WO2020032339A1 - Electromagnetic wave shielding material having metal thin film and liner and method for manufacturing same - Google Patents

Electromagnetic wave shielding material having metal thin film and liner and method for manufacturing same Download PDF

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Publication number
WO2020032339A1
WO2020032339A1 PCT/KR2019/002304 KR2019002304W WO2020032339A1 WO 2020032339 A1 WO2020032339 A1 WO 2020032339A1 KR 2019002304 W KR2019002304 W KR 2019002304W WO 2020032339 A1 WO2020032339 A1 WO 2020032339A1
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Prior art keywords
liner
thin film
metal thin
substrate
shielding material
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PCT/KR2019/002304
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French (fr)
Korean (ko)
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곽규범
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주식회사 크린앤사이언스
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Publication of WO2020032339A1 publication Critical patent/WO2020032339A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/64Joining a non-plastics element to a plastics element, e.g. by force
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74Joining plastics material to non-plastics material
    • B29C66/742Joining plastics material to non-plastics material to metals or their alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1866Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212Electromagnetic interference shielding

Definitions

  • the present invention relates to an electromagnetic wave shielding material having a metal foil and a liner and a method of manufacturing the same. More specifically, by covering the inside or the outside of the base of the molded article with a metal thin film and then attaching a thin film liner, the electromagnetic shielding material that can be mass produced in a short time with high efficiency, high strength, light weight and low cost, and a manufacturing method thereof It is about.
  • Korean Patent No. 10-0990154 (2010.10.20) discloses a substrate layer in which metal nanopowder is dispersed in a nonflammable material; A first metal layer provided on one surface of the base layer; A first chromate layer provided on the first metal layer to prevent oxidation of the first metal layer; A first resin layer provided on the first chromate layer to block ultraviolet rays; And a first antistatic layer provided on the first resin layer to prevent static electricity.
  • Japanese Laid-Open Patent Publication No. 2009-267230 states that, in an electromagnetic shielding material, a conductive metal layer having high magnetic permeability has a small diameter in order to cover the surface of the fiber so that the clearance between the fibers is not filled.
  • the electromagnetic wave shielding material is formed on the surface of one side or both sides of the fiber cloth to be included, the electromagnetic wave shielding material having moisture permeability, bright in weight and excellent in elasticity.
  • Korean Patent No. 10-460297 discloses a metal foil ribbon having a specific permeability of 1000 or more and a pressure-sensitive adhesive layer formed on at least one surface of a metal foil ribbon having a thickness of 1 to 900 ⁇ m and a width of 1 to 90 mm and a metal foil ribbon. Electromagnetic shielding material using the metal foil ribbon of the high permeability containing "is disclosed.
  • Patent No. 10-376960 (2003.3.08) “A method of forming a functional film for shielding electromagnetic waves on a plastic substrate, after forming a multi-layer plating film on the surface of the plastic substrate, the final electromagnetic shielding gold (Au)
  • a single film of each material or a combination of these films is formed by using a sputtering target made of at least one of nickel, chromium, an alloy of nickel and chromium on a multilayer plated film by a magnetron sputtering method.
  • a technique for depositing and forming a multilayer film formed thereon are disclosed.
  • Patent No. 10-707382 (2007.4.06) discloses that "the mixing ratio of the electromagnetic wave absorbing blocking material composition made of ferrite powder, which is an oxide magnetic material, compared to the mixing ratio of the synthetic resin composition, is 80 to 90% by weight or more based on the total composition of the electromagnetic wave absorber.
  • a liquid electromagnetic wave absorber is coated to have a thickness of about 0.01 to 0.5 mm on the surface of the thin heat resistant film paper using an application roller, and then cured by passing through a drying furnace, followed by removing the heat resistant film paper, to produce a flexible thin film type electromagnetic wave absorber.
  • Absorber is disclosed.
  • the present invention has been invented to solve the above-mentioned problems and difficulties, high efficiency, high strength, light weight, by attaching a thin film liner after covering the inside or the outside of the base of the molded article (Base) with a metal film It is to provide an electromagnetic shielding material and a method of manufacturing the same that can be mass produced in a short time at low cost.
  • the present invention is 1) a substrate made of a molded article; 2) a metal thin film disposed inside the substrate; 3) a liner formed inside the metal thin film; 4) including the base material, a metal thin film and a liner, the bottom of the base is formed with a mounting groove for firmly mounting the metal thin film and the liner, the flange of the base is formed with an attachment hole, Provided is an electromagnetic shielding material having a metal thin film and a liner, wherein a gap is formed between the substrate and the liner.
  • the present invention provides a method for producing an electromagnetic shielding material having a metal thin film and a liner for manufacturing the electromagnetic shielding material.
  • the electromagnetic shielding material having the metal thin film and the liner of the present invention by attaching a thin film liner after covering the inside or the outside of the base (base) of the molded article with the metal thin film can have the advantages of high efficiency, high strength and light weight. .
  • the manufacturing method of the electromagnetic shielding material having a metal thin film and a liner has the advantage that it can mass-produce the electromagnetic shielding material in a short time at a low cost by a simple method.
  • FIG. 1 is a cross-sectional view and a partially enlarged view of an electromagnetic shielding material having a metal thin film and a liner of the present invention.
  • FIG. 2 is another example of a sectional view and a partially enlarged view of an electromagnetic shielding material having a metal thin film and a liner of the present invention.
  • FIG 3 is an exploded view in which each component of the electromagnetic shielding material for producing the electromagnetic shielding material having the metal thin film and the liner of the present invention is disposed.
  • FIG. 4 is a schematic block diagram illustrating a method of manufacturing an electromagnetic shielding material having a metal thin film and a liner of the present invention.
  • the electromagnetic shielding material having the metal foil and the liner of the present invention and a method of manufacturing the same are not limited thereto, and may be used without limitation in various apparatuses and devices requiring electromagnetic shielding.
  • FIG. 1 to 4 there is shown a schematic diagram of a shielding material for explaining an electric wave shielding material having a metal thin film and a liner and a method of manufacturing the same according to the present invention.
  • Method for producing an electromagnetic wave shielding material having a metal thin film and a liner comprises: 1) a first step of preparing a substrate as a molded article formed with a mounting groove at the bottom; 2) a second step of placing a metal thin film of an appropriate size inside the substrate of the first step; 3) After placing the liner inside the metal thin film of the second step, and then applying an adhesive to the flange portion of the substrate so that the substrate and the liner does not separate, and pressing with a crimping mechanism (A) A third step of mounting the metal thin film and the liner while maintaining a constant distance; 4) after the third step is characterized in that it comprises a fourth step of trimming (trimming) the edge of the metal thin film exposed to the outside.
  • the first step is a preparation step for the method of manufacturing an electromagnetic shielding material having a metal thin film and a liner according to the present invention, and is a step of preparing a substrate as a molded article formed with a mounting groove at the bottom.
  • any material capable of forming a molded article that can be used as a base (Base, 10) is possible.
  • the mounting groove 11 may be formed at the lower end of the substrate 10 to be a molded article in order to firmly mount the metal thin film 20 and the liner 30.
  • the flange 40 of the substrate 10 forms an attachment hole 40 for firm attachment of the shielding material.
  • the second step is to place a metal thin film of an appropriate size inside the substrate of the first step.
  • the metal thin film 20 is placed in the inside of the substrate 10 prepared in the first step after cutting the metal thin film 20 to suit the size and size of the substrate 10.
  • the metal thin film various kinds can be cited, but among them, it is preferable that the metal thin film is any one selected from copper, nickel, and aluminum thin films.
  • the liner is placed inside the metal thin film of the second step, and then an adhesive is applied to the flange portion of the substrate so that the substrate and the liner are not separated, and then pressed by a crimping mechanism, the gap between the substrate and the liner It is a step of mounting the metal thin film and the liner while maintaining a constant distance.
  • the liner 30 should be placed inside the metal thin film 20, and the metal thin film 20 should be positioned inside the base 10.
  • FRP fiber-reinforced plastic
  • SMC sheet molding compound
  • BMC bulk molding compound
  • the thickness of the liner 30 in the form of the thin film is preferably 1.0 to 2.5 mm. If the thickness is less than 1.0 mm, there is a risk that the liner is too thin and breaks upon mounting. If the thickness is more than 2.5 mm, the thickness is too thick, resulting in poor adhesion.
  • the portion to which the adhesive is applied is uniformly pressed by using a pressing device such as a simple press or a pressing machine, while maintaining the distance A between the substrate 10 and the liner 30 at a predetermined distance, the metal thin film 20 And liner 30 can be mounted.
  • the spacing (A) is preferably maintained in the range of 0.2 ⁇ 1.0mm, when the spacing (A) is less than 0.2mm there is a risk of damage to the metal thin film 20 when mounted, if the thickness exceeds 1.0mm metal thin film
  • the adhesiveness of 20 may deteriorate and the quality of a shielding material may deteriorate.
  • the fourth step is trimming by trimming the edge portion of the metal thin film exposed to the outside after the third step.
