TWI381799B - Both surface decoration and electromagnetic shielding of the non-metallic substrate - Google Patents

Description

Non-metallic substrate with both surface decoration and electromagnetic wave shielding

The invention relates to a non-metal substrate, in particular to a non-metal substrate which has both surface decoration and electromagnetic wave shielding.

In today's society, with the rapid advancement of technology, the data processing frequency of electronic products is increasing, coupled with the prevalence of wireless products such as mobile phones and wireless networks, the situation of electromagnetic wave pollution is becoming more and more serious, which will not only affect The normal operation of the product itself and the surrounding electronic products is more likely to endanger human health. Therefore, how to prevent and reduce the interference of electromagnetic waves has become an important issue in product design and production.

At present, the most common way to prevent external electromagnetic interference is to increase the shielding ability of the external packaging of electronic products to electromagnetic waves. According to the Schelkunoff theory, a metal having high conductivity has an excellent absorption and reflection effect on electromagnetic waves, so that electromagnetic wave shielding can be achieved by enhancing the electrical conductivity of the outer package of the electronic component.

In order to achieve high quality and high output requirements, most electronic products use injection molded plastic materials as the outer casing. However, general plastics do not have the effect of electromagnetic shielding. In order to make plastic packaging products resistant to electromagnetic interference, Generally, the method adopted by the industry includes adding a conductive filler to the plastic to make the outer casing conductive, or adding a conductive layer to the outer casing 11 by using a metal plate, metal plating, electroless plating, conductive adhesive coating, and conductive film coating. Floor. In the above method, the addition of the conductive filler material to the plastic has the advantages of good shielding effect, no additional process, but high cost, and the outer casing is easy to lose the original strength. The cost of masking metal sheets is also in line with current environmental regulations, but the processing and assembly is complicated, and the weight of the products is additionally increased, which does not meet the trend of light, thin and short electronic products. The rest of the methods are mostly high-pollution processes, which not only touch the environmental regulations, but also the establishment of new electroplating plants is not easy, and will gradually be replaced by other processes.

Thin film sputtering is currently the only process that meets the EU coating specifications. The traditional vacuum sputtering process has a working temperature of about 150 degrees Celsius or higher. The temperature is high and the products that can be sputtered are limited. It cannot be used in thermoplastic plastic materials. At present, the technology can reduce the working temperature to 60 degrees Celsius, and it has no problem in the application of plastic shell film sputtering. Due to the breakthrough of technology, the sputtering process has been gradually applied to the anti-electromagnetic wave process of plastic shell parts in 3C products.

1 is a conventionally designed coating film layer. The inner surface of the outer casing 11 of the electronic component has a copper film 12 coated thereon and a stainless steel film 13 overlying the copper film 12.

Due to the excellent electrical conductivity of copper and high film deposition rate, it has become the main material for sputtering anti-electromagnetic radiation process. Because the equipment for testing the electromagnetic wave shielding effect is complicated and the detection time is consuming, the conductivity of the coating on the general line is taken as the quality control standard. In the case of the commonly used copper film 12, the resistance between the top of the column and the outer 10 mm of the column is smaller than With 5 Ω, the effect of shielding electromagnetic waves can be achieved.

Since the copper film 12 of the sputtering process is extremely oxidizable, the resistance value of the copper film 12 after oxidation is greatly increased, and the conductive property is lost, thereby reducing the shielding effect on electromagnetic waves. Therefore, in order to avoid the oxidation resistance of the copper film 12, the anti-electromagnetic interference performance is lowered, and a stainless steel film 13 is usually sputtered on the copper film 12, thereby protecting the copper film 12 from the ability to shield electromagnetic waves due to contact with air oxidation. As a result of the addition of a sputtering process, the cost of equipment has increased greatly. In addition, the price of stainless steel has risen sharply, increasing the cost of the sputtering process, and the profit of the thin electronic industry is even worse.

The main purpose of shielding electromagnetic waves is to protect the body of electronic products and the consumers they use, but the main factors that cause consumers to purchase are in product design, especially the design of 3C products has a decisive influence on the sales of products. At present, the decorative film layer 14 of the outer casing 11 of the 3C product is mostly painted to produce a color effect, but the products of such a process do not have metallic luster, and the production process is easy to pollute the environment, and in the case of high environmental awareness, there is great Improve the space.

Accordingly, it is an object of the present invention to provide a non-metallic substrate having both surface decoration and electromagnetic wave shielding that meets environmental regulations and can simultaneously achieve appearance decoration and electromagnetic wave shielding.

Therefore, the non-metallic substrate of the present invention having both surface decoration and electromagnetic wave shielding comprises a substrate and a plating film.

The substrate is made of a non-conductive material. The coating has a metal total reflection layer overlying the substrate, an optical film layer overlying the metal total reflection layer, and a metal semi-reflective layer overlying the optical film layer.

The effect of the invention is to form an optical interference phenomenon by using the optical film layer and the reflection of the metal total reflection layer and the metal semi-reflection layer, and different surface colors can be produced without using a high-pollution process such as painting. For the purpose of exterior decoration, the high electrical conductivity of the metal total reflection layer and the metal semi-reflective layer also has the function of electromagnetic wave shielding, and the process and production cost can be reduced by integrating the decorative coating and the electromagnetic wave shielding coating.

The foregoing and other technical aspects, features and advantages of the present invention will be apparent from the Detailed Description of the <RTIgt;

Before the present invention is described in detail, it is noted that in the following description, like elements are denoted by the same reference numerals.

