CN101410001B - Non-metal basis material with surface decoration and electromagnetic wave shield - Google Patents
Non-metal basis material with surface decoration and electromagnetic wave shield Download PDFInfo
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- CN101410001B CN101410001B CN2007101631487A CN200710163148A CN101410001B CN 101410001 B CN101410001 B CN 101410001B CN 2007101631487 A CN2007101631487 A CN 2007101631487A CN 200710163148 A CN200710163148 A CN 200710163148A CN 101410001 B CN101410001 B CN 101410001B
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Abstract
The invention relates to a non-metal substrate which is provided with surface decoration and electromagnetic wave shielding, comprising a substrate and a coating. The substrate is made of non-conductive material; the coating is provided with a metal full-reflecting layer which covers the substrate, an optical film layer which covers the metal full-reflecting layer, and a metal half-reflecting layer which covers the optical film layer. The non-metal substrate has the advantages that an optical interference phenomenon is formed by the optical film layer matched with the metal full-reflecting layer and the metal half-reflecting layer; different surface colors can be generated without using high-pollution preparation process such as painting and the like, thus achieving the object of appearance decoration; furthermore, the metal full-reflecting layer and the metal half-reflecting layer have the functions of high conductivity and electromagnetic shielding.
Description
Technical field
The present invention relates to a kind of non-metallic substrate, particularly relate to a kind of environmental regulation that meets, and can reach the non-metallic substrate with incrustation and electromagnetic shielding of decorative appearance and electromagnetic shielding effect simultaneously.
Background technology
In society now, quick progress along with science and technology, the data processing frequency of electronic product promotes day by day, add the in vogue of wireless product such as mobile phone and Wi-Fi, the situation that makes electromagnetic wave pollute is more and more serious, this not only can influence product itself and arround the normal operation of electronic product, also may be detrimental to health.Therefore how to prevent and reduce electromagnetic interference, become the important topic of product design and production.
With present, the method for the most general strick precaution external electromagnetic wave interference is to increase the outer packaging of electronic product to electromagnetic screening capacity.According to the Schelkunoff theory, the metal pair electromagnetic wave with high conductive capability has splendid assimilation effect and reflecting effect, therefore as long as strengthen the purpose that the conductive capability of the outer packaging of electronic component just can reach electromagnetic shielding.
General electronic products is in order to reach light weight, the requirement that output is big, use the plastic material of ejection formation as shell mostly, but, general plastic cement does not have the effect of electromagnetic shielding, can resist electromagnetic interference in order to make the plastic rubber material packaged products, the mode that general industry adopts comprises that adding conductivity filling material in the plastics makes this shell have conductivity, perhaps utilize metallic plate, metal plating, methods such as electroless plating, conducting resinl coating and conducting film paste increase one deck conductive layer at this shell.In the said method, adding the conductivity packing material in plastic cement, to have a screening effect good, do not need the advantage of additional process, but the cost height, and this shell original intensity of forfeiture easily.Also meet current environmental regulation so that metal sheet masking methods cost is low, but its processing assembling is complicated, and can additionally increases product weight, do not meet the compact development trend of electronic product.Remaining method then mostly is the high pollution processing procedure greatly, the environmental regulation of not only conflicting, and also newly Electroplate Factory sets up and is difficult for, and will be replaced by other processing procedures gradually.
The film sputter is present unique processing procedure that meets European Union's plated film standard, and more than 150 degree Celsius, temperature is higher greatly for traditional vacuum splashing and plating processing procedure working temperature, and the product of energy sputter is limited, can't be applied to thermoplastic plastic cement material.Technology can have been reduced to working temperature 60 degree Celsius at present, is applied to plastic cement shell film sputter no problem, because the breakthrough of technology, sputter process is applied to the anti-electromagnetic wave processing procedure of plastic cement shell spare in the 3C Product gradually.
