CN108359221A - A kind of resin combination and the low flow prepreg using its preparation - Google Patents

A kind of resin combination and the low flow prepreg using its preparation Download PDF

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Publication number
CN108359221A
CN108359221A CN201810219796.8A CN201810219796A CN108359221A CN 108359221 A CN108359221 A CN 108359221A CN 201810219796 A CN201810219796 A CN 201810219796A CN 108359221 A CN108359221 A CN 108359221A
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resin
epoxy resin
flexible chain
parts
long flexible
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何继亮
马建
崔春梅
陈诚
张明军
罗鹏辉
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Suzhou Shengyi Technology Co Ltd
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Suzhou Shengyi Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention discloses a kind of resin combinations, in terms of organic solid content parts by weight, including：（A）Epoxy resin：50 ~ 100 parts；（B）Long flexible chain resin：1 ~ 30 part；（C）Epoxy curing agent：2 ~ 100 parts；（D）Long flexible chain resin curing agent：0.1 ~ 100 part；The long flexible chain resin contains 2 or more hydroxy functional groups；The long flexible chain resin curing agent is selected from one or more of isocyanates, modified isocyanate, isocyanate-terminated base polyurethane prepolymer for use as, isocyanate-terminated organosilicon performed polymer, boric acid, borax.The present invention can form long flexible chain resin cross-linking system in the epoxy curing systems cured gummosis stage, to assign entire resin composition system very low glue overflow amount, solve the problems, such as it is that the problem of shearing of toughness deficiency loses powder and glue overflow amount are bigger than normal existing for prepreg in the prior art.

Description

A kind of resin combination and the low flow prepreg using its preparation
Technical field
The present invention relates to a kind of low flow prepregs of its preparation of resin combination and application, belong to electronic material technology Field.
Background technology
Currently, rigid/flexible combined printed circuit board and stepped plate etc. are demand and the just prosperous printed circuit board of development instantly, this The special printed circuit board of class is the effective means realized interconnection field Miniature high-densityization and promote security performance.
The special printed circuit board such as existing rigid-flex combined board is solid using the half of low Resin Flow in processing and fabricating Change piece as bonding layer material, before pressing, low flow prepreg is carried out by mechanical punching according to printed circuit board product structure Processing is cut, is then pressed with after rigid printed board and flexible printed board overlapping.For conventional FR-4 prepregs, low tree Gummosis is minimum at high temperature under high pressure or hardly gummosis for Membranous lipid fluidity prepreg, but still has good caking property, can will The dielectric material being in contact with it bonds well.
The low flow prepreg of early stage on the basis of conventional FR-4 by increase baking time promoted the extent of reaction come Realize low gummosis, but there are cohesive forces it is insufficient, toughness is insufficient the problems such as.
Low flow prepreg at this stage generally passes through the phenoxy resin of high molecular weight, rubber and other thermoplasticity high scores Sub- material comes modified epoxy and other matrix resins, as low in order to realize in Chinese invention patent application CN102775734A Gummosis adds phenoxy resin, shell core rubber and macromolecule epoxy resin in resin formula.However, existing low gummosis bonds Although piece solves the problems, such as that bonding is hypodynamic, but there are problems that the shearing of toughness deficiency loses powder and glue overflow amount is bigger than normal and ask Topic, causes the application of the prepreg of low Resin Flow and seriously affects.For another example, Chinese invention patent application It is disclosed in CN107286583A and flexible Long carbon chain high molecular weight resin is used for epoxy resin, but found in practical application：It presses Glue overflow amount problem bigger than normal is still had in actual use according to the prepreg that above-mentioned technical proposal is prepared, it cannot Meet practical application request.
Invention content
The goal of the invention of the present invention is to provide a kind of resin combination and the low flow prepreg using its preparation.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of resin combination, with organic solid content Parts by weight meter, including：
(A) epoxy resin：50~100 parts；
(B) long flexible chain resin：1~50 part；
(C) epoxy curing agent：2~100 parts；
(D) long flexible chain resin curing agent：0.1~100 part；
The long flexible chain resin contains 2 or 2 or more hydroxy functional groups；
The long flexible chain resin curing agent is selected from isocyanates, modified isocyanate, isocyanate-terminated poly- ammonia One or more of ester performed polymer, isocyanate-terminated organosilicon performed polymer, boric acid, borax.