  • the fourth step is a finishing step of the method for manufacturing an electromagnetic shielding material having a metal thin film and a liner according to the present invention. After the third step, the edge portion of the metal thin film 20 exposed to the outside is trimmed using a knife or the like removing means. trimming) to produce a finished shielding material.
  • the electromagnetic shielding material produced by continuously performing the processes of the first to fourth steps is relatively strongly coupled to the metal thin film 20 and the liner 30 through the mounting groove 11 formed in the substrate 10. It is possible to manufacture a product which is lightweight and has excellent mechanical properties such as strength. Furthermore, since the substrate 10 and the liner 30 made of a molded product are taken out by a press from a mold, it can be mass-produced in a short time and in a simple manner at a low cost. In view of the time required for the production of the molded article, three minutes is sufficient for sheet molding compound (SMC) and bulk molding compound (BMC) as a molding material, and ten minutes is sufficient for thermoplastic resin.
  • SMC sheet molding compound
  • BMC bulk molding compound
  • a substrate to be a molded article 1) a substrate to be a molded article; 2) a metal thin film disposed inside the substrate; 3) a liner formed inside the metal thin film; 4) including the base material, a metal thin film and a liner, the bottom of the base is formed with a mounting groove for firmly mounting the metal thin film and the liner, the flange of the base is formed with an attachment hole, It is possible to manufacture an electromagnetic shielding material having a metal thin film and a liner, wherein a gap A is formed between the substrate and the liner.
  • the method for manufacturing the electromagnetic wave shielding material having the metal thin film and the liner includes: 1) a molded product having mounting grooves formed at a lower end thereof; Preparing a liner; 2) a second step of placing a metal thin film of an appropriate size inside the liner of the first step; 3) A substrate formed of a molded article is placed inside the metal thin film of the second step, and then an adhesive is applied to the flange portion of the liner so that the substrate and the liner are not separated, and then pressed with a crimping mechanism, between the substrate and the liner.
  • a third step of mounting the metal thin film and the liner while maintaining the distance at a constant distance; 4) after the third step is characterized in that it comprises a fourth step of trimming (trimming) the edge of the metal thin film exposed to the outside.
  • the first step is to prepare a liner as a molded article formed with a mounting groove at the bottom.
  • any material capable of forming a molded article that can be used as the liner 30 can be used.
  • the mounting groove 11 may be formed at the lower end of the liner 30 formed as a molded product in order to firmly mount the metal thin film 20 and the substrate 10.
  • the flange of the liner 30 forms an attachment hole 40 for firm attachment of the shielding material.
  • the second step is to place a metal thin film of an appropriate size inside the liner of the first step.
  • This is a case where the liner 30 is mounted on the outside of the substrate 10, and the substrate 10 is a liner (compared with the second step when the liner 30 is mounted on the inside of the substrate 10). 30) and the rest are the same, so a description thereof will be omitted.
  • the substrate is placed inside the metal thin film of the second step, and then an adhesive is applied to the flange portion of the liner so that the substrate and the liner are not separated, and then pressed by a crimping mechanism, the gap between the substrate and the liner.
  • the liner 30 should be placed outside the metal thin film 20, and the metal thin film 20 should be located outside the substrate 10.
  • An adhesive is applied to a flange portion that is an edge of the liner 30 so that the substrate 10 and the liner 30 are not separated.
  • the fourth step is trimming by trimming the edge portion of the metal thin film exposed to the outside after the third step. This is the same as the case in which the liner 30 is mounted inside the substrate 10, so a description thereof will be omitted.
  • the electromagnetic shielding material produced by continuously performing the processes of the first to fourth steps is a product having excellent mechanical properties such as light weight and strength due to the relatively strong bonding of the metal thin film 20 and the substrate 10 to the liner 30. Can be prepared. Furthermore, other effects are the same as those when the liner 30 is mounted inside the substrate 10, and thus description thereof will be omitted.
  • the electromagnetic shielding material having a metal thin film and a liner is 1) a substrate to be a molded article; 2) a metal thin film disposed outside the substrate; 3) a liner formed on the outside of the metal thin film; 4) including the base material, a metal thin film and a liner, the lower end of the liner is formed with a mounting groove for firmly mounting the metal thin film and the substrate, the flange (flange) of the liner is formed, A gap is formed between the substrate and the liner.
  • the electromagnetic wave shielding material according to the present invention could be manufactured according to the following process.
  • the sheet molding compound (SMC) was weighed to fit the size and shape of the base material 10, put into a mold, pressed and demolded to form a liner 30 having a thickness of 1.5 mm.
  • the metal thin film 20 and the liner 30 are placed inside the substrate 10, and then an adhesive is applied to the flange portion of the substrate 10 so that the substrate 10 and the liner 30 are not separated. Then, while pressing at a pressure of 2 kgf / cm2 by a simple press through the mounting groove 11 of the substrate 10 while maintaining the distance (A) between the substrate and the liner at 0.5 mm and the metal thin film 20 and The liner 30 was firmly mounted.
  • Example 1 Compared to Example 1, instead of placing the metal thin film 20 and the liner 30 inside the substrate 10, respectively, only the point of placing the metal thin film 20 and the substrate 10 inside the liner 30, respectively.
  • the shielding material was prepared in the same manner except for the others.
  • An electromagnetic shielding material having a thickness of 0.75 mm was manufactured using a cold rolled steel sheet (SPCC).
  • Resin film, metal fiber yarn, thin film aluminum, metal fiber yarn, resin film are laminated in this order, melt the resin film, compress it with a punch of press mold, harden the molten resin, and then shape it by molding 3.0mm thick using thin film aluminum.
  • the electromagnetic shielding materials prepared in Examples 1 and 2 and Comparative Examples 1 and 2 were made into reference specimens (29.7 mm ⁇ 21.0 mm), and the shielding rate was measured according to IEEE-Std-299, which is the international standard most commonly used measurement method. The results are shown in Table 1.
  • the electromagnetic wave shielding materials prepared in Examples 1, 2 and Comparative Example 2 were measured for mechanical properties such as flexural strength by KSM 3015 (general test method for thermosetting plastics), and barcol hardness and weight were measured. Is shown in Table 2.
  • Example 1 Comparative Example 1 Comparative Example 2 Remarks Flexural strength MPa 180.2 180.1 - 115.3 o Barcol hardness measured by Barcol hardness tester GYZJ 934-1. The tensile strength MPa 90.5 90.3 - 67.1 Bacol Hardness - 48.1 47.9 - 33.1 weight g / m2 3,508 3,509 6,096 4,465
  • the electromagnetic wave shielding material according to the preferred embodiment of the present invention is not only light and has a laminated structure of the shielding material compared to the electromagnetic wave shielding material of Comparative Example 2, but also has flexural strength and the like. It can be seen that there is an excellent advantage in the mechanical properties and shielding rate. Furthermore, the electromagnetic shielding material according to Examples 1 and 2 has a shielding rate in the band of frequency 700 to 1400 kHz and is much lighter than the shielding material manufactured using the cold rolled steel sheet (SPCC) of Comparative Example 1, and the shielding rate is almost the same. The level was similar. In particular, since the substrate 10 and the liner 30 made of a molded article can be produced by pressing in a mold according to Examples 1 and 2, the shielding material can be mass-produced in a short time.
  • SPCC cold rolled steel sheet

Abstract

An electromagnetic wave shielding material having a metal thin film and a liner is disclosed. The electromagnetic wave shielding material comprises: (1) a substrate made of a molded article; (2) a metal thin film disposed on an inner side of the substrate; and (3) a liner formed on an inner side of the metal thin film, wherein (4) the substrate has a mounting groove for firmly mounting the metal thin film at a lower portion thereof, and an attachment hole formed at a flange thereof, wherein a gap is formed between the substrate and the liner.

Description

금속박막과 라이너를 갖는 전자파 차폐재 및 그 제조방법Electromagnetic shielding material having metal thin film and liner, and method of manufacturing same
본 발명은 금속박과 라이너(Liner)를 갖는 전자파 차폐재 및 그 제조방법에 관한 것이다. 더욱 상세하게는 성형품으로 된 기재(Base)의 안쪽 또는 바깥쪽을 금속박막으로 씌운 후에 얇은 박막의 라이너를 부착시킴으로써 고효율, 고강도, 경량, 저비용으로 단시간에 양산할 수 있는 전자파 차폐재 및 그 제조방법에 관한 것이다.The present invention relates to an electromagnetic wave shielding material having a metal foil and a liner and a method of manufacturing the same. More specifically, by covering the inside or the outside of the base of the molded article with a metal thin film and then attaching a thin film liner, the electromagnetic shielding material that can be mass produced in a short time with high efficiency, high strength, light weight and low cost, and a manufacturing method thereof It is about.
