CN114727521B

CN114727521B - Shell assembly and electronic equipment

Info

Publication number: CN114727521B
Application number: CN202110013658.6A
Authority: CN
Inventors: 陈益明; 黄志勇
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-01-06
Filing date: 2021-01-06
Publication date: 2023-11-28
Anticipated expiration: 2041-01-06
Also published as: CN114727521A

Abstract

The application provides a housing assembly and an electronic device. The present application provides a housing assembly comprising: a fibrous resin layer; the surface modification layer is formed on the surface of the fiber resin layer and is used for modifying the surface of the fiber resin layer and improving the dyne value of the surface of the fiber resin layer; and the leather layer is formed on the surface of the surface modification layer, which is away from the fiber resin layer. The shell assembly provided by the embodiment of the application can be made thinner, and the cortex layer is less prone to falling off, so that the shell assembly has a longer service life.

Description

Shell assembly and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to a shell assembly and electronic equipment.

Background

In order to avoid homogenization of the appearance of the electronic equipment, leather is arranged on the surface of the electronic equipment shell, so that the electronic equipment shell has the appearance effect and the hand feeling of the leather, and the texture is improved. However, the thickness of the electronic equipment shell with leather appearance and hand feeling is larger at present, so that the thickness of the whole electronic equipment is influenced, the experience effect of consumers is reduced, and in addition, the binding force between leather and a shell base material is insufficient, so that the leather is easy to fall off after the electronic equipment shell is used for a period of time, and the service life of the electronic equipment shell is influenced.

Disclosure of Invention

In view of the above, the present application provides a housing assembly, which can be made thinner, and the leather layer is less likely to fall off, and has a longer lifetime.

The present application provides a housing assembly comprising:

a fibrous resin layer;

the surface modification layer is formed on the surface of the fiber resin layer and is used for modifying the surface of the fiber resin layer and improving the dyne value of the surface of the fiber resin layer; and

and the leather layer is formed on the surface of the surface modification layer, which is away from the fiber resin layer.

The present application also provides a housing assembly comprising:

a fibrous resin layer having a modified surface; and

and a cortical layer adhered to the modified surface of the fiber resin layer, wherein the modified surface has a dyne value greater than 32N/mm.

The application also provides electronic equipment, which comprises the shell assembly.

The shell component provided by the embodiment of the application adopts the fiber resin layer as the base material of the shell component, and the fiber resin layer has high mechanical strength, so that the shell component can be made thinner while the mechanical strength is ensured, and meanwhile, the surface of the fiber resin layer is modified by the surface modification layer, so that the bonding performance between the fiber resin layer and the leather layer is better, the fiber resin layer is less prone to falling off, and the service life is longer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a housing assembly according to an embodiment of the present application.

Fig. 2 is a schematic structural view of a housing assembly according to yet another embodiment of the present application.

FIG. 3 is a schematic flow chart of a method for manufacturing a housing assembly according to an embodiment of the present application.

Fig. 4 is a schematic structural view of a housing assembly according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The terms first, second and the like in the description and in the claims and in the above-described figures are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of explanation, like reference numerals denote like components in the embodiments of the present application, and detailed descriptions of the like components are omitted in the different embodiments for brevity.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a housing assembly 100 according to an embodiment of the application, where the housing assembly 100 according to the embodiment of the application includes: a fibrous resin layer 10; a surface modification layer 30 formed on the surface of the fiber resin layer 10, for modifying the surface of the fiber resin layer 10 and increasing the dyne value of the surface of the fiber resin layer 10; and a leather layer 50 formed on the surface of the surface modification layer 30 facing away from the fiber resin layer 10.

The term "dyne value" in the present application is also called a surface tension coefficient, and is used to indicate wettability of a solid surface. Higher dyne values indicate greater forces required to separate the liquid from its surface, whereas lower dyne values result in the liquid moving across the substrate surface to separate into individual spherical droplets.

The term "leather layer" in the present application refers to a layer of material that imparts a leather texture or feel to the housing assembly 100, which may be a single layer or a multi-layer structure. The leather may be artificial leather (polyurethane PU, etc.) or true leather (e.g., pigskin, cow leather, sheep leather, etc.). In addition, other material layers that provide the housing assembly 100 with a pleasant feel are possible, and the present application is not particularly limited.

The shell component 100 of the application adopts the fiber resin layer 10 as the base material of the shell component 100, the mechanical strength of the fiber resin layer 10 is high, so that the shell component 100 can be made thinner while ensuring the mechanical strength, and meanwhile, the surface of the fiber resin layer 10 is modified by the surface modification layer 30, so that the bonding performance between the fiber resin layer 10 and the leather layer 50 is better, the fiber resin layer is less easy to fall off, and the service life is longer.

Alternatively, the shape of the housing assembly 100 may be a 2D shape, a 2.5D shape, a 3D shape, etc. The housing assembly 100 may be, but is not limited to, a back cover, a center, a trim piece, etc. of an electronic device. Optionally, the thickness of the housing assembly 100 is 0.5mm to 1.0mm. Further, the thickness of the housing assembly 100 is 0.5mm to 0.8mm. Still further, the thickness of the housing assembly 100 is 0.5mm to 0.7mm. This allows the electronic device including the housing assembly 100 to have a thinner thickness, improving the user's experience. Specifically, the thickness of the housing assembly 100 may be, but is not limited to, 0.5mm, 0.6mm, 0.63mm, 0.65mm, 0.68mm, 0.7mm, 0.75mm, 0.8mm, 0.9mm, 1.0mm.

Alternatively, the fiber resin layer 10 includes a fiber cloth 11 and a resin 13 impregnating the fiber cloth 11. Optionally, the weight ratio of the fiber cloth 11 to the resin 13 is 0.8:1 to 1.2:1, specifically, the weight ratio of the fiber cloth 11 to the resin 13 may be, but is not limited to, 0.8:1, 0.9:1, 1:1, 1.1:1, 1.2:1, or the like. When the weight ratio of the fiber cloth 11 to the resin 13 is 1:1, the fiber resin layer 10 has better mechanical strength.

The term "impregnation" according to the present application means that the resin 13 is wrapped around and enters the fiber cloth 11, and includes the case that the resin 13 is wrapped around the entire fiber cloth 11, and may include the case that the resin 13 is wrapped around and wets in gaps between fiber threads or filaments of the fiber cloth 11, that is, the case that the resin 13 is wrapped around each fiber thread or each fiber filament. When the resin 13 wets each fiber strand or each fiber filament, the fiber cloth 11 can be more uniformly distributed in the resin 13, and the structure of the fiber resin layer 10 can be more uniformly distributed, thereby having higher mechanical strength.