Preferably, the isocyanates be toluene di-isocyanate(TDI), ethylbenzene diisocyanate, isopropyl phenylene diisocyanate, Methyl diphenylene diisocyanate, diphenyldimethyhnethane diisocyanate, dimethyl diphenyl diisocyanate, dimethoxy Biphenyl diisocyanate, di-ethylbenzene diisocyanate, diisopropyl phenylene diisocyanate, Biphenyl Ether diisocyanate, to first Benzenesulfonyl isocyanate, n-butyl isocyanate or polymethylene are to phenylisocyanate.
Preferably, the modified isocyanate is the modifier of above-mentioned isocyanates.
Preferably, the long flexible chain resin curing agent is boric acid or borax, and dosage is 0.1-5 parts.When a small amount of boron Acid or borax as long flexible chain resin curing agent addition resin combination when, obtained resin combination solidfied material it is heat-resisting Performance is more beneficial.
The selection of above-mentioned long flexible chain resin curing agent it is critical that the long flexible chain resin curing agent and long flexible chain tree The solidification temperature of fat is less than the curing reaction temperature of epoxy resin, but has good stability again at normal temperatures, such Long flexible chain resin curing agent is conducive to the control and storage of resin system glue overflow amount.
The dosage of the long flexible chain resin curing agent can be 0.5 part, 1 part, 1.5 parts, 2 parts, 3 parts, 5 parts, 10 parts, 15 Part, 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts.
Above, the epoxy resin can be phosphorous epoxy resin, it is nitrogen-containing epoxy thermoset, polyfunctional epoxy resin, double Phenol A epoxy resin, bisphenol F epoxy resin, tetraphenyl ethane epoxy resin, triphenyl methane epoxy resin, biphenyl type epoxy tree Fat, naphthalene nucleus type epoxy resin, dicyclopentadiene type epoxy resin, isocyanate-based epoxy resin, aralkyl novolac epoxy Resin, polyphenyl ether modified epoxy resin, alicyclic based epoxy resin, glycidyl amine type epoxy resin, ethylene oxidic ester type ring One kind in oxygen resin or arbitrary several mixture.If the low flow prepreg for having high heat resistance demand, then need to select Select the high heat stable resin composition composition such as biphenyl type epoxy resin, naphthalene nucleus type epoxy resin, aralkyl linear phenolic epoxy resin； If the low flow prepreg for having low-dielectric that can require, then selection dicyclopentadiene type epoxy resin, polyphenyl ether modified is needed The special epoxy resins such as epoxy resin.50~100 parts by weight of the epoxy resin can be 50 parts, 60 parts, 70 parts, 80 parts, 90 Part, 100 parts.
Preferably, the epoxy resin is selected from bisphenol A epoxide resin, bisphenol F epoxy resin, tetraphenyl ethane epoxy tree Fat, triphenyl methane epoxy resin, biphenyl type epoxy resin, naphthalene nucleus type epoxy resin, dicyclopentadiene type epoxy resin, isocyanide Sour ester type epoxy resin, aralkyl linear phenolic epoxy resin, polyphenyl ether modified epoxy resin, alicyclic based epoxy resin, contracting Water glyceramine type epoxy resin, glycidyl ester type epoxy resin, phosphorous epoxy resin, nitrogen-containing epoxy thermoset, multi-functional epoxy One or more of resin.
Above, the long flexible chain resin of the component B is the long flexible chain containing 2 or 2 or more hydroxy functional groups Resin can be polyvinyl alcohol, polyvinyl alcohol modification object, hydroxyl modification polysiloxanes, hydroxymethyl cellulose, polyether polyols Any one or a few in alcohol, polyester polyol；The polyvinyl alcohol modification object can be the poly- second of hydroxylic moiety acetalation The polyvinyl alcohol that enol, hydroxylic moiety are esterified；The polyvinyl alcohol of the hydroxylic moiety acetalation can be polyvinyl formal, The polyvinyl alcohol of polyvinyl acetal polyvinyl butyral etc., the hydroxylic moiety esterification can be polyvinyl alcohol phosphoric acid Ester.Preferably, the hydroxy functional group number that the long flexible chain resin contains is 3 or 3 or more.