최근 항공기, 자동차, 선박에 설치되는 각종 전자기기는 편의성, 고급화, 경량화, 슬림화, 하이브리드화 등과 같은 특성에 따른 개발로 인해 다량의 전장(電裝)부품이 채용되고 있다. 그러나 이들 기기로부터 유해 전자파가 다량 방출되고, 이로 인해 각종 전자기기의 오작동 및 안전사고 발생 등이 사회문제로 대두되고 있는 실정이다. 이러한 전자파 차폐를 목적으로 경량화된 고분자 복합소재에 탄소, 금속, 세라믹 등의 소재를 첨가하여 전자파를 차폐하는 새로운 기능성을 갖는 복합소재들이 연구되고 있다. Recently, various electronic devices installed in aircrafts, automobiles, and ships have been adopted due to their characteristics such as convenience, high-end, light weight, slim, and hybridization. However, a large amount of harmful electromagnetic waves are emitted from these devices, causing malfunctions and safety accidents of various electronic devices to be a social problem. For the purpose of shielding electromagnetic waves, composite materials having new functionality for shielding electromagnetic waves by adding materials such as carbon, metal, and ceramics to lightweight polymer composite materials have been studied.
이와 관련한 종래기술로서, 등록특허 10-0990154(2010.10.20)는 “불연재에 금속 나노분말이 분산된 기재층; 상기 기재층의 일면에 구비되는 제1금속층; 상기 제1금속층상에 구비되어 상기 제1금속층의 산화를 방지하는 제1크로메이트층; 상기 제1크로메이트층상에 구비되어 자외선을 차단하는 제1수지층; 및 상기 제1수지층 상에 구비되어 정전기를 방지하는 제1대전방지층을 포함하는 전자파 차폐재”가 개시되어 있다. As a related art in this regard, Korean Patent No. 10-0990154 (2010.10.20) discloses a substrate layer in which metal nanopowder is dispersed in a nonflammable material; A first metal layer provided on one surface of the base layer; A first chromate layer provided on the first metal layer to prevent oxidation of the first metal layer; A first resin layer provided on the first chromate layer to block ultraviolet rays; And a first antistatic layer provided on the first resin layer to prevent static electricity.
일본공개특허 특개2009-267230(2009.11.12)에는 “소재를 차폐하는 전자파에서, 파이버 사이의 클리어런스가 충전되지 않도록, 높은 자기 투과성을 가진 도전성 금속층은 파이버의 표면을 덮기 위해 작은 직경을 갖는 섬유를 포함하는 섬유천의 한 측면 또는 양면의 표면에 형성되므로 전자파 차단재는 투습성을 가지고, 무게에서 밝고 신축성이 우수한 전자파차폐재”가 개시되어 있다. Japanese Laid-Open Patent Publication No. 2009-267230 (Nov. 12, 2009) states that, in an electromagnetic shielding material, a conductive metal layer having high magnetic permeability has a small diameter in order to cover the surface of the fiber so that the clearance between the fibers is not filled. The electromagnetic wave shielding material is formed on the surface of one side or both sides of the fiber cloth to be included, the electromagnetic wave shielding material having moisture permeability, bright in weight and excellent in elasticity.
등록특허 10-460297(2004.11.26)에는 “비투자율이 1000 이상인 금속 또는 합금으로 두께가 1~900㎛이고 폭이 1~90㎜인 금속박 리본과 금속박 리본의 적어도 일면에 형성된 점착층을 추가로 포함하는 고투자율의 금속박 리본을 이용한 전자파 차폐재”가 개시되어 있다. Korean Patent No. 10-460297 (2004.11.26) discloses a metal foil ribbon having a specific permeability of 1000 or more and a pressure-sensitive adhesive layer formed on at least one surface of a metal foil ribbon having a thickness of 1 to 900 µm and a width of 1 to 90 mm and a metal foil ribbon. Electromagnetic shielding material using the metal foil ribbon of the high permeability containing "is disclosed.
또한, 등록특허 10-376960(2003.3.08) “플라스틱 기판상에 전자파 차폐용 기능막을 형성하는 방법으로 플라스틱 기판의 표면상에 다층 도금막을 형성한 후, 최종적으로 형성될 전자파 차폐용 금(Au) 박막과 도금막 간의 부착력 향상을 위해 마그네트론 스퍼터링 방법으로 다층 도금막 상에 니켈, 크롬, 니켈과 크롬의 합금 중 적어도 하나의 재료로 이루어진 스퍼터링 타겟을 이용하여 각 재료의 단일막 또는 이들 단일막의 조합으로 이루어진 다층막을 증착 형성하는 기술”이 개시되어 있다. In addition, Patent No. 10-376960 (2003.3.08) “A method of forming a functional film for shielding electromagnetic waves on a plastic substrate, after forming a multi-layer plating film on the surface of the plastic substrate, the final electromagnetic shielding gold (Au) In order to improve the adhesion between the thin film and the plated film, a single film of each material or a combination of these films is formed by using a sputtering target made of at least one of nickel, chromium, an alloy of nickel and chromium on a multilayer plated film by a magnetron sputtering method. And a technique for depositing and forming a multilayer film formed thereon ”are disclosed.
나아가 등록특허 10-707382(2007.4.06)에는 “합성수지 조성물의 배합 비율에 비해 산화물 자성 재료인 페라이트 분말로 이루어진 전자파 흡수 차단 물질 조성물의 배합 비율을 전자파 흡수체 전체 조성물에 대하여 80~90중량% 이상 배합한 액상의 전자파 흡수체를 도포 롤러를 이용하여 얇은 내열성 필름지의 표면에 대략 0.01~0.5㎜ 두께를 갖도록 코팅 후 건조로를 통과시켜 경화시킨 다음 내열성 필름지를 제거함으로써 얇은 박막 형태의 유연성 전자파 흡수체를 제조하는 전자파 흡수체”의 제조 기술이 개시되어 있다.Furthermore, Patent No. 10-707382 (2007.4.06) discloses that "the mixing ratio of the electromagnetic wave absorbing blocking material composition made of ferrite powder, which is an oxide magnetic material, compared to the mixing ratio of the synthetic resin composition, is 80 to 90% by weight or more based on the total composition of the electromagnetic wave absorber. A liquid electromagnetic wave absorber is coated to have a thickness of about 0.01 to 0.5 mm on the surface of the thin heat resistant film paper using an application roller, and then cured by passing through a drying furnace, followed by removing the heat resistant film paper, to produce a flexible thin film type electromagnetic wave absorber. Absorber ”is disclosed.
그러나 전술한 바와 같은 종래 기술의 전자파 차폐재는 모두 전자파 흡수 및 차폐 효율도 기대에 미치지 못하기 때문에 경박단소(輕薄短小) 및 집적화(集積化)되는 각종 전자 및 통신 기기에 폭넓게 활용되기에는 한계가 있다는 문제점이 있다.However, since the electromagnetic wave shielding materials of the prior art as described above do not meet the expected electromagnetic wave absorption and shielding efficiency, there is a limit to being widely applied to various electronic and communication devices that are light and small and small. There is a problem.
따라서 이러한 문제점을 해결하기 위한 전자파 차폐재의 차폐율 향상 및 대량 생산을 위한 기술개발의 필요성이 절실한 실정이다. Therefore, there is an urgent need for technology development for improving the shielding rate and mass production of electromagnetic shielding materials to solve these problems.
본 발명은 상기와 같은 상술한 문제점 및 어려움을 해결하기 위하여 발명된 것으로서, 성형품으로 된 기재(Base)의 안쪽 또는 바깥쪽을 금속박막으로 씌운 후에 얇은 박막의 라이너를 부착시킴으로써 고효율, 고강도, 경량, 저비용으로 단시간에 양산할 수 있는 전자파 차폐재 및 그 제조방법을 제공하는 것이다.The present invention has been invented to solve the above-mentioned problems and difficulties, high efficiency, high strength, light weight, by attaching a thin film liner after covering the inside or the outside of the base of the molded article (Base) with a metal film It is to provide an electromagnetic shielding material and a method of manufacturing the same that can be mass produced in a short time at low cost.
상기한 바와 같은 목적을 달성하기 위하여, 본 발명은 1) 성형품으로 되는 기재; 2) 상기 기재의 안쪽에 배치되는 금속박막; 3) 상기 금속박막의 안쪽에 형성되는 라이너; 4) 상기 기재, 금속박막 및 라이너를 포함하되, 상기 기재의 하단에는 상기 금속박막과 라이너를 견고하게 장착하기 위한 장착홈이 형성되며, 상기 기재의 플랜지(flange)에는 부착구가 형성되고, 상기 기재와 라이너의 사이에는 간격이 형성되는 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재를 제공한다. In order to achieve the object as described above, the present invention is 1) a substrate made of a molded article; 2) a metal thin film disposed inside the substrate; 3) a liner formed inside the metal thin film; 4) including the base material, a metal thin film and a liner, the bottom of the base is formed with a mounting groove for firmly mounting the metal thin film and the liner, the flange of the base is formed with an attachment hole, Provided is an electromagnetic shielding material having a metal thin film and a liner, wherein a gap is formed between the substrate and the liner.