See also shown in Figure 1, it is the structural representation of an existing electronics enclosure of explanation and the design of the plated film rete on it, be the existing plated film rete design of industry, the shell 11 of this electronic component has a copper film 12 that covers on its inner surface, and a stainless steel film 13 that covers on this copper film 12.Because the good electric conductivity of copper and high film deposition rate have become sputter electromagnetic radiation resistant processing procedure main material.Because the equipment complexity of electromagnetic shielding effect test, and detect consuming time, so generally produce on the line with the conductance behind the plated film as the product pipe standards, with copper film 12 commonly used, resistance outside capital and the post place between the 10mm needs just can reach the effect of electromagnetic wave shielding less than 5 Ω.
Because these copper film 12 as easy as rolling off a log oxidations of sputter process, these copper film 12 resistance values after the oxidation can significantly rise, and lose conductive characteristic, and then reduce electromagnetic screening effect.Therefore the oxidation for fear of this copper film 12 causes the anti-electromagnetic wave jamming effectiveness to reduce, normally can be on this copper film 12 sputter one deck stainless steel film 13 again, to protect this copper film 12 unlikely abilities that lose electromagnetic wave shielding because of the ingress of air oxidation.Owing to increase by one sputter flow process more, cause equipment cost to heighten, the stainless steel price is significantly climbed to a higher point in addition, has increased the cost of sputter process again, makes the matter worse especially for the profit of the electronic industry of small profitsization.
The main purpose of electromagnetic wave shielding is the consumer for protection electronic product body and use, but causes that consumer's desire to purchase principal element but is in product design, and especially the appearance design of 3C Product more has decisive influence to the sale of product.The decoration coating 14 of 3C Product shell 11 is to produce colored effect mostly in the mode of spraying paint at present, but the product of this type of processing procedure does not have metallic luster, and production process produces environment easily to be polluted, and under the surging situation of current environmental consciousness, the great space of improving is arranged.
Therefore, how to found comparatively environmental protection of a kind of making,, just become the relevant dealer of base material manufacturing and need the target of making great efforts research and development badly simultaneously with the non-metallic substrate of incrustation and electromagnetic shielding.
Summary of the invention
The objective of the invention is to, overcome the defective that existing plated film rete design exists, and provide a kind of non-metallic substrate of new structure with incrustation and electromagnetic shielding, technical problem to be solved is to make it can meet environmental regulation, and can reach the purpose of decorative appearance and electromagnetic shielding simultaneously, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of non-metallic substrate with incrustation and electromagnetic shielding that the present invention proposes, this non-metallic substrate comprises a substrate, and one deck covers the plated film on this substrate, and wherein: this substrate is made by non-metallic material; This plated film has one deck and cover metal total reflection layer on this substrate, and one deck covers the optical thin film layer on this metal total reflection layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid non-metallic substrate with incrustation and electromagnetic shielding, wherein said plated film also have one deck and cover metal semi-reflective layer on this optical thin film layer.
Aforesaid non-metallic substrate with incrustation and electromagnetic shielding, wherein the material of this substrate is to be selected from the following group that constitutes: glass, Merlon, acrylonitrile-butadiene-styrene copolymer, acrylic resin (acrylic, acryl), plastic cement or these a combination.
Aforesaid non-metallic substrate with incrustation and electromagnetic shielding, the totally reflected material of the metal of wherein said plated film is to be selected from the following group that constitutes: aluminium, silver, gold, chromium, molybdenum, nickel, titanium, tungsten, copper or these a combination.
Aforesaid non-metallic substrate with incrustation and electromagnetic shielding, the material of the optical thin film layer of wherein said plated film are to be selected from the following group that constitutes: the oxide of titanium, tantalum, niobium, silicon, zirconium, silicon, zinc sulphide.
Aforesaid non-metallic substrate with incrustation and electromagnetic shielding, the metal semi-reflective layer material of wherein said plated film is to be selected from the following group that constitutes: aluminium, silver, gold, chromium, molybdenum, nickel, titanium, tungsten or these a combination.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, for achieving the above object,, comprise a substrate and a plated film according to the non-metallic substrate of the present invention with incrustation and electromagnetic shielding.This substrate is made by non-conductive material.This plated film has one and covers in the metal total reflection layer, on this substrate and cover a optical thin film layer on this metal total reflection layer and a metal semi-reflective layer that covers on this optical thin film layer.
