CN107163274B - Low-flow-glue prepreg - Google Patents
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Abstract
The invention discloses a low-flow prepreg, which comprises: a prepreg substrate comprising an upper surface and a lower surface opposite the upper surface; coating resin layers arranged on the upper surface and the lower surface of the prepreg substrate; the coating resin layer contains flexible long carbon chain high molecular weight resin; the prepreg substrate comprises a reinforcing material and an impregnating resin layer impregnated on the reinforcing material, wherein the impregnating resin layer contains resin with the weight-average molecular weight Mw of 100-5000 and 40-70% of filler by mass. Compared with the prior art, the low-flow prepreg has the characteristics of low flow and excellent toughness, the prepreg has good edge quality after mechanical punching, less resin powder falls off, no cavity is formed in the cured base material, the bonding performance is excellent, the thermal expansion coefficient is low, and the bending strength and the modulus are higher.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a halogen-free low-resin fluidity prepreg used as a bonding layer material in the production of special printed circuit boards such as rigid-flexible printed circuit boards, step plates, metal-based heat-dissipation cold plates and the like.
Background
The rigid-flexible printed circuit board, the step board and the metal-based heat dissipation cold plate are printed circuit boards which are in current demand and are in vigorous development, and the special printed circuit boards are effective means for realizing small-size high-density and safety performance improvement in the interconnection field.
The binding material used in the processing and manufacturing of printed circuit boards such as rigid-flex boards mainly comprises a pure resin adhesive film without a reinforcing material and a low-flow prepreg with the reinforcing material. The pure resin adhesive film is gradually replaced by a low-flow prepreg containing a reinforcing material due to poor heat resistance, low modulus, too large thermal expansion coefficient and the like, and the structure of the conventional prepreg is shown as figure 1 and comprises a reinforcing material 1 and a resin layer 2 impregnated on the reinforcing material. The earliest low-flow prepreg was realized by increasing the baking degree of a common prepreg, but the method has the defects of poor adhesion and the like.
In order to solve the above problems, the technical method for realizing low-flow prepreg at present is to design a resin formula, mainly including introducing high molecular weight materials such as rubber and phenoxy resin to increase the average molecular weight of the formula, increase the viscosity of the formula system, and assist with high-temperature moderate baking, for example, in patent CN102775734A, in order to realize low-flow prepreg, phenoxy resin, core rubber and high-molecular epoxy resin are added in the resin formula, and for example, in patent JP2006316104A, in order to realize low-flow prepreg, epoxidized polybutadiene is added in the resin formula, however, this method will increase the impregnation difficulty of the resin component to the reinforcing material to generate substrate defects, and at the same time, the high-viscosity resin composition will easily cause process problems to affect the appearance of prepreg, and cause defects to the printed circuit board in use, and more high-molecular weight materials will reduce the rigidity of the prepreg to increase the thermal expansion coefficient, problems of matching with the material to be bonded tend to occur.
Disclosure of Invention
The invention aims to provide a low-gummosis prepreg which has a special structure formed by different components, is small in gummosis, less in shedding of mechanical punching resin powder, good in cohesiveness, low in thermal expansion coefficient and high in rigidity retention rate, meets the use requirements of special printed circuit boards such as rigid-flexible combined boards, step boards and metal-based heat dissipation plates, and has better matching performance.
Wherein, low flow prepreg includes:
a prepreg substrate comprising an upper surface and a lower surface opposite the upper surface;
coating resin layers arranged on the upper surface and the lower surface of the prepreg substrate;
wherein the coating resin layer contains flexible long carbon chain high molecular weight resin; the prepreg substrate comprises a reinforcing material and an impregnating resin layer impregnated on the reinforcing material, wherein the impregnating resin layer contains resin with the weight average molecular weight Mw of 100-5000 and 40-70% of filler by mass.
As a further improvement of the invention, the thickness of the coating resin layer is 3 to 20 μm.