또한 본 발명은 상기 전자파 차폐재를 제조하기 위한 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법을 제공한다.In another aspect, the present invention provides a method for producing an electromagnetic shielding material having a metal thin film and a liner for manufacturing the electromagnetic shielding material.
한편, 본 발명에 의한 그 밖의 구체적인 과제의 해결수단은 발명의 상세한 설명에 기재되어 있다.On the other hand, the solving means of the other specific subject by this invention is described in the detailed description of this invention.
본 발명의 금속박막과 라이너를 갖는 전자파 차폐재에 의하면, 성형품으로 된 기재(Base)의 안쪽 또는 바깥쪽을 금속박막으로 씌운 후에 얇은 박막의 라이너를 부착시킴으로써 고효율, 고강도 및 경량의 장점을 가질 수 있다.According to the electromagnetic shielding material having the metal thin film and the liner of the present invention, by attaching a thin film liner after covering the inside or the outside of the base (base) of the molded article with the metal thin film can have the advantages of high efficiency, high strength and light weight. .
또한 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법은 전자파 차폐재를 간단한 방법에 의하여 저비용으로 단시간에 양산할 수 있는 장점이 있다. In addition, the manufacturing method of the electromagnetic shielding material having a metal thin film and a liner has the advantage that it can mass-produce the electromagnetic shielding material in a short time at a low cost by a simple method.
나아가 현재 그레핀이나, 탄소 나노튜브, 카본섬유 등을 활용한 전자파 차폐재가 갖는 문제점인 고가, 성형성의 한계를 극복할 수 있는 신소재로 활용될 수 있는 장점이 있다.Furthermore, there is an advantage that can be used as a new material that can overcome the limitations of the high cost and formability, which are problems of the electromagnetic wave shielding material using the present graphene, carbon nanotubes, carbon fibers and the like.
도 1은 본 발명의 금속박막과 라이너를 갖는 전자파 차폐재의 단면도 및 부분 확대도이다.1 is a cross-sectional view and a partially enlarged view of an electromagnetic shielding material having a metal thin film and a liner of the present invention.
도 2는 본 발명의 금속박막과 라이너를 갖는 전자파 차폐재의 단면도 및 부분 확대도의 다른 예이다.2 is another example of a sectional view and a partially enlarged view of an electromagnetic shielding material having a metal thin film and a liner of the present invention.
도 3은 본 발명의 금속박막과 라이너를 갖는 전자파 차폐재를 제조하기 위한 전자파 차폐재의 각 부품을 배치한 분해도이다.3 is an exploded view in which each component of the electromagnetic shielding material for producing the electromagnetic shielding material having the metal thin film and the liner of the present invention is disposed.
도 4는 본 발명의 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법을 설명하기 위한 개략적인 블록도이다.4 is a schematic block diagram illustrating a method of manufacturing an electromagnetic shielding material having a metal thin film and a liner of the present invention.
이하, 본 발명의 실시 예를 첨부된 도면을 참조하여 더욱 상세히 설명한다. 본 발명의 실시예는 여러 가지 형태로 변형될 수 있으며, 본 발명의 범위가 아래의 실시 예들로 한정되는 것으로 해석되어서는 안 된다. 본 실시 예는 해당 기술분야에서 평균적인 지식을 가진 자에게 본 발명을 더욱 완전하게 설명하기 위해 제공되는 것이다. 따라서 도면에서의 요소의 형상 및 세부적인 구성은 설명을 위해 단순화되었다. 그리고 본 명세서에서 사용되는 용어들은 본 발명의 바람직한 실시예를 적절히 표현하기 위해 사용된 용어들임을 참고하여야 한다.Hereinafter, with reference to the accompanying drawings an embodiment of the present invention will be described in more detail. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and detailed configuration of the elements in the drawings have been simplified for explanation. It should be noted that the terms used in the present specification are terms used to properly express preferred embodiments of the present invention.
아래에서는 전자파 차폐재에 사용될 수 있는 것으로써 본 실시예의 전자파를 차폐시킬 수 있는 금속박막을 이용한 전자파 차폐재와 관련하여 그 제조방법 및 그 구조와 함께 세부적인 특징을 상세히 설명하도록 한다. 본 발명의 금속박과 라이너를 갖는 전자파 차폐재 및 그 제조방법은 이에 한정되지 않으며, 이외에도 전자파 차폐를 필요로 하는 다양한 장치 및 기기에 제한 없이 이용될 수 있음은 물론이다.Hereinafter, the detailed description will be described in detail with the manufacturing method and structure thereof with respect to the electromagnetic shielding material using the metal thin film which can shield the electromagnetic wave of the present embodiment as it can be used in the electromagnetic shielding material. The electromagnetic shielding material having the metal foil and the liner of the present invention and a method of manufacturing the same are not limited thereto, and may be used without limitation in various apparatuses and devices requiring electromagnetic shielding.
첨부된 도 1 내지 4에는 본 발명에 의한 금속박막과 라이너를 갖는 전차파 차폐재 및 그 제조방법을 설명하기 위한 차폐재의 개략적인 도면이 도시되어 있다.1 to 4, there is shown a schematic diagram of a shielding material for explaining an electric wave shielding material having a metal thin film and a liner and a method of manufacturing the same according to the present invention.
본 발명에 의한 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법은 1) 하단에 장착홈이 형성된 성형품으로서, 기재를 준비하는 제 1단계; 2) 상기 제 1단계의 기재의 안쪽에 적절한 크기의 금속박막을 놓는 제 2단계; 3) 상기 제 2단계의 금속박막의 안쪽에 라이너를 놓고 나서 상기 기재의 플랜지 부분에 접착제를 도포하여 상기 기재와 라이너가 분리되지 않도록 한 다음, 압착기구로써 눌러 상기 기재와 라이너 사이의 간격(A)을 일정거리로 유지하면서 금속박막과 라이너를 장착시키는 제 3단계; 4) 상기 제 3단계 후에 외부로 노출된 금속박막의 가장자리 부분을 트리밍(trimming)하여 다듬는 제 4단계를 포함하는 것을 특징으로 한다.Method for producing an electromagnetic wave shielding material having a metal thin film and a liner according to the present invention comprises: 1) a first step of preparing a substrate as a molded article formed with a mounting groove at the bottom; 2) a second step of placing a metal thin film of an appropriate size inside the substrate of the first step; 3) After placing the liner inside the metal thin film of the second step, and then applying an adhesive to the flange portion of the substrate so that the substrate and the liner does not separate, and pressing with a crimping mechanism (A) A third step of mounting the metal thin film and the liner while maintaining a constant distance; 4) after the third step is characterized in that it comprises a fourth step of trimming (trimming) the edge of the metal thin film exposed to the outside.
먼저, 제 1단계는 본 발명에 의한 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법을 위한 준비단계이고, 하단에 장착홈이 형성된 성형품으로서, 기재를 준비하는 단계이다. 더욱 상세히 설명하면, 제조하고자 하는 여러 가지 형태의 차폐재에 따라, 기재(Base, 10)로서 사용될 수 있는 성형품을 성형할 수 있는 물질이면 모두 가능하다. 그 중에서 섬유강화플라스틱(FRP), 시트몰딩컴파운드(SMC), 벌크몰딩컴파운드(BMC), 열가소성수지 중에서 선택되는 어느 하나로 성형되는 것이 바람직하다. 그리고 성형품으로 되는 기재(10)의 하단에는 금속박막(20)과 라이너(30)를 견고하게 장착하기 위하여 장착홈(11)을 형성시킬 수 있다. 또한 라이너(30)를 내부 장착하는 경우 기재(10)의 플랜지에는 차폐재의 견고한 부착을 위하여 부착구(40)를 형성시킨다. First, the first step is a preparation step for the method of manufacturing an electromagnetic shielding material having a metal thin film and a liner according to the present invention, and is a step of preparing a substrate as a molded article formed with a mounting groove at the bottom. In more detail, according to various types of shielding material to be produced, any material capable of forming a molded article that can be used as a base (Base, 10) is possible. Among them, it is preferable to be molded into any one selected from fiber reinforced plastic (FRP), sheet molding compound (SMC), bulk molding compound (BMC), and thermoplastic resin. The mounting groove 11 may be formed at the lower end of the substrate 10 to be a molded article in order to firmly mount the metal thin film 20 and the liner 30. In addition, when the inner liner 30 is mounted inside, the flange 40 of the substrate 10 forms an attachment hole 40 for firm attachment of the shielding material.
