CN213462651U

CN213462651U - Shell assembly and electronic equipment

Info

Publication number: CN213462651U
Application number: CN202022771722.0U
Authority: CN
Inventors: 黄志勇
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-06-15
Anticipated expiration: 2030-11-25

Abstract

The application relates to a shell assembly and an electronic device. The housing assembly of the present application includes: a fiber resin layer including a fiber cloth and a resin impregnated in the fiber cloth; and the cortical layer is adhered to the surface of one side of the fiber resin layer, and is bonded with the fiber resin layer through the resin. The housing assembly of the present application can be made thinner.

Description

Shell assembly and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to a shell assembly and electronic equipment.

Background

In order to avoid homogenization of the appearance of the electronic equipment, leather is arranged on the surface of the electronic equipment shell, so that the electronic equipment shell has the appearance effect and the hand feeling of the leather, and the texture is improved. However, the thickness of the shell of the electronic device with leather appearance and hand feeling is larger at present, so that the thickness of the whole electronic device is influenced, and the experience effect of consumers is reduced.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present application provides a housing assembly and an electronic device, in which the thickness of the housing assembly can be made thinner.

The application provides a casing subassembly, it includes: a fiber resin layer including a fiber cloth and a resin impregnated in the fiber cloth; and

and the cortical layer is adhered to the surface of one side of the fiber resin layer, and is bonded with the fiber resin layer through the resin.

Based on the same concept, the application also provides an electronic device, which comprises the shell assembly; the cortical layer is arranged on the outer surface of the electronic device.

From this, the casing subassembly of this application adopts the fibre resin layer as the substrate for the casing subassembly is under the same mechanical strength, and thickness can be done thinly, simultaneously, the fibre resin layer includes fibre cloth and soaks the resin of fibre cloth, through the resin with the cortex bonding extremely the fibre resin layer need not to use the hot melt adhesive, has further reduced casing subassembly's thickness, has still simplified preparation technology.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a housing assembly according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of a housing assembly according to yet another embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a housing assembly according to still another embodiment of the present application.

Fig. 4 is a schematic flow chart of a method of manufacturing a housing assembly according to an embodiment of the present application.

Fig. 5 is a schematic flow chart of a method for manufacturing a fiber semi-cured resin sheet according to an embodiment of the present application.

Fig. 6 is a schematic flow chart of a method for preparing a cortical layer according to an embodiment of the present application.

Fig. 7 is a schematic flow chart of a method for preparing a cortical layer according to yet another embodiment of the present application.

Fig. 8 is a schematic flow chart of a method for preparing a cortical layer according to yet another embodiment of the present application.

Fig. 9 is a schematic flow chart of a method for preparing a cortical layer according to yet another embodiment of the present application.

Fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

Referring to fig. 1 and 2, an embodiment of the present application provides a housing assembly 100, which includes: a fiber resin layer 10, the fiber resin layer 10 including a fiber cloth 11 and a resin 13 impregnated in the fiber cloth 11; and a cortical layer 30, wherein the cortical layer 30 is adhered to the surface of one side of the fiber resin layer 10, and the cortical layer 30 is bonded with the fiber resin layer 10 through the resin 13.

The term "impregnation" in this application refers to the condition that the resin is wrapped around and enters the fiber cloth, including the condition that the resin 13 wraps the whole fiber cloth 11, and may also include the condition that the resin 13 wraps and infiltrates gaps between the fiber threads or fiber filaments of the fiber cloth 11, that is, the resin 13 wraps the periphery of each fiber thread or each fiber filament. When resin soaks each strand of fiber line or each fiber silk, can make fibre cloth 11 more evenly distributed in resin 13, the structural distribution of fibre resin layer 10 is more even, has higher mechanical strength.

The shell assembly 100 of this application adopts fibre resin layer 10 as the substrate for shell assembly 100 is under the same mechanical strength, and thickness can be made thinner, and simultaneously, fibre resin layer 10 includes fibre cloth 11 and soaks fibre cloth 11's resin 13, through resin 13 with cortex 30 bonding extremely fibre resin layer 10 need not to use the hot melt adhesive, has further reduced shell assembly 100's thickness, has still simplified preparation technology.

Alternatively, the shape of the housing assembly 100 may be a 2D shape, a 2.5D shape, a 3D shape, or the like. The housing assembly 100 may be, but is not limited to, a rear cover, a center frame, a decoration, etc. of an electronic device.

Optionally, the thickness of the housing assembly 100 is 0.58mm to 1.0 mm. Further, the thickness of the housing assembly 100 is 0.58mm to 0.8 mm. Further, the thickness of the housing assembly 100 is 0.58mm to 0.7 mm. This allows the electronic device including the housing assembly 100 to have a thinner thickness, which improves the user experience. Specifically, the thickness of the housing assembly 100 may be, but is not limited to, 0.58mm, 0.6mm, 0.63mm, 0.65mm, 0.68mm, 0.7mm, 0.75mm, 0.8mm, 0.9mm, 1.0 mm.

In some embodiments, the fiber resin layer 10 has a thickness of 0.3mm to 0.5 mm. Further, the fiber resin layer 10 has a thickness of 0.3 to 0.4 mm. Specifically, the thickness of the fiber resin layer 10 may be, but not limited to, 0.3mm, 0.32mm, 0.35mm, 0.38mm, 0.4mm, 0.43mm, 0.46mm, 0.5mm, and the like. When the thickness of the fiber resin layer 10 is within this range, the mechanical strength of the housing assembly 100 can be ensured, and meanwhile, the thickness of the housing assembly 100 can be reduced well, and the experience of a user is improved.

