WO2020226185A1 - フィルム加工装置 - Google Patents

フィルム加工装置 Download PDF

Info

Publication number
WO2020226185A1
WO2020226185A1 PCT/JP2020/021052 JP2020021052W WO2020226185A1 WO 2020226185 A1 WO2020226185 A1 WO 2020226185A1 JP 2020021052 W JP2020021052 W JP 2020021052W WO 2020226185 A1 WO2020226185 A1 WO 2020226185A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
suction
stage
processing apparatus
suction stage
Prior art date
Application number
PCT/JP2020/021052
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
哲也 会田
俊介 功刀
真弓　聡
直樹 武田
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to JP2021518411A priority Critical patent/JPWO2020226185A1/ja
Publication of WO2020226185A1 publication Critical patent/WO2020226185A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/34—Apparatus for taking-out curl from webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
    • H10F19/33—Patterning processes to connect the photovoltaic cells, e.g. laser cutting of conductive or active layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a film processing apparatus.
  • the present application claims priority based on Japanese Patent Application No. 2019-084446 filed in Japan on May 8, 2019 and Japanese Patent Application No. 2019-099901 filed in Japan on May 29, 2019. The contents are used here.
  • a film is used as a base material.
  • the surface of the film is subjected to various processes in order to impart the desired function.
  • the transport of the film is paused and the film is placed on a flat stage (processing table).
  • Fix it As a method for processing such a film, for example, a laser beam is irradiated from the other surface side of the film supported by a roller-shaped supporting means that supports one surface side of the film with an outer peripheral surface, and the main surface of the film substrate is subjected to.
  • a patterning device is known (see, for example, Patent Document 1). Further, as a method of fixing the film on the stage, for example, vacuum adsorption can be mentioned.
  • a film is used as a base material.
  • the surface of the film is subjected to various processes in order to impart the desired function.
  • the film is fixed on a stage (processing table).
  • a method of fixing the film on the stage for example, vacuum adsorption can be mentioned (see, for example, Patent Document 2).
  • both ends of the film in the width direction are warped on the opposite side of the stage
  • adsorbing (fixing) on the film the central portion of the film in the width direction is in contact with the stage, but both ends of the film in the width direction are lifted from the stage. Therefore, even if the film is vacuum-adsorbed to the stage, there is a problem that both ends of the film in the width direction do not adhere to the suction holes of the stage and the both ends of the film in the width direction cannot be vacuum-adsorbed.
  • the film could not be vacuum-adsorbed to the stage, the flatness of the film would decrease on the stage, and the surface of the film could not be subjected to predetermined processing or uniform processing.
  • the film when a large-area film is placed on the stage, the film is vacuum-adsorbed and adsorbed (fixed) on the stage, the gap inside the stage is depressurized. Therefore, the stage receives a large load due to atmospheric pressure. Then, the suction surface of the stage (the surface that sucks the film on the stage) is deformed without being able to withstand the load. Along with this, there is a problem that the film adsorbed on the stage warps and the film becomes uneven.
  • the present invention has been made in view of the above circumstances, and the warp of the film conveyed by the roll-to-roll method is alleviated, and the film is uniformly vacuum-adsorbed on the stage. It is an object of the present invention to provide a film processing apparatus capable of capable. Another object of the present invention is to provide a film processing apparatus that suppresses deformation of the adsorption stage when the film is vacuum-adsorbed, and as a result, suppresses warpage of the film.
  • the present invention has the following aspects.
  • An apparatus which is a film processing apparatus having a pressing means for pressing both ends of the film in the width direction on the suction surface of the suction stage on the suction stage.
  • [2] The film processing apparatus according to [1], which has a decompression means for depressurizing an inner space formed by a top plate, a bottom plate, and an outer frame constituting the adsorption stage.
  • the decompression means is preferably the decompression means described in the following [8] or [9].
  • a suction stage for vacuum-sucking the film is provided, and the suction stage penetrates the top plate of the suction stage in the thickness direction and communicates with an inner space located under the top plate of the suction stage.
  • a film processing apparatus having holes, the inner space being divided into two or more small spaces, and a decompression means for individually depressurizing the two or more small spaces.
  • the small space is composed of a central small space group consisting of one or more small spaces located in the central portion of the suction stage and one or more small spaces located outside the central small space group. Including the outer small space group, the decompression means changes the pressure of each of the small spaces so that the pressures of the central small space group and the outer small space group are different [8].
  • the film is long and includes a transport means for transporting the film in the longitudinal direction, and the transport means is a roll-to-roll system [8] to [11]. ] The film processing apparatus according to any one of. [13] The film processing apparatus according to any one of [1] to [12] for films used in film devices. [14] The film processing apparatus according to any one of [1] to [12] for a film used in a film device having a monolithic structure. [15] The film processing apparatus according to any one of [1] to [12] for films used in solar cells.
  • a film processing apparatus capable of alleviating the warp of a film conveyed by a roll-to-roll method and uniformly vacuum-adsorbing the film on a stage. Can be done.
  • the present invention it is possible to provide a film processing apparatus that suppresses deformation of the adsorption stage when the film is vacuum-adsorbed, and as a result, suppresses warpage of the film.
  • FIG. 1 It is a perspective view which shows the schematic structure of the film processing apparatus which is one Embodiment to which this invention is applied.
  • a suction stage and a pressing means in a film processing apparatus according to an embodiment to which the present invention is applied are shown, and is a side view seen from the longitudinal direction in FIG.
  • a suction stage and a pressing means in a film processing apparatus according to an embodiment to which the present invention is applied are shown, and is a side view seen from the longitudinal direction in FIG.
  • a suction stage and a pressing means in a film processing apparatus according to an embodiment to which the present invention is applied are shown, and is a side view seen from the longitudinal direction in FIG.
  • FIG. 1 It is a perspective view which shows the adsorption stage and the pressing means in the film processing apparatus which is one Embodiment to which this invention is applied. It is a perspective view which shows the adsorption stage and the pressing means in the film processing apparatus which is one Embodiment to which this invention is applied. It is a perspective view which shows the adsorption stage and the pressing means in the film processing apparatus which is one Embodiment to which this invention is applied. A suction stage and a pressing means in a film processing apparatus according to an embodiment to which the present invention is applied are shown, and is a side view seen from the longitudinal direction in FIG. It is a perspective view which shows the adsorption stage and the pressing means in the film processing apparatus which is one Embodiment to which this invention is applied.
  • FIG. 5 is a cross-sectional view taken along the line AA in FIG. 1 showing an adsorption stage constituting a film processing apparatus according to an embodiment to which the present invention is applied. It is a top view which shows the partition member which comprises the film processing apparatus which is one Embodiment to which this invention is applied. It is a top view which shows the reinforcing member which comprises the film processing apparatus which is one Embodiment to which this invention is applied.