The content of the long flexible chain resin is 1~50 part, can be 1 part, 2 parts, 5 parts, 10 parts, 15 parts, 20 parts, 30 Part, 40 parts, 50 parts, preferably 2~30 parts by weight.The additive amount of the long flexible chain resin can also be more, but additive amount In the case of too many, the heat resistance that may result in resin combination is deteriorated, as glass transition temperature declines.
In above-mentioned technical proposal, the key of the long flexible chain Choice of Resin is：Selected long flexible chain resin can lead to Flexibility and the self-curing rear and epoxy resin solidifying system for crossing itself form inierpeneirating network structure and play good increasing Tough effect.
Preferably, the long flexible chain resin is selected from polyvinyl alcohol, polyvinyl alcohol modification object, hydroxymethyl cellulose, polyhydroxy One or more of base modified polyorganosiloxane；
The structural formula of the polyvinyl alcohol modification object is：
Wherein, x：y：Z=0：0.85：0.15~0.15：0.5：0.35, wherein x+y+z≤1,0≤x≤0.15,0.5≤ Y≤0.85,0.15≤z≤0.35；100≤n≤20000；Its weight average molecular weight is between 50,000 to 500,000；
R1Selected from-OH ,-COOH ,-COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3、-CN、-Ph、- COOCH2Ph、-COOCH2CH2Ph、Or
R2Selected from-H ,-CH3Or-OH；
R3One kind in having structure：
R4Selected from-Ph ,-OH ,-COOH ,-COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3Or-CN；
R5One kind in having structure：
Wherein R1、R2、R4、R5In at least one contain hydroxyl.
In above-mentioned technical proposal, the long flexible chain resin is preferably polyvinyl alcohol modification object.To the resistance to of resin combination Wet performance, wet-hot aging performance and dimensional stability all improve significantly.
In above-mentioned technical proposal, the epoxy curing agent is selected from aliphatic amine, aromatic amine, cycloaliphatic amines, heterocycle Amine, aromatic anhydride, alicyclic acid anhydrides, aliphatic anhydride, polyamide, phenolic resin and poly- phenol resin, arylamine formaldehyde tree One or more of fat, polysulfides, polyester resin, latent curing agent, flame retardant curing agent, active ester.Preferably, institute It states epoxy curing agent and is selected from dicyandiamide, aromatic diamines class curing agent, linear phenol-aldehyde resin, aromatic anhydride, alicyclic acid One or more of acid anhydride, aliphatic anhydride and active ester.
In above-mentioned technical proposal, the mass ratio of the component B and D is 0.5~20：1.Preferably 0.5~10：1, more there is choosing , the mass ratio of the component B and D is 1~9：1.More preferably 2~8：1.More preferably 3~7：1.More preferably 4~6：1. More preferably 5：1.
In above-mentioned technical proposal, the resin combination also includes 2~10 parts of macromolecular phenoxy resin, the macromolecular Phenoxy resin can be bis-phenol A glycidyl ether type, Bisphenol F diglycidyl ether type or biphenyl type diglycidyl ether type phenoxy resin One or more of；Preferably, weight average molecular weight is 5000~70000.The additive amount of the phenoxy resin it is excessive or Molecular weight crosses the wellability variation that mostly may result in resin adhesive liquid to reinforcing material, while the adhesive strength after resin solidification It is deteriorated, eventually leads to the less reliable for not flowing bonding sheet.In addition, due to the flexibility described in phenoxy resin and said program Dissolubility of the long-chain resin in conventionally used solvent differs greatly, it usually needs could be good by the two using mixed solvent It is dissolved in a kind of solution, is susceptible to the problem of one of which resin is precipitated in actual use.Thus, from processing work The angle of skill is set out, it should be noted that the addition of control phenoxy resin.
In above-mentioned technical proposal, the resin combination also includes 10~20 parts of rubber or modified rubber.The rubber Or modified rubber is core shell rubbers, end carboxyl modified butadiene acrylonitrile rubber；Preferably solid rubber or modified solid rubber.