In some embodiments, the stiffness of the fiber resin layer 10 under a load of 3N is 3550N/m to 12000N/m. Specifically, the rigidity of the fiber resin layer 10 may be, but is not limited to, 3550N/m, 4000N/m, 4500N/m, 5000N/m, 5500N/m, 6000N/m, 7000N/m, 8000N/m, 9000N/m, 10000N/m, 11000N/m, 12000N/m, and the like. At this time, the mechanical strength of the housing assembly 100 can satisfy the use requirement, and at the same time, the thickness of the housing assembly 100 can be reduced to the maximum.

In some embodiments, the fiber resin layer 10 is at least three layers, and at least three fiber resin layers 10 are stacked. Specifically, the fiber resin layer 10 may be, but not limited to, 3, 4, 5, 6, 7, or the like.

Alternatively, the thickness of the single fiber resin layer 10 is 0.05mm to 0.1 mm. Specifically, the thickness of the single fiber resin layer may be, but not limited to, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.

In some embodiments, the fiber cloth 11 may be an inorganic fiber cloth or an organic fiber cloth. When the fiber cloth 11 is an inorganic fiber cloth, it can better enhance the strength of the fiber resin layer 10, so that the housing assembly 100 and the electronic device using the housing assembly 100 can be made thinner.

In some embodiments, the inorganic fiber cloth can be a glass fiber cloth, such as an alkali-free glass fiber cloth (e.g., borosilicate glass), a medium-alkali glass fiber cloth (e.g., soda-lime-silicate glass containing boron or not), a high-alkali glass fiber cloth (e.g., soda-silicate glass), a high-strength glass fiber cloth, an alkali-resistant glass fiber cloth, a boron-free alkali-free glass fiber cloth, a low-dielectric glass fiber cloth, a fluorine-free glass fiber, and the like. The glass fiber cloth has low cost, good insulation, strong heat resistance, good corrosion resistance and high mechanical strength, and when the glass fiber cloth is used as a base material of the shell assembly 100, the shell assembly 100 can have a thinner thickness while the mechanical strength of the shell assembly 100 is ensured.

In other embodiments, the inorganic fiber cloth may be an inorganic fiber cloth formed by one or more of carbon fiber cloth, quartz glass fiber, boron fiber, ceramic fiber and metal fiber.

In some embodiments, the organic fiber cloth may be, but is not limited to, an organic fiber cloth having high mechanical properties, such as aramid, ultra-high molecular weight polyethylene fiber, poly-p-phenylene benzobisoxazole fiber, poly-p-benzimidazole fiber, poly-p-phenylene pyridobisimidazole fiber, polyimide fiber, and the like.

In some embodiments, the fiber cloth 11 is a woven cloth with fibers arranged in a crossed manner. Specifically, the fiber cloth 11 is formed by weaving or knitting a plurality of strands of inorganic fiber threads. Alternatively, the fiber cloth 11 is formed of a plurality of inorganic fiber threads which are staggered in the transverse and longitudinal directions. Specifically, each of the inorganic fiber threads is formed by kneading a plurality of inorganic fiber filaments, for example, 500, 1000, 2000, 3000, 5000, 1 ten thousand or 1.2 ten thousand inorganic fiber filaments, and the present application is not particularly limited.

In other embodiments, each layer of fiber cloth 11 is a fiber cloth with fibers arranged in the same direction, each layer of fiber cloth 11 includes a plurality of fiber lines, the fiber lines of each layer of fiber cloth 11 are arranged unidirectionally, and the extending directions of the fiber lines of two adjacent layers of fiber cloth have an included angle. Specifically, the plurality of fiber threads of the same layer of fiber cloth 11 extend along the same direction, and the extending directions of the fiber threads of the adjacent two layers of fiber cloth 11 have an included angle. Further, the included angle of the fiber lines of the two adjacent layers of fiber cloth 11 may be, but not limited to, 30 °, 45 °, 60 °, 70 °, 80 °, or 90 °. When the included angle of the fiber lines of the two adjacent layers of fiber cloth 11 is 90 °, the prepared fiber resin layer 10 has better mechanical strength, and the thickness of the shell assembly 100 can be made thinner while the mechanical strength is satisfied.

In some embodiments, resin 13 may be, but is not limited to, an epoxy resin, such as a bisphenol a epoxy resin. The epoxy resin has good adhesive property, chemical resistance, physical mechanical property and electrical insulation property, and the fiber resin layer 10 can have better mechanical strength after the first fiber cloth 11 is impregnated with the epoxy resin, so that good mechanical property can be ensured only by the thinner fiber resin layer 10. Meanwhile, the epoxy resin has a semi-cured state, after the first fiber cloth 11 is impregnated with the epoxy resin monomer mixed solution, the pre-cured state can be performed at a predetermined temperature (for example, 70 ℃ to 80 ℃) to form a semi-cured resin which is solid at normal temperature, and when the epoxy resin is heated to the curing temperature again, the epoxy resin still has fluidity and viscosity, and the cortical layer 30 can be bonded to the fiber resin layer 10 by using the viscosity thereof, without using a hot melt adhesive, and the curing of the epoxy resin and the bonding of the cortical layer 30 are performed simultaneously, thereby further simplifying the preparation process.

In other embodiments, the resin 13 may also be a phenolic resin, a polyester resin, a thermoplastic resin, or the like.