  • FIG. 5 is a cross-sectional view taken along the line AA in FIG. 1 showing an adsorption stage constituting a film processing apparatus according to an embodiment to which the present invention is applied.
  • FIG. 5 is a cross-sectional view taken along the line AA in FIG. 1 showing an adsorption stage constituting a film processing apparatus according to an embodiment to which the present invention is applied.
  • the film processing device of the present embodiment is a device provided with a suction stage that vacuum-sucks the film and sucks (fixes) the film on the suction surface of the suction stage.
  • the film processing apparatus of the present embodiment will be described with reference to FIGS. 1 and 2.
  • FIG. 1 is a perspective view showing a schematic configuration of the film processing apparatus of the present embodiment.
  • FIG. 2 is a side view seen from the longitudinal direction (starting side in the film transport direction) in FIG.
  • the arrows along the longitudinal direction of the film indicate the transport direction of the film.
  • the film processing apparatus 1 of the present embodiment includes an adsorption stage 10, a laser irradiation means 20, a linear guide 30, and a transfer means 40.
  • the film processing apparatus 1 of the present embodiment may include a vacuum pump 50 and a control unit 60 for controlling an electromagnetic valve (not shown) connected to the vacuum pump 50.
  • the control unit 60 is connected to the vacuum pump 50 and the solenoid valve.
  • the suction stage 10 vacuum sucks a part of the long film 100, that is, the film 100 arranged on the suction surface 10a of the suction stage 10.
  • the suction stage 10 has a top plate, a bottom plate, and an outer frame interposed between the top plate and the bottom plate.
  • the top plate has a plurality of suction holes that penetrate the top plate in the thickness direction.
  • the film 100 is adsorbed on the top plate by evacuating the inner space formed by the top plate, the bottom plate and the outer frame by the vacuum pump 50.
  • the size of the suction stage 10, that is, the area of the suction surface 10a of the suction stage 10 is appropriately adjusted according to the width of the film 100, and is preferably 400 mm in length ⁇ 400 mm in width, for example.
  • the film processing apparatus 1 of the present embodiment has pressing means 70 on the suction stage 10 for pushing down both ends 100A and 100A of the film 100 on the suction surface 10a of the suction stage 10.
  • the pressing means 70 is a jig 71 that pushes both ends 100A and 100A of the film 100 in the width direction in the direction perpendicular to the suction surface 10a of the suction stage 10.
  • the jig 71 is a columnar or plate-shaped member arranged at both ends in the width direction of the film 100 on the suction surface 10a of the suction stage 10.
  • the jig 71 is moved from above the suction surface 10a of the suction stage 10 to the suction surface 10a side of the suction stage 10 by a support member 72 attached to the surface 71a of the jig 71 opposite to the suction stage 10. , Both ends 100A, 100A in the width direction of the film 100 are brought into contact with each other, and both ends 100A, 100A in the width direction of the film 100 are pushed down onto the suction surface 10a of the suction stage 10.
  • the length of the film 100 in the transfer direction of the jig 71 is equal to the length of the film 100 in the transfer direction on the suction surface 10a of the suction stage 10. Further, the jig 71 may be divided into two or more along the longitudinal direction of the film 100.
  • the width of the jig 71 (the length in the direction perpendicular to the transport direction of the film 100) is not particularly limited, but is appropriately adjusted according to the assumed amount of warpage of the film 100.
  • the laser irradiation means 20 is arranged so as to face the adsorption surface 10a of the adsorption stage 10, and irradiates the surface 100a of the film 100 with laser light to process the surface 100a of the film 100.
  • the laser irradiation means 20 includes a main body portion 21, a laser irradiation portion 22, and an alignment camera 23.
  • the main body 21 includes a laser oscillator and a laser optical system.
  • the laser irradiation unit 22 includes a galvano scanner that scans the laser oscillated from the laser oscillator, a mirror that bends the optical path of the laser, a lens that collects and irradiates the laser, and the like.
  • the alignment camera 23 photographs the surface (processed surface) 100a of the film 100, finds a specific portion or mark in the image, detects the position, and determines the position to irradiate the laser.
  • the linear guide 30 linearly moves the laser irradiation means 20 in the X direction or the Y direction shown in FIG. 1 to arrange the laser irradiation means 20 at a predetermined position.
  • the linear guide 30 is arranged so as to straddle the suction stage 10 from the suction surface 10a side.
  • the linear guide 30 has a gate shape.
  • the linear guide 30 is movable in the X direction shown in FIG. As a result, the laser irradiation means 20 can be arranged at a predetermined position in the X direction of the surface 100a of the film 100 adsorbed on the adsorption surface 10a of the adsorption stage 10.
  • the laser irradiation means 20 is provided on the side surface 30a of the portion of the portal type linear guide 30 that straddles the suction surface 10a of the suction stage 10.
  • the laser irradiation means 20 can move in the Y direction shown in FIG. 1 on the side surface 30a.
  • the laser irradiation means 20 can be arranged at a predetermined position in the Y direction of the surface 100a of the film 100 adsorbed on the adsorption surface 10a of the adsorption stage 10.
  • the transporting means 40 has a winding roll 41 for winding the film 100 and a feeding roll 42 for feeding the film 100. That is, the transport means 40 is a film transport means that transports the film 100 in the longitudinal direction by a roll-to-roll method.
  • the film 100 is step-transported by the transport means 40. Specifically, the film 100 is conveyed by the conveying means 40 at a time by a length corresponding to the length of the suction surface 10a of the suction stage 10 in the X direction.
  • the film processing apparatus 1 of the present embodiment has pressing means 70 that pushes down both ends 100A, 100A in the width direction of the film 100 in the direction perpendicular to the suction surface 10a of the suction stage 10 on the suction stage 10. Therefore, even if both ends 100A and 100A in the width direction of the film 100 conveyed by the roll-to-roll method are warped, both ends 100A and 100A in the width direction of the film 100 are adsorbed. It can be brought close to the suction surface 10a of the stage 10. Therefore, the film 100 can be uniformly vacuum-adsorbed on the suction surface 10a of the suction stage 10 to perform a predetermined process or a uniform process on the surface 100a of the film 100.
  • the pressing means 70 may be a columnar or plate-shaped member that grips both ends 100A, 100A in the width direction of the film 100 from the vertical direction. In this case, after grasping both end portions 100A, 100A in the width direction of the film 100 from the vertical direction, the end portions 100A, 100A in the width direction of the film 100 are pushed down in the direction perpendicular to the suction surface 10a of the suction stage 10. By doing so, the warp of the film 100 can be suppressed more accurately.
  • the central portion in the width direction of the film 100 is not dented vertically downward, so that the back surface 100b of the film 100 is formed in the width direction of the film 100. It is preferable to blow a gas such as air to the central portion of the film.
  • the pressing means 70 is a jig 71 that moves up and down in the direction perpendicular to the suction surface 10a of the suction stage 10 is illustrated, but the present invention is not limited to this.
  • the jigs arranged at both ends in the width direction of the film rotate (roll over) and come into contact with both ends in the width direction of the film to suck the suction stage.
