WO2020217892A1 - Dispositif d'entrée - Google Patents

Dispositif d'entrée Download PDF

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Publication number
WO2020217892A1
WO2020217892A1 PCT/JP2020/014972 JP2020014972W WO2020217892A1 WO 2020217892 A1 WO2020217892 A1 WO 2020217892A1 JP 2020014972 W JP2020014972 W JP 2020014972W WO 2020217892 A1 WO2020217892 A1 WO 2020217892A1
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WO
WIPO (PCT)
Prior art keywords
dye
power generation
generation element
input device
electrode
Prior art date
Application number
PCT/JP2020/014972
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English (en)
Japanese (ja)
Inventor
浩一 奥田
絵美 日向野
敏行 日向野
Original Assignee
株式会社ジャパンディスプレイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2020217892A1 publication Critical patent/WO2020217892A1/fr

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/02Input arrangements using manually operated switches, e.g. using keyboards or dials
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/20Light-sensitive devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/542Dye sensitized solar cells

Definitions

  • One embodiment of the present invention relates to an input device having a power generation element.
  • keyboards that can be used without connecting to a computer by using wiring when using a computer have become widespread. Since such a keyboard is driven by a battery (storage battery) as a power source, it can be used for several hours per charge. However, when the rechargeable keyboard is used on the go, it cannot be used for a long time, and it is difficult to charge the keyboard on the go, so that the usage time is greatly restricted.
  • a battery storage battery
  • Patent Document 1 discloses an input device in which a solar cell is built in a keyboard and a signal is transmitted between the keyboard and the computer body by optical communication.
  • Patent Document 1 when a solar cell is built in an input device, the solar cell is arranged in a peripheral area of an area in which a plurality of keys are arranged. Therefore, the entire input device becomes large. Further, in a low illuminance environment, sufficient power may not be obtained.
  • one of the objects of the embodiment of the present invention is to provide a miniaturized input device that can generate sufficient power even in a low illuminance environment.
  • the input device includes a dye-sensitized power generation element and a touch sensor provided on the dye-sensitized power generation element, and the dye-sensitized power generation element includes a first electrode and a first electrode. It includes an oxide semiconductor layer facing the electrode, an electrolyte medium between the first electrode and the oxide semiconductor layer, and a first dye between the electrolyte medium and the oxide semiconductor layer.
  • the input device includes a first dye sensitized power generation element, a second dye sensitized power generation element, a touch sensor on the first dye sensitized power generation element and the second dye sensitized power generation element, and the like.
  • Each of the first dye-sensitized power generation element and the second dye-sensitized power generation element is between the first electrode, the oxide semiconductor layer facing the first electrode, and the first electrode and the oxide semiconductor layer.
  • the electrolyte medium, the electrolyte medium, and the first dye between the oxide semiconductor layer.
  • (A) It is a figure explaining the outline of the input device which concerns on one Embodiment of this invention.
  • (B) It is a figure explaining the hardware structure of the input device which concerns on one Embodiment of this invention. It is a top view of the input device which concerns on one Embodiment of this invention. It is an enlarged view of a part of the input device shown in FIG. It is sectional drawing when the two keys shown in FIG. 3 are cut along the B1-B2 line. It is sectional drawing when the two keys shown in FIG. 3 are cut along the line A1-A2.
  • (A) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention.
  • (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention.
  • A It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention.
  • (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention.
  • A) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention.
  • (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention.
  • A) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention.
  • (B) It is sectional drawing explaining the manufacturing method of the input device which concerns on one Embodiment of this invention. It is sectional drawing of the input device which concerns on one Embodiment of this invention. It is a plane layout view of the conductive layer included in a dye-sensitized power generation element. It is a plane layout view of the conductive layer included in a dye-sensitized power generation element. It is sectional drawing when the dye sensitizing power generation element shown in FIG. 12 is cut along the line C1-C2. It is a plane layout view of the conductive layer included in a dye-sensitized power generation element. It is sectional drawing when the dye sensitizing power generation element shown in FIG. 14 is cut along the line D1-D2.
  • FIG. 1A is a diagram illustrating an outline of an input device 100 according to an embodiment of the present invention.
  • the input device 100 is connected to an information processing device 10 such as a personal computer, a smartphone, or a tablet by wireless communication.
