WO2020215975A1 - Coque, son procédé de fabrication, résine époxy modifiée, plaque de résine époxy et dispositif électronique - Google Patents

Coque, son procédé de fabrication, résine époxy modifiée, plaque de résine époxy et dispositif électronique Download PDF

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Publication number
WO2020215975A1
WO2020215975A1 PCT/CN2020/081315 CN2020081315W WO2020215975A1 WO 2020215975 A1 WO2020215975 A1 WO 2020215975A1 CN 2020081315 W CN2020081315 W CN 2020081315W WO 2020215975 A1 WO2020215975 A1 WO 2020215975A1
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Prior art keywords
epoxy resin
layer
resin board
modified
adhesive layer
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PCT/CN2020/081315
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English (en)
Chinese (zh)
Inventor
杨光明
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Oppo广东移动通信有限公司
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Publication of WO2020215975A1 publication Critical patent/WO2020215975A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers

Definitions

  • the invention relates to the technical field of electronic equipment, in particular to a housing and a manufacturing method thereof, a modified epoxy resin, an epoxy resin board and electronic equipment.
  • the shell materials of electronic devices are usually made of composite sheets made of PC (polycarbonate) and PMMA (polymethyl methacrylate), pure PC sheets, etc.
  • PC polycarbonate
  • PMMA polymethyl methacrylate
  • the tensile properties of composite sheets Inferior. If bending is used, it is easy to crack when stretched during the bending process.
  • pure PC sheet has good tensile properties, it can solve the cracking problem in the forming and stretching process of composite sheet to a certain extent, but The low hardness of PC board leads to poor wear resistance and scratch resistance, which affects consumer experience.
  • PET (polyethylene terephthalate) sheet has good wear resistance and scratch resistance, some terminal companies are also trying to use PET sheet to make electronic equipment shells, but PET sheet is in the process of bending and forming. It is easy to warp, which limits its application on the back cover.
  • a modified epoxy resin the modified epoxy resin has an epoxy value of 0.25-0.45
  • the modified epoxy resin is an epoxy resin modified by a modified product
  • the modified product is selected from organic At least one of silicon, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5-1:10.
  • An epoxy resin board the material of the epoxy resin board is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is a modified product.
  • the modified product is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5 -1:10.
  • a manufacturing method of a shell includes the following steps:
  • the material of the epoxy resin board is modified epoxy resin
  • the epoxy value of the modified epoxy resin is 0.25-0.45
  • the modified epoxy resin is modified by the modified product
  • the epoxy resin, the modified substance is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified substance to the epoxy resin is 1:5- 1:10;
  • the epoxy resin board is bent and formed to obtain a shell.
  • An electronic device includes the above-mentioned casing or the casing produced by the above-mentioned casing manufacturing method.
  • Fig. 1 is a flowchart of a manufacturing method of a housing of the first embodiment
  • FIG. 2 is a schematic diagram of the structure of the housing of the first embodiment
  • Figure 3 is a partial cross-sectional view of the housing shown in Figure 2;
  • FIG. 4 is a flowchart of the manufacturing method of the housing of the second embodiment
  • Figure 5 is a partial cross-sectional view of the housing of the second embodiment
  • Fig. 6 is a flow chart of the manufacturing method of the housing of the third embodiment
  • Fig. 7 is a partial cross-sectional view of the housing of the third embodiment.
  • the modified epoxy resin of an embodiment can be used to make housings, such as housings of electronic devices, especially back covers of mobile phones, tablet computers, and the like.
  • the epoxy value of the modified epoxy resin is 0.25-0.45
  • the modified epoxy resin is the epoxy resin modified by the modified product
  • the modified product is selected from at least one of silicone, polyurethane prepolymer and polyimide One type
  • the mass ratio of the modified product to the epoxy resin is 1:5-1:10.
  • the epoxy value referred to herein refers to the amount (ie, molar amount) of the epoxy group contained in 100g of the modified epoxy resin, and the epoxy value of the modified epoxy resin can be determined according to the epoxy value. Quality percentage.
  • Modification of epoxy resin can improve the tensile strength and impact resistance of epoxy resin and reduce the risk of material cracking during the manufacturing process while ensuring that the epoxy resin has a higher hardness.
  • the method for preparing the modified epoxy resin in one embodiment is a method for preparing the above-mentioned modified epoxy resin.
  • the method for preparing the modified epoxy resin includes the following steps: according to the epoxy value of the modified epoxy resin 0.25-0.45, mix the above modified substance, epoxy resin and catalyst to obtain a mixture, wherein the mass ratio of the modified substance to epoxy resin is 1:5-1:10; add curing agent to the mixture, and then React at 80°C-120°C to obtain the above-mentioned modified epoxy resin.
  • the epoxy resin may be an epoxy resin commonly used in the art, such as bisphenol A epoxy resin.
  • the epoxy resin is selected from at least one of E-51 epoxy resin, E-55 epoxy resin and E-44 epoxy resin.
  • the organosilicon can be an organosilicon monomer commonly used in the field.
  • the silicone is selected from polydimethylsiloxane, dimethyldimethoxysiloxane, methylvinyldimethoxysiloxane and methylphenyldimethoxysiloxane At least one of siloxanes.
  • the polyurethane prepolymer can be a polyurethane prepolymer commonly used in the field for modifying epoxy resins, and the polyurethane prepolymer is obtained by reacting diisocyanate or polyisocyanate and polyol in a certain proportion.
  • the polyisocyanate is selected from IPDI (isophorone diisocyanate), TDI (toluene diisocyanate), MDI (diphenylmethane-4,4'-diisocyanate) and HDI (hexamethylene diisocyanate) One of them; the polyol is polyethylene glycol or polypropylene glycol; the mass ratio of polyisocyanate to polyol is 1:(0.5-1.5).
  • Polyurethane prepolymers can also be purchased on the market, such as the polyurethane prepolymer model KHP-456 produced by Jining Huakai Resin, and the MDI polyurethane prepolymer model N434 of Dow USA.
  • the polyimide is selected from benzene type polyimide, fluorinated anhydride type polyimide, ketone anhydride type polyimide, NA group-terminated polyimide, ethynyl-terminated polyimide, polyphenylene At least one of bisimidazole polyimides.
  • the catalyst may be a catalyst commonly used in the field.
  • the catalyst is dibutyl tin dilaurate.
  • the curing agent may be a curing agent commonly used in the field.
  • the curing agent is dicyandiamide.
  • the modified product is selected from at least one of silicone and polyurethane prepolymer; or, the modified product is made of It is composed of polyimide and polyurethane prepolymer.
  • the mass percentage of the polyurethane prepolymer is more than 60%; or, the modification is made of silicone with a mass ratio of 1:(0.1-0.2) And polyimide composition.
  • the step of preparing the modified epoxy resin includes: mixing the modified product, epoxy resin, and catalyst at room temperature for 1 hour to 4 hours, and then adding a curing agent at 80°C to 120°C React for 1 hour to 2 hours to obtain modified epoxy resin.
  • the mass ratio of modified substance and epoxy resin is 1:5-1:10
  • the mass ratio of catalyst to epoxy resin is 1:100-5:100
  • the mass ratio of curing agent to epoxy resin is 10: 100-30:100.
  • the room temperature referred to herein is 10°C-40°C.
