecting portion 12 is preset Distance; where the preset distance is greater than or equal to 100 ⁇ m.
  • the preset distance is 100 ⁇ m
  • the connecting portion 12 has a rectangular parallelepiped structure.
  • the size of the connecting portion 12 is 600 ⁇ m ⁇ 600 ⁇ m ⁇ 100 ⁇ m.
  • the connecting portion 12 can also be a column structure or other irregular structure, the size parameters of the connecting portion 12 can also be set according to the needs of the user, and the number of the connecting portions 12 can also be designed according to the needs, for example, For three or four etc.
  • the connecting portion 12 is a bump structure; the connecting portion 12 starts from the end surface of the main body 11 facing the receiving chamber and extends into the receiving chamber in a direction away from the end surface; or, the main body 11 is provided with a concave portion 111 which faces the main body 11
  • the end surface of the containing chamber starts and is formed recessed in the direction away from the containing chamber.
  • the connecting portion 12 is arranged in the recess 111 and the end facing the containing chamber is coplanar with the end surface.
  • the connecting portion can be improved by rationally setting the structure of the connecting portion 12 12 and check the reliability of the connection of the component 20.
  • the outer peripheral surface of the end of the sensing element 10 away from the detection assembly 20 is provided with a protruding portion 112, and the protruding portion 112 is connected to the housing 31 in a position limit.
  • the protruding portion 112 is a flange structure provided at one end of the sensing element 10 away from the detection assembly 20.
  • FIG. 6 shows a schematic structural diagram of a detection component according to an embodiment of the present application.
  • the detection assembly 20 includes a vibration beam 21 and a detection electrode 22.
  • the detection assembly 20 further includes a lead electrode 23.
  • the lead electrode 23 is disposed on the vibration beam 21 and is electrically connected to the detection electrode 22 so that the signal detected by the detection electrode 22 can pass The lead electrode 23 outputs.
  • the vibration beam 21 on the detection assembly 20 includes a main beam 211 and an auxiliary beam 212.
  • the auxiliary beams 212 are arranged at both ends of the main beam 211 in the length direction.
  • the number of detection electrodes 22 is two. At both ends of the beam 211 in the width direction, the detection electrode 22 extends along the length of the main beam 211, and the lead electrode 23 is arranged on the auxiliary beam 212; wherein the number of the auxiliary beam 212 is two, and the auxiliary beam 212 has a U-shaped structure.
  • the openings of the two auxiliary beams 212 are arranged opposite to each other.
  • a lead electrode 23 is respectively provided at both ends of the two detection electrodes 22, which can realize the redundant setting of signal output, and the provision of multiple lead electrodes 23 can improve the accuracy of signal transmission and further improve the performance of the pressure sensitive element 1. measurement accuracy.
  • the vibrating beam 21 is a Z-cut quartz single crystal wafer, and the thickness of the vibrating beam 21 is 200 ⁇ m.
  • the size of the vibrating beam 21 can be set according to the needs of the user, which can be 150 ⁇ m or 250 ⁇ m. Wait.
  • the detection component 20 is made of quartz material, and the vibrating beam 21 and the connecting portion 12 are bonded and connected by glass paste, which improves the connection stability of the vibrating beam 21 and the connecting portion 12.
  • two anchor points are provided at both ends of the main beam 211 of the vibrating beam 21, the connecting part 12 and the anchor point are arranged oppositely, and a layer of glass paste is arranged between the connecting part 12 and the anchor point.
  • the bonding connection between the connecting portion 12 and the anchor point is realized through the glass paste layer.
  • the sensing element 10 in the embodiment of the present application can be made of stainless steel as a whole.
  • the thermal expansion coefficient of the glass paste is similar to that of stainless steel and quartz material, which can effectively reduce the thermal mismatch effect between different materials and improve the pressure sensitive element. 1 stability.
  • FIG. 7 shows a schematic structural diagram of a base 30 according to an embodiment of the present application.
  • the base 30 includes a housing 31 and a signal output member 32.
  • the housing 31 has a containing chamber, and the signal output member 32 is connected to the housing 31.
  • the base 30 further includes an insulating member 33, the signal output member 32 is electrically connected to the lead electrode 23, and the insulating member 33 is sleeved on the signal output member 32 and arranged in contact with the housing 31.
  • the housing 31 is made of stainless steel, and the surface of the signal output member 32 is plated with a transition metal layer for deriving the pressure signal.
  • the inner surface of the base 30 is a ring-shaped wall surface, which cooperates with the cylindrical sensing element 10 to realize the sealed connection of the pressure sensitive element 1.
  • the inner surface of the base 30 may also be formed by connecting multiple planes, which is not limited in this application.
  • the pressure sensitive element 1 of the embodiment of the present application uses the resonance effect to measure pressure.
  • the pressure sensitive element 1 is a quartz tuning fork resonance component, wherein the sensing element 10 is an elastic diaphragm, and the detection component 20 is a tuning fork type force sensitive resonance
  • the vibration beam 21 is a resonant beam.
  • the sensing element 10 stretches the vibrating beam 21 in a direction parallel to the detection assembly 20 through the connecting portion 12, and the frequency of the resonant beam changes with the change of the applied force, thereby obtaining the specific parameters of the pressure and the change of the pressure.
  • FIG. 9 shows a simulation schematic diagram of the pressure sensitive element 1 in an embodiment of the present application.
  • the resonance center frequency of the vibrating beam is 81.595kHz and the full pressure is 100MPa
  • the center frequency shifts by 10kHz, that is, the pressure resolution is 10kPa/Hz, and the accuracy is better than 0.02%.
  • FIG. 10 shows a flowchart of the method 100 for preparing a pressure sensitive element according to an embodiment of the present application.
  • the manufacturing method of the pressure sensitive element of the embodiment of the present application includes step S110 to step S150.
  • S110 Provide a sensing element, which has a predetermined cushioning deformation capacity, and includes a body and a connecting portion that are connected to each other, and the connecting portion extends away from the body from the body; the connecting portion and at least part of the body connected to the connecting portion are made of stainless steel .