제 2단계는 상기 제 1단계의 기재의 안쪽에 적절한 크기의 금속박막을 놓는 단계이다. 더욱 상세히 설명하면, 도 1과 같이 상기 금속박막(20)을 상기 기재(10)의 형상 및 크기와 비교하여 적절히 맞도록 제단한 후에 제 1단계에서 준비된 기재(10)의 안쪽에 놓는 것이다. 상기 금속박막으로서는 여러 가지 종류의 것이 열거될 수 있으나, 그 중에서 구리, 니켈, 알루미늄 박막 중에서 선택된 어느 하나인 것이 바람직하다.The second step is to place a metal thin film of an appropriate size inside the substrate of the first step. In more detail, as shown in FIG. 1, the metal thin film 20 is placed in the inside of the substrate 10 prepared in the first step after cutting the metal thin film 20 to suit the size and size of the substrate 10. As the metal thin film, various kinds can be cited, but among them, it is preferable that the metal thin film is any one selected from copper, nickel, and aluminum thin films.
제 3단계는 상기 제 2단계의 금속박막의 안쪽에 라이너를 놓고 나서 상기 기재의 플랜지 부분에 접착제를 도포하여 상기 기재와 라이너가 분리되지 않도록 한 다음, 압착기구로써 눌러 상기 기재와 라이너 사이의 간격을 일정거리로 유지하면서 금속박막과 라이너를 장착시키는 단계이다. 더욱 상세히 설명하면, 도 1과 같이 상기 라이너(30)는 상기 금속박막(20)의 안쪽에 놓여지고, 금속박막(20)은 기재(10)의 안쪽에 위치하여야 한다.In the third step, the liner is placed inside the metal thin film of the second step, and then an adhesive is applied to the flange portion of the substrate so that the substrate and the liner are not separated, and then pressed by a crimping mechanism, the gap between the substrate and the liner It is a step of mounting the metal thin film and the liner while maintaining a constant distance. In more detail, as shown in FIG. 1, the liner 30 should be placed inside the metal thin film 20, and the metal thin film 20 should be positioned inside the base 10.
또한 상기 라이너(30)는 상기 제 1단계에서 준비한 성형품과 같이, 제조하고자 하는 여러 가지 형태의 차폐재에 따라, 박막 형태의 라이너(30)로서 사용할 수 있는 성형품은 모두 가능하나, 그 중에서 섬유강화플라스틱(FRP), 시트몰딩컴파운드(SMC), 벌크몰딩컴파운드(BMC), 열가소성수지 중에서 선택되는 어느 하나로 성형되는 것이 바람직하다. 상기 박막 형태인 라이너(30)의 두께는 1.0~2.5㎜가 바람직하다. 그 두께가 1.0㎜ 미만이면, 라이너가 너무 얇아 장착시 파손될 우려가 있고, 2.5㎜를 초과하면 두께가 너무 두꺼워 밀착성이 나빠지는 문제가 있다. In addition, the liner 30, like the molded article prepared in the first step, depending on the various types of shielding material to be manufactured, any of the molded article that can be used as the liner 30 of the thin film form, but among them, fiber-reinforced plastic (FRP), sheet molding compound (SMC), bulk molding compound (BMC), preferably formed of any one selected from a thermoplastic resin. The thickness of the liner 30 in the form of the thin film is preferably 1.0 to 2.5 mm. If the thickness is less than 1.0 mm, there is a risk that the liner is too thin and breaks upon mounting. If the thickness is more than 2.5 mm, the thickness is too thick, resulting in poor adhesion.
그리고 상기 기재(10)의 가장자리인 플랜지(Frange) 부분에 접착제를 도포하여 상기 기재(10)와 라이너(30)가 분리되지 않도록 한다. 이어서 접착제가 도포된 부분을 간이 프레스나, 압착기 등의 압착기구를 사용하여 균일하게 눌러주어 상기 기재(10)와 라이너(30) 사이의 간격(A)을 일정거리로 유지하면서 금속박막(20)과 라이너(30)를 장착시킬 수 있다. 이때 상기 간격(A)은 0.2~1.0㎜의 범위로 유지시키는 것이 바람직한데, 간격(A)이 0.2㎜ 미만일 때는 장착 시 금속박막(20)이 손상될 위험성이 있고, 1.0㎜를 초과하면 금속박막(20)의 밀착성이 나빠져 차폐재의 품질이 저하될 수 있다.An adhesive is applied to a flange portion that is an edge of the substrate 10 so that the substrate 10 and the liner 30 are not separated. Subsequently, the portion to which the adhesive is applied is uniformly pressed by using a pressing device such as a simple press or a pressing machine, while maintaining the distance A between the substrate 10 and the liner 30 at a predetermined distance, the metal thin film 20 And liner 30 can be mounted. At this time, the spacing (A) is preferably maintained in the range of 0.2 ~ 1.0mm, when the spacing (A) is less than 0.2mm there is a risk of damage to the metal thin film 20 when mounted, if the thickness exceeds 1.0mm metal thin film The adhesiveness of 20 may deteriorate and the quality of a shielding material may deteriorate.
제 4단계는 상기 제 3단계 후에 외부로 노출된 금속박막의 가장자리 부분을 트리밍(trimming)하여 다듬는 단계이다. 상기 제 4단계는 본 발명에 의한 금속박막과 라이너를 갖는 전자파 차폐재 제조방법의 마무리단계로서, 제 3단계 후에 외부로 노출된 금속박막(20)의 가장자리 부분을 칼 등 제거수단을 이용하여 트리밍(trimming)함으로써 완성품인 차폐재를 제조할 수 있게 된다. The fourth step is trimming by trimming the edge portion of the metal thin film exposed to the outside after the third step. The fourth step is a finishing step of the method for manufacturing an electromagnetic shielding material having a metal thin film and a liner according to the present invention. After the third step, the edge portion of the metal thin film 20 exposed to the outside is trimmed using a knife or the like removing means. trimming) to produce a finished shielding material.
이와 같이 상기 제 1단계부터 제 4단계의 공정을 계속하여 수행함으로써 만들어진 전자파 차폐재는 상기 기재(10)에 형성된 장착홈(11)을 통하여 금속박막(20)과 라이너(30)가 비교적 강하게 결합됨으로써 경량이면서 강도 등 기계적 특성이 우수한 제품을 제조할 수 있다. 나아가 성형품으로 된 상기 기재(10)와 라이너(30)를 금형에서 프레스로 찍어내므로 단시간에 간단한 방법으로 저렴하게 양산할 수 있게 되는 것이다. 성형품의 생산에 필요한 시간을 보면, 성형재료로서 시트몰딩컴파운드(SMC), 벌크몰딩컴파운드(BMC)를 사용하는 경우 3분이면 충분하고, 열가소성수지를 하는 경우 10분이면 충분하다.As such, the electromagnetic shielding material produced by continuously performing the processes of the first to fourth steps is relatively strongly coupled to the metal thin film 20 and the liner 30 through the mounting groove 11 formed in the substrate 10. It is possible to manufacture a product which is lightweight and has excellent mechanical properties such as strength. Furthermore, since the substrate 10 and the liner 30 made of a molded product are taken out by a press from a mold, it can be mass-produced in a short time and in a simple manner at a low cost. In view of the time required for the production of the molded article, three minutes is sufficient for sheet molding compound (SMC) and bulk molding compound (BMC) as a molding material, and ten minutes is sufficient for thermoplastic resin.
한편, 상기의 제조방법에 의하여 도 1와 같이, 1) 성형품으로 되는 기재; 2) 상기 기재의 안쪽에 배치되는 금속박막; 3) 상기 금속박막의 안쪽에 형성되는 라이너; 4) 상기 기재, 금속박막 및 라이너를 포함하되, 상기 기재의 하단에는 상기 금속박막과 라이너를 견고하게 장착하기 위한 장착홈이 형성되며, 상기 기재의 플랜지(flange)에는 부착구가 형성되고, 상기 기재와 라이너의 사이에는 간격(A)이 형성되는 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재를 제조할 수 있게 된다.On the other hand, as shown in Figure 1 by the above production method, 1) a substrate to be a molded article; 2) a metal thin film disposed inside the substrate; 3) a liner formed inside the metal thin film; 4) including the base material, a metal thin film and a liner, the bottom of the base is formed with a mounting groove for firmly mounting the metal thin film and the liner, the flange of the base is formed with an attachment hole, It is possible to manufacture an electromagnetic shielding material having a metal thin film and a liner, wherein a gap A is formed between the substrate and the liner.
한편, 위에서는 상기 라이너(30)가 기재(10)의 내부에 장착되는 경우에 대하여 상세히 설명하였으나, 이와 반대로 상기 라이너(30)가 기재(10)의 외부에 장착되는 경우에 대하여 상세히 설명하기로 한다.Meanwhile, in the above, the case where the liner 30 is mounted on the inside of the substrate 10 has been described in detail. On the contrary, the case where the liner 30 is mounted on the outside of the substrate 10 will be described in detail. do.