  • the structure may be such that the film is pushed down against the surface.
  • the film processing apparatus of the present invention on the suction surface of the suction stage, jigs arranged at both ends in the width direction of the film move along the longitudinal direction of the film and push down both ends in the width direction of the film. You may. Further, in the film processing apparatus of the present invention, on the suction surface of the suction stage, jigs arranged at both ends in the width direction of the film move along the width direction of the film and push down both ends in the width direction of the film. You may. Further, in the present embodiment, the case where the film processing apparatus 1 has the laser irradiation unit 22 and the laser irradiation unit 22 performs laser processing is illustrated, but the present invention is not limited to this. In the film processing apparatus of the present invention, the film adsorbed on the adsorption surface of the adsorption stage may be processed by photolithography.
  • a film processing method using the film processing apparatus 1 of the present embodiment will be described.
  • the film 100 is conveyed by the conveying means 40 for a predetermined length, and the processing target region of the film 100 is arranged on the suction surface 10a of the suction stage 10.
  • the pressing means 70 pushes the widthwise both ends 100A, 100A of the film 100 arranged on the suction stage 10 onto the suction surface 10a of the suction stage 10, and the widthwise both ends 100A, 100A of the film 100 are pushed to the suction stage. It is brought close to the suction surface 10a of 10.
  • the degree to which both ends 100A, 100A in the width direction of the film 100 are brought close to the suction surface 10a of the suction stage 10 can be determined in consideration of the ability of the suction stage 10, for example, both ends 100A, 100A in the width direction of the film 100.
  • the distance between the suction stage 10 and the suction surface 10a of the suction stage 10 is preferably 20 mm or less, more preferably 10 mm or less.
  • the inner space of the suction stage 10 is evacuated by the vacuum pump 50 to create a negative pressure in the inner space, and the film 100 is sucked on the suction surface 10a of the suction stage 10.
  • the laser irradiation unit 22 of the laser irradiation means 20 is arranged at a predetermined position of the film 100 adsorbed on the adsorption surface 10a of the adsorption stage 10 by the linear guide 30, and the laser is applied from the laser irradiation unit 22 to the surface 100a of the film 100. Is irradiated with laser processing.
  • the film 100 is conveyed by the conveying means 40 for a predetermined length, and the processing target region of the unprocessed film 100 is arranged on the adsorption surface 10a of the adsorption stage 10.
  • the surface 100a of the film 100 is laser-processed.
  • the film 100 processed in this way is used as a film-type device in solar cells, displays, sensors, and the like.
  • a thin film is laminated on one side of a film such as a solar cell having a monolithic structure, warpage is likely to occur.
  • the laminated film is conveyed and patterning is performed on the suction surface 10a of the suction stage 10.
  • the laminated film include a laminated body composed of a thin film such as an electrode layer, a semiconductor layer, and a power generation layer on a metal foil or a resin film.
  • FIG. 3 is a side view seen from the longitudinal direction (starting side in the film transport direction) in FIG.
  • the same configurations as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the pressing means 200 is different from that of the first embodiment.
  • the film processing apparatus of the present embodiment has pressing means 200 on the suction stage 10 that pushes both ends 100A and 100A of the film 100 on the suction surface 10a of the suction stage 10 in the width direction.
  • the pressing means 200 is a jig 201 that pushes both ends 100A and 100A of the film 100 in the width direction in the direction perpendicular to the suction surface 10a of the suction stage 10.
  • the jig 201 is a columnar or plate-shaped member arranged at both ends of the suction stage 10 a of the suction stage 10 along the transport direction of the film 100.
  • the jig 201 is moved from above the suction surface 10a of the suction stage 10 to the suction surface 10a side of the suction stage 10 by the support member 202 attached to the surface 201a on the suction stage 10 side of the jig 201, whereby the film 100
  • the both ends 100A, 100A in the width direction of the film 100 are brought into contact with the suction surfaces 10a of the suction stage 10, and the both ends 100A, 100A in the width direction of the film 100 are pushed down.
  • the length of the film 100 in the transport direction in the jig 201 is preferably equal to the length in the transport direction of the film 100 on the suction surface 10a of the suction stage 10.
  • the width of the jig 201 (the length in the direction perpendicular to the transport direction of the film 100) is not particularly limited, but is appropriately adjusted according to the assumed amount of warpage of the film 100.
  • the film processing apparatus of the present embodiment has pressing means 200 on the suction stage 10 that pushes down both ends 100A, 100A in the width direction of the film 100 in the direction perpendicular to the suction surface 10a of the suction stage 10. Therefore, even if both ends 100A and 100A in the width direction of the film 100 conveyed by the roll-to-roll method are warped, both ends 100A and 100A in the width direction of the film 100 are adsorbed. It can be brought close to the suction surface 10a of the stage 10. Therefore, the film 100 can be uniformly vacuum-adsorbed on the suction surface 10a of the suction stage 10 to perform a predetermined process or a uniform process on the surface 100a of the film 100.
  • FIG. 4 is a side view seen from the longitudinal direction (starting side in the film transport direction) in FIG.
  • the same configurations as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the pressing means 210 is different from that of the first embodiment.
  • the film processing apparatus of the present embodiment has pressing means 210 on the suction stage 10 for pushing down both ends 100A and 100A of the film 100 on the suction surface 10a of the suction stage 10.
  • the pressing means 210 pushes both end portions 100A, 100A of the film 100 in the width direction in an oblique direction (direction from the center in the width direction of the film 100 toward both ends) with respect to the suction surface 10a of the suction stage 10.
  • Jig 211 is a columnar or plate-shaped member arranged at both ends along the conveying direction of the film 100 on the suction surface 10a of the suction stage 10.
  • the jig 211 is moved from above the suction surface 10a of the suction stage 10 to the suction surface 10a side of the suction stage 10 by the support member 212 attached to the surface 211a of the jig 211 opposite to the suction stage 10. , Both ends 100A, 100A in the width direction of the film 100 are brought into contact with each other, and both ends 100A, 100A in the width direction of the film 100 are pushed down onto the suction surface 10a of the suction stage 10.
  • the length of the film 100 in the transfer direction of the jig 211 is equal to the length of the film 100 in the transfer direction on the suction surface 10a of the suction stage 10.
  • the width of the jig 211 (the length in the direction perpendicular to the transport direction of the film 100) is not particularly limited, but is appropriately adjusted according to the assumed amount of warpage of the film 100.
  • the film processing apparatus of the present embodiment has pressing means 210 on the suction stage 10 that pushes down both ends 100A, 100A in the width direction of the film 100 in an oblique direction with respect to the suction surface 10a of the suction stage 10. Therefore, even if both ends 100A and 100A in the width direction of the film 100 conveyed by the roll-to-roll method are warped, both ends 100A and 100A in the width direction of the film 100 are adsorbed. It can be brought close to the suction surface 10a of the stage 10. Therefore, the film 100 can be uniformly vacuum-adsorbed on the suction surface 10a of the suction stage 10 to perform a predetermined process or a uniform process on the surface 100a of the film 100.
