CN101754611A - Electronic device casing and manufacturing method thereof - Google Patents
Electronic device casing and manufacturing method thereof Download PDFInfo
- Publication number
- CN101754611A CN101754611A CN200810306302A CN200810306302A CN101754611A CN 101754611 A CN101754611 A CN 101754611A CN 200810306302 A CN200810306302 A CN 200810306302A CN 200810306302 A CN200810306302 A CN 200810306302A CN 101754611 A CN101754611 A CN 101754611A
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- conductive coatings
- electronic device
- plastic film
- plastic
- device housing
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Abstract
The invention provides an electronic device casing, comprising a plastic base and a decorative film directly contacted with the surface of the plastic base; the decorative film comprises a transparent plastic film, a non-conductive coating film layer and an ink layer; the plastic film comprises an external surface and an internal surface which are bifarious; a space pattern is formed on the external surface, the non-conductive coating film layer is directly formed on the internal surface of the plastic film, the ink layer is formed on the surface where the non-conductive coating film layer is far away from the plastic film, so that the non-conductive coating film layer and the ink layer are arranged between the plastic film and the plastic base. The electronic device casing can not only meet radio frequency demands of the electronic device but also features metallic appearance and decorative effect of the space pattern. The invention also provides a manufacturing method of the casing.
Description
Technical field
The invention relates to a kind of electronic device housing and manufacture method thereof.
Background technology
The shell of electronic installation such as mobile phone is made separately by plastics or two kinds of materials of metal mostly now.Metal shell has mechanical strength preferably, but metal shell has shielding action to electromagnetic wave, such as mobile phone, the computer that can get online without being tethered to a cable, can not satisfy its radio frequency requirement for some electronic installations with radio frequency transmit and receive function.Though plastic casing can satisfy radio frequency requirement, lack the beautiful texture of metal shell.
In order to obtain the appearance of metal shell, surface treatments such as can electroplating or spray paint usually on the plastic casing surface.
Yet the electroplate liquid that uses in the existing plating process contains more noxious substance, causes environmental pollution easily, and the blowdown cost of electroplating processes is higher.
Though existing spraying paint handled and can be produced the product of different color and lusters with client's demand by selecting different types of lacquer look for use.Yet,, be difficult to present the texture of metal owing to the paint vehicle characteristic.
Summary of the invention
In view of this, be necessary to provide a kind of and can satisfy radio frequency requirement, have an electronic device housing of metal appearance effect again.
In addition, also be necessary to provide a kind of manufacture method of above-mentioned electronic device housing.
A kind of electronic device housing, the decorating film that it comprises a plastic substrate and directly is incorporated into this surface of plastic matrix, this decorating film comprises transparent plastic film, a non-conductive coatings and an ink lay, this plastic film comprises opposing outer surface and inner surface, be formed with space pattern on this outer surface, this non-conductive coatings directly is formed on the inner surface of this plastic film, this ink lay is formed at the surface of this non-conductive coatings away from plastic film, makes this non-conductive coatings and this ink lay between this plastic film and this plastic substrate.
A kind of manufacture method of electronic device housing, it comprises the steps:
One transparent plastic film is provided, is formed with the space pattern that is geometry on the surface of this plastic film;
The surface formation one that is not formed with space pattern in this plastic film has the non-conductive coatings of metal appearance;
Form an ink lay in the surface of this non-conductive coatings;
On described ink lay in conjunction with a plastic substrate.
One surface of the plastic film of above-mentioned electronic device housing is formed with space pattern, touch the real third dimension of tool with hand, its another surface is formed with non-conductive coatings and the ink lay with metal appearance, make electronic device housing can satisfy the radio frequency requirement of electronic installation, can present colorful metal appearance again, have the decorative effect of space pattern simultaneously.
Description of drawings
Fig. 1 is the cross-sectional schematic of preferred embodiment electronic device housing of the present invention.
