CN103105248B - 一种硅基双岛结构石英梁谐振式微压力传感器 - Google Patents
一种硅基双岛结构石英梁谐振式微压力传感器 Download PDFInfo
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- CN103105248B CN103105248B CN201310016227.0A CN201310016227A CN103105248B CN 103105248 B CN103105248 B CN 103105248B CN 201310016227 A CN201310016227 A CN 201310016227A CN 103105248 B CN103105248 B CN 103105248B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 63
- 239000010703 silicon Substances 0.000 title claims abstract description 63
- 239000010453 quartz Substances 0.000 title claims abstract description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 239000011521 glass Substances 0.000 claims abstract description 18
- 230000007797 corrosion Effects 0.000 claims abstract description 8
- 238000005260 corrosion Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 26
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
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- 238000013461 design Methods 0.000 description 3
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- 238000001514 detection method Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
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- 239000007767 bonding agent Substances 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
Abstract
Description
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016227.0A CN103105248B (zh) | 2013-01-16 | 2013-01-16 | 一种硅基双岛结构石英梁谐振式微压力传感器 |
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| CN201310016227.0A CN103105248B (zh) | 2013-01-16 | 2013-01-16 | 一种硅基双岛结构石英梁谐振式微压力传感器 |
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| CN103105248A CN103105248A (zh) | 2013-05-15 |
| CN103105248B true CN103105248B (zh) | 2015-04-15 |
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| CN201310016227.0A Active CN103105248B (zh) | 2013-01-16 | 2013-01-16 | 一种硅基双岛结构石英梁谐振式微压力传感器 |
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| CN (1) | CN103105248B (zh) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103674409A (zh) * | 2013-11-30 | 2014-03-26 | 成都国科海博信息技术股份有限公司 | 改进型压力传感器 |
| CN103575347B (zh) * | 2013-12-02 | 2016-03-02 | 中国电子科技集团公司第二十六研究所 | 用于气流检测的pvdf超声传感器 |
| FR3016038B1 (fr) * | 2013-12-31 | 2016-11-04 | Valeo Systemes De Controle Moteur | Dispositif de mesure de pression |
| CN104198107B (zh) * | 2014-09-11 | 2017-03-08 | 武汉飞恩微电子有限公司 | 一种压力传感器及其制造方法 |
| CN104458076B (zh) * | 2014-11-26 | 2017-01-04 | 西安交通大学 | 一种具有高过载低加速度干扰的微压力传感器 |
| CN104568238B (zh) * | 2014-12-08 | 2018-02-23 | 太原航空仪表有限公司 | 压电激励谐振膜压力传感器 |
| CN105157735A (zh) * | 2015-08-20 | 2015-12-16 | 龙微科技无锡有限公司 | 传感器芯片及其制造方法、封装方法、及传感器芯体 |
| CN106768502A (zh) * | 2016-12-12 | 2017-05-31 | 太原航空仪表有限公司 | 一种新型石英谐振传感器 |
| CH713460A2 (de) * | 2017-02-15 | 2018-08-15 | Digi Sens Ag | Schwingsaitensensor und Schwingsaite für einen Schwingsaitensensor. |
| CN108132123A (zh) * | 2017-12-23 | 2018-06-08 | 埃泰克汽车电子(芜湖)有限公司 | 汽车刹车助力真空度传感器、压强差检测方法及制备方法 |
| CN110567632B (zh) * | 2019-08-29 | 2021-10-19 | 北京自动化控制设备研究所 | 芯体复合式硅压阻压力传感器 |
| CN111289156B (zh) * | 2020-02-26 | 2021-05-28 | 西安交通大学 | 基于静电激励压阻检测的差动式硅微谐振式压力传感器 |
| CN113218540A (zh) * | 2021-05-07 | 2021-08-06 | 慧石（上海）测控科技有限公司 | 微机电谐振式压力敏感结构及压力测量方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN88211371U (zh) * | 1988-01-22 | 1988-12-28 | 复旦大学 | 双岛-梁-膜结构压力传感器 |
| CN1179203C (zh) * | 2001-08-24 | 2004-12-08 | 中国科学院电子学研究所 | 全SiNx微结构谐振梁压力传感器 |
| CN1189727C (zh) * | 2002-09-28 | 2005-02-16 | 中国科学院电子学研究所 | 一种梁膜分体结构谐振梁压力传感器 |
| JP2004132913A (ja) * | 2002-10-11 | 2004-04-30 | Toyo Commun Equip Co Ltd | 感圧素子、及びこれを用いた圧力センサ |
| CN100507482C (zh) * | 2006-09-20 | 2009-07-01 | 西北工业大学 | 硅微谐振式压力传感器及其制作方法 |
| CN101348233A (zh) * | 2008-09-09 | 2009-01-21 | 西安交通大学 | 微结构谐振梁压力传感器 |
| CN101672710B (zh) * | 2009-10-14 | 2011-01-12 | 西安交通大学 | 梁膜结合微压传感器 |
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- 2013-01-16 CN CN201310016227.0A patent/CN103105248B/zh active Active
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