CN101549543A - Shell of electronic device and manufacturing method thereof - Google Patents
Shell of electronic device and manufacturing method thereof Download PDFInfo
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- CN101549543A CN101549543A CNA2008100858943A CN200810085894A CN101549543A CN 101549543 A CN101549543 A CN 101549543A CN A2008100858943 A CNA2008100858943 A CN A2008100858943A CN 200810085894 A CN200810085894 A CN 200810085894A CN 101549543 A CN101549543 A CN 101549543A
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- shell
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- electronic installation
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- forming film
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Abstract
The invention discloses a manufacturing method of a shell of an electronic device, which includes the following steps: firstly, a vacuum forming film is formed on a first die and is provided with a first surface and a second surface; then an electromagnetic shielding layer is formed on the first surface; and next, a patterned film and the vacuum forming film are arranged in a second die and an intramode decoration effluence forming processing procedure is performed so that a shell is formed between the second surface and the patterned film.
Description
Technical field
The invention relates to a kind of shell, and particularly relevant for a kind of shell and manufacture method thereof of electronic installation.
Background technology
For fear of electromagnetic interference (Electro-Magnetic Interference, EMI) with static discharge (Electro-Static Discharge, stability when the electronic building brick in the problems affect electronic installation ESD) uses, the plastic casing inner surface of electronic installation usually all can coating last layer metal level, so that the shell that plastic casing and metal level are formed has the function that can prevent electromagnetic interference and static discharge.
In known technology, plastic casing normally is made with ejection forming technique (injection molding technology) earlier.Then, again to plastic casing outer surface application baking vanish (baked enamel coating), to finish the appearance design of shell.Then, the sheet metal that again a shape is met the shape of plastic casing inner surface is assembled in the plastic casing, to finish the metal level of shell.Perhaps, can on the plastic casing inner surface, form the layer of metal layer by sputter (sputtering), evaporation (evaporation) or the mode of electroplating (electroplating), or the mode that tinsel such as aluminium foil or Copper Foil are attached at the plastic casing inner surface be made the metal level of shell.In addition, can also be at plastic casing inner surface spraying conductive paint (conductive paint), with the making of the metal level of finishing shell.
Yet, because above-mentioned plastic casing needs outward appearance and these two parts of electromagnetic interference shielding are separately handled, could form shell, and because these processing procedures are very complicated, therefore, can make the procedure of shell more, process time is tediously long, and then can improve the fraction defective of product, and increases its production cost.Moreover, surface-assembled sheet metal or attach tinsel and comparatively bother in the enclosure, though and the spraying conductive paint is comparatively simple, the cost of conductive paint is higher.Therefore, how to simplify electronic installation housing the making flow process and reduce its production cost, real is problem demanding prompt solution.
Summary of the invention
The invention provides a kind of manufacture method of shell of electronic installation, to simplify the procedure for producing of shell.
The invention provides a kind of shell of electronic installation, to reduce the production cost of shell.
The present invention proposes a kind of manufacture method of shell of electronic installation, comprises the following steps.At first, form a vacuum forming film (vacuum formedfilm) on one first mould, wherein the vacuum forming film has a first surface and a second surface.Then, on first surface, form an electro-magnetic screen layer (electro-magnetic shieldinglayer).Then, one patterned film (patterned film) and vacuum forming film are disposed in one second mould, and carry out an in-mold decorating injection molding manufacture procedure (in-mold decoration injection molding), between second surface and patterned film, to form a housing.
In one embodiment of this invention, the mode that forms above-mentioned electro-magnetic screen layer comprises plating, evaporation or sputter process.
In one embodiment of this invention, above-mentioned second mould have a patrix, a counterdie and be formed at patrix and counterdie between die cavity (mold cavity).
In one embodiment of this invention, the above-mentioned vacuum forming film and the material of housing be polyethylene terephthalate (polye thyleneterephthalate, PET).
In one embodiment of this invention, the material of above-mentioned electro-magnetic screen layer is a metal.
The present invention also proposes a kind of shell of electronic installation, it is characterized in that: shell has a vacuum forming film and an electro-magnetic screen layer, and vacuum forming film and electro-magnetic screen layer are stacked on the wherein surface of shell in regular turn.