  • the method for preparing the above-mentioned modified epoxy resin is not limited to using the materials and steps in the above-mentioned steps, and the above-mentioned modified epoxy resin can also be prepared by using a traditional modified epoxy resin preparation process.
  • the controlled epoxy value of the modified epoxy resin is 0.25-0.45, and the mass ratio of the modified epoxy resin to the epoxy resin is 1:5-1:10, so that the modified epoxy resin
  • the hardness can reach HB-H, and it has good wear resistance and good scratch resistance; the above modified epoxy resin also has good tensile properties, tensile strength above 60MPa, and can be directly bent and formed; And the softening temperature of the above modified epoxy resin is 100°C-130°C, which has good high temperature resistance.
  • the softening temperature of the above modified epoxy resin is 100°C-130°C, which has good high temperature resistance.
  • Modified epoxy resin can also not yellow under ultraviolet light for 48H, has good aging resistance, and also has impact resistance.
  • the material of the epoxy resin board is the above-mentioned modified epoxy resin. That is, the epoxy resin board is obtained by the above-mentioned modified epoxy resin molding process.
  • the epoxy resin board can be used to make shells, such as the shells of electronic devices, especially the back covers of mobile phones or tablet computers.
  • the thickness of the epoxy resin board is 0.4 mm-0.8 mm, and the epoxy resin board of this thickness is suitable for making a shell with a decorative layer (such as a pattern, a texture, etc.). It can be understood that the thickness of the epoxy resin board can be adjusted according to the required thickness and performance.
  • the optical transmittance of the epoxy resin board is 83%-88%, so as to make other decorative layers (such as patterns, textures, etc.) on the epoxy resin board subsequently to obtain vibrant products.
  • the preparation step of the epoxy resin board includes: melting the modified epoxy resin at 140° C.-190° C. and then extruding to obtain the epoxy resin board.
  • the epoxy resin board is prepared from the modified epoxy resin, the epoxy resin board has a hardness of up to HB-H, and has good abrasion resistance and scratch resistance; and the epoxy resin board It also has good tensile properties, and can be directly bent and formed; and the softening temperature of the modified epoxy resin is 100°C-130°C, which has good high temperature resistance.
  • the traditional epoxy resin board has poor high temperature resistance and is easy to age, which limits its scope of use.
  • the material of the epoxy resin board is the modified epoxy resin, and the softening temperature of the modified epoxy resin is 100°C. -130°C, has good high temperature resistance, does not turn yellow under ultraviolet radiation for 48H, and has good aging resistance, so that the above epoxy resin board can be used for making shells.
  • the housing manufactured by this method can be used as the housing of an electronic device, such as a housing of a tablet computer, a mobile phone, etc., especially a back cover of a mobile phone or a tablet computer.
  • the manufacturing method of the housing of this embodiment includes the following steps S11-S15:
  • Step S11 preparing an epoxy resin board.
  • the material of the epoxy resin board is modified epoxy resin
  • the epoxy value of the modified epoxy resin is 0.25-0.45
  • the modified epoxy resin is the epoxy resin modified by the modification
  • the modification is selected from At least one of organosilicon, polyurethane prepolymer and polyimide
  • the mass ratio of the modified product and the epoxy resin is 1:5-1:10.
  • the epoxy resin board is the above-mentioned epoxy resin board, and the preparation method is as described above, which will not be repeated here.
  • the housing is the back cover of the mobile phone, and the thickness of the epoxy resin board is 0.4 mm-0.8 mm. It can be understood that the thickness of the epoxy resin board can be adjusted according to the required thickness and performance.
  • optical transmittance of the epoxy resin board is 83%-88%.
  • Step S12 forming a pattern layer on one side of the epoxy resin board.
  • the pattern of the pattern layer may be, for example, a LOGO, a symbol, an animal pattern, and the like.
  • the pattern layer is printed by mirror silver ink and dried. More specifically, the step of forming a pattern layer on one side of the epoxy resin board is: use 300-420 mesh screen printing mirror silver ink on one side of the epoxy resin board, and then statically at 15°C-30°C Let it stand for 30 minutes-60 minutes, and then bake at 60°C-80°C for 30 minutes-90 minutes.
  • the mirror ink is, for example, the 06B mirror silver ink from Shenzhen Lianyiwang Ink Technology Co., Ltd.
  • the corrosion-resistant layer is UV glue
  • the UV glue is urethane acrylate glue. This type of glue has good chemical resistance, good adhesion, and excellent weather resistance. Polyurethane acrylate glue such as Bethel New Material Co., Ltd.'s model is 633-75 UV glue.
  • the thickness of the pattern layer is 1 ⁇ m-4 ⁇ m. It is understood that the thickness of the pattern layer can be set as required.
  • Step S13 setting a decoration unit on the epoxy resin board.
  • a decoration unit is provided on the side of the epoxy resin board where the pattern layer is formed, and the pattern layer is covered.
  • the decoration unit includes an adhesive layer, a reflective layer and an ink layer.
  • the step of arranging a decorative unit on the epoxy resin board includes: forming a transparent adhesive layer on the side of the epoxy resin board where the pattern layer is formed, and the adhesive layer covers the pattern layer; A reflective layer is formed on one side; an ink layer is formed on the side of the reflective layer away from the adhesive layer.
  • the adhesive layer is obtained by UV (ultraviolet light) glue transfer, and the adhesive layer has a texture pattern, so that the shell has a textured appearance.
  • the UV glue can be a transparent UV glue that is commonly used in the field after curing.
  • the UV glue is urethane acrylate glue, for example, the UV glue of the model 633-75 from Bethel New Material Co., Ltd.
  • the curing energy of UV glue is 600mj/cm 2 -1500mj/cm 2 .
  • the UV glue is not limited to the above-mentioned glue, and may also be a glue that is commonly used in the field and becomes transparent after curing; the adhesive layer may not have a texture pattern, at this time, the shell does not have a texture appearance.
  • the thickness of the adhesive layer is 5 ⁇ m-20 ⁇ m. It can be understood that the thickness of the adhesive layer is not limited to the above-mentioned thickness, and the thickness of the adhesive layer can be set as required.
  • the reflective layer is obtained by vacuum non-conductive electroplating (NCVM), so that the reflective layer can not only impart color to the shell, but also improve the gloss and reflectivity of the shell.
  • NCVM vacuum non-conductive electroplating
  • the reflective layer formed on the adhesive layer can improve the reflective layer and adhesion.
  • the reflective layer is selected from at least an indium tin oxide layer, a titanium dioxide layer, a niobium dioxide layer, a niobium trioxide layer, a niobium dioxide layer, a niobium pentoxide layer, a silicon dioxide layer, and a zirconium dioxide layer.
  • the reflective layer may have a single-layer structure or a multilayer structure.
  • the total thickness of the reflective layer is 5 nanometers to 300 nanometers, that is, when the reflective layer is a single layer structure, the thickness of the reflective layer is 5 nanometers to 300 nanometers, and when the reflective layer is a multilayer structure, the multilayer The total thickness of the reflective layer is 5 nm to 300 nm. It can be understood that the thickness of the reflective layer is not limited to the above-mentioned thickness, and the thickness of the reflective layer can be set as required.
  • the ink layer is prepared by screen printing. Further, the ink layer is formed by multiple printings and multiple dryings, and multiple printings and multiple dryings are performed alternately. Each printing has a thickness of 5-8 microns.
  • the ink layer can be made more flat and relatively smooth through multiple printings. Reliable, if the thickness of a single printing is too thick, appearance quality problems such as bubbles may occur during baking.
