CN103105248A - 一种硅基双岛结构石英梁谐振式微压力传感器 - Google Patents
一种硅基双岛结构石英梁谐振式微压力传感器 Download PDFInfo
- Publication number
- CN103105248A CN103105248A CN2013100162270A CN201310016227A CN103105248A CN 103105248 A CN103105248 A CN 103105248A CN 2013100162270 A CN2013100162270 A CN 2013100162270A CN 201310016227 A CN201310016227 A CN 201310016227A CN 103105248 A CN103105248 A CN 103105248A
- Authority
- CN
- China
- Prior art keywords
- pressure
- substrate
- quartzy
- cavity
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 title claims abstract description 28
- 239000010453 quartz Substances 0.000 title claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 18
- 230000007797 corrosion Effects 0.000 claims abstract description 8
- 238000005260 corrosion Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 25
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 14
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005259 measurement Methods 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310016227.0A CN103105248B (zh) | 2013-01-16 | 2013-01-16 | 一种硅基双岛结构石英梁谐振式微压力传感器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310016227.0A CN103105248B (zh) | 2013-01-16 | 2013-01-16 | 一种硅基双岛结构石英梁谐振式微压力传感器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103105248A true CN103105248A (zh) | 2013-05-15 |
CN103105248B CN103105248B (zh) | 2015-04-15 |
Family
ID=48313271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310016227.0A Active CN103105248B (zh) | 2013-01-16 | 2013-01-16 | 一种硅基双岛结构石英梁谐振式微压力传感器 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103105248B (zh) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103674409A (zh) * | 2013-11-30 | 2014-03-26 | 成都国科海博信息技术股份有限公司 | 改进型压力传感器 |
CN104198107A (zh) * | 2014-09-11 | 2014-12-10 | 武汉飞恩微电子有限公司 | 一种压力传感器及其制造方法 |
CN104458076A (zh) * | 2014-11-26 | 2015-03-25 | 西安交通大学 | 一种具有高过载低加速度干扰的微压力传感器 |
CN104568238A (zh) * | 2014-12-08 | 2015-04-29 | 太原航空仪表有限公司 | 电磁激励谐振膜压力传感器 |
CN105157735A (zh) * | 2015-08-20 | 2015-12-16 | 龙微科技无锡有限公司 | 传感器芯片及其制造方法、封装方法、及传感器芯体 |
CN103575347B (zh) * | 2013-12-02 | 2016-03-02 | 中国电子科技集团公司第二十六研究所 | 用于气流检测的pvdf超声传感器 |
CN106062527A (zh) * | 2013-12-31 | 2016-10-26 | 法雷奥电机控制系统公司 | 压强测量装置 |
CN106768502A (zh) * | 2016-12-12 | 2017-05-31 | 太原航空仪表有限公司 | 一种新型石英谐振传感器 |
CN108132123A (zh) * | 2017-12-23 | 2018-06-08 | 埃泰克汽车电子(芜湖)有限公司 | 汽车刹车助力真空度传感器、压强差检测方法及制备方法 |
CN110289228A (zh) * | 2018-03-19 | 2019-09-27 | 应用材料公司 | 谐振工艺监视器 |
CN110462356A (zh) * | 2017-02-15 | 2019-11-15 | 迪知胜控股公司 | 振弦式传感器和用于振弦式传感器的振弦 |
CN110567632A (zh) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | 芯体复合式硅压阻压力传感器 |
CN111289156A (zh) * | 2020-02-26 | 2020-06-16 | 西安交通大学 | 基于静电激励压阻检测的差动式硅微谐振式压力传感器 |
CN113218540A (zh) * | 2021-05-07 | 2021-08-06 | 慧石(上海)测控科技有限公司 | 微机电谐振式压力敏感结构及压力测量方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN88211371U (zh) * | 1988-01-22 | 1988-12-28 | 复旦大学 | 双岛-梁-膜结构压力传感器 |
CN1401979A (zh) * | 2001-08-24 | 2003-03-12 | 中国科学院电子学研究所 | 新型全SiNx微结构谐振梁压力传感器 |
CN1485600A (zh) * | 2002-09-28 | 2004-03-31 | 中国科学院电子学研究所 | 一种梁膜分体结构谐振梁压力传感器 |