  • FIG. 5 is a perspective view showing a suction stage and pressing means in the film processing apparatus of the present embodiment.
  • the same configurations as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the pressing means 220 is different from that of the first embodiment.
  • the film processing apparatus of the present embodiment has pressing means 220 on the suction stage 10 that pushes both ends 100A and 100A of the film 100 in the width direction on the suction surface 10a of the suction stage 10.
  • the pressing means 220 is a guide roller 221 that pushes the film 100 against the suction surface 10a of the suction stage 10.
  • the guide roller 221 moves the surface 100a of the film 100 arranged on the suction surface 10a of the suction stage 10 to abut on the entire surface 100a of the film 100, and the entire film 100 touches the suction surface 10a of the suction stage 10. Press down.
  • the diameter of the guide roller 221 is not particularly limited, but is appropriately adjusted according to the assumed amount of warpage of the film 100.
  • the film processing apparatus of this embodiment has a guide roller 221 that moves the surface 100a of the film 100 arranged on the suction surface 10a of the suction stage 10. Therefore, even if both ends 100A and 100A in the width direction of the film 100 conveyed by the roll-to-roll method are warped, both ends 100A and 100A in the width direction of the film 100 are adsorbed. It can be brought close to the suction surface 10a of the stage 10. Therefore, the film 100 can be uniformly vacuum-adsorbed on the suction surface 10a of the suction stage 10 to perform a predetermined process or a uniform process on the surface 100a of the film 100.
  • the guide roller is not limited to the guide roller 221 of the present embodiment.
  • guide rollers 222A and 222B may be provided as pressing means 220 only on both ends of the film 100 in the width direction on the suction surface 10a of the suction stage 10.
  • the guide rollers 222A and the guide rollers 222B, the guide rollers 222A and 222B sandwich both ends of the film 100 in the width direction from the vertical direction.
  • the guide roller 222B is embedded in the suction stage 10, and the suction surface 10a of the suction stage 10 and the uppermost point of the guide roller 222B (the highest point in the thickness direction of the suction stage 10) are on the same surface.
  • the pressing means 220 may be composed of only the guide roller 222A provided on the surface 100a side of the film 100. Further, as shown in FIG. 7, guide rollers 223A and 223B may be provided as pressing means 220 only at both ends in the width direction of the film 100 in the front and rear stages of the suction stage 10. In this case, the guide rollers 223A and the guide rollers 223B sandwich the both ends of the film 100 in the width direction from the vertical direction by the guide rollers 223A and 223B.
  • a plurality of guide rollers 223A and 223B are provided along the longitudinal direction of the film 100.
  • the pressing means 220 may be composed of only the guide roller 223A provided on the surface 100a side of the film 100.
  • the guide rollers 222A and 222B and the guide rollers 223A and 223B are not limited to columns and may be spherical.
  • FIG. 8 is a side view seen from the longitudinal direction (starting side in the film transport direction) in FIG.
  • the same configurations as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the pressing means 230 is different from that of the first embodiment.
  • the film processing apparatus of the present embodiment has pressing means 230 on the suction stage 10 that pushes both ends 100A and 100A of the film 100 in the width direction on the suction surface 10a of the suction stage 10.
  • the pressing means 230 is a gas spraying portion that blows a gas such as air in a direction in which both ends 100A and 100A in the width direction of the film 100 are pushed down in a direction perpendicular to or diagonally with respect to the suction surface 10a of the suction stage 10. It is 231.
  • the gas spraying portion 231 pushes the both ends 100A and 100A of the film 100 on the suction surface 10a of the suction stage 10 by blowing gas from the spray port 231a to both ends 100A and 100A of the film 100 in the width direction.
  • the film processing apparatus of the present embodiment has gas spraying portions 231 that blow gas onto both end portions 100A and 100A in the width direction of the surface 100a of the film 100 arranged on the suction surface 10a of the suction stage 10. Therefore, even if both ends 100A and 100A in the width direction of the film 100 conveyed by the roll-to-roll method are warped, both ends 100A and 100A in the width direction of the film 100 are adsorbed. It can be brought close to the suction surface 10a of the stage 10. Therefore, the film 100 can be uniformly vacuum-adsorbed on the suction surface 10a of the suction stage 10 to perform a predetermined process or a uniform process on the surface 100a of the film 100.
  • the film processing apparatus has a gas spraying portion 231 as a means for spraying gas on both ends 100A and 100A in the width direction of the surface 100a of the film 100
  • the film processing of the present invention has been illustrated.
  • the device is not limited to this.
  • the film processing apparatus of the present invention faces the suction surface 10a of the suction stage 10 as a means for blowing gas onto both ends 100A, 100A in the width direction of the surface 100a of the film 100 arranged on the suction surface 10a of the suction stage 10. You may use a fan arranged so as to do so.
  • a plurality of gas spraying portions may be linearly arranged along the respective longitudinal directions with respect to both end portions 100A and 100A in the width direction of the surface 100a of the film 100, and the gas may be sprayed linearly.
  • FIG. 9 is a perspective view showing a suction stage and pressing means in the film processing apparatus of the present embodiment.
  • the same configurations as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the pressing means 240 is different from that of the first embodiment.
  • the film processing apparatus of the present embodiment has a pressing means 240 composed of a guide 241 provided in front of the suction stage 10 in the transport direction of the film 100.
  • a gap is provided between the guide 241 and the suction surface 10a of the suction stage 10 so that the film 100 can pass along the thickness direction of the suction stage 10.
  • the film processing apparatus of the present embodiment has a pressing means 240 composed of a guide 241 provided in front of the suction stage 10 in the transport direction of the film 100. Therefore, even if both ends 100A and 100A in the width direction of the film 100 conveyed by the roll-to-roll method are warped, both ends 100A and 100A in the width direction of the film 100 are adsorbed. It can be brought close to the suction surface 10a of the stage 10. Therefore, the film 100 can be uniformly vacuum-adsorbed on the suction surface 10a of the suction stage 10 to perform a predetermined process or a uniform process on the surface 100a of the film 100.
  • a balloon is provided in the pressing means, and the balloon inflates to bring both ends 100A and 100A of the film 100 in the width direction closer to the suction surface 10a of the suction stage 10. You may do so.
  • FIG. 10 is a cross-sectional view taken along the line AA in FIG.
  • the suction stage 10 has a top plate 11, an outer frame 12, a partition member 13, and a suction hole 14.
  • the suction hole 14 penetrates the top plate 11 in the thickness direction.
  • a plurality of suction holes 14 are formed on the top plate 11 at intervals.
  • the film 100 is adsorbed on the top plate 11 by evacuating the inner space 17 formed by the top plate 11, the bottom plate (not shown) and the outer frame 12 by the vacuum pump 50.
  • the top plate 11 is arranged on the outer frame 12.
  • the top plate 11 is a member to which the film 100 is adsorbed.
  • the upper surface (the surface opposite to the surface in contact with the outer frame 12, the suction surface) 11a of the top plate 11 forms the suction surface 10a of the suction stage 10.