In above-mentioned technical proposal, the resin combination also includes that 20~100 polyimide resins or allyl are modified Bimaleimide resin, it is by allyl compound and maleimide resin that the allyl, which is modified span imide resin, The prepolymer that prepolymerization generates, number-average molecular weight are 2000~5000g/mol；The allyl compound is selected from allyl ether Compound, allyl phenoxy resin, allyl phenol urea formaldehyde, diallyl bisphenol, one kind in diallyl bisphenol S or several Kind；The maleimide resin is selected from 4,4 '-diphenyl methane dimaleimide resins, 4,4 '-diphenyl ether bismaleimides Polyimide resin, 4,4 '-hexichol isopropyl bimaleimide resins, one kind in 4,4 '-diphenyl sulphone (DPS) bimaleimide resins or It is several.
In above-mentioned technical proposal, the resin combination also includes inorganic filler, the content of the inorganic filler relative to 100 parts by weight meter of resin combination total amount is 20~300 parts by weight；
The inorganic filler is selected from powdered quartz, fused silica, preparing spherical SiO 2, aluminium oxide, hydrogen-oxygen Change aluminium, aluminium nitride, boron nitride, titanium dioxide, strontium titanates, barium titanate, barium sulfate, talcum powder, calcium silicates, calcium carbonate, mica, gather One or more of tetrafluoroethene, graphene.
The content of inorganic filler is preferably 30~150 parts by weight, more preferably 40~140 parts by weight, more preferably 50~ 130 parts by weight, more preferably 60~120 parts by weight, more preferably 70~110 parts by weight, more preferably 80~100 parts by weight, More preferably 90 parts by weight.
Inorganic filler can be surface-treated through silane coupling agent, can be direct plungeed into or previously prepared filler dispersion liquid Or it is made in lotion input resin combination；The grain size preferable particle size of inorganic filler is 0.5~10 micron.
In above-mentioned technical proposal, the fire retardant of 5~50 solid weight parts is may also include in the resin combination.The resistance It can be phosphorus flame retardant, nitrogenated flame retardant, organic silicon fibre retardant and inorganic flame retardant etc. to fire agent.Wherein, phosphorus flame retardant Can be Phos, phosphate compound, phosphinic acid compounds, phosphinic compounds, phosphine oxide compound and 9,10- dihydros- Miscellaneous phenanthrene -10- the oxides of 9 oxa- -10- phosphines, -9 miscellaneous phenanthrene -10- oxygen of oxa- -10- phosphines of 10- (2,5 dihydroxy phenyl) -9,10- dihydros Compound, the miscellaneous phenanthrene -10- oxides of -9 oxa- -10- phosphines of 10- phenyl -9,10- dihydros, three (2,6 3,5-dimethylphenyl) phosphonitriles etc. are organic Phosphorus-containing compound.Nitrogenated flame retardant can be triaizine compounds, cyanuric acid compound, isocyanide acid compound, phenthazine etc..It is organic Silicon fire retardant can be organic silicone oil, organic silicon rubber, organic siliconresin etc..Inorganic combustion inhibitor can be aluminium hydroxide, hydrogen-oxygen Change magnesium, aluminium oxide, barium monoxide etc..
In above-mentioned technical proposal, the resin combination further includes curing accelerator；The curing accelerator is selected from imidazoles One or more of class accelerating agent, amine type accelerator, tin class accelerating agent；
The imidazoles accelerating agent is 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- phenylimidazoles or 2- phenyl -4- Methylimidazole；
The amine type accelerator is triethylene diamine or N- amino morpholines；
The tin class accelerating agent is dibutyl tin laurate or stannous octoate.
A kind of low flow prepreg is claimed in the present invention simultaneously, by above-mentioned resin composition in reinforcing material, Toasted drying, you can obtain the low flow prepreg.Preparation method is as follows：By composition epoxy resin, flexibility Long-chain resin, epoxy curing agent, long flexible chain resin curing agent, curing agent accelerating agent and diluent are added to mixed glue kettle In, solid content 60%-70% is stirred evenly, and is cured 4-8 hours, and the halogen-free resin composition glue of the present invention is made； Then reinforcing material is immersed in above-mentioned halogen-free resin composition glue, then by the reinforcing material after dipping in 100-200 Under DEG C environment the low flow prepreg is can be obtained after baking 3-10min dryings.
The reinforcing material is natural fiber, organic synthetic fibers, organic fabric or inorganic fabric.
The diluent includes epoxide diluent, N, N ,-dimethylformamide, acetone, butanone, propylene glycol monomethyl ether, second two One or more of alcohol ether, methanol, ethyl alcohol, benzene or toluene.