JP2004132913A (ja) * | 2002-10-11 | 2004-04-30 | Toyo Commun Equip Co Ltd | 感圧素子、及びこれを用いた圧力センサ |
CN101149298A (zh) * | 2006-09-20 | 2008-03-26 | 西北工业大学 | 硅微谐振式压力传感器及其制作方法 |
CN101348233A (zh) * | 2008-09-09 | 2009-01-21 | 西安交通大学 | 微结构谐振梁压力传感器 |
CN101672710A (zh) * | 2009-10-14 | 2010-03-17 | 西安交通大学 | 梁膜结合微压传感器 |
-
2013
- 2013-01-16 CN CN201310016227.0A patent/CN103105248B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN88211371U (zh) * | 1988-01-22 | 1988-12-28 | 复旦大学 | 双岛-梁-膜结构压力传感器 |
CN1401979A (zh) * | 2001-08-24 | 2003-03-12 | 中国科学院电子学研究所 | 新型全SiNx微结构谐振梁压力传感器 |
CN1485600A (zh) * | 2002-09-28 | 2004-03-31 | 中国科学院电子学研究所 | 一种梁膜分体结构谐振梁压力传感器 |
JP2004132913A (ja) * | 2002-10-11 | 2004-04-30 | Toyo Commun Equip Co Ltd | 感圧素子、及びこれを用いた圧力センサ |
CN101149298A (zh) * | 2006-09-20 | 2008-03-26 | 西北工业大学 | 硅微谐振式压力传感器及其制作方法 |
CN101348233A (zh) * | 2008-09-09 | 2009-01-21 | 西安交通大学 | 微结构谐振梁压力传感器 |
CN101672710A (zh) * | 2009-10-14 | 2010-03-17 | 西安交通大学 | 梁膜结合微压传感器 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103674409A (zh) * | 2013-11-30 | 2014-03-26 | 成都国科海博信息技术股份有限公司 | 改进型压力传感器 |
CN103575347B (zh) * | 2013-12-02 | 2016-03-02 | 中国电子科技集团公司第二十六研究所 | 用于气流检测的pvdf超声传感器 |
CN106062527A (zh) * | 2013-12-31 | 2016-10-26 | 法雷奥电机控制系统公司 | 压强测量装置 |
WO2016037302A1 (zh) * | 2014-09-11 | 2016-03-17 | 武汉飞恩微电子有限公司 | 一种压力传感器及其制造方法 |
CN104198107A (zh) * | 2014-09-11 | 2014-12-10 | 武汉飞恩微电子有限公司 | 一种压力传感器及其制造方法 |
US10436663B2 (en) | 2014-09-11 | 2019-10-08 | Wuhan Finemems Inc. | Semiconductor pressure sensor including improved structure and integrated sensor chip |
CN104458076B (zh) * | 2014-11-26 | 2017-01-04 | 西安交通大学 | 一种具有高过载低加速度干扰的微压力传感器 |
CN104458076A (zh) * | 2014-11-26 | 2015-03-25 | 西安交通大学 | 一种具有高过载低加速度干扰的微压力传感器 |
CN104568238A (zh) * | 2014-12-08 | 2015-04-29 | 太原航空仪表有限公司 | 电磁激励谐振膜压力传感器 |
CN105157735A (zh) * | 2015-08-20 | 2015-12-16 | 龙微科技无锡有限公司 | 传感器芯片及其制造方法、封装方法、及传感器芯体 |
CN106768502A (zh) * | 2016-12-12 | 2017-05-31 | 太原航空仪表有限公司 | 一种新型石英谐振传感器 |
CN110462356A (zh) * | 2017-02-15 | 2019-11-15 | 迪知胜控股公司 | 振弦式传感器和用于振弦式传感器的振弦 |
CN110462356B (zh) * | 2017-02-15 | 2022-04-26 | 迪知胜控股公司 | 振弦式传感器和用于振弦式传感器的振弦 |
CN108132123A (zh) * | 2017-12-23 | 2018-06-08 | 埃泰克汽车电子(芜湖)有限公司 | 汽车刹车助力真空度传感器、压强差检测方法及制备方法 |
CN110289228A (zh) * | 2018-03-19 | 2019-09-27 | 应用材料公司 | 谐振工艺监视器 |
CN110567632A (zh) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | 芯体复合式硅压阻压力传感器 |
CN111289156A (zh) * | 2020-02-26 | 2020-06-16 | 西安交通大学 | 基于静电激励压阻检测的差动式硅微谐振式压力传感器 |
CN113218540A (zh) * | 2021-05-07 | 2021-08-06 | 慧石(上海)测控科技有限公司 | 微机电谐振式压力敏感结构及压力测量方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103105248B (zh) | 2015-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103105248B (zh) | 一种硅基双岛结构石英梁谐振式微压力传感器 | |
CN103115720B (zh) | 一种硅基单岛结构石英梁谐振式微压力传感器芯片 | |
CN101603870B (zh) | 压力传感器用膜片和压力传感器 | |
CN205785644U (zh) | Mems微压压力传感器 | |
CN102374909A (zh) | 基于微机械的电磁激励谐振式压力传感器 | |
CN102928131B (zh) | 一种石英谐振梁式微压力传感器芯片 | |
CN101603871B (zh) | 压力传感器 | |
CN101226092A (zh) | Soi全硅结构充硅油耐高温压力传感器 | |
CN103941041B (zh) | 一种三框架结构的单质量块三轴mems加速度计 | |
