CN107211549B - Housing member, electronic device, and method for manufacturing housing member - Google Patents
Housing member, electronic device, and method for manufacturing housing member Download PDFInfo
- Publication number
- CN107211549B CN107211549B CN201580074634.4A CN201580074634A CN107211549B CN 107211549 B CN107211549 B CN 107211549B CN 201580074634 A CN201580074634 A CN 201580074634A CN 107211549 B CN107211549 B CN 107211549B
- Authority
- CN
- China
- Prior art keywords
- metal layer
- film
- base film
- metal
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 193
- 239000002184 metal Substances 0.000 claims abstract description 193
- 238000007740 vapor deposition Methods 0.000 claims abstract description 49
- 238000005034 decoration Methods 0.000 claims abstract description 40
- 238000000465 moulding Methods 0.000 claims description 45
- 239000007769 metal material Substances 0.000 claims description 38
- 238000012546 transfer Methods 0.000 claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
- 239000010936 titanium Substances 0.000 claims description 22
- 229910052719 titanium Inorganic materials 0.000 claims description 17
- 230000001629 suppression Effects 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 26
- 239000010408 film Substances 0.000 description 256
- 239000010410 layer Substances 0.000 description 138
- 229920005989 resin Polymers 0.000 description 39
- 239000011347 resin Substances 0.000 description 39
- 230000035699 permeability Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 13
- 239000010419 fine particle Substances 0.000 description 11
- 238000007789 sealing Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 239000002932 luster Substances 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 241000234295 Musa Species 0.000 description 2
- 235000018290 Musa x paradisiaca Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000012994 photoredox catalyst Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 241000699670 Mus sp. Species 0.000 description 1
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1679—Making multilayered or multicoloured articles applying surface layers onto injection-moulded substrates inside the mould cavity, e.g. in-mould coating [IMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5886—Mechanical treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/518—Oriented bi-axially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2451/00—Decorative or ornamental articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2571/00—Protective equipment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
A housing component according to one embodiment of the present technology includes a decorative film and a housing portion. The decoration film includes a metal layer formed on a base film by vapor deposition, and a micro crack is formed in the metal layer by stretching the base film. The housing portion includes a decorated region to which the decoration film is adhered.
Description
Technical Field
The present technology relates to a case member applicable to an electronic device, an electronic device using the case member, and a method of manufacturing the case member.
Background
Conventionally, a member having a metal-like appearance while being capable of transmitting electromagnetic waves such as millimeter waves is designed as a case member of an electronic apparatus or the like. For example, patent document 1 discloses an exterior member for mounting a radar of an automobile on a emblem of the automobile. For example, indium is deposited on a resin film and the film is attached to the surface layer of the emblem by an insert molding method. Thereby, it is possible to form an exterior element having a decorative metallic luster and having no absorption region within the electromagnetic frequency band due to the island structure of indium (paragraph 0006 of the specification of patent document 1, etc.).
However, in the method of forming an island-shaped structure of indium, there is a problem that it is difficult to form a film thickness uniform over the whole in the case where, for example, the deposition area is large. Further, when the case member is formed, there is a problem that the island structure is easily broken due to the temperature of the resin flowing therein (paragraphs 0007 and 0008 of patent document 1, and the like).
In order to solve this problem, patent document 1 discloses the following technique. That is, an island-and-sea structure in which a metal region is an island and a nonmetal region surrounding the island is a sea is artificially formed with regularity. Then, each of the metal regions is insulated from each other by the non-metal region, and the area of the metal region and the interval with the adjacent metal region are appropriately controlled. Thus, a material having electromagnetic wave permeability comparable to that of a film in which indium is deposited can be obtained (paragraph 0013 of the specification of patent document 1, and so on).
Documents of the prior art
Patent document
Patent document 1: japanese patent application publication No. 2010-251899.
Disclosure of Invention
Technical problem
As described above, a technique for forming a case member having a metallic luster while being able to transmit radio waves and also having high designability is desired.
In view of this, an object of the present technology is to provide a housing member having a metal-like appearance while being capable of transmitting radio waves with high designability, an electronic apparatus employing the housing member, and a method of manufacturing the housing member.
Technical scheme for solving problems
In order to achieve the above-mentioned object, a case member according to an embodiment of the present technology includes a decorative film and a case portion.
The decoration film includes a metal layer formed on a base film by vapor deposition, and a micro crack is formed in the metal layer by stretching the base film.
The housing portion includes a decorated region to which the decoration film is adhered.
In the case member, a decorative film including a metal layer is adhered to a decorated region of the case member. The metal layer is formed on the base film by vapor deposition. In the metal layer, a microcrack is formed by stretching the base film. Thus, the selection range of the metal material constituting the metal layer is widened. It is possible to realize a case member that is permeable to radio waves and has a metal-like appearance and has high designability.
The decoration film may include a base film in which the metal layer is formed.
Since the microcracks are formed by stretching the base film, the metal layer can be formed on the base film with high adhesiveness. As a result, the durability of the decorated region decorated with the decoration film including the base film can be improved.
The micro-cracks may be formed by performing biaxial stretching on the base film.
Thus, fine cracks can be easily formed.
The metal layer may have a suppression structure that suppresses stretchability.
In this way, a metal material having high stretchability can be used, and designability is improved.
The suppression structure may be a structure in which a metal material constituting the metal layer has a frost column shape.
By making the metal material have a frost column shape, stretchability of the metal layer can be suppressed.
The metal layer may be formed on the base film by vacuum vapor deposition. In this case, the suppression structure may be formed by performing the vacuum vapor deposition under a predetermined temperature condition and a predetermined pressure condition.
By controlling the temperature condition and the pressure condition, the suppression structure can be easily formed.
The metal layer may be formed by performing vacuum vapor deposition on the base film conveyed from a wind-up roll toward a wind-up roll along an outer circumferential surface of a rotating drum.
In the case of using the roll-to-roll method, the decorative film can be easily mass-produced at low cost.
The metal layer may be made of any one of aluminum, titanium, and an alloy containing at least one of aluminum and titanium.
The metal layer may be formed of such a material that is difficult to form with wet plating and has high stretchability. In this way, the designability of the housing member can be improved.
The metal layer may have a laminated structure in which metal layers or metal oxide layers are laminated.
Thus, the stretchability of the metal layer can be suppressed and the designability of the case member can be improved.
The metal layer may include a layer of any one material among aluminum, aluminum oxide, titanium oxide, and an alloy including at least one of aluminum and titanium.
In this way, the designability of the housing member can be improved.
The micro-cracks may be formed at a pitch of 1 μm or less and 500 μm or more.
In this way, sufficient radio wave transmission characteristics can be exhibited.
An electronic device according to an embodiment of the present technology includes: the decorative layer, the housing portion, and electronic components housed within the housing portion.
The electronic device may include an antenna unit disposed inside the decorated region.
A method of manufacturing a case member according to an embodiment of the present technology includes: a metal layer is formed on a base film by vapor deposition, and a micro crack is formed in the metal layer by stretching the base film.
Forming a decorative film including a metal layer in which the micro-cracks are formed.
A transfer film is formed by bonding a carrier film to the decoration film.
And forming a forming part by an in-mold forming method or a hot stamping method to transfer the decoration film from the transfer printing film.
A method of manufacturing a case member according to another embodiment of the present technology includes: a metal layer is formed on a base film to be a carrier film by vapor deposition, and a micro crack is formed in the metal layer by stretching the base film.
Forming a transfer film comprising the base film and the metal layer.
And forming a forming part by an in-mold forming method or a hot stamping method to transfer the metal layer from the transfer film.
A method of manufacturing a case member according to another embodiment of the present technology includes: a metal layer is formed on a base film by vapor deposition, and a micro crack is formed in the metal layer by stretching the base film.
Forming a decorative film including a metal layer in which the micro-cracks are formed.
