WO2020215975A1

WO2020215975A1 - Shell, manufacturing method therefor, modified epoxy resin, epoxy resin board and electronic device

Info

Publication number: WO2020215975A1
Application number: PCT/CN2020/081315
Authority: WO
Inventors: 杨光明
Original assignee: Oppo广东移动通信有限公司
Priority date: 2019-04-25
Filing date: 2020-03-26
Publication date: 2020-10-29
Also published as: CN110003442B; CN110003442A

Abstract

A shell, a manufacturing method therefor, a modified epoxy resin, an epoxy resin board and an electronic device. The epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is an epoxy resin modified by a modifier. The modifier is at least one selected from organosilicone, a polyurethane prepolymer and polyimide. The mass ratio of the modifier to the epoxy resin is 1: 5-1: 10.

Description

Shell and manufacturing method thereof, modified epoxy resin, epoxy resin board and electronic equipment

Technical field

The invention relates to the technical field of electronic equipment, in particular to a housing and a manufacturing method thereof, a modified epoxy resin, an epoxy resin board and electronic equipment.

Background technique

At present, the shell materials of electronic devices (such as mobile phones) are usually made of composite sheets made of PC (polycarbonate) and PMMA (polymethyl methacrylate), pure PC sheets, etc. However, the tensile properties of composite sheets Inferior. If bending is used, it is easy to crack when stretched during the bending process. Although pure PC sheet has good tensile properties, it can solve the cracking problem in the forming and stretching process of composite sheet to a certain extent, but The low hardness of PC board leads to poor wear resistance and scratch resistance, which affects consumer experience.

Because PET (polyethylene terephthalate) sheet has good wear resistance and scratch resistance, some terminal companies are also trying to use PET sheet to make electronic equipment shells, but PET sheet is in the process of bending and forming. It is easy to warp, which limits its application on the back cover.

Summary of the invention

Based on this, it is necessary to provide a housing and a manufacturing method thereof, a modified epoxy resin, an epoxy resin board, and electronic equipment.

A modified epoxy resin, the modified epoxy resin has an epoxy value of 0.25-0.45, the modified epoxy resin is an epoxy resin modified by a modified product, and the modified product is selected from organic At least one of silicon, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5-1:10.

An epoxy resin board, the material of the epoxy resin board is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is a modified product. The modified product is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5 -1:10.

A shell comprising an epoxy resin layer, the material of the epoxy resin layer is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is modified epoxy resin. A modified epoxy resin, wherein the modified product is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5-1:10.

A manufacturing method of a shell includes the following steps:

Prepare an epoxy resin board, the material of the epoxy resin board is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is modified by the modified product The epoxy resin, the modified substance is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified substance to the epoxy resin is 1:5- 1:10; and

The epoxy resin board is bent and formed to obtain a shell.

An electronic device includes the above-mentioned casing or the casing produced by the above-mentioned casing manufacturing method.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, without creative work, the drawings of other embodiments can also be obtained based on these drawings.

Fig. 1 is a flowchart of a manufacturing method of a housing of the first embodiment;

2 is a schematic diagram of the structure of the housing of the first embodiment;

Figure 3 is a partial cross-sectional view of the housing shown in Figure 2;

FIG. 4 is a flowchart of the manufacturing method of the housing of the second embodiment;

Figure 5 is a partial cross-sectional view of the housing of the second embodiment;

Fig. 6 is a flow chart of the manufacturing method of the housing of the third embodiment;

Fig. 7 is a partial cross-sectional view of the housing of the third embodiment.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The drawings show preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

The modified epoxy resin of an embodiment can be used to make housings, such as housings of electronic devices, especially back covers of mobile phones, tablet computers, and the like. The epoxy value of the modified epoxy resin is 0.25-0.45, the modified epoxy resin is the epoxy resin modified by the modified product, and the modified product is selected from at least one of silicone, polyurethane prepolymer and polyimide One type, and the mass ratio of the modified product to the epoxy resin is 1:5-1:10.

The epoxy value referred to herein refers to the amount (ie, molar amount) of the epoxy group contained in 100g of the modified epoxy resin, and the epoxy value of the modified epoxy resin can be determined according to the epoxy value. Quality percentage. The relationship between epoxy value and epoxy equivalent is: epoxy value=100/epoxy equivalent, the molecular weight of epoxy group is 43, and the mass percentage of epoxy group of modified epoxy resin=43×100/epoxy equivalent. For example, if the epoxy equivalent of a certain bisphenol A epoxy resin is 180 g/equivalent, the mass percentage of the epoxy group of the resin is 43×100/180=23.88, and the epoxy value of the resin is 100/ 180=0.555.

Among them, the higher the epoxy value, the harder the epoxy resin, the better the abrasion resistance and scratch resistance, but the brittleness of the epoxy resin will be too large, which will cause the material to crack easily. Modification of epoxy resin can improve the tensile strength and impact resistance of epoxy resin and reduce the risk of material cracking during the manufacturing process while ensuring that the epoxy resin has a higher hardness.

The method for preparing the modified epoxy resin in one embodiment is a method for preparing the above-mentioned modified epoxy resin. The method for preparing the modified epoxy resin includes the following steps: according to the epoxy value of the modified epoxy resin 0.25-0.45, mix the above modified substance, epoxy resin and catalyst to obtain a mixture, wherein the mass ratio of the modified substance to epoxy resin is 1:5-1:10; add curing agent to the mixture, and then React at 80°C-120°C to obtain the above-mentioned modified epoxy resin.

The epoxy resin may be an epoxy resin commonly used in the art, such as bisphenol A epoxy resin. In one of the embodiments, the epoxy resin is selected from at least one of E-51 epoxy resin, E-55 epoxy resin and E-44 epoxy resin.

The organosilicon can be an organosilicon monomer commonly used in the field. In one embodiment, the silicone is selected from polydimethylsiloxane, dimethyldimethoxysiloxane, methylvinyldimethoxysiloxane and methylphenyldimethoxysiloxane At least one of siloxanes.

The polyurethane prepolymer can be a polyurethane prepolymer commonly used in the field for modifying epoxy resins, and the polyurethane prepolymer is obtained by reacting diisocyanate or polyisocyanate and polyol in a certain proportion. In one embodiment, the polyisocyanate is selected from IPDI (isophorone diisocyanate), TDI (toluene diisocyanate), MDI (diphenylmethane-4,4'-diisocyanate) and HDI (hexamethylene diisocyanate) One of them; the polyol is polyethylene glycol or polypropylene glycol; the mass ratio of polyisocyanate to polyol is 1:(0.5-1.5). Polyurethane prepolymers can also be purchased on the market, such as the polyurethane prepolymer model KHP-456 produced by Jining Huakai Resin, and the MDI polyurethane prepolymer model N434 of Dow USA.

The polyimide is selected from benzene type polyimide, fluorinated anhydride type polyimide, ketone anhydride type polyimide, NA group-terminated polyimide, ethynyl-terminated polyimide, polyphenylene At least one of bisimidazole polyimides.

The catalyst may be a catalyst commonly used in the field. In one of the embodiments, the catalyst is dibutyl tin dilaurate.

The curing agent may be a curing agent commonly used in the field. In one of the embodiments, the curing agent is dicyandiamide.

If it is necessary for the modified epoxy resin to have higher optical transmittance (optical transmittance above 85%), the modified product is selected from at least one of silicone and polyurethane prepolymer; or, the modified product is made of It is composed of polyimide and polyurethane prepolymer. In the modification, the mass percentage of the polyurethane prepolymer is more than 60%; or, the modification is made of silicone with a mass ratio of 1:(0.1-0.2) And polyimide composition.

In one of the embodiments, the step of preparing the modified epoxy resin includes: mixing the modified product, epoxy resin, and catalyst at room temperature for 1 hour to 4 hours, and then adding a curing agent at 80°C to 120°C React for 1 hour to 2 hours to obtain modified epoxy resin. Among them, the mass ratio of modified substance and epoxy resin is 1:5-1:10, the mass ratio of catalyst to epoxy resin is 1:100-5:100, and the mass ratio of curing agent to epoxy resin is 10: 100-30:100. Among them, the room temperature referred to herein is 10°C-40°C.

It can be understood that the method for preparing the above-mentioned modified epoxy resin is not limited to using the materials and steps in the above-mentioned steps, and the above-mentioned modified epoxy resin can also be prepared by using a traditional modified epoxy resin preparation process.

The controlled epoxy value of the modified epoxy resin is 0.25-0.45, and the mass ratio of the modified epoxy resin to the epoxy resin is 1:5-1:10, so that the modified epoxy resin The hardness can reach HB-H, and it has good wear resistance and good scratch resistance; the above modified epoxy resin also has good tensile properties, tensile strength above 60MPa, and can be directly bent and formed; And the softening temperature of the above modified epoxy resin is 100°C-130°C, which has good high temperature resistance.

Because the traditional epoxy resin board has poor high temperature resistance and easy aging, its application range is limited. The softening temperature of the above modified epoxy resin is 100℃-130℃, which has good high temperature resistance. At the same time, Modified epoxy resin can also not yellow under ultraviolet light for 48H, has good aging resistance, and also has impact resistance.

In the epoxy resin board of one embodiment, the material of the epoxy resin board is the above-mentioned modified epoxy resin. That is, the epoxy resin board is obtained by the above-mentioned modified epoxy resin molding process. The epoxy resin board can be used to make shells, such as the shells of electronic devices, especially the back covers of mobile phones or tablet computers.

In one of the embodiments, the thickness of the epoxy resin board is 0.4 mm-0.8 mm, and the epoxy resin board of this thickness is suitable for making a shell with a decorative layer (such as a pattern, a texture, etc.). It can be understood that the thickness of the epoxy resin board can be adjusted according to the required thickness and performance.

Furthermore, the optical transmittance of the epoxy resin board is 83%-88%, so as to make other decorative layers (such as patterns, textures, etc.) on the epoxy resin board subsequently to obtain exquisite products.

In one of the embodiments, the preparation step of the epoxy resin board includes: melting the modified epoxy resin at 140° C.-190° C. and then extruding to obtain the epoxy resin board.

Since the epoxy resin board is prepared from the modified epoxy resin, the epoxy resin board has a hardness of up to HB-H, and has good abrasion resistance and scratch resistance; and the epoxy resin board It also has good tensile properties, and can be directly bent and formed; and the softening temperature of the modified epoxy resin is 100°C-130°C, which has good high temperature resistance.

The traditional epoxy resin board has poor high temperature resistance and is easy to age, which limits its scope of use. The material of the epoxy resin board is the modified epoxy resin, and the softening temperature of the modified epoxy resin is 100°C. -130℃, has good high temperature resistance, does not turn yellow under ultraviolet radiation for 48H, and has good aging resistance, so that the above epoxy resin board can be used for making shells.

As shown in FIG. 1, according to the manufacturing method of the housing of the first embodiment, the housing manufactured by this method can be used as the housing of an electronic device, such as a housing of a tablet computer, a mobile phone, etc., especially a back cover of a mobile phone or a tablet computer. The manufacturing method of the housing of this embodiment includes the following steps S11-S15:

Step S11: preparing an epoxy resin board.

Among them, the material of the epoxy resin board is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, the modified epoxy resin is the epoxy resin modified by the modification, and the modification is selected from At least one of organosilicon, polyurethane prepolymer and polyimide, and the mass ratio of the modified product and the epoxy resin is 1:5-1:10. Specifically, the epoxy resin board is the above-mentioned epoxy resin board, and the preparation method is as described above, which will not be repeated here.

In one of the embodiments, the housing is the back cover of the mobile phone, and the thickness of the epoxy resin board is 0.4 mm-0.8 mm. It can be understood that the thickness of the epoxy resin board can be adjusted according to the required thickness and performance.

Furthermore, the optical transmittance of the epoxy resin board is 83%-88%.

Step S12: forming a pattern layer on one side of the epoxy resin board.

Among them, the pattern of the pattern layer may be, for example, a LOGO, a symbol, an animal pattern, and the like.

Specifically, the pattern layer is printed by mirror silver ink and dried. More specifically, the step of forming a pattern layer on one side of the epoxy resin board is: use 300-420 mesh screen printing mirror silver ink on one side of the epoxy resin board, and then statically at 15℃-30℃ Let it stand for 30 minutes-60 minutes, and then bake at 60℃-80℃ for 30 minutes-90 minutes. Among them, the mirror ink is, for example, the 06B mirror silver ink from Shenzhen Lianyiwang Ink Technology Co., Ltd.

If the mirror silver ink used is a corrosive ink, before the step of forming a pattern layer on one side of the epoxy resin board, a transparent corrosion-resistant layer is formed on one side of the epoxy resin board, and then the corrosion-resistant layer is formed Pattern layer. In one of the embodiments, the corrosion-resistant layer is UV glue, and the UV glue is urethane acrylate glue. This type of glue has good chemical resistance, good adhesion, and excellent weather resistance. Polyurethane acrylate glue such as Bethel New Material Co., Ltd.'s model is 633-75 UV glue.

In one of the embodiments, the thickness of the pattern layer is 1 μm-4 μm. It is understood that the thickness of the pattern layer can be set as required.

Step S13: setting a decoration unit on the epoxy resin board.

In this embodiment, a decoration unit is provided on the side of the epoxy resin board where the pattern layer is formed, and the pattern layer is covered.

In one of the embodiments, the decoration unit includes an adhesive layer, a reflective layer and an ink layer. The step of arranging a decorative unit on the epoxy resin board includes: forming a transparent adhesive layer on the side of the epoxy resin board where the pattern layer is formed, and the adhesive layer covers the pattern layer; A reflective layer is formed on one side; an ink layer is formed on the side of the reflective layer away from the adhesive layer.

Further, the adhesive layer is obtained by UV (ultraviolet light) glue transfer, and the adhesive layer has a texture pattern, so that the shell has a textured appearance. Among them, the UV glue can be a transparent UV glue that is commonly used in the field after curing. In one of the embodiments, the UV glue is urethane acrylate glue, for example, the UV glue of the model 633-75 from Bethel New Material Co., Ltd. The curing energy of UV glue is 600mj/cm ² -1500mj/cm ² . It can be understood that the UV glue is not limited to the above-mentioned glue, and may also be a glue that is commonly used in the field and becomes transparent after curing; the adhesive layer may not have a texture pattern, at this time, the shell does not have a texture appearance.

In one of the embodiments, the thickness of the adhesive layer is 5 μm-20 μm. It can be understood that the thickness of the adhesive layer is not limited to the above-mentioned thickness, and the thickness of the adhesive layer can be set as required.

The reflective layer is obtained by vacuum non-conductive electroplating (NCVM), so that the reflective layer can not only impart color to the shell, but also improve the gloss and reflectivity of the shell. The reflective layer formed on the adhesive layer can improve the reflective layer and adhesion.

Specifically, the reflective layer is selected from at least an indium tin oxide layer, a titanium dioxide layer, a niobium dioxide layer, a niobium trioxide layer, a niobium dioxide layer, a niobium pentoxide layer, a silicon dioxide layer, and a zirconium dioxide layer. One kind. That is, the reflective layer may have a single-layer structure or a multilayer structure.

In one of the embodiments, the total thickness of the reflective layer is 5 nanometers to 300 nanometers, that is, when the reflective layer is a single layer structure, the thickness of the reflective layer is 5 nanometers to 300 nanometers, and when the reflective layer is a multilayer structure, the multilayer The total thickness of the reflective layer is 5 nm to 300 nm. It can be understood that the thickness of the reflective layer is not limited to the above-mentioned thickness, and the thickness of the reflective layer can be set as required.

The ink layer is prepared by screen printing. Further, the ink layer is formed by multiple printings and multiple dryings, and multiple printings and multiple dryings are performed alternately. Each printing has a thickness of 5-8 microns. The ink layer can be made more flat and relatively smooth through multiple printings. Reliable, if the thickness of a single printing is too thick, appearance quality problems such as bubbles may occur during baking. Specifically, the ink layer includes a white ink layer, a white ink layer or a gray ink layer. The ink layer can not only protect the reflective layer, but also provide the background color and shield the light. The internal structure and components of the product can be seen through the shell.

In one of the embodiments, the thickness of the ink layer is 10 μm-20 μm. It can be understood that the thickness of the ink layer is not limited to the above-mentioned thickness, and the thickness of the ink layer can be set as required.

Step S14: The epoxy resin board is bent and formed.

The epoxy resin board with the decorative unit and the pattern layer is about to be bent and formed. After the epoxy resin board is bent and formed, the epoxy resin board has an inner concave surface and an outer convex surface opposite to the inner concave surface. Both the decoration unit and the pattern layer are located on the concave surface.

In one of the embodiments, the method of bending and forming the epoxy resin board is high pressure forming. High pressure molding refers to a process in which raw materials are processed and shaped under a pressure of more than 14 kg/cm, which is approximately 1.4×10 Pa. The process parameters of high-pressure molding include: the temperature of the molding die is 90℃-150℃, the temperature of the heating plate is 150℃-300℃, the inflation pressure is 10Bar-30Bar, and the molding time is 60sec-150sec. Among them, the temperature of the molding die and the temperature of the heating plate must be appropriate and matched with each other. If the temperature is too high, the surface of the epoxy resin board (especially the convex surface) is easy to fold and foam. If the temperature is too low, it will cause the epoxy resin The board cracks, especially the curved part of the convex surface.

In another embodiment, the method of bending and forming the epoxy resin board is hot pressing, and the step of hot pressing includes: first placing the epoxy resin board in the lower mold, and the temperature of the heating plate is 250°C-380°C. Heat 15 seconds-30 seconds under the condition of ℃, and the lower mold temperature is 90℃-140℃; then close the upper mold and the lower mold, and hold the pressure for 10 seconds-30 seconds, the upper mold temperature is 90℃-130℃ . Among them, the temperature of the heating plate, the temperature of the upper mold, and the temperature of the lower mold must be appropriate and matched. If the temperature is too high, the epoxy resin board is easy to fold and foam (especially the convex surface). If the temperature is too low, it will cause ringing. The oxy resin board cracked, especially the curved part of the convex surface.

Step S15: forming a hardened layer on the convex surface of the epoxy resin board to obtain a shell.

In one of the embodiments, the step of forming a hardened layer on the convex surface of the epoxy resin board includes: spraying a hardening solution on the convex surface of the epoxy resin board, and then baking at 60°C-80°C 3 Minutes to 10 minutes, and then irradiated with ultraviolet light to cure to obtain a hardened layer.

In one embodiment, the main component liquid hardening resin is added a silicone acrylate and perfluorinated polyether urethane acrylate, e.g. PPG's 304 model hardening liquid; curing energy ^{^{400mj / cm 2 -1200mj / cm 2}} . It can be understood that the hardening liquid is not limited to the above-mentioned substances, and may be a hardening liquid commonly used in the art. The hardened layer prepared by the above hardening liquid has good wear resistance and good scratch resistance.

In one of the embodiments, the thickness of the hardened layer is 3 μm-20 μm. It can be understood that the thickness of the hardened layer can be adjusted as required.

Specifically, the hardness of the hardened layer is 3H-5H. If the hardness is too small, the wear resistance and scratch resistance will be poor; if the hardness is too large, the hardened layer will become more brittle and reduce production efficiency. The hardness of the hardened layer can be adjusted by adjusting the thickness and curing energy of the hardened layer.

It should be noted that the manufacturing method of the housing is not limited to the above steps, the hardened layer can be omitted, then step S15 can be omitted; the decoration unit is not limited to the above structure, for example, the decoration unit does not have an ink layer, that is, the ink layer can be omitted; Alternatively, the decoration unit does not have a reflective layer. In this case, the ink layer is directly printed on the side of the adhesive layer away from the epoxy resin board. Alternatively, the pattern layer can be omitted. In this case, step S12 can be omitted. In this case, a decorative unit is formed on one side of the epoxy resin board, and a transparent adhesive layer is formed on one side of the epoxy resin board. The unit can only be an ink layer, and the ink layer can be directly printed on one side of the epoxy resin board. Alternatively, the decoration unit can also be omitted, and step S13 is omitted in this case. Or, in other embodiments, the shell can also be obtained by bending and molding only an epoxy resin plate, and the manufacturing method of the shell does not have steps S12, S13 and S15; or, the shell does not have a pattern layer. The epoxy resin board also has at least one of a hardened layer and a decorative layer, that is, the manufacturing method of the housing does not have steps S12 and S15, or the manufacturing method of the housing does not have steps S12 and S13.

The manufacturing method of the above shell has at least the following advantages:

Since the above-mentioned epoxy resin board is prepared from the above-mentioned modified epoxy resin, the epoxy resin board has good tensile performance (tensile strength above 60MPa) and can be directly bent and formed; and the epoxy resin board The hardness can reach HB-H, it has good wear resistance and good scratch resistance, and the softening temperature is 110℃-130℃. It has good high temperature resistance, and also has good aging resistance and Impact resistance.

Although, the current method of using epoxy resin injection molding to prepare one-piece unequal-thickness shells is prone to stress lines (cracks) during cold and hot shrinkage, making the corners or wakes prone to rainbow phenomenon, and it is likely to occur Inside the shell, it cannot be trimmed again, which has a greater impact on the appearance; in addition, the samples after injection need to be polished to get a better appearance. Therefore, compared to the above-mentioned epoxy resin injection molding method , The manufacturing method of the above-mentioned casing is formed by bending the epoxy resin plate, the epoxy resin plate after bending and molding does not require any process, and can also avoid the rainbow phenomenon. Therefore, the manufacturing method of the above-mentioned casing can simplify the manufacturing process, improve the yield, and reduce The production cost of the shell.

As shown in FIG. 2, the housing 100 of the first embodiment can be produced by the manufacturing method of the housing of the first embodiment described above. The housing 100 can be used as a housing of an electronic device, such as a tablet computer, a mobile phone, etc. It is the back cover of a mobile phone or tablet. As shown in FIG. 3, the housing 100 of the first embodiment includes an epoxy resin layer 110, a pattern layer 120, a decoration unit 130 and a hardened layer 140.

The material of the epoxy resin layer 110 is the above modified epoxy resin, which will not be repeated here. Wherein, the epoxy resin layer 110 is obtained by bending the above-mentioned epoxy resin board. The epoxy resin layer 110 has a first surface 112 and a second surface 114 opposite to the first surface 112. Among them, the first surface 112 is an inner concave surface, and the second surface 114 is an outer convex surface.

In one of the embodiments, the housing 100 is a back cover of a mobile phone, and the thickness of the epoxy resin layer 110 is 0.4 mm-0.8 mm. It can be understood that the thickness of the epoxy resin layer 110 can be adjusted as required.

The pattern layer 120 is disposed on the first surface 112. The pattern of the pattern layer 120 may be, for example, a logo, a symbol, an animal pattern, and the like. In one of the embodiments, the material of the pattern layer 120 is mirror silver; the pattern silver is prepared by screen printing mirror silver ink.

In one of the embodiments, the thickness of the pattern layer 120 is 1 μm-4 μm. It can be understood that the thickness of the pattern layer 120 can be set as required.

The decoration unit 130 is disposed on the first surface 112 of the epoxy resin layer 110 and covers the pattern layer 120. Specifically, in the illustrated embodiment, the decoration unit 130 includes an adhesive layer 132, a reflective layer 134, and an ink layer 136 stacked in sequence.

The adhesive layer 132 is a transparent material. The adhesive layer 132 is disposed on the first surface 112 of the epoxy resin layer 110, and the adhesive layer 132 covers the pattern layer 120. Further, the adhesive layer 132 is a UV transfer layer with a texture pattern, so that the outer shell 100 has a texture appearance. Specifically, the adhesive layer 132 is a urethane acrylate glue layer. For example, Betteli New Material Co., Ltd.'s model is 633-75 UV glue. It can be understood that the adhesive layer 132 is not limited to the above-mentioned glue layer, and may also be a transparent glue that is commonly used in the art after curing; the adhesive layer 132 may not have a texture pattern. In this case, the housing 100 does not have a texture appearance.

In one of the embodiments, the thickness of the adhesive layer 132 is 5 μm-20 μm. It can be understood that the thickness of the adhesive layer 132 is not limited to the above-mentioned thickness, and the thickness of the adhesive layer 132 can be set as required.

The reflective layer 134 is laminated on the side of the adhesive layer 132 away from the epoxy resin layer 110. Specifically, the reflective layer 134 is a vacuum non-conductive electroplated layer.

Specifically, the reflective layer 134 is selected from the group consisting of an indium tin oxide layer, a titanium dioxide layer, a niobium dioxide layer, a niobium trioxide layer, a niobium dioxide layer, a niobium pentoxide layer, a silicon dioxide layer, and a zirconium dioxide layer. At least one. That is, the reflective layer 134 may have a single-layer structure or a multilayer structure.

In one of the embodiments, the total thickness of the reflective layer 134 is 5 nanometers to 300 nanometers, that is, when the reflective layer 134 is a single layer structure, the thickness of the reflective layer 134 is 5 nanometers to 300 nanometers, and the reflective layer 134 has a multilayer structure. At this time, the total thickness of the multilayer reflective layer 134 is 5 nm to 300 nm. It can be understood that the thickness of the reflective layer 134 is not limited to the above-mentioned thickness, and the thickness of the reflective layer 134 can be set as required.

The ink layer 136 is laminated on the side of the reflective layer 134 away from the adhesive layer 132. Specifically, the ink layer 136 includes a white ink layer, a white ink layer, or a gray ink layer. The ink layer 136 can not only protect the reflective layer 134, but also provide a background color and shield light, and the internal structure and components of the product can be seen through the housing 100.

In one of the embodiments, the thickness of the ink layer 136 is 10 μm-20 μm. It can be understood that the thickness of the ink layer 136 is not limited to the above-mentioned thickness, and the thickness of the ink layer 136 can be set as required.

The hardening layer 140 is disposed on the second surface 114 of the epoxy resin layer 110. The hardened layer 140 can increase the wear resistance and scratch resistance of the housing 100.

In one of the embodiments, the hardening layer 140 is prepared from hardening liquid, and the main components of the hardening liquid are urethane acrylate, silicone resin and perfluoropolyether acrylate, such as PPG304 hardening liquid. It can be understood that the hardening liquid is not limited to the above-mentioned substances, and may be a hardening liquid commonly used in the art. The hardened layer 140 prepared by the above hardening liquid has good wear resistance and good scratch resistance.

Specifically, the hardness of the hardened layer 140 is 3H-5H. If the hardness is too small, the wear resistance and scratch resistance will be poor; if the hardness is too large, the hardened layer 140 will become more brittle and reduce production efficiency.

In one of the embodiments, the thickness of the hardened layer 140 is 3 μm-20 μm. It can be understood that the thickness of the hardened layer 140 can be adjusted as required.

It should be noted that the structure of the housing 100 is not limited to a structure. For example, the hardened layer 140 may be omitted. In this case, the second surface 114 of the epoxy resin layer 110 is the outer surface of the housing 100.

The pattern layer 120 may also be omitted, and the decoration unit 130 is directly laminated on the first surface 112 of the epoxy resin layer 110.

The decoration unit 130 is not limited to the above structure. The adhesive layer 132 of the decoration unit 130 can be replaced with other coatings that can facilitate the adhesion of the reflective layer 134, such as spraying a semi-transparent color layer, inkjet printing to achieve a semi-transparent color; or The decoration unit 130 does not have the ink layer 136, that is, the reflective layer 134 of the decoration unit 130 does not have the ink layer 136 on the side away from the adhesive layer 132; or, the decoration unit 130 does not have the adhesive layer 132 and the reflective layer 134 at the same time. The layer 136 is directly disposed on the first surface 112 of the epoxy resin layer 110; or, the decoration unit 130 does not have the reflective layer 134, and the ink layer 136 is directly laminated on the side of the adhesive layer 132 away from the epoxy resin layer 110.

The decoration unit 130 can also be omitted. In the case where the pattern layer 120 is provided, a protective layer can be provided on the first surface 112 of the epoxy resin layer 110, and the protective layer covers the pattern layer 120 to protect the pattern layer 120. For example, it can be a UV glue layer.

The decoration unit 130, the pattern layer 120, and the hardened layer 140 may also be omitted at the same time. In this case, the housing 100 may only have the epoxy resin layer 110.

The aforementioned housing 100 has at least the following advantages:

Since the housing 100 includes the epoxy resin layer 110 of the above material, the epoxy resin layer 110 has better wear resistance and better scratch resistance, and also has better high temperature resistance, aging resistance and resistance The impact performance makes the aforementioned housing 100 not only have better performance, but also help reduce its cost.

As shown in FIG. 4, the second embodiment of the manufacturing method of the housing, the housing manufactured by this method can be used as the housing of an electronic device, for example, a housing of a tablet computer, a mobile phone, etc., especially a back cover of a mobile phone or a tablet computer. The manufacturing method of the housing of this embodiment includes the following steps S21-S26:

Step S21: preparing an epoxy resin board.

The steps of preparing the epoxy resin board in this embodiment are the same as step S11, and will not be repeated here.

Step S22: forming a pattern layer on one side of the epoxy resin board.

Specifically, the method for forming a patterned layer in this embodiment is the same as that for forming a patterned layer in step S12 of the first embodiment, and will not be repeated here.

Step S23: forming a protective layer on the side of the epoxy resin board where the pattern layer is formed, and the protective layer covers the pattern layer.

Specifically, the protective layer is a UV glue layer. In one of the embodiments, the protective layer is a polyurethane acrylate glue layer. For example, Betteli New Material Co., Ltd.'s model is 633-75 UV glue. It can be understood that the protective layer is not limited to the above-mentioned glue layer.

In one of the embodiments, the thickness of the protective layer is 8-20 microns. It can be understood that the thickness of the protective layer is not limited to the above-mentioned thickness, and the thickness of the protective layer can be set as required.

Step S24: setting a decoration unit on the side of the protective layer away from the epoxy resin board.

Specifically, the step of arranging a decorative unit on the side of the protective layer away from the epoxy resin board includes: forming a transparent adhesive layer on the base film, forming a reflective layer on the adhesive layer, and forming an ink layer on the reflective layer to obtain Decoration unit; bonding the side of the base film of the decoration unit away from the adhesive layer with the side of the protective layer away from the epoxy resin board.

In one of the embodiments, the base film is a polycarbonate (PC) film or a TPU film. It can be understood that the base film is not limited to the above base film, and the base film may be a transparent base film commonly used in the art. Specifically, the thickness of the base film is 50 micrometers to 125 micrometers. It can be understood that the thickness of the base film is not limited to the above-mentioned thickness, and the thickness of the base film can be set as required.

The manufacturing method of the bonding layer is similar to the manufacturing method of the bonding layer of the first embodiment, except that the bonding layer of this embodiment is manufactured on the base film, which will not be repeated here.

The manufacturing method of the reflective layer is the same as the manufacturing method of the reflective layer of the first embodiment, and will not be repeated here.

The manufacturing method of the ink layer is the same as the manufacturing method of the ink layer of the first embodiment, and will not be repeated here.

Specifically, the step of bonding the side of the base film of the decoration unit away from the adhesive layer and the side of the protective layer away from the epoxy resin board includes: using a UV adhesive to move the base film away from the side of the adhesive layer to the protective layer. The side of the layer away from the epoxy board is bonded. In one of the embodiments, the UV adhesive is Bethel 805-16 glue.

Step S25: bending the epoxy resin board into shape.

The epoxy resin board with the protective layer, pattern layer and decoration unit will be bent and formed. Specifically, the method of bending the epoxy resin board in this embodiment is the same as that in the first embodiment, and will not be repeated here.

Step S26: forming a hardened layer on the convex surface of the epoxy resin board to obtain a shell.

The step of forming the hardened layer of this embodiment is the same as the step of forming the hardened layer of the first embodiment, and will not be repeated here.

It should be noted that the manufacturing method of the casing of this embodiment is not limited to the above steps. This embodiment is also similar to the manufacturing method of the casing of the first embodiment, and the production of the hardened layer in step S26 can be omitted; step S22 and steps S23 can be omitted, that is, the pattern layer and the protective layer are not made, and the decoration unit is directly adhered to the epoxy resin board through the UV adhesive; or, step S23 is omitted, that is, the protective layer is not made, and the decoration unit is directly adhered through the UV adhesive. Adhere to the epoxy resin board and cover the pattern layer. The decoration unit can also be made as required, for example, the ink layer is omitted, and so on.

Since the manufacturing method of the housing of this embodiment is similar to the manufacturing method of the housing of the first embodiment, it also has the effect similar to the manufacturing method of the housing of the first embodiment, which will not be repeated here.

As shown in FIG. 5, the housing 200 of the second embodiment can be produced by the manufacturing method of the housing of the second embodiment described above. The housing 200 can be used as a housing of an electronic device, such as a tablet computer, a mobile phone, etc. It is the back cover of a mobile phone or tablet. The structure of the housing 200 of this embodiment is similar to the structure of the housing 100 of the first embodiment, with the following differences:

The housing 200 further includes a protective layer 250 disposed on the first surface 212 of the epoxy resin layer 210 and covering the pattern layer 220. Wherein, the first surface 212 is a concave surface. Specifically, the protective layer 250 is a UV glue layer. In one of the embodiments, the protective layer 250 is a urethane acrylate glue layer. For example, Betteli New Material Co., Ltd.'s model is 633-75 UV glue. It can be understood that the protective layer 250 is not limited to the aforementioned glue layer.

The decoration unit 230 further includes a base film 238, which is disposed on the first surface 212, and the housing 200 further includes an adhesive layer 260, which is disposed between the base film 238 and the first surface 212, and the adhesive layer 260 fixes and bonds the base film 238 and the first surface 212. The side of the adhesive layer 232 away from the reflective layer 234 and the side of the base film 238 away from the first surface 212 are laminated, that is, the adhesive layer 232, the reflective layer 234, and the ink layer 236 are sequentially formed on the base film 238.

In one of the embodiments, the base film 238 is a polycarbonate (PC) film or a TPU film. It can be understood that the base film 238 is not limited to the above-mentioned base film 238, and the base film 238 may be a transparent base film commonly used in the art.

In one of the embodiments, the material of the adhesive layer 260 is a UV adhesive, and the UV adhesive is a UV glue with a model of 805-16 from Bethel New Material Co., Ltd.

Since the structure of the housing 200 of the second embodiment is similar to the structure of the housing 100 of the first embodiment, the housing 200 of the second embodiment also has similar effects to the housing 100 of the first embodiment, which will not be repeated here.

As shown in FIG. 6, the manufacturing method of the housing of the third embodiment, the housing manufactured by this method can be used as the housing of an electronic device, for example, a housing of a tablet computer, a mobile phone, etc., especially a back cover of a mobile phone or a tablet computer. The manufacturing method of the housing of this embodiment includes the following steps S31-S35:

Step S31: preparing an epoxy resin board.

Step S32: forming a pattern layer on one side of the epoxy resin board.

Specifically, the method of forming a patterned layer in this embodiment is similar to that of forming a patterned layer in step S12 of the first embodiment, and will not be repeated here.

Step S33: The epoxy resin board is bent and formed.

The epoxy resin board with the patterned layer is about to be bent and molded. Specifically, the method of bending the epoxy resin board in this embodiment is the same as that in the first embodiment, and will not be repeated here.

Step S34: setting a decoration unit on the concave surface of the epoxy resin.

That is, in this embodiment, the step of providing a decorative layer on the concave surface of the epoxy resin is after the step of bending the epoxy resin board.

Specifically, the step of arranging a decorative unit on the concave surface of the epoxy resin includes: forming a transparent adhesive layer on the base film, forming a reflective layer on the adhesive layer, and forming an ink layer on the reflective layer to obtain the decorative unit ; Bond the side of the base film of the decoration unit away from the adhesive layer with the concave surface of the epoxy resin board. It can be understood that the step of forming the decoration unit can be before or at the same time as step S33, that is, the decoration unit can be made in step S33 or at the same time as step S33, and then the base film of the decoration unit can be connected to the epoxy resin board on the side away from the adhesive layer. The concave surface is bonded.

In one of the embodiments, the base film is a polycarbonate film or a TPU film. It can be understood that the base film is not limited to the above base film, and the base film may be a transparent base film commonly used in the art.

Specifically, the step of bonding the side of the base film of the decoration unit away from the adhesive layer to the concave surface of the epoxy resin board includes: using an adhesive to connect the side of the base film away from the adhesive layer to the epoxy resin board. The concave surface is bonded. In this embodiment, the adhesive is a thermosetting adhesive or a UV adhesive. The thermosetting adhesive is OCA glue, such as OCA glue from Aojia Optoelectronics; the UV adhesive is UV glue with the model of 805-16 from Bethel New Material Co., Ltd.

Step S35: forming a hardened layer on the convex surface of the epoxy resin board to obtain a shell.

It should be noted that the manufacturing method of the casing of this embodiment is not limited to the above steps. In this embodiment, it is also similar to the manufacturing method of the casing of the first embodiment. The production of the hardened layer in step S35 can be omitted; step S32 It can be omitted. At this time, no pattern layer is made, and the side of the base film of the decoration unit away from the adhesive layer is bonded to the concave surface of the epoxy resin board, that is, the decoration unit is directly adhered to the ring through the UV adhesive. On the concave surface of the oxygen resin board; the decoration unit can also be made as required, for example, the ink layer is omitted, and so on.

Since the manufacturing method of the housing of this embodiment is similar to the manufacturing method of the housing of the first embodiment, it also has the effect similar to the manufacturing method of the housing of the first embodiment, which will not be repeated here. Since the bending step of the manufacturing method of the housing of the third embodiment is before the decoration unit is set, the glue of the manufacturing method of the housing of this embodiment to set the decoration unit to the epoxy resin board can not only use UV adhesive, but also Use thermosetting adhesive.

As shown in FIG. 7, the housing 300 of the third embodiment can be manufactured by the manufacturing method of the housing of the third embodiment described above. The housing 300 can be used as a housing of an electronic device, such as a tablet computer, a mobile phone, etc. It is the back cover of a mobile phone or tablet. The structure of the housing 300 of this embodiment is similar to the structure of the housing 100 of the first embodiment, with the following differences:

The decoration unit 330 further includes a base film 338, which is disposed on the concave surface 312 of the epoxy resin layer 310, and the housing 300 further includes an adhesive layer 350, which is disposed between the base film 338 and the concave surface 312. The adhesive layer 350 fixes and bonds the base film 338 and the concave surface 312, and the side of the adhesive layer 332 away from the reflective layer is laminated with the concave surface 312 of the epoxy resin layer 310, that is, the adhesive layer 332, the reflective layer 334 and the ink layer 336 are sequentially formed on the base film 338.

In one of the embodiments, the base film 338 is a PC film or a TPU film. It can be understood that the base film 338 is not limited to the aforementioned base film, and the base film 338 may be a transparent base film commonly used in the art.

In one of the embodiments, the material of the adhesive layer 360 is UV adhesive or thermosetting adhesive. Among them, the UV adhesive is, for example, a UV model of 805-16 from Bethel New Material Co., Ltd.; the thermosetting adhesive is OCA glue, such as OCA glue of Aojia Optoelectronics.

Since the structure of the housing 300 of the third embodiment is similar to the structure of the housing 100 of the first embodiment, the housing 300 of the third embodiment also has similar effects to the housing 100 of the first embodiment, which will not be repeated here.

An electronic device of an embodiment, for example, a tablet computer, a mobile phone, etc., includes a casing, wherein the outer casing is the casing produced by the method of manufacturing the casing of the first embodiment, the casing of the first embodiment, and the casing of the second embodiment The shell produced by the manufacturing method, the shell of the second embodiment, the shell of the third embodiment, or the shell of the third embodiment.

In one of the embodiments, the electronic device is a mobile phone or a tablet computer, and the housing is a back cover.

Since the above-mentioned electronic device adopts the housing produced by the housing manufacturing method of the first embodiment, the housing of the first embodiment, the housing produced by the housing of the second embodiment, the housing of the second embodiment, and the third embodiment The housing produced by the method of manufacturing the housing or the housing of the third embodiment is beneficial to increase the service life of the electronic device and reduce the production cost of the electronic device.

It should be noted that the above-mentioned housing is not limited to the housing of the electronic device, and may also be the housing of other products.

The following is a specific example part (the following examples take one of the preparation methods of modified epoxy resin as an example to illustrate the preparation of modified epoxy resin, but the preparation method of modified epoxy resin of the present invention does not It is not limited to the following steps and the following materials, that is, the technical solution of the present invention is not limited to the following examples. For example, in the following examples, the catalyst adopts dibutyltin dilaurate, the curing agent adopts dicyandiamide, and the polyurethane prepolymer adopts the United States. Dow's MDI polyurethane prepolymer with the model number N434 is an example and does not limit the scope of the present invention):

Example 1

The preparation process of the epoxy resin board of this embodiment is as follows:

(1) Preparation of modified epoxy resin: According to Table 1, according to the mass ratio of modified product and epoxy resin as A:B, the modified product, epoxy resin and catalyst were stirred and mixed for t ₁ hour at room temperature, then Add the curing agent and stir uniformly, and then react at T ₁ ℃ for t ₂ hours to obtain a modified epoxy resin. The mass ratio of the catalyst to the epoxy resin is C:B, the mass ratio of the curing agent to the epoxy resin is D:B, the catalyst is dibutyltin dilaurate, and the curing agent is dicyandiamide.

The epoxy value of the modified epoxy resin prepared according to the GB 1677-1981 "hydrochloric acid-acetone method" test; the softening temperature of the modified epoxy resin prepared according to the ISO 306-2013 test, where the modified epoxy resin The epoxy value and softening temperature are shown in Table 2.

(2) According to Table 2, melt the modified epoxy resin prepared in step (1) at T ₂ ° C. and then extrude to obtain an epoxy resin board with a thickness of D mm.

Table 1

Among them, in the column of "epoxy resin" in Table 1, E-51, E-55 and E-44 represent E-51 epoxy resin, E-55 epoxy resin and E-44 epoxy resin respectively, and this The ":" in the column indicates the mass ratio. For example, E-51:E-44 means that the epoxy resin of this example is composed of E-51 epoxy resin and E-44 epoxy resin, and E-51:E The ratio indicated by -44 is mass ratio.

Table 2

To	环氧值Epoxy value	软化温度(℃)Softening temperature (℃)	T ₂(℃) T ₂ (℃)	D(毫米)D (mm)
实施例1Example 1	0.330.33	122122	168168	0.60.6
实施例2Example 2	0.320.32	115115	165165	0.40.4
实施例3Example 3	0.340.34	124124	170170	0.80.8
实施例4Example 4	0.330.33	120120	155155	0.50.5
实施例5Example 5	0.320.32	121121	148148	0.70.7
实施例6Example 6	0.360.36	126126	142142	0.60.6
实施例7Example 7	0.330.33	123123	170170	0.40.4

实施例8Example 8	0.310.31	109109	150150	0.80.8
实施例9Example 9	0.370.37	127127	180180	0.60.6
实施例10Example 10	0.340.34	124124	177177	0.50.5
实施例11Example 11	0.320.32	116116	155155	0.70.7
实施例12Example 12	0.330.33	120120	160160	0.40.4
实施例13Example 13	0.360.36	125125	158158	0.60.6
实施例14Example 14	0.450.45	130130	190190	0.80.8
实施例15Example 15	0.250.25	100100	140140	0.70.7
实施例16Example 16	0.420.42	128128	174174	0.60.6
实施例17Example 17	0.450.45	129129	188188	0.40.4
实施例18Example 18	0.360.36	125125	172172	0.50.5
实施例19Example 19	0.380.38	128128	181181	0.70.7
实施例20Example 20	0.430.43	120120	155155	0.60.6
实施例21Example 21	0.350.35	124124	178178	0.60.6
对比例1Comparative example 1	0.240.24	100100	140140	0.60.6
对比例2Comparative example 2	0.460.46	130130	190190	0.60.6
对比例3Comparative example 3	0.330.33	122122	168168	0.60.6
对比例4Comparative example 4	0.330.33	122122	168168	0.60.6
对比例5Comparative example 5	0.350.35	125125	180180	0.60.6

Comparative example 5

Comparative Example 5 is a conventional 3240 epoxy resin board with a thickness of 0.6 mm and an epoxy value of 0.35.

Comparative example 6

Comparative Example 6 is a conventional composite substrate of polycarbonate (PC) and polymethyl methacrylate (PMMA), with a total thickness of 0.6 mm.

Comparative example 7

Comparative Example 7 is a conventional pure polycarbonate (PC) board with a thickness of 0.6 mm.

Comparative example 8

Comparative Example 8 is a conventional polyethylene terephthalate (PET) board with a thickness of 0.6 mm.

test:

(1) Use DIGILA's FTS-3000 Fourier Infrared Spectrometer to test the epoxy resin boards of Examples 1-21 and Comparative Examples 1-4, the 3240 epoxy resin boards of Comparative Example 5, and the composite of Comparative Example 6. The optical transmittance of the substrate, the pure polycarbonate plate of Comparative Example 7 and the polyethylene terephthalate plate of Comparative Example 8;

(2) Using Shimadzu's AG-IS universal testing machine Examples 1-21 and Comparative Example 1-4 epoxy resin board, Comparative Example 5 3240 epoxy resin board, Comparative Example 6 composite substrate, Comparative Example 7 The tensile properties of the pure polycarbonate board and the polyethylene terephthalate board of Comparative Example 8;

(3) The ASTM D3363 method was used to test the epoxy resin plates of Examples 1-21 and Comparative Examples 1-4, the 3240 epoxy resin plates of Comparative Example 5, the composite substrate of Comparative Example 6, and the pure polycarbonate of Comparative Example 7 The hardness of the board and the polyethylene terephthalate board of Comparative Example 8;

(4) The ASTM G-151 method was used to test the epoxy resin boards of Example 1-21 and Comparative Example 1-4, the 3240 epoxy resin board of Comparative Example 5, the composite substrate of Comparative Example 6, and the pure polymer of Comparative Example 7. The aging resistance of the carbonate board and the polyethylene terephthalate board of Comparative Example 8;

(5) Hot press bending test: the epoxy resin board of Example 1-21 and Comparative Example 1-4, the 3240 epoxy resin board of Comparative Example 5, the composite substrate of Comparative Example 6 and the pure polycarbonate of Comparative Example 7 The ester board and the polyethylene terephthalate board of Comparative Example 8 are used as the template to be bent by hot pressing. The specific steps are: first place the template in the lower mold and set the heating plate temperature to 300°C. Heat down for 22 seconds, and the temperature of the lower mold is 90℃-140℃; then close the upper film and the lower mold, and keep the pressure for 20 seconds, the temperature of the upper mold is 120℃, and then observe the effect of the bent sample under the light (Whether it can be bent into a predetermined arc, and whether there are cracks on the convex surface).

(6) High pressure bending test: the epoxy resin plates of Examples 1-21 and Comparative Examples 1-4, the 3240 epoxy resin plates of Comparative Example 5, the composite substrate of Comparative Example 6 and the pure polycarbonate of Comparative Example 7 The board and the polyethylene terephthalate board of Comparative Example 8 are used as a model to be bent by high-pressure forming. The specific process parameters are: the temperature of the forming mold is 120°C, the temperature of the heating plate is 220°C, and the inflation pressure is 20Bar , The molding time is 100 seconds. Then observe the effect of the curved model under the light.

Among them, the epoxy resin plates of Examples 1-21 and Comparative Examples 1-4, the 3240 epoxy resin plates of Comparative Example 5, the composite substrates of Comparative Example 6, the pure polycarbonate plates of Comparative Example 7 and those of Comparative Example 8 The optical transmittance, tensile resistance, hardness, aging resistance, bending effect of hot press forming and the bending effect of high pressure forming of the polyethylene terephthalate board are shown in Table 3.

table 3

It can be seen from Table 3 that the optical transmittance of the epoxy resin board of Example 1-21 is 83%-88%, which has a relatively high optical transmittance, and the epoxy resin board of Example 1-21 The tensile strength is at least 60MPa, the tensile strength is better, the hardness is HB-H, and the hardness is greater, so that it has better wear resistance, better scratch resistance, and The above epoxy resin board does not turn yellow under ultraviolet light for 48H, and has good aging resistance. Its performance is equivalent to that of the composite substrate of Comparative Example 6. It can be used as a shell, thereby providing a new material for the manufacture of the shell. . At the same time, the epoxy resin board of Examples 1-21 can be bent into a predetermined shape after hot press bending and high pressure bending molding without cracks. It can be directly formed by bending, which simplifies the production process, improves the yield, and reduces The production cost of the shell.

The epoxy resin board of Comparative Example 1 not only has low tensile strength, but also has low hardness. It turns yellow slightly after 48H of ultraviolet radiation and cannot be bent into a predetermined shape; the epoxy resin of Comparative Example 2 and Comparative Example 3 Although the resin board has greater hardness, its tensile strength is low, and there will be cracks after the bending test, so it cannot be directly bent into shape; although the epoxy resin board of Comparative Example 4 has greater tensile strength, But the hardness is too low; although the epoxy resin board of Comparative Example 5 has greater hardness and better tensile strength, it is severely yellowed after 48 hours of ultraviolet radiation, and there are cracks on the surface after bending and forming, and it cannot be bent directly. The hardness of the pure polycarbonate plate of Comparative Example 7 is too low, and the wear resistance and scratch resistance are too poor; the tensile strength of the polyethylene terephthalate plate of Comparative Example 8 is too large, and the curvature after bending Smaller, it cannot be bent into a predetermined shape, and it is more difficult to make a shell with a predetermined arc.

Example 22

The manufacturing process of the housing of this embodiment is as follows:

The epoxy resin board produced in Example 1 was subjected to high-pressure molding to bend the epoxy resin board, and then CNC processing was performed to mill off the excess leftover material to obtain a shell. Among them, the process parameters of high-pressure molding include: the temperature of the molding die is 120°C, the temperature of the heating plate is 200°C, the inflation pressure is 20 Bar, and the molding time is 100 seconds.

Example 23

The manufacturing process of the housing of this embodiment is as follows:

The epoxy resin board produced in Example 4 was subjected to high-pressure molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess scrap to obtain the shell. Among them, the process parameters of high-pressure molding include: the temperature of the molding die is 90°C, the temperature of the heating plate is 300°C, the inflation pressure is 10 Bar, and the molding time is 60 seconds.

Example 24

The manufacturing process of the housing of this embodiment is as follows:

The epoxy resin board produced in Example 7 was subjected to high-pressure molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess leftover material to obtain the shell. Among them, the process parameters of high-pressure molding include: the temperature of the molding die is 150°C, the temperature of the heating plate is 150°C, the inflation pressure is 30 Bar, and the molding time is 150 seconds.

Example 25

The manufacturing process of the housing of this embodiment is as follows:

The epoxy resin board produced in Example 2 was subjected to thermocompression molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess leftover material to obtain the shell. Wherein, the step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat it for 25 seconds under the condition that the temperature of the heating plate is 320°C, and the temperature of the lower mold is 120°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 20 seconds, the upper mold temperature is 110 ℃.

Example 26

The manufacturing process of the housing of this embodiment is as follows:

The epoxy resin board produced in Example 5 was subjected to thermo-compression molding to bend the epoxy resin board, and then CNC processing was performed to mill off excess leftover material to obtain a shell. Wherein, the step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat for 30 seconds under the condition that the temperature of the heating plate is 250°C, and the temperature of the lower mold is 140°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 30 seconds, the upper mold temperature is 130 ℃.

Example 27

The manufacturing process of the housing of this embodiment is as follows:

The epoxy resin board produced in Example 8 was subjected to thermocompression molding to bend the epoxy resin board, and then CNC processing was performed to mill out the excess leftover material to obtain the shell. Wherein, the step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat it for 15 seconds under the condition of the temperature of the heating plate is 380°C, and the temperature of the lower mold is 90°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 10 seconds, the upper mold temperature is 90 ℃.

Example 28

The manufacturing process of the housing of this embodiment is as follows:

(1) Use 350 mesh screen printing mirror silver ink on one side of the epoxy resin board prepared in Example 3, then let it stand at 25°C for 45 minutes, and then bake it at 70°C for 60 minutes to form a thickness It is a 3 micron pattern layer.

(2) Use UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the patterned layer on the epoxy resin board to form an adhesive layer with a texture and thickness of 10 microns, and bond it The layer covers the pattern layer; on the side of the adhesive layer away from the epoxy resin board, vacuum non-conductive electroplating forms a reflective layer with a thickness of 15 nanometers, the reflective layer is an indium tin oxide layer; on the side of the indium tin oxide layer away from the adhesive layer Print black ink to form an ink layer with a thickness of 15 microns to form a decorative unit.

(3) The epoxy resin board with the decoration unit formed in step (2) is subjected to high pressure molding to bend the epoxy resin board. The process parameters of high-pressure molding include: the temperature of the molding die is 140°C, the temperature of the heating plate is 250°C, the inflation pressure is 15 Bar, and the molding time is 120 seconds.

(4) Spread PPG 304 hardening solution on the side of the curved epoxy resin board away from the decoration unit, then bake it at 70°C for 6 minutes, and then cure under UV light irradiation with a curing energy of 800mj/cm ² to form The hardened layer with a thickness of 10 microns is then CNC machined to mill off the excess scrap to obtain the shell.

Example 29

The manufacturing process of the housing of this embodiment is as follows:

(1) Use 300 mesh screen printing mirror silver ink on one side of the epoxy resin board prepared in Example 6, then let it stand at 15°C for 60 minutes, and then bake it at 60°C for 90 minutes to form a thickness It is a 4 micron pattern layer.

(2) Use UV glue (Bettery New Material Co., Ltd., model 633-75) to transfer the patterned layer on the side of the epoxy resin board to form an adhesive layer with texture and thickness of 5 microns, and bond it The layer covers the pattern layer; on the side of the adhesive layer away from the epoxy resin board, vacuum non-conductive electroplating forms a reflective layer with a thickness of 50 nanometers, the reflective layer is a niobium dioxide layer; on the side of the niobium dioxide layer away from the adhesive layer Print black ink to form an ink layer with a thickness of 20 microns to form a decorative unit.

(3) The epoxy resin board with the decoration unit formed in step (2) is subjected to high pressure molding to bend the epoxy resin board. The process parameters of high-pressure molding include: the temperature of the molding die is 100°C, the temperature of the heating plate is 280°C, the inflation pressure is 200 Bar, and the molding time is 80 seconds.

(4) Spread PPG 304 hardening solution on the side of the curved epoxy resin board far away from the decoration unit, then bake it at 60°C for 10 minutes, and then cure under ultraviolet light irradiation with a curing energy of 400mj/cm ² to form The hardened layer with a thickness of 3 microns is then CNC machined to mill off the excess scrap to obtain the shell.

Example 30

The manufacturing process of the housing of this embodiment is as follows:

(1) Use 420 mesh screen printing mirror silver ink on one side of the epoxy resin board prepared in Example 10, then let it stand at 30°C for 30 minutes, and then bake it at 80°C for 30 minutes to form a thickness It is a 1 micron pattern layer.

(2) Use UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the patterned layer on the epoxy resin board to form an adhesive layer with a texture and a thickness of 20 microns, and bond it Layer covering the pattern layer; vacuum non-conductive electroplating on the side of the adhesive layer away from the epoxy resin board to form a reflective layer with a thickness of 300 nm, and the reflective layer is a niobium trioxide layer; on the niobium trioxide layer away from the adhesive layer Black ink is printed on one side of the device to form an ink layer with a thickness of 10 microns to form a decorative unit.

(3) The epoxy resin board with the decoration unit formed in step (2) is subjected to high pressure molding to bend the epoxy resin board. The process parameters of high-pressure molding include: the temperature of the molding die is 90°C, the temperature of the heating plate is 200°C, the inflation pressure is 30Bar, and the molding time is 150 seconds.

(4) Spread PPG 304 hardening liquid on the side of the curved epoxy resin board away from the decoration unit, and then bake it at 80°C for 3 minutes and then cure under ultraviolet light. The curing energy is 1200mj/cm ² to form a thickness It is a hardened layer of 20 microns, and then CNC machining is performed to mill off the excess scrap to obtain the shell.

Example 31

The manufacturing process of the housing of this embodiment is as follows:

(1) Similar to step (1) of Example 28, except that the epoxy resin board used is the epoxy resin board prepared in Example 11.

(2) Similar to the step (2) of embodiment 28, the difference is that the preparation process of the reflective layer is different: vacuum non-conductive electroplating is formed on the side of the adhesive layer away from the epoxy resin board to form niobium pentoxide with a thickness of 50 nm Layer, and then a silicon dioxide layer with a thickness of 50 nm is formed on the niobium pentoxide layer. The ink layer is formed on the side of the silicon dioxide layer away from the niobium pentoxide layer.

(3) The epoxy resin board with the decorative unit formed in step (2) is subjected to thermo-compression molding to bend the epoxy resin board. Wherein, the step of hot press molding is: first place the epoxy resin board in the lower mold, heat it for 18 seconds under the condition that the temperature of the heating plate is 300°C, and the temperature of the lower mold is 100°C, remove the heating plate , And then close the upper film and the lower mold, and hold the pressure for 30 seconds, the upper mold temperature is 130 ℃.

(4) The same as the step (4) of Example 28.

Example 32

The manufacturing process of the housing of this embodiment is as follows:

(1) It is similar to step (1) of Example 29, except that the epoxy resin board used is the epoxy resin board prepared in Example 13.

(2) Similar to the step (2) of embodiment 29, the difference is that the preparation process of the reflective layer is different: vacuum non-conductive electroplating is formed on the side of the adhesive layer away from the epoxy resin board to form a thickness of 40 nanometers of niobium pentoxide Layer, then vacuum non-conductive electroplating on the niobium pentoxide layer to form a silicon dioxide layer with a thickness of 60 nanometers, and then vacuum non-conductive electroplating on the side of the silicon dioxide layer away from the niobium pentoxide layer to form a thickness of 70 nanometers Zirconium dioxide layer. The ink layer is formed on the side of the zirconium dioxide layer away from the silicon dioxide layer.

(3) The epoxy resin board with the decorative unit formed in step (2) is subjected to thermo-compression molding to bend the epoxy resin board. Wherein, the step of hot pressing is as follows: first put the epoxy resin board in the lower mold, heat it for 20 seconds under the condition that the temperature of the heating plate is 350°C, and the lower mold temperature is 110°C, remove the heating plate , Then the upper film and the lower mold are closed, and the pressure is kept for 20 seconds, and the upper mold temperature is 110°C.

(4) The same as the step (4) of Example 29.

Example 33

The manufacturing process of the housing of this embodiment is as follows:

(1) Use 350 mesh screen printing mirror silver ink on one side of the epoxy resin board prepared in Example 14, and then let it stand at 20°C for 50 minutes, and then bake at 75°C for 50 minutes to form a thickness It is a 2 micron pattern layer.

(2) Use UV glue (Bettery New Material Co., Ltd., model 633-75) to form a protective layer with a thickness of 8 microns on the side of the epoxy resin board where the pattern layer is formed, and the protective layer covers the pattern layer.

(3) Use UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the base film to form an adhesive layer with texture and thickness of 8 microns. The adhesive layer is far from the epoxy resin board. The side vacuum non-conductive electroplating forms a reflective layer with a thickness of 80 nanometers, and the reflective layer is a niobium dioxide layer; black ink is printed on the side of the niobium dioxide layer away from the bonding layer to form an ink layer with a thickness of 18 microns. To form a decorative unit; use the UV adhesive on the side of the base film of the decorative unit away from the adhesive layer and the side of the protective layer away from the epoxy resin board (Better New Material Co., Ltd. model is 805-16 UV Glue) bonding. Among them, the base film is a polycarbonate film with a thickness of 50 microns.

(4) The epoxy resin board provided with the decoration unit in step (3) is subjected to high pressure molding to bend the epoxy resin board. The process parameters of high-pressure molding include: the temperature of the molding die is 150°C, the temperature of the heating plate is 250°C, the inflation pressure is 20 Bar, and the molding time is 120 seconds.

(5) Spread PPG 304 hardening liquid on the side of the curved epoxy resin board away from the decoration unit, then bake it at 65°C for 8 minutes, and then cure under UV light irradiation with a curing energy of 600mj/cm ² to form The hardened layer with a thickness of 8 microns is then CNC machined to mill off the excess scrap to obtain the shell.

Example 34

The manufacturing process of the housing of this embodiment is as follows:

(1) Use 400 mesh screen printing mirror silver ink on one side of the epoxy resin board prepared in Example 15, and then let it stand at 25°C for 40 minutes, and then bake at 70°C for 70 minutes to form a thickness It is a 3 micron pattern layer.

(2) Use UV glue (Bettery New Material Co., Ltd., model 633-75) to form a protective layer with a thickness of 20 microns on the side of the epoxy resin board where the patterned layer is formed, and the protective layer covers the patterned layer.

(3) Use UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the base film to form an adhesive layer with a texture and a thickness of 12 microns. The adhesive layer is far from the epoxy resin board. Side vacuum non-conductive electroplating forms a reflective layer with a thickness of 200 nanometers, and the reflective layer is a niobium dioxide layer; black ink is printed on the side of the indium tin oxide layer away from the adhesive layer to form an ink layer with a thickness of 12 microns to form Decoration unit; use UV adhesive on the side of the base film of the decoration unit away from the adhesive layer and the side of the protective layer away from the epoxy resin board (Better New Material Co., Ltd.'s model is 805-16 UV glue) Bonding. Among them, the base film is a polycarbonate film with a thickness of 100 microns.

(4) The epoxy resin board provided with the decoration unit in step (3) is subjected to high pressure molding to bend the epoxy resin board. The process parameters of high-pressure molding include: the temperature of the molding die is 90°C, the temperature of the heating plate is 300°C, the inflation pressure is 15 Bar, and the molding time is 60 seconds.

(5) Spread PPG 304 hardening liquid on the side of the curved epoxy resin board away from the decoration unit, then bake it at 80°C for 4 minutes, and then cure under UV light irradiation with a curing energy of 1000mj/cm ² to form The hardened layer with a thickness of 12 microns is then CNC machined to mill off the excess scrap to obtain the shell.

Example 35

The manufacturing process of the housing of this embodiment is as follows:

(1) Similar to step (1) of Example 33, the difference is that the epoxy resin board is the epoxy resin board prepared in Example 4.

(2) The same as step (2) of Example 33.

(3) It is similar to step (3) of Embodiment 33, except that the light reflecting layer is a zirconium dioxide layer with a thickness of 20 nanometers.

(4) The epoxy resin board provided with the decoration unit in step (3) is subjected to thermocompression molding to bend the epoxy resin board. Wherein, the step of hot press molding is: first put the epoxy resin board in the lower mold, heat it for 28 seconds under the condition of the temperature of the heating plate is 280°C, and the temperature of the lower mold is 90°C, remove the heating plate , Then the upper film and the lower mold are closed, and the pressure is maintained for 30 seconds, and the upper mold temperature is 90°C.

(5) The same as step (5) of Example 33.

Example 36

The manufacturing process of the housing of this embodiment is as follows:

(1) Similar to step (1) of Example 34, the difference is that the epoxy resin board is the epoxy resin board prepared in Example 18.

(2) The same as the step (2) of Example 34.

(3) It is similar to step (3) of embodiment 34, except that the reflective layer is a niobium pentoxide layer with a thickness of 100 nm.

(4) The epoxy resin board provided with the decoration unit in step (3) is subjected to thermocompression molding to bend the epoxy resin board. Among them, the step of hot press molding is: first put the epoxy resin board in the lower mold, heat it for 20 seconds under the condition of the temperature of the heating plate at 370℃, and the temperature of the lower mould is 120℃, remove the heating plate, and then Clamp the upper film and the lower mold, and hold the pressure for 15 seconds. The upper mold temperature is 120°C.

(5) The same as the step (5) of Example 34.

Example 37

The manufacturing process of the housing of this embodiment is as follows:

(1) Use 320 mesh screen printing screen printing mirror silver ink on one side of the epoxy resin board prepared in Example 5, then let it stand at 15°C for 60 minutes, and then bake it at 80°C for 60 minutes to form a thickness It is a 4 micron pattern layer.

(2) The epoxy resin board forming the pattern layer is subjected to high pressure molding to bend the epoxy resin board. The process parameters of high-pressure molding include: the temperature of the molding die is 100°C, the temperature of the heating plate is 180°C, the inflation pressure is 15 Bar, and the molding time is 120 seconds.

(3) Use UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the base film to form an adhesive layer with a texture and a thickness of 16 microns. The adhesive layer is far from the epoxy resin board. Side vacuum non-conductive electroplating forms a reflective layer with a thickness of 120 nanometers, and the reflective layer is an indium tin oxide layer; black ink is printed on the side of the indium tin oxide layer away from the adhesive layer to form an ink layer with a thickness of 15 microns to form a decoration Unit; The side of the base film of the decorative unit away from the adhesive layer and the concave surface of the epoxy resin board are bonded with OCA glue (OCA glue from Aojia Optoelectronics), and the decorative unit covers the pattern layer. Among them, the base film is a TPU film with a thickness of 125 microns.

(4) Spread PPG 304 hardening solution on the convex surface of the epoxy resin board, then bake it at 60°C for 10 minutes, and then cure under ultraviolet light. The curing energy is 800mj/cm ² and the thickness is 18 microns. The hardened layer is then CNC machined, and the excess leftover material is milled to obtain the shell.

Example 38

The manufacturing process of the housing of this embodiment is as follows:

(1) Use 420 mesh screen printing mirror silver ink on one side of the epoxy resin board prepared in Example 16, and then let it stand at 30°C for 30 minutes, and then bake at 60°C for 90 minutes to form a thickness It is a 2 micron pattern layer.

(2) The epoxy resin board forming the pattern layer is subjected to high pressure molding to bend the epoxy resin board. The process parameters of high-pressure molding include: the temperature of the molding die is 120°C, the temperature of the heating plate is 200°C, the inflation pressure is 10 Bar, and the molding time is 150 seconds.

(3) Use UV glue (Bettery New Material Co., Ltd., Model 633-75) to transfer the base film to form an adhesive layer with texture and thickness of 8 microns. The adhesive layer is far from the epoxy resin board. The side vacuum non-conductive electroplating forms a reflective layer with a thickness of 30 nanometers, and the reflective layer is a silicon dioxide layer; black ink is printed on the side of the silicon dioxide layer away from the adhesive layer to form an ink layer with a thickness of 10 microns to form a decoration Unit; The side of the base film of the decorative unit away from the adhesive layer and the concave surface of the epoxy resin board are bonded with OCA glue (OCA glue from Aojia Optoelectronics), and the decorative unit covers the pattern layer. Among them, the base film is a TPU film with a thickness of 75 microns.

(4) Spread PPG 304 curing solution on the convex surface of the epoxy resin board, then bake it at 80℃ for 3 minutes, and then cure under ultraviolet light. The curing energy is 500mj/cm ² and the thickness is 5 microns. The hardened layer is then CNC machined, and the excess leftover material is milled to obtain the shell.

Example 39

The manufacturing process of the housing of this embodiment is as follows:

(1) It is similar to the step (1) of embodiment 37, except that the epoxy resin board of this embodiment is the epoxy resin board prepared in embodiment 10.

(2) The epoxy resin board forming the pattern layer is thermocompressed to bend the epoxy resin board. Among them, the steps of hot press molding are: first place the epoxy resin board in the lower mold, heat it for 15 seconds under the condition of the temperature of the heating plate at 280°C and the temperature of the lower mold at 140°C, remove the heating plate, and then Clamp the upper film and the lower mold, and hold the pressure for 130 seconds. The temperature of the upper mold is 130°C.

(3) The same as the step (3) of Example 37.

(4) The same as the step (4) of Example 37.

Example 40

The manufacturing process of the housing of this embodiment is as follows:

(1) Similar to step (1) of embodiment 38, the difference is that the epoxy resin board of this embodiment is the epoxy resin board prepared in embodiment 16.

(2) The epoxy resin board forming the pattern layer is thermocompressed to bend the epoxy resin board. Among them, the step of hot press molding is: first place the epoxy resin board in the lower mold, heat it for 30 seconds under the condition of the temperature of the heating plate at 300°C, and the temperature of the lower mold is 90°C, remove the heating plate, and then Clamp the upper film and the lower mold, and hold the pressure for 10 seconds. The temperature of the upper mold is 90°C.

(3) The same as the step (3) of Example 38.

(4) The same as the step (4) of Example 38.

Example 41

The manufacturing process of the casing of this embodiment is similar to that of Embodiment 23, except that the temperature of the heating plate is 310°C.

Example 42

The manufacturing process of the housing of this embodiment is similar to that of Embodiment 24, except that the temperature of the molding die is 80°C.

Example 43

The manufacturing process of the shell of this embodiment is similar to that of Embodiment 24, except that the temperature of the heating plate is 140°C.

Example 44

The manufacturing process of the housing of this embodiment is similar to that of Embodiment 26, except that the temperature of the heating plate is 240°C.

Example 45

The manufacturing process of the shell of this embodiment is similar to that of Embodiment 27, except that the temperature of the heating plate is 390°C.

test:

The effect of the epoxy resin layer of the shell prepared in Example 22 to Example 45 was observed by changing the angle under strong light (such as lamp light), as shown in Table 4:

Table 4

To	环氧树脂层的效果The effect of epoxy resin layer
实施例22Example 22	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例23Example 23	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例24Example 24	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例25Example 25	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例26Example 26	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例27Example 27	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例28Example 28	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例29Example 29	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例30Example 30	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例31Example 31	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例32Example 32	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例33Example 33	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例34Example 34	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例35Example 35	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例36Example 36	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例37Example 37	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例38Example 38	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例39Example 39	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例40Example 40	无裂痕，且弯曲成预定的弯曲弧度No cracks, and bend into a predetermined arc
实施例41Example 41	弯曲成预定的弯曲弧度，但表面褶皱起泡Bending into a predetermined arc, but the surface folds and blisters
实施例42Example 42	未弯曲成预定弯曲弧度Not bent into a predetermined bending arc
实施例43Example 43	未弯曲成预定弯曲弧度Not bent into a predetermined bending arc
实施例44Example 44	外凸表面的弧形部处开裂Cracks at the arc of the convex surface
实施例45Example 45	弯曲成预定的弯曲弧度，但表面褶皱起泡Bending into a predetermined arc, but the surface folds and blisters

It can be seen from Table 4 that the epoxy resin layer of the shell of Examples 22-40 has no cracks and is bent into a predetermined bending arc, while the surface of the epoxy resin layer of Example 41 and Example 45 is blistered. The reason is that the heating temperature is too high. The epoxy resin layer of Example 42 and Example 43 is not bent into a predetermined bending arc because the temperature of the molding die or heating plate is too low, resulting in insufficient molding temperature. The epoxy resin of Example 44 The cracking of the layer occurs because the temperature of the heating plate is too low, which causes the epoxy resin layer to crack during the clamping and holding pressure process, resulting in cracks.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of this specification.

The above-mentioned embodiments only express several embodiments of the present invention, and the descriptions are more specific and detailed, but they should not be understood as limiting the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

A modified epoxy resin, the modified epoxy resin has an epoxy value of 0.25-0.45, the modified epoxy resin is an epoxy resin modified by a modified product, and the modified product is selected from organic At least one of silicon, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5-1:10.
The modified epoxy resin of claim 1, wherein the modified product is selected from at least one of the silicone and the polyurethane prepolymer;

Alternatively, the modified product is composed of the polyimide and the polyurethane prepolymer, and in the modified product, the polyurethane prepolymer has a mass percentage of 60% or more;

Alternatively, the modified product is composed of the silicone and the polyimide in a mass ratio of 1:(0.1-0.2).
An epoxy resin board, the material of the epoxy resin board is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is a modified product. The modified product is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5 -1:10.
A shell comprising an epoxy resin layer, the material of the epoxy resin layer is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is modified epoxy resin. A modified epoxy resin, wherein the modified product is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified product to the epoxy resin is 1:5-1:10.
4. The housing according to claim 4, wherein the epoxy resin layer has a first surface, and the housing further comprises a decoration unit provided on the first surface.
The housing according to claim 5, wherein the decoration unit comprises an adhesive layer, a reflective layer, and an ink layer stacked in sequence, the adhesive layer is made of transparent material, and the adhesive layer is away from the reflective layer One side is laminated with the first surface.
The housing according to claim 6, wherein the adhesive layer is a UV transfer layer with a texture pattern.
The enclosure according to claim 6, wherein the reflective layer is a vacuum non-conductive electroplated layer.
The housing of claim 6, wherein the reflective layer is selected from the group consisting of indium tin oxide layer, titanium dioxide layer, niobium dioxide layer, niobium trioxide layer, niobium dioxide layer, niobium pentoxide layer, At least one of a silicon dioxide layer and a zirconium dioxide layer.
The housing according to claim 6, wherein the decoration unit further comprises a base film, the base film is arranged on the first surface, the housing further comprises an adhesive layer, the adhesive layer is arranged Between the base film and the first surface, and the adhesive layer fixedly bonds the base film and the first surface, wherein the adhesive layer is connected to a side away from the reflective layer The base film is laminated on the side away from the first surface.
The housing according to claim 5, further comprising a pattern layer provided on the first surface of the epoxy resin, and the decoration unit covers the pattern layer.
The housing according to any one of claims 4-11, wherein the modified substance is selected from one of the silicone and the polyurethane prepolymer;

Alternatively, the modified product is composed of at least one of the silicone and the polyimide and the polyurethane prepolymer, and in the modified product, the quality of the polyurethane prepolymer The percentage content is above 60%;

Alternatively, the modified product is composed of the silicone and the polyimide in a mass ratio of 1:(0.1-0.2).
The housing according to any one of claims 4-11, wherein the epoxy resin layer has a second surface, and the housing further includes a hardened layer disposed on the second surface.
A manufacturing method of a shell includes the following steps:

Prepare an epoxy resin board, the material of the epoxy resin board is modified epoxy resin, the epoxy value of the modified epoxy resin is 0.25-0.45, and the modified epoxy resin is modified by the modified product The epoxy resin, the modified substance is selected from at least one of silicone, polyurethane prepolymer and polyimide, and the mass ratio of the modified substance to the epoxy resin is 1:5- 1:10; and

The epoxy resin board is bent and formed to obtain a shell.
The manufacturing method of the housing according to claim 14, further comprising a step of arranging a decoration unit on the epoxy resin board; and after the epoxy resin board is bent and formed, the epoxy resin board It has a concave surface, and the decoration unit is located on the concave surface.
The method of manufacturing a housing according to claim 15, wherein the step of arranging a decorative unit on the epoxy resin board is before the step of bending and forming the epoxy resin board, and the The step of arranging a decoration unit on the epoxy resin board includes: forming a transparent adhesive layer on one side of the epoxy resin board; forming a reflective layer on the side of the adhesive layer away from the epoxy resin board Forming an ink layer on the side of the reflective layer away from the adhesive layer to obtain the decorative unit.
The method of manufacturing a housing according to claim 15, wherein the step of arranging a decorative unit on the epoxy resin board is before the step of bending and forming the epoxy resin board, and the The step of arranging a decoration unit on the epoxy resin board includes: forming a transparent adhesive layer on a base film, forming a reflective layer on the adhesive layer, and forming an ink layer on the reflective layer to obtain the decoration Unit; bonding the side of the base film of the decorative unit away from the adhesive layer with the side of the epoxy resin board.
The method of manufacturing a housing according to claim 15, wherein the step of arranging a decoration unit on the epoxy resin board is after the step of bending and forming the epoxy resin board, and the The step of arranging a decoration unit on the epoxy resin board includes: forming a transparent adhesive layer on a base film, forming a reflective layer on the adhesive layer, and forming an ink layer on the reflective layer to obtain the decoration Unit; bonding the side of the base film of the decorative unit away from the adhesive layer with the concave surface of the epoxy resin board.
The manufacturing method of the shell according to any one of claims 16-18, wherein the adhesive layer is obtained by UV glue transfer, and the adhesive layer has a texture pattern.
The manufacturing method of the housing according to any one of claims 16-18, wherein the reflective layer is obtained by vacuum non-conductive electroplating.
The method for manufacturing a housing according to any one of claims 15-18, wherein before the step of arranging a decorative unit on the epoxy resin board, the method further comprises installing on one side of the epoxy resin board. The step of forming a pattern layer; the step of providing a decoration unit on the epoxy resin board includes: forming the decoration unit on the side of the epoxy resin board where the pattern layer is formed, and the decoration unit covers The pattern layer.
22. The manufacturing method of the housing according to claim 21, wherein the pattern layer is printed by mirror silver ink and dried.
The manufacturing method of the housing according to any one of claims 14-18, wherein the modified substance is selected from at least one of the silicone and the polyurethane prepolymer;

Alternatively, the modified product is composed of the polyimide and the polyurethane prepolymer, and in the modified product, the polyurethane prepolymer has a mass percentage of 60% or more;

Alternatively, the modified product is composed of the silicone and the polyimide in a mass ratio of 1:(0.1-0.2).
The manufacturing method of the housing according to any one of claims 14-18, wherein after the epoxy resin board is bent and formed, the epoxy resin board has a convex surface; and the After the step of bending and forming the epoxy resin board, it further includes a step of forming a hardened layer on the convex surface of the epoxy resin.
The method for manufacturing a housing according to any one of claims 14-18, wherein the method for bending the epoxy resin board is high pressure molding, and the process parameters of the high pressure molding include: The temperature is 90℃-150℃, the temperature of the heating plate is 150℃-300℃, the inflation pressure is 10Bar-30Bar, and the molding time is 60sec-150sec;

Alternatively, the method for bending and forming the epoxy resin board is hot press molding, and the hot press molding step includes: first placing the epoxy resin board in a lower mold, and the temperature of the heating plate is 250°C. Heat for 15 seconds-30 seconds at -380°C, and the lower mold temperature is 90°C-140°C; then close the upper film and the lower mold, and hold the pressure for 10 seconds-30 seconds, the upper mold temperature is 90°C ℃-130℃.
An electronic device, comprising the shell according to any one of claims 4-13 or the shell produced by the method for manufacturing the shell according to any one of claims 14-25.
The electronic device according to claim 26, wherein the electronic device is a mobile phone or a tablet computer, and the housing is a back cover.