By technique scheme, the present invention has following advantage and beneficial effect at least with the non-metallic substrate of incrustation and electromagnetic shielding: what the present invention utilized this optical thin film layer and cooperated this metal total reflection layer and this metal semi-reflective layer reflects to form the optical interference phenomenon, under the situation of not using high pollution processing procedures such as spraying paint, just can produce the different surfaces color and reach the purpose of decorative appearance, and the high conductivity of this metal total reflection layer and metal semi-reflective layer also has the function of electromagnetic shielding simultaneously, and also can reduce processing procedure operation and production cost by integrating decoration film coating and electromagnetic shielding plated film.
In sum, the present invention can meet environmental regulation, and can reach the purpose of decorative appearance and electromagnetic shielding simultaneously.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing plated film rete design has the outstanding effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the structural representation of an existing electronics enclosure of explanation and the design of the plated film rete on it.
Fig. 2 is the structural representation of an explanation the present invention with first preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding.
Fig. 3 is the structural representation of an explanation the present invention with the 7th preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of non-metallic substrate, structure, feature and the effect thereof that foundation the present invention proposes with incrustation and electromagnetic shielding, describe in detail as after.
Seeing also shown in Figure 2ly, is that an explanation the present invention is with the structural representation of first preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding.The non-metallic substrate with incrustation and electromagnetic shielding of the present invention's first preferred embodiment comprises a substrate 2 and a plated film 3.
Above-mentioned substrate 2 is made by non-conductive material;
Above-mentioned plated film 3 has one and covers in the metal total reflection layer on this substrate 2 31, and cover a optical thin film layer 32 on this metal total reflection layer 31 and a metal semi-reflective layer 33 that covers on this optically thin tunic 32.
In the present embodiment, this substrate 2 is made by plastic cement, this metal total reflection layer 31 is that a thickness is the aluminium film of 500nm, this optical thin film layer 32 is that a thickness is the silica membrane of 200nm, this metal semi-reflective layer 33 is that a thickness is the silver-colored film of 4nm, and above-mentioned metal total reflection layer 31, optical thin film layer 32, and metal semi-reflective layer 33 all is to plate in the evaporation mode to be located on the corresponding surface.Present embodiment is after finishing, and its plated film 3 can be lavender, and the resistance value of the aluminium film of thickness more than 500nm is 2.1 Ω, is lower than 5 Ω, that is to say that the design of present embodiment can reach the required electrical conductivity of shielding electromagnetic wave really.
The present invention is with second preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding, be identical haply with above-mentioned first preferred embodiment, its identical place is in this superfluous words no longer, place wherein inequality is: this substrate 2 is by acrylic resin (acrylic, it is acryl, this paper all is called acrylic resin) made, this metal total reflection layer 31 is that a thickness is the silver-colored film of 200nm, this optical thin film layer 32 is that a thickness is the zirconia film of 300nm, this metal semi-reflective layer 33 is that a thickness is the titanium film of 4nm, and above-mentioned metal total reflection layer 31, optical thin film layer 32, and metal semi-reflective layer 33 all is to be located on the corresponding surface with the sputtering way plating.Present embodiment is after finishing, and its plated film 3 is can pinkiness, and the resistance value of the silver-colored film of thickness more than 200nm is 2.8 Ω, is lower than 5 Ω, that is to say that the design of present embodiment can reach the required electrical conductivity of shielding electromagnetic wave really.Because present embodiment and first preferred embodiment shown in Figure 2 are roughly similar on its structure except the thickness of each rete is different, so do not disclose one graphicly more in addition, that is to say, just can find out the structure of present embodiment by Fig. 2 easily.