A molded part is formed integrally with the decorative film by an insert molding method.
The forming of the metal layer may include performing vacuum vapor deposition under a predetermined temperature condition and a predetermined pressure condition so that a metal material constituting the metal layer has a frost column shape.
The invention has the advantages of
As described above, according to the present technology, a housing component having a metal-like appearance while being capable of transmitting radio waves with high designability can be realized. It should be noted that the effects described herein are not necessarily limiting and may be any of the effects described in the present invention.
Drawings
Fig. 1 is a schematic diagram showing a configuration example of a portable terminal as an electronic apparatus according to an embodiment.
Fig. 2 is a schematic cross-sectional view showing a structural example of the metal decorative portion shown in fig. 1.
Fig. 3 is a schematic diagram showing a structural example of a glossy film composed of a base film and a metal layer.
Fig. 4 is a schematic diagram showing a structural example of the vacuum deposition apparatus.
Fig. 5 is an enlarged view schematically showing the glossy film after vacuum vapor deposition and before biaxial stretching.
Fig. 6 is a schematic diagram showing a relationship between the film temperature and the degree of vacuum and the shape of the film to be the metal layer.
Fig. 7 is a schematic diagram showing a structural example of the biaxial stretching device.
Fig. 8 is a schematic view for describing an in-mold forming method.
Fig. 9 is a schematic diagram for describing an insert molding method.
Fig. 10 is a schematic diagram for describing evaluation of the radio wave transmission characteristics.
Fig. 11 is a picture obtained by magnifying and photographing the surface state of the sample 2 by a microscope.
Fig. 12 is a schematic view showing a state where the front and rear sides of the device film are bonded upside down.
Fig. 13 is a schematic view showing another structural example of the metal decorative portion.
Fig. 14 is a diagram showing a structural example of a transfer film including a base film and a metal layer.
Detailed Description
Embodiments according to the present technology will be described hereinafter with reference to the drawings.
[ Structure of electronic device ]
Fig. 1 is a schematic diagram showing a configuration example of a portable terminal as an electronic apparatus according to an embodiment of the present technology. Part a of fig. 1 is a front view showing a front side of the portable terminal 100, and part B of fig. 1 is a perspective view showing a rear side of the portable terminal 100.
The portable terminal 100 includes a housing portion 101 and electronic components (not shown) accommodated within the housing portion 101. As shown in part a of fig. 1, a front surface 102, which is the front surface side of a housing 101, is provided with a telephone unit 103, a touch panel 104, and a facing camera 105. The calling section 103 is provided for calling with the other party on the telephone, and includes a speaker unit 106 and an audio input unit 107. The voice of the counterpart is output from the speaker unit 106, and the voice of the user is transmitted to the counterpart via the audio input unit 107.
On the touch panel 104, various images and GUIs (graphical user interfaces) are displayed. The user can see a still image or a moving image via the touch panel 104. Further, the user inputs various touch operations via the touch panel 104. The face camera 105 is used when capturing an image of the face or the like of the user. The specific structure of each device is not limited.
As shown in part B of fig. 1, a metal decorative portion 10 decorated to have a metal-like appearance is provided on the back surface portion 108 which is the back surface side of the case 101. The metal decorative portion 10 has a metal-like appearance and is permeable to radio waves.
In a predetermined region of the back surface portion 108, a decorated region 11, which will be described later in detail, is provided. By adhering the decorative film 12 according to the present technology into the decorated region 11, the metal decorative part 10 is constituted. Therefore, the decorated region 11 is a region where the metal decorative portion 10 is to be provided. The case portion 101 having the decorated region 11, and the decoration film 12 bonded to the decorated region 11 constitute a case member according to the present technology.
In the example shown in part B of fig. 1, the metal decoration portion 10 is partially formed at substantially the center of the back surface portion 108. The position where the metal device portion 10 is formed is not limited and may be set as appropriate. For example, the metal decoration portion 10 may be formed on the entire back surface portion 108. In this way, the entire back surface portion 108 can have a uniform metal-like appearance.
It is also possible to make the entire back surface portion 108 have the same metal-like appearance by making the appearance of the other portions around the metal decoration portion 10 substantially similar to the appearance of the metal decoration portion 10. Further, the designability can also be improved by giving the portions other than the metal decorative portion 108 other appearance such as a wood grain appearance. The position and size of the metal decorative portion 10, the appearance of other parts, and the like may be appropriately set so as to exhibit the designability desired by the user.
As the electronic components housed in the housing portion 101, in the present embodiment, an antenna unit 15 (see fig. 2) capable of communicating with an external reader/writer or the like via radio waves is housed. The antenna unit 15 includes, for example, a substrate (not shown), an antenna coil 16 (see fig. 2) formed on the substrate, a signal processing circuit unit (not shown) electrically connected to the antenna coil 16, and the like. The specific structure of the antenna unit 15 is not limited. Note that as the electronic components housed in the housing portion 101, various electronic components such as an IC chip and a capacitor may be housed.
Fig. 2 is a schematic cross-sectional view showing a structural example of the metal decorative portion 10. As described above, the metal decorative portion 10 includes the decorated region 11 provided in the region corresponding to the position of the antenna unit 15 and the like, and the decorative film 12 adhered to the decorated region 11.
The decoration film 12 includes an adhesive layer 18, a base film 19, a metal layer 20, and a sealing resin 21. The adhesive layer 18 is a layer for adhering the decorative film 12 to the decorated region 11. The adhesive layer 18 is formed by applying an adhesive material on the surface of the base film 19 opposite to the surface on which the metal layer 20 is formed. The kind of the adhesive material, the coating method, and the like are not limited.
The sealing resin 21 is made of a transparent material, and functions as a protective layer that protects the base film 19 and the metal layer 20. The sealing Resin 21 is formed by applying a UV-curable Resin, a thermosetting Resin, a Two-Component Curing Resin (Two-Component Curing Resin), or the like. By forming the sealing resin 21, for example, smoothing, stain prevention, peeling prevention, scratch prevention, and the like are achieved.
The base film 19 is made of a material having stretchability, and typically a resin film is used as the base film 19. As a material of the base film 19, for example, PET (polyethylene terephthalate), acrylic resin, or the like can be used. Other materials may also be used.
The metal layer 20 is formed to give the decorated region 11 a metal-like appearance. The metal layer 20 is a layer formed on the base film 19 by vacuum vapor deposition, and a number of minute cracks (hereinafter referred to as minute cracks) 22 are formed.
The fine cracks 22 form a plurality of discontinuous surfaces on the metal layer 20. Therefore, when radio waves are applied to the housing portion 101, it is possible to sufficiently prevent the generation of eddy current. Therefore, it is possible to sufficiently prevent the energy of the electromagnetic wave from being reduced due to the eddy current loss, and to achieve high radio wave permeability.
In the present embodiment, when the decorative film 12 is formed, first, the glossy film 23 composed of the base film 19 and the metal layer 20 is formed. Thereafter, the adhesive layer 18 and the sealing resin 21 are formed on the glossy film 23. Note that the formation order of the layers is not limited to this. Further, depending on the molding conditions of the case portion 101 and the like, the adhesive layer 18 and the sealing resin 21 may be omitted in some cases. In this case, the glossy film 23 is adhered to the decorated region 11 as the decoration film according to the present technology.
Fig. 3 is an enlarged schematic view showing a structural example of the glossy film 23 composed of the base film 19 and the metal layer 20. The glossy film 23 is formed by performing vacuum vapor deposition in a state where the base film 19 is conveyed in a roll-to-roll manner, which will be described later. Part a of fig. 3 is a cross-sectional view in the case of cutting the optical film along the traveling direction (X direction in the figure) of the base film 19. Part B of fig. 3 is a cross-sectional view in the case of cutting the optical film in a direction (Y direction in the figure) orthogonal to the traveling direction of the base film 19.