  • the ink layer includes a white ink layer, a white ink layer or a gray ink layer. The ink layer can not only protect the reflective layer, but also provide the background color and shield the light. The internal structure and components of the product can be seen through the shell.
  • the thickness of the ink layer is 10 ⁇ m-20 ⁇ m. It can be understood that the thickness of the ink layer is not limited to the above-mentioned thickness, and the thickness of the ink layer can be set as required.
  • Step S14 The epoxy resin board is bent and formed.
  • the epoxy resin board with the decorative unit and the pattern layer is about to be bent and formed. After the epoxy resin board is bent and formed, the epoxy resin board has an inner concave surface and an outer convex surface opposite to the inner concave surface. Both the decoration unit and the pattern layer are located on the concave surface.
  • the method of bending and forming the epoxy resin board is high pressure forming.
  • High pressure molding refers to a process in which raw materials are processed and shaped under a pressure of more than 14 kg/cm, which is approximately 1.4 ⁇ 10 Pa.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 90°C-150°C, the temperature of the heating plate is 150°C-300°C, the inflation pressure is 10Bar-30Bar, and the molding time is 60sec-150sec. Among them, the temperature of the molding die and the temperature of the heating plate must be appropriate and matched with each other. If the temperature is too high, the surface of the epoxy resin board (especially the convex surface) is easy to fold and foam. If the temperature is too low, it will cause the epoxy resin The board cracks, especially the curved part of the convex surface.
  • the method of bending and forming the epoxy resin board is hot pressing, and the step of hot pressing includes: first placing the epoxy resin board in the lower mold, and the temperature of the heating plate is 250°C-380°C. Heat 15 seconds-30 seconds under the condition of °C, and the lower mold temperature is 90°C-140°C; then close the upper mold and the lower mold, and hold the pressure for 10 seconds-30 seconds, the upper mold temperature is 90°C-130°C .
  • the temperature of the heating plate, the temperature of the upper mold, and the temperature of the lower mold must be appropriate and matched. If the temperature is too high, the epoxy resin board is easy to fold and foam (especially the convex surface). If the temperature is too low, it will cause ringing. The oxy resin board cracked, especially the curved part of the convex surface.
  • Step S15 forming a hardened layer on the convex surface of the epoxy resin board to obtain a shell.
  • the step of forming a hardened layer on the convex surface of the epoxy resin board includes: spraying a hardening solution on the convex surface of the epoxy resin board, and then baking at 60°C-80°C 3 Minutes to 10 minutes, and then irradiated with ultraviolet light to cure to obtain a hardened layer.
  • the main component liquid hardening resin is added a silicone acrylate and perfluorinated polyether urethane acrylate, e.g. PPG's 304 model hardening liquid; curing energy 400mj / cm 2 -1200mj / cm 2 .
  • the hardening liquid is not limited to the above-mentioned substances, and may be a hardening liquid commonly used in the art.
  • the hardened layer prepared by the above hardening liquid has good wear resistance and good scratch resistance.
  • the thickness of the hardened layer is 3 ⁇ m-20 ⁇ m. It can be understood that the thickness of the hardened layer can be adjusted as required.
  • the hardness of the hardened layer is 3H-5H. If the hardness is too small, the wear resistance and scratch resistance will be poor; if the hardness is too large, the hardened layer will become more brittle and reduce production efficiency.
  • the hardness of the hardened layer can be adjusted by adjusting the thickness and curing energy of the hardened layer.
  • the manufacturing method of the housing is not limited to the above steps, the hardened layer can be omitted, then step S15 can be omitted; the decoration unit is not limited to the above structure, for example, the decoration unit does not have an ink layer, that is, the ink layer can be omitted; Alternatively, the decoration unit does not have a reflective layer.
  • the ink layer is directly printed on the side of the adhesive layer away from the epoxy resin board.
  • the pattern layer can be omitted.
  • step S12 can be omitted.
  • a decorative unit is formed on one side of the epoxy resin board, and a transparent adhesive layer is formed on one side of the epoxy resin board.
  • the unit can only be an ink layer, and the ink layer can be directly printed on one side of the epoxy resin board.
  • the decoration unit can also be omitted, and step S13 is omitted in this case.
  • the shell can also be obtained by bending and molding only an epoxy resin plate, and the manufacturing method of the shell does not have steps S12, S13 and S15; or, the shell does not have a pattern layer.
  • the epoxy resin board also has at least one of a hardened layer and a decorative layer, that is, the manufacturing method of the housing does not have steps S12 and S15, or the manufacturing method of the housing does not have steps S12 and S13.
  • the epoxy resin board Since the above-mentioned epoxy resin board is prepared from the above-mentioned modified epoxy resin, the epoxy resin board has good tensile performance (tensile strength above 60MPa) and can be directly bent and formed; and the epoxy resin board The hardness can reach HB-H, it has good wear resistance and good scratch resistance, and the softening temperature is 110°C-130°C. It has good high temperature resistance, and also has good aging resistance and Impact resistance.
  • the current method of using epoxy resin injection molding to prepare one-piece unequal-thickness shells is prone to stress lines (cracks) during cold and hot shrinkage, making the corners or wakes prone to rainbow phenomenon, and it is likely to occur Inside the shell, it cannot be trimmed again, which has a greater impact on the appearance; in addition, the samples after injection need to be polished to get a better appearance. Therefore, compared to the above-mentioned epoxy resin injection molding method , The manufacturing method of the above-mentioned casing is formed by bending the epoxy resin plate, the epoxy resin plate after bending and molding does not require any process, and can also avoid the rainbow phenomenon. Therefore, the manufacturing method of the above-mentioned casing can simplify the manufacturing process, improve the yield, and reduce The production cost of the shell.
  • the housing 100 of the first embodiment can be produced by the manufacturing method of the housing of the first embodiment described above.
  • the housing 100 can be used as a housing of an electronic device, such as a tablet computer, a mobile phone, etc. It is the back cover of a mobile phone or tablet.
  • the housing 100 of the first embodiment includes an epoxy resin layer 110, a pattern layer 120, a decoration unit 130 and a hardened layer 140.
  • the material of the epoxy resin layer 110 is the above modified epoxy resin, which will not be repeated here.
  • the epoxy resin layer 110 is obtained by bending the above-mentioned epoxy resin board.
  • the epoxy resin layer 110 has a first surface 112 and a second surface 114 opposite to the first surface 112.
  • the first surface 112 is an inner concave surface
  • the second surface 114 is an outer convex surface.
  • the housing 100 is a back cover of a mobile phone, and the thickness of the epoxy resin layer 110 is 0.4 mm-0.8 mm. It can be understood that the thickness of the epoxy resin layer 110 can be adjusted as required.
  • the pattern layer 120 is disposed on the first surface 112.
  • the pattern of the pattern layer 120 may be, for example, a logo, a symbol, an animal pattern, and the like.
  • the material of the pattern layer 120 is mirror silver; the pattern silver is prepared by screen printing mirror silver ink.
  • the thickness of the pattern layer 120 is 1 ⁇ m-4 ⁇ m. It can be understood that the thickness of the pattern layer 120 can be set as required.
  • the decoration unit 130 is disposed on the first surface 112 of the epoxy resin layer 110 and covers the pattern layer 120. Specifically, in the illustrated embodiment, the decoration unit 130 includes an adhesive layer 132, a reflective layer 134, and an ink layer 136 stacked in sequence.