The present invention is with the 3rd preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding, it is identical with above-mentioned first preferred embodiment haply, identical place is in this superfluous words no longer, place wherein inequality is: this substrate 2 is made by glass, this metal total reflection layer 31 is that a thickness is the molybdenum film of 400nm, this optical thin film layer 32 is that a thickness is the tantalum oxide film of 200nm, this metal semi-reflective layer 33 is that a thickness is the nickel film of 4nm, and above-mentioned metal total reflection layer 31, optical thin film layer 32, and metal semi-reflective layer 33 all is to be located on the corresponding surface with the sputtering way plating.Present embodiment is after finishing, and it is blue that its plated film 3 can be, and the resistance value of the molybdenum film of thickness more than 400nm is 3.1 Ω, is lower than 5 Ω, that is to say that the design of present embodiment can reach the required electrical conductivity of shielding electromagnetic wave really.Because present embodiment and first preferred embodiment shown in Figure 2 are roughly similar on its structure except the thickness of each rete is different, so do not disclose one graphicly more in addition, that is to say, just can find out the structure of present embodiment by Fig. 2 easily.
The present invention is with the 4th preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding, it is identical with the first above-mentioned preferred embodiment haply, its identical place is in this superfluous words no longer, place wherein inequality is: this substrate 2 is made by acrylonitrile-butadiene-styrene copolymer, this metal total reflection layer 31 is that a thickness is 400nm, and the percentage by weight composition is a copper 80%, the albronze film of aluminium 20%, this optical thin film layer 32 is that a thickness is the thin film of titanium oxide of 180nm, this metal semi-reflective layer 33 is that a thickness is the W film of 4nm, and above-mentioned metal total reflection layer 31, optical thin film layer 32, and metal semi-reflective layer 33 all is to be located on the corresponding surface with the sputtering way plating.Present embodiment is after finishing, and it is green that its plated film 3 can be, and the resistance value of the albronze film of thickness more than 400nm is 2.7 Ω, is lower than 5 Ω, that is to say that the design of present embodiment can reach the required electrical conductivity of shielding electromagnetic wave really.Because present embodiment and first preferred embodiment shown in Figure 2 are roughly similar on its structure except the thickness of each rete is different, so do not disclose one graphicly more in addition, that is to say, just can find out the structure of present embodiment by Fig. 2 easily.
The present invention is with the 5th preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding, be identical haply with this first preferred embodiment, identical place is in this superfluous words no longer, place wherein inequality is: this substrate 2 is made by plastic cement, this metal total reflection layer 31 is that a thickness is 400nm, and the percentage by weight composition is an aluminium 80%, the aluminum titanium alloy film of titanium 20%, this optical thin film layer 32 is that a thickness is the zinc sulfide film of 200nm, this metal semi-reflective layer 33 is that a thickness is the silver-colored film of 4nm, and above-mentioned metal total reflection layer 31, optical thin film layer 32, and metal semi-reflective layer 33 all is to plate in the evaporation mode to be located on the corresponding surface.Present embodiment is after finishing, and its plated film 3 can be brown, and the resistance value of the aluminum titanium alloy film of thickness more than 400nm is 4.3 Ω, is lower than 5 Ω, that is to say that the design of present embodiment can reach the required electrical conductivity of shielding electromagnetic wave really.Because present embodiment and first preferred embodiment shown in Figure 2 are roughly similar on the structure except the thickness of each rete is different, so do not disclose one graphicly more in addition, that is to say, just can find out the structure of present embodiment by Fig. 2 easily.
The present invention is with the 6th preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding, be identical haply with this first preferred embodiment, identical place is in this superfluous words no longer, place wherein inequality is: this substrate 2 is made by the mixture of Merlon and acrylonitrile-butadiene-styrene copolymer, this metal total reflection layer 31 is that a thickness is 400nm, and the percentage by weight composition is a nickel 80%, the chrome-nickel alloy thin film of chromium 20%, this optical thin film layer 32 is that a thickness is the columbium oxide film of 400nm, this metal semi-reflective layer 33 is that a thickness is the chromium thin film of 4nm, and above-mentioned metal total reflection layer 31, optical thin film layer 32, and metal semi-reflective layer 33 all is to be located on the corresponding surface with the sputtering way plating.Present embodiment is after finishing, and it is green that its plated film 3 can be, and the resistance value of the chrome-nickel alloy thin film of thickness more than 400nm is 4.4 Ω, is lower than 5 Ω, that is to say that the design of this present embodiment can reach the required electrical conductivity of shielding electromagnetic wave really.Because present embodiment and first preferred embodiment shown in Figure 2 are roughly similar on its structure except the thickness of each rete is different, so do not disclose one graphicly more in addition, that is to say, just can find out the structure of present embodiment by Fig. 2 easily.