  • the information processing device 10 can be controlled by transmitting the control signal detected by the input device 100 to the information processing device 10.
  • FIG. 1B is a diagram showing a hardware configuration of an input device 100 according to an embodiment of the present invention.
  • the input device 100 includes a control unit 111, an operation unit 112, a communication unit 113, and a power generation unit 114.
  • the control unit 111 is, for example, a CPU (Central Processing Unit) and executes various control processes of the operation unit 112, the communication unit 113, and the power generation unit 114.
  • the operation unit 112 corresponds to an area in which a plurality of keys 102 are arranged.
  • the operation unit 112 includes, for example, a touch sensor and detects that the user has touched the key 102, the operation unit 112 outputs a control signal corresponding to the key 102 that the user has contacted to the control unit of the information processing device 10.
  • the operation unit 112 includes haptics, and when the haptics detects that the user has touched the key 102, the haptics vibrate the contacted region as an output reaction.
  • the communication unit 113 is a communication interface included in the input device 100.
  • the input device 100 can be connected to the information processing device 10 via the communication unit 113.
  • the communication unit 113 transmits a signal to the information processing device 10 by wireless communication.
  • As the communication unit 113 for example, Bluetooth (registered trademark) can be used.
  • the power generation unit 114 generates electric power consumed by the input device 100.
  • the power generation unit 114 supplies the generated electric power to the control unit 111, the operation unit 112, and the communication unit 113.
  • a dye-sensitized power generation element is used as the power generation unit 114.
  • the configuration of the dye-sensitized power generation element will be described in detail.
  • the dye-sensitized power generation element is called a Grätzel cell and has a photoanode, a counter electrode, and an electrolyte medium provided between the photoanode and the counter electrode.
  • the optical anode typically has a conductive layer that transmits visible light and a semiconductor layer that contains a photosensitizer formed on the conductive layer.
  • the semiconductor layer contains, for example, porous titanium oxide, and a dye is supported on the surface of the porous titanium oxide as a photosensitizer.
  • the dye is, for example, a ruthenium (Ru) complex.
  • the counter electrode is, for example, a platinum electrode.
  • the electrolyte medium is, for example, an electrolyte solution containing a redox substance (mediator).
  • the dye-sensitized power generation element when the battery is irradiated with light, the dye carried on the porous titanium oxide of the photoanode is photoexcited, and then electrons are injected from the dye into the porous titanium oxide to oxidize the dye. To. The dye that has lost electrons takes electrons from iodine in the electric field solution and is reduced, and iodine receives electrons from the counter electrode and returns to the original.
  • the configuration of the photosensitizer type power generation element according to the embodiment of the present invention will be described in detail below.
  • FIG. 2 is a plan view of the input device 100 according to the embodiment of the present invention. As shown in FIG. 2, a plurality of keys 102 are arranged on the upper surface of the input device 100, and the keys 102 are surrounded by a region 105.
  • FIG. 3 is an enlarged view of a part 110 of the input device 100 shown in FIG. 2, and FIG. 4 is a cross-sectional view of the part 110 shown in FIG. 3 cut along the B1-B2 line. Note that FIG. 4 shows the configuration of the dye-sensitized power generation element 210.
  • the input device 100 has a dye-sensitized power generation element 210.
  • the dye-sensitized power generation element 210 is provided with a first conductive layer 202 and a first electrode 203 that functions as a counter electrode on the first substrate 201 side, and a second conductive layer 206 that functions as an optical anode on the second substrate 207 side.
  • the oxide semiconductor layer 205 and the dye 208, the dye 218, and the dye 228 are provided.
  • an electrolyte medium 204 is provided between the first electrode 203 and the dye 208, the dye 218, and the dye 228.
  • the first substrate 201 and the second substrate 207 for example, a glass substrate or a plastic substrate is used.
  • a plastic substrate for example, an organic resin such as acrylic, polyimide, polyethylene terephthalate, or polyethylene naphthalate is used.
  • the first substrate 201 has a first surface 201A and a second surface 201B opposite to the first surface 201A.
  • the second substrate 207 has a first surface 207A and a second surface 207B opposite to the first surface 207A.