  • the top plate 11 extends in the thickness direction of the top plate 11 and has a suction hole 14 that penetrates the top plate 11 in the thickness direction.
  • the inner space 17 formed by the top plate 11 and the outer frame 12 is divided into five small spaces 17A, 17B, 17C, 17D, and 17E by the partition member 13.
  • the partition member 13 is connected to the top plate 11 in the inner space 17 and extends along the thickness direction of the suction stage 10, and the inner space 17 is divided into five small spaces 17A, 17B, 17C. It is divided into 17D and 17E. That is, the small spaces 17A, 17B, 17C, 17D, and 17E partitioned by the partition member 13 are independent of each other.
  • the partition member 13 is provided in a region of the surface (back surface) 11b of the top plate 11 opposite to the suction surface 11a and which does not overlap with the suction hole 14. That is, the suction hole 14 is partitioned by the partition member 13 and communicates with the respective small spaces 17A, 17B, 17C, 17D, and 17E located under the top plate 11.
  • the small space 17C constitutes a central small space group composed of one or more small spaces located in the central portion of the suction stage 10. Further, the small spaces 17A, 17B, 17D, and 17E form an outer small space group consisting of one or more small spaces located outside the central small space group.
  • the thickness of the top plate 11 is not particularly limited, but is preferably 10 mm or more.
  • the interval at which the partition member 13 is provided on the back surface 11b of the top plate 11 is not particularly limited, but is preferably 200 mm or less, and more preferably 150 mm or less.
  • the interval at which the partition members 13 are provided is preferably 200 mm or less.
  • the pressure when the inner space 17 is evacuated by a vacuum pump or the like is set to 70 kPa or less.
  • the interval at which the partition member 13 is provided is 150 mm or less. It is preferable to have.
  • the pressure when the inner space 17 is evacuated by a vacuum pump or the like is set to 50 kPa or less.
  • the width of the suction hole 14 (the width in the direction perpendicular to the thickness direction of the top plate 11 and the diameter when the shape of the suction hole 14 viewed from the suction surface 10a side of the suction stage 10 in a plan view is circular) is not particularly limited. However, for example, it is preferably 0.2 mm to 2 mm.
  • the suction hole 14 is for sucking the film 100 on the suction surface 10a of the suction stage 10 by evacuating the inner space 17 with a vacuum pump 50 to create a negative pressure in the inner space 17. Further, the distance between the suction holes 14 (the distance between the center lines of the suction holes 14 parallel to the length direction thereof) is preferably 5 mm to 150 mm.
  • the vacuum pump 50 is a decompression means for individually depressurizing the small spaces 17A, 17B, 17C, 17D, and 17E partitioned by the partition member 13.
  • the vacuum pump 50 includes a central small space group consisting of a small space 17C located at the center of the suction stage 10 and an outer small space group consisting of small spaces 17A, 17B, 17D, and 17E located outside the central small space group.
  • the pressures of the small spaces 17A, 17B, 17C, 17D, and 17E are changed so that the pressures are different from those of the group.
  • one vacuum pump 50 may be used, and the degree of vacuum of each of the small spaces 17A, 17B, 17C, 17D, and 17E may be adjusted by an electromagnetic valve or the like.
  • one vacuum pump 50 may be provided corresponding to each of the small spaces 17A, 17B, 17C, 17D and 17E, and the degree of vacuum of the small spaces 17A, 17B, 17C, 17D and 17E may be adjusted. ..
  • the center (c1) of the center (c2) is drawn.
  • the number of small spaces is not particularly limited, but if it is too large, the design and manufacture of the adsorption stage and the control of decompression of the small spaces become complicated, so that the total number of small spaces is 3 or more.
  • the direction of one side of the suction stage is (1 to 10) ⁇ the direction of the other side of the suction stage (in the direction perpendicular to one direction (1 to 10)). It is more preferable that one side direction (1 to 7 pieces) ⁇ the other side direction of the suction stage (1 to 7 pieces in the direction perpendicular to one direction), and one side direction of the suction stage (1 to 5 pieces). (Pieces) ⁇ The other side direction of the suction stage (1 to 5 pieces in the direction perpendicular to one direction) is more preferable.
  • the inner space 17 of the suction stage 10 is divided into five small spaces 17A, 17B, 17C, 17D and 17E by the partition member 13, and the small spaces 17A and 17B are divided into five. , 17C, 17D, 17E are individually depressurized with a vacuum pump 50. Therefore, according to the film processing apparatus 1 of the present embodiment, when the film 100 is vacuum-sucked on the suction surface 10a of the suction stage 10, it is possible to suppress the deformation of the suction surface 10a of the suction stage 10.
  • the pressure (vacuum degree) in each of the small spaces 17A, 17B, 17C, 17D, and 17E is optimized to obtain the film 100. Can be suppressed from being deformed on the suction surface 10a of the suction stage 10 when the suction surface 10a of the suction stage 10 is vacuum-sucked.
  • the atmospheric pressure of the small spaces 17B and 17D located between the small spaces 17A and 17E and the small space 17C shall be an intermediate value between the atmospheric pressure of the small spaces 17A and 17E and the atmospheric pressure of the small space 17C.
  • the surface 100a of the film 100 can be subjected to predetermined processing or uniform processing.
  • the central small space group and the outer small space group are provided, and each of the plurality of small spaces constituting the central small space group and / or the outer small space group is provided.
  • the pressure is set to a different value, it is preferable to configure the decompression means so that the difference (a) between the maximum value and the minimum value of the pressure in each small space group is 10 kPa to 70 kPa, and the difference (a) is 30 kPa to 70 kPa. It is more preferable that the difference (a) is 50 kPa to 70 kPa.
  • the atmospheric pressure is different between the central small space group and the outer small space group means that the difference (A) between the atmospheric pressure of the central small space group and the atmospheric pressure of the outer small space group is generally 10 kPa.
  • the difference (A) is preferably 10 kPa to 70 kPa, and more preferably 50 kPa to 70 kPa.
  • the above difference (A) is the central small space. It means the difference between the average value of atmospheric pressure in the group and the average value of atmospheric pressure in the outer small space group.
  • the inner space 17 of the suction stage 10 is divided into five small spaces 17A, 17B, 17C, 17D, and 17E by the partition member 13 is illustrated, but the present invention is not limited to this. ..
  • the inner space of the suction stage may be divided into two or more by a partition member.
  • the case where the inner space 17 of the suction stage 10 is partitioned by the partition member 13 in the width direction of the film 100 (the width direction of the suction stage 10) is illustrated. Not limited to.
  • the partition member 300 extends in a direction perpendicular to the plurality of first plate-shaped portions 300A extending in the width direction of the film 100 and the first plate-shaped portion 300A, and in a direction perpendicular to the width direction of the film 100. It is composed of a plurality of second plate-shaped portions 300B. That is, the partition member 300 has a grid-like structure formed by the first plate-shaped portion 300A and the second plate-shaped portion 300B in a plan view in the height direction of the partition member 300.
  • the partition member 300 is interposed between the top plate 11 and the outer frame 12 and is connected to the top plate 11 and the outer frame 12.
  • the partition member 300 is provided in a region of the surface (back surface) 11b of the top plate 11 opposite to the suction surface 11a so as not to overlap the suction hole 14.
  • the inner space 17 of the suction stage 10 is divided into small spaces 17A2, 17B2, 17C2, 17D2, 17E2, 17F2, 17G2, 17H2, 17I2 by a partition member 300.