As a further improvement of the invention, the flexible long carbon chain high molecular weight resin has the structural formula:
wherein x, y and z are 0:0.85: 0.15-0.15: 0.5:0.35, x + y + z is less than or equal to 1, x is less than or equal to 0.15, y is less than or equal to 0.5 and less than or equal to 0.85, z is less than or equal to 0.15 and less than or equal to 0.35, n is more than or equal to 100 and less than or equal to 20000, and the weight average molecular weight is between 10 ten thousand and 100 ten thousand;
r1 is selected from one of the following structures: -OH, -COOH, -COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3、-CN、-Ph、-COOCH2Ph、-COOCH2CH2Ph、
R2 is selected from-H or-CH3；
R3 is selected from one of the following structures:
r4 is selected from one of the following structures: -Ph, -OH, -COOH, -COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3、-CN；
R5 is selected from one of the following structures:
as a further improvement of the invention, the glue overflow amount of the low-flow glue prepreg is less than or equal to 3mm, and the glue overflow amount of the prepreg substrate is less than or equal to 1 mm.
As a further improvement of the invention, the weight average molecular weight Mw of the flexible long carbon chain high molecular weight resin is 10-100 ten thousand, and the mass percentage thereof is 70-100%.
As a further improvement of the invention, the impregnating resin layer contains 55-68% by mass of filler, and the filler is selected from one or a combination of several of silicon dioxide, aluminum oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, clay, kaolin, glass powder, mica powder, talcum powder, titanium dioxide, zinc borate, zinc molybdate, aluminum nitride and boron nitride.
As a further improvement of the invention, the resin with the weight-average molecular weight Mw of 100-5000 is selected from one of epoxy resin, cyanate resin, benzoxazine resin, bismaleimide resin, polyphenyl ether resin, hydrocarbon resin, polyimide resin, polyamide resin or phenolic resin.
As a further improvement of the invention, the reinforcing material is selected from one of natural fibers, organic synthetic fibers, organic fabrics, inorganic fabrics and metal films.
As a further improvement of the present invention, the impregnating resin layer further comprises a curing agent and a curing accelerator, wherein the curing agent is one or a combination of any two of aliphatic amine, aromatic amine, alicyclic amine, heterocyclic amine, aromatic acid anhydride, alicyclic acid anhydride, aliphatic acid anhydride, polyamide resin, phenol novolac resin, polyphenol resin, arylamine formaldehyde resin, polysulfide compound, polyester resin, latent curing agent, flame retardant curing agent and active ester curing agent, and the curing accelerator is imidazole accelerator.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
the low-flow prepreg has the low-flow characteristic and excellent toughness, the prepreg has good edge quality through mechanical punching, the resin powder is less in falling, no cavity exists in the cured base material, the bonding performance is excellent, the thermal expansion coefficient is low, the bending strength and the modulus are higher, and the problems of insufficient bonding force of similar products, apparent pressing defects of rigid-flexible printed circuit boards caused by obvious falling of the resin powder through mechanical punching and the matching performance caused by larger thermal expansion coefficient or low modulus in the pressing process can be solved.
Drawings
FIG. 1 is a schematic diagram of a prepreg according to the prior art;
fig. 2 is a schematic structural diagram of a low flow prepreg according to an embodiment of the invention.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention. Variations in reaction conditions, amounts of reactants or starting materials, which may be made by one of ordinary skill in the art in light of these examples, are within the scope of the invention.
Referring to fig. 2, in one embodiment of the present invention, a low flow prepreg 10 includes: the prepreg substrate 11 comprises an upper surface and a lower surface opposite to the upper surface, and the coating resin layers 12 are arranged on the upper surface and the lower surface of the prepreg substrate 11. Preferably, the thickness of the coating resin layer is 3 to 20 μm, and the thickness of the coating resin layers provided on the upper and lower surfaces of the prepreg substrate 11 may be the same or different.
Further, the prepreg substrate 11 includes a reinforcing material 111 and an impregnation resin layer 112 impregnated on the reinforcing material 111, wherein the reinforcing material 111 is selected from one of natural fibers, organic synthetic fibers, organic fabrics, inorganic fabrics, and metal films; the impregnation resin layer 112 contains a resin having a weight average molecular weight Mw of 100-.
Further, the resin having the weight average molecular weight Mw of 100-5000 is selected from one of epoxy resin, cyanate ester resin, benzoxazine resin, bismaleimide resin, polyphenylene ether resin, hydrocarbon resin, polyimide resin, polyamide resin or phenolic resin.