In some embodiments, the fiber cloth 11 may be an inorganic fiber cloth or an organic fiber cloth. When the fiber cloth 11 is an inorganic fiber cloth, it can enhance the strength of the fiber resin layer 10 better, so that the housing assembly 100 and the whole electronic device using the housing assembly 100 can be made thinner.

In some embodiments, the inorganic fiber cloth 11 may be a glass fiber cloth, such as an alkali-free glass fiber cloth (e.g., borosilicate glass), a medium alkali glass fiber cloth (e.g., soda lime silicate glass with or without boron), a high alkali glass fiber cloth (e.g., sodium silicate glass), a high strength glass fiber cloth, an alkali-resistant glass fiber cloth, a boron-free alkali-free glass fiber cloth, a low dielectric glass fiber cloth, a fluorine-free glass fiber, or the like. The glass fiber cloth has low cost, good insulation, strong heat resistance, good corrosion resistance and high mechanical strength, and can be used as a base material of the shell assembly 100, so that the shell assembly 100 can have thinner thickness while the mechanical strength of the shell assembly 100 is ensured.

In other embodiments, the inorganic fiber cloth may also be an inorganic fiber cloth formed by one or more of carbon fiber cloth, quartz glass fiber, boron fiber, ceramic fiber and metal fiber.

In some embodiments, the organic fiber cloth may be, but is not limited to, an organic fiber cloth having high mechanical properties such as aramid, ultra-high molecular weight polyethylene fibers, poly-p-phenylene benzobisoxazole fibers, poly-p-benzimidazole fibers, poly-phenylene pyridobisimidazole fibers, polyimide fibers, and the like.

In some embodiments, the fiber cloth 11 is a woven cloth with fibers arranged in a crossed manner. Specifically, the fiber cloth 11 is formed by weaving or braiding a plurality of inorganic fiber threads. Alternatively, the fiber cloth 11 is formed of a plurality of inorganic fiber threads which are staggered in the transverse and longitudinal directions. Specifically, each inorganic fiber strand is formed by mixing a plurality of inorganic fiber strands, for example, 500, 1000, 2000, 3000, 5000, 1 ten thousand or 1.2 ten thousand inorganic fiber strands, and the present application is not particularly limited.

In other embodiments, each layer of fiber cloth 11 is a fiber cloth 11 with fibers arranged in the same direction, each layer of fiber cloth 11 comprises a plurality of fiber threads, the fiber threads of each layer of fiber cloth 11 are unidirectionally arranged, and the extending directions of the fiber threads of two adjacent layers of fiber cloth 11 have included angles. Specifically, the fiber strands of the same layer of fiber cloth 11 extend in the same direction, and the extending directions of the fiber strands of the adjacent two layers of fiber cloth 11 have an included angle. Further, the included angle of the fiber lines of the adjacent two layers of the fiber cloth 11 may be, but not limited to, 30 °, 45 °, 60 °, 70 °, 80 °, 90 °, or the like. When the included angle of the fiber lines of the adjacent two layers of the fiber cloth 11 is 90 degrees, the manufactured fiber resin layer 10 has better mechanical strength, and the thickness of the housing assembly 100 can be made thinner while satisfying the mechanical strength.

In some embodiments, the resin 13 may be, but is not limited to being, an epoxy resin, such as bisphenol a epoxy resin. The epoxy resin has good adhesive property, chemical resistance, physical and mechanical properties and electrical insulation properties, and after the fiber cloth 11 is impregnated with the epoxy resin, the fiber resin layer 10 can have better mechanical strength, so that good mechanical properties can be ensured only by the thinner fiber resin layer 10. Meanwhile, the epoxy resin has a hydroxyl group after curing, and the hydroxyl group can undergo an exchange reaction with the ester in the surface modification layer 30 to generate a stable chemical bond, thereby improving the adhesive force between the fiber resin layer 10 and the surface modification layer 30.

In other embodiments, the resin 13 may also be a phenolic resin, a polyester resin, a thermoplastic resin, or the like.

The resin 13 according to the embodiment of the present application may be formed by curing a commercially available resin monomer mixture, or may be formed by curing a resin monomer mixture obtained by a known preparation method, and the present application is not particularly limited.

In some embodiments, the thickness of the fibrous resin layer 10 is 0.2mm to 0.5mm. Still further, the thickness of the fiber resin layer 10 is 0.2mm to 0.4mm. Specifically, the thickness of the fibrous resin layer 10 may be, but is not limited to, 0.2mm, 0.3mm, 0.32mm, 0.35mm, 0.38mm, 0.4mm, 0.43mm, 0.46mm, 0.5mm, etc. When the thickness of the fiber resin layer 10 is within this range, the mechanical strength of the housing assembly 100 can be ensured, and at the same time, the thickness of the housing assembly 100 can be well reduced, thereby improving the user experience. In some embodiments, the fiber resin layer 10 is at least three layers, and at least three fiber resin layers 10 are stacked. Specifically, the fiber resin layer 10 may be, but is not limited to, 3 layers, 4 layers, 5 layers, 6 layers, 7 layers, or the like. Alternatively, the thickness of the single-layer fibrous resin layer 10 is 0.05mm to 0.1mm. Specifically, the thickness of the single-layer fiber resin layer 10 may be, but is not limited to, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, and the like.

In some embodiments, the stiffness of the fibrous resin layer 10 under a load of 3N is 3550N/m to 27300N/m. Specifically, the stiffness of the fiber resin layer 10 may be, but is not limited to, 3550N/m, 4000N/m, 5000N/m, 6000N/m, 7000N/m, 8000N/m, 9000N/m, 10000N/m, 11000N/m, 12000N/m, 15000N/m, 18000N/m, 22000N/m, 25000N/m, 27300, and the like. At this time, the mechanical strength of the housing assembly 100 can meet the use requirement, and at the same time, the thickness of the housing assembly 100 can be reduced to the maximum extent.