  • the adhesive layer 132 is a transparent material.
  • the adhesive layer 132 is disposed on the first surface 112 of the epoxy resin layer 110, and the adhesive layer 132 covers the pattern layer 120.
  • the adhesive layer 132 is a UV transfer layer with a texture pattern, so that the outer shell 100 has a texture appearance.
  • the adhesive layer 132 is a urethane acrylate glue layer.
  • Betteli New Material Co., Ltd.'s model is 633-75 UV glue. It can be understood that the adhesive layer 132 is not limited to the above-mentioned glue layer, and may also be a transparent glue that is commonly used in the art after curing; the adhesive layer 132 may not have a texture pattern. In this case, the housing 100 does not have a texture appearance.
  • the thickness of the adhesive layer 132 is 5 ⁇ m-20 ⁇ m. It can be understood that the thickness of the adhesive layer 132 is not limited to the above-mentioned thickness, and the thickness of the adhesive layer 132 can be set as required.
  • the reflective layer 134 is laminated on the side of the adhesive layer 132 away from the epoxy resin layer 110. Specifically, the reflective layer 134 is a vacuum non-conductive electroplated layer.
  • the reflective layer 134 is selected from the group consisting of an indium tin oxide layer, a titanium dioxide layer, a niobium dioxide layer, a niobium trioxide layer, a niobium dioxide layer, a niobium pentoxide layer, a silicon dioxide layer, and a zirconium dioxide layer. At least one. That is, the reflective layer 134 may have a single-layer structure or a multilayer structure.
  • the total thickness of the reflective layer 134 is 5 nanometers to 300 nanometers, that is, when the reflective layer 134 is a single layer structure, the thickness of the reflective layer 134 is 5 nanometers to 300 nanometers, and the reflective layer 134 has a multilayer structure. At this time, the total thickness of the multilayer reflective layer 134 is 5 nm to 300 nm. It can be understood that the thickness of the reflective layer 134 is not limited to the above-mentioned thickness, and the thickness of the reflective layer 134 can be set as required.
  • the ink layer 136 is laminated on the side of the reflective layer 134 away from the adhesive layer 132. Specifically, the ink layer 136 includes a white ink layer, a white ink layer, or a gray ink layer. The ink layer 136 can not only protect the reflective layer 134, but also provide a background color and shield light, and the internal structure and components of the product can be seen through the housing 100.
  • the thickness of the ink layer 136 is 10 ⁇ m-20 ⁇ m. It can be understood that the thickness of the ink layer 136 is not limited to the above-mentioned thickness, and the thickness of the ink layer 136 can be set as required.
  • the hardening layer 140 is disposed on the second surface 114 of the epoxy resin layer 110.
  • the hardened layer 140 can increase the wear resistance and scratch resistance of the housing 100.
  • the hardening layer 140 is prepared from hardening liquid, and the main components of the hardening liquid are urethane acrylate, silicone resin and perfluoropolyether acrylate, such as PPG304 hardening liquid. It can be understood that the hardening liquid is not limited to the above-mentioned substances, and may be a hardening liquid commonly used in the art.
  • the hardened layer 140 prepared by the above hardening liquid has good wear resistance and good scratch resistance.
  • the hardness of the hardened layer 140 is 3H-5H. If the hardness is too small, the wear resistance and scratch resistance will be poor; if the hardness is too large, the hardened layer 140 will become more brittle and reduce production efficiency.
  • the thickness of the hardened layer 140 is 3 ⁇ m-20 ⁇ m. It can be understood that the thickness of the hardened layer 140 can be adjusted as required.
  • the structure of the housing 100 is not limited to a structure.
  • the hardened layer 140 may be omitted.
  • the second surface 114 of the epoxy resin layer 110 is the outer surface of the housing 100.
  • the pattern layer 120 may also be omitted, and the decoration unit 130 is directly laminated on the first surface 112 of the epoxy resin layer 110.
  • the decoration unit 130 is not limited to the above structure.
  • the adhesive layer 132 of the decoration unit 130 can be replaced with other coatings that can facilitate the adhesion of the reflective layer 134, such as spraying a semi-transparent color layer, inkjet printing to achieve a semi-transparent color; or
  • the decoration unit 130 does not have the ink layer 136, that is, the reflective layer 134 of the decoration unit 130 does not have the ink layer 136 on the side away from the adhesive layer 132; or, the decoration unit 130 does not have the adhesive layer 132 and the reflective layer 134 at the same time.
  • the layer 136 is directly disposed on the first surface 112 of the epoxy resin layer 110; or, the decoration unit 130 does not have the reflective layer 134, and the ink layer 136 is directly laminated on the side of the adhesive layer 132 away from the epoxy resin layer 110.
  • the decoration unit 130 can also be omitted.
  • a protective layer can be provided on the first surface 112 of the epoxy resin layer 110, and the protective layer covers the pattern layer 120 to protect the pattern layer 120.
  • the protective layer can be a UV glue layer.
  • the decoration unit 130, the pattern layer 120, and the hardened layer 140 may also be omitted at the same time.
  • the housing 100 may only have the epoxy resin layer 110.
  • the aforementioned housing 100 has at least the following advantages:
  • the housing 100 includes the epoxy resin layer 110 of the above material, the epoxy resin layer 110 has better wear resistance and better scratch resistance, and also has better high temperature resistance, aging resistance and resistance The impact performance makes the aforementioned housing 100 not only have better performance, but also help reduce its cost.
  • the second embodiment of the manufacturing method of the housing, the housing manufactured by this method can be used as the housing of an electronic device, for example, a housing of a tablet computer, a mobile phone, etc., especially a back cover of a mobile phone or a tablet computer.
  • the manufacturing method of the housing of this embodiment includes the following steps S21-S26:
  • Step S21 preparing an epoxy resin board.
  • step S11 The steps of preparing the epoxy resin board in this embodiment are the same as step S11, and will not be repeated here.
  • Step S22 forming a pattern layer on one side of the epoxy resin board.
  • the method for forming a patterned layer in this embodiment is the same as that for forming a patterned layer in step S12 of the first embodiment, and will not be repeated here.
  • Step S23 forming a protective layer on the side of the epoxy resin board where the pattern layer is formed, and the protective layer covers the pattern layer.
  • the protective layer is a UV glue layer.
  • the protective layer is a polyurethane acrylate glue layer.
  • Betteli New Material Co., Ltd.'s model is 633-75 UV glue. It can be understood that the protective layer is not limited to the above-mentioned glue layer.
  • the thickness of the protective layer is 8-20 microns. It can be understood that the thickness of the protective layer is not limited to the above-mentioned thickness, and the thickness of the protective layer can be set as required.
  • Step S24 setting a decoration unit on the side of the protective layer away from the epoxy resin board.
  • the step of arranging a decorative unit on the side of the protective layer away from the epoxy resin board includes: forming a transparent adhesive layer on the base film, forming a reflective layer on the adhesive layer, and forming an ink layer on the reflective layer to obtain Decoration unit; bonding the side of the base film of the decoration unit away from the adhesive layer with the side of the protective layer away from the epoxy resin board.
  • the base film is a polycarbonate (PC) film or a TPU film. It can be understood that the base film is not limited to the above base film, and the base film may be a transparent base film commonly used in the art. Specifically, the thickness of the base film is 50 micrometers to 125 micrometers. It can be understood that the thickness of the base film is not limited to the above-mentioned thickness, and the thickness of the base film can be set as required.
  • the manufacturing method of the bonding layer is similar to the manufacturing method of the bonding layer of the first embodiment, except that the bonding layer of this embodiment is manufactured on the base film, which will not be repeated here.
  • the manufacturing method of the reflective layer is the same as the manufacturing method of the reflective layer of the first embodiment, and will not be repeated here.
  • the manufacturing method of the ink layer is the same as the manufacturing method of the ink layer of the first embodiment, and will not be repeated here.
  • the step of bonding the side of the base film of the decoration unit away from the adhesive layer and the side of the protective layer away from the epoxy resin board includes: using a UV adhesive to move the base film away from the side of the adhesive layer to the protective layer.
  • the side of the layer away from the epoxy board is bonded.
  • the UV adhesive is Bethel 805-16 glue.
  • Step S25 bending the epoxy resin board into shape.
  • the epoxy resin board with the protective layer, pattern layer and decoration unit will be bent and formed. Specifically, the method of bending the epoxy resin board in this embodiment is the same as that in the first embodiment, and will not be repeated here.
  • Step S26 forming a hardened layer on the convex surface of the epoxy resin board to obtain a shell.
  • the step of forming the hardened layer of this embodiment is the same as the step of forming the hardened layer of the first embodiment, and will not be repeated here.
  • the manufacturing method of the casing of this embodiment is not limited to the above steps.
  • This embodiment is also similar to the manufacturing method of the casing of the first embodiment, and the production of the hardened layer in step S26 can be omitted; step S22 and steps S23 can be omitted, that is, the pattern layer and the protective layer are not made, and the decoration unit is directly adhered to the epoxy resin board through the UV adhesive; or, step S23 is omitted, that is, the protective layer is not made, and the decoration unit is directly adhered through the UV adhesive. Adhere to the epoxy resin board and cover the pattern layer.
  • the decoration unit can also be made as required, for example, the ink layer is omitted, and so on.
  • the manufacturing method of the housing of this embodiment is similar to the manufacturing method of the housing of the first embodiment, it also has the effect similar to the manufacturing method of the housing of the first embodiment, which will not be repeated here.
  • the housing 200 of the second embodiment can be produced by the manufacturing method of the housing of the second embodiment described above.
  • the housing 200 can be used as a housing of an electronic device, such as a tablet computer, a mobile phone, etc. It is the back cover of a mobile phone or tablet.
  • the structure of the housing 200 of this embodiment is similar to the structure of the housing 100 of the first embodiment, with the following differences:
  • the housing 200 further includes a protective layer 250 disposed on the first surface 212 of the epoxy resin layer 210 and covering the pattern layer 220.
  • the first surface 212 is a concave surface.
  • the protective layer 250 is a UV glue layer.
  • the protective layer 250 is a urethane acrylate glue layer.
  • Betteli New Material Co., Ltd.'s model is 633-75 UV glue. It can be understood that the protective layer 250 is not limited to the aforementioned glue layer.
  • the decoration unit 230 further includes a base film 238, which is disposed on the first surface 212
  • the housing 200 further includes an adhesive layer 260, which is disposed between the base film 238 and the first surface 212, and the adhesive layer 260 fixes and bonds the base film 238 and the first surface 212.
  • the side of the adhesive layer 232 away from the reflective layer 234 and the side of the base film 238 away from the first surface 212 are laminated, that is, the adhesive layer 232, the reflective layer 234, and the ink layer 236 are sequentially formed on the base film 238.
  • the base film 238 is a polycarbonate (PC) film or a TPU film. It can be understood that the base film 238 is not limited to the above-mentioned base film 238, and the base film 238 may be a transparent base film commonly used in the art.
  • PC polycarbonate
  • TPU TPU
  • the material of the adhesive layer 260 is a UV adhesive
  • the UV adhesive is a UV glue with a model of 805-16 from Bethel New Material Co., Ltd.
  • the housing 200 of the second embodiment Since the structure of the housing 200 of the second embodiment is similar to the structure of the housing 100 of the first embodiment, the housing 200 of the second embodiment also has similar effects to the housing 100 of the first embodiment, which will not be repeated here.
  • the manufacturing method of the housing of the third embodiment can be used as the housing of an electronic device, for example, a housing of a tablet computer, a mobile phone, etc., especially a back cover of a mobile phone or a tablet computer.
  • the manufacturing method of the housing of this embodiment includes the following steps S31-S35:
  • Step S31 preparing an epoxy resin board.
  • step S11 The steps of preparing the epoxy resin board in this embodiment are the same as step S11, and will not be repeated here.
  • Step S32 forming a pattern layer on one side of the epoxy resin board.
  • the method of forming a patterned layer in this embodiment is similar to that of forming a patterned layer in step S12 of the first embodiment, and will not be repeated here.
  • Step S33 The epoxy resin board is bent and formed.
  • the epoxy resin board with the patterned layer is about to be bent and molded. Specifically, the method of bending the epoxy resin board in this embodiment is the same as that in the first embodiment, and will not be repeated here.
  • Step S34 setting a decoration unit on the concave surface of the epoxy resin.
  • the step of providing a decorative layer on the concave surface of the epoxy resin is after the step of bending the epoxy resin board.
  • the step of arranging a decorative unit on the concave surface of the epoxy resin includes: forming a transparent adhesive layer on the base film, forming a reflective layer on the adhesive layer, and forming an ink layer on the reflective layer to obtain the decorative unit ; Bond the side of the base film of the decoration unit away from the adhesive layer with the concave surface of the epoxy resin board.
  • the step of forming the decoration unit can be before or at the same time as step S33, that is, the decoration unit can be made in step S33 or at the same time as step S33, and then the base film of the decoration unit can be connected to the epoxy resin board on the side away from the adhesive layer.
  • the concave surface is bonded.
  • the base film is a polycarbonate film or a TPU film. It can be understood that the base film is not limited to the above base film, and the base film may be a transparent base film commonly used in the art.
  • the manufacturing method of the bonding layer is similar to the manufacturing method of the bonding layer of the first embodiment, except that the bonding layer of this embodiment is manufactured on the base film, which will not be repeated here.
  • the manufacturing method of the reflective layer is the same as the manufacturing method of the reflective layer of the first embodiment, and will not be repeated here.
  • the manufacturing method of the ink layer is the same as the manufacturing method of the ink layer of the first embodiment, and will not be repeated here.
  • the step of bonding the side of the base film of the decoration unit away from the adhesive layer to the concave surface of the epoxy resin board includes: using an adhesive to connect the side of the base film away from the adhesive layer to the epoxy resin board.
  • the concave surface is bonded.
  • the adhesive is a thermosetting adhesive or a UV adhesive.
  • the thermosetting adhesive is OCA glue, such as OCA glue from Aojia Optoelectronics; the UV adhesive is UV glue with the model of 805-16 from Bethel New Material Co., Ltd.
  • Step S35 forming a hardened layer on the convex surface of the epoxy resin board to obtain a shell.
  • the step of forming the hardened layer of this embodiment is the same as the step of forming the hardened layer of the first embodiment, and will not be repeated here.
  • the manufacturing method of the casing of this embodiment is not limited to the above steps. In this embodiment, it is also similar to the manufacturing method of the casing of the first embodiment.
  • the production of the hardened layer in step S35 can be omitted; step S32 It can be omitted.
  • step S32 It can be omitted.
  • no pattern layer is made, and the side of the base film of the decoration unit away from the adhesive layer is bonded to the concave surface of the epoxy resin board, that is, the decoration unit is directly adhered to the ring through the UV adhesive.
  • the decoration unit can also be made as required, for example, the ink layer is omitted, and so on.
  • the manufacturing method of the housing of this embodiment is similar to the manufacturing method of the housing of the first embodiment, it also has the effect similar to the manufacturing method of the housing of the first embodiment, which will not be repeated here. Since the bending step of the manufacturing method of the housing of the third embodiment is before the decoration unit is set, the glue of the manufacturing method of the housing of this embodiment to set the decoration unit to the epoxy resin board can not only use UV adhesive, but also Use thermosetting adhesive.
  • the housing 300 of the third embodiment can be manufactured by the manufacturing method of the housing of the third embodiment described above.
  • the housing 300 can be used as a housing of an electronic device, such as a tablet computer, a mobile phone, etc. It is the back cover of a mobile phone or tablet.
  • the structure of the housing 300 of this embodiment is similar to the structure of the housing 100 of the first embodiment, with the following differences:
  • the decoration unit 330 further includes a base film 338, which is disposed on the concave surface 312 of the epoxy resin layer 310, and the housing 300 further includes an adhesive layer 350, which is disposed between the base film 338 and the concave surface 312.
  • the adhesive layer 350 fixes and bonds the base film 338 and the concave surface 312, and the side of the adhesive layer 332 away from the reflective layer is laminated with the concave surface 312 of the epoxy resin layer 310, that is, the adhesive layer 332, the reflective layer 334 and the ink layer 336 are sequentially formed on the base film 338.
  • the base film 338 is a PC film or a TPU film. It can be understood that the base film 338 is not limited to the aforementioned base film, and the base film 338 may be a transparent base film commonly used in the art.
  • the material of the adhesive layer 360 is UV adhesive or thermosetting adhesive.
  • the UV adhesive is, for example, a UV model of 805-16 from Bethel New Material Co., Ltd.
  • the thermosetting adhesive is OCA glue, such as OCA glue of Aojia Optoelectronics.
  • the housing 300 of the third embodiment Since the structure of the housing 300 of the third embodiment is similar to the structure of the housing 100 of the first embodiment, the housing 300 of the third embodiment also has similar effects to the housing 100 of the first embodiment, which will not be repeated here.
  • An electronic device of an embodiment for example, a tablet computer, a mobile phone, etc., includes a casing, wherein the outer casing is the casing produced by the method of manufacturing the casing of the first embodiment, the casing of the first embodiment, and the casing of the second embodiment The shell produced by the manufacturing method, the shell of the second embodiment, the shell of the third embodiment, or the shell of the third embodiment.
  • the electronic device is a mobile phone or a tablet computer
  • the housing is a back cover.
  • the above-mentioned electronic device adopts the housing produced by the housing manufacturing method of the first embodiment, the housing of the first embodiment, the housing produced by the housing of the second embodiment, the housing of the second embodiment, and the third embodiment
  • the housing produced by the method of manufacturing the housing or the housing of the third embodiment is beneficial to increase the service life of the electronic device and reduce the production cost of the electronic device.
  • housing is not limited to the housing of the electronic device, and may also be the housing of other products.
  • the preparation methods of modified epoxy resin as an example to illustrate the preparation of modified epoxy resin, but the preparation method of modified epoxy resin of the present invention does not It is not limited to the following steps and the following materials, that is, the technical solution of the present invention is not limited to the following examples.
  • the catalyst adopts dibutyltin dilaurate
  • the curing agent adopts dicyandiamide
  • the polyurethane prepolymer adopts the United States.
  • Dow's MDI polyurethane prepolymer with the model number N434 is an example and does not limit the scope of the present invention):
  • modified epoxy resin According to Table 1, according to the mass ratio of modified product and epoxy resin as A:B, the modified product, epoxy resin and catalyst were stirred and mixed for t 1 hour at room temperature, then Add the curing agent and stir uniformly, and then react at T 1 °C for t 2 hours to obtain a modified epoxy resin.
  • the mass ratio of the catalyst to the epoxy resin is C:B
  • the mass ratio of the curing agent to the epoxy resin is D:B
  • the catalyst is dibutyltin dilaurate
  • the curing agent is dicyandiamide.
  • E-51, E-55 and E-44 represent E-51 epoxy resin, E-55 epoxy resin and E-44 epoxy resin respectively, and this The ":" in the column indicates the mass ratio.
  • E-51:E-44 means that the epoxy resin of this example is composed of E-51 epoxy resin and E-44 epoxy resin, and E-51:E The ratio indicated by -44 is mass ratio.
  • Example 1 0.33 122 168 0.6
  • Example 2 0.32 115 165 0.4
  • Example 3 0.34 124 170 0.8
  • Example 4 0.33 120 155 0.5
  • Example 5 0.32 121 148 0.7
  • Example 6 0.36 126 142 0.6
  • Example 7 0.33 123 170 0.4
  • Example 8 0.31 109 150 0.8 Example 9 0.37 127 180 0.6
  • Example 10 0.34 124 177 0.5
  • Example 11 0.32 116 155 0.7
  • Example 12 0.33 120 160 0.4
  • Example 13 0.36 125 158 0.6
  • Example 14 0.45 130 190 0.8
  • Example 15 0.25 100 140 0.7
  • Example 16 0.42 128 174 0.6
  • Example 17 0.45 129 188 0.4
  • Example 18 0.36 125 172 0.5
  • Example 19 0.38 128 181 0.7
  • Example 20 0.43 120 155 0.6
  • Example 21 0.35 124 178 0.6 Comparative example 1 0.24 100 140 0.6 Comparative example 2 0.46 130 190 0.6 Comparative example 3 0.33 122 168 0.6 Comparative example 4 0.33 122 168 0.6 Comparative example 5 0.35 125 180 0.6
  • Comparative Example 5 is a conventional 3240 epoxy resin board with a thickness of 0.6 mm and an epoxy value of 0.35.
  • Comparative Example 6 is a conventional composite substrate of polycarbonate (PC) and polymethyl methacrylate (PMMA), with a total thickness of 0.6 mm.
  • Comparative Example 7 is a conventional pure polycarbonate (PC) board with a thickness of 0.6 mm.
  • Comparative Example 8 is a conventional polyethylene terephthalate (PET) board with a thickness of 0.6 mm.
  • Hot press bending test the epoxy resin board of Example 1-21 and Comparative Example 1-4, the 3240 epoxy resin board of Comparative Example 5, the composite substrate of Comparative Example 6 and the pure polycarbonate of Comparative Example 7
  • the ester board and the polyethylene terephthalate board of Comparative Example 8 are used as the template to be bent by hot pressing.
  • the specific steps are: first place the template in the lower mold and set the heating plate temperature to 300°C.
  • the optical transmittance of the epoxy resin board of Example 1-21 is 83%-88%, which has a relatively high optical transmittance, and the epoxy resin board of Example 1-21
  • the tensile strength is at least 60MPa, the tensile strength is better, the hardness is HB-H, and the hardness is greater, so that it has better wear resistance, better scratch resistance, and
  • the above epoxy resin board does not turn yellow under ultraviolet light for 48H, and has good aging resistance. Its performance is equivalent to that of the composite substrate of Comparative Example 6. It can be used as a shell, thereby providing a new material for the manufacture of the shell. .
  • the epoxy resin board of Examples 1-21 can be bent into a predetermined shape after hot press bending and high pressure bending molding without cracks. It can be directly formed by bending, which simplifies the production process, improves the yield, and reduces The production cost of the shell.
  • the epoxy resin board of Comparative Example 1 not only has low tensile strength, but also has low hardness. It turns yellow slightly after 48H of ultraviolet radiation and cannot be bent into a predetermined shape; the epoxy resin of Comparative Example 2 and Comparative Example 3 Although the resin board has greater hardness, its tensile strength is low, and there will be cracks after the bending test, so it cannot be directly bent into shape; although the epoxy resin board of Comparative Example 4 has greater tensile strength, But the hardness is too low; although the epoxy resin board of Comparative Example 5 has greater hardness and better tensile strength, it is severely yellowed after 48 hours of ultraviolet radiation, and there are cracks on the surface after bending and forming, and it cannot be bent directly.
  • the hardness of the pure polycarbonate plate of Comparative Example 7 is too low, and the wear resistance and scratch resistance are too poor; the tensile strength of the polyethylene terephthalate plate of Comparative Example 8 is too large, and the curvature after bending Smaller, it cannot be bent into a predetermined shape, and it is more difficult to make a shell with a predetermined arc.
  • the epoxy resin board produced in Example 1 was subjected to high-pressure molding to bend the epoxy resin board, and then CNC processing was performed to mill off the excess leftover material to obtain a shell.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 120°C, the temperature of the heating plate is 200°C, the inflation pressure is 20 Bar, and the molding time is 100 seconds.
  • the epoxy resin board produced in Example 4 was subjected to high-pressure molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess scrap to obtain the shell.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 90°C, the temperature of the heating plate is 300°C, the inflation pressure is 10 Bar, and the molding time is 60 seconds.
  • the epoxy resin board produced in Example 7 was subjected to high-pressure molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess leftover material to obtain the shell.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 150°C, the temperature of the heating plate is 150°C, the inflation pressure is 30 Bar, and the molding time is 150 seconds.
  • the epoxy resin board produced in Example 2 was subjected to thermocompression molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess leftover material to obtain the shell.
  • the step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat it for 25 seconds under the condition that the temperature of the heating plate is 320°C, and the temperature of the lower mold is 120°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 20 seconds, the upper mold temperature is 110 °C.
  • the epoxy resin board produced in Example 5 was subjected to thermo-compression molding to bend the epoxy resin board, and then CNC processing was performed to mill off excess leftover material to obtain a shell.
  • the step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat for 30 seconds under the condition that the temperature of the heating plate is 250°C, and the temperature of the lower mold is 140°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 30 seconds, the upper mold temperature is 130 °C.
  • the epoxy resin board produced in Example 8 was subjected to thermocompression molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess leftover material to obtain the shell.
  • the step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat it for 15 seconds under the condition of the temperature of the heating plate is 380°C, and the temperature of the lower mold is 90°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 10 seconds, the upper mold temperature is 90 °C.
  • UV glue Bity New Material Co., Ltd., Model 633-75
  • the layer covers the pattern layer; on the side of the adhesive layer away from the epoxy resin board, vacuum non-conductive electroplating forms a reflective layer with a thickness of 15 nanometers, the reflective layer is an indium tin oxide layer; on the side of the indium tin oxide layer away from the adhesive layer Print black ink to form an ink layer with a thickness of 15 microns to form a decorative unit.
  • step (3) The epoxy resin board with the decoration unit formed in step (2) is subjected to high pressure molding to bend the epoxy resin board.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 140°C, the temperature of the heating plate is 250°C, the inflation pressure is 15 Bar, and the molding time is 120 seconds.
  • UV glue Bity New Material Co., Ltd., model 633-75
  • the layer covers the pattern layer; on the side of the adhesive layer away from the epoxy resin board, vacuum non-conductive electroplating forms a reflective layer with a thickness of 50 nanometers, the reflective layer is a niobium dioxide layer; on the side of the niobium dioxide layer away from the adhesive layer Print black ink to form an ink layer with a thickness of 20 microns to form a decorative unit.
  • step (3) The epoxy resin board with the decoration unit formed in step (2) is subjected to high pressure molding to bend the epoxy resin board.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 100°C, the temperature of the heating plate is 280°C, the inflation pressure is 200 Bar, and the molding time is 80 seconds.
  • step (3) The epoxy resin board with the decoration unit formed in step (2) is subjected to high pressure molding to bend the epoxy resin board.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 90°C, the temperature of the heating plate is 200°C, the inflation pressure is 30Bar, and the molding time is 150 seconds.
  • the difference is that the preparation process of the reflective layer is different: vacuum non-conductive electroplating is formed on the side of the adhesive layer away from the epoxy resin board to form niobium pentoxide with a thickness of 50 nm Layer, and then a silicon dioxide layer with a thickness of 50 nm is formed on the niobium pentoxide layer. The ink layer is formed on the side of the silicon dioxide layer away from the niobium pentoxide layer.
  • step (3) The epoxy resin board with the decorative unit formed in step (2) is subjected to thermo-compression molding to bend the epoxy resin board.
  • step of hot press molding is: first place the epoxy resin board in the lower mold, heat it for 18 seconds under the condition that the temperature of the heating plate is 300°C, and the temperature of the lower mold is 100°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 30 seconds, the upper mold temperature is 130 °C.
  • step (1) of Example 29 is similar to step (1) of Example 29, except that the epoxy resin board used is the epoxy resin board prepared in Example 13.
  • the difference is that the preparation process of the reflective layer is different: vacuum non-conductive electroplating is formed on the side of the adhesive layer away from the epoxy resin board to form a thickness of 40 nanometers of niobium pentoxide Layer, then vacuum non-conductive electroplating on the niobium pentoxide layer to form a silicon dioxide layer with a thickness of 60 nanometers, and then vacuum non-conductive electroplating on the side of the silicon dioxide layer away from the niobium pentoxide layer to form a thickness of 70 nanometers Zirconium dioxide layer.
  • the ink layer is formed on the side of the zirconium dioxide layer away from the silicon dioxide layer.
  • step (3) The epoxy resin board with the decorative unit formed in step (2) is subjected to thermo-compression molding to bend the epoxy resin board.
  • step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat it for 20 seconds under the condition that the temperature of the heating plate is 350°C, and the lower mold temperature is 110°C, remove the heating plate , Then the upper film and the lower mold are closed, and the pressure is kept for 20 seconds, and the upper mold temperature is 110°C.
  • UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the base film to form an adhesive layer with texture and thickness of 8 microns.
  • the adhesive layer is far from the epoxy resin board.
  • the side vacuum non-conductive electroplating forms a reflective layer with a thickness of 80 nanometers, and the reflective layer is a niobium dioxide layer; black ink is printed on the side of the niobium dioxide layer away from the bonding layer to form an ink layer with a thickness of 18 microns.
  • To form a decorative unit use the UV adhesive on the side of the base film of the decorative unit away from the adhesive layer and the side of the protective layer away from the epoxy resin board (Better New Material Co., Ltd. model is 805-16 UV Glue) bonding.
  • the base film is a polycarbonate film with a thickness of 50 microns.
  • the epoxy resin board provided with the decoration unit in step (3) is subjected to high pressure molding to bend the epoxy resin board.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 150°C, the temperature of the heating plate is 250°C, the inflation pressure is 20 Bar, and the molding time is 120 seconds.
  • UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the base film to form an adhesive layer with a texture and a thickness of 12 microns.
  • the adhesive layer is far from the epoxy resin board.
  • Side vacuum non-conductive electroplating forms a reflective layer with a thickness of 200 nanometers, and the reflective layer is a niobium dioxide layer; black ink is printed on the side of the indium tin oxide layer away from the adhesive layer to form an ink layer with a thickness of 12 microns to form Decoration unit; use UV adhesive on the side of the base film of the decoration unit away from the adhesive layer and the side of the protective layer away from the epoxy resin board (Better New Material Co., Ltd.'s model is 805-16 UV glue) Bonding.
  • the base film is a polycarbonate film with a thickness of 100 microns.
  • the epoxy resin board provided with the decoration unit in step (3) is subjected to high pressure molding to bend the epoxy resin board.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 90°C, the temperature of the heating plate is 300°C, the inflation pressure is 15 Bar, and the molding time is 60 seconds.
  • step (1) of Example 33 the difference is that the epoxy resin board is the epoxy resin board prepared in Example 4.
  • step (3) It is similar to step (3) of Embodiment 33, except that the light reflecting layer is a zirconium dioxide layer with a thickness of 20 nanometers.
  • step (3) The epoxy resin board provided with the decoration unit in step (3) is subjected to thermocompression molding to bend the epoxy resin board.
  • step of hot press molding is: first put the epoxy resin board in the lower mold, heat it for 28 seconds under the condition of the temperature of the heating plate is 280°C, and the temperature of the lower mold is 90°C, remove the heating plate , Then the upper film and the lower mold are closed, and the pressure is maintained for 30 seconds, and the upper mold temperature is 90°C.
  • step (1) of Example 34 the difference is that the epoxy resin board is the epoxy resin board prepared in Example 18.
  • step (3) It is similar to step (3) of embodiment 34, except that the reflective layer is a niobium pentoxide layer with a thickness of 100 nm.
  • the epoxy resin board provided with the decoration unit in step (3) is subjected to thermocompression molding to bend the epoxy resin board.
  • the step of hot press molding is: first put the epoxy resin board in the lower mold, heat it for 20 seconds under the condition of the temperature of the heating plate at 370°C, and the temperature of the lower mould is 120°C, remove the heating plate, and then Clamp the upper film and the lower mold, and hold the pressure for 15 seconds.
  • the upper mold temperature is 120°C.
  • the epoxy resin board forming the pattern layer is subjected to high pressure molding to bend the epoxy resin board.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 100°C, the temperature of the heating plate is 180°C, the inflation pressure is 15 Bar, and the molding time is 120 seconds.
  • UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the base film to form an adhesive layer with a texture and a thickness of 16 microns.
  • the adhesive layer is far from the epoxy resin board.
  • Side vacuum non-conductive electroplating forms a reflective layer with a thickness of 120 nanometers, and the reflective layer is an indium tin oxide layer; black ink is printed on the side of the indium tin oxide layer away from the adhesive layer to form an ink layer with a thickness of 15 microns to form a decoration Unit;
  • the side of the base film of the decorative unit away from the adhesive layer and the concave surface of the epoxy resin board are bonded with OCA glue (OCA glue from Aojia Optoelectronics), and the decorative unit covers the pattern layer.
  • the base film is a TPU film with a thickness of 125 microns.
  • the epoxy resin board forming the pattern layer is subjected to high pressure molding to bend the epoxy resin board.
  • the process parameters of high-pressure molding include: the temperature of the molding die is 120°C, the temperature of the heating plate is 200°C, the inflation pressure is 10 Bar, and the molding time is 150 seconds.
  • the adhesive layer is far from the epoxy resin board.
  • the side vacuum non-conductive electroplating forms a reflective layer with a thickness of 30 nanometers, and the reflective layer is a silicon dioxide layer; black ink is printed on the side of the silicon dioxide layer away from the adhesive layer to form an ink layer with a thickness of 10 microns to form a decoration Unit;
  • the side of the base film of the decorative unit away from the adhesive layer and the concave surface of the epoxy resin board are bonded with OCA glue (OCA glue from Aojia Optoelectronics), and the decorative unit covers the pattern layer.
  • the base film is a TPU film with a thickness of 75 microns.
  • the epoxy resin board forming the pattern layer is thermocompressed to bend the epoxy resin board.
  • the steps of hot press molding are: first place the epoxy resin board in the lower mold, heat it for 15 seconds under the condition of the temperature of the heating plate at 280°C and the temperature of the lower mold at 140°C, remove the heating plate, and then Clamp the upper film and the lower mold, and hold the pressure for 130 seconds.
  • the temperature of the upper mold is 130°C.
  • step (1) of embodiment 38 the difference is that the epoxy resin board of this embodiment is the epoxy resin board prepared in embodiment 16.
  • the epoxy resin board forming the pattern layer is thermocompressed to bend the epoxy resin board.
  • the step of hot press molding is: first place the epoxy resin board in the lower mold, heat it for 30 seconds under the condition of the temperature of the heating plate at 300°C, and the temperature of the lower mold is 90°C, remove the heating plate, and then Clamp the upper film and the lower mold, and hold the pressure for 10 seconds.
  • the temperature of the upper mold is 90°C.
  • the manufacturing process of the casing of this embodiment is similar to that of Embodiment 23, except that the temperature of the heating plate is 310°C.
  • the manufacturing process of the housing of this embodiment is similar to that of Embodiment 24, except that the temperature of the molding die is 80°C.
  • the manufacturing process of the shell of this embodiment is similar to that of Embodiment 24, except that the temperature of the heating plate is 140°C.
  • the manufacturing process of the housing of this embodiment is similar to that of Embodiment 26, except that the temperature of the heating plate is 240°C.
  • the manufacturing process of the shell of this embodiment is similar to that of Embodiment 27, except that the temperature of the heating plate is 390°C.
  • the epoxy resin layer of the shell of Examples 22-40 has no cracks and is bent into a predetermined bending arc, while the surface of the epoxy resin layer of Example 41 and Example 45 is blistered.
  • the reason is that the heating temperature is too high.
  • the epoxy resin layer of Example 42 and Example 43 is not bent into a predetermined bending arc because the temperature of the molding die or heating plate is too low, resulting in insufficient molding temperature.
  • the epoxy resin of Example 44 The cracking of the layer occurs because the temperature of the heating plate is too low, which causes the epoxy resin layer to crack during the clamping and holding pressure process, resulting in cracks.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une coque, son procédé de fabrication, une résine époxy modifiée, une plaque de résine époxy et un dispositif électronique. La valeur époxy de la résine époxy modifiée est de 0,25 à 0,45, et la résine époxy modifiée est une résine époxy modifiée par un modificateur. Le modificateur est au moins un élément sélectionné parmi l'organosilicone, un prépolymère de polyuréthane et le polyimide. Le rapport de masse du modificateur sur la résine époxy est de 1/5 à 1/10.
PCT/CN2020/081315 2019-04-25 2020-03-26 Coque, son procédé de fabrication, résine époxy modifiée, plaque de résine époxy et dispositif électronique WO2020215975A1 (fr)

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CN201910337064.3 2019-04-25

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