As shown in part a of fig. 3 and part B of fig. 3, in the present embodiment, the metal layer 20 is formed such that the metal material constituting the metal layer 20 has a shape of a frost column. That is, a plurality of fine columnar structures in which fine particles of the metal material are collected are formed on the foundation film 19 like frost columns. Hereinafter, when each fine pillar is referred to as a fine pillar 25, a minute gap (not shown) exists between the adjacent fine pillars 25.
In the present embodiment, the frost columnar structure corresponds to a suppression structure that suppresses stretchability of the metal layer 20. It is to be noted that such a structure may also be expressed as a (fine) pillar structure or a fiber-like structure.
As shown in part a of fig. 3, for each of the fine pillars 25, the growth direction of the fine particles is shifted away from the base film 19 in the Z direction, and becomes a curved shape like a banana. The directions in which each of the fine pillars 25 is bent are substantially the same as each other.
As shown in part B of fig. 3, there is a variation in the size or position of the cross section of each of the micro pillars 25. That is, a plurality of fine pillars 25 are formed at random positions on the base film 19, respectively. However, not limited to this, the plurality of fine pillars 25 may also be formed to be arranged on a substantially straight line along the Y direction.
The micro-cracks 22 formed in the metal layer 19 are formed between the micro-pillars 25. The microcracks 22 are formed by expanding fine voids between the fine pillars 25, and are sufficiently larger than the voids. By observing the cross section of the glossy film 23, the frost column-like structure and the microcracks 22 having the metal layer 20 can be sufficiently confirmed.
A method of forming the glossy film 23 will be described. The glossy film 23 is formed by vapor deposition and biaxial stretching. Fig. 4 is a schematic diagram showing a structural example of the vacuum deposition apparatus. In this vacuum deposition apparatus 500, continuous vacuum vapor deposition can be performed in a roll-to-roll manner.
The vacuum deposition apparatus 500 includes a film conveyance mechanism 501, a partition wall 502, a crucible 503, and a heating source (not shown) provided within a vacuum chamber (not shown). The film conveying mechanism 501 includes a wind-out roller 505, a rotary drum 506, and a wind-up roller 507. The base film 19 is conveyed from the take-up roll 505 along the outer peripheral surface of the rotary drum 506 toward the take-up roll 507.
The crucible 503 is disposed at a position facing the rotary cylinder 506. In the crucible 503, the metal material 90 constituting the metal layer 20 is accommodated. The region of the rotary cylinder 506 facing the crucible 503 becomes a film formation region 510, and fine particles 91 of the metal material 90 are deposited on the base film 19 during conveyance through the film formation region 510. The partition wall 502 restricts the fine particles 91 traveling at an angle toward a region other than the film formation region 510.
As the metal material 25, for example, a metal having high reflectance and relatively low permeability to visible light (e.g., Al, Ti, Cr, Fe, Co, Ni, Cu, Zn, Ag, W, Ir, Au, Pt, Sn, or an alloy containing these metals) can be used. Of course, it is not limited thereto, and other metal materials may be used. For example, the metal material 25 is appropriately selected in consideration of designability or material cost.
Although the film thickness of the metal layer 20 is not limited, it is formed, for example, in a thickness that reflects almost all visible light (for example, several nm to 100 nm). By forming the metal layer 20 with a thickness of greater than or equal to about 10nm, a sufficiently high reflectance can be exhibited.
In a state where the rotary drum 506 is sufficiently cooled, the base film 19 is conveyed. The metal material 90 in the crucible 503 is heated by a heating source (not shown) such as a heater, a laser, or an electron gun. In this way, the vapor containing the fine particles 91 is generated from the crucible 503. Then, the metal layer 20 is formed on the base film 19 by depositing the fine particles 91 on the base film 19 that travels through the film formation area 510. It should be noted that the structure of the vacuum deposition apparatus 500 is not limited.
Fig. 5 is an enlarged view schematically showing the glossy film 23' after vacuum vapor deposition and before biaxial stretching. Part a of fig. 5 is a cross-sectional view in the case of cutting in the traveling direction of the base film 19, and part B of fig. 5 is a cross-sectional view in the case of cutting in the direction orthogonal to the traveling direction. The glossy film 23' shown in part a and part B of fig. 5 is in a state before the micro-crack 22 is formed.
After entering the film formation region 510 in fig. 4 and starting film formation, the fine particles 91 of the metal material 90 are raised from the front side of the traveling base film 19 at a predetermined angle. When the base film 19 travels through the film formation area 510, the deposition direction of the metal particles 91 is close to the normal direction of the base film 19. Then, at the intermediate position of the film formation region 510, the fine particles 91 of the metal material 90 are deposited in the direction substantially the same as the normal direction of the base film 19.
When the base film 19 passes through the middle position of the film formation region 510, the fine particles 91 of the metal material 90 reach the base film 19 at a predetermined angle from the rear side of the base film 19. As the conveyance of the base film 19 continues to advance, the deposition direction of the fine particles 91 is close to the planar direction of the base film 19. As a result, a plurality of fine pillars 25 having a curved shape like a banana are formed.
Further, in the present embodiment, the temperature conditions and pressure conditions of the vacuum vapor deposition are appropriately controlled so that the metal layer 20 has a frost column-like structure. That is, the present inventors have found suitable conditions under which a plurality of fine pillars 25 are formed on the base film 19 with sufficient adhesiveness. The conditions are determined by the film temperature, the degree of vacuum, the film formation rate, the deposition material, and the like. In particular, the influence of the film temperature and the degree of vacuum is significant. By taking this into account, the frost column-like structure according to the present technology can be achieved by controlling the film temperature and the degree of vacuum.
Fig. 6 is a schematic diagram showing the relationship between the film temperature and the degree of vacuum and the shape of the film to be the metal layer 20. As shown in fig. 6, in the case where the film temperature is high and the degree of vacuum is high (pressure is low), a film structure a which is dense and hard and has adhesion to the base film 10 is obtained. In the case of the film structure a, since high stretchability is maintained, it is difficult to form a suitable microcrack 22 by biaxial stretching to be described below.
In the case where the film temperature is low and the degree of vacuum is low (pressure is high), a film structure C is obtained which is a rough film filled with voids, is very fragile, and has no adhesion. In the case of the film structure C, cracks are easily formed by biaxial stretching, but the appearance of metallic luster may be deteriorated due to the strength of the metal layer 20. Further, since the adhesion force with the base film 19 is low, the metal layer 20 is likely to overflow and fall when the case portion 101 is formed by an In-Mold Molding (In-Mold Molding) method, an Insert Molding (Insert Molding) method, or the like.
When the film temperature and the degree of vacuum are controlled to be intermediate values of the film temperature and the degree of vacuum described above, since the growth is started with the particles initially attached to the base film 19 as nuclei and the growth becomes columnar (columnar structure), the film structure B having a moderate hardness, adhesion is obtained. In the case of the film structure B, the stretchability can be suppressed as compared with the film structure a or bulk metal (bulk metal), and the microcracks 22 can be suitably formed by biaxial stretching. Further, the film structure B has suitable strength and sufficient adhesion as compared with the film structure C, so that high durability of the metal decorative portion 10 can be achieved, and suitable decoration can be achieved on the housing portion 101 by in-mold molding or the like.
By controlling the film temperature and the degree of vacuum in the intermediate ranges, the metal layer 20 having the film structure B can be formed. As the intermediate range, for example, the film temperature is in the range of from about-30 ℃ to about 100 ℃ and the degree of vacuum is about 1X 10- 4Pa to about 1X 10-2Pa, in the range of Pa. Of course, without being limited thereto, suitable conditions for the metal layer 20 to have the film structure B may be set as appropriate only according to the metal material to be deposited, for example. For example, in the case where the metal layer 20 has the film structure a, it may be only necessary to reduce the film temperature and the degree of vacuum. Further, in the case where the metal layer 20 has the film structure C, it may be only necessary to increase the film temperature and the degree of vacuum.
Fig. 7 is a schematic diagram showing a structural example of the biaxial stretching device. The biaxial stretching device 550 includes a base member 551, and four stretching mechanisms 552 provided on the base member 551 and having substantially the same structure. In the four stretching mechanisms 552, two mechanisms are arranged on each of two axes (x-axis and y-axis) orthogonal to each other, respectively, so that the two mechanisms face each other on each axis. Hereinafter, description will be made with reference to the stretching mechanism 552a that stretches the glossy film 23' toward the direction opposite to the arrow of the y-axis direction.
Stretching mechanism 552a includes a fixed block 553, a movable block 554, and a plurality of grippers (clips) 555. The fixing block 553 is fixed to the base member 551. A tension screw 556 extending in the tension direction (y direction) penetrates the fixing block 553.
The movable block 554 is movably disposed on the base member 551. The movable block 554 is connected to a tension screw 556 penetrating the fixed block 553. Accordingly, the movable block 554 may be moved in the y direction by operating the tension screw 556.
The plurality of grip pieces 555 are arranged along a direction (x direction) orthogonal to the stretching direction. A slide shaft 557 extending in the x-direction penetrates each of the plurality of chucking members 555. The position of each gripping member 555 in the x direction may vary along the slide shaft 557. Each clamp 555 of the plurality of clamps 555, and the movable block 554, are connected to each other by a connecting rod 558 and a connecting pin 559.
The stretching ratio (ratio of the amount of stretching to the original size) can be controlled by the amount of operation of the stretching screw 556. Further, the stretching ratio may be controlled by appropriately setting the number and position of the plurality of clips 555, the length of the connecting pin 558, and the like. It should be noted that the structure of the biaxial stretching device 550 is not limited. In the biaxial stretching device 550 according to the present embodiment, although biaxial stretching is performed on the film using a full-cut sheet (full-cut sheet), the biaxial stretching may be continuously performed by a roller. For example, by applying a tension caused by the traveling direction between the rollers and a tension perpendicular to the traveling direction caused by the nip 555 provided between the rollers moving in synchronization with the traveling, it is possible to perform continuous biaxial stretching.
The vacuum vapor deposited glossy film 23' is arranged on the base member 551, and a plurality of clamping pieces 555 of a stretching mechanism 552 is attached to each of the four sides. The biaxial stretching is performed by operating four stretching screws 556 in a state where the glossy film 23' is heated by a temperature-controlled heating lamp (not shown) or temperature-controlled hot air. Thus, as shown in fig. 3, a plurality of micro cracks 22 are formed on the metal layer 20.
It is to be noted that, although the stretching ratio is not limited, it is typical to set the stretching ratio within a range from about 2% to about 10%. The stretching ratio may be appropriately set based on the size of the glossy film 23, the stretchability of the metal material, and the like. The pitch of the formed micro-cracks 22 depends on the frequency band of the antenna, but the size that cannot be distinguished by the naked human eye may be set, for example, within a range of 1 μm or more and 500 μm or less. However, the present invention is not limited to this, and may be set as appropriate based on designability in appearance, for example.
Fig. 8 is a schematic view for describing an in-mold forming method. In-mold molding is performed by a molding apparatus 600 including a cavity mold 601 and a core mold 602 shown in fig. 8. As shown in part a of fig. 8, a recess 603 corresponding to the shape of the housing portion 101 is formed in the cavity mold 601. The transfer film 30 is provided so as to cover the recess 603. The transfer film 30 is formed by adhering the decoration film 12 shown in fig. 2 to the carrier film 31. The transfer sheet 30 is supplied from the outside of the molding apparatus 600 by, for example, a roll-to-roll manner.
As shown in Part B of fig. 8, the cavity mold 601 and the core mold 602 are clamped, and the molding resin 35 is injected into the recess 603 via a Gate Part 606 formed in the core mold 602. In the cavity mold 601, a Sprue portion (Sprue Part)608 that supplies the molding resin 35 and a Runner portion (Runner Part)609 connected to the Sprue portion are formed. When the cavity mold 601 and the core mold 602 are clamped, the runner section 609 and the gate section 606 are connected to each other. In this way, the molding resin 35 supplied to the sprue portion 608 is injected into the recess 603. Note that the structure for the injection molding resin 35 is not limited.
As the molding resin 35, for example, general-purpose resin such as ABS (acrylonitrile butadiene styrene) resin, engineering plastic such as PC (polycarbonate) resin, ABS and PC mixed resin, and the like are used. Without being limited thereto, the material and color (transparency) of the molding resin may be appropriately selected so as to obtain a desired housing portion (housing member).
The molding material 35 in a molten state at a high temperature is injected into the recess 603. The molding material 35 is injected to press the inner surface of the concave portion 603. At this time, the transfer film 30 disposed on the concave portion 603 is pressed by the molding resin 35 to be deformed. The adhesive layer 18 formed on the transfer film 30 is melted by the heat of the molding resin 35, and the decoration film 12 is adhered to the surface of the molding resin 35.
After the injection molding resin 35 is injected, the cavity mold 601 and the core mold 602 are cooled, and the jig is released. The molding resin 35 on which the decorative film 12 is transferred is attached to the core mold 602. By taking out the molding resin 35, the case portion 101 in which the metal decorative portion 10 is formed in a predetermined region is manufactured. Note that when the jig is released, the carrier film 30 is peeled off.
By using the in-mold forming method, it is possible to easily conform the position of the decorative film 12 and simply form the metal decorative part 10. Further, the design flexibility of the shape of the case 101 is high, and the case 101 having various shapes can be manufactured.
It is to be noted that the antenna unit 15 accommodated inside the housing portion 101 may be attached by an in-mold molding method when the housing portion 101 is molded. Alternatively, the antenna unit 15 may be attached to the inside of the housing portion 101 after the housing portion 101 is molded. Further, in some cases, the antenna unit 15 may also be built inside the housing.
As shown in fig. 2, in the present embodiment, the base film 19 and the case portion 101 are bonded via the adhesive layer 18. Not limited to this, as shown in fig. 12, the sealing resin 21 side may be bonded to the case portion 101. In this case, a transparent base film 19 is used, and the sealing resin 21 may be opaque. That is, as the sealing resin 21, a resin of an arbitrary color can be used. In this way, designability can be improved. Further, the base film 19 may be made to function as a protective layer.
Fig. 9 is a schematic diagram for describing an insert molding method. In the insert molding, as an insert film, the decoration film 12 is provided in the cavity mold 651 of the molding device 650. Then, as shown in part B of fig. 9, the cavity mold 651 and the core mold 652 are clamped, and the molding resin 35 is injected into the cavity mold 651 via the gate portion 656. Thus, the case 101 is integrally molded with the decorative film 12. The metal decorative part 10 can also be easily formed by using an insert molding method. In addition, the case portion 101 having various shapes can be manufactured. It should be noted that the structure of the molding apparatus that performs in-mold molding and insert molding is not limited.
The metallic decorative property and the radio transparency in the case of forming the metallic decorative portion 10 according to the present technology will be described. Part a of fig. 10 is a schematic diagram for describing an evaluation method of radio wave permeability. Part B of fig. 10 is a table showing the evaluation results of the radio wave permeability.
As samples for this evaluation, 8 samples from sample 1 to sample 8 were formed. In each sample, the film of the metal layer 20 was formed by using a PET film having a thickness of about 100 μm as the base film 19 and by vacuum vapor deposition to have a film structure B shown in fig. 6.
As vapor deposition conditions, from about 1X 10 is used-3Pa to about 1X 10-2Pa, and film formation is performed at a speed of about 1 nm/s. At this time, the distance between the crucible 503 and the base film 19 is about 500 nm. The metallic material of each sample is as in the table of part B of fig. 10. In addition, wherein TiO2The oxide film of (titanium oxide) was formed by vapor-depositing Ti while flowing oxygen at about 30 sccm.
After the vacuum vapor deposition, a biaxial stretching process is performed with a stretching ratio shown in part B of fig. 10. Note that, in the case where the stretching ratio was 0%, the stretching process (sample 1) was not performed. In each of these samples, high designability in which light can be reflected with high reflectivity was confirmed.
As shown in part a of fig. 10, the radio wave permeability is evaluated using a network analyzer (high frequency circuit) 70. The reflected power terminal 71 and the pass power terminal 72 of the network analyzer 70 are located at both ends of a waveguide 73 having a diameter of 100mm and a length of 260 mm. A hole 75 is provided at a central portion of the waveguide 73, and a square hole 74 having an opening size of 40mm × 40mm is formed in the hole 75.
Each of the above samples was clamped in the hole 75, respectively, to evaluate the radio wave permeability thereof. In the present embodiment, as the evaluation value of the radio wave transmittance, the attenuation rate at 2.45GHz, which is generally used by WiFi or the like, is calculated. As shown in part B of fig. 10, the attenuation rate in dB is obtained by subtracting the value when no sample is put as a reference value. The closer the attenuation ratio is to 0dB, the higher the radio wave transmittance. And the larger the negative value, the lower the radio wave permeability.
Fig. 11 is a picture obtained by magnifying and photographing the surface state of the sample 2 with a microscope. The picture is taken to include the x-axis and the y-axis shown in fig. 11. However, in order to easily recognize the axis and scale portion, the respective lines are shown enhanced on the picture.
The dimension of one scale of the x-axis and y-axis shown in fig. 11 is about 100 μm. It can therefore be seen that on the metal layer 20 of sample 2, the micro-cracks 22 having a pitch of about 10 μm were formed in the biaxial direction. Note that the crack size (μm) shown in part B of fig. 10 is equal to the pitch of the micro-cracks 22.
These Al, Ti, and the like are metals having brightness and luster, and are very useful metal materials for realizing metallic luster. However, since Al, Ti, or the like has high stretchability, it is difficult to form the microcracks 22 by the conventional technique. In the present technology, by forming the metal layer 20 in vapor deposition to have a frost column-like structure, stretchability can be suppressed. Therefore, even in the case of using a metal material having high stretchability such as Al and Ti, the microcracks 22 can be suitably formed by the biaxial stretching process. As a result, high radio wave permeability can be exhibited, and a very good metallic luster appearance is exhibited.
In samples 5-8, by using Ti + TiO2The double layer structure of (1) can utilize Ti film surface and TiO2Interference of film light produces color. Even in the case of using such a decorative film composed of a metal + oxide film, high radio wave permeability can be exhibited by the present technology. As shown in part B of fig. 10, by adjusting TiO2Can realize various metallic luster and improve designability.
As described above, the metal layer 20 may be formed to have a stacked structure in which metal layers or metal oxide layers are stacked. Even if Al and Al are included2O3(alumina), Ti, TiO2And an alloy containing at least one metal of Al and Ti, high radio wave permeability can also be exhibited.
As described above, in the present embodiment, the decorative film 12 is bonded to the decorated region 11 of the case portion 101. In the decoration film 12, the metal layer 20 is formed on the base film 19 by vacuum vapor deposition, and the micro-cracks 22 are formed in the metal layer 20 by performing biaxial stretching on the base film 19.
Since the metal material film is formed by vapor deposition, a material such as Al and Ti which is difficult to deposit on a resin by wet plating such as electroless plating (electro plating) can be used. Therefore, the selection range of usable metal materials is very large. In addition, since the micro-cracks 22 are formed by biaxial stretching, the metal layer 20 having high adhesiveness can be formed in vacuum vapor deposition. Therefore, the metal layer 20 does not overflow and fall down at the time of in-mold molding and at the time of insert molding, and the case portion 101 can be molded appropriately. Further, the durability of the metal decorative part 10 itself can be improved.
Further, since the metal layer is formed to have a frost column shape and the stretchability is suppressed in the vacuum vapor deposition, a metal material having high stretchability, such as Al, Ti, Ag, Au, and Sn, may be used. In this regard, the selection range of the metal material is also significantly widened, and the housing portion 101 can be formed to have a desired metal appearance. As a result, a case member that is permeable to radio waves and has a metal-like appearance with high designability can be realized.
Further, although the vacuum film forming method is conventionally a high-cost processing method, in the present embodiment, since film formation can be continuously performed on a film by a roll-to-roll method. Therefore, it is possible to significantly reduce the cost and achieve an improvement in productivity.
In the indium foil having the above radio wave permeability, the radio wave permeability is realized by a discontinuous indium film. However, in the indium foil, since the film thickness is very thin, sufficient reflectance is not obtained, darkening is caused, and the designability of metal decoration is very low. In addition, indium is a rare metal, so material cost is spent.
A method of forming a discontinuous film by adding stress to the metal plating film and causing it to form cracks is also conceivable. However, the metal materials that can be formed into a film by wet plating are limited. In particular, Al, Ti, Zn, and the like cannot be coated with a resin by electroless plating. In addition, there are environmental issues such as waste liquid disposal.
A method of forming a discontinuous film by fine pattern etching is also conceivable. However, the cost is increased due to the addition of processes such as resist coating, exposure, etching, cleaning, and resin sealing.
In contrast, in the case portion including the metal decorative portion according to the present technology, various effects as follows can be exhibited.
The radio wave transmission characteristic can be improved, and the added value of the design can be improved by the metal decoration.
Since substantially all metals can be used by vapor deposition or the like, the range of texture choices is wide.
Even in the case of using a metal material having high stretchability, the vapor deposition conditions can be controlled by sufficiently cooling the base film 19, and thus, the miniaturization of crystallinity, the growth structure in a frost column shape, the gaps between fine columns, and the like can be achieved. As a result, since a structure in which the microcracks 22 are easily formed (a structure in which stretchability is suppressed) can be easily realized in biaxial stretching, decoration having radio wave permeability can be realized.
Since the glossiness and reflectance can be improved compared to conventionally used products, a high added value can be achieved.
Since the glossy film 23 can be easily formed by a mass production process such as a roll-to-roll manner, it is very advantageous in mass production and cost reduction.
Since the molding can be performed without performing a mask process or an etching process, it is possible to achieve cost reduction and prevent generation of harmful waste.
Since a protective layer (e.g., the sealing resin 21 in fig. 2) that protects the metal layer 20 can be easily formed at the outermost portion, defects such as peeling of the metal layer 20 can be prevented, and the metal layer 20 is prevented from being reduced due to long-term use. Therefore, the appearance quality can be maintained. Further, by coloring the protective portion, a new design expression of metal + coloring can be realized.
Since the resin case 101 can be easily formed, the weight of the product can be reduced.
The present technology is applicable to substantially all electronic devices that house an internal antenna or the like inside. Examples of such electronic devices include electronic devices such as mobile phones, smart phones, personal computers, game machines, digital cameras, audio devices, TVs, projectors, car navigation systems, GPS terminals, digital video cameras, and wearable information devices (glasses type, wrist band type), operation devices such as remote controllers, mice, and touch pens that operate these electronic devices through wireless communication and the like, and electronic devices provided in vehicles such as vehicle-mounted radars and vehicle-mounted antennas, and the like.
It is to be noted that the effects described in the present specification including the effects listed above are merely exemplary and not restrictive, and additional effects may be provided. Moreover, the above description of multiple effects does not imply that these effects must be presented simultaneously. But means that at least any of the above-mentioned effects can be obtained depending on conditions and the like, and effects not described in the present specification can of course be exhibited.
< other embodiment >
The present technology is not limited to the above-described embodiments, and various other embodiments may be implemented.
Fig. 13 is a schematic view showing another structural example of the metal decorative portion. In the metallic decorative portion 210 shown in part a of fig. 13, a concave-convex process is performed on the base film 219 within the decorative film 212, and the metallic layer 220 is formed on the concave-convex surface 219a by vacuum vapor deposition. Then, the micro-crack 222 is formed by biaxial stretching. In this way, the surface of the metal layer 220 also has irregularities corresponding to the irregularities of the base film 219. As a result, the metallic decorative portion 210 can be designed by a hairline processing (wire processing) and a blast processing (blast processing) of a metal finishing processing (metal processing). The texture of the metallic decorative portion 210 can be changed by changing the shape, size, and the like of the unevenness. It is to be noted that the same effect can be obtained also in the case where the metal layer 220 is formed on the surface 219b on the opposite side to the uneven surface 219 a.
In the metallic decoration portion 310 shown in part B of fig. 13, on the metallic layer 320 within the decoration film 312, an oxide film 380 as an optical interference film is formed. This is the same as the Ti + TiO of samples 5 to 8 shown in part B of FIG. 102The double-layer structure of (2) is equivalent to a structure, and can present high designability. For example, a structure in which the color, texture, or the like changes depending on the angle at which the metal decorative portion 310 is viewed can also be realized. This can be achieved by appropriately setting the shape of the irregularities of the base film 219 or the material or thickness of the adhesive resin 221.
Fig. 14 is a schematic diagram of a structure example of a transfer film including a base film and a metal layer. The transfer film 430 includes a base film 419, a peeling layer 481, a hard coat layer 482, a metal layer 420, an adhesion resin 421, and an adhesive layer 418. A peeling layer 481 and a hard coat layer 482 are formed on the base film 419 in this order.
Thus, the metal layer 420 is formed on the base film 419 in which the peeling layer 481 and the hard coat layer 482 are formed. Then, by stretching the base film 419, a micro crack 422 is formed in the metal layer 420.
As shown in part B of fig. 14, when the case portion 101 is formed by the in-mold forming method, the base film 419 and the peeling layer 481 are peeled off, and the decoration film 412 including the metal layer 420 is adhered to the decorated region 411. As described above, the base film 419 may be used as a carrier film. Note that the base film 419 in which the peeling layer 481 and the hard coat layer 482 are formed may also be regarded as a base film according to the present technology.
In the above, the suppressing structure that suppresses stretchability of the metal layer has been realized by the frost column-like structure. However, the present invention is not limited to this, and the suppression structure may be implemented by another structure. For example, a structure in which impurities are mixed in a metal material constituting the metal layer may be used as the suppression structure. For example, compared with the case where the metal layer is formed by a pure metal, it is also possible to suppress stretchability by forming the metal layer not by a pure metal but by a material mixed with 1% or more of impurities. Further, by forming the metal oxide layer as a base layer of the metal layer, stretchability can also be suppressed. It is to be noted that, for a metal having low stretchability, the suppressing structure may not be formed. In this case, the decorative film according to the present technology may also be formed by vacuum vapor deposition and biaxial stretching.
In the above, as shown in fig. 3 and the like, the curved fine pillars 25 are formed. Without being limited thereto, the fine pillars may be formed on the base film fixed on the plane by vacuum vapor deposition. In this case, the fine particles of the metal material grow linearly to form fine pillars extending in one direction. Of course, the glossy film 23 may be formed by a batch film forming process.
In the above, the case portion is molded by in-mold molding and insert molding. Without being limited thereto, the case member including the metal decoration portion according to the present technology may be molded by vacuum molding or pressure molding.
The stretching for forming the micro-crack 22 is not limited to biaxial stretching. Uniaxial stretching or three or more axis stretching may be performed. Further, the base film 19 wound up by the winding roll 507 shown in fig. 4 may be further subjected to biaxial stretching by a roll-to-roll method. Further, after performing the vacuum vapor deposition, the biaxial stretching may be further performed before being wound up by the winding roll 507.
In the above, the decoration film 12 is adhered to the housing portion 101 by the in-mold forming method or the insert molding method. Without being limited thereto, the decoration film 12 may be adhered to the case portion 101 by other methods such as thermal transfer and adhesion. That is, a case portion having a decorated region to which a decoration film including a metal layer is transferred may be formed by a hot stamping (hot stamping) method using the transfer films 30 and 430 shown in fig. 8 and 14.
At least two of the features of the embodiments described above may also be combined. That is, the various features described in the embodiments may be arbitrarily combined without distinguishing the embodiments.
Note that the present technology may also take the following configuration.
(1) A housing component, comprising:
a decorative film including a metal layer formed on a base film by vapor deposition and forming a micro crack in the metal layer by stretching the base film; and
a housing portion including a decorated region, the decoration film being adhered to the decorated region.
(2) The housing member according to (1), wherein
The decoration film includes a base film in which the metal layer is formed.
(3) The housing member according to (1) or (2), wherein
The micro-cracks are formed by performing biaxial stretching on the base film.
(4) The housing component according to any one of (1) to (3), wherein
The metal layer has a suppression structure that suppresses stretchability.
(5) The housing member according to (4), wherein
The suppression structure is a structure in which a metal material constituting the metal layer has a frost column shape.
(6) The housing member according to (4) or (5), wherein
The metal layer is formed on the base film by vacuum vapor deposition, and
the suppression structure is formed by performing the vacuum vapor deposition under a predetermined temperature condition and a predetermined pressure condition.
(7) The housing member according to (6), wherein
The metal layer is formed by performing vacuum vapor deposition on the base film conveyed from a take-up roll toward a take-up roll along an outer circumferential surface of a rotating drum.
(8) The housing component according to any one of (4) to (7), wherein
The metal layer is made of any one of aluminum, titanium, and an alloy containing at least one of aluminum and titanium.
(9) The housing component according to any one of (4) to (7), wherein
The metal layer has a laminated structure in which metal layers or metal oxide layers are laminated.
(10) The housing member according to (9), wherein
The metal layer includes a layer of any one of aluminum, aluminum oxide, titanium oxide, and an alloy containing at least one of aluminum and titanium.
(11) The housing component according to any one of (1) to (10), wherein
The micro-cracks are formed at a pitch of 1 μm or less and 500 μm or more.
(12) An electronic device, comprising:
a decorative film including a metal layer formed on a base film by vapor deposition and forming a micro crack in the metal layer by stretching the base film; and
a housing portion including a decorated region to which the decoration film is adhered; and
an electronic component housed within the housing portion.
(13) The electronic apparatus according to (12),
the electronic component includes an antenna unit disposed inside the decorated region.
(14) A method of manufacturing a housing component, comprising:
forming a metal layer on a base film by vapor deposition, and forming a micro-crack in the metal layer by stretching the base film;
forming a decorative film including a metal layer in which the micro-cracks are formed;
forming a transfer film by bonding a carrier film to the decoration film; and
and forming a forming part by an in-mold forming method or a hot stamping method to transfer the decoration film from the transfer printing film.
(15) A method of manufacturing a housing component, comprising:
forming a metal layer on a base film to be a carrier film by vapor deposition, and forming a micro crack in the metal layer by stretching the base film;
forming a transfer film comprising the base film and the metal layer; and
and forming a forming part by an in-mold forming method or a hot stamping method to transfer the metal layer from the transfer film.
(16) A method of manufacturing a housing component, comprising:
forming a metal layer on a base film by vapor deposition, and forming a micro-crack in the metal layer by stretching the base film;
forming a decorative film including a metal layer in which the micro-cracks are formed; and
a molded part is formed integrally with the decorative film by an insert molding method.
(17) The method for manufacturing a case member according to any one of (14) to (16), wherein
The forming of the metal layer includes performing vacuum vapor deposition under a predetermined temperature condition and a predetermined pressure condition so that a metal material constituting the metal layer has a frost column shape.