Embodiment
Preferred embodiment electronic device housing 100 of the present invention as shown in Figure 1, the decorating film 20 that it comprises a plastic substrate 10 and directly is incorporated into these plastic substrate 10 surfaces.
Described decorating film 20 comprises a plastic film 21, be formed at the ink lay 25 that a non-conductive coatings 23 and on this plastic film 21 is formed at this non-conductive coatings 23, and non-conductive coatings 23 is between plastic film 21 and ink lay 25.
This plastic film 21 is made by transparent plastics, it comprises an outer surface 211 and one and outer surface 211 interior surface opposing 213, be formed with on the described outer surface 211 and be certain geometrical shape, the space pattern 2112 that can be used for decorating is as circular, square or other regular/erose grooves, projection or texture.
This ink lay 25 is formed at the surface of this non-conductive coatings 23.The printing ink that forms this ink lay 25 is colored ink, background colour is provided can for shell 100.Simultaneously, ink lay 25 also shields to non-conductive coatings 23, in order to avoid non-conductive coatings 23 is destroyed when plastic film 21 combines with matrix 10.
Matrix 10 is a plastic substrate, and it can combine with decorating film 20 by the mode of injection mo(u)lding, makes non-conductive coatings 23 and ink lay 25 between matrix 10 and plastic film 21.
The manufacture method of above-mentioned electronic device housing 100 comprises the steps:
At first, provide a transparent plastic film 21.Be formed with the space pattern 2112 that is geometry on the outer surface 211 of this plastic film 21.Space pattern 2112 can by two in relative rotation running roller roll formation, one of them surface of this two running roller is provided with and the corresponding projection of space pattern 2112 shapes, the surface of another running roller is the plane, plastic film 21 is by passing between this running roller, and the outer surface 211 that the running roller that makes the surface have projection rolls plastic film 21 can form space pattern 2112 in its outer surface 211.
Afterwards, form one in inner surface 213 by modes such as vacuum splashing and plating or vacuum evaporations and have the non-conductive coatings 23 of metal appearance.
Form an ink lay 25 again in the surface of non-conductive coatings 23.This ink lay 25 can form by the mode of ink printing, promptly makes described decorating film 20.
At last, provide a molding tool, described decorating film 20 is placed in this mould and injection moulding forms a matrix 10 and is incorporated into decorating film 20, make non-conductive coatings 23 and ink lay 25 between matrix 10 and plastic film 21.
The outer surface 212 of the plastic film 21 of above-mentioned electronic device housing 100 is formed with space pattern 2112, touches the real third dimension of tool with hand; The inner surface 211 of plastic film 21 is formed with the non-conductive coatings 23 with metal appearance, on plastic film 21, be printed with simultaneously colored ink layer 25, make electronic device housing 100 can satisfy the radio frequency requirement of electronic installation, can present colorful metal appearance again, have the decorative effect of space pattern simultaneously.
Claims (10)
1. electronic device housing, the decorating film that it comprises a plastic substrate and directly is incorporated into this surface of plastic matrix, it is characterized in that: this decorating film comprises a transparent plastic film, an one non-conductive coatings and an ink lay, this plastic film comprises opposing outer surface and inner surface, be formed with space pattern on this outer surface, this non-conductive coatings directly is formed on the inner surface of this plastic film, this ink lay is formed at the surface of this non-conductive coatings away from plastic film, makes this non-conductive coatings and this ink lay between this plastic film and this plastic substrate.
2. electronic device housing as claimed in claim 1 is characterized in that: the material that forms this non-conductive coatings is metal or has the nonmetallic materials of metal appearance.
3. electronic device housing as claimed in claim 1 is characterized in that: described space pattern is groove, projection or the texture that is geometry.
4. electronic device housing as claimed in claim 1 is characterized in that: this non-conductive coatings has the light penetrability.
5. electronic device housing as claimed in claim 4 is characterized in that: the thickness of this non-conductive coatings is less than or equal to 0.5 μ m.