Since above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：
1. the present invention adds long flexible chain resin curing agent and epoxy curing agent in epoxy-resin systems, and soft Property long-chain resin curing agent can form long flexible chain resin cross-linking system in the epoxy curing systems cured gummosis stage, this is soft Property long-chain resin system be cross-linked to form network structure hinder epoxy resin flowing, it is non-to assign entire resin composition system Normal low glue overflow amount solves the problems, such as it is that toughness deficiency shearing picking and glue overflow amount are bigger than normal existing for prepreg in the prior art The problem of, achieve significant effect；
2. experiment shows have extremely low Resin Flow, the low gummosis half solid using prepreg produced by the present invention It is fabulous to change piece toughness, falls off almost without apparent resin-oatmeal through machinery punching, while having both excellent cohesive force, heat resistance, fire-retardant Property, excellent combination property.
Specific implementation mode
With reference to embodiment, the invention will be further described：
Synthesis example 1-2 is the synthesis of long flexible chain resin of the present invention, and embodiment 1-8 and comparative example 1-6 are offers of the present invention Resin combination and low flow prepreg preparation and its performance evaluation.
Synthesis example 1
In the three-necked flask of drying of blender, thermometer and reflux condensing tube is installed, the acetic acid after purification is added Vinyl acetate 400g (4.65mol), 0.1gAIBN and 250mL acetone, the heating water bath under stirring, control bath temperature are It 50-65 DEG C, maintains the reflux for；After a period of time, reactant starts to become sticky and be generated along with bubble in flask, waits for reactant It when middle bubble no longer rises and is in elongated strip substantially, then adds 250mL acetone into flask and continues to stir, wait for mixing in flask Stop reaction when conjunction object viscosity is almost unchanged.Mixture in flask is poured out into washing and is filtered, after in 100 DEG C of constant temperature ovens do Dry 12h, obtains vinyl acetate polymer.Then, copolymer 1 00g is taken, using being poured into flask after 100mL acetone solutions And be kept stirring, 150mL methanol and NaOH methanol solution 50mL is then added, the polyvinyl alcohol (PVA) that partial alcoholysis is made is molten Liquid, after dry, washing, which is dissolved in be made in solvent dimethylformamide 15% resin solution (C1), the tree The Mw of fat is 110,000.
Synthesis example 2
In the three-necked flask of drying of blender, thermometer and reflux condensing tube is installed, the acetic acid after purification is added Vinyl acetate 400g (4.65mol), 0.1gAIBN and 250mL acetone, the heating water bath under stirring, control bath temperature are It 50-55 DEG C, maintains the reflux for.After a period of time, reactant starts to become sticky and be generated along with bubble in flask, waits for reactant It when middle bubble no longer rises and is in elongated strip substantially, then adds 250mL acetone into flask and continues to stir, wait for mixing in flask Stop reaction when conjunction object viscosity is almost unchanged.Mixture in flask is poured out into washing and is filtered, after in 100 DEG C of constant temperature ovens do Dry 12h, obtains vinyl acetate polymer.Then, copolymer 1 00g is taken, using being poured into flask after 100mL acetone solutions And be kept stirring, the hydrochloric acid 100mL of 150mL methanol and 2mol/l is then added, polyvinyl alcohol (PVA) is made；After a period of time 37% formalin of 150g mass concentrations is added, holding bath temperature is 50 DEG C, and after 10h plus NaOH adjustment PH is 6, is added after filtering Water waits for that product is precipitated, and is then washed with 40 DEG C or so of soft water, then through dry polyhydroxy long flexible chain resin.The resin is used Glycol monoethyl ether (MC) dissolves, and the resin solution (C2) of 15% solid content is made.Its structural formula is as follows：
Wherein, R1For-OH, R2For-H, R3ForR4For-OH, R5Forx:y:Z= 0.08:0.73:0.19, Mw is 400,000.
Embodiment 1-8 and comparative example 1-6
Be formulated according to shown in Tables 1 and 2, by each component be uniformly mixed be made 50% resin solution, use electron level 2116 glass-fiber-fabrics are impregnated with above-mentioned resin solution as reinforcing material, and prepreg is then heating and curing certain time i.e. in baking oven Low flow prepreg is obtained, part prepreg is pressed into laminate by following conditions, then passes through following methods evaluation half The properties of cured sheets and laminate.