CN101625274B (zh) | 声表面波压力和温度传感器 | |
CN110501098B (zh) | 一种基于双压力膜和弱耦合谐振系统的高灵敏微压传感器 | |
CN107478862B (zh) | 一种基于金金键合的石英振梁加速度计敏感芯片 | |
CN109782022B (zh) | 一种基于压力敏感的石墨烯谐振式光纤加速度计 | |
JP2012233872A (ja) | 半導体圧力センサおよびその製造方法 | |
CN203191141U (zh) | 用于测量气体与液体压力的硅压阻式mems压力传感器 | |
CN109883581B (zh) | 一种悬臂梁式差动谐振压力传感器芯片 | |
CN103616124A (zh) | 一种mems芯片微腔内部残余压力测量系统及方法 | |
CN113405946B (zh) | 微机电谐振式粘度传感器 | |
CN102175305A (zh) | 一种单片集成三维矢量振动传感器 | |
CN107976274A (zh) | 一种基于同步共振的压力检测装置及检测方法 | |
CN109682514B (zh) | 基于光纤光栅的高量程高精度张力计的使用方法 | |
CN103940548B (zh) | 一种双端固支石英梁谐振式真空度传感器 | |
CN110243532A (zh) | 一种管道油气压力监测的光纤光栅压力传感器 | |
JP2012181062A (ja) | 力検出器収容ケース、力測定器 | |
CN102539063B (zh) | 一种soi矩形膜结构高压传感器芯片 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhao Yulong Inventor after: Zhao Jianhua Inventor before: Zhao Yulong Inventor before: Cheng Rongjun |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170601 Address after: 710119, No. 19, foreign exchange Road, Xi'an hi tech Zone, Shaanxi Patentee after: Shaanxi Lin Tak inertia Electric Co.,Ltd. Address before: Beilin District Xianning West Road 710049, Shaanxi city of Xi'an province No. 28 Patentee before: Xi'an Jiaotong University |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Silicon substrate double-paddle structure quartz beam resonant micro pressure sensor Effective date of registration: 20180124 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: 2018610000012 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20190614 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: 2018610000012 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Silicon substrate double-paddle structure quartz beam resonant micro pressure sensor Effective date of registration: 20190619 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: 2019610000126 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200313 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: 2019610000126 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A silicon-based dual Island quartz beam resonant micro pressure sensor Effective date of registration: 20210129 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: Y2021980000882 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220228 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: Y2021980000882 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A silicon-based double island structure quartz beam resonant micro pressure sensor Effective date of registration: 20220302 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: Y2022610000063 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230310 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: Y2022610000063 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Silicon Based Double Island Structure Quartz Beam Resonant Micro Pressure Sensor Effective date of registration: 20230315 Granted publication date: 20150415 Pledgee: Xi'an Guoxin micro credit Co.,Ltd. Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: Y2023610000180 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |