CN113878952A

CN113878952A - Electronic equipment, shell and manufacturing method thereof

Info

Publication number: CN113878952A
Application number: CN202111107172.5A
Authority: CN
Inventors: 黄志勇; 陈益明
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2022-01-04

Abstract

The application mainly relates to an electronic device, a shell and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: performing semi-curing treatment on the glass fiber prepreg; respectively sticking a texture membrane on the front surface and the back surface of the glass fiber prepreg; and curing the glass fiber prepreg and the texture membrane. The manufacturing method provided by the application can realize the molding of the shell in the same process, and simultaneously, the texture layers are respectively formed on the front surface and the back surface of the shell, so that the manufacturing process of the shell and the texture layers on the shell is greatly simplified, the production efficiency is improved, and the production cost is reduced.

Description

Electronic equipment, shell and manufacturing method thereof

Technical Field

The present application relates to the field of electronic devices, and in particular, to an electronic device, a housing, and a method for manufacturing the same.

Background

With the increasing popularity of electronic devices, electronic devices have become indispensable social and entertainment tools in people's daily life, and people have increasingly high requirements for electronic devices. Taking an electronic device such as a mobile phone as an example, users are also increasingly concerned about the visual experience brought by the appearance of the casing (commonly called "battery cover" or "rear cover") of the mobile phone.

Disclosure of Invention

The embodiment of the application provides a manufacturing method of a shell, which comprises the following steps: performing semi-curing treatment on the glass fiber prepreg; respectively sticking a texture membrane on the front surface and the back surface of the glass fiber prepreg; and curing the glass fiber prepreg and the texture membrane.

The embodiment of the application also provides a shell, and the shell is manufactured by the manufacturing method of the embodiment.

The embodiment of the application also provides electronic equipment, and the electronic equipment comprises a display module and the shell, and the shell is connected with the display module.

The beneficial effect of this application is: compared with the prior art that two different processes are needed for forming the shell and the texture layer, and two different processes are needed for forming the texture layer on the two sides of the shell, the manufacturing method provided by the application can realize the forming of the shell in the same process, and simultaneously, the texture layer is formed on the front surface and the back surface of the shell respectively, so that the manufacturing processes of the shell and the texture layer thereon are greatly simplified, the production efficiency is improved, and the production cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic disassembled structural diagram of an embodiment of an electronic device provided in the present application;

FIG. 2 is a schematic flow chart illustrating an embodiment of a method for manufacturing a housing according to the present disclosure;

fig. 3 is a schematic structural diagram of the housing provided in the present application corresponding to different processes in the manufacturing process;

fig. 4 is a schematic structural diagram of the housing provided in the present application corresponding to different processes in the manufacturing process;

fig. 5 is a schematic structural diagram of the housing provided in the present application corresponding to different processes in the manufacturing process;

FIG. 6 is a schematic structural diagram of an embodiment of a forming die provided herein;

fig. 7 is a schematic structural diagram corresponding to different processes in the manufacturing process of the housing provided by the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic view of a disassembled structure of an embodiment of an electronic device provided in the present application.

In the present application, the electronic device 10 may be a portable device such as a mobile phone, a tablet computer, and a smart watch. In this embodiment, the electronic device 10 is taken as a mobile phone for exemplary explanation.

Referring to fig. 1, an electronic device 10 may include a display module 11, a middle frame 12, and a housing 13. The display module 11 and the housing 13 are respectively located on two opposite sides of the middle frame 12, and can be assembled and connected with the middle frame 12 through one or a combination of assembling modes such as gluing, clamping, welding and the like, so that a basic structure that the display module 11 and the housing 13 clamp the middle frame 12 together is formed after the three are assembled. Further, a cavity with a certain volume may be formed between the display module 11 and the housing 13, and the cavity may be used to set structural members such as the camera module 14, the main board 15, and the battery 16, so that the electronic device 10 can implement corresponding functions. The display module 11, the camera module 14 and other components may be electrically connected to the main board 15, the battery 16 and the like through a Flexible Printed Circuit (FPC), so that they can be supplied with electric power from the battery 16 and can execute corresponding commands under the control of the main board 15.

Further, the edge of the display module 11 may be bent toward the middle frame 12, so that the image displayed on the display module 11 may extend from the front surface of the display module 11 to the side surface thereof in a form similar to a "waterfall". So set up, not only can reduce or even hide the black edge of display module assembly 11 to make electronic equipment 10 can provide bigger demonstration field of vision for the user, can also make display module assembly 11 build a visual effect around the demonstration, thereby make electronic equipment 10 bring one kind and be different from bang screen, water droplet screen, dig the visual experience of flat full-face screen such as hole screen, over-and-under type camera, sliding closure type camera for the user, and then increase electronic equipment 10's competitiveness. Accordingly, the edge of the housing 13 may also be curved toward the middle frame 12, so as to improve the grip feel and aesthetic appearance of the electronic device 10.

Next, a method of manufacturing the housing 13 and a form of a product obtained by the method will be described as an example.

Referring to fig. 2, fig. 2 is a schematic flow chart illustrating a manufacturing method of the housing according to an embodiment of the present disclosure. It should be noted that: for convenience of description, the steps of fabricating a certain housing will be described in a specific order below; however, the housing may be made in a different order of steps, with additional steps added or certain steps reduced (combined).

Step S101: and performing semi-curing treatment on the glass fiber prepreg.

For example, the material of the housing base 131 in the housing 13 may be glass fiber, and other films such as the texture layer 132, the optical coating layer 133, and the cover bottom layer 134 may be formed on the housing base 131. The housing base 131 is mainly used to satisfy the structural requirement of strength/hardness of the housing 13 to resist external impact; the other film layers are mainly used to satisfy the colorful appearance requirement of the housing 13. Therefore, when the housing 13 is applied to the electronic device 10, other film layers may be mainly located on the side of the housing base 131 facing the inside of the electronic device 10 so as not to be scraped.

Generally, the glass fiber can have three forms of a prepreg, a semi-curing material and a curing material, and the manufacturing method provided by the application can fully utilize different characteristics corresponding to different forms of the glass fiber. In particular, the method of manufacturing a semiconductor device,

prepreg preparation: the glass fiber woven cloth is used as a main body, resin is filled in the glass fiber woven cloth in a soaking mode, and then a single-layer material with a certain thickness is formed. The glass fiber woven cloth can be unidirectional fiber cloth, checkered cloth, twill cloth, multi-axial cloth and the like so as to meet the strength requirement of glass fibers; the resin can be epoxy resin, phenolic resin or a mixture of epoxy resin and phenolic resin, so as to meet the requirements of orientation and bonding of the glass fiber. Further, the mass ratio of the glass fiber woven cloth to the resin may be 40-60%: 40-60 percent. It is worth noting that: in order to allow the film layers such as the texture layer 132, the optical coating layer 133, and the cover bottom layer 134 to be displayed, the light transmittance of the case base 131 may be greater than or equal to 80%; accordingly, the resin may be preferably a transparent material.

Semi-curing material: the prepreg (i.e., prepreg) is cured at a low temperature (e.g., 40 ℃ to 80 ℃) to form a single-layer board material with certain strength. At this time, the structural strength of the prepreg is still low, basically for maintaining a solid basic state, and correspondingly soft for storage and transportation. Typically, the prepreg can be made as thin as 0.04mm, with a typical thickness of 0.06 mm.

Curing materials: the prepreg is subjected to high temperatures (e.g., 90 c to 180 c) and formed into a specific shape with the aid of a forming die. At the moment, the curing material has good structural strength and can meet corresponding use requirements.

Based on the above description, the glass fiber prepreg described in the present application is a glass fiber prepreg. Therefore, the semi-curing treatment of the glass fiber prepreg can refer to that the glass fiber prepreg is subjected to a low-temperature (for example, 40 ℃ to 80 ℃) treatment so as to form a single-layer board material with certain strength. The glass fiber prepreg can be stacked in multiple layers, so that the thickness of the glass fiber prepreg after the semi-curing treatment can be between 0.18mm and 0.55mm, and the finally manufactured shell 13 can be light, thin and structurally strong. For example: the thickness of the semi-cured material is 0.3mm, and 4 layers of glass fiber prepreg are adopted; for another example: the thickness of the semi-cured material is 0.4mm, and 5 layers of glass fiber prepreg are adopted. Of course, in other embodiments, the prepreg may be only one layer, but the thickness of one layer of prepreg may be 0.3mm or 0.4 mm.

It should be noted that: based on the structural parameters such as the shape and the size of the housing 13, the glass fiber prepreg can be cut before or after the semi-curing treatment, and a certain margin can be left.

Step S102: and respectively sticking a texture membrane on the front surface and the back surface of the glass fiber prepreg.

By way of example, after the glass fiber prepreg is subjected to semi-curing treatment, a semi-cured material with certain thickness and certain strength can be formed. For example, the thickness of the semi-solidified material is 0.3mm or 0.4 mm. At this time, the front and back surfaces of the prepreg may be respectively attached with the textured film 100, that is, a "sandwich" laminated structure in which two layers of textured films 100 sandwich the glass fiber, so as to prepare for the subsequent processes. The glass fiber prepreg can be attached to the texture membrane 100 through the viscosity of resin of the glass fiber prepreg, and can also be attached to the texture membrane 100 through additional adhesive such as UV adhesive and OCA adhesive.

In some embodiments, referring to fig. 3, fig. 3 is a schematic structural diagram of the housing provided in the present application corresponding to different processes in the manufacturing process, and the textured film 100 may include a substrate 101 and a textured layer 132 formed on the substrate 101. The base material 101 may be a film made of a polymer material with certain flexibility, and the specific material may be Polyethylene terephthalate (PET), Polyvinyl chloride (PVC), Thermoplastic polyurethane elastomer (TPU), and the like, which is not limited herein. The thickness of the base material 101 may be selected from common specifications such as 20 μm, 30 μm, 50 μm, 80 μm, 125 μm, and the like; it is verified that the thickness of the substrate 101 is preferably 50 μm when the subsequent application of the curing glue is ensured. The texture layer 132 may be made of Ultraviolet (UV) curable glue, and may be formed into a specific texture through a transfer process, so as to enrich the appearance of the housing 13. Generally, if the texture layer 132 is too thin, the texture is less effective, and if the texture layer 132 is too thick, the texture layer 132 is brittle, resulting in poor adhesion. Therefore, the thickness of the texture layer 132 may be between 5 μm and 20 μm, for example, 5 μm, 10 μm, 15 μm, 20 μm, etc., and may be selected according to actual requirements. At this time, the substrate 101 may be bonded to the glass fiber prepreg (i.e., the housing body 131). In other words, the texture layer 132 is farther away from the housing base 131 than the substrate 101. Of course, in other embodiments, the texture layer 132 may be attached to the fiberglass prepreg. Further, in this embodiment, the base material 101 may be left as a part of the finally manufactured housing 13.

In other embodiments, referring to fig. 4, fig. 4 is a schematic structural diagram of the housing provided in the present application corresponding to different processes in the manufacturing process, and the textured film 100 may include a substrate 101, and a release layer 102 and a textured layer 132 sequentially formed on the substrate 101. The release layer 102 may be paraffin, polyethylene, silicone, or phenol release agent to allow the texture layer 132 to be separated from the substrate 101. At this time, the texture layer 132 may be attached to the glass fiber prepreg (i.e., the housing substrate 131). In other words, the texture layer 132 is closer to the housing body 131 than the substrate 101. Further, in this embodiment, the substrate 101 may be used only for supporting the texture layer 132, and may be removed in the manufacturing process of the housing 13, for example, the substrate 101 is torn off after the step S103, that is, the housing 13 does not have the substrate 101. Of course, the release layer 102 may also be removed during the manufacturing process of the housing 13, for example, after the substrate 101 is torn off, the release layer 102 is further cleaned for the subsequent processes.

In other embodiments, referring to fig. 5, fig. 5 is a schematic structural diagram corresponding to different processes in the manufacturing process of the housing provided by the present application, and the front surface of the housing substrate 131 may be the textured film shown in fig. 4, and the back surface may be the textured film shown in fig. 3. Specifically, the front surface of the housing base 131 may be the texture layer 132 which is attached to the glass fiber prepreg, and the substrate 101 is removed; the opposite side of the housing base 131 may be formed by bonding the substrate 101 and the glass fiber prepreg, and the texture layer 132 is further away from the housing base 131 than the substrate 101.

It should be noted that: the front surface is a surface of the shell 13 deviating from the display module 11, namely an outer surface; the reverse surface described herein is the surface of the housing 13 facing the display module 11, i.e., the inner surface. Further, the textured film 100 may be separately manufactured or purchased.

Step S103: and curing the glass fiber prepreg and the texture membrane.

As an example, the "sandwich" laminate structure obtained in step S102 may be placed in a forming mold 200. With reference to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of the forming mold provided by the present application, and the forming mold 200 may include a female mold 201 and a male mold 202, where the male mold 202 and the female mold 201 are closed to form a cavity 203 (i.e., a space region where a "sandwich" stacked structure is located). Therefore, the glass fiber prepreg and the texture membrane are placed in the concave die 201, and then the convex die 202 and the concave die 201 are matched. Wherein, the concave die 201 can have a positioning structure. At this time, the "sandwich" laminate structure may be deformed according to the spatial form of the cavity 203 because the glass fibers are still in a semi-cured state. Therefore, the glass fiber prepreg and the textured membrane can be subjected to high-temperature and high-pressure treatment in the forming mold 200, and the resin in the glass fiber prepreg is further cured immediately, so that the sandwich laminated structure is cured and formed. Wherein the curing temperature may be between 80 ℃ and 160 ℃, preferably between 100 ℃ and 110 ℃; the curing pressure can be 30MPa, and the dwell time can be between 5min and 14 min.

Further, the form of the housing 13 may depend on the cavity 203 of the molding die 200. Therefore, referring to fig. 6, after the male mold 202 and the female mold 201 are clamped, the glass fiber prepreg and the textured film sheet may be partially located on the side of the male mold 202, so that the shape of the shell 13 is 2.5D or 3D. When the male mold 202 and the female mold 201 are closed, the edge of the sandwich structure may be pressed (commonly referred to as "pressing edge") to facilitate the deformation of the sandwich structure, and the pressing edge may be removed by, for example, a CNC process after curing and forming. In this way, the basic structure (e.g., sandwich "laminated structure) and the basic form (e.g., 2.5D or 3D) of the housing 13 can be formed at one time in the same process, thereby realizing the 3D positive and negative texture effect and increasing the appearance quality of the housing 13. Of course, in other embodiments, the basic form of the housing 13 may be a flat plate instead of a curved shape such as 2.5D or 3D.

In the related art, the basic form of the housing may be 2.5D or 3D, and the material of the housing substrate may be a composite plate (PC + PMMA) or glass. For the texture layer, the corresponding processing techniques can be generally classified into the following two types:

firstly, a composite board (PC + PMMA) multi-texture processing technology comprises the following steps: transfer printing textures on the PC side of the composite plate → optical coating → black bottom ink covering → high-pressure molding → transfer printing textures on the PMMA side of the composite plate. The processing technology is that the texture and the effect of one side are firstly made, and then the texture of the other side is made on a 2.5D or 3D structure formed by high pressure, so that the processing technology is complex. In this case, the total thickness of the case is generally 0.55 mm.

Secondly, the glass multi-texture processing technology comprises the following steps: glass hot bending molding → front and back surface polishing → front surface etching texture → back surface attaching with a textured membrane, wherein the texture processing of the membrane is to independently perform transfer printing texture, optical coating and bottom covering on a PET material. The process requires etching of the texture and is also complicated. In this case, the total thickness of the case is generally 0.6 mm.