The epoxy resin is selected from one or a combination of any more of phosphorus-containing epoxy resin, nitrogen-containing epoxy resin, multifunctional epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, tetraphenylethane epoxy resin, triphenylmethane epoxy resin, biphenyl epoxy resin, naphthalene ring epoxy resin, dicyclopentadiene epoxy resin, isocyanate epoxy resin, aralkyl novolac epoxy resin, polyphenyl ether modified epoxy resin, alicyclic epoxy resin, glycidyl amine epoxy resin and glycidyl ester epoxy resin.
The cyanate ester resin refers to a structure containing cyanate ester groups
The compound (b) can be one or a combination of more of bisphenol A cyanate resin, bisphenol F cyanate resin, bisphenol M cyanate resin, dicyclopentadiene cyanate resin, o-methyl novolac epoxy resin, phenol cyanate resin and polyphenylene oxide modified cyanate resin.
The benzoxazine resin can be one or the combination of more of bisphenol A type benzoxazine, bisphenol g type benzoxazine, bisphenol S type benzoxazine, bisphenol diamine type benzoxazine and dicyclopentadiene phenol type benzoxazine.
The hydrocarbon resin is selected from one or more of styrene-butadiene resin, polybutadiene resin, polyisobutylene resin, polypentadiene, polystyrene, 2-methyl polystyrene, 3-methyl polystyrene, 4-methyl polystyrene, 2, 4-diisopropyl polystyrene, 2, 4-dimethyl polystyrene, styrene-butadiene copolymer and styrene-isobutylene diene copolymer; the number average molecular weight of the hydrocarbon resin is less than 11000 and the vinyl content of the hydrocarbon resin is more than 60 percent. Preferably, the number average molecular weight of the hydrocarbon resin in the above technical solution is less than 7000. Preferably, in the above technical scheme, the hydrocarbon resin is one or a combination of more of styrene-butadiene resin, polybutadiene resin and polyisobutylene diene resin.
The bismaleimide can be a prepolymer produced by prepolymerization of allyl compounds and maleimide resin, wherein the allyl compounds are selected from one or more of allyl ether compounds, allyl phenol-oxygen resin, allyl phenolic resin, diallyl bisphenol A and diallyl bisphenol S; the maleimide resin is selected from one or more of 4,4 '-diphenylmethane bismaleimide resin, 4' -diphenyl ether bismaleimide resin, 4 '-diphenyl isopropyl bismaleimide resin and 4, 4' -diphenyl sulfone bismaleimide resin. The number average molecular weight of the allyl modified bismaleimide is 2000-5000.
Preferably, the mass portion of the filler in the resin impregnation layer 112 is 55-68%, and the filler is selected from one or a combination of several of silica, alumina, aluminum hydroxide, magnesium hydroxide, calcium carbonate, clay, kaolin, glass powder, mica powder, talcum powder, titanium dioxide, zinc borate, zinc molybdate, aluminum nitride and boron nitride.
More preferably, the silica is a spherical silica surface-treated with an epoxy silane coupling agent.
More preferably, a filler in the form of a sphere, plate, needle, horn or amorphous form or a mixture thereof is used, and the particle diameter thereof is 0.5 to 3 μm.
The impregnating resin layer 112 further includes a curing agent and a curing accelerator, the curing agent is selected from one or a combination of any more of aliphatic amine, aromatic amine, alicyclic amine, heterocyclic amine, aromatic anhydride, alicyclic anhydride, aliphatic anhydride, polyamide resin, novolac resin and polyphenol resin, arylamine formaldehyde resin, polysulfide compound, polyester resin, latent curing agent, flame retardant curing agent and active ester curing agent, the curing accelerator is an imidazole accelerator, and the imidazole accelerator may be specifically one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole.
The impregnation resin layer 112 may be added with one or a combination of additives such as a silane coupling agent, a pigment, an emulsifier, a dispersant, an antioxidant, an antistatic agent, a heat stabilizer, an ultraviolet absorber, a colorant, and a lubricant, depending on the actual conditions.
The coating resin layer 12 contains a flexible long carbon chain high molecular weight resin, and the structural formula of the flexible long carbon chain high molecular weight resin is as follows:
wherein x, y and z are 0:0.85: 0.15-0.15: 0.5:0.35, x + y + z is less than or equal to 1, x is less than or equal to 0.15, y is less than or equal to 0.5 and less than or equal to 0.85, z is less than or equal to 0.15 and less than or equal to 0.35, n is more than or equal to 100 and less than or equal to 20000, and the weight average molecular weight is between 10 ten thousand and 100 ten thousand;
r1 is selected from one of the following structures: -OH, -COOH, -COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3、-CN、-Ph、-COOCH2Ph、-COOCH2CH2Ph、
R2 is selected from-H or-CH3；
R3 is selected from one of the following structures:
r4 is selected from one of the following structures: -Ph, -OH, -COOH, -COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3、-CN；
R5 is selected from one of the following structures:
in the above technical solution, preferably in the structure of the flexible long carbon chain high molecular weight resin,
r1 is preferably selected from-OH, -COOH, -COOCH3、-OCOCH3One of (1);
r2 is preferably-H;
r3 is selected from one of the following structures:
r4 is preferably selected from-OH, -COOH, -COOCH3、-OCOCH3One of (1);
r5 is selected from one of the following structures:
The weight average molecular weight Mw of the flexible long carbon chain high molecular weight resin is 10-100 ten thousand g/mol, and the mass percentage is 70-100%.
Preferably, the glue overflow amount of the low-flow glue prepreg 10 is less than or equal to 3mm, and the glue overflow amount of the prepreg substrate 11 is less than or equal to 1 mm. The amount of overflow was measured according to the method specified in IPC-TM-6502.3.17.2.
the resin composition is firstly impregnated or coated on the reinforcing material, then the prepreg substrate is prepared by high-temperature baking, finally the resin layers are coated on the upper surface and the lower surface of the prepreg substrate by using a coating technology, and the low-flow-rate prepreg 10 is prepared by baking.
The low-flow prepreg is used for preparing copper clad plates, insulating plates, rigid circuit boards, flexible circuit boards, rigid-flex printed circuit boards, step plates or metal-based heat dissipation cold plates, and is particularly used for preparing rigid-flex printed circuit boards.
In order to better illustrate the invention, specific examples of the preparation of low flow prepregs are provided below.
A low-flow-rate prepreg comprises a prepreg substrate 11 and coating resin layers 12 coated on the upper surface and the lower surface of the prepreg substrate 11, wherein the prepreg substrate 11 further comprises a reinforcing material 111 and an impregnating resin layer 112 impregnated on the reinforcing material 111. The preparation method comprises the following steps of uniformly mixing the components to prepare a 50% resin solution by adopting the formula shown in the following table 1 and table 2, impregnating the resin solution with electronic-grade 2116 fiberglass cloth serving as a reinforcing material, controlling the content of the impregnated resin according to the design that the content of prepreg resin is 60%, heating the prepreg in an oven at 165 ℃ for 3-8min to prepare a prepreg substrate, coating pure resin layers with the thickness of 5-10 mu m on the upper surface and the lower surface of the prepreg substrate by using a coating technology, and heating in the oven at 165 ℃ for 1-3min to prepare the low-flow adhesive prepreg.
TABLE 1 examples
TABLE 2 comparative examples
Note: in the context of tables 1 and 2,
a1: phosphorus modified epoxy resin (Shengquan, SQEP-808EK70)
A2: bisphenol A epoxy (Hexion, EPON 828)
A3: a3: biphenyl type epoxy (NIPPON KAYAKU, NC-3000H)
B1: dicyandiamide
B2: diamino diphenyl sulfone
C: ball silicon (Admatechs, SC2050-MB)
D: 2-ethyl-4-methylimidazole
E: bisphenol A type phenoxy resin (Shengquan, SQEP-32AMX)
F: nitrile rubber (Kumho, CBE-800)
G1: the flexible long carbon chain polymer resin has the following structure:
wherein R1 is-OH, R2 is-H, R3 is
R4 is-COOH, R5 is
x, y, z is 0.14:0.69:0.17, Mw is 32 ten thousand.
G2: the flexible long carbon chain polymer resin has the following structure:
wherein R1 is-OH, R2 is-H, R3 is
R4 is-OH, R5 is
x, y, z is 0.09:0.73:0.18, Mw is 41 ten thousand.
In the embodiment, the low flow prepreg manufactured according to the prepreg substrate structure and the component requirements shown in the invention has low glue overflow, good die-cut edge quality, lower powder removal rate, lower thermal expansion coefficient, higher bending strength and modulus compared with the comparative example.
Part of the low flow prepreg was pressed into a laminate under the following conditions, and then various properties of the low flow prepreg and the laminate were evaluated by the following methods.
The manufacturing conditions of the laminated board are as follows:
stacking: 8, 2116; thickness of copper foil: 1 OZ; thickness of the formed plate: 0.8 mm; curing conditions are as follows: the temperature is raised by 3 to 5 ℃/min, and the material temperature is 190 ℃/1 to 2 hours.
Prepreg test items: glue overflow amount and edge punching quality;
and (3) measuring the glue overflow amount: the amount of run-out of the prepreg was measured as specified by IPC-TM-6502.3.17.2 to evaluate the run-out under hot pressing.
Determination of the quality of the punched edge: and (3) punching the prepreg by using a sampler for testing the resin content, placing the punched sample under a magnifying glass of 10 times to observe the edge whitening degree, wherein the more whitening obviously represents that the resin powder falls off more, the quality of the punched edge is poor, and if the whitening is slight or invisible, the quality of the punched edge is good.
Determination of powder removal rate: the falling degree of the resin powder after the punching/shearing treatment of the prepreg is taken as a judgment basis. The test was carried out by taking 10cm x 10cm sized pieces of prepreg 4, weighing them and recording them as m 1. A notch with the depth of 9cm is cut on one side of the sample by a pair of scissors, 29 cutters are cut in total, each sample is made into a small strip with the length of 30 strips and the length of 9cm, and each sample is treated in the same way. The hand-held processed sample was vibrated up and down 30 times with the wrist as the center, and one vibration was recorded back and forth as one vibration. After completion, the weight was again measured and recorded as m2, and the powder removal rate of the prepreg was calculated as (m1-m2)/m1 × 100%.
Copper clad laminate test items: adhesion, wicking heat resistance, substrate mass, Z-axis coefficient of thermal expansion (Z-CTE), flexural strength, flexural modulus.
Peel strength: the peel strength of the metal cap was tested according to the "post thermal stress" experimental conditions in the IPC-TM-6502.4.8 method.
Tin immersion heat resistance: using a 50 x 50mm copper-bearing sample, immersed in solder at 288 ℃, the time to delamination blistering of the sample was recorded.
Base material quality: and (3) manufacturing a metallographic section by using the well-pressed sample, and observing whether a cavity exists in the sample under a metallographic microscope after polishing the sample to be smooth.
Thermal expansion coefficient of Z axis: the test was carried out by the TMA method in accordance with the method specified by IPC-TM-6502.4.24.
Flexural strength/modulus: the flexural strength at room temperature was measured according to the method specified in IPC-TM-6502.4.4, and the flexural modulus was obtained.
The invention has the following advantages:
1. the low-flow-glue prepreg has a double-layer structure, the inner layer is a prepreg substrate, and a low-molecular-weight high-fluidity resin system is matched with a high-proportion filler, so that the prepreg substrate is ensured to be soaked and simultaneously the characteristics of low fluidity, high heat resistance, high modulus and low thermal expansion coefficient are provided; the long carbon chain flexible high molecular weight resin in the outer coating resin layer forms entanglement through the polarity and reactivity of functional groups carried by the resin layer and a molecular diffusion effect, so that good adhesion and toughness with a prepreg substrate and a contact medium are ensured, and the low fluidity of the resin is also ensured due to the ultrahigh molecular weight.
2. The low-flow-glue prepreg can adjust the overall glue overflow amount by respectively adjusting the glue overflow sizes of the inner layer structure and the outer layer structure, and can also adjust the glue overflow amount by adjusting the thickness of the resin layer coated on the outer layer according to application requirements so as to meet the glue filling requirements in specific application examples.
3. The low-flow-glue prepreg structure can be popularized to prepregs of all resin systems at present, so that the low-flow-glue prepreg with special performance is quickly realized, and the use requirement of a special printed circuit board is met.