  • the atmospheric pressure of the outer small space group consisting of the small spaces 17A2, 17B2, 17C2, 17D2, 17F2, 17G2, 17H2, 17I2 located at the edge of the suction stage 10 corresponding to the edge of the film 100 having a large warp.
  • the pressure is lowered to raise the air pressure of the central small space group consisting of the small spaces 17E2 existing in the central portion of the adsorption stage 10.
  • it is possible to prevent the film 100 adsorbed on the adsorption surface 10a of the adsorption stage 10 from warping.
  • a cylindrical reinforcing member 400 may be provided between the top plate 11 and the outer frame 12.
  • the reinforcing member 400 is interposed between the top plate 11 and the outer frame 12 and is connected to the top plate 11 and the outer frame 12.
  • the reinforcing member 400 is provided in a region of the surface (back surface) 11b of the top plate 11 opposite to the suction surface 11a and which does not overlap with the suction hole 14.
  • FIGS. 1 and 10 A film processing method using the film processing apparatus of the present embodiment will be described with reference to FIGS. 1 and 10.
  • the film 100 is conveyed by the conveying means 40 for a predetermined length, and the processing target region of the film 100 is arranged on the suction surface 10a of the suction stage 10.
  • the inner space 17 of the suction stage 10 is evacuated by the vacuum pump 50 to create a negative pressure in the inner space 17 and suck the film 100 on the suction surface 10a of the suction stage 10.
  • the control unit 60 controls the vacuum pump 50 and the solenoid valve to optimize the atmospheric pressure (vacuum degree) in each of the small spaces 17A, 17B, 17C, 17D, and 17E.
  • the atmospheric pressure (vacuum degree) of the small spaces 17C located at the center of the suction stage 10 and the small spaces 17A and 17E located at both ends in the width direction of the suction stage 10 is changed. Specifically, the air pressure is high (vacuum degree is low) in the small space 17C located at the center of the suction stage 10, and the air pressure is low (vacuum) in the small spaces 17A and 17E at both ends in the width direction of the suction stage 10. (Higher degree). In the small spaces 17B and 17D in the portion between them, the atmospheric pressure is set to an intermediate value between the atmospheric pressures in the small spaces 17A and 17E and the atmospheric pressure in the small spaces 17C.
  • the air pressure is increased (the degree of vacuum is decreased) from both ends of the adsorption stage 10 toward the center.
  • the film 100 is vacuum-sucked on the suction surface 10a of the suction stage 10, it is possible to prevent the suction surface 10a of the suction stage 10 from being deformed.
  • the laser irradiation unit 22 of the laser irradiation means 20 is arranged at a predetermined position of the film 100 adsorbed on the adsorption surface 10a of the adsorption stage 10 by the linear guide 30, and the laser is applied from the laser irradiation unit 22 to the surface 100a of the film 100. Is irradiated with laser processing.
  • the film 100 is conveyed by the conveying means 40 for a predetermined length, and the processing target region of the unprocessed film 100 is arranged on the adsorption surface 10a of the adsorption stage 10.
  • the surface 100a of the film 100 is laser-processed.
  • the air pressure in the inner space 17 when the film 100 is adsorbed on the adsorption surface 10a of the adsorption stage 10 is detected, and the air pressure is set to a set value (adsorption surface of the adsorption stage 10).
  • the air pressure is set to a set value (adsorption surface of the adsorption stage 10).
  • the air pressure in the inner space 17 when the film 100 is adsorbed on the adsorption surface 10a of the adsorption stage 10 is detected and the air pressure becomes lower than the above set value. It is preferable to push up the top plate 11 from the back surface 11b side by a hydraulic cylinder or the like. The amount (distance) of pushing up the top plate 11 is detected by a displacement sensor provided in the inner space 17. Such control is performed individually for each of the small spaces 17A, 17B, 17C, 17D, and 17E constituting the inner space 17.
  • FIG. 13 is a cross-sectional view taken along the line AA in FIG.
  • the same configurations as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the suction stage 500 vacuum sucks a part of the long film 100, that is, the film 100 arranged on the suction surface 500a of the suction stage 500.
  • the suction stage 500 has a main body 510, a suction hole 520, and an inner space 530.
  • the size of the suction stage 500, that is, the area of the suction surface 500a of the suction stage 500 is appropriately adjusted according to the width of the film 100, and is preferably 400 mm in length ⁇ 400 mm in width, for example.
  • the main body 510 is a thick plate-shaped member.
  • the suction hole 520 extends along the thickness direction of the main body 510 from the upper surface 510a of the main body 510 to its vicinity (the upper portion in the thickness direction of the main body 510).
  • the inner space 530 extends in the main body 510 in the region below the lower end 520a of the suction hole 520 along the thickness direction of the main body 510. The suction hole 520 and the inner space 530 communicate with each other.
  • the width of the inner space 530 (the width in the direction perpendicular to the thickness direction of the main body 510, the diameter when the shape of the inner space 530 viewed from the upper surface 510a side of the main body 510 in a plan view is circular) is the width of the suction hole 520 (the width in the direction perpendicular to the thickness direction of the main body 510).
  • the width in the direction perpendicular to the thickness direction of the main body 510 is larger than the diameter) when the shape of the suction hole 520 viewed from the upper surface 510a side of the main body 510 in a plan view is circular.
  • the inner space 530 is formed in the main body 510 at intervals in the direction perpendicular to the thickness direction of the main body 510, and the inner space 530 is divided into five small spaces 530A and 530B by the inner wall (corresponding to a partition member) 511 of the main body 510. , 530C, 530D, 530E.
  • the small space 530C constitutes a central small space group consisting of one or more small spaces located in the central portion of the suction stage 500.
  • the small spaces 530A, 530B, 530D, and 530E form an outer small space group consisting of one or more small spaces located outside the central small space group.
  • the thickness (height) of the main body 510 is not particularly limited, but is preferably 10 mm to 150 mm.
  • the width of the suction hole 520 is not particularly limited, but is preferably 0.2 mm to 2 mm.
  • the suction hole 520 is for sucking the film 100 on the suction surface 500a of the suction stage 500 by evacuating the inner space 530 with the vacuum pump 50 to create a negative pressure in the inner space 530.
  • the distance between the suction holes 520 is preferably 5 mm to 150 mm.
  • the width of the small spaces 530A, 530B, 530C, 530D, and 530E is not particularly limited, but is preferably 2 mm to 150 mm.
  • the inner space 530 of the suction stage 500 is divided into five small spaces 530A, 530B, 530C, 530D, and 530E by the inner wall 511 of the main body 510, and the small spaces are divided into five. It has a vacuum pump 50 that individually depressurizes 530A, 530B, 530C, 530D, and 530E. Therefore, according to the film processing apparatus of the present embodiment, when the film 100 is vacuum-sucked on the suction surface 500a of the suction stage 500, it is possible to suppress the deformation of the suction surface 500a of the suction stage 500.
  • the pressure (vacuum degree) in each of the small spaces 530A, 530B, 530C, 530D, and 530E is optimized to optimize the film 100. Is vacuum-sucked onto the suction surface 500a of the suction stage 500, the deformation of the suction surface 500a of the suction stage 500 can be suppressed.
  • the air pressures of the small spaces 530A and 530E located at both ends of the suction stage 500 in the width direction corresponding to both ends of the film 100 having a large warp are minimized, and the central portion of the suction stage 500 in the width direction. The air pressure is increased toward the small space 530C located in.