In one embodiment of this invention, the shell of above-mentioned electronic installation has more another the lip-deep pattern that is disposed at shell.
In one embodiment of this invention, the material of above-mentioned vacuum forming film is a polyethylene terephthalate.
In one embodiment of this invention, the material of above-mentioned electro-magnetic screen layer is a metal.
The manufacture method of the shell of electronic installation of the present invention mainly is when carrying out in-mold decorating injection molding manufacture procedure, finishes the appearance of shell of electronic installation and the making of electro-magnetic screen layer in the lump.So, can simplify the processing procedure and the procedure of the shell of electronic installation significantly, and then shorten its production time and reduce its production cost.
Description of drawings
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below, wherein:
Fig. 1 to Fig. 9 is the section schematic flow sheet of manufacture method of shell of a kind of electronic installation of one embodiment of the invention.
The specific embodiment
Fig. 1 to Fig. 9 is the section schematic flow sheet of manufacture method of shell of a kind of electronic installation of one embodiment of the invention.Please refer to Fig. 1, at first, provide one first mould 100 and a plastic sheeting 210.Wherein, the material of plastic sheeting 210 for example is a polyethylene terephthalate.Then, make on plastic sheeting 210 surface 110 that roughly is attached at first mould 100 as shown in Figure 2.Then, make plastic sheeting 210 form a vacuum forming film 210a in vacuum forming mode (vacuum forming).More specifically, the mode that forms vacuum forming film 210a for example is to carry out a vacuum process earlier, extracting the air between first mould 100 and the plastic sheeting 210, and then make on plastic sheeting 210 surface that is attached at first mould 100 fully 110 as shown in Figure 3.
Then, with plastic sheeting 210 by taking out in first mould 100 (as shown in Figure 4), and cut out remove the waste material 212 of plastic sheeting 210 after, can form vacuum forming film 210a as shown in Figure 5.Then, as shown in Figure 6, form an electro-magnetic screen layer 220 with plating, evaporation or sputter process again on the first surface 214 of vacuum forming film 210a, wherein the material of electro-magnetic screen layer 220 for example is a metal.
Then, as shown in Figure 7, provide a patterned film 300 and one second mould 400.Wherein, patterned film 300 has a pattern 310 (being a plurality of shown in the figure), and second mould 400 has a patrix 410 and a counterdie 420, and the shape on a surface 422 of counterdie 420 for example is the shape corresponding to vacuum forming film 210a.Then, patterned film 300 is placed between patrix 410 and the counterdie 420, and vacuum forming film 210a is placed between patterned film 300 and the counterdie 420.At this moment, electro-magnetic screen layer 220 is towards counterdie 420, and vacuum forming film 210a one with respect to the second surface 216 of first surface 214 towards patrix 410.
Then, as shown in Figure 8, form a die cavity 430 with counterdie 420 in conjunction with patrix 410.At this moment, the pattern 310 of vacuum forming film 210a and patterned film 300 all is arranged in die cavity 430, and vacuum forming film 210a can bear against on the counterdie 420.Then, carry out an in-mold decorating injection molding manufacture procedure,, entirely be attached at a surface 412 of patrix 410 up to patterned film 300 between the second surface 216 of patterned film 300 and vacuum forming film 210a, to continue an injecting material.Wherein, the material of this material for example is polyethylene terephthalate or other plastic material.
Then, carry out a curing process so that this material cured, with between the second surface 216 of patterned film 300 and vacuum forming film 210a, form one with the integrated housing 230 of vacuum forming film 210a.Then, as shown in Figure 9, remove second mould 400 and patterned film 300 after, can form the shell 200 of an electronic installation, wherein vacuum forming film 210a and electro-magnetic screen layer 220 are stacked on the inner surface of shell 200 of electronic installation in regular turn.
It should be noted that after being cured processing procedure, also can be needed on owing to the pattern 310 of patterned film 300 on the surface 232 of housing 230 (as shown in Figure 9) along with the curing of this material.Therefore, the present invention can finish the making of appearance and electro-magnetic screen layer in the lump when carrying out in-mold decorating injection molding manufacture procedure, and reaches the effect of simplifying processing procedure.