Based on the above description, the present application utilizes the characteristics of the glass fiber to realize the molding of the housing (i.e. the cured glass fiber prepreg) in the same process, and simultaneously forms a texture layer on the front and back surfaces of the housing. Compared with the prior art that two different processes are needed for forming the shell and the texture layer, and two different processes are needed for forming the texture layer on the two sides of the shell, the manufacturing method provided by the application can greatly simplify the manufacturing processes of the shell and the texture layer thereon, improve the production efficiency and reduce the production cost.

Further, with reference to fig. 3 to 5, after step S103, film layers such as an optical coating layer 133 and a cover bottom layer 134 may be sequentially formed on the textured film (i.e., the inner surface of the housing 13) opposite to the glass fiber prepreg, so that the housing 13 may have more gorgeous appearance quality. In the case of the housing 13 shown in fig. 3 to 5, the optical coating layer 133 and the cover bottom layer 134 may be sequentially formed on the texture layer 132.

The optical coating layer 133 may include at least one of zirconia, titania, and silica, and may be formed by a vacuum coating process to have a high reflectance, thereby exhibiting an appearance effect of high color superposition. The optical coating layer 133 is matched with the texture layer 132, so that the reflection effect of the texture is more gorgeous, and the visual layering sense is favorably increased.

In the technical field of vacuum coating, the coating types are generally divided into two types according to the film thickness: a film with a thickness of more than 200nm may be called a thick plating film, and a film with a thickness of less than 200nm may be called a thin plating film. The reflective hue of the coating can have hues such as blue, golden yellow, pink and the like according to the thickness of the coating. It is worth noting that: compared with a thin coating film, the thick coating film has wide reflection wave band and high reflectivity, and the visual performance is more dazzling and brighter; however, when the film thickness exceeds 450nm, due to the limitation of coating stress and the capability of electron gun equipment, the film layer is volatile in the testing process, and the defects of film layer falling, cracking or UV aging discoloration and the like occur, so that the further improvement of the appearance effect is limited.

Illustratively, the optical coating layer 133 is formed by depositing zirconium, titanium and silicon on the textured membrane 100 opposite the "sandwich" laminate structure by a vacuum coating process under an oxygen atmosphere to form layers of zirconium oxide, titanium oxide and silicon oxide, respectively. Based on the above description, the optical coating layer 133 may be a thin coating film or a thick coating film. Since the optical coating layer 133 is formed after step S103, it is possible to prefer a thick coating film. Based on this, the optical coating layer 133 may be primed with zirconia on which titania and silica are formed in a multi-layer stacked combination. The thickness of the optical coating layer 133 may be between 200nm and 450nm, such as 200nm, 300nm, 450nm, and may be specifically selected according to actual requirements; the reflectivity may be 60% to 75%, for example, 60%, 65%, 70%, 75%, etc., and may be selected according to actual requirements.

The cover bottom layer 134 may be made of ink, and may be formed on the optical coating layer 133 by a screen printing process to set off the color of the optical coating layer 133, protect the optical coating layer 133, and meet the fire protection requirement of the housing 13. Specifically, the bottom cover layer 134 may include a main color layer and a fire-retardant ink layer, the former is generally white ink or black ink, black is mainly used for reflecting the color of the optical coating layer 133, and white is mainly used for displaying the transmission color of the optical coating layer 133; the latter is typically a gray ink and may have added to it a fire-blocking filler, such as an acrylic/isocyanate polyurethane curing system, to improve the fire-blocking properties of the housing 13. The thickness of the cover bottom layer 134 may be between 5 μm and 20 μm, for example, 5 μm, 10 μm, 15 μm, 20 μm, and the like, and may be selected according to actual requirements; in order to achieve better flame retardant and covering effects, 2-3 lines of fireproof ink layers are generally needed to be silk-screened.

As an example, a main color layer, such as white ink or black ink, is formed on the optical coating layer 133 by a screen printing process; and forming a fireproof ink layer on the main color layer, for example, adding a fireproof filler into gray ink, wherein the fireproof filler can be a polyurethane curing system prepared from acrylic acid/isocyanate, and further obtaining the cover bottom layer 134.