  • the atmospheric pressure of the small spaces 530B and 530D located between the small spaces 530A and 530E and the small space 530C shall be an intermediate value between the atmospheric pressures of the small spaces 530A and 530E and the atmospheric pressure of the small spaces 530C.
  • FIG. 14 is a cross-sectional view taken along the line AA in FIG.
  • the same configurations as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the suction stage 600 vacuum sucks a part of the long film 100, that is, the film 100 arranged on the suction surface 600a of the suction stage 600.
  • the suction stage 600 has a top plate 11, a partition member 610, a bottom plate 620, and a suction hole 14.
  • the size of the suction stage 600 that is, the area of the suction surface 600a of the suction stage 600 is appropriately adjusted according to the width of the film 100, and is preferably 400 mm in length ⁇ 400 mm in width, for example.
  • the top plate 11 and the bottom plate 620 are arranged to face each other at predetermined intervals via the partition member 610. That is, a partition member 610 is provided between the top plate 11 and the bottom plate 620. The partition member 610 is interposed between the top plate 11 and the bottom plate 620 and is connected to the top plate 11 and the bottom plate 620. The partition members 610 are arranged on the back surface 11b side of the top plate 11 at predetermined intervals. Two adjacent partition members 610 form a set and are connected to the same bottom plate 620. As a result, on the back surface 11b side of the top plate 11, small spaces 630A, 630B, 630C, and 630D surrounded by the top plate 11, the two partition members 610, and the bottom plate 620 are formed.
  • the small spaces 630A, 630B, 630C, and 630D are independent of each other and are arranged at predetermined intervals.
  • the partition member 610 is provided in a region of the back surface 11b of the top plate 11 that does not overlap with the suction hole 14.
  • the suction hole 14 is provided so as to communicate with the small spaces 630A, 630B, 630C, and 630D.
  • a plurality of suction holes 14 are provided in the region corresponding to the small spaces 630A, 630B, 630C, and 630D in the top plate 11.
  • the small spaces 630B and 630C form a central small space group composed of one or more small spaces located in the central portion of the suction stage 600.
  • the small spaces 630A and 630D form an outer small space group composed of one or more small spaces located outside the central small space group.
  • the processing apparatus of the present embodiment has a vacuum pump 50 that individually reduces the pressure of the small spaces 630A, 630B, 630C, and 630D divided into four.
  • small spaces 640A, 640B, and 640C partitioned by the partition member 610 are provided between the small spaces 630A, 630B, 630C, and 630D surrounded by the top plate 11, the two partition members 610, and the bottom plate 620. It is formed.
  • the small spaces 640A, 640B, and 640C are independent of each other, and are arranged at predetermined intervals.
  • the suction holes 14 are not provided at the positions corresponding to the small spaces 640A, 640B, and 640C on the top plate 11.
  • the interval at which the partition member 610 is provided on the back surface 11b of the top plate 11 is not particularly limited.
  • the distance between the two partition members 610 forming the small spaces 630A, 630B, 630C, and 630D is preferably 200 mm or less, and more preferably 150 mm or less.
  • the suction stage 600 having a wide width such as 1 m width can be easily manufactured by widening the distance between the two partition members 610 forming the small spaces 640A, 640B, and 640C.
  • the film 100 can be sucked if the small space 630 is arranged at the center and the edge in the width direction of the suction stage 600.
  • a smaller space 630 may be added between the center and the edge of the adsorption stage 600 in the width direction. Further, even if the distance between the two partition members 610 forming the small space 640, that is, the width of the small space 640 is 200 mm or more, the small space 640 does not evacuate, so that the suction stage 600 does not have a dent.
  • the film 100 is a non-warped base material (a base material that becomes flat when placed on the suction surface 600a of the suction stage 600), two partitions forming the small spaces 630A, 630B, 630C, and 630D.
  • the interval at which the members 610 are provided is preferably 200 mm or less.
  • the pressure at which the small spaces 630A, 630B, 630C, and 630D are evacuated by a vacuum pump or the like is set to 70 kPa or less.
  • the film 100 is a warped base material (a base material that does not become flat when placed on the suction surface 600a of the suction stage 600 and the edges are raised)
  • the small spaces 630A, 630B, 630C, and 630D are formed.
  • the distance between the two partition members 610 to be formed is preferably 150 mm or less.
  • the pressure at which the small spaces 630A, 630B, 630C, and 630D are evacuated by a vacuum pump or the like is set to 50 kPa or less.
  • the width of the suction hole 14 (the width in the direction perpendicular to the thickness direction of the top plate 11 and the diameter when the shape of the suction hole 14 viewed from the suction surface 600a side of the suction stage 600 in a plan view is circular) is not particularly limited. However, for example, it is preferably 0.2 mm to 2 mm.
  • the suction hole 14 creates a negative pressure in the small spaces 630A, 630B, 630C, and 630D by evacuating the small spaces 630A, 630B, 630C, and 630D with the vacuum pump 50, and forms the suction surface 600a of the suction stage 600. This is for adsorbing the film 100.
  • the distance between the suction holes 14 is 5 mm or more. It is preferably 150 mm.
  • the thickness of the bottom plate 620 is not particularly limited, but is preferably 10 mm or more.
  • small spaces 630A, 630B, 630C, and 630D surrounded by the top plate 11, two partition members 610, and the bottom plate 620 are formed on the back surface 11b side of the top plate 11. It has a vacuum pump 50 that individually depressurizes the small spaces 630A, 630B, 630C, and 630D divided into four. Therefore, according to the film processing apparatus of the present embodiment, when the film 100 is vacuum-sucked on the suction surface 600a of the suction stage 600, it is possible to suppress the deformation of the suction surface 600a of the suction stage 600.
  • the film 100 is vacuum-sucked on the suction surface 600a of the suction stage 600, the film 100 is sucked by optimizing the pressure (vacuum degree) in each of the small spaces 630A, 630B, 630C, and 630D.
  • the pressure vacuum degree
  • the air pressure of the small spaces 630A and 630D located at both ends of the suction stage 600 in the width direction corresponding to both ends of the film 100 having a large warp is minimized, and the central portion of the suction stage 600 in the width direction.
  • the air pressure is increased toward the small spaces 630B and 630C located in.
  • the atmospheric pressure in the small spaces 630B and 630C is maximized.
  • the film 100 adsorbed on the adsorption surface 600a of the adsorption stage 600 from warping. Therefore, the surface 100a of the film 100 can be subjected to predetermined processing or uniform processing.
  • the film processing apparatus of the present invention is not limited to the above-described embodiment.
  • the film processing apparatus of the present invention may have means for applying tension in the width direction of the film.
  • the film processing apparatus of the present invention can alleviate the warp of the film conveyed by the roll-to-roll method, and can uniformly vacuum-adsorb the film on the stage. Further, the film processing apparatus of the present invention can suppress deformation of the adsorption stage when the film is vacuum-adsorbed, and as a result, can suppress warpage of the film. Therefore, when the film processed by the film processing apparatus of the present invention is applied to an electronic device, an electronic device that functions as designed can be obtained.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2020/021052 2019-05-08 2020-05-28 フィルム加工装置 WO2020226185A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021518411A JPWO2020226185A1 (enrdf_load_stackoverflow) 2019-05-08 2020-05-28