In order to make the electronic device housing assembly 100 have the texture appearance and feel of leather, a plastic plate (such as polycarbonate) is often used as a base material, and the leather is bonded to the plastic plate by a hot melt adhesive, so that the thickness of the plastic plate is thicker due to the limitation of the processing technology. Whether natural leather or artificial leather, its texture is soft and contributes almost negligible to the mechanical strength such as rigidity of the housing assembly 100, and thus the rigidity of the substrate determines the rigidity of the manufactured housing assembly 100. The glass fiber has high rigidity and lower cost, and the manufacturing cost of the shell assembly 100 can be reduced better when the glass fiber is used for manufacturing the shell assembly 100, and the existing shell assembly 100 mostly adopts Polycarbonate (PC) or a laminated board of polycarbonate and polymethyl methacrylate (PC/PMMA) as a base material, so that the PC and the PC/PMMA laminated board are adopted as comparative examples below to compare the rigidity of the glass fiber resin layer 10 and the PC/PMMA laminated board of the application. The following table 1 shows stiffness data for layers of fiberglass epoxy 13 (i.e., the fibrous resin layer 10 formed by impregnating fiberglass cloth with epoxy 13, wherein the weight ratio of epoxy 13 to fiberglass cloth is 1:1), polycarbonate, and polycarbonate to polymethyl methacrylate laminate, wherein the thickness ratio of polycarbonate to polymethyl methacrylate is 0.45:0.05. because it is difficult to achieve thicknesses of less than 0.5mm for existing plastic substrates such as polycarbonate, polycarbonate and polymethyl methacrylate, samples with a thickness greater than 0.5mm were taken for the thickness comparisons in the following comparative examples.

The stiffness in table 1 was tested using a three-point bending test method, which specifically includes: the sample was placed on two support points at a distance, a downward load was applied to the sample at the midpoint of the two support points, three-point bending occurred when the 3 points of contact of the sample formed equal two moments, the sample was broken at the midpoint, and the rigidity at 3N load was measured in table 1.

TABLE 1 rigidity data for glass fiber epoxy layers, PC boards, and PC/PMMA laminated boards of different thicknesses

As can be seen from table 1, when the thicknesses are the same, the glass fiber epoxy resin layer has greater rigidity than the Polycarbonate (PC), the polycarbonate and the polymethyl methacrylate laminate, so that the glass fiber epoxy resin layer is used as the base material of the housing assembly 100, and the smaller thickness is required to meet the requirements, so that the housing assembly 100 can be made thinner, however, compared with the plastic base material such as the polycarbonate, the adhesive force between the glass fiber epoxy resin layer and the leather layer 50 is smaller than the adhesive force between the polycarbonate and the leather layer 50, so that the leather layer 50 is directly injection molded or formed on the glass fiber epoxy resin layer, the leather layer 50 is easy to fall off after the manufactured housing assembly 100 is used for a period of time, and the service life of the housing assembly 100 is reduced.

In some embodiments, the surface modification layer 30 is prepared by coating a surface modification solution on the surface of the fiber resin layer 10 and volatilizing a solvent in the surface modification solution. In other embodiments, the surface modifying layer 30 is prepared by coating a surface modifying solution on the surface of the fiber-resin layer 10, volatilizing a solvent in the surface modifying solution, and polymerizing an active agent in the surface modifying solution while forming the cortical layer 50. In other embodiments, the surface modification layer 30 may be formed by other methods.

In some embodiments, a sizing may be injection molded onto the surface of the surface modification layer 30 facing away from the fibrous resin layer 10 to form a cortical layer 50. In other embodiments, the cortical layer 50 may also be formed first before bonding or hot pressing the cortical layer 50 to the surface of the surface modification layer 30 facing away from the fiber resin layer 10. For convenience of explanation, the present application will be described below with reference to the leather layer 50 being formed by surface injection molding a sizing material.

In some embodiments, the raw material components (i.e., surface modifying solutions) of surface modifying layer 30 include, but are not limited to including, an active agent. The active agent reacts with the fiber resin layer to form a chemical bond between the surface modification layer and the surface of the fiber resin layer. Alternatively, the active agent contains an ester group, and the ester group of the active agent may undergo an ester interchange reaction with a hydroxyl group of the fiber-resin layer 10, such as a glass-fiber epoxy resin layer, to form a stable chemical bond, thereby improving the adhesion between the fiber-resin layer 10 and the surface-modified layer 30. In addition, the surface modification layer 30 has a dyne value greater than that of the fiber resin layer 10, so that the raw material composition of the leather layer 50 has better wettability on the surface modification layer 30, whereby the binding force between the leather layer 50 and the surface modification layer 30 is greater than that between the leather layer 50 and the fiber resin layer 10, in other words, the compatibility between the leather layer 50 and the surface modification layer 30 is greater than that between the leather layer 50 and the fiber resin layer 10, or, the intermolecular force between the leather layer 50 and the surface modification layer 30 is greater than that between the leather layer 50 and the fiber resin layer 10. In addition, when the sizing material of the leather layer 50 is injection molded, the active agent in the raw material component of the surface modification layer 30 is simultaneously polymerized, so that the adhesive force between the surface modification layer 30 and the leather layer 50 can be increased. Therefore, the addition of the surface modification layer 30 allows the housing assembly 100 to be used for a longer period of time, so that the leather layer 50 is less likely to fall off from the fiber resin layer 10, and the service life of the housing assembly 100 is improved.

In some embodiments, the active agent includes, but is not limited to, one or more of isopropyl methacrylate, isobutyl methacrylate, triisopropyl borate, isopropyl ethacrylate, butyl orthosilicate.

In a specific embodiment, the active agent in the raw material component of the surface modification layer 30 may include isopropyl methacrylate and isopropyl borate, and the weight ratio of isopropyl methacrylate to isopropyl borate is 7:2, when the raw material components of the surface modification layer 30 include isopropyl methacrylate and isopropyl borate, the prepared surface modification layer 30 may have a larger dyne value, so that the adhesion between the fiber resin layer 10 and the leather layer 50 may be better improved, and the service life of the shell assembly 100 may be improved.