Referring to fig. 7, fig. 7 is a schematic structural diagram of the housing provided in the present application corresponding to different processes in the manufacturing process, the texture layer 132, the optical coating layer 133, and the cover bottom layer 134 may be sequentially formed on the substrate 101, so as to obtain an optical film 300, and the optical film 300 is attached to the texture film (i.e., the inner surface of the housing 13) on the reverse side of the glass fiber prepreg.

It should be noted that: the texture layer 132 and the optical coating layer 133 on the inner surface of the housing 13 may be alternately arranged in sequence according to actual appearance requirements, for example, a stacked structure of the texture layer 132, the optical coating layer 133, and the cover bottom layer 134.

Based on the above detailed description, the housing manufactured by the manufacturing method described in the present application may have the following laminated structure: the back surface of the shell realizes single-layer texture, single-layer optical coating, double-layer texture, double-layer optical coating or a combination thereof, and the front surface of the shell realizes single-layer texture. Compared with the related technology in which the total thickness of the composite board shell is 0.55mm and the total thickness of the glass shell is 0.6mm, the technical scheme in the application can realize a similar laminated structure by using the double-layer texture and the single-layer optical coating, and the total thickness of the shell can be thinner, that is, the thickness of the shell body is 0.3mm (cured glass fiber) +10 μm front texture layer +10 μm back texture layer +200nm optical coating layer +10 μm cover bottom layer is 0.3302 μm. Moreover, the density of glass fiber is generally 1.9g/cm3, the density of composite board is generally 1.2g/cm3, and the density of glass is generally 2.5g/cm3, and the casing that this application provided still is favorable to reducing weight when the attenuate, and then realizes the frivolous design of casing.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A method of making a housing, the method comprising:

performing semi-curing treatment on the glass fiber prepreg;

respectively sticking a texture membrane on the front surface and the back surface of the glass fiber prepreg;

and curing the glass fiber prepreg and the texture membrane.

2. The manufacturing method according to claim 1, wherein after the step of curing the glass fiber prepreg and the textured film, the method further comprises:

sequentially forming an optical coating layer and a cover bottom layer on the texture film on the reverse side of the glass fiber prepreg;

or, an optical film is pasted on the texture film on the reverse side of the glass fiber prepreg, and the optical film comprises a base material, and a texture layer, an optical coating layer and a cover bottom layer which are sequentially formed on the base material.

3. The method of claim 2, wherein the optical coating layer comprises at least one of zirconia, titania, and silica, and the optical coating layer has a thickness between 200nm and 450 nm.

4. The manufacturing method of claim 1, wherein the textured film comprises a substrate and a textured layer formed on the substrate, and the substrate is attached to the glass fiber prepreg.

5. The manufacturing method of claim 1, wherein the textured film comprises a substrate, and a release layer and a texture layer which are sequentially formed on the substrate, and the texture layer is attached to the glass fiber prepreg;

after the step of curing the glass fiber prepreg and the texture membrane, the method further comprises the following steps:

removing the substrate.

6. A method of manufacture as claimed in claim 4 or claim 5, in which the textured layer has a thickness of between 5 μm and 20 μm.

7. The manufacturing method according to claim 1, wherein the step of curing the glass fiber prepreg and the textured film sheet comprises:

placing the glass fiber prepreg and the texture membrane into a female die of a forming die;

matching the male die of the forming die with the female die of the forming die;

and after the male die and the female die of the forming die are closed, the glass fiber prepreg and the texture membrane are partially positioned on the side surface of the male die of the forming die.

8. The manufacturing method according to claim 1, wherein the glass fiber prepreg is laminated in a multilayer manner so that the thickness of the glass fiber prepreg after semi-curing is between 0.18mm and 0.55 mm.

9. A housing, characterized in that it is manufactured by the method of manufacture according to any one of claims 1 to 8.

10. An electronic device, comprising a display module and the housing of claim 9, wherein the housing is connected to the display module.