6. the manufacture method of an electronic device housing, it comprises the steps:
One transparent plastic film is provided, is formed with the space pattern that is geometry on the surface of this plastic film;
The surface formation one that is not formed with space pattern in this plastic film has the non-conductive coatings of metal appearance;
The surface away from plastic film in this non-conductive coatings forms an ink lay;
On described ink lay in conjunction with a plastic substrate.
7. the manufacture method of electronic device housing as claimed in claim 6, it is characterized in that: the material that forms this non-conductive vacuum coatings is metal or has the nonmetallic materials of metal appearance.
8. the manufacture method of shell as claimed in claim 7, it is characterized in that: this non-conductive coatings forms by sputter or evaporation mode.
9. the manufacture method of shell as claimed in claim 6, it is characterized in that: this plastic substrate combines with this decorating film by the mode of injection mo(u)lding.
10. the manufacture method of shell as claimed in claim 6, it is characterized in that: this non-conductive coatings has the light penetrability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810306302A CN101754611A (en) | 2008-12-17 | 2008-12-17 | Electronic device casing and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810306302A CN101754611A (en) | 2008-12-17 | 2008-12-17 | Electronic device casing and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101754611A true CN101754611A (en) | 2010-06-23 |
Family
ID=42480745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810306302A Pending CN101754611A (en) | 2008-12-17 | 2008-12-17 | Electronic device casing and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101754611A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102448261A (en) * | 2010-10-11 | 2012-05-09 | 深圳富泰宏精密工业有限公司 | Electronic device casing and manufacturing method thereof |
| CN102480861A (en) * | 2010-11-25 | 2012-05-30 | 深圳富泰宏精密工业有限公司 | Decorative film, outer casing of electronic device and method for manufacturing outer casing of electronic device |
| CN102638953A (en) * | 2012-04-13 | 2012-08-15 | 深圳光启创新技术有限公司 | Protective shell of wireless communication device |
| CN102637066A (en) * | 2012-04-13 | 2012-08-15 | 深圳光启创新技术有限公司 | Notebook computer |
| CN102673202A (en) * | 2012-06-07 | 2012-09-19 | 东莞钜升塑胶电子制品有限公司 | Mark printing manufacturing process based on transparent piece material |
| CN103369074A (en) * | 2012-03-02 | 2013-10-23 | Lg电子株式会社 | Mobile terminal and method for manufacturing image module provided thereon |
| CN103780724A (en) * | 2013-12-31 | 2014-05-07 | 宇龙计算机通信科技(深圳)有限公司 | Plastic housing with metal brushed appearance and preparing method thereof |
| CN107211549A (en) * | 2015-02-03 | 2017-09-26 | 索尼公司 | The manufacture method of housing parts, electronic equipment and housing parts |
| WO2018210221A1 (en) * | 2017-05-16 | 2018-11-22 | 昇印光电（昆山）股份有限公司 | Optical sheet, mold, and electronic device cover plate |
| CN108873113A (en) * | 2017-05-16 | 2018-11-23 | 昇印光电（昆山）股份有限公司 | A kind of texture structure, optical thin film, mold and electronic equipment cover board |
| CN109152259A (en) * | 2017-06-27 | 2019-01-04 | 昇印光电（昆山）股份有限公司 | A kind of optical thin film, mold and electronic equipment cover board |
| CN109387888A (en) * | 2017-08-11 | 2019-02-26 | 昇印光电（昆山）股份有限公司 | A kind of texture structure, optical thin film, mold and electronic equipment cover board |