Alternatively, the mass fraction of active agent in the raw material component of the surface-modified layer 30 is 0.06wt% to 0.15wt%; specifically, the mass fraction of the active agent may be, but is not limited to, 0.06wt%, 0.07wt%, 0.08wt%, 0.09wt%, 0.10wt%, 0.11wt%, 0.12wt%, 0.13wt%, 0.14wt%, 0.15wt%, etc. When the mass fraction of the active agent in the raw material component of the surface modification layer 30 is lower than 0.06wt%, the dyne value of the surface modification layer 30 does not reach an ideal value, in other words, the bonding force between the surface modification layer 30 and the leather layer 50 is weak, and when the mass fraction of the active agent in the raw material component of the surface modification layer 30 is higher than 0.15wt%, the dyne value of the surface modification layer 30 reaches a peak value, the dyne value increases less or no longer increases with increasing concentration, and the thickness of the surface modification layer 30 increases correspondingly with increasing concentration, which affects the overall thickness of the housing assembly 100 and increases the manufacturing cost of the housing assembly 100.

In some embodiments, the raw material component (i.e., the surface modifying solution) of the surface modifying layer 30 further includes a polymerization inhibitor, which may be, but is not limited to, methoxy hydroquinone. The polymerization inhibitor can prevent the active agent in the raw material components of the surface modification layer 30 from undergoing polymerization reaction, which is beneficial to maintaining the stability of the raw material components of the surface modification layer 30.

Alternatively, the mass fraction of the polymerization inhibitor in the raw material component of the surface modification layer 30 is 0.01wt% to 0.03wt%, specifically, the mass fraction of the polymerization inhibitor may be, but is not limited to, 0.01wt%, 0.015wt%, 0.02wt%, 0.025wt%, 0.028wt%, 0.03wt%, or the like. When the concentration of the polymerization inhibitor is too low, the polymerization inhibition effect is weak, and the active agent in the raw material component of the surface modification layer 30 may partially undergo polymerization reaction, so that the transesterification reaction between the ester group of the active agent in the raw material component of the surface modification layer 30 and the hydroxyl group in the fiber resin layer 10 is affected, and the adhesion between the surface modification layer 30 and the fiber resin layer 10 is further affected, and in addition, compared with the case where the leather layer 50 is formed by injection molding, the active agent in the raw material component of the surface modification layer 30 undergoes polymerization reaction at the same time, and before the leather layer 50 is injection molded, the active agent in the raw material component of the surface modification layer 30 undergoes partial or complete polymerization reaction, so that the adhesion between the surface modification layer 30 and the leather layer 50 is reduced, the leather layer 50 is more likely to fall off, and the life of the manufactured housing component 100 is affected. When the concentration of the polymerization inhibitor is too high, the active agent is difficult to polymerize to form a polymer having a large molecular weight when the leather layer 50 is injection molded, which reduces the adhesion property of the formed surface-modified layer 30 to the leather layer 50, which is disadvantageous in improving the service life of the housing assembly 100.

In some embodiments, the feedstock component (i.e., surface modifying solution) of surface modifying layer 30 also includes an organic solvent, which may be, but is not limited to, one or more of isopropanol, n-butanol, toluene. In a specific embodiment, the organic solvent is a mixed solution of isopropanol, n-butanol and toluene, wherein the mass fraction of the n-butanol in the organic solvent is 1 to 3wt% and the mass fraction of the toluene is 0.01 to 0.05wt%; specifically, the mass fraction of n-butanol may be, but is not limited to, 1wt%, 1.2wt%, 1.5wt%, 1.8wt%, 2.0wt%, 2.3wt%, 2.5wt%, 2.8wt%, 3wt%, etc.; the mass fraction of toluene may be, but is not limited to, 0.01wt%, 0.015wt%, 0.02wt%, 0.025wt%, 0.03wt%, 0.035wt%, 0.04wt%, 0.045wt%, 0.05wt%, etc. The mixed solution of isopropanol, n-butanol and toluene is used as the solvent of the active agent, so that the coating can be better carried out, a thin film layer is formed on the surface of the fiber resin layer 10, and after the surface modification solution is coated on the fiber resin layer 10, most of the organic solvent can volatilize after being placed at normal temperature or in an environment of 30-40 ℃, and at the temperature, the active agent cannot undergo polymerization reaction, so that the adhesive property between the surface modification layer 30 and the leather layer 50 is improved when the leather layer 50 is formed later.

In some embodiments, the surface modification layer 30 has a thickness of 5 μm to 10 μm, in particular, the surface modification layer 30 may have a thickness of, but is not limited to, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 10 μm, etc. When the thickness of the surface modification layer 30 is less than 5 μm, the increase in the dyne value to the surface of the fiber resin layer 10 is not large, in other words, at this time, the dyne value of the surface modification layer 30 is low, which is disadvantageous in improving the adhesion property between the cortical layer 50 and the fiber resin layer 10. When the thickness of the surface modification layer 30 is greater than 10 μm, the dyne value of the surface modification layer 30 reaches a peak value, and the dyne value is lifted less or no longer with the increase of the thickness of the surface modification layer 30, and the increase of the thickness of the surface modification layer 30 affects the overall thickness of the manufactured housing assembly 100.

Alternatively, the surface of the fiber-resin layer 10 modified by the surface-modifying layer 30 has a dyne value of 36N/mm or more, specifically, but not limited to, 36N/mm, 38N/mm, 40N/mm, etc.

In some embodiments, the cortical layer 50 is formed from a thermoplastic material via injection molding. In injection molding, the temperature of the injection mold is 140 to 160 ℃, specifically, but not limited to, 140 ℃, 145 ℃, 148 ℃, 150 ℃, 153 ℃, 155 ℃, 158 ℃, 160 ℃, and the like. The temperature of the compound at the time of injection molding is 180 to 220 ℃, and specifically, but not limited to, 180 ℃, 185 ℃, 190 ℃, 195 ℃, 200 ℃, 210 ℃, 215 ℃, 220 ℃ and the like. In addition, the temperature of the injection mold and the sizing material during injection molding may be determined according to the melting temperature and the polymerization temperature of the raw materials of the thermoplastic material from which the leather layer 50 is made. When the active agent has a polymerizable functional group, the temperature of the sizing material is higher when the leather layer 50 is injection molded, so that the temperature of the surface modification solution coating is increased, and the active agent is polymerized to form a macromolecular polymer, so that the surface modification layer 30 is formed. The surface modification layer 30 and the cortical layer 50 are formed in the same step, which results in better adhesion between the surface modification layer 30 and the cortical layer 50, and less tendency for the cortical layer 50 to fall off.