List of reference marks
10. 210, 310 metallic decorative part
11. 411 area to be decorated
12. 212, 312, 412 decorative film
15 antenna unit
19. 219, 419 base film
20. 220, 320, 420 metal layers
22. 422 fine cracks
25 micro fine column
30. 430 transfer film
31 carrier film
90 metal material
100 portable terminal
101 casing part
500 vacuum deposition device
550 biaxial stretching device
600. 650 forming device
Claims (15)
1. A housing component, comprising:
a decorative film including a metal layer that is formed on a base film by vapor deposition and forms microcracks in the metal layer by stretching the base film, and that has a structure that suppresses stretchability; and
a housing portion including a decorated region to which the decoration film is adhered,
wherein the suppressing structure is a frost column structure in which a metal material constituting the metal layer has a frost column shape, the frost column structure having fine columns and fine voids between the fine columns, wherein the microcracks are larger than the fine voids.
2. Housing component according to claim 1, wherein
The decoration film includes a base film in which the metal layer is formed.
3. Housing component according to claim 1, wherein
The micro-cracks are formed by performing biaxial stretching on the base film.
4. Housing component according to claim 1, wherein
The metal layer is formed on the base film by vacuum vapor deposition, and
the suppression structure is formed by performing the vacuum vapor deposition under a predetermined temperature condition and a predetermined pressure condition.
5. Housing component according to claim 4, wherein
The metal layer is formed by performing vacuum vapor deposition on the base film conveyed from a take-up roll toward a take-up roll along an outer circumferential surface of a rotating drum.
6. Housing component according to claim 1, wherein
The metal layer is made of any one of aluminum, titanium, and an alloy containing at least one of aluminum and titanium.
7. Housing component according to claim 1, wherein
The metal layer has a laminated structure in which metal layers or metal oxide layers are laminated.
8. Housing component according to claim 7, wherein
The metal layer includes a layer of any one of aluminum, aluminum oxide, titanium oxide, and an alloy containing at least one of aluminum and titanium.
9. Housing component according to claim 1, wherein
The micro-cracks are formed at a pitch of 1 μm or more and 500 μm or less.
10. An electronic device, comprising:
a decorative film including a metal layer that is formed on a base film by vapor deposition and forms microcracks in the metal layer by stretching the base film, and that has a structure that suppresses stretchability; and
a housing portion including a decorated region to which the decoration film is adhered; and
an electronic component housed within the housing portion,
wherein the suppressing structure is a frost column structure in which a metal material constituting the metal layer has a frost column shape, the frost column structure having fine columns and fine voids between the fine columns, wherein the microcracks are larger than the fine voids.
11. The electronic device of claim 10, wherein the electronic device,
the electronic component includes an antenna unit disposed inside the decorated region.
12. A method of manufacturing a housing component, comprising:
forming a metal layer on a base film by vapor deposition, and forming a micro crack in the metal layer by stretching the base film, and the metal layer has a suppression structure that suppresses stretchability;
forming a decorative film including a metal layer in which the micro-cracks are formed;
forming a transfer film by bonding a carrier film to the decoration film; and
forming a molding part by an in-mold molding method or a hot stamping method to transfer the decoration film from the transfer film,
wherein the suppressing structure is a frost column structure in which a metal material constituting the metal layer has a frost column shape, the frost column structure having fine columns and fine voids between the fine columns, wherein the microcracks are larger than the fine voids.
13. The method for manufacturing a housing component according to claim 12, wherein
The forming of the metal layer includes performing vacuum vapor deposition under a predetermined temperature condition and a predetermined pressure condition so that a metal material constituting the metal layer has the shape of the frost column.
14. A method of manufacturing a housing component, comprising:
forming a metal layer on a base film to be a carrier film by vapor deposition, and forming a micro crack in the metal layer by stretching the base film, and the metal layer having a suppression structure that suppresses stretchability;
forming a transfer film comprising the base film and the metal layer; and
forming a molding part by an in-mold molding method or a hot stamping method to transfer the metal layer from the transfer film,
wherein the suppressing structure is a frost column structure in which a metal material constituting the metal layer has a frost column shape, the frost column structure having fine columns and fine voids between the fine columns, wherein the microcracks are larger than the fine voids.
15. A method of manufacturing a housing component, comprising:
forming a metal layer on a base film by vapor deposition, and forming a micro crack in the metal layer by stretching the base film, and the metal layer has a suppression structure that suppresses stretchability;
forming a decorative film including a metal layer in which the micro-cracks are formed; and
forming a molded part integrally with the decorative film by an insert molding method,
wherein the suppressing structure is a frost column structure in which a metal material constituting the metal layer has a frost column shape, the frost column structure having fine columns and fine voids between the fine columns, wherein the microcracks are larger than the fine voids.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-019705 | 2015-02-03 | ||
| JP2015019705 | 2015-02-03 | ||
| PCT/JP2015/005439 WO2016125212A1 (en) | 2015-02-03 | 2015-10-29 | Case component, electronic device and method for producing case component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107211549A CN107211549A (en) | 2017-09-26 |
| CN107211549B true CN107211549B (en) | 2021-05-28 |
Family
ID=56563579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580074634.4A Active CN107211549B (en) | 2015-02-03 | 2015-10-29 | Housing member, electronic device, and method for manufacturing housing member |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10710289B2 (en) |
| EP (1) | EP3255965B1 (en) |
| JP (1) | JP6627781B2 (en) |
| CN (1) | CN107211549B (en) |
| WO (1) | WO2016125212A1 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016088702A1 (en) * | 2014-12-01 | 2016-06-09 | 株式会社タイカ | Hydraulic transfer method and hydraulic transfer sheet |
| CN107211549B (en) * | 2015-02-03 | 2021-05-28 | 索尼公司 | Housing member, electronic device, and method for manufacturing housing member |
| JP6720644B2 (en) * | 2016-03-30 | 2020-07-08 | 大日本印刷株式会社 | Hard coat film for transfer to electromagnetic wave transmissive decorative member, hard coat layer laminate with substrate film, electromagnetic wave transmissive decorative member, and production methods thereof |
| WO2017179463A1 (en) * | 2016-04-12 | 2017-10-19 | ソニー株式会社 | Structure, electronic equipment, decoration film, and method for manufacturing structure |
| US20210101327A1 (en) * | 2017-03-31 | 2021-04-08 | Sony Corporation | Structure, decorative film, method for producing structure, and method for producing decorative film |
| KR101810815B1 (en) * | 2017-04-07 | 2017-12-20 | 김병삼 | Manufacturing method of sensor cover penetrating electronic signal having micro crack and laser hole |
| DE102017206916A1 (en) * | 2017-04-25 | 2018-10-25 | Thyssenkrupp Ag | Method for joining a metal-polymer laminate |