  • the first surface 201A of the first substrate 201 is the surface on which the first electrode 203 is provided
  • the first surface 207A of the second substrate 207 is the surface on which the second conductive layer 206 is provided.
  • a flexible plastic substrate as the first substrate 201 and the second substrate 207, it is possible to form an input device 100 that can be bent or curved.
  • the first electrode 203 has no photovoltaic force.
  • the first electrode 203 has a function of reducing redox-based I 3 - ions to I - ions on the surface of the first electrode 203.
  • the first conductive layer 202 is connected to the first electrode 203 and is connected to the electrode supply terminal.
  • ITO Indium tin oxide
  • FTO fluorine-doped tin oxide
  • oxide semiconductor layer 205 n-type semiconductors such as titanium oxide, zinc oxide, and tin oxide are used.
  • IGZO may be used as the oxide semiconductor layer 205.
  • the oxide semiconductor layer 205 described above has absorption in the ultraviolet region.
  • the dye 208, the dye 218, and the dye 228 are adsorbed on the oxide semiconductor layer 205 by a chemical bond (ester bond).
  • Inorganic dyes or organic dyes are used as the dye 208, the dye 218, and the dye 228.
  • a Ru-based dye is used as the inorganic dye.
  • the Ru-based dye has a long photoexcitation lifetime, and the Ru oxide species generated in the electron transfer process after photoexcitation are stable.
  • Ru-based dye RuL 2 (NCS) 2 , RuL 1 (NCS) 2 , Ru phenanthroline dye, and Ru picinoline dye are used.
  • a coumarin derivative, a mercurochrome dye, or the like is used as the organic dye.
  • Dye 208, dye 218, and dye 228 have different peaks in the absorption spectrum. Therefore, the dye 208, the dye 218, and the dye 228 can represent the key 102 of the input device 100.
  • the dye 208 is used in the region 103
  • the dye 218 is used in the region 104
  • the dye 228 is used in the region 105.
  • the area 103 corresponds to the area of the key 102.
  • the area 104 is provided inside the area 103. In the area 104, the characters, figures, and symbols are arranged so as to form a pattern within the area 103. Further, the area 105 surrounds the area 103.
  • the input device 100 can display the key 102 and the peripheral region of the key 102 so as to be visually distinguishable.
  • the dye 208 and the dye 218 do not overlap with each other, and the dye 218 is preferably adsorbed on the oxide semiconductor layer 205.
  • the arrangement of the plurality of keys 102 is represented by the dye 208, the dye 218, and the dye 228. It suffices if the area 103, the area 104, and the area 105 can be visually identified. Therefore, the dye 108 may be provided at least in the region 103 representing the key 102, and the region 104 and the region 105 may not be provided with the dye. Further, since it is sufficient that the regions 103 to 105 can be distinguished from each other, the peaks of the absorption spectra of the dyes provided in the regions 104 and 105 may be substantially the same.
  • the electrolyte medium 204 receives electrons from the first electrode 203 and reduces the oxidized dye 208, dye 218, and dye 228. Therefore, those having a high diffusion rate in the electrolyte medium 204 and a low redox potential are preferable.
  • the electrolyte medium 204 for example, an iodine-based electric field solution is used. Further, as the electric field liquid other than the iodine type, a bromine type, a cobalt type and the like are used. Further, the electrolyte medium 204 may be a liquid or a solid.
  • a spacer is provided to form a gap between the first electrode 203 and the oxide semiconductor layer 205 (not shown in FIG. 3).
  • the spacer may be provided so as to surround the area where the plurality of keys are arranged (see FIG. 5), or a columnar spacer may be provided between the key 102 and the key 102.
  • FIG. 5 is a cross-sectional view when the input device 100 shown in FIG. 2 is cut along the lines A1-A2. Note that FIG. 5 describes a configuration in which the touch sensor 217 is used as the input function of the input device 100 and the haptics 220 is used as the output reaction.
  • the touch sensor 217 is provided above the second substrate 207.
  • the touch sensor 217 is formed directly on the second substrate 207.
  • the touch sensor 217 formed on a substrate (for example, a cover material) different from the second substrate 207 may be attached to the second substrate 207 with an adhesive.
  • the haptics 220 are provided below the dye-sensitized power generation element 210, and specifically, are provided on the second surface 201B of the first substrate 201.
  • the haptics 220 has a transparent electrode 212, a vibration type actuator 213, a transparent electrode 215, and a spacer 216.
  • a flexible substrate such as a plastic substrate is used in order to transmit the pressure when the key 102 is pressed by the user to the transparent electrode 215.
  • ITO is used as the transparent electrode 215, and the ITO is formed on the second surface 201B of the first substrate 201.
  • the actuator 213 is provided on the third substrate 211 via the transparent electrode 215.
  • ITO is formed by a sputtering method or a vapor deposition method.
  • the spacer 216 also functions as a sealing material for bonding the actuator 213 and the transparent electrode 215. Further, by providing the spacer 216, a space 214 can be provided between the actuator 213 and the transparent electrode 215.
  • the distance between the transparent electrode 212 and the transparent electrode 215 becomes narrow.
  • a current flows through the actuator 213, causing the key 102 to vibrate.
  • the vibration gives the user a sensation similar to the feel of pressing a physical key.
  • the dye sensitizing power generation element 210 is provided in the area where a plurality of keys are arranged.
  • the dye-sensitized power generation element 210 has a power storage function. Therefore, even if there is a sudden change in the amount of light, the fluctuation of the power output can be flattened to some extent. Therefore, even if the user interferes with the power generation of the dye-sensitized power generation element 210 by hand when using the input device 100, the fluctuation of the power output can be reduced as compared with the solar cell. Further, unlike the solar cell, it is not necessary to separate the area where the plurality of keys are arranged and the area where the dye sensitizing power generation element 210 is arranged, so that the input device 100 can be miniaturized.
  • FIG. 6A is a step of forming the first substrate 201, the first conductive layer 202, and the first electrode 203 on the support substrate 231.
  • the support substrate 231 is a substrate used when forming a plastic substrate as the first substrate 201.
  • a glass substrate is used as the support substrate 231.
  • the first substrate 201 is formed on the support substrate 231.
  • polyimide is used as the first substrate 201.
  • the first conductive layer 202 is formed on the first substrate 201.
  • the first conductive layer 202 is formed by a vapor deposition method using a metal mask.
  • the first electrode 203 is formed on the first conductive layer 202.
  • the first electrode 203 is also formed by a vapor deposition method using a metal mask.
  • FIG. 6B is a step of forming the second conductive layer 206, the oxide semiconductor layer 205, and the dye 208, the dye 218, and the dye 228 on the second substrate 207.
  • the dye 208 and the dye 218 are not shown.
  • the second substrate 207 for example, a glass substrate or a plastic substrate can be used.
  • the second conductive layer 206 and the oxide semiconductor layer 205 can be formed by a sputtering method. Further, the second conductive layer 206 and the oxide semiconductor layer 205 can be processed by photolithography.
  • the second substrate 207 may be formed on the support substrate in the same manner as in the step of forming the first substrate 201.
  • the dye 208, the dye 218, and the dye 228 are formed on the oxide semiconductor layer 205. It is preferable that the dye 208, the dye 218, and the dye 228 have different peaks in the absorption spectra.
  • Dye 208 is used in region 103
  • dye 218 is used in region 104
  • dye 228 is used in region 105.
  • dye 228 is shown.
  • FIG. 7A is a diagram illustrating a step of forming the spacer 209 on the second substrate 207 and forming the electrolyte medium 204 in the region surrounded by the spacer 209.
  • the spacer 209 is formed so as to surround the peripheral edge of the second substrate 207. Further, the electrolyte medium 204 is formed in the region surrounded by the spacer 209.
  • FIG. 7B is a diagram illustrating a step of bonding the first substrate 201 and the second substrate 207.
  • the bonding of the first substrate 201 and the second substrate 207 may be performed in the atmosphere or in a vacuum.
  • the spacer 209 is cured and the first substrate 201 and the second substrate 207 can be adhered to each other.
  • FIG. 8A describes a step of forming the transparent electrode 215 on the second surface 201B of the first substrate 201 after peeling the dye-sensitized power generation element 210 formed on the first substrate 201 from the support substrate 231. It is a figure to do.
  • a transparent electrode is used as the transparent electrode 215.
  • FIG. 8B is a diagram illustrating a process of forming the actuator 213, the transparent electrode 212, and the spacer 216 on the third substrate 211.
  • a transparent electrode 212 is formed on the third substrate 211.
  • a vibration type actuator 213 is provided on the transparent electrode 212.
  • the spacer 216 is formed on the vibration type actuator 213. The spacer 216 is formed at a height at which the transparent electrode 212 and the transparent electrode 215 face each other.
  • FIG. 9 is a diagram illustrating a step of bonding the third substrate 211 to the transparent electrode 215 of the first substrate 201 with the spacer 216 sandwiched between them. As a result, the dye-sensitized power generation element 210 and the haptics 220 can be formed.
  • the input device 100 shown in FIG. 5 can be manufactured.
  • the touch sensor 217 may be formed directly on the second substrate 207, or the touch sensor formed on the cover material may be attached to the second substrate 207 via an adhesive material.
  • Spacer 209B may be provided in the region 105.
  • the spacer 209B is preferably provided so as to be in contact with the oxide semiconductor layer and the first electrode. Further, the spacer 209B may be provided between the adjacent regions 103.
  • FIG. 11 is a plan view of the first conductive layer 202 and the second conductive layer 206.
  • the first conductive layer 202 and the second conductive layer 206 are arranged so as to overlap with the region where at least a plurality of keys 102 are arranged.
  • the first conductive layer 202 and the second conductive layer 206 may be formed in a peripheral region of a region in which a plurality of keys 102 are arranged.
  • the area of the first conductive layer 202 is shown to be larger than the area of the second conductive layer 206, but the area of the first conductive layer 202 and the area of the second conductive layer 206 are shown. It may be the same as the area of 206.
  • terminal 222 of the first conductive layer 202 and the terminal 226 of the second conductive layer 206 are connected to the power supply terminal.
  • the terminal 222 and the terminal 226 are connected to the control unit 111, the operation unit 112, and the communication unit 113 via the power supply terminal.
  • FIG. 12 is a plan view of the first conductive layer 202 and the second conductive layer 206 provided on the dye-sensitized power generation element 210. As shown in FIG. 12, it is divided into a plurality of first conductive layers 202A to 202D, and is divided into a plurality of second conductive layers 206A to 206D. The plurality of first conductive layers 202A to 202D are connected in parallel, and the plurality of second conductive layers 206A to 206D are connected in parallel. That is, the configuration is equivalent to that a plurality of dye sensitizing power generation elements 210A to 210D are connected in parallel.
  • FIG. 13 is a cross-sectional view when cut along the line C1-C2 shown in FIG.
  • the stacking order of the first electrode 203, the oxide semiconductor layer 205, the electrolyte medium 204, and the dye 228 is the same.
  • the stacking order of the first electrode 203, the oxide semiconductor layer 205, the electrolyte medium 204, and the dye 228 included in the dye sensitized power generation element 210A is the first electrode 203, the oxide semiconductor layer included in the dye sensitized power generation element 210B.
  • the order of stacking 205, the electrolyte medium 204, and the dye 228 is the same.
  • the first electrode 203 When dividing into a plurality of first conductive layers 202A to 202D, the first electrode 203 may be patterned in the same manner as the first conductive layers 202A to 202D. Alternatively, the first electrode 203 may be formed so as to overlap the entire plurality of first conductive layers 202A to 202D without patterning. Although the dye is adsorbed on the oxide semiconductor layer 205, it is difficult to adsorb on the first electrode 203. Therefore, for example, when the dye 228 is provided in the region between the first conductive layer 202A and the first conductive layer 202B, the oxide semiconductor layer 205 is not patterned, and the plurality of first conductive layers 202A to 202D are formed. It is preferable to form it so as to overlap with the whole.
  • FIG. 14 is a plan view of the first conductive layer 202 and the second conductive layer 206. As shown in FIG. 14, it is divided into a plurality of first conductive layers 202A to a plurality of first conductive layers 202D, and is divided into a plurality of second conductive layers 206A to a second conductive layer 206D. The difference from FIG. 12 is that a plurality of dye sensitizing power generation elements 210A to 210D are connected in series. The first conductive layers 202A to 202D are connected to each other. On the other hand, the second conductive layer 206B and the second conductive layer 206C are connected. The second conductive layer 206A and the second conductive layer 206D are separated from each other. The terminal 222A of the second conductive layer 206A and the terminal 222B of the second conductive layer 206D are connected to different power supply terminals.