Optionally, the surface of the leather layer 50 remote from the fibrous resin layer 10 has a texture, which may be, but is not limited to, a leather texture. Specifically, a texture corresponding to the texture of the surface of the leather layer 50 is imprinted on the surface of the injection mold, and then injection molding is performed using the injection mold so that the texture is formed on the surface of the leather layer 50 remote from the surface modification layer 30. The texture may be, but is not limited to, a texture that may provide the housing assembly 100 with a flashing function, a texture that may increase the appearance of the housing assembly 100. Specifically, the texture structure having the flash function may be formed by, but not limited to, disposing a coating layer having a high reflectivity on the surface of the texture structure.

Optionally, the raw material components of the cortical layer 50 include, but are not limited to, one or more of thermoplastic polyurethane elastomers (ThermoPlastic polyurethanes, TPU), thermoplastic silicone elastomers (Thermo Plastic SiliconeVulcaniate, TPSIV), or thermoplastic elastomers (Thermo Plastic Elastomer, TPE). Alternatively, the thermoplastic polyurethane may include, but is not limited to including, one or more of polyester polyurethane (e.g., spandex), polyether polyurethane, and the like; the thermoplastic silicone elastomer may be, but is not limited to, silica gel; the thermoplastic elastomer may be, but is not limited to, a thermoplastic rubber. Alternatively, the mass fraction of the elastomer in the raw material component of the leather layer 50 is 90wt% to 92wt%, specifically, but not limited to 90wt%, 90.5wt%, 91wt%, 91.5wt%, 92wt%, etc., and in other embodiments, the mass fraction of the elastomer may be other values, which is not particularly limited to the present application. The thermoplastic polyurethane elastomer, thermoplastic silicone elastomer, thermoplastic elastomer and the like are soft and elastic, so that the prepared leather layer 50 has better leather touch, the hand feeling of the shell assembly 100 is improved, and the user experience is improved.

Optionally, the raw material components of the cortical layer 50 also include lubricants, such as calcium stearate, zinc stearate, lead stearate, and the like. The mass fraction of lubricant in the raw material components of the leather layer 50 is 1wt% to 2wt%, and specifically may be, but not limited to, 1wt%, 1.2wt%, 1.5wt%, 1.8wt%, 2wt%, etc.

Optionally, the raw material composition of the cortical layer 50 further comprises color master batch (Color Master Batch). Alternatively, by controlling the color and the mixture ratio of the color master batch, the leather layer 50 can be made to present different color appearance effects. The mass fraction of the color master batch in the raw material component of the leather layer 50 is 5wt% to 8wt%, and specifically may be, but not limited to, 5wt%, 5.5wt%, 6wt%, 6.5wt%, 7wt%, 7.5wt%, 8wt%, etc.

Optionally, the raw material components of the cortical layer 50 also include antioxidants such as pentaerythritol tetrakis [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate (anaxidant 1010, antioxidant 1010), 2, 6-di-tert-butyl-p-cresol (Antioxidant 264), n-Octadecyl beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate (n-Octadecyl-beta- (4-hydroxy-3, 5-di-tert-butyl-phenyl) -propionate, antioxidant 1076), tris [2, 4-di-tert-butylphenyl ] phosphite (Tns- (2, 4-di-tert-butyl) -phosphate, antioxidant 168), and the like. The mass fraction of the antioxidant in the raw material component of the leather layer 50 is 0wt% to 1wt%, and specifically may be, but not limited to, 0.01wt%, 0.2wt%, 0.4wt%, 0.5wt%, 0.6wt%, 0.8wt%, 1.0wt%, etc.

Alternatively, the thickness of the cortical layer 50 is 0.3mm to 0.5mm, and in particular, may be, but not limited to, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.48mm, 0.5mm, etc. When the thickness of the cortical layer 50 is less than 0.3mm, it is difficult to achieve, increasing the difficulty of the process, and when the thickness of the cortical layer 50 is greater than 0.5mm, increasing the thickness of the housing assembly 100.

In other embodiments, the leather layer 50 may be formed (e.g., molded on release paper) in advance, and then adhered or thermally pressed to the surface of the surface modification layer 30 away from the fiber resin layer 10. When the leather layer 50 is formed by adhesion, the surface modification layer 30 is formed by coating a surface modification solution on the surface of the fiber resin layer 10 and volatilizing a solvent in the surface modification solution; when the leather layer 50 is formed by the thermal compression method, the surface modification layer 30 is formed by coating the surface of the fiber resin layer with the surface modification solution, volatilizing the solvent in the surface modification solution, and polymerizing the active agent in the surface modification solution during the thermal compression process, thereby finally forming the surface modification layer 30.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a housing assembly 100 according to another embodiment of the present application, and in the embodiment of fig. 2, the housing assembly 100 further includes a protective layer 70, where the protective layer 70 is located on a surface of the leather layer 50 away from the fiber resin layer 10.

Optionally, the material of the protective layer 70 includes, but is not limited to, one or more of polyurethane, polyvinyl chloride, and the like. The raw material components of the protective layer 70 may further include a protective agent such as an antioxidant. The protective layer 70 is used to provide the leather layer 50 with good stain resistance, fingerprint resistance, yellowing resistance, etc. The protective layer 70 is made of transparent material, the light transmittance of the protective layer 70 is greater than 80%, and further, the light transmittance of the protective layer 70 is greater than 88%. So that the color effect and/or texture effect of the cortical layer 50 can be observed through the protective layer 70. Specifically, the light transmittance of the protective layer 70 may be, but is not limited to, 80%, 85%, 88%, 90%, 92%, 95%, etc.

Referring to fig. 3, fig. 3 is a flow chart illustrating a method for manufacturing the housing assembly 100 according to an embodiment of the application. The manufacturing method of the housing assembly 100 of the present embodiment includes:

s201, preparing a fiber resin layer 10;

the preparation process of the fiber-resin layer 10 may be as follows:

1) Impregnating the fiber cloth 11 in the resin monomer mixed solution to obtain an impregnated sheet of the fiber cloth 11; and

specifically, the resin monomer mixture may be, but not limited to, an epoxy resin monomer mixture (e.g., bisphenol a epoxy resin monomer), a phenolic resin monomer mixture, a polyester resin monomer mixture, a thermoplastic resin monomer mixture, etc., and the resin monomer mixture is pre-cured to form a semi-cured resin, and is fully cured to form a resin.

The resin monomer mixture according to the embodiment of the present application may be a commercially available resin monomer mixture, or may be a resin monomer mixture obtained by a known production method, and the present application is not particularly limited.

2) The multi-layer fiber cloth 11 impregnated sheet is overlapped, and the resin monomer is heated to be solidified, so as to obtain the fiber resin layer 10, wherein the fiber resin layer 10 comprises the fiber cloth 11 and the resin 13 which wets the fiber cloth 11.

Specifically, the curing temperature may be 130 ℃ to 150 ℃, for example, but not limited to 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, and the like.

S202, forming a surface modification layer 30 on the surface of the fiber resin layer 10, wherein the surface modification layer 30 is used for modifying the surface of the fiber resin layer 10 and improving the dyne value of the surface of the fiber resin layer 10; and

in some embodiments, a surface modifying solution is provided, including but not limited to including an active agent, which reacts with the fiber resin layer 10 to form a surface modified coating by chemically bonding the surface modified layer to the surface of the fiber resin layer and drying at room temperature or 30 to 40 ℃ to volatilize an organic solvent in the surface modified solution. When polymerization does not occur after the temperature of the active agent in the surface-modified coating is raised or when the cortical layer 50 is formed, the surface-modified coating is the surface-modified layer 30; when polymerization occurs after the temperature of the active agent in the surface-modified coating is raised or when the cortical layer 50 is formed, the surface-modified coating after polymerization is the surface-modified layer 30.

Alternatively, the active agent includes, but is not limited to, one or more of isopropyl methacrylate, isobutyl methacrylate, triisopropyl borate, isopropyl ethacrylate, butyl orthosilicate; the mass fraction of the active agent is 0.06wt% to 0.15wt%; specifically, the mass fraction of the active agent may be, but is not limited to, 0.06wt%, 0.07wt%, 0.08wt%, 0.09wt%, 0.10wt%, 0.11wt%, 0.12wt%, 0.13wt%, 0.14wt%, 0.15wt%, etc. In some embodiments, the active agent comprises one or more of isopropyl methacrylate, isobutyl methacrylate, isopropyl ethacrylate, and the cortical layer 50 is formed by injection molding or hot pressing, and the active agent of the surface modifying coating polymerizes to form the surface modifying layer 30 when the cortical layer 50 is formed. In other embodiments, the active agent comprises one or more of triisopropyl borate and butyl orthosilicate, and the surface-modifying layer 30 is prepared by coating the surface of the fiber resin layer 10 with a surface-modifying solution, and volatilizing a solvent in the surface-modifying solution.

Optionally, the surface modifying solution further includes a polymerization inhibitor, which may be, but is not limited to, methoxy hydroquinone. Optionally, an organic solvent is also included, and the organic solvent may be, but is not limited to, one or more of isopropanol, n-butanol, toluene.

It should be understood that the surface modifying solutions of the present application may be self-contained and may also be commercially available surface modifying solutions.

And S203, forming a leather layer 50 on the surface of the surface modification layer 30 facing away from the fiber resin layer 10 to obtain the shell assembly 100.

In some embodiments, a sizing material of the leather layer 50 is injection molded on a surface of the surface modification layer 30 facing away from the fiber resin layer 10 to form the leather layer 50 to produce the housing assembly 100. Alternatively, at the time of injection molding, the temperature of the injection mold is 140 to 160 ℃, and specifically, may be, but not limited to, 140 ℃, 145 ℃, 148 ℃, 150 ℃, 153 ℃, 155 ℃, 158 ℃, 160 ℃, and the like. The temperature of the compound at the time of injection molding is 180 to 220 ℃, and specifically, but not limited to, 180 ℃, 185 ℃, 190 ℃, 195 ℃, 200 ℃, 210 ℃, 215 ℃, 220 ℃ and the like. In addition, the temperature of the injection mold and the sizing material during injection molding may be determined according to the melting temperature and the polymerization temperature of the raw materials of the thermoplastic material from which the leather layer 50 is made.

In other embodiments, a release paper having a texture corresponding to the texture of the leather layer 50 is provided, the leather layer 50 is formed on the release paper, and the leather layer 50 is formed on the surface of the surface modification layer 30 facing away from the fiber resin layer 10 by bonding or hot pressing.

In some embodiments, the active agent comprises one or more of isopropyl methacrylate, isobutyl methacrylate, isopropyl ethacrylate, and the cortical layer 50 is formed by injection molding or hot pressing, and the active agent of the surface modifying coating is simultaneously polymerized to form the surface modifying layer 30 when the cortical layer 50 is formed.

The manufacturing method of the housing assembly 100 is similar to the technical features of the embodiment of the housing assembly 100 described above, please refer to the above embodiment, and the description is omitted herein.

Referring to fig. 4, an embodiment of the present application further provides a housing assembly 100, which includes: a fibrous resin layer 10, said fibrous resin layer 10 having a modified surface 17; and a cortical layer 50 adhered to the modified surface 17 of the fiber resin layer 10, wherein the modified surface 17 has a dyne value of more than 32N/mm, that is, the surface of the unmodified fiber resin layer 10.

The shell assembly 100 of the application adopts the fiber resin layer 10 as a base material of the shell assembly 100, and the fiber resin layer 10 has high mechanical strength, so that the shell assembly 100 can be made thinner while ensuring the mechanical strength, and meanwhile, the fiber resin layer 10 has a modified surface 17; the modified surface 17 has a dyne value of more than 32N/mm, so that the adhesion property between the fiber resin layer 10 and the cortical layer 50 is better, less likely to fall off, and longer life.

In some embodiments, the surface of the fibrous resin layer 10 is surface treated with a surface modifying solution, wherein the surface modifying solution comprises an active agent, causing the active agent in the surface modifying solution to react with the fibrous resin layer 10 and form the modified surface 17 on the fibrous resin layer 10. In some embodiments, the fibrous resin layer 10 includes a fibrous cloth 11 and a resin 13 impregnating the fibrous cloth 11. Optionally, the weight ratio of the fiber cloth 11 to the resin 13 is 0.8:1 to 1.2:1, specifically, the weight ratio of the fiber cloth 11 to the resin 13 may be, but is not limited to, 0.8:1, 0.9:1, 1:1, 1.1:1, 1.2:1, or the like. When the weight ratio of the fiber cloth 11 to the resin 13 is 1:1, the fiber resin layer 10 has better mechanical strength.

In some embodiments, the modified surface 17 has a dyne value greater than or equal to 36N/mm, and specifically, may be, but not limited to, 36N/mm, 38N/mm, 40N/mm, etc.

In some embodiments, the active agent comprises one or more of isopropyl methacrylate, isobutyl methacrylate, triisopropyl borate, isopropyl ethacrylate, butyl orthosilicate; the mass fraction of the active agent is 0.06wt% to 0.15wt%.

In some embodiments, the housing assembly 100 of the present application further includes a protective layer 70, the protective layer 70 being located on a surface of the cortical layer 50 remote from the fiber resin layer 10.

The fiber resin layer 10, the surface modifying solution, the leather layer 50, the protective layer 70, etc. which are not modified in this embodiment have the same or corresponding technical features as those of the embodiment of fig. 1 and 2, and are not described in detail herein.

The embodiment of the application also provides a preparation method of the shell assembly, which comprises the following steps:

1) Preparing a fiber resin layer 10;

2) Modifying the surface of the fiber resin layer 10 with a surface modifying solution to form a modified surface 17; wherein the modified surface 17 has a dyne value greater than 32N/mm;

3) A cortical layer is formed on the modified surface of the fibrous resin layer to produce the housing assembly.

The detailed description of the same or corresponding technical features as those of the embodiments of fig. 1, 2 and 3 is referred to the above embodiments, and will not be repeated here.

The technical features described in the present document can be combined with each other to form a new technical scheme as long as the contradiction condition does not exist, and the scheme also belongs to the protection scope of the present application.

The effect of the surface modifying solution on the surface properties of the glass fiber epoxy resin layer, in other words, the effect of the surface modifying solution on the peeling force of the glass fiber epoxy resin layer surface from the adhesive tape is described below by way of example 1, comparative example 1 and comparative example 2.

Example 1 preparation of substrate 1

The substrate 1 of this example is a glass fiber epoxy resin layer coated with a surface modifying solution, and its preparation method is as follows:

1) The glass fiber epoxy resin layer is prepared as follows:

impregnating glass fiber cloth in a bisphenol A epoxy resin monomer mixed solution to obtain a glass fiber cloth impregnated sheet, and controlling the weight ratio of the glass fiber cloth to the epoxy resin monomer to be 1:1;

overlapping the multi-layer glass fiber cloth impregnating sheets, and heating to 140 ℃ to solidify bisphenol A epoxy resin monomers to obtain a glass fiber epoxy resin layer, wherein the glass fiber epoxy resin layer comprises glass fiber cloth and bisphenol A epoxy resin which infiltrates the glass fiber cloth;

2) Providing a surface modification solution, wherein the surface modification solution comprises the following components in percentage by weight: 97.87wt% of isopropanol, 2wt% of n-butanol, 0.03wt% of toluene, 0.02wt% of isopropyl methacrylate, 0.07wt% of isopropyl borate and 0.01wt% of a stabilizer;

3) The surface modification solution was applied to the surface of the glass fiber epoxy resin layer, and the resultant was dried at room temperature to form a surface modification layer, to prepare a substrate 1, and the substrate 1 was cut to obtain samples 1, 2 and 3 each having a width of 25 mm.

Comparative example 1 preparation of substrate 2

The substrate 2 of this example is a glass fiber resin layer and is prepared as follows:

impregnating glass fiber cloth in a bisphenol A epoxy resin monomer mixed solution to obtain a glass fiber cloth impregnated sheet, and controlling the weight ratio of the glass fiber cloth to the bisphenol A epoxy resin monomer to be 1:1;

and superposing the multi-layer glass fiber cloth impregnating sheets, heating to 140 ℃ to solidify bisphenol A epoxy resin monomers to obtain a base material 2, wherein the glass fiber epoxy resin layer comprises glass fiber cloth and bisphenol A epoxy resin which infiltrates the glass fiber cloth, and cutting the base material 2 to obtain a sample 1, a sample 2 and a sample 3 with the width of 25 mm.

Comparative example 2 preparation of substrate 3

Polycarbonate substrates (PC) having a width of 25mm were prepared to obtain samples 1, 2 and 3.

The peel force of example 1, comparative example 1 and comparative example 2 was tested using the following method:

1) A 3MVHB adhesive tape with the width of 25mm is respectively stuck on the surface of the substrate 1 coated with the surface modification solution, the surface of the substrate 2 and the surface of the substrate 3;

2) The base material to which the adhesive tape was attached was hot-pressed at 80 ℃ for 25 seconds, the adhesive tape and the base material of each sample were torn open into a small opening, the torn adhesive tape and the base material were respectively fixed at 180 ° to both sides of the pullout force tester, the peeling force required for peeling the adhesive tape from the base material was tested, data at the time of the test when the intermediate peeling force was stable was taken as peeling force data of the sample, and the measured peeling force data are shown in table 2 below.

Table 2 peel force test of substrate 1, substrate 2 and substrate 3

As can be seen from table 2, the peel force of the glass fiber epoxy resin layer (comparative example 1) to the adhesive tape was much lower than that of the polycarbonate (comparative example 2), indicating that the adhesion force of the unmodified glass fiber epoxy resin layer to soft feel materials such as the adhesive tape was low. After a layer of surface modification solution is coated on the surface of the glass fiber epoxy resin layer, the peeling force between the glass fiber epoxy resin layer and the adhesive tape (example 1) can be greatly improved, so that the adhesive force between the glass fiber epoxy resin layer and the soft-feel material can be improved. As can be seen from table 2, the peel force of the glass fiber epoxy resin layer and the adhesive tape after the surface modification solution was applied was twice or more the peel force of the polycarbonate and the adhesive tape.

The effect of the surface modifying solution on the dyne value of the surface of the glass fiber epoxy resin layer is described below by a specific experiment.

Examples 2 to 6 preparation of surface modified glass fiber epoxy resin layer substrates

The substrates of examples 2 to 6 in the following table 3 were prepared by the following method:

1) A glass fiber epoxy layer was prepared by the method of example 1, wherein the weight ratio of glass fiber cloth to epoxy was 1:1.

2) Surface modifying solutions of different concentrations are provided, including isopropyl alcohol, n-butanol, toluene, isopropyl methacrylate, isopropyl borate, and a polymerization inhibitor. The weight ratio of isopropanol, n-butanol and toluene in the surface modification solution is 98:2:0.03, isopropyl methacrylate and isopropyl borate in a weight ratio of 7:2.