Prepreg and laminate manufacturing conditions：
Prepreg semi-solid preparation condition：Embodiment 1-8 and comparative example 1,3,5,6 are 170 DEG C/4min, comparative example 2,4 For 180 DEG C/4min；Folded structure：5*2116；Copper thickness：1OZ；Plate thickness after molding：0.5mm；Condition of cure：Temperature rises 3-5 DEG C/min, 190 DEG C/1-2h of material temperature.
Prepreg test event：Glue overflow amount, piercing edge quality, picking rate；
The measurement of glue overflow amount：PP is made to the square-like of 100mm*100mm sizes, one 1 inch is rushed in centre position Circular hole, PP samples are then stacked in one according to the mode of folding of " steel plate+copper-clad plate+PP samples+release film+padded coaming+steel plate " It rises, is pressed using the press for setting temperature/pressure/time, the glue overflow amount of circular sample hole site is taken out after the completion of pressing, with Evaluate its gummosis size under hot pressing condition.
The measurement of piercing edge quality：The sampler of prepreg resin content test is punched, it will be under punching Sample is placed in 10 times of amplification microscopic observation edges and whitens degree, whiten more obviously represent resin-oatmeal fall off it is more.
The measurement of toughness (shedding rate)：With prepreg after punching/shear treatment resin-oatmeal fall off degree be judge according to According to.Specific test method is to take 4 small pieces of prepreg of 10cm*10cm sizes, weighs and is recorded as m1.With scissors at it certain The notch of 9cm depths is cut on one side, cuts 29 knives altogether, and the small item containing 30 long 9cm is made in every sample, and every is done same place Reason.Hand-held sample position up-down vibration 30 times centered on wrist handled well, one is denoted as primary vibration back and forth.After the completion again It is secondary to weigh and be recorded as m2, press (m1-m2)/m1* 100% calculates the shedding rate up to the prepreg.
Peel strength：According to " after thermal stress " experiment condition in IPC-TM-650 2.4.8 methods, metallic cover layer is tested Peel strength.
<The measurement of dielectric constant and dielectric loss tangent>Dielectric constant uses tablet according to IPC-TM-6502.5.5.9 Method measures the dielectric constant under 1GHz；Dielectric loss tangent：Flat band method is used according to IPC-TM-650 2.5.5.9, is measured Dielectric loss factor under 1GHz.
Glass transition temperature Tg：Using DMA methods, tested according to IPC-TM-650 2.4.25 defined methods.
Anti-flammability：It is measured according to UL94 vertical combustions.
1 embodiment of table
2 comparative example of table
Component Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5 Comparative example 6
A1 P Modification epoxies 75 75 70 70 85 75
A2DCPD epoxies
A3 biphenyl epoxies 15 15 25 25 10 15
A4UV-EP 10 10 5 5 5 10
B1PN 50
B2 active esters
B3Dicy 6 6 6
B4DDS 18 18
C1 20 20
C2 5 5
D1 polyisocyanates
D2 oligomeric isocyanates
D3 boric acid
E1 rubber 10
E2 phenol oxygen 10 10 10 10 10 10
F1 organotin catalysts
F2 imidazoles 0.1 0.1 0.2 0.2 0.15 0.1
G ball silicon 50 50 120 120 100 50
Glue overflow amount (mm) 0.5 0.2 0.6 0.3 0.8 0.5
Piercing edge quality It is good Difference It is good Difference Difference Difference
Shedding rate (%) 0.16 0.6 0.25 0.8 1.5 0.8
Peel strength (N/mm) 1.37 0.9 1.3 0.7 1.1 1.1
Glass transition temperature (DEG C) 173 173 220 220 190 175
Dielectric constant 4.26 4.26 4.22 4.22 4.2 4.22
Anti-flammability V-0 V-0 V-0 V-0 V-0 V-0
The footnote of Tables 1 and 2：
A1：P Modification epoxy resin (holy well, SQEP-808EK70)
A2：DCPD-containing epoxy resin (DIC, HP-7200H-75M)
A3：Biphenyl type epoxy (NIPPON KAYAKU, NC-3000H)
A4：Tetrafunctional epoxy (Hexion, EPON1031)
B1：Phenol type phenolic resin (KOLON, KPH2004)
B2：Active ester (import)
B3：Dicyandiamide
B4：Diaminodiphenylsulfone
C1：The made flexible Long carbon chain high molecular weight resin (C1) of synthesis example 1