  • a detection component In S120, a detection component is provided.
  • the detection component includes a vibration beam and a detection electrode, and the detection electrode is arranged on a surface of the vibration beam facing the sensing element.
  • a base is provided.
  • the base includes a housing and a signal output member.
  • the housing has a containing chamber, and the signal output member is connected to the housing and at least partially extends into the containing chamber.
  • S150 Connect the detection component with the signal-located component, connect the base and the sensing component, and seal the containing chamber, wherein the detection component is arranged in the containing chamber.
  • step S110 the sensing element 10 is manufactured by precision machining, so that the sensing element 10 has a connecting portion 12, and polishing the surface of the connecting portion 12 away from the body 11 of the sensing element 10, so that the surface of the connecting portion 12 achieves a mirror effect. Yes, the surface roughness Ra ⁇ 1nm, so that the connecting portion 12 and the detection component 20 are better connected.
  • Step S120 also includes the step of preparing the detection component 20:
  • Step 1 Prepare a Z-cut quartz single crystal wafer to make a vibrating beam 21.
  • the thickness of the quartz single crystal wafer is 200 ⁇ m;
  • Step 2 Deposit a chromium film and a gold film on the quartz wafer in sequence, and use the chromium film and the gold film as an anisotropic etching mask;
  • Step 3 etch and pattern the chromium film and the gold film to form the detection electrode 22 and the lead electrode 23 through photolithography patterning and wet etching processes;
  • Step 4 the quartz single crystal wafer is etched through the quartz wet anisotropy to form the detection component 20.
  • the vibration beam 21 includes a main beam 211 and two U-shaped auxiliary beams 212 connected at both ends of the main beam 211.
  • the openings of the two auxiliary beams 212 are arranged opposite to each other, the detection electrode 22 is arranged on the main beam, and the lead electrode 23 is arranged on the main beam.
  • the main beam 211 of the vibrating beam has a width of 200 ⁇ m and a length of 3.5 mm.
  • Two anchor points are provided at both ends of the main beam 211, and the size of the anchor points is 600 ⁇ m ⁇ 600 ⁇ m square.
  • step S130 the detection component 20 is turned over 180° so that the anchor point of the detection component 20 is aligned with the connecting portion 12 of the sensing component 10, and the detection component 20 is bonded to the sensing component 10 by using glass paste. Then the detection electrode 22 is connected to the signal output member 32 through the wire section 40.
  • the backside of the pressure sensitive element 1 is brought into contact with the DUT, which facilitates the extraction of electrical signals, improves the media compatibility and anti-radiation characteristics of the pressure sensitive element 1, and makes the pressure sensitive element 1 1 Capable of measuring a variety of pressure media.
  • step S150 the induction member 10 and the base 30 are welded using a vacuum electron beam welding process to form the pressure sensitive element 1.
  • Vacuum laser welding or vacuum electron beam welding is used to realize vacuum packaging of the pressure-sensitive element 1, reduce resonance damping, and greatly increase the Q value.
  • the production sequence from S110 to S150 can be designed according to the user's needs without conflict. For example, it can be prepared in sequence from S110 to S150, or it can be performed in the order of S120 and S110. Swap.
  • FIG. 11 shows a schematic diagram of the connection relationship of the pressure sensor 2 according to an embodiment of the present application.
  • the pressure sensor 2 includes: the pressure-sensitive element 1 described above and a processing module, and the processing module is connected to the pressure-sensitive element 1.
  • the processing module includes one or a combination of a Microcontroller Unit (MCU), a wireless module 204, a power supply module 201, and an energy harvesting module 203.
  • the pressure sensor 2 in the embodiment of the present application includes a pressure sensitive element 1, a micro processing unit 202, a wireless module 204, a power supply module 201, and an energy harvesting module 203, wherein the micro processing unit 202 is connected to the pressure sensitive element 1, wireless
  • the module 204 is connected, the power module 201 and the energy harvesting module 203 are connected to receive and control signals from the pressure sensitive element 1, the wireless module 204, the power module 201, and the energy harvesting module 203.
  • the power module 201 provides power to the pressure sensor 2.
  • the wireless module 204 is used to communicate with an external device, and is used to perform data interaction with the external device.
  • the pressure sensor 2 includes an excitation circuit 205.
  • the resonance frequency of the vibrating beam 21 is between 30 and 80 kHz. According to the pressure range, the full resonant frequency changes by about 1 to 10 kHz. The relationship between frequency and pressure can be demodulated. High-precision pressure measurement.
  • the pressure sensor 2 of the embodiment of the present application includes a pressure-sensitive element 1.
  • the connecting portion 12 and at least part of the body 11 connected to the connecting portion 12 are made of stainless steel, which improves the compressive strength of the pressure sensor 2 and can withstand relatively A large pressure can significantly improve the measurement range and safety of the pressure sensitive element 1; through the bonding connection of the vibrating beam 21 and the connecting portion 12, when the sensing element 10 is compressed and deformed, the vibrating beam of the detection component can be made 21. Vibration is generated, the vibration frequency is converted into an electrical signal through the detection electrode 22, and the electrical signal is output through the signal output part 32 to achieve pressure measurement.
  • the embodiment of the present application improves the pressure sensitive element through the cooperation of the sensing part 10 and the detection part. 1 measurement accuracy.
  • the pressure sensor provided in the embodiments of the present application adopts the principle of quartz resonance pressure measurement, which improves the accuracy and long-term stability of the sensor.
  • the overall performance of the sensor is expected to be increased to 100MPa at full capacity and ⁇ 0.02% accuracy;
  • the excitation circuit of the pressure sensor 2 in the embodiment is relatively simple, and the MCU and the wireless module 204 can be integrated to realize the intelligence of the pressure sensor 2.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