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-088446 2019-05-08
JP2019088446 2019-05-08
JP2019099901 2019-05-29
JP2019-099901 2019-05-29

Publications (1)

Publication Number Publication Date
WO2020226185A1 true WO2020226185A1 (ja) 2020-11-12

Family

ID=73051291

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/021052 WO2020226185A1 (ja) 2019-05-08 2020-05-28 フィルム加工装置

Country Status (2)

Country Link
JP (1) JPWO2020226185A1 (enrdf_load_stackoverflow)
WO (1) WO2020226185A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118458459A (zh) * 2024-07-12 2024-08-09 温州润丰机械有限公司 一种编织袋软包装输送机的出膜限位机构

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0188660U (enrdf_load_stackoverflow) * 1987-12-04 1989-06-12
JP2001036106A (ja) * 1999-07-23 2001-02-09 Fuji Electric Co Ltd 薄膜太陽電池の製造装置
JP2001072290A (ja) * 1999-09-03 2001-03-21 Toppan Printing Co Ltd 長尺物の搬送方法と長尺物の搬送装置
JP2009173443A (ja) * 2007-12-28 2009-08-06 Seiko Epson Corp インクジェット捺染装置
JP2012192690A (ja) * 2011-03-17 2012-10-11 Seiko Epson Corp 記録装置
JP2014172393A (ja) * 2013-03-13 2014-09-22 Seiko Epson Corp プラテン装置およびこれを備えた印刷装置
JP2016016520A (ja) * 2014-07-04 2016-02-01 東レ株式会社 テンター装置及びフィルムの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0188660U (enrdf_load_stackoverflow) * 1987-12-04 1989-06-12
JP2001036106A (ja) * 1999-07-23 2001-02-09 Fuji Electric Co Ltd 薄膜太陽電池の製造装置
JP2001072290A (ja) * 1999-09-03 2001-03-21 Toppan Printing Co Ltd 長尺物の搬送方法と長尺物の搬送装置
JP2009173443A (ja) * 2007-12-28 2009-08-06 Seiko Epson Corp インクジェット捺染装置
JP2012192690A (ja) * 2011-03-17 2012-10-11 Seiko Epson Corp 記録装置
JP2014172393A (ja) * 2013-03-13 2014-09-22 Seiko Epson Corp プラテン装置およびこれを備えた印刷装置
JP2016016520A (ja) * 2014-07-04 2016-02-01 東レ株式会社 テンター装置及びフィルムの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118458459A (zh) * 2024-07-12 2024-08-09 温州润丰机械有限公司 一种编织袋软包装输送机的出膜限位机构

Also Published As

Publication number Publication date
JPWO2020226185A1 (enrdf_load_stackoverflow) 2020-11-12

Similar Documents

Publication Publication Date Title
KR102453746B1 (ko) 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
KR102316311B1 (ko) 접합 장치 및 접합 시스템
KR102407489B1 (ko) 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
JP5548426B2 (ja) インクジェット塗布装置及び方法
JP6407803B2 (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP5150949B2 (ja) 近接スキャン露光装置及びその制御方法
TWI493647B (zh) 接合裝置、接合方法、程式及電腦記憶媒體
JP2015119088A (ja) 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
JP2011242534A (ja) 基板搬送装置と基板の傾き補正
KR20210111158A (ko) 접합 장치, 접합 시스템, 접합 방법 및 기억 매체
CN107429386A (zh) 基板保持机构、成膜装置、及基板的保持方法
CN111041424B (zh) 成膜装置、制造系统、有机el面板的制造系统、成膜方法及有机el元件的制造方法
WO2020226185A1 (ja) フィルム加工装置
JP5437395B2 (ja) 真空蒸着装置及び真空蒸着方法
JP7290996B2 (ja) フィルム加工装置
JP6598521B2 (ja) 真空積層方法
KR102560167B1 (ko) 디본딩 서포트 장치 및 이를 이용한 디본딩 방법
KR20170102431A (ko) 프린트 기판용 노광 장치
JP6120749B2 (ja) 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
WO2012029493A1 (ja) ラミネート装置及びラミネート方法
JP7512264B2 (ja) フィルム加工装置
JP2012061506A (ja) レーザパターニング装置及びレーザパターニング方法
JP4852476B2 (ja) 薄膜形成装置および薄膜形成方法
KR100905394B1 (ko) 평판표시소자 제조장치
JP7649693B2 (ja) 基板キャリア、成膜システム、及び電子デバイスの製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20802661

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021518411

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20802661

Country of ref document: EP

Kind code of ref document: A1