C2：The made flexible Long carbon chain high molecular weight resin (C2) of synthesis example 2
D1：Methyl diphenylene diisocyanate
D2：Methyl diphenylene diisocyanate is modified terminal hydroxy group polymethyl siloxane (self-control)
D3：Boric acid
E1：Nitrile rubber (Zeon, Nipol 1312)
E2：Bisphenol A-type phenoxy resin (holy well, SQEP-32AMX)
F1：Dibutyl tin laurate
F2：2-ethyl-4-methylimidazole
G：Ball silicon (joins auspicious, DQ1028L)
It was found from the result of Tables 1 and 2：
Long flexible chain resin curing system is added in embodiment 1-8, and compared to comparative example 1-6, toughness, glue overflow amount bonding can be all Very excellent level can be reached.Embodiment 1-8 has lower glue overflow amount, compared to comparative example compared to comparative example 1 and 3 With better peel strength and lower picking rate.Embodiment 4 is compared with 5 with comparative example 1,3, in addition to smaller excessive glue Amount is outer, also has superior peel strength, lower dielectric constant, higher glass transition temperature.Embodiment 4,5 and right Ratio 2,4 is compared, although comparative example 2,4 obtains comparable glue overflow amount, comparative example by the method for improving solidification temperature 2,4 picking rate greatly improves, peel strength declines to a great extent；Especially when long flexible chain resin curing agent selects the implementation of boric acid Example 3-8 obtains more excellent glass transition temperature and glue overflow amount compared to the embodiment 1-2 of selection isocyanates.
In conclusion the low flow prepreg of its preparation of resin combination using the present invention and application has low gummosis Characteristic, and have excellent toughness, prepreg is high-quality through mechanical piercing edge, and resin-oatmeal falls off few.Caking property after solidification, Heat resistance and anti-flammability are excellent, can solve similar product glue overflow amount is bigger than normal, cohesive force is insufficient, through machinery punching resin-oatmeal fall off The problems such as obviously causing rigid/flexible combined printed circuit board to press visual defects.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest range caused.

Claims (10)

1. a kind of resin combination, which is characterized in that in terms of organic solid content parts by weight, including：
(A) epoxy resin：50~100 parts；
(B) long flexible chain resin：1~50 part；
(C) epoxy curing agent：2~100 parts；
(D) long flexible chain resin curing agent：0.1~100 part；
The long flexible chain resin contains 2 or 2 or more hydroxy functional groups；
It is pre- that the long flexible chain resin curing agent is selected from isocyanates, modified isocyanate, isocyanate-terminated polyurethane One or more of aggressiveness, isocyanate-terminated organosilicon performed polymer, boric acid, borax.
2. resin combination according to claim 1, it is characterised in that：The isocyanates be toluene di-isocyanate(TDI), Ethylbenzene diisocyanate, isopropyl phenylene diisocyanate, methyl diphenylene diisocyanate, diphenyldimethyhnethane diisocyanate Ester, dimethyl diphenyl diisocyanate, dimethoxy-biphenyl diisocyanate, di-ethylbenzene diisocyanate, diisopropyl benzene Diisocyanate, Biphenyl Ether diisocyanate, tolysulfonyl isocyanates, n-butyl isocyanate or polymethylene are to benzene isocyanide Acid esters.
3. resin combination according to claim 1, it is characterised in that：The epoxy resin be selected from bisphenol A epoxide resin, Bisphenol F epoxy resin, tetraphenyl ethane epoxy resin, triphenyl methane epoxy resin, biphenyl type epoxy resin, naphthalene nucleus type ring oxygen Resin, dicyclopentadiene type epoxy resin, isocyanate-based epoxy resin, aralkyl linear phenolic epoxy resin, polyphenylene oxide change Property epoxy resin, alicyclic based epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, phosphorous ring One or more of oxygen resin, nitrogen-containing epoxy thermoset, polyfunctional epoxy resin.