The resin 13 in the examples of the present application may be formed by curing a commercially available resin monomer mixture, or may be formed by curing a resin monomer mixture obtained by a known production method, and the present application is not particularly limited.

In some embodiments, the cortical layer 30 is 0.28mm to 0.5mm thick. Specifically, the thickness of the cortical layer 30 may be, but is not limited to, 0.28mm, 0.3mm, 0.32mm, 0.35mm, 0.88mm, 0.4mm, 0.43mm, 0.45mm, 0.48mm, 0.5mm, and the like.

Referring to fig. 1, in some embodiments, the leather layer 30 includes a substrate 31, a color texture layer 33, and a protective layer 35 sequentially stacked; the substrate 31 is bonded to the fiber resin layer 10, and the surface of the color texture layer 33 away from the substrate 31 (i.e., the surface close to the protective layer 35) is provided with a texture structure. Specifically, the surface of the color texture layer 33 away from the substrate 31 is provided with a plurality of textures, which may be, but not limited to, textures that can make the housing assembly 100 have a glittering function, a leather texture, and the like, which can increase the appearance effect of the housing assembly 100. Specifically, the texture structure having the glittering function may be formed by, but not limited to, providing a coating layer having high reflectivity on a surface of the texture structure.

In this embodiment, the substrate 31 is a thermoplastic polyurethane substrate. When the substrate 31 is a thermoplastic polyurethane substrate, the thickness of the resulting cortical layer 30 is thinner because the thermoplastic polyurethane substrate can be made thinner. Meanwhile, since the thermoplastic polyurethane substrate itself is soft and elastic, the leather layer 30 can have a better leather touch, and thus, when the thermoplastic polyurethane substrate is used as the substrate, the leather touch can be realized without providing a foaming layer and an adhesive layer described below. Specifically, the material of the thermoplastic polyurethane substrate includes, but is not limited to, one or more of polyester polyurethane (e.g., spandex), polyether polyurethane, and the like.

In the present embodiment, the material of the color texture layer 33 includes, but is not limited to, one or more of polyurethane, polyvinyl chloride, and the like. The color texture layer 33 imparts the texture of leather to the cortical layer 30. Optionally, the raw material composition of the color texture structure 33 may further include a pigment, and the cortical layer 30 may present different color appearance effects by controlling the color and the proportion of the pigment. The specific gravity of the pigment in the color texture layer 33 is 0.5% to 5%, and specifically may be 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, or the like. The color texture layer 33 may be formed by being formed on a release paper by a process such as casting, coating (spray coating, spin coating, etc.), and then transferred to the substrate 31. The color texture layer 33 also serves as a hardness layer for the leather layer 30, so that the color texture layer 33 can be better prevented from being scratched in the using process, and the shell assembly 100 has a longer service life.

In the present embodiment, the material of the protective layer 35 includes, but is not limited to, one or more of polyurethane, polyvinyl chloride, and the like. The raw material composition of the protective layer 35 may further include a protective agent such as an antioxidant. The protective layer 35 is used to provide the leather layer 30 with good properties of stain resistance, fingerprint resistance, yellowing resistance, etc. The protective layer 35 is made of a transparent material, the light transmittance of the protective layer 35 is greater than 80%, and further, the light transmittance of the protective layer 35 is greater than 88%. So that the color effect and texture effect of the color texture layer 33 can be observed through the protective layer 35. Specifically, the light transmittance of the protective layer 35 may be, but is not limited to, 80%, 85%, 88%, 90%, 92%, 95%, etc.

In this embodiment, the thermoplastic polyurethane substrate has a thickness of 0.25mm to 0.3 mm; specifically, the thermoplastic polyurethane substrate may have a thickness of, but not limited to, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.30mm, and the like. The thickness of the color texture layer 33 is 0.02mm to 0.05 mm; specifically, the thickness of the color texture layer 33 may be, but is not limited to, 0.02mm, 0.025mm, 0.03mm, 0.035mm, 0.04mm, 0.045mm, 0.05mm, and the like. The thickness of the protective layer 35 is 0.01mm to 0.03 mm; specifically, the thickness of the protective layer 35 may be, but is not limited to, 0.01mm, 0.015mm, 0.018mm, 0.02mm, 0.025mm, 0.03mm, and the like.

In this embodiment, the main material of the color texture layer 33 and the protective layer 35 may include polyurethane, so that the substrate 31, the color texture layer 33 and the protective layer 35 can be better bonded together during processing.

Referring to fig. 2, fig. 2 is another embodiment of the housing assembly 100, and the difference between the embodiment of fig. 2 and the embodiment of fig. 1 is that the leather layer 30 further includes a foaming layer 37 and an adhesive layer 39 disposed between the substrate 31 and the color texture layer 33 and stacked together; the foam layer 37 is disposed adjacent to the substrate 31 and the adhesive layer 39 is disposed adjacent to the color texture layer 33.

In this embodiment, the substrate 31 is a dacron substrate. The material of the polyester substrate includes, but is not limited to, one or more of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), wholly aromatic polyester fiber, and the like.

The material of the foaming layer 37 includes, but is not limited to, one or more of polyurethane, polyvinyl chloride, and the like. In particular, the polyurethane may be, but is not limited to, a polyester polyurethane or a polyether polyurethane. In addition, the raw material components forming the foaming layer 37 may further include various auxiliary agents such as a foaming agent, a catalyst, a flame retardant, and the like. The foaming layer 37 can make the leather layer 30 have better leather texture, improve the hand feeling of the housing assembly 100, and improve the user experience.