| JP7211359B2 (en) * | 2017-05-30 | 2023-01-24 | ソニーグループ株式会社 | Structural body, decorative film, structure manufacturing method, and decorative film manufacturing method |
| JP2020128875A (en) * | 2017-06-14 | 2020-08-27 | 株式会社島津製作所 | Electromagnetic wave transmission inspection method and electromagnetic wave transmissive structure |
| WO2018235488A1 (en) * | 2017-06-21 | 2018-12-27 | 富士フイルム株式会社 | Composite body |
| KR101925470B1 (en) | 2017-06-27 | 2018-12-05 | 주식회사 엘지화학 | Decoration element and preparing method thereof |
| JPWO2019187929A1 (en) * | 2018-03-30 | 2021-04-01 | ソニー株式会社 | Structure, decorative film and manufacturing method of decorative film |
| CN112654730A (en) | 2018-08-31 | 2021-04-13 | 株式会社Lg化学 | Method for producing a film for a decorative element |
| KR102507549B1 (en) * | 2018-08-31 | 2023-03-07 | 주식회사 엘지화학 | Manufacturing method for decoration element and decoration element |
| CN109333975B (en) * | 2018-09-20 | 2021-08-10 | 绍兴华昱塑业有限公司 | Manufacturing process of cosmetic crackle bottle |
| KR102266400B1 (en) * | 2018-10-02 | 2021-06-17 | (주)엘지하우시스 | Adhesive composition and Decoration sheet containing the same |
| CN110978832A (en) * | 2019-12-19 | 2020-04-10 | Oppo广东移动通信有限公司 | Manufacturing method of shell, shell and electronic equipment |
| EP4070534A1 (en) * | 2020-01-24 | 2022-10-12 | Huawei Technologies Co., Ltd. | Functional housing structure for an electronic device |
| US11440301B2 (en) * | 2020-03-27 | 2022-09-13 | Faurecia Interior Systems, Inc. | Light permeable vehicle interior panel |
| DE102020003493A1 (en) | 2020-06-10 | 2021-12-16 | Giesecke+Devrient Currency Technology Gmbh | Composite body, decorative film and manufacturing process |
| CN112195441B (en) * | 2020-09-28 | 2022-06-28 | 中国科学院宁波材料技术与工程研究所 | Method for preparing flexible electronic/quantum circuit by liquid metal |
| JP7113412B1 (en) | 2022-04-06 | 2022-08-05 | 東洋インキＳｃホールディングス株式会社 | Protective film, housing having protective film, and electronic device using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5118372A (en) * | 1988-11-21 | 1992-06-02 | Eastman Kodak Company | Method of forming a protective and decorative sheet material on a substrate |
| JP2005264254A (en) * | 2004-03-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | Metal evaporated film and metal evaporated member provided with the metal evaporated film and method for manufacturing the same |
| JP2010005999A (en) * | 2008-06-30 | 2010-01-14 | Nissha Printing Co Ltd | Method of manufacturing metal film decorative sheet which has crack |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4115619A (en) * | 1977-01-07 | 1978-09-19 | The Dow Chemical Company | Highly reflective multilayer metal/polymer composites |
| US4769100A (en) * | 1986-09-22 | 1988-09-06 | General Motors Corporation | Method of applying carrier films prepainted with metallic paint to automobile body panels |
| US4976896A (en) * | 1988-08-17 | 1990-12-11 | General Motors Corporation | Process of making thermoformable laminate films and processes |
| JPH10123081A (en) * | 1996-10-16 | 1998-05-15 | Osaka Gas Co Ltd | Method and apparatus for identifying gas |
| US6175493B1 (en) * | 1998-10-16 | 2001-01-16 | Dell Usa, Lp | Heat transfer from base to display portion of a portable computer |
| US6858287B2 (en) * | 2001-08-10 | 2005-02-22 | Soliant Llc | Formable bright film having discontinuous metallic layers |
| JP2004001433A (en) * | 2002-03-25 | 2004-01-08 | Nissha Printing Co Ltd | Metal tone decorative sheet and method for manufacture of metal tone decorative molded article using the sheet |
| WO2004067249A2 (en) * | 2003-01-27 | 2004-08-12 | Robert Lafave | Decorative system composite and method |
| JP4936689B2 (en) | 2005-07-25 | 2012-05-23 | 株式会社ウェーブロック・アドバンスト・テクノロジー | Metal decoration sheet for deep drawing molding |
| JP5051648B2 (en) * | 2008-01-11 | 2012-10-17 | レノボ・シンガポール・プライベート・リミテッド | Electronic device casing structure and electronic device |
| US8062451B2 (en) * | 2008-02-22 | 2011-11-22 | Delta Engineered Plastics | Post molding application of an extruded film to an injection molded part |
| JP2009286082A (en) | 2008-05-30 | 2009-12-10 | Toyoda Gosei Co Ltd | Electromagnetic wave transmitting lustrous resin product and its manufacturing method |
| CN101754611A (en) * | 2008-12-17 | 2010-06-23 | 深圳富泰宏精密工业有限公司 | Electronic device casing and manufacturing method thereof |
| JP5346632B2 (en) | 2009-03-17 | 2013-11-20 | 信越ポリマー株式会社 | Radio wave transmitting decorative film and decorative member using the same |
| JP5400454B2 (en) | 2009-04-13 | 2014-01-29 | 三恵技研工業株式会社 | Method for producing electromagnetically permeable metal composite material |
| CN101888751A (en) * | 2009-05-11 | 2010-11-17 | 深圳富泰宏精密工业有限公司 | Electronic device case with antenna function and manufacturing method thereof |
| CN102483480B (en) * | 2009-08-26 | 2014-03-05 | 东海橡塑工业株式会社 | Transparent laminate film and method for producing same |
| CN107211549B (en) * | 2015-02-03 | 2021-05-28 | 索尼公司 | Housing member, electronic device, and method for manufacturing housing member |
-
2015
- 2015-10-29 CN CN201580074634.4A patent/CN107211549B/en active Active
- 2015-10-29 JP JP2016572944A patent/JP6627781B2/en active Active
- 2015-10-29 US US15/544,168 patent/US10710289B2/en active Active
- 2015-10-29 WO PCT/JP2015/005439 patent/WO2016125212A1/en active Application Filing
- 2015-10-29 EP EP15881029.1A patent/EP3255965B1/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5118372A (en) * | 1988-11-21 | 1992-06-02 | Eastman Kodak Company | Method of forming a protective and decorative sheet material on a substrate |
| JP2005264254A (en) * | 2004-03-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | Metal evaporated film and metal evaporated member provided with the metal evaporated film and method for manufacturing the same |
| JP2010005999A (en) * | 2008-06-30 | 2010-01-14 | Nissha Printing Co Ltd | Method of manufacturing metal film decorative sheet which has crack |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180009143A1 (en) | 2018-01-11 |
| CN107211549A (en) | 2017-09-26 |
| EP3255965A4 (en) | 2018-07-11 |
| EP3255965B1 (en) | 2022-06-15 |
| US10710289B2 (en) | 2020-07-14 |
| JP6627781B2 (en) | 2020-01-08 |
| EP3255965A1 (en) | 2017-12-13 |
| JPWO2016125212A1 (en) | 2017-11-09 |
| WO2016125212A1 (en) | 2016-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107211549B (en) | Housing member, electronic device, and method for manufacturing housing member | |
| CN108883607B (en) | Structure, electronic device, decorative film, and method for manufacturing structure | |
| JP6665781B2 (en) | Housing parts, electronic equipment, and manufacturing method of housing parts | |
| WO2020153137A1 (en) | Structure, decorative film, method for manufacturing structure, and method for manufacturing decorative film | |
| CN112020423B (en) | Electromagnetic wave-transparent metallic glossy article and metallic film | |
| JP7211359B2 (en) | Structural body, decorative film, structure manufacturing method, and decorative film manufacturing method | |
| US20140355208A1 (en) | Method of manufacturing case frame and electronic device having it | |
| WO2019187929A1 (en) | Structure, decorative film, and decorative film manufacturing method | |
| TWI780132B (en) | Structure, decorative film, manufacturing method of structure, and manufacturing method of decorative film | |
| CN112004663B (en) | Electromagnetic wave-transparent metallic glossy article and metallic film | |
| CN112004664B (en) | Electromagnetic wave-transparent metallic glossy article | |
| CN114228385A (en) | Surface decoration method of 3D plate | |
| JP2022131590A (en) | Metallic sheen member, decorative member, and manufacturing method of metallic sheen member | |
| JP2002022937A (en) | Antireflection molding and method for manufacturing the same | |
| CN114854065A (en) | Plastic product, preparation method thereof and product comprising plastic product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1237578 Country of ref document: HK |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1237578 Country of ref document: HK |