一种压敏元件（1）、压敏元件（1）的制备方法和压力传感器（2）。压敏元件（1）包括：基座（30），基座（30）包括外壳（31）以及信号输出件（32），外壳（31）具有容纳腔室，信号输出件（32）连接于外壳（31）且至少部分延伸进入容纳腔室；感应件（10），与基座（30）连接并封闭容纳腔室，感应件（10）具有预定的缓冲变形能力，感应件（10）包括相互连接的本体（11）以及连接部（12），本体（11）与外壳（31）连接且连接部（12）位于容纳腔室内，连接部（12）以及与连接部（12）连接的至少部分本体（11）由不锈钢材料制成；检测组件（20），设置于容纳腔室并与信号输出件（32）以及感应件（10）连接，检测组件（20）包括振动梁（21）和检测电极（22），检测电极（22）设置在振动梁（21）面向感应件（10）的表面并与信号输出件（32）电连接，振动梁（21）与连接部（12）键合连接。该压敏元件（1）能够实现大量程的压力测量，且测量精度高。

Description

压敏元件、压敏元件的制备方法和压力传感器
相关申请的交叉引用
本申请要求享有于2019年05月13日提交的发明名称为“压敏元件、压敏元件的制备方法和压力传感器”、申请号为201910394886.5的中国专利申请的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及传感器技术领域，特别是涉及一种压敏元件、压敏元件的制备方法和压力传感器。
背景技术
在现有的很多压力测试场合中，例如航空航天、舰船、能源领域及工业领域，有相当一部分都采用压力传感器对压力进行测量，大部分压力测试场合的被测件受到的压力比较恒定或者受到的压力在一个较窄的变化范围内。
随着科技进步和很多压力传感器的使用要求的提高，在压力测试场合对被测件的施加压力范围也提出了更高的要求。而目前的压力传感器，无法满足对该压力区间连续控制的要求，或者，在测试较大压力时的测量精度较差，不能满足需求。
因此，期望一种大量程、高精度的压力传感器。
发明内容
本申请实施例提供一种压敏元件、压敏元件的制备方法和压力传感器，其中压敏元件能够实现大量程的压力测量，而且，测量精度高。
针对上述问题，根据本申请实施例提供一种压敏元件，包括：基座，包括外壳以及信号输出件，外壳具有容纳腔室，信号输出件连接于外壳且 至少部分延伸进入容纳腔室；感应件，与基座连接并封闭容纳腔室，感应件具有预定的缓冲变形能力，感应件包括相互连接的本体以及连接部，本体与外壳连接且连接部位于容纳腔室内，连接部以及与连接部连接的至少部分本体由不锈钢材料制成；检测组件，设置于容纳腔室并与信号输出件以及感应件连接，检测组件包括振动梁和检测电极，检测电极设置在振动梁面向感应件的表面并与信号输出件电连接，振动梁与连接部键合连接。
根据本申请一方面的实施方式，检测组件由石英材料制成，振动梁与连接部通过玻璃浆料键合连接。
根据本申请一方面前述任一实施方式，连接部的数量为两个及以上，两个及以上连接部间隔设置，连接部面向容纳腔室的表面和与连接部交叠的本体的表面之间相距预设距离；其中，预设距离大于或等于100μm。
根据本申请一方面前述任一实施方式，连接部为凸块结构；连接部由本体面向容纳腔室的端面起始并远离端面的方向延伸进入容纳腔室；或者，本体上设置有凹部，凹部由本体面向容纳腔室的端面起始并向远离容纳腔室的方向凹陷形成，连接部设置于凹部且面向容纳腔室的一端与端面共面。
根据本申请一方面前述任一实施方式，检测组件进一步包括引线电极，引线电极设置于振动梁并与检测电极电性连接。
根据本申请一方面前述任一实施方式，振动梁包括主梁和辅助梁，辅助梁设置在主梁的长度方向的两端，检测电极设置于主梁的宽度方向的两端，检测电极沿长度方向延伸，引线电极设置于辅助梁上；其中，辅助梁的数量为两个，辅助梁为U型结构，两个辅助梁的开口背对设置。
根据本申请一方面前述任一实施方式，基座进一步包括绝缘件，信号输出件与引线电极电性连接，绝缘件套设在信号输出件上且与外壳接触设置。
根据本申请一方面前述任一实施方式，感应件远离检测组件一端的外周表面设置有凸出部，凸出部与外壳限位连接。
本申请的另一个方面提供一种压敏元件的制备方法，包括：提供感应件，感应件具有预定的缓冲变形能力，包括相互连接的本体和连接部，连接部由本体向远离本体方向延伸；连接部和与连接部连接的至少部分本体 为不锈钢材料制成；提供检测组件，检测组件包括振动梁和检测电极，检测电极设置在振动梁面向感应件的表面；将检测组件翻转，以将振动梁与连接部键合连接；提供基座，基座包括外壳以及信号输出件，外壳具有容纳腔室，信号输出件连接于外壳且至少部分延伸进入容纳腔室；将检测组件与信号所处件连接且将基座和感应件连接并封闭容纳腔室，其中，检测组件设置于容纳腔室内
本申请的又一个方面提供一种压力传感器，包括：上述内容所述的压敏元件；处理模块，与压敏元件连接。
本申请实施例提供的压敏元件，通过将连接部和与连接部连接的至少部分本体为不锈钢材料制成，能够承受较大的压力，因此可以显著提高压敏元件的测量量程；通过振动梁和连接部的键合连接，使得在感应件受压产生变形时，能够使检测部件的振动梁产生振动，通过检测电极将振动频率转化成电信号，并通过信号输出件将电信号输出实现对压力的测量，本申请实施例通过感应件和检测部件相配合提高了压敏元件的测量精度。