In sum, the manufacture method of the shell of electronic installation of the present invention mainly is when carrying out in-mold decorating injection molding manufacture procedure, finishes the appearance of shell of electronic installation and the making of electro-magnetic screen layer in the lump.So, can simplify the processing procedure and the procedure of the shell of electronic installation significantly, and then shorten its production time and reduce its production cost.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that claims define.
Claims (9)
1, a kind of manufacture method of shell of electronic installation is characterized in that, comprises the following steps:
Form a vacuum forming film on one first mould, wherein above-mentioned vacuum forming film has a first surface and a second surface;
On above-mentioned first surface, form an electro-magnetic screen layer; And
One patterned film and above-mentioned vacuum forming film are disposed in one second mould, and carry out an in-mold decorating injection molding manufacture procedure, between above-mentioned second surface and above-mentioned patterned film, to form a housing.
2, the manufacture method of the shell of electronic installation according to claim 1 is characterized in that, the mode that wherein forms above-mentioned electro-magnetic screen layer comprises plating, evaporation or sputter process.
3, the manufacture method of the shell of electronic installation according to claim 1 is characterized in that, wherein above-mentioned second mould has a patrix, a counterdie and is formed at the die cavity between above-mentioned patrix and the above-mentioned counterdie.
4, the manufacture method of the shell of electronic installation according to claim 1 is characterized in that, the material of wherein above-mentioned vacuum forming film and above-mentioned housing is a polyethylene terephthalate.
5, the manufacture method of the shell of electronic installation according to claim 1 is characterized in that, wherein the material of above-mentioned electro-magnetic screen layer is a metal.
6, a kind of shell of electronic installation is characterized in that, above-mentioned shell has a vacuum forming film and an electro-magnetic screen layer, and wherein above-mentioned vacuum forming film and above-mentioned electro-magnetic screen layer are stacked on the wherein surface of above-mentioned shell in regular turn.
7, the shell of electronic installation according to claim 6 is characterized in that, wherein also has a pattern, is disposed on another surface of above-mentioned shell.
8, the shell of electronic installation according to claim 6 is characterized in that, the material of wherein above-mentioned vacuum forming film is a polyethylene terephthalate.
9, the shell of electronic installation according to claim 6 is characterized in that, wherein the material of above-mentioned electro-magnetic screen layer is a metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100858943A CN101549543A (en) | 2008-04-02 | 2008-04-02 | Shell of electronic device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100858943A CN101549543A (en) | 2008-04-02 | 2008-04-02 | Shell of electronic device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101549543A true CN101549543A (en) | 2009-10-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100858943A Pending CN101549543A (en) | 2008-04-02 | 2008-04-02 | Shell of electronic device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101549543A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548276A (en) * | 2010-12-13 | 2012-07-04 | 广达电脑股份有限公司 | Method for preparing conductive ribs on machine shell, machine shell and electronic device assembling method |
| CN110196548A (en) * | 2018-02-27 | 2019-09-03 | 精工爱普生株式会社 | Machine core and clock and watch |
| US11262705B2 (en) | 2018-02-27 | 2022-03-01 | Seiko Epson Corporation | Movement and timepiece |
-
2008
- 2008-04-02 CN CNA2008100858943A patent/CN101549543A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548276A (en) * | 2010-12-13 | 2012-07-04 | 广达电脑股份有限公司 | Method for preparing conductive ribs on machine shell, machine shell and electronic device assembling method |
| CN102548276B (en) * | 2010-12-13 | 2014-11-19 | 广达电脑股份有限公司 | Method for preparing conductive ribs on machine shell, machine shell and electronic device assembling method |
| CN110196548A (en) * | 2018-02-27 | 2019-09-03 | 精工爱普生株式会社 | Machine core and clock and watch |
| US11209778B2 (en) | 2018-02-27 | 2021-12-28 | Seiko Epson Corporation | Movement and timepiece |
| US11262705B2 (en) | 2018-02-27 | 2022-03-01 | Seiko Epson Corporation | Movement and timepiece |
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Application publication date: 20091007 |