Seeing also shown in Figure 3ly, is that an explanation the present invention is with the structural representation of the 7th preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding.The present invention is with the 7th preferred embodiment of the non-metallic substrate of incrustation and electromagnetic shielding, be identical haply with above-mentioned first preferred embodiment, its identical place is in this superfluous words no longer, place wherein inequality is: this substrate 2 is made by acrylic resin, this metal total reflection layer 31 is that a thickness is the gold thin film of 400nm, this optical thin film layer 32 is that a thickness is the silicon thin film of 10nm, and do not need this metal semi-reflective layer 33 just can produce color in the present embodiment, and just can produce into color by the metallic luster of this gold thin film with the optical interference phenomenon that this optical thin film 32 is produced, and above-mentioned metal total reflection layer 31 and this optical thin film layer 32 all are to plate in the evaporation mode to be located on the corresponding surface.Present embodiment is after finishing, and it is yellow that its plated film 3 can be, and the resistance value of the gold thin film of thickness more than 400nm is 2.1 Ω, is lower than 5 Ω, that is to say that the design of this present embodiment can reach the required electrical conductivity of shielding electromagnetic wave really.
Among above-mentioned each embodiment, the material of this substrate 2 only is the sub-fraction in numerous non-conducting materials, also can made by other non-conductive materials (for example Merlon etc.), so should not exceed with the explanation of above-mentioned each embodiment.
The sputter process of oxide among above-mentioned each embodiment, the available metal target prepares in reactive plated film mode with straight flow sputter or evaporated device, or is target with the metal oxide, utilizes radio frequency sputter-deposited film.When this metal total reflection layer 31, optical thin film layer 32, and after metal semi-reflective layer 33 finishes in regular turn, along with the change of the thickness of this optical thin film layer 32 causes the optical interference phenomenon, and then the various color of output, be applicable to the decoration of product appearance, and the reflectivity of 31 pairs of visible lights of this metal total reflection layer is average, the difference of unlikely because reflectivity and cause interfering the minus effect that light is too outstanding or constrain.
Because in each embodiment, its plated film 3 is forming the function that the back just can have color generation (incrustation) and electromagnetic wave shielding simultaneously concurrently by sputter or evaporation, unlike must after the sputter complete has the metallic film of electromagnetic shielding function, also needing as the prior art many one spray painting operations obtaining needed incrustation, and can effectively reduce the processing procedure cost.Moreover the present invention utilizes sputter or this type of processing procedure that meets the environmental protection standard of evaporation just can reach the purpose of incrustation, need not to use the high pollution processing procedure that environment is had negative effect, is very suitable for practicality.
In sum, the present invention is with the non-metallic substrate of incrustation and electromagnetic shielding, utilize metal total reflection layer 31, the optical thin film layer 32 of different-thickness and unlike material, and metal semi-reflective layer 33 cooperatively interacts to produce different colours, and reach the purpose of incrustation whereby, and it utilizes the generation type of sputter or evaporation also can replace the processing procedure that sprays paint with pollution, meet the requirement of environmental regulation, and this metal total reflection layer 31 also has enough electrical conductivities simultaneously so that required electromagnetic wave shielding to be provided, so can reach purpose of the present invention and effect really.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (6)
1. non-metallic substrate with incrustation and electromagnetic shielding, this non-metallic substrate comprises a substrate, and one deck covers the plated film on this substrate, it is characterized in that:
This substrate is made by non-metallic material;
This plated film has one deck and cover metal total reflection layer on this substrate, and one deck covers the optical thin film layer on this metal total reflection layer.