附图说明
下面将对本申请实施例中所需要使用的附图作简单的介绍，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一个实施例提供的压敏元件的剖面结构示意图；
图2是本申请一个实施例提供的压敏元件整体结构的爆炸示意图；
图3是本申请一个实施例提供的压敏元件整体结构的立体图；
图4是本申请一个实施例提供的感应件结构的第一示意图；
图5是本申请一个实施例提供的感应件结构的第二示意图；
图6是本申请一个实施例提供的检测组件的结构示意图；
图7是本申请一个实施例提供的基座的结构示意图；
图8是本申请一个实施例提供的感应件和检测组件的装配示意图；
图9是本申请一个实施例提供的压敏元件的仿真示意图；
图10是本申请一个实施例提供的压敏元件制备方法的流程图；
图11是本申请一个实施例提供的压力传感器的连接关系示意图。
标记说明：
其中：
1-压敏元件；10-感应件；11-本体；111-凹部；112-凸出部；113-压力接口；12-连接部；20-检测组件；21-振动梁；211-主梁；212-辅助梁；22-检测电极；23-引线电极；30-基座；31-外壳；32-信号输出件；33-绝缘件；40-导线段
2-压力传感器；201-电源模块；202-微处理单元；203-能量收集模块；204-无线模块；205-激振电路。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅被配置为解释本申请，用于示例性的说明本申请的原理，并不被配置为限定本申请。另外，附图中的机构件不一定是按照比例绘制的。例如，可能对于其他结构件或区域而放大了附图中的一些结构件或区域的尺寸，以帮助对本申请实施例的理解。
下述描述中出现的方位词均为图中示出的方向，并不是对本申请实施例的具体结构进行限定。在本申请的描述中，需要说明的是，除非另有说明，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可视具体情况理解上述术语在本申请中的具体含义。
此外术语“包括”、“包含”“具有”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素结构件或组件不仅包括那些要素，而且还包括没有明确列出或固有的属于结构件、组件上的其他机构件。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在 包括要素的物品或者设备中还存在另外的相同要素。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
下面将详细描述本申请的各个方面的特征和示例性实施例。此外，下文中所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。
请参阅图1至图3，图1示出了本申请一个实施例的压敏元件的剖面结构示意图，图2示出了本申请一个实施例的压敏元件整体结构的爆炸示意图，图3示出了本申请一个实施例的压敏元件整体结构的立体图。本申请的实施例提供的压敏元件1包括基座30、感应件10和检测组件20。
基座30包括外壳31以及信号输出件32，外壳31具有容纳腔室，信号输出件32连接于外壳31且至少部分延伸进入容纳腔室；感应件10与基座30连接并封闭容纳腔室，感应件10具有预定的缓冲变形能力，感应件10包括相互连接的本体11以及连接部12，本体11与外壳31连接且连接部12位于容纳腔室内，连接部12以及与连接部12连接的至少部分本体11由不锈钢材料制成；检测组件20设置于容纳腔室并与信号输出件32以及感应件10连接，检测组件20包括振动梁21和检测电极22，检测电极22设置在振动梁21面向感应件10的表面并与信号输出件32电连接，振动梁21与连接部12键合连接。
本申请实施例提供的压敏元件1，通过将连接部12和与连接部12连接的至少部分本体11为不锈钢材料制成，能够承受较大的压力，因此可以显著提高压敏元件1的测量量程；通过振动梁21和连接部12的键合连接，使得在感应件10受压产生变形时，能够使检测部件20的振动梁21产生振动，通过检测电极22将振动频率转化成电信号，并通过信号输出件32将电信号输出实现对压力的测量，本申请实施例通过感应件10和检测部件相配合提高了压敏元件1的测量精度。
本申请实施例中，感应件10与基座30连接并封闭容纳腔室，以使容纳腔室形成真空腔室，通过形成真空腔室能够对检测组件20和感应件10进行保护，提高压敏元件1的可靠性。
具体的，请参阅图4和图5，图4示出了本申请一个实施例的感应件结构的第一示意图，图5示出了本申请一个实施例的感应件结构的第二示意图。感应件10的本体11为柱状结构，在感应件10的本体11远离连接部12的一端设置有压力接口113，压力接口113为由本体11远离连接部12的端面向本体11内部凹陷形成的凹槽结构，在本申请实施例中，凹槽结构设置在本体11的中心位置，便于感应件10的制作且能够使得感应件10在受到压力时的应力分布更加均匀。通过设置压力接口113，使得被测件设置在压力接口113处，便于压敏元件1与被测件的连接，同时将压力接口113设置为凹槽结构，减小了压敏元件1的受力面积，也保证了感应件10安全性。可以理解的是，本申请实施例的压力接口113也可以设置在本体11的其他位置，例如与本体11偏心设置，本申请对此不进行限定。