| CN110716361A (en) * | 2018-07-11 | 2020-01-21 | Oppo广东移动通信有限公司 | Electrochromic device, preparation method, shell and electronic equipment |
| CN111556676A (en) * | 2020-04-02 | 2020-08-18 | 维沃移动通信(重庆)有限公司 | Shell, preparation method thereof and electronic equipment |
| CN113844190A (en) * | 2021-09-27 | 2021-12-28 | 广东阿特斯科技有限公司 | Production process of matte pearly-luster-added mobile phone backboard |
-
2008
- 2008-12-17 CN CN200810306302A patent/CN101754611A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102448261A (en) * | 2010-10-11 | 2012-05-09 | 深圳富泰宏精密工业有限公司 | Electronic device casing and manufacturing method thereof |
| CN102480861A (en) * | 2010-11-25 | 2012-05-30 | 深圳富泰宏精密工业有限公司 | Decorative film, outer casing of electronic device and method for manufacturing outer casing of electronic device |
| CN103369074A (en) * | 2012-03-02 | 2013-10-23 | Lg电子株式会社 | Mobile terminal and method for manufacturing image module provided thereon |
| US9291827B2 (en) | 2012-03-02 | 2016-03-22 | Lg Electronics Inc. | Mobile terminal and method for fabricating image module provided thereon |
| CN102637066B (en) * | 2012-04-13 | 2016-08-24 | 深圳光启创新技术有限公司 | A kind of notebook computer |
| CN102638953B (en) * | 2012-04-13 | 2016-02-03 | 深圳光启创新技术有限公司 | A kind of containment vessel of radio communication device |
| CN102637066A (en) * | 2012-04-13 | 2012-08-15 | 深圳光启创新技术有限公司 | Notebook computer |
| CN102638953A (en) * | 2012-04-13 | 2012-08-15 | 深圳光启创新技术有限公司 | Protective shell of wireless communication device |
| CN102673202A (en) * | 2012-06-07 | 2012-09-19 | 东莞钜升塑胶电子制品有限公司 | Mark printing manufacturing process based on transparent piece material |
| CN102673202B (en) * | 2012-06-07 | 2014-06-04 | 东莞钜升塑胶电子制品有限公司 | Mark printing manufacturing process based on transparent piece material |
| CN103780724A (en) * | 2013-12-31 | 2014-05-07 | 宇龙计算机通信科技(深圳)有限公司 | Plastic housing with metal brushed appearance and preparing method thereof |
| CN107211549A (en) * | 2015-02-03 | 2017-09-26 | 索尼公司 | The manufacture method of housing parts, electronic equipment and housing parts |
| CN108873113A (en) * | 2017-05-16 | 2018-11-23 | 昇印光电（昆山）股份有限公司 | A kind of texture structure, optical thin film, mold and electronic equipment cover board |
| WO2018210221A1 (en) * | 2017-05-16 | 2018-11-22 | 昇印光电（昆山）股份有限公司 | Optical sheet, mold, and electronic device cover plate |
| CN108873113B (en) * | 2017-05-16 | 2021-10-19 | 昇印光电（昆山）股份有限公司 | Texture structure, optical film, mold and electronic equipment cover plate |
| CN109152259A (en) * | 2017-06-27 | 2019-01-04 | 昇印光电（昆山）股份有限公司 | A kind of optical thin film, mold and electronic equipment cover board |
| CN109387888A (en) * | 2017-08-11 | 2019-02-26 | 昇印光电（昆山）股份有限公司 | A kind of texture structure, optical thin film, mold and electronic equipment cover board |
| CN110716361A (en) * | 2018-07-11 | 2020-01-21 | Oppo广东移动通信有限公司 | Electrochromic device, preparation method, shell and electronic equipment |
| CN111556676A (en) * | 2020-04-02 | 2020-08-18 | 维沃移动通信(重庆)有限公司 | Shell, preparation method thereof and electronic equipment |
| CN113844190A (en) * | 2021-09-27 | 2021-12-28 | 广东阿特斯科技有限公司 | Production process of matte pearly-luster-added mobile phone backboard |
| CN113844190B (en) * | 2021-09-27 | 2023-11-21 | 广东阿特斯科技有限公司 | Production process of matt pearlescent powder-added mobile phone backboard |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100623 |