In conclusion, the low-flow-rate prepreg has the characteristics of controllable glue overflow size, less shedding of mechanically punched resin powder, high heat resistance, high modulus, low thermal expansion coefficient, good bonding force and the like, can quickly realize serialization, and meets various requirements.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (7)
1. A low flow prepreg, comprising:
a prepreg substrate comprising an upper surface and a lower surface opposite the upper surface;
coating resin layers arranged on the upper surface and the lower surface of the prepreg substrate;
the coating resin layer contains flexible long carbon chain high molecular weight resin, the weight average molecular weight Mw of the flexible long carbon chain high molecular weight resin is 10-100 ten thousand, and the mass percentage of the flexible long carbon chain high molecular weight resin is 70-100%; the prepreg substrate comprises a reinforcing material and an impregnating resin layer impregnated on the reinforcing material, wherein the impregnating resin layer contains resin with the weight average molecular weight Mw of 100-5000 and 40-70% of filler by mass;
the structural formula of the flexible long carbon chain high molecular weight resin is as follows:
wherein x, y and z are 0:0.85: 0.15-0.15: 0.5:0.35, x + y + z is less than or equal to 1, x is less than or equal to 0.15, y is less than or equal to 0.5 and less than or equal to 0.85, z is less than or equal to 0.15 and less than or equal to 0.35, n is more than or equal to 100 and less than or equal to 20000, and the weight average molecular weight is between 10 ten thousand and 100 ten thousand;
r1 is selected from one of the following structures: -OH, -COOH, -COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3、
R2 is selected from-H or-CH3；
R3 is selected from one of the following structures:
r4 is selected from one of the following structures: -OH, -COOH, -COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3；
R5 is selected from one of the following structures:
2. the low flow prepreg according to claim 1, wherein the coating resin layer has a thickness of 3 to 20 μm.
3. The low flow prepreg according to claim 1, wherein the low flow prepreg overflow is less than or equal to 3mm and the prepreg substrate overflow is less than or equal to 1 mm.
4. The low flow prepreg according to claim 1, wherein the impregnating resin layer contains 55-68% by mass of a filler selected from one or a combination of silica, alumina, aluminum hydroxide, magnesium hydroxide, calcium carbonate, clay, kaolin, glass powder, mica powder, talc, titanium dioxide, zinc borate, zinc molybdate, aluminum nitride and boron nitride.
5. The low flow prepreg according to claim 4, wherein the resin with the weight average molecular weight Mw of 100-5000 is selected from one of epoxy resin, cyanate ester resin, benzoxazine resin, bismaleimide resin, polyphenylene oxide resin, hydrocarbon resin, polyimide resin, polyamide resin or phenolic resin.
6. The low flow prepreg according to claim 1, wherein the reinforcing material is selected from one of natural fibers, organic synthetic fibers, organic fabrics, inorganic fabrics, and metal films.
7. The low flow prepreg according to claim 1, wherein the impregnating resin layer further comprises a curing agent and a curing accelerator, the curing agent is one or a combination of any of aliphatic amine, aromatic amine, alicyclic amine, heterocyclic amine, aromatic anhydride, alicyclic anhydride, aliphatic anhydride, polyamide resin, novolac resin and polyphenol resin, arylamine formaldehyde resin, polysulfide compound, polyester resin, latent curing agent, flame retardant curing agent and active ester curing agent, and the curing accelerator is imidazole accelerator.
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| CN108359221A (en) * | 2018-03-16 | 2018-08-03 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg using its preparation |
| CN108384236A (en) * | 2018-03-16 | 2018-08-10 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg using its preparation |
| CN110835456B (en) * | 2019-12-05 | 2022-06-24 | 陕西生益科技有限公司 | Epoxy resin composition and application thereof |
| CN110978724B (en) * | 2019-12-07 | 2022-02-08 | 浙江元集新材料科技股份有限公司 | Manufacturing method of high-frequency high-speed copper-clad plate |
| CN114149658B (en) * | 2021-12-31 | 2024-04-09 | 常熟生益科技有限公司 | Resin composition and low-gummosis prepreg prepared from same |
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