进一步的，连接部12的数量为两个及以上，两个及以上连接部12间隔设置，连接部12面向容纳腔室的表面和与连接部12交叠的本体11的表面之间相距预设距离；其中，预设距离大于或等于100μm。本申请实施例中，预设距离为100μm，连接部12为长方体结构，可选的，连接部12的尺寸为600μm×600μm×100μm。可以理解的是，连接部12也可以为柱体结构或其他不规则结构，连接部12的尺寸参数也可以根据用户的需求进行设定，连接部12的数量也可以根据需求进行设计，例如可以为三个或四个等。
连接部12为凸块结构；连接部12由本体11面向容纳腔室的端面起始并向远离端面的方向延伸进入容纳腔室；或者，本体11上设置有凹部111，凹部111由本体11面向容纳腔室的端面起始并向远离容纳腔室的方向凹陷形成，连接部12设置于凹部111且面向容纳腔室的一端与端面共面，通过将连接部12的结构合理设置能够提高连接部12和检测组件20连接的可靠性。
请进一步参阅图2，感应件10远离检测组件20一端的外周表面设置有凸出部112，凸出部112与外壳31限位连接。可选的，凸出部112为设置在感应件10远离检测组件20一端的凸缘结构，在感应件10与基座30装配时，凸出部112可以对感应件10的装配位置进行限位，同时凸出部112卡接与基座30的端面上，以实现更好的密封容纳腔室。
请参阅图6，图6示出了本申请一个实施例的检测组件的结构示意图。检测组件20包括振动梁21和检测电极22，其中，检测组件20进一步包括引线电极23，引线电极23设置于振动梁21并与检测电极22电性连接，以使检测电极22检测到的信号通过引线电极23输出。
检测组件20上的振动梁21包括主梁211和辅助梁212，辅助梁212设置在主梁211的长度方向的两端，检测电极22的数量为两个，两个检测电极22间隔设置于主梁211的宽度方向的两端，检测电极22沿主梁211的长度方向延伸，引线电极23设置于辅助梁212上；其中，辅助梁212的数量为两个，辅助梁212为U型结构，两个辅助梁212的开口背对设置。具体的，两个检测电极22的两端分别设置有一个引线电极23，能够实现信号输出的冗余设置，而且设置多个引线电极23能够提高信号传输的准确性，进一步提高压敏元件1的测量精度。在本申请的一个实施例中，振动梁21为Z切石英单晶晶圆，振动梁21的厚度为200μm，其中，振动梁21的尺寸可以根据用户的需求进行设定，可以为150μm或250μm等。
检测组件20由石英材料制成，振动梁21与连接部12通过玻璃浆料键合连接，提高了振动梁21和连接部12的连接稳定性。具体的，在振动梁21的主梁211两端设置有两个锚点，连接部12和锚点相对设置，在连接部12和锚点之间设置有一层玻璃浆料层，通过对玻璃浆料的烧结形成，在烧结过程，通过玻璃浆料层实现连接部12和锚点之间键合连接。进一步的，本申请实施例中的感应件10整体可以为不锈钢材料，玻璃浆料的热膨胀系数与不锈钢材料和石英材料相近，能够有效减少不同材料之间的热失配效应，提高了压敏元件1的稳定性。
请参阅图7，图7示出了本申请一个实施例的基座30的结构示意图，基座30包括外壳31以及信号输出件32，外壳31具有容纳腔室，信号输出 件32连接于外壳31且至少部分延伸进入容纳腔室，基座30进一步包括绝缘件33，信号输出件32与引线电极23电性连接，绝缘件33套设在信号输出件32上且与外壳31接触设置。可选的，外壳31由不锈钢材料制成，信号输出件32的表面镀有过渡金属层，用于将压力信号导出。可选的，基座30的内表面呈环形壁面，与柱状的感应件10相配合，实现压敏元件1的密封连接。当然，基座30的内表面还可以为多个平面连接形成的，本申请不进行限定。
本申请实施例的压敏元件1利用谐振效应对压力进行测量，可选的，压敏元件1为石英音叉谐振组件，其中，感应件10为弹性膜片，检测组件20为音叉式力敏谐振器，振动梁21为谐振梁，当压力作用于感应件10时，使感应件10产生形变，由于感应件10产生形变作用，导致感应件10上的连接部12之间的相对位置产生变化，导致感应件10通过连接部12沿与检测组件20的平行方向拉伸振动梁21，谐振梁的频率随作用力的变化而变化，以此得到压力的具体参数和压力的变化。
请参阅图9，图9示出了本申请一个实施例中压敏元件1的仿真示意图。根据理论仿真结果可知，当振动梁的谐振中心频率为81.595kHz，压力满量100MPa变化时，中心频率偏移10kHz，即压力分辨率为10kPa/Hz，精度优于0.02％，能够实现了大量程高精度的压力测量。
本申请的另一个方面提供一种压敏元件的制备方法100，请参阅图10，图10中示出了本申请一个实施例的压敏元件制备方法100的流程图。本申请实施例的压敏元件的制备方法包括步骤S110至步骤S150。
S110，提供感应件，感应件具有预定的缓冲变形能力，包括相互连接的本体和连接部，连接部由本体向远离本体方向延伸；连接部和与连接部连接的至少部分本体为不锈钢材料制成。