The material of the adhesive layer 39 includes, but is not limited to, one or more of polyurethane, epoxy resin, polyvinyl chloride, and the like. The adhesive layer 39 is used to enable the foamed layer 37 and the color texture layer 33 to be better adhered, so as to better prevent the structures of the leather layer 30 from being separated after a period of use, and improve the service life of the leather layer 30.

In the present embodiment, the thickness of the polyester substrate is 0.3mm to 0.35 mm; specifically, the thickness of the polyester substrate may be, but is not limited to, 0.3mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, and the like. The thickness of the foaming layer 37 is 0.05mm to 0.1 mm; specifically, the thickness of the foamed layer 37 may be, but is not limited to, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, and the like. The thickness of the adhesive layer 39 is 0.02mm to 0.05 mm; specifically, the thickness of the adhesive layer 39 may be, but is not limited to, 0.02mm, 0.025mm, 0.03mm, 0.035mm, 0.04mm, 0.045mm, 0.05mm, and the like.

In this embodiment, the foam layer 37, the adhesive layer 39, the color texture layer 33 and the protective layer 35 may be made of the same material, for example, polyurethane, so that the foam layer 37, the adhesive layer 39, the color texture layer 33 and the protective layer 35 can be better bonded together during processing.

Please refer to the description of the embodiment in fig. 1 for the same parts of the present embodiment as those of the embodiment in fig. 1, and the description thereof is omitted.

Referring to fig. 3, fig. 3 is a further embodiment of the housing assembly 100, in the embodiment, the cortical layer 30 includes a substrate 31, a silica gel layer 34 and a protective layer 35, which are sequentially stacked; the substrate 31 is bonded to the fiber resin layer 10, and the surface of the silica gel layer 34 away from the substrate 31 (i.e. the surface close to the protective layer 35) is provided with a texture structure.

Specifically, the surface of the silicone layer 34 away from the substrate 31 is provided with a plurality of textures, which may be, but not limited to, textures that can make the housing assembly 100 have a flashing function, a leather texture, and the like, which can increase the appearance effect of the housing assembly 100. Specifically, the texture structure having the glittering function may be formed by, but not limited to, providing a coating layer having high reflectivity on a surface of the texture structure. The material of the silicone layer 34 includes, but is not limited to, silicone. Optionally, the raw material components of the silica gel layer 34 may further include a pigment, and the cortical layer 30 may present different color appearance effects by controlling the color and the proportion of the pigment. The specific gravity of the pigment in the silica gel layer 34 is 0.5% to 5%, and specifically may be 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, or the like. Silica gel layer 34 has elasticity, can make cortical layer 30 have the feel of cortex, and silica gel layer 34 still has certain hardness simultaneously, can prevent that cortical layer 30 from being scraped flower, makes casing subassembly 100 have longer life. Specifically, the shore hardness of the silicone gel layer may be 30A to 50D, and specifically, may be, but is not limited to, 30A, 50A, 60A, 75A, 85A, 1D, 10D, 20D, 30D, 40D, 50D, and the like.

In this embodiment, the substrate 31 may be a thermoplastic polyurethane substrate or a polyester substrate. When the substrate 31 is a thermoplastic polyurethane substrate, the thickness of the resulting cortical layer 30 is thinner because the thermoplastic polyurethane substrate can be made thinner. Meanwhile, since the thermoplastic polyurethane substrate itself is soft and elastic, the leather layer 30 can have a better leather touch, and thus, when the thermoplastic polyurethane substrate is used as the substrate, the leather touch can be realized without providing a foaming layer and an adhesive layer described below. Specifically, the material of the thermoplastic polyurethane substrate includes, but is not limited to, one or more of polyester polyurethane (e.g., spandex), polyether polyurethane, and the like. The material of the polyester substrate includes, but is not limited to, one or more of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), wholly aromatic polyester fiber, and the like.

In the present embodiment, the thickness of the silicone gel layer 34 is 0.02mm to 0.05 mm; in particular, the thickness of the silicone gel layer 34 may be, but is not limited to, 0.02mm, 0.025mm, 0.03mm, 0.035mm, 0.04mm, 0.045mm, 0.05mm, etc. Please refer to the corresponding parts of the embodiments of fig. 1 and 2 for the thickness ranges of the substrate 31 and the protection layer 35, which are not described herein again.

Referring to fig. 4, the present application also provides a method for manufacturing a housing assembly, the method comprising:

s201, preparing a fiber semi-cured resin sheet, wherein the fiber semi-cured resin sheet comprises fiber cloth and semi-cured resin for impregnating the fiber cloth;

In other embodiments, the inorganic fiber cloth may also be an inorganic fiber cloth formed of one or more of carbon fiber cloth, quartz glass fiber, boron fiber, ceramic fiber, metal fiber, and the like.

In some embodiments, the organic fiber cloth may be, but is not limited to, aramid, ultra-high molecular weight polyethylene fiber, poly-p-phenylene benzobisoxazole fiber, poly-p-benzimidazole fiber, poly-p-phenylene pyridobisimidazole fiber, polyimide fiber, and the like, which have high mechanical properties.