2. according to claim 1 with the non-metallic substrate of incrustation and electromagnetic shielding, it is characterized in that wherein said plated film also has one deck and covers metal semi-reflective layer on this optical thin film layer.
3. the non-metallic substrate with incrustation and electromagnetic shielding as claimed in claim 1 or 2 is characterized in that wherein the material of this substrate is to be selected from the following group that constitutes: glass, Merlon, acrylonitrile-butadiene-styrene copolymer, acrylic resin, plastic cement or these a combination.
As described in the claim 3 with the non-metallic substrate of incrustation and electromagnetic shielding, it is characterized in that the totally reflected material of metal of wherein said plated film is to be selected from the following group that constitutes: aluminium, silver, gold, chromium, molybdenum, nickel, titanium, tungsten, copper or these a combination.
As described in the claim 4 with the non-metallic substrate of incrustation and electromagnetic shielding, the material that it is characterized in that the optical thin film layer of wherein said plated film is to be selected from the following group that constitutes: the oxide of titanium, tantalum, niobium, silicon, zirconium, silicon, zinc sulphide.
As described in the claim 5 with the non-metallic substrate of incrustation and electromagnetic shielding, it is characterized in that the metal semi-reflective layer material of wherein said plated film is to be selected from the following group that constitutes: aluminium, silver, gold, chromium, molybdenum, nickel, titanium, tungsten or these a combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2007101631487A CN101410001B (en) | 2007-10-10 | 2007-10-10 | Non-metal basis material with surface decoration and electromagnetic wave shield |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2007101631487A CN101410001B (en) | 2007-10-10 | 2007-10-10 | Non-metal basis material with surface decoration and electromagnetic wave shield |
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| CN101410001A CN101410001A (en) | 2009-04-15 |
| CN101410001B true CN101410001B (en) | 2010-11-17 |
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| CN2007101631487A Expired - Fee Related CN101410001B (en) | 2007-10-10 | 2007-10-10 | Non-metal basis material with surface decoration and electromagnetic wave shield |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555339A (en) * | 2010-12-08 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Board with composite plated film and portable electronic device adopting board |
| CN102555338A (en) * | 2010-12-08 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Plate with composite coating and portable electronic device using same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101375956B1 (en) * | 2012-07-05 | 2014-03-18 | 엘에스산전 주식회사 | Electronic component box for vehicle |
| CN106335248A (en) * | 2016-08-24 | 2017-01-18 | 梁丽珍 | High-strength wave-absorption material |
| CN107134229A (en) * | 2017-05-31 | 2017-09-05 | 广东欧珀移动通信有限公司 | Lamp house cloth and lamp box |
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| EP1002773A1 (en) * | 1998-11-18 | 2000-05-24 | Nippon Sheet Glass Co., Ltd. | Heat-reflecting glass and double-glazing unit using the same |
| CN2457818Y (en) * | 2000-12-21 | 2001-10-31 | 张建樟 | Displayer protective screen without color difference |
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2007
- 2007-10-10 CN CN2007101631487A patent/CN101410001B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1002773A1 (en) * | 1998-11-18 | 2000-05-24 | Nippon Sheet Glass Co., Ltd. | Heat-reflecting glass and double-glazing unit using the same |
| CN2457818Y (en) * | 2000-12-21 | 2001-10-31 | 张建樟 | Displayer protective screen without color difference |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555339A (en) * | 2010-12-08 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Board with composite plated film and portable electronic device adopting board |
| CN102555338A (en) * | 2010-12-08 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Plate with composite coating and portable electronic device using same |
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| CN101410001A (en) | 2009-04-15 |
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Effective date of registration: 20120110 Address after: 213149 Jiangsu city of Changzhou province Wujin Economic Development District Road No. 18 Patentee after: Changzhou Sinosteel Precision Forging Material Co., Ltd Address before: Kaohsiung City, Taiwan, China Patentee before: Zhongguo Iron & Steel Co., Ltd. |
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