S120，提供检测组件，检测组件包括振动梁和检测电极，检测电极设置在振动梁面向感应件的表面。
S130，将检测组件翻转，以将振动梁与连接部键合连接。
S140，提供基座，基座包括外壳以及信号输出件，外壳具有容纳腔室，信号输出件连接于外壳且至少部分延伸进入容纳腔室。
S150，将检测组件与信号所处件连接且将基座和感应件连接并封闭容纳腔室，其中，检测组件设置于容纳腔室内。
在步骤S110中，通过精密机械加工制作感应件10，使得感应件10具有连接部12，对连接部12远离感应件10本体11的表面进行抛光，使连接部12的表面达到镜面效果，可选的，该表面的粗糙度Ra<1nm，以使连接部12与检测组件20更好的进行连接。
在步骤S120中还包括制备检测组件20的步骤：
步骤1，准备Z切石英单晶晶圆制作振动梁21，可选的，石英单晶晶圆的厚度200μm；
步骤2，依次在石英晶圆上沉积铬薄膜和金薄膜，并把铬薄膜和金薄膜作为各向异性刻蚀掩膜；
步骤3，通过光刻图形化和湿法刻蚀工艺，对铬薄膜和金薄膜进行刻蚀图形化形成检测电极22和引线电极23；
步骤4，通过石英湿法各向异性对石英单晶晶圆进行刻蚀，形成检测组件20。
其中，振动梁21包括主梁211和连接在主梁211两端的两个U型辅助梁212，两个辅助梁212的开口背对设置，检测电极22设置在主梁上，引线电极23设置在辅助梁212上。其中，振动梁主梁211的宽度为200μm，长度3.5mm，主梁211两端设置有两个锚点，锚点的尺寸为600μm×600μm方形。
S130步骤中，将检测组件20翻转180°，使得检测组件20的锚点与感应件10的连接部12对准，通过使用玻璃浆料将检测组件20与感应件10键合。然后通过导线段40将检测电极22与信号输出件32连接。通过将检测组件20采用倒装焊接结构，使得压敏元件1的背面接触被测件，便于将电信号引出，提高了压敏元件1的介质兼容性和抗辐照特性，而且使压敏元件1能够测量多种压力介质。
S150步骤中，采用真空电子束焊接工艺感应件10与基座30进行焊接，形成压敏元件1。采用真空激光焊接或真空电子束焊接，实现压敏元件1的真空封装，降低谐振阻尼，极大的提高了Q值。
可以理解的是，S110至步骤S150的制作顺序在不冲突的情况下可以根据用户的需求进行设计，例如可以按照S110至步骤S150的顺序依次进行制备，也可以将步骤S120与步骤S110的顺序进行调换。
本申请的又一个方面提供一种压力传感器2，请参阅图11，图11示出了本申请一个实施例的压力传感器2的连接关系示意图。压力传感器2包括：上述内容所述的压敏元件1和处理模块，处理模块与压敏元件1连接。
处理模块包括微控制单元(Microcontroller Unit，MCU)、无线模块204、电源模块201、能量收集模块203的一种或组合。可选的，本申请实施例中的压力传感器2包括压敏元件1、微处理单元202、无线模块204、电源模块201和能量收集模块203，其中微处理单元202分别与压敏元件1、无线模块204连接、电源模块201和能量收集模块203连接，用于接收并控制压敏元件1、无线模块204、电源模块201和能量收集模块203的信号，其中电源模块201为压力传感器2提供电能，无线模块204用于与外部设备进行通信连接，用于与外部设备进行数据交互。压力传感器2中包括有激振电路205，通常振动梁21的谐振频率在30～80kHz，根据压力量程的不同，谐振频率的满量变化约1～10kHz，通过解调频率与压力关系，能够实现高精度的压力测量。
本申请实施例的压力传感器2，包括压敏元件1，通过将连接部12和与连接部12连接的至少部分本体11为不锈钢材料制成，提高了压力传感器2的抗压强度，能够承受较大的压力，因此可以显著提高压敏元件1的测量量程和安全性；通过振动梁21和连接部12的键合连接，使得在感应件10受压产生变形时，能够使检测部件的振动梁21产生振动，通过检测电极22将振动频率转化成电信号，并通过信号输出件32将电信号输出实现对压力的测量，本申请实施例通过感应件10和检测部件相配合提高了压敏元件1的测量精度。
进一步的，本申请实施例提供的压力传感器采用石英谐振式测压原理，提升了传感器的精度和长期稳定性，采用该种设计，传感器整体性能有望提升至满量100MPa、精度±0.02％；本实施例中的压力传感器2的激振电路较为简单，可集成MCU和无线模块204等，实现压力传感器2的智能 化。
应理解，术语“第一”、“第二”、等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。需要理解，如此使用的术语在适当的情况下是可以互换的，以使本文所描述的申请中的实施例，例如，能够按照除了本文说明的或其他方式描述的那些顺次而工作或排列。
本申请可以以其他的具体形式实现，而不脱离其精神和本质特征。因此，当前的实施例在所有方面都被看作是示例性的而非限定性的，本申请的范围由所附权利要求而非上述描述定义，并且，落入权利要求的含义和等同物的范围内的全部改变从而都被包括在本申请的范围之中。并且，在不同实施例中出现的不同技术特征可以进行组合，以取得有益效果。本领域技术人员在研究附图、说明书及权利要求书的基础上，应能理解并实现所揭示的实施例的其他变化的实施例。