본 발명에 의한 전자파 차폐재의 다른 예로서, 상기 라이너(30)가 기재(10)의 외부에 장착되는 경우 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법은 1) 하단에 장착홈이 형성된 성형품으로서, 라이너를 준비하는 제 1단계; 2) 상기 제 1단계의 라이너의 안쪽에 적절한 크기의 금속박막을 놓는 제 2단계; 3) 상기 제 2단계의 금속박막의 안쪽에 성형품으로 되는 기재를 놓고 나서 상기 라이너의 플랜지 부분에 접착제를 도포하여 상기 기재와 라이너가 분리되지 않도록 한 다음, 압착기구로써 눌러 상기 기재와 라이너 사이의 간격을 일정거리로 유지하면서 금속박막과 라이너를 장착시키는 제 3단계; 4) 상기 제 3단계 후에 외부로 노출된 금속박막의 가장자리 부분을 트리밍(trimming)하여 다듬는 제 4단계를 포함하는 것을 특징으로 한다.As another example of the electromagnetic wave shielding material according to the present invention, when the liner 30 is mounted on the outside of the substrate 10, the method for manufacturing the electromagnetic wave shielding material having the metal thin film and the liner includes: 1) a molded product having mounting grooves formed at a lower end thereof; Preparing a liner; 2) a second step of placing a metal thin film of an appropriate size inside the liner of the first step; 3) A substrate formed of a molded article is placed inside the metal thin film of the second step, and then an adhesive is applied to the flange portion of the liner so that the substrate and the liner are not separated, and then pressed with a crimping mechanism, between the substrate and the liner. A third step of mounting the metal thin film and the liner while maintaining the distance at a constant distance; 4) after the third step is characterized in that it comprises a fourth step of trimming (trimming) the edge of the metal thin film exposed to the outside.
먼저, 제 1단계는 하단에 장착홈이 형성된 성형품으로서, 라이너를 준비하는 단계이다. 더욱 상세히 설명하면, 제조하고자 하는 여러 가지 형태의 차폐재에 따라, 라이너(30)로서 사용될 수 있는 성형품을 성형할 수 있는 물질이면 모두 가능하다. 그 중에서 섬유강화플라스틱(FRP), 시트몰딩컴파운드(SMC), 벌크몰딩컴파운드(BMC), 열가소성수지 중에서 선택되는 어느 하나로 성형되는 것이 바람직하다. 그리고 성형품으로 되는 라이너(30)의 하단에는 금속박막(20)과 기재(10)를 견고하게 장착하기 위하여 장착홈(11)을 형성시킬 수 있다. 또한 상기 라이너(30)의 플랜지에는 차폐재의 견고한 부착을 위하여 부착구(40)를 형성시킨다. First, the first step is to prepare a liner as a molded article formed with a mounting groove at the bottom. In more detail, according to various types of shielding material to be manufactured, any material capable of forming a molded article that can be used as the liner 30 can be used. Among them, it is preferable to be molded into any one selected from fiber reinforced plastic (FRP), sheet molding compound (SMC), bulk molding compound (BMC), and thermoplastic resin. The mounting groove 11 may be formed at the lower end of the liner 30 formed as a molded product in order to firmly mount the metal thin film 20 and the substrate 10. In addition, the flange of the liner 30 forms an attachment hole 40 for firm attachment of the shielding material.
제 2단계는 상기 제 1단계의 라이너의 안쪽에 적절한 크기의 금속박막을 놓는 단계이다. 이는 상기 라이너(30)가 기재(10)의 외부에 장착되는 경우로서, 앞서 상기 라이너(30)가 기재(10)의 내부에 장착되는 경우의 제 2단계와 비교하여 기재(10)가 라이너(30)으로 바뀌었을 뿐이고, 나머지는 동일하므로 이에 대한 설명은 생략하기로 한다.The second step is to place a metal thin film of an appropriate size inside the liner of the first step. This is a case where the liner 30 is mounted on the outside of the substrate 10, and the substrate 10 is a liner (compared with the second step when the liner 30 is mounted on the inside of the substrate 10). 30) and the rest are the same, so a description thereof will be omitted.
제 3단계는 상기 제 2단계의 금속박막의 안쪽에 기재를 놓고 나서 상기 라이너의 플랜지 부분에 접착제를 도포하여 상기 기재와 라이너가 분리되지 않도록 한 다음, 압착기구로써 눌러 상기 기재와 라이너 사이의 간격을 일정거리로 유지하면서 금속박막과 라이너를 장착시키는 단계이다. 더욱 상세히 설명하면, 도 2와 같이 상기 라이너(30)는 상기 금속박막(20)의 바깥쪽에 놓여지고, 금속박막(20)은 기재(10)의 바깥쪽에 위치하여야 한다. 그리고 상기 라이너(30)의 가장자리인 플랜지(Frange) 부분에 접착제를 도포하여 상기 기재(10)와 라이너(30)가 분리되지 않도록 한다. 이는 상기 라이너(30)가 기재(10)의 외부에 장착되는 경우로서, 앞서 상기 라이너(30)가 기재(10)의 내부에 장착되는 경우의 제 3단계와 비교하여 라이너(30)가 기재(10)로 바뀌었을 뿐이고, 나머지는 동일하므로 이에 대한 설명은 생략하기로 한다.In the third step, the substrate is placed inside the metal thin film of the second step, and then an adhesive is applied to the flange portion of the liner so that the substrate and the liner are not separated, and then pressed by a crimping mechanism, the gap between the substrate and the liner. It is a step of mounting the metal thin film and the liner while maintaining a constant distance. In more detail, as shown in FIG. 2, the liner 30 should be placed outside the metal thin film 20, and the metal thin film 20 should be located outside the substrate 10. An adhesive is applied to a flange portion that is an edge of the liner 30 so that the substrate 10 and the liner 30 are not separated. This is a case in which the liner 30 is mounted on the outside of the substrate 10, and the liner 30 may be mounted on the substrate (compared to the third step when the liner 30 is mounted on the inside of the substrate 10. 10), and the rest are the same, so a description thereof will be omitted.
제 4단계는 상기 제 3단계 후에 외부로 노출된 금속박막의 가장자리 부분을 트리밍(trimming)하여 다듬는 단계이다. 이는 상기 라이너(30)가 기재(10)의 내부에 장착되는 경우와 동일하므로 이에 대한 설명은 생략하기로 한다.The fourth step is trimming by trimming the edge portion of the metal thin film exposed to the outside after the third step. This is the same as the case in which the liner 30 is mounted inside the substrate 10, so a description thereof will be omitted.
이와 같이 상기 제 1단계부터 제 4단계의 공정을 계속하여 수행함으로써 만들어진 전자파 차폐재는 금속박막(20)과 기재(10)가 라이너(30)에 비교적 강하게 결합됨으로써 경량이면서 강도 등 기계적 특성이 우수한 제품을 제조할 수 있다. 나아가 그 밖의 효과도 상기 라이너(30)가 기재(10)의 내부에 장착되는 경우와 동일하므로 이에 대한 설명은 생략하기로 한다.As described above, the electromagnetic shielding material produced by continuously performing the processes of the first to fourth steps is a product having excellent mechanical properties such as light weight and strength due to the relatively strong bonding of the metal thin film 20 and the substrate 10 to the liner 30. Can be prepared. Furthermore, other effects are the same as those when the liner 30 is mounted inside the substrate 10, and thus description thereof will be omitted.
한편, 상기의 제조방법에 의하여 도 2와 같이, 금속박막과 라이너를 갖는 전자파 차폐재는 1) 성형품으로 되는 기재; 2) 상기 기재의 바깥쪽에 배치되는 금속박막; 3) 상기 금속박막의 바깥쪽에 형성되는 라이너; 4) 상기 기재, 금속박막 및 라이너를 포함하되, 상기 라이너의 하단에는 상기 금속박막과 기재를 견고하게 장착하기 위한 장착홈이 형성되며, 상기 라이너의 플랜지(flange)에는 부착구가 형성되고, 상기 기재와 라이너의 사이에는 간격이 형성되는 것을 특징으로 한다.On the other hand, as shown in Figure 2 by the above manufacturing method, the electromagnetic shielding material having a metal thin film and a liner is 1) a substrate to be a molded article; 2) a metal thin film disposed outside the substrate; 3) a liner formed on the outside of the metal thin film; 4) including the base material, a metal thin film and a liner, the lower end of the liner is formed with a mounting groove for firmly mounting the metal thin film and the substrate, the flange (flange) of the liner is formed, A gap is formed between the substrate and the liner.
이하, 실시예 및 도면을 통하여 본 발명을 더욱 상세히 설명하고자 한다. Hereinafter, the present invention will be described in more detail with reference to examples and drawings.
[실시예 1]Example 1
본 발명에 의한 전자파 차폐재를 다음과 같은 공정에 따라 제조할 수 있었다. The electromagnetic wave shielding material according to the present invention could be manufactured according to the following process.
1) 차폐재의 크기 및 형상에 맞도록 두께 3.0㎜의 시트몰딩컴파운드(SMC)를 계량하여 금형에 투입한 후 프레싱하고 탈형하여 장착홈(11)과 부착구(40)가 형성된 성형품을 제조하여 기재(10)로 하였다.1) Measure a sheet molding compound (SMC) with a thickness of 3.0 mm to fit the size and shape of the shielding material, insert it into a mold, press and demould, and manufacture a molded article having a mounting groove 11 and an attachment hole 40 formed thereon. It was set as (10).
2) 0.03㎜ 두께의 알루미늄막박을 상기 기재(10)에 맞게 적절한 형상 및 크기로 제단하여 금속박막(20)으로 하였다.2) An aluminum film foil having a thickness of 0.03 mm was cut into an appropriate shape and size to fit the substrate 10 to obtain a metal thin film 20.
3) 상기 기재(10)의 크기 및 형상에 맞도록 시트몰딩컴파운드(SMC)를 계량하여 금형에 투입한 후 프레싱하고 탈형하여 두께 1.5㎜의 라이너(30)로 하였다.3) The sheet molding compound (SMC) was weighed to fit the size and shape of the base material 10, put into a mold, pressed and demolded to form a liner 30 having a thickness of 1.5 mm.
4) 상기 기재(10)의 안쪽에 금속박막(20과 라이너(30)를 각각 놓고 나서 상기 기재(10)의 플랜지 부분에 접착제를 도포하여 상기 기재(10)와 라이너(30)가 분리되지 않도록 한 다음, 간이프레스로써 2㎏f/㎠의 압력으로 누르면서 상기 기재(10)의 장착홈(11)을 통하여 상기 기재와 라이너 사이의 간격(A)을 0.5㎜로 유지하면서 금속박막(20)과 라이너(30)를 견고하게 장착시켰다. 4) The metal thin film 20 and the liner 30 are placed inside the substrate 10, and then an adhesive is applied to the flange portion of the substrate 10 so that the substrate 10 and the liner 30 are not separated. Then, while pressing at a pressure of 2 kgf / ㎠ by a simple press through the mounting groove 11 of the substrate 10 while maintaining the distance (A) between the substrate and the liner at 0.5 mm and the metal thin film 20 and The liner 30 was firmly mounted.
5) 이어서 외부로 노출된 금속박막(20)의 가장자리 부분을 칼로 트리밍(trimming)하여 다듬어 두께 5.0㎜의 차폐재를 제조하였다. 5) Subsequently, the edge portion of the metal thin film 20 exposed to the outside was trimmed with a knife to prepare a shielding material having a thickness of 5.0 mm.
[실시예 2]Example 2
실시예 1과 비교하여 상기 기재(10)의 안쪽에 금속박막(20과 라이너(30)를 각각 놓는 대신에 상기 라이너(30)의 안쪽에 금속박막(20)과 기재(10)를 각각 놓는 점만 다를 뿐 나머지는 동일하게 하여 차폐재를 제조하였다.Compared to Example 1, instead of placing the metal thin film 20 and the liner 30 inside the substrate 10, respectively, only the point of placing the metal thin film 20 and the substrate 10 inside the liner 30, respectively. The shielding material was prepared in the same manner except for the others.
<비교예 1>Comparative Example 1
냉간압연강판(SPCC)을 사용하여 두께 0.75㎜의 전자파 차폐재를 제조하였다.An electromagnetic shielding material having a thickness of 0.75 mm was manufactured using a cold rolled steel sheet (SPCC).
<비교예 2> Comparative Example 2
수지필름, 금속섬유얀, 박막알루미늄, 금속섬유얀, 수지필름이 차례대로 적층시킨 후 수지필름을 용융시킨 후 프레스 금형의 펀치로 압착시켜 용융수지를 경화시킨 다음 성형하여 박막알루미늄을 이용한 두께 3.0㎜의 전자파 차폐재를 제조하였다. Resin film, metal fiber yarn, thin film aluminum, metal fiber yarn, resin film are laminated in this order, melt the resin film, compress it with a punch of press mold, harden the molten resin, and then shape it by molding 3.0mm thick using thin film aluminum. Was prepared for the electromagnetic shielding material.
<실험예 1> 전자파 차폐율Experimental Example 1 Electromagnetic Shielding Rate
실시예 1, 2 및 비교예 1, 2에서 제조된 전자파 차폐재를 기준시편(29.7㎜×21.0㎜)으로 만들어 차폐율을 국제적으로 가장 많이 사용되는 표준측정방법인 IEEE-Std-299에 따라 측정하고, 그 결과를 표 1에 나타내었다.The electromagnetic shielding materials prepared in Examples 1 and 2 and Comparative Examples 1 and 2 were made into reference specimens (29.7 mm × 21.0 mm), and the shielding rate was measured according to IEEE-Std-299, which is the international standard most commonly used measurement method. The results are shown in Table 1.
Figure PCTKR2019002304-appb-T000001
Figure PCTKR2019002304-appb-T000001
<실험예 2> 기계적 물성Experimental Example 2 Mechanical Properties
실시예 1, 2 및 비교예 2에서 제조된 전자파 차폐재를 KSM 3015(열경화성 플라스틱의 일반시험방법)에 의한 굴곡강도 등 기계적 물성을 측정하고, 또한 바콜경도(Barcol Hardness) 및 중량을 측정하여 그 결과를 표 2에 나타내었다.The electromagnetic wave shielding materials prepared in Examples 1, 2 and Comparative Example 2 were measured for mechanical properties such as flexural strength by KSM 3015 (general test method for thermosetting plastics), and barcol hardness and weight were measured. Is shown in Table 2.
기계적 물성치Mechanical properties
단위unit 실시예1 Example 1 실시예2Example 2 비교예1Comparative Example 1 비교예2Comparative Example 2 비 고Remarks
굴곡강도Flexural strength MPaMPa 180.2180.2 180.1180.1 -- 115.3115.3 o 바콜경도는 바콜 경도계 GYZJ 934-1에 의하여 측정. o Barcol hardness measured by Barcol hardness tester GYZJ 934-1.
인장강도The tensile strength MPaMPa 90.5 90.5 90.390.3 -- 67.167.1
바콜경도Bacol Hardness -- 48.1 48.1 47.947.9 -- 33.133.1
중량weight g/㎡g / ㎡ 3,5083,508 3,5093,509 6,0966,096 4,4654,465
[실험결과 분석][Test Results Analysis]
실시예 1, 2 및 비교예 1, 2의 실험결과로부터 본 발명의 바람직한 실시예에 의한 전자파 차폐재는 비교예 2의 전자파 차폐재와 비교하여, 차폐재의 적층 구조 간단하여 경량일 뿐만 아니라, 굴곡강도 등 기계적 특성 및 차폐율에서도 매우 뛰어난 장점이 있음을 알 수 있었다. 나아가, 실시예 1, 2에 의한 전자파 차폐재는 주파수 700~1400kHz의 대역에서 차폐율이 비교예 1의 냉간압연강판(SPCC)을 사용하여 제조한 차폐재보다도 훨씬 경량(輕量)이면서도 차폐율이 거의 비슷한 수준임을 알 수 있었다. 특히, 실시예 1, 2에 의하여 성형품으로 된 기재(10) 및 라이너(30)를 금형에서 프레스로 찍어 생산할 수 있으므로 차폐재를 단시간에 대량생산할 수 있는 장점이 있다. According to the experimental results of Examples 1 and 2 and Comparative Examples 1 and 2, the electromagnetic wave shielding material according to the preferred embodiment of the present invention is not only light and has a laminated structure of the shielding material compared to the electromagnetic wave shielding material of Comparative Example 2, but also has flexural strength and the like. It can be seen that there is an excellent advantage in the mechanical properties and shielding rate. Furthermore, the electromagnetic shielding material according to Examples 1 and 2 has a shielding rate in the band of frequency 700 to 1400 kHz and is much lighter than the shielding material manufactured using the cold rolled steel sheet (SPCC) of Comparative Example 1, and the shielding rate is almost the same. The level was similar. In particular, since the substrate 10 and the liner 30 made of a molded article can be produced by pressing in a mold according to Examples 1 and 2, the shielding material can be mass-produced in a short time.
이상 본 발명은 도면에 도시된 실시예를 참고로 설명하고 있으나, 이는 예시적인 것에 해당되며, 당해기술이 속하는 분야에서 통상적인 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호범위는 아래의 특허청구범위에 의해서 정해지는 것임은 자명하다 할 것이다.The present invention has been described above with reference to the embodiments shown in the drawings, but this is for illustrative purposes, and those skilled in the art to which the art belongs may have various modifications and other equivalent embodiments therefrom. Will understand. Therefore, it will be apparent that the true technical protection scope of the present invention is defined by the following claims.

Claims (12)

1) 성형품으로 되는 기재; 1) base material which becomes a molded article;
2) 상기 기재의 안쪽에 배치되는 금속박막; 2) a metal thin film disposed inside the substrate;
3) 상기 금속박막의 안쪽에 형성되는 라이너;3) a liner formed inside the metal thin film;
4) 상기 기재, 금속박막 및 라이너를 포함하되,4) including the base material, a metal thin film and a liner,
상기 기재의 하단에는 상기 금속박막과 라이너를 견고하게 장착하기 위한 장착홈이 형성되며,The bottom of the substrate is formed with a mounting groove for firmly mounting the metal thin film and liner,
상기 기재의 플랜지(flange)에는 부착구가 형성되고, An flange is formed on the flange of the substrate,
상기 기재와 라이너의 사이에는 간격이 형성되는 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재.An electromagnetic shielding material having a metal thin film and a liner, wherein a gap is formed between the substrate and the liner.