In some embodiments, the fiber cloth 11 is a woven cloth. Specifically, the fiber cloth 11 is formed by weaving or knitting a plurality of strands of inorganic fiber threads. Alternatively, the fiber cloth 11 is formed of a plurality of inorganic fiber threads which are staggered in the transverse and longitudinal directions. Specifically, each of the inorganic fiber threads is formed by kneading a plurality of inorganic fiber filaments, for example, 500, 1000, 2000, 3000, 5000, 1 ten thousand or 1.2 ten thousand inorganic fiber filaments, and the present application is not particularly limited.

In other embodiments, each layer of fiber cloth 11 includes a plurality of fiber threads, the plurality of fiber threads of each layer of fiber cloth 11 are arranged unidirectionally, and the extending directions of the fiber threads of two adjacent layers of fiber cloth have an included angle. Specifically, the plurality of fiber threads of the same layer of fiber cloth 11 extend along the same direction, and the extending directions of the fiber threads of the adjacent two layers of fiber cloth 11 have an included angle. Further, the included angle of the fiber lines of the two adjacent layers of fiber cloth 11 may be, but not limited to, 30 °, 45 °, 60 °, 70 °, 80 °, or 90 °. When the included angle of the fiber lines of the two adjacent layers of fiber cloth 11 is 90 °, the prepared fiber resin layer 10 has better mechanical strength, and the thickness of the shell assembly 100 can be made thinner while the mechanical strength is satisfied.

Referring also to fig. 5, in some embodiments, a method for preparing a fiber prepreg sheet includes:

s2011, soaking the fiber cloth in the resin monomer mixed solution to obtain a fiber cloth soaked sheet; and

specifically, the resin monomer mixture may be, but not limited to, an epoxy resin monomer mixture, a phenolic resin monomer mixture, a polyester resin monomer mixture, a thermoplastic resin monomer mixture, and the like, and the resin monomer mixture is pre-cured to form a semi-cured resin, and is fully cured to form a resin.

The resin monomer mixture in the examples of the present application may be a commercially available resin monomer mixture or a resin monomer mixture obtained by a known production method, and the present application is not particularly limited.

S2012, heating the fiber cloth impregnated sheet to pre-cure the resin monomer to obtain a fiber semi-cured resin sheet, wherein the fiber semi-cured resin sheet comprises fiber cloth and semi-cured resin impregnated in the fiber cloth.

Specifically, the fiber cloth impregnated sheet is placed at 70 ℃ to 80 ℃ to pre-cure the resin monomer to form a semi-cured resin, and the semi-cured resin is impregnated into the fiber cloth. Further, the pre-curing temperature may be, but is not limited to, 70 ℃, 72 ℃, 75 ℃, 87 ℃, 79 ℃, 80 ℃ and the like.

Specifically, the semi-cured resin may be, but is not limited to, an epoxy semi-cured resin, a phenolic semi-cured resin, a polyester semi-cured resin, a thermoplastic semi-cured resin, and the like.

S202, preparing a cortical layer; and

referring also to fig. 6, in some embodiments, the method of preparing the cortical layer 30 includes:

s2021, providing release paper, wherein the surface of the release paper is provided with preset textures, and the preset textures correspond to the texture structure;

specifically, the texture structure may be, but is not limited to, a texture structure that may provide the shell assembly with a flashing function, a leather texture, or the like, which may increase the appearance of the shell assembly 100.

S2022, forming a semi-cured color texture layer on the surface of the release paper provided with the preset texture;

specifically, the glue solution for forming the color texture layer is adhered to the surface of the release paper provided with the preset texture by adopting the processes of casting, coating (cloth spraying, spin coating and the like), and the glue solution for forming the color texture layer is semi-cured to form the semi-cured color texture layer. The glue solution for forming the color texture layer can comprise one or more of a colored polyurethane monomer mixed solution, a polyvinyl chloride monomer mixed solution and the like. Specifically, the semi-curing temperature may be 70 ℃ to 80 ℃, for example, the semi-curing temperature may be, but is not limited to, 70 ℃, 72 ℃, 75 ℃, 87 ℃, 79 ℃, 80 ℃ or the like.

S2023, transferring the semi-cured color texture layer to the surface of a substrate 31, curing to form a color texture layer 33, and removing release paper, wherein the texture structure is located on the surface of the color texture layer away from the substrate; and

specifically, the curing temperature may be 130 ℃ to 150 ℃, and for example, may be, but is not limited to, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, and the like. In the present embodiment, the substrate 31 is a thermoplastic polyurethane substrate.

S2024, preparing a protective layer 35 on the surface of the color texture layer 33 away from the substrate 31 to obtain the cortical layer 30, wherein the protective layer 35 is made of a transparent material.

Specifically, the protective layer 35 is formed on the surface of the color texture layer 33 away from the substrate 31 by casting, coating (spraying, spin coating, etc.), and the like, so as to obtain the cortical layer 30.

For the description of the same parts of this embodiment as other embodiments of the present application, please refer to related embodiments, which are not described herein again.

Referring to fig. 7, in still other embodiments, the method for preparing the cortical layer 30 includes:

s2031, providing release paper, wherein the surface of the release paper is provided with preset textures, and the preset textures correspond to texture structures;

s2032, forming a color texture layer on the surface of the release paper with the preset texture;

specifically, the glue solution for forming the color texture layer is adhered to the surface of the release paper provided with the preset texture by adopting the processes of casting, coating (fabric spraying, spin coating and the like), the glue solution for forming the color texture layer is cured to form the color texture layer, and the surface of the color texture layer 33 close to the release paper is provided with the texture structure. For example, a color texture layer glue solution formed by spraying one or more of a colored polyurethane monomer mixed solution, a polyvinyl chloride monomer mixed solution, and the like on the surface of the release paper provided with the predetermined texture is cured to form the color texture layer 33. The curing temperature may be 130 ℃ to 150 ℃, and for example, it may be, but not limited to, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, and the like.