Claims (10)

  1. 一种压敏元件，包括：
    基座，包括外壳以及信号输出件，所述外壳具有容纳腔室，所述信号输出件连接于所述外壳且至少部分延伸进入所述容纳腔室；
    感应件，与所述基座连接并封闭所述容纳腔室，所述感应件具有预定的缓冲变形能力，所述感应件包括相互连接的本体以及连接部，所述本体与所述外壳连接且所述连接部位于所述容纳腔室内，所述连接部以及与所述连接部连接的至少部分所述本体由不锈钢材料制成；
    检测组件，设置于所述容纳腔室并与所述信号输出件以及所述感应件连接，所述检测组件包括振动梁和检测电极，所述检测电极设置在所述振动梁面向所述感应件的表面并与所述信号输出件电连接，所述振动梁与所述连接部键合连接。
  2. 根据权利要求1所述的压敏元件，其中，所述检测组件由石英材料制成，所述振动梁与所述连接部通过玻璃浆料键合连接。
  3. 根据权利要求1所述的压敏元件，其中，所述连接部的数量为两个及以上，两个及以上所述连接部间隔设置，所述连接部面向所述容纳腔室的表面和与所述连接部交叠的所述本体的表面之间相距预设距离；
    其中，所述预设距离大于或等于100μm。
  4. 根据权利要求1所述的压敏元件，其中，所述连接部为凸块结构；
    所述连接部由所述本体面向所述容纳腔室的端面起始并向远离所述端面的方向延伸进入所述容纳腔室；或者，所述本体上设置有凹部，所述凹部由所述本体面向所述容纳腔室的端面起始并向远离所述容纳腔室的方向凹陷形成，所述连接部设置于所述凹部且面向所述容纳腔室的一端与所述端面共面。
  5. 根据权利要求1所述的压敏元件，其中，所述检测组件进一步包括引线电极，所述引线电极设置于所述振动梁并与所述检测电极电性连接。
  6. 根据权利要求5所述的压敏元件，其中，所述振动梁包括主梁和辅助梁，所述辅助梁设置在所述主梁的长度方向的两端，所述检测电极设置 于所述主梁的宽度方向的两端，所述检测电极沿所述长度方向延伸，所述引线电极设置于所述辅助梁上；
    其中，所述辅助梁的数量为两个，所述辅助梁为U型结构，两个所述辅助梁的开口背对设置。
  7. 根据权利要求5所述的压敏元件，其中，所述基座进一步包括绝缘件，所述信号输出件与所述引线电极电性连接，所述绝缘件套设在所述信号输出件上且与所述外壳接触设置。
  8. 根据权利要求1所述的压敏元件，其中，所述感应件远离所述检测组件一端的外周表面设置有凸出部，所述凸出部与所述外壳限位连接。
  9. 一种压敏元件的制备方法，包括：
    提供感应件，所述感应件具有预定的缓冲变形能力，包括相互连接的本体和连接部，所述连接部由所述本体向远离所述本体方向延伸；所述连接部和与所述连接部连接的至少部分所述本体为不锈钢材料制成；
    提供检测组件，所述检测组件包括振动梁和检测电极，所述检测电极设置在所述振动梁面向所述感应件的表面；
    将所述检测组件翻转，以将所述振动梁与所述连接部键合连接；
    提供基座，所述基座包括外壳以及信号输出件，所述外壳具有容纳腔室，所述信号输出件连接于所述外壳且至少部分延伸进入所述容纳腔室；
    将所述检测组件与所述信号所处件连接且将所述基座和所述感应件连接并封闭所述容纳腔室，其中，所述检测组件设置于所述容纳腔室内。
  10. 一种压力传感器，包括：
    权利要求1-8任一项所述的压敏元件；
    处理模块，与所述压敏元件连接。
PCT/CN2020/090028 2019-05-13 2020-05-13 压敏元件、压敏元件的制备方法和压力传感器 WO2020228738A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910394886.5A CN111928980A (zh) 2019-05-13 2019-05-13 压敏元件、压敏元件的制备方法和压力传感器
CN201910394886.5 2019-05-13