3) Coating a surface modification solution on the surface of the glass fiber epoxy resin layer prepared in the step 1), and volatilizing a solvent in the surface modification solution to obtain samples 1 to 5 to be tested, wherein the concentrations of active agents in the surface modification solutions coated on the samples 1 to 5 are different, and the specific details are shown in the following table 3.

Comparative example the glass fiber epoxy resin layer prepared in comparative example 1 was used for comparison.

And (3) testing a dyne value: the dyne values of the surfaces of the samples 1 to 5 (the surfaces coated with the surface modification solutions) and the substrate 2 were measured using a dyne pen, and specific data are shown in table 3.

TABLE 3 dyne values of surface coated with surface modification solutions at different concentrations on the surface of glass fiber epoxy layer

As can be seen from table 3, after the glass fiber epoxy resin layer was coated with a surface modifying solution of a certain concentration and dried, when the mass fraction of the active agent in the surface modifying solution was lower than 0.06wt%, the dyne value of the prepared surface modifying layer 30 was comparable to that of the glass fiber epoxy resin layer surface without the surface modifying solution, when the mass fraction of the active agent in the surface modifying solution was higher than 0.06wt% and lower than 0.15wt%, the dyne value of the prepared sample was increased with the increase of the concentration of the active agent in the surface modifying solution, but when the mass fraction of the active agent in the surface modifying solution was higher than 0.15, the dyne value of the prepared substrate reached a peak value, and the change of the dyne value of the substrate was smaller, continuing to increase the concentration of the active agent.

The performance of the housing assembly made in accordance with the present application and the housing assembly prior to modification will be described below with reference to specific examples.

Examples 7 to 10 preparation of the housing Assembly

The preparation method of the shell component comprises the following steps:

1) Providing the substrate prepared in examples 2 to 6 above;

2) Coating the surface of the substrate of examples 2 to 6 with a surface modifying solution to form a leather layer sizing material, and respectively preparing the shell components of examples 7 to 10, wherein the leather layer sizing material comprises the following components in parts by weight: 90wt% of thermoplastic polyurethane, 2wt% of calcium stearate, 7wt% of color master batch and 1wt% of antioxidant 1010. Wherein, the thickness of the glass fiber epoxy resin layer of the prepared shell component is 0.3mm, the thickness of the surface modification layer is 8 mu m, and the thickness of the leather layer is 0.5mm.

Comparative example 3

A method of making a housing assembly, comprising:

1) Providing a polycarbonate substrate; and

2) A hot melt adhesive was used to adhere a leather layer to one side surface of a polycarbonate substrate, wherein the leather layer comprised 90wt% thermoplastic polyurethane, 2wt% calcium stearate, 7wt% color master batch, and 1wt% antioxidant 1010. Wherein, the thickness of the polycarbonate of the prepared shell component is 0.7mm, the thickness of the hot melt adhesive layer is 0.05mm, and the thickness of the leather layer is 0.5mm.

Peel performance test:

1) Test sample preparation: the housing assemblies prepared in examples 7 to 10 and comparative example 3 were cut into standard samples having a width of 2cm and a length of 5cm, respectively.

2) Clamping a sample: peeling the leather layer and the base material of each sample by hand or by means of a tool such as a blade for about 3cm, and fixing the torn leather layer and two ends of the base material at the upper end and the lower end of the drawing force testing machine at an angle of 180 degrees;

3) Setting test parameters: the stretching speed was 30mm/min and the test stroke was 5mm. The test was started, and the peel force for peeling the cortical layer from the substrate was measured in examples 7 to 10 and comparative example 3, and the test results are shown in table 4 below. Multiple tests may be used to average the peel performance test.

Table 4 shows the peel force test data for the housing assemblies prepared in examples 7 to 10 and comparative example 3

As can be seen from table 4, the peel force of the shell assembly prepared by the present application is approximately 3 times that of the shell assembly before improvement, so that the leather layer and the fiber resin layer of the shell assembly prepared by the present application have better adhesion property, are less likely to fall off after a period of use, and have longer service life.

Referring to fig. 5, an embodiment of the present application further provides an electronic device 300, where the electronic device 300 includes the housing assembly 100 according to the above embodiment of the present application.

The electronic device 300 of the present application may be, but is not limited to, a portable device or a wearable device such as a mobile phone, tablet computer, notebook computer, smart watch, smart bracelet, etc.

Alternatively, the housing assembly 100 may be, but is not limited to being, a battery back cover, a center, a trim piece, etc. of an electronic device.

Reference herein to "an embodiment," "implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Finally, it should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the above-mentioned preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present application without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A housing assembly, comprising:

a fibrous resin layer;

the surface modification layer is formed on the surface of the fiber resin layer and is used for modifying the surface of the fiber resin layer and improving the dyne value of the surface of the fiber resin layer, the dyne value of the surface modification layer is larger than that of the fiber resin layer, the raw material components of the surface modification layer comprise an active agent, the active agent comprises an ester group, and the fiber resin layer is connected with the surface modification layer through a chemical bond; and

and the leather layer is formed on the surface of the surface modification layer, which is away from the fiber resin layer, and has elasticity.

2. The housing assembly of claim 1, wherein the active agent comprises one or more of isopropyl methacrylate, isobutyl methacrylate, triisopropyl borate, isopropyl ethacrylate, butyl orthosilicate.

3. The housing assembly of claim 2, wherein the active agent comprises isopropyl methacrylate and isopropyl borate in a weight ratio of 7:2.

4. A housing assembly according to any one of claims 1 to 3, wherein the raw material components of the surface modification layer further comprise a polymerization inhibitor and a solvent; wherein the mass fraction of the active agent in the raw material component of the surface modification layer is 0.06wt% to 0.15wt%, and the mass fraction of the polymerization inhibitor in the raw material component of the surface modification layer is 0.01wt% to 0.03wt%.

5. The housing assembly of claim 1, wherein the surface of the fibrous resin layer modified by the surface modifying layer has a dyne value of 36N/mm or greater.

6. The housing assembly of claim 1, wherein the cortical layer is formed from a thermoplastic elastomer material by injection molding onto a surface of the surface modification layer facing away from the fiber resin layer.

7. The housing assembly of claim 1, wherein the fibrous resin layer has a thickness of 0.2mm to 0.5mm; the surface modification layer has a thickness of 5 μm to 10 μm; the thickness of the cortical layer is 0.3mm to 0.5mm.

8. An electronic device comprising a housing assembly according to any one of claims 1-7.