S2033, preparing a substrate 31 on the surface of the color texture layer, which is far away from the release paper, and removing the release paper, wherein the texture structure is positioned on the surface of the color texture layer, which is far away from the substrate; and

in this embodiment, the substrate 31 is a thermoplastic polyurethane substrate, and a casting method is adopted on the surface of the color texture layer 33 away from the release paper to cast a thermoplastic polyurethane glue solution, so as to form a thermoplastic polyurethane group by curing, and the release paper is removed.

S2034, preparing a protective layer 35 on the surface of the color texture layer 33 away from the substrate 31 to obtain the cortical layer 30, wherein the protective layer 35 is made of a transparent material.

For the description of the same parts of this embodiment as those of other embodiments of the present application, reference is made to the description of other embodiments of the present application, which is not repeated herein.

Referring also to fig. 8, in yet another embodiment, the method of preparing the cortical layer 30 includes:

s2041, providing release paper, wherein the surface of the release paper is provided with preset textures, and the preset textures correspond to texture structures;

s2042, forming a silica gel layer on the surface of the release paper with the preset texture;

specifically, a silica gel layer 34 is formed on the surface of the release paper provided with the preset texture by adopting casting, coating (fabric spraying, spin coating and the like) and other processes, so that the surface of the silica gel layer 34 close to the release paper has a texture structure. More specifically, a surface of the release paper provided with the predetermined texture is sprayed with a colored silicone monomer mixed solution or the like to form a silicone layer, and the silicone layer 34 is formed by curing. Specifically, the curing temperature may be 130 ℃ to 150 ℃, and for example, may be, but is not limited to, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, and the like.

S2043, transferring the silica gel layer 34 to the surface of the substrate 31 and removing release paper, wherein the texture structure is located on the surface, away from the substrate, of the silica gel layer 34; and

in this embodiment, the substrate 31 may be a thermoplastic polyurethane substrate, and may also be a polyester substrate.

S2044, preparing a protective layer 35 on the surface of the silica gel layer 34 away from the substrate 31 to obtain the cortical layer 30, wherein the protective layer 35 is made of a transparent material.

Specifically, the protective layer 35 is formed on the surface of the silica gel layer 34 away from the substrate 31 by casting, coating (spraying, spin coating, etc.), and the like, so as to obtain the cortical layer 30.

Referring also to fig. 9, in yet another embodiment, the method of preparing the cortical layer 30 includes:

s2051, providing release paper, wherein the surface of the release paper is provided with preset textures, and the preset textures correspond to texture structures;

S2052, forming a color texture layer on the surface of the release paper, wherein the surface is provided with preset textures;

specifically, a color texture layer 33 is formed on the surface of the release paper provided with the preset texture by adopting casting, coating (spraying, spin coating, etc.), and the like, so that the surface of the color texture layer 33 has a texture structure. Further, the number of the texture structures may be one or more, and the plurality of texture structures may be the same or different. More specifically, one or more materials for forming the color texture layer, such as colored polyurethane monomer mixed liquid and polyvinyl chloride monomer mixed liquid, are sprayed on the surface of the release paper provided with the preset texture, and the color texture layer is formed after curing. Specifically, the curing temperature may be 130 ℃ to 150 ℃, and for example, may be, but is not limited to, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, and the like.

S2053, forming a bonding layer on the surface of the color texture layer far away from the release paper;

specifically, an adhesive layer 39 is formed on the surface of the color texture layer 33 away from the release paper by a coating method such as spray coating or spin coating.

Optionally, the material of the adhesive layer 39 includes, but is not limited to, one or more of polyurethane, epoxy resin, and polyvinyl chloride. The adhesive layer 39 is used to enable the foamed layer 37 and the color texture layer 33 to be better adhered, so as to better prevent the structures of the leather layer 30 from being separated after a period of use, and improve the service life of the leather layer 30. The thickness of the adhesive layer 39 is 0.02mm to 0.05 mm; specifically, the thickness of the adhesive layer 39 may be, but is not limited to, 0.02mm, 0.025mm, 0.03mm, 0.035mm, 0.04mm, 0.045mm, 0.05mm, and the like.

S2054, arranging a foaming layer on the surface, far away from the color texture layer, of the bonding layer;

specifically, a foam layer is applied to the surface of the adhesive layer, and the foam layer 37 is obtained by foaming. The foaming layer 37 can make the leather layer 30 have better leather texture, improve the hand feeling of the housing assembly 100, and improve the user experience.

Optionally, the material of the foaming layer 37 includes, but is not limited to, one or more of polyurethane, polyvinyl chloride, and the like. In particular, the polyurethane may be, but is not limited to, a polyester polyurethane or a polyether polyurethane. The material of the foaming layer 37 may further include various additives such as a foaming agent, a catalyst, and a flame retardant. Optionally, the thickness of the foamed layer 37 is 0.05mm to 0.1 mm. Specifically, the thickness of the foamed layer 37 may be, but is not limited to, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, and the like.