Publications (1)

Publication Number Publication Date
WO2020228738A1 true WO2020228738A1 (zh) 2020-11-19

Family

ID=73282584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/090028 WO2020228738A1 (zh) 2019-05-13 2020-05-13 压敏元件、压敏元件的制备方法和压力传感器

Country Status (2)

Country Link
CN (1) CN111928980A (zh)
WO (1) WO2020228738A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004132913A (ja) * 2002-10-11 2004-04-30 Toyo Commun Equip Co Ltd 感圧素子、及びこれを用いた圧力センサ
JP2007171123A (ja) * 2005-12-26 2007-07-05 Epson Toyocom Corp 圧力センサ及び感圧素子
CN101348233A (zh) * 2008-09-09 2009-01-21 西安交通大学 微结构谐振梁压力传感器
CN102200483A (zh) * 2010-03-25 2011-09-28 精工爱普生株式会社 压力检测装置
CN202204625U (zh) * 2011-09-21 2012-04-25 中国电子科技集团公司第四十九研究所 梁膜结构石英压力谐振元件
CN102650559A (zh) * 2011-02-25 2012-08-29 精工爱普生株式会社 物理量检测器及其制造方法
CN104913864A (zh) * 2015-06-23 2015-09-16 西安励德微系统科技有限公司 一种抑制同频干扰的硅谐振压力传感器结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912990A (en) * 1989-02-27 1990-04-03 Sundstrand Data Control, Inc. Magnetically driven vibrating beam force transducer
JP4332859B2 (ja) * 2007-04-27 2009-09-16 エプソントヨコム株式会社 圧力センサ
CN101327592B (zh) * 2008-07-23 2010-06-16 哈尔滨工业大学 集成压阻微力检测的四臂式mems微夹持器
JP2012073163A (ja) * 2010-09-29 2012-04-12 Seiko Epson Corp 圧力センサー
WO2012140846A1 (ja) * 2011-04-12 2012-10-18 パナソニック株式会社 Ｍｅｍｓ圧力センサ
CN109576345A (zh) * 2018-10-17 2019-04-05 西人马（厦门）科技有限公司 一种用于dna提取的微流控芯片及其检测方法
CN109580077B (zh) * 2018-12-06 2020-07-28 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 压力传感器结构及其制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004132913A (ja) * 2002-10-11 2004-04-30 Toyo Commun Equip Co Ltd 感圧素子、及びこれを用いた圧力センサ
JP2007171123A (ja) * 2005-12-26 2007-07-05 Epson Toyocom Corp 圧力センサ及び感圧素子
CN101348233A (zh) * 2008-09-09 2009-01-21 西安交通大学 微结构谐振梁压力传感器
CN102200483A (zh) * 2010-03-25 2011-09-28 精工爱普生株式会社 压力检测装置
CN102650559A (zh) * 2011-02-25 2012-08-29 精工爱普生株式会社 物理量检测器及其制造方法
CN202204625U (zh) * 2011-09-21 2012-04-25 中国电子科技集团公司第四十九研究所 梁膜结构石英压力谐振元件
CN104913864A (zh) * 2015-06-23 2015-09-16 西安励德微系统科技有限公司 一种抑制同频干扰的硅谐振压力传感器结构

Also Published As

Publication number Publication date
CN111928980A (zh) 2020-11-13

Similar Documents

Publication Publication Date Title
US8297124B2 (en) Pressure sensor
US7779700B2 (en) Pressure sensor
JP4998860B2 (ja) 圧力センサー素子、圧力センサー
WO2017215254A1 (zh) 一种双空腔压力计芯片及其制造工艺
US8011252B2 (en) Pressure sensor
US7895896B2 (en) Pressure sensor
CN103105248B (zh) 一种硅基双岛结构石英梁谐振式微压力传感器
US20120096945A1 (en) Pressure sensor
JP4332859B2 (ja) 圧力センサ
CN102928131A (zh) 一种石英谐振梁式微压力传感器芯片
JP2004132913A (ja) 感圧素子、及びこれを用いた圧力センサ
JP2006170984A (ja) 圧力を検知するためのシステム及び方法
JP2013104753A (ja) 物理量検出器
WO2020228738A1 (zh) 压敏元件、压敏元件的制备方法和压力传感器
JPH09297082A (ja) 圧力センサ
JP5712674B2 (ja) 力検出器収容ケース、力測定器
JP2010243276A (ja) 相対圧力センサー、相対圧力測定装置及び相対圧力測定方法
JP4984068B2 (ja) 圧力センサ
JPS5856428B2 (ja) 水晶振動子を用いた圧力センサ
JP2005195423A (ja) 圧力センサ
JP2007171123A (ja) 圧力センサ及び感圧素子
JP2014126423A (ja) 圧力センサー、および真空装置
Yu et al. A Resonant High-Pressure Sensor Based on Six Cavities
JP2007024633A (ja) 圧力センサ
CN112556892B (zh) 一种高精度谐振球式压力传感器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20806358

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20806358

Country of ref document: EP

Kind code of ref document: A1