  • FIG. 15 is a cross-sectional view when cut along the D1-D2 line shown in FIG.
  • the first conductive layer 202A, the first electrode 203A, the electrolyte medium 204A, the dye 228A, the oxide semiconductor layer 205A, and the second conductive layer 206A are laminated in this order from the first substrate 201 side. .. Further, the first conductive layer 202A, the oxide semiconductor layer 205B, the dye 228B, the electrolyte medium 204, the first electrode 203B, and the second conductive layer 206B are laminated in this order from the first substrate 201 side.
  • the stacking order of the dye sensitizing power generation element 210A is opposite to the stacking order of the dye sensitizing power generation element 210B.
  • the first conductive layer 202C, the first electrode 203C, the electrolyte medium 204C, the dye 228C, the oxide semiconductor layer 205C, and the second conductive layer 206C are laminated in this order from the first substrate 201 side.
  • the first conductive layer 202D, the oxide semiconductor layer 205D, the dye 228D, the electrolyte medium 204D, the first electrode 203D, and the second conductive layer 206D are laminated in this order from the first substrate 201 side. That is, the adjacent dye sensitizing power generation elements 210A to 210D are connected while being interchanged in the stacking order.
  • FIG. 16 is a plan view of the first conductive layers 202A to 202D and the second conductive layers 206A to 206D. As shown in FIG. 16, it is divided into a plurality of first conductive layers 202A to 202D, and is divided into a plurality of second conductive layers 206A to 206D. Also in FIG. 16, the configuration is equivalent to that of a plurality of dye sensitizing power generation elements 210A to 210D connected in series. The difference from FIG. 14 is that the first conductive layers 202A to 202D and the second conductive layers 206A to 206D are connected inside the dye sensitizing power generation element 210.
  • FIG. 17 is a cross-sectional view taken along the line E1-E2 shown in FIG.
  • the first electrodes 203A to 203D are formed on the first conductive layers 202A to 202D, and the second conductive layers 206A to 206D are formed via the oxide semiconductor layers 205A to 205D.
  • Dyes 228A to 228D are provided.
  • the first conductive layer 202A partially overlaps with the second conductive layer 206B. In the region where the first conductive layer 202A and the second conductive layer 206B are overlapped with each other, the first conductive layer 202 and the second conductive layer 206B are connected by the conductive sealing material 219.
  • first conductive layer 202B partially overlaps with the second conductive layer 206C.
  • first conductive layer 202B and the second conductive layer 206C are connected by the conductive sealing material 219.
  • the conductive sealing material 219 is surrounded by a spacer 209, and insulates the adjacent first conductive layer 202 and the adjacent second conductive layer 206.
  • the configuration in which the dye-sensitized power generation element 210 is provided in the region where the plurality of keys 102 are arranged has been described, but the region where the dye-sensitized power generation element 210 is provided is included in this. Not limited.
  • the dye sensitizing power generation element 230A may be provided on the side surface of the housing 101 of the input device 100.
  • FIG. 18 shows an external view of the input device 100 according to the embodiment of the present invention.
  • a dye sensitizing power generation element 210 is provided on the side surface of the housing 101 of the input device 100.
  • One dye-sensitizing power generation element 210 may be provided so as to surround the side surface of the housing 101, or the dye-sensitizing power generation element 230A may be provided for each side surface of the housing 101.
  • the amount of power generation can be increased because the light can be absorbed from the side surface as compared with the case where the light is absorbed only from the upper surface of the input device 100.

Abstract

L'invention concerne un dispositif d'entrée comprenant un élément de génération d'énergie à colorant et un capteur tactile disposé sur l'élément de génération d'énergie à colorant, l'élément de génération d'énergie à colorant ayant une première électrode, une couche semi-conductrice à oxyde faisant face à la première électrode, un milieu électrolytique entre la première électrode et la couche semi-conductrice à oxyde, et un premier pigment entre le milieu électrolytique et la couche semi-conductrice à oxyde.
PCT/JP2020/014972 2019-04-22 2020-04-01 Dispositif d'entrée WO2020217892A1 (fr)

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JP2019080990A JP2020177564A (ja) 2019-04-22 2019-04-22 入力装置
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