S2055, transferring the stacked color texture layer, the bonding layer and the foaming layer to the surface of a substrate and removing release paper, wherein the foaming layer is arranged close to the substrate, and the surface of the color texture layer provided with the texture structure is arranged far away from the substrate;

in the present embodiment, the substrate 31 is a polyester substrate, and specifically, the material of the polyester substrate includes, but is not limited to, one or more of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), wholly aromatic polyester fiber, and the like. The thickness of the terylene substrate is 0.3mm to 0.35 mm; specifically, the thickness of the polyester substrate may be, but is not limited to, 0.3mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, and the like.

S2056, forming a protective layer 35 on the surface of the color texture layer 33 away from the substrate 31 to obtain the cortical layer 30, where the protective layer 35 is made of a transparent material.

Specifically, the protective layer 35 is formed on the surface of the color texture layer 33 away from the substrate 31 by casting, coating (spraying, spin coating, etc.), and the like, so as to obtain the cortical layer 30. The protective layer 35 is disposed on the surface of the color texture layer 33 away from the substrate 31, so that the leather layer 30 has good properties of stain resistance, fingerprint resistance, yellowing resistance and the like. The material of the protective layer 35 includes, but is not limited to, one or more of polyurethane, polyvinyl chloride, and the like.

In the above method for preparing the cortical layer 30, in the process of preparing the base or transferring the laminated structure such as the color texture layer to the base, when the base does not have viscosity, the laminated structure such as the color texture layer is firstly semi-cured, and then transferred to the base for curing. When the glue solution for preparing the substrate has viscosity, the laminated structures such as the color texture layer and the like are solidified, and then the substrate glue solution is cast or sprayed on the surface far away from the release paper, and the substrate is formed through solidification.

It should be noted that there is no sequence between step S201 and step S202, and in another embodiment, the cortical layer 30 may be prepared first and then the fiber semi-cured resin sheet may be prepared.

S203, laminating the fiber semi-cured resin sheet and the cortex, carrying out hot press molding, curing the semi-cured resin to form the resin, and curing the fiber semi-cured resin sheet to form a fiber resin layer 10; the cortical layer 30 is bonded to the fiber resin layer 10 by the resin 13, and the case assembly 100 is obtained.

Specifically, the laminating the fiber semi-cured resin sheet and the cortical layer includes:

sequentially overlapping at least three layers of fiber semi-cured resin sheets to form an intermediate state fiberboard;

superposing the cortical layer to one side surface of the intermediate state fiber board, wherein the substrate of the cortical layer is arranged close to the fiber semi-cured resin sheet; and

and pre-laminating at least three layers of fiber semi-cured resin sheets with the cortical layer to form the composite board. Optionally, the pre-application temperature is 70 ℃ to 80 ℃. Specifically, the temperature for pre-bonding may be, but is not limited to, 70 ℃, 72 ℃, 75 ℃, 87 ℃, 79 ℃, 80 ℃ or the like. The fiber semi-cured resin sheet is pre-attached to the leather layer, so that dislocation among layers in a hot pressing process can be better prevented, and the yield of the prepared shell assembly is reduced.

Optionally, the temperature of the hot press forming is 130 ℃ to 150 ℃. Specifically, the temperature of the hot press molding may be, but is not limited to, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, and the like. And carrying out hot press molding on the composite board, wherein when the temperature is raised to 130-150 ℃, the semi-solidified resin is in a molten state, the molten semi-solidified resin infiltrates the substrate 31 of the leather layer 30, and the semi-solidified resin is further solidified to form the resin, so that the fiber semi-solidified resin sheet is solidified to form the fiber resin layer 10, and meanwhile, the leather layer 30 and the fiber resin layer 10 are bonded through the resin to obtain the shell assembly 100.

The fiber resin layer of the present application will be described below with reference to specific examples.

Example 1

A method for preparing a glass fiber epoxy resin layer comprises the following steps:

dipping the glass fiber cloth in epoxy resin monomer mixed solution to obtain a glass fiber cloth dipped sheet, wherein the epoxy resin monomer mixed solution comprises bisphenol A and beta-methyl epichlorohydrin;

precuring a glass fiber cloth impregnated sheet at 75 ℃ to obtain a glass fiber epoxy semi-cured resin sheet, wherein the glass fiber epoxy semi-cured resin sheet comprises glass fiber cloth and epoxy semi-cured resin impregnated in the glass fiber cloth; and

and (3) sequentially overlapping the 3 layers of the glass fiber semi-cured resin sheets, and curing at 140 ℃ to obtain the glass fiber epoxy resin layer.

The thickness of the glass fiber epoxy resin layer prepared in the example was 0.3 mm.

Example 2

and (3) sequentially overlapping 4 layers of glass fiber semi-cured resin sheets, and curing at 140 ℃ to obtain the glass fiber epoxy resin layer.

The thickness of the glass fiber epoxy resin layer prepared in this example was tested to be 0.38 mm.

Example 3

and (3) sequentially overlapping 5 layers of glass fiber semi-cured resin sheets, and curing at 140 ℃ to obtain the glass fiber epoxy resin layer.

The thickness of the glass fiber epoxy resin layer prepared in this example was tested to be 0.45 mm.

Example 4

and (3) sequentially overlapping 6 layers of glass fiber semi-cured resin sheets, and curing at 140 ℃ to obtain the glass fiber epoxy resin layer.

The thickness of the glass fiber epoxy resin layer prepared in this example was tested to be 0.5 mm.