4. resin combination according to claim 1, it is characterised in that：The long flexible chain resin be selected from polyvinyl alcohol, One or more of polyvinyl alcohol modification object, hydroxymethyl cellulose, polyhydroxy modified polyorganosiloxane；
The structural formula of the polyvinyl alcohol modification object is：
Wherein, x：y：Z=0：0.85：0.15~0.15：0.5：0.35, wherein x+y+z≤1,0≤x≤0.15,0.5≤y≤ 0.85,0.15≤z≤0.35；100≤n≤20000；Its weight average molecular weight is between 50,000 to 500,000；
R1Selected from-OH ,-COOH ,-COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3、-CN、-Ph、- COOCH2Ph、-COOCH2CH2Ph、
R2Selected from-H ,-CH3Or-OH；
R3One kind in having structure：
R4Selected from-Ph ,-OH ,-COOH ,-COOCH3、-OCOCH3、-COOCH2CH3、-COOCH2CH2CH2CH3Or-CN；
R5One kind in having structure：
Wherein R1、R2、R4、R5In at least one contain hydroxyl.
5. resin combination according to claim 1, it is characterised in that：The epoxy curing agent is selected from aliphatic Amine, aromatic amine, cycloaliphatic amines, heterocyclic amine, aromatic anhydride, alicyclic acid anhydrides, aliphatic anhydride, polyamide, phenolic aldehyde Resin and poly- phenol resin, arylamine formaldehyde resin, polysulfides, polyester resin, latent curing agent, flame retardant curing agent, activity One or more of ester.
6. resin combination according to claim 1, it is characterised in that：The mass ratio of the component B and D is 0.5~20： 1。
7. resin combination according to claim 1, it is characterised in that：The resin combination also includes 10~20 portions of rubbers Glue or modified rubber.
8. resin combination according to claim 1, it is characterised in that：The resin combination also includes inorganic filler,
The content of the inorganic filler is 20~300 parts by weight based on 100 parts by weight of resin combination total amount；
The inorganic filler be selected from powdered quartz, fused silica, preparing spherical SiO 2, aluminium oxide, aluminium hydroxide, Aluminium nitride, boron nitride, titanium dioxide, strontium titanates, barium titanate, barium sulfate, talcum powder, calcium silicates, calcium carbonate, mica, polytetrafluoro One or more of ethylene, graphene.
9. resin combination according to claim 1, it is characterised in that：The resin combination further includes that imidazoles promote Any one or a few in agent, amine type accelerator, tin class accelerating agent；The imidazoles accelerating agent is 2-methylimidazole, 2- second Base -4-methylimidazole, 2- phenylimidazoles, 2- phenyl -4-methylimidazole；The amine type accelerator is triethylene diamine, N- amino Morpholine；The tin class accelerating agent is that have dibutyl tin laurate, stannous octoate.
10. a kind of low flow prepreg, it is characterised in that：By any resin composition in the claims 1~9 in Reinforcing material, toasted drying, you can obtain the low flow prepreg.
CN201810219796.8A 2018-03-16 2018-03-16 A kind of resin combination and the low flow prepreg using its preparation Pending CN108359221A (en)

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CN109504033B (en) * 2018-10-30 2021-01-01 广东翔思新材料有限公司 Flexible prepreg and preparation method thereof
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CN109859894A (en) * 2018-12-27 2019-06-07 广西纵览线缆集团有限公司 Overhead transmission line high-strength aluminum alloy conducting wire
CN112037966A (en) * 2018-12-27 2020-12-04 广西纵览线缆集团有限公司 High-strength aluminum alloy conductor
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CN112608582A (en) * 2020-11-02 2021-04-06 建滔（江苏）化工有限公司 Resin composition and preparation method and application thereof
CN114106514A (en) * 2021-12-15 2022-03-01 广东生益科技股份有限公司 Epoxy resin composition, prepreg containing same, laminated board and printed circuit board
CN114106514B (en) * 2021-12-15 2023-09-12 广东生益科技股份有限公司 Epoxy resin composition, prepreg comprising same, laminated board and printed circuit board
CN114163961A (en) * 2022-01-10 2022-03-11 中国科学院兰州化学物理研究所 Polyurethane modified epoxy resin adhesive material and preparation method and application thereof
CN114163961B (en) * 2022-01-10 2022-09-20 中国科学院兰州化学物理研究所 Polyurethane modified epoxy resin adhesive material and preparation method and application thereof

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