1) 성형품으로 되는 기재; 1) base material which becomes a molded article;
2) 상기 기재의 바깥쪽에 배치되는 금속박막; 2) a metal thin film disposed outside the substrate;
3) 상기 금속박막의 바깥쪽에 형성되는 라이너;3) a liner formed on the outside of the metal thin film;
4) 상기 기재, 금속박막 및 라이너를 포함하되,4) including the base material, a metal thin film and a liner,
상기 라이너의 하단에는 상기 금속박막과 기재를 견고하게 장착하기 위한 장착홈이 형성되며,The bottom of the liner is formed with a mounting groove for firmly mounting the metal film and the substrate,
상기 라이너의 플랜지(flange)에는 부착구가 형성되고, An flange is formed on the flange of the liner,
상기 기재와 라이너의 사이에는 간격이 형성되는 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재.An electromagnetic shielding material having a metal thin film and a liner, wherein a gap is formed between the substrate and the liner.
제 1항 또는 제 2항에 있어서, The method according to claim 1 or 2,
상기 기재 또는 라이너는 섬유강화플라스틱(FRP), 시트몰딩컴파운드(SMC), 벌크몰딩컴파운드(BMC), 열가소성수지 중에서 선택되는 어느 하나로 성형되는 것을 특징으로 하는 금속박막과, 라이너를 갖는 전자파 차폐재.The substrate or liner is an electromagnetic wave shielding material having a metal thin film and a liner, characterized in that formed of any one selected from fiber reinforced plastic (FRP), sheet molding compound (SMC), bulk molding compound (BMC), thermoplastic resin.
제 3항에 있어서, The method of claim 3, wherein
상기 금속박막은 구리, 니켈, 알루미늄 박막 중에서 선택된 어느 하나인 것을 특징으로 하는 금속박막과, 라이너를 갖는 전자파 차폐재.The metal thin film is an electromagnetic shielding material having a metal thin film and a liner, characterized in that any one selected from copper, nickel, aluminum thin film.
제 4항에 있어서,The method of claim 4, wherein
상기 라이너의 두께는 1.0~2.5㎜인 것을 특징으로 하는 금속박막과, 라이너를 갖는 전자파 차폐재. Electromagnetic shielding material having a metal thin film and a liner, characterized in that the thickness of the liner is 1.0 ~ 2.5mm.
제 5항에 있어서,The method of claim 5,
상기 간격은 0.2~1.0㎜ 범위로 유지되는 것을 특징으로 하는 금속박막과, 라이너를 갖는 전자파 차폐재.Electromagnetic shielding material having a metal thin film and a liner, characterized in that the interval is maintained in the range 0.2 ~ 1.0mm.
1) 하단에 장착홈이 형성된 성형품으로서, 기재를 준비하는 제 1단계;  1) a first step of preparing a substrate as a molded article formed with a mounting groove at the bottom;
2) 상기 제 1단계의 기재의 안쪽에 기재의 형상 및 크기에 맞도록 재단한 금속박막을 놓는 제 2단계; 2) a second step of placing a metal thin film cut to fit the shape and size of the substrate inside the substrate of the first step;
3) 상기 제 2단계의 금속박막의 안쪽에 라이너를 놓고 나서 상기 기재의 플랜지 부분에 접착제를 도포하여 상기 기재와 라이너가 분리되지 않도록 한 다음, 압착기구로써 눌러 상기 기재와 라이너 사이의 간격을 일정거리로 유지하면서 금속박막과 라이너를 장착시키는 제 3단계; 3) Place the liner inside the metal thin film of the second step, and then apply an adhesive to the flange portion of the substrate so that the substrate and the liner do not separate, and then press with a crimping mechanism to maintain a gap between the substrate and the liner A third step of mounting the metal thin film and the liner while keeping the distance;
4) 상기 제 3단계 후에 외부로 노출된 금속박막의 가장자리 부분을 트리밍(trimming)하여 다듬는 제 4단계를 포함하는 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법.And 4) a fourth step of trimming and trimming the edge portion of the metal thin film exposed to the outside after the third step.
1) 하단에 장착홈이 형성된 성형품으로서, 라이너를 준비하는 제 1단계; 1) a first step of preparing a liner as a molded product formed with a mounting groove at the bottom;
2) 상기 제 1단계의 라이너의 안쪽에 라이너의 형상 및 크기에 맞도록 재단한 금속박막을 놓는 제 2단계; 2) a second step of placing a metal thin film cut to fit the shape and size of the liner inside the liner of the first step;
3) 상기 제 2단계의 금속박막의 안쪽에 성형품으로 되는 기재를 놓고 나서 상기 라이너의 플랜지 부분에 접착제를 도포하여 상기 기재와 라이너가 분리되지 않도록 한 다음, 압착기구로써 눌러 상기 기재와 라이너 사이의 간격을 일정거리로 유지하면서 금속박막과 라이너를 장착시키는 제 3단계; 3) A substrate formed of a molded article is placed inside the metal thin film of the second step, and then an adhesive is applied to the flange portion of the liner so that the substrate and the liner are not separated, and then pressed with a crimping mechanism, between the substrate and the liner. A third step of mounting the metal thin film and the liner while maintaining the distance at a constant distance;
4) 상기 제 3단계 후에 외부로 노출된 금속박막의 가장자리 부분을 트리밍(trimming)하여 다듬는 제 4단계를 포함하는 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법.And 4) a fourth step of trimming and trimming the edge portion of the metal thin film exposed to the outside after the third step.
제 7항 또는 제 8항에 있어서, The method according to claim 7 or 8,
상기 제 1단계의 기재 또는 라이너는 섬유강화플라스틱(FRP), 시트몰딩컴파운드(SMC), 벌크몰딩컴파운드(BMC), 열가소성수지 중에서 선택되는 어느 하나로 성형되는 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법.The substrate or liner of the first step is an electromagnetic wave having a metal thin film and a liner, which is formed of any one selected from fiber reinforced plastic (FRP), sheet molding compound (SMC), bulk molding compound (BMC), and thermoplastic resin. Method of manufacturing shielding material.
제 9항에 있어서, The method of claim 9,
상기 제 2단계의 금속박막은 구리, 니켈, 알루미늄 박막 중에서 선택된 어느 하나인 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법.The metal thin film of the second step is a method of manufacturing an electromagnetic shielding material having a metal thin film and a liner, characterized in that any one selected from copper, nickel, aluminum thin film.
제 10항에 있어서,The method of claim 10,
상기 제 3단계의 간격은 0.2~1.0㎜의 범위인 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법.The interval of the third step is a method of manufacturing an electromagnetic shielding material having a metal thin film and a liner, characterized in that the range of 0.2 ~ 1.0mm.
제 11항에 있어서,The method of claim 11,
상기 라이너 두께는 1.0~2.5㎜인 것을 특징으로 하는 금속박막과 라이너를 갖는 전자파 차폐재의 제조방법.The liner thickness is 1.0 ~ 2.5mm method of manufacturing an electromagnetic shielding material having a metal thin film and a liner, characterized in that.
PCT/KR2019/002304 2018-07-03 2019-02-26 Electromagnetic wave shielding material having metal thin film and liner and method for manufacturing same WO2020032339A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241011A (en) * 1985-08-16 1987-02-23 Dainippon Printing Co Ltd Process of electromagnetic wave shield molding
KR20050029389A (en) * 2003-09-22 2005-03-28 예원플라즈마 주식회사 An apparutus and method for emi and esd shielding using plastic can in borad of electronic equipment
US20050202723A1 (en) * 2002-09-17 2005-09-15 Wavezero, Inc. Equipment and methods for producing continuous metallized thermoformable EMI shielding material
KR20080008833A (en) * 2006-07-21 2008-01-24 삼성전자주식회사 Case for electric apparatus and manufacturing method thereof
KR20160062013A (en) * 2013-09-25 2016-06-01 다츠다 덴센 가부시키가이샤 Shielding housing, printed circuit board, and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241011A (en) * 1985-08-16 1987-02-23 Dainippon Printing Co Ltd Process of electromagnetic wave shield molding
US20050202723A1 (en) * 2002-09-17 2005-09-15 Wavezero, Inc. Equipment and methods for producing continuous metallized thermoformable EMI shielding material
KR20050029389A (en) * 2003-09-22 2005-03-28 예원플라즈마 주식회사 An apparutus and method for emi and esd shielding using plastic can in borad of electronic equipment
KR20080008833A (en) * 2006-07-21 2008-01-24 삼성전자주식회사 Case for electric apparatus and manufacturing method thereof
KR20160062013A (en) * 2013-09-25 2016-06-01 다츠다 덴센 가부시키가이샤 Shielding housing, printed circuit board, and electronic device

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