In order to make the electronic device housing assembly before improvement have the texture appearance and hand feeling of leather, a plastic sheet (such as polycarbonate) is usually adopted as a substrate, the leather is adhered to the plastic sheet through hot melt adhesive, and the processed thickness of the plastic sheet is thicker due to the limitation of a processing technology. In the stiffness comparison experiment, only the thickness and the stiffness between the base material and the base material before improvement are needed to be compared. Glass fiber's rigidity is high, and the cost is lower, and its manufacturing cost who is used for preparing reduction casing subassembly that casing subassembly can be better, and present casing subassembly adopts polycarbonate as the substrate mostly, consequently, this application adopts the glass fiber resin layer as this application casing subassembly's substrate, adopts polycarbonate as comparing the substrate. Since it is difficult to achieve a thickness of less than 0.55mm with the existing plastic substrate such as polycarbonate, the thickness ratios in the following comparative examples each take a sample having a thickness of more than 0.55 mm.

Comparative example 1 is Polycarbonate (PC) having a thickness of 0.55mm and a width of 15 mm.

Comparative example 2 is Polycarbonate (PC) having a thickness of 0.7mm and a width of 15 mm.

Comparative example 3 is Polycarbonate (PC) having a thickness of 0.8mm and a width of 15 mm.

Comparative example 4 is Polycarbonate (PC) having a thickness of 1.0mm and a width of 15 mm.

The rigidity test of the embodiment of the application adopts a three-point bending test, and the method specifically comprises the following steps: the sample is placed on two support points with a certain distance, a downward load is applied to the sample above the middle point of the two support points, three-point bending occurs when 3 contact points of the sample form two equal moments, and the sample breaks at the middle point. The three-point bending test method was used for each of the above examples 1 to 4 and comparative examples 1 to 4, and the stiffness was measured at loads of 1N, 3N and 5N, respectively.

TABLE 1 stiffness data for glass fiber epoxy layers made in the examples of the present application and polycarbonates of different thicknesses

As can be seen from the test results of example 4 and comparative example 1 in table 1, when the glass epoxy resin layer is comparable in thickness to polycarbonate, the glass epoxy resin layer has a higher rigidity (mechanical strength), and as can be seen from example 1 and comparative example 1, when the glass epoxy resin layer is comparable in rigidity to polycarbonate, the thickness of the glass epoxy resin layer is much smaller than that of polycarbonate, and the thickness of the glass epoxy resin layer is about half of that of polycarbonate, so that the thickness of the housing assembly can be greatly reduced while securing rigidity.

Referring to fig. 10, an electronic device 300 is further provided in the embodiment of the present application, where the electronic device 300 includes the housing assembly 100 in the above embodiment of the present application; the cortical layer 30 of the housing assembly 100 is disposed on an outer surface of the electronic device 300.

The electronic device 300 of the present application may be, but is not limited to, a portable device or a wearable device such as a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, and the like.

Alternatively, the housing assembly 100 may be, but is not limited to, a battery back cover, a center frame, a decoration, etc. of an electronic device.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A housing assembly, comprising:

a fiber resin layer including a fiber cloth and a resin impregnated in the fiber cloth; and

2. The housing assembly of claim 1 wherein the fiber resin layer is at least three layers, at least three layers being stacked.

3. The housing assembly of claim 2, wherein the fiber cloth is a fiber cloth with fibers arranged in the same direction or a woven cloth with fibers arranged in a cross direction; when the fiber cloth is fiber cloth with fibers arranged in the same direction, each layer of the fiber cloth comprises a plurality of strands of fiber lines, the strands of the fiber lines of each layer of the fiber cloth are arranged in a single direction, and an included angle is formed in the extending direction of the fiber lines of two adjacent layers of the fiber cloth.

4. The housing assembly of claim 1 wherein said cortical layer comprises a substrate bonded to said fibrous resin layer, said substrate being a polyester substrate or a thermoplastic polyurethane substrate.

5. The housing assembly of claim 4, wherein the cortical layer further comprises a silicone layer; the silica gel layer is arranged on the surface of the substrate far away from the fiber resin layer.

6. The housing assembly of claim 4, wherein the cortical layer further comprises a color textured layer disposed on one side of the substrate; and the surface of the color texture layer, which is far away from the substrate, is provided with a texture structure.

7. The housing assembly of claim 6, wherein when the substrate is a dacron substrate, the leather layer further comprises a foaming layer and an adhesive layer disposed between the substrate and the color texture layer and stacked together; the foaming layer is arranged close to the substrate, and the bonding layer is arranged close to the color texture layer.

8. The housing assembly of claim 6 or 7, wherein the leather layer further comprises a protective layer, the protective layer is made of a transparent material, and the protective layer is disposed on a surface of the color texture layer away from the substrate.

9. The housing assembly of claim 8, wherein the color textured layer has a thickness of 0.02mm to 0.05 mm; the thickness of the protective layer is 0.01mm to 0.03 mm; when the substrate is a thermoplastic polyurethane substrate, the thickness of the substrate is 0.25mm to 0.3mm, and when the substrate is a terylene substrate, the thickness of the terylene substrate is 0.3mm to 0.35 mm.

10. The housing assembly of claim 1 wherein the fiber cloth is an inorganic fiber cloth.

11. The housing assembly of claim 1, wherein the fiber resin layer has a thickness of 0.3mm to 0.5 mm; the thickness of the cortical layer is 0.28mm to 0.5 mm.

12. An electronic device, characterized in that the electronic device comprises a housing assembly according to any one of claims 1 to 11; the cortical layer is arranged on the outer surface of the electronic device.