As shown in FIG. 2, the first preferred embodiment of the non-metallic substrate having both surface decoration and electromagnetic wave shielding comprises a substrate 2 and a plating film 3.

The substrate 2 is made of a non-conductive material, and the coating 3 has a metal total reflection layer 31 covering the substrate 2, an optical film layer 32 covering the metal total reflection layer 31, and a coating layer The metal semi-reflective layer 33 on the optical thin film 32. In this embodiment, the substrate 2 is made of plastic. The metal total reflection layer 31 is an aluminum film having a thickness of 500 nm, and the optical film layer 32 is a cerium oxide film having a thickness of 200 nm. The reflective layer 33 is a silver thin film having a thickness of 4 nm, and the metal total reflection layer 31, the optical thin film layer 32, and the metal semi-reflective layer 33 are deposited on the corresponding surface by evaporation. After the completion of the embodiment, the coating film 3 will be lavender, and the aluminum film having a thickness of 500 nm or more has a resistance value of 2.1 Ω and less than 5 Ω, which means that the design of the embodiment can achieve the shielding of electromagnetic waves. Conductivity.

As shown in FIG. 3, the second preferred embodiment of the non-metallic substrate of the present invention having both surface decoration and electromagnetic wave shielding is substantially the same as the first preferred embodiment, and the same is no longer a common statement. The substrate 2 is made of acryl. The metal total reflection layer 31 is a silver film having a thickness of 200 nm. The optical film layer 32 is a zirconia film having a thickness of 300 nm. The reflective layer 33 is a titanium thin film having a thickness of 4 nm, and the metal total reflection layer 31, the optical thin film layer 32, and the metal semi-reflective layer 33 are all plated on the corresponding surfaces by sputtering. After the completion of the embodiment, the coating film 3 is pink, and the resistance of the silver film having a thickness of 200 nm or more is 2.8 Ω, which is lower than 5 Ω, which means that the design of the embodiment can achieve the shielding of electromagnetic waves. Conductivity.

As shown in FIG. 4, the third preferred embodiment of the non-metallic substrate of the present invention having both surface decoration and electromagnetic wave shielding is substantially the same as the first preferred embodiment, and the same is no longer a common statement. The substrate 2 is made of glass. The metal total reflection layer 31 is a molybdenum film having a thickness of 400 nm. The optical film layer 32 is a ruthenium oxide film having a thickness of 200 nm. 33 is a nickel film having a thickness of 4 nm, and the metal total reflection layer 31, the optical film layer 32, and the metal semi-reflective layer 33 are all plated on the corresponding surfaces by sputtering. After the completion of the embodiment, the coating film 3 will be blue, and the molybdenum film having a thickness of 400 nm or more has a resistance value of 3.1 Ω and less than 5 Ω, which means that the design of the embodiment can achieve the shielding of electromagnetic waves. Conductivity.

As shown in FIG. 5, the fourth preferred embodiment of the non-metallic substrate of the present invention having both surface decoration and electromagnetic wave shielding is substantially the same as the first preferred embodiment, and the same is no longer a common statement. The same is as follows: the substrate 2 is made of an acrylonitrile-butadiene-styrene copolymer, the metal total reflection layer 31 is a thickness of 400 nm, and the weight percentage component is 80% of copper and 20% of aluminum. a copper-aluminum alloy film, the optical film layer 32 is a titanium oxide film having a thickness of 180 nm, the metal semi-reflective layer 33 is a tungsten film having a thickness of 4 nm, and the metal total reflection layer 31 and the optical film layer 32, and The metal semi-reflective layer 33 is plated on the corresponding surface by sputtering. After the completion of the embodiment, the coating film 3 will be green, and the resistance value of the copper-aluminum alloy film having a thickness of 400 nm or more is 2.7 Ω, which is lower than 5 Ω, which means that the design of the embodiment can achieve the shielding electromagnetic wave. Conductivity.

As shown in FIG. 6, the fifth preferred embodiment of the non-metallic substrate having both surface decoration and electromagnetic wave shielding of the present invention is substantially the same as the first preferred embodiment, and the same is no longer a rumor, wherein no The substrate 2 is made of plastic. The metal total reflection layer 31 is an aluminum-titanium alloy film having a thickness of 400 nm and a weight percentage of 80% aluminum and 20% titanium. The optical film layer 32 is 32. It is a zinc sulfide film having a thickness of 200 nm, and the metal semi-reflective layer 33 is a silver film having a thickness of 4 nm, and the metal total reflection layer 31, the optical film layer 32, and the metal semi-reflective layer 33 are all evaporated. The method is plated on the corresponding surface. After the completion of the embodiment, the coating film 3 will be brown, and the aluminum-titanium alloy film having a thickness of 400 nm or more has a resistance value of 4.3 Ω, which is lower than 5 Ω, which means that the design of the embodiment can achieve the shielding electromagnetic wave. Conductivity.

As shown in FIG. 7, the sixth preferred embodiment of the non-metallic substrate of the present invention having both surface decoration and electromagnetic wave shielding is substantially the same as the first preferred embodiment, and the same is no longer a common statement. The same is that the substrate 2 is made of a mixture of a polycarbonate and an acrylonitrile-butadiene-styrene copolymer having a thickness of 400 nm and a weight percentage of nickel 80. %, chromium 20% nickel-chromium alloy film, the optical film layer 32 is a cerium oxide film having a thickness of 400 nm, the metal semi-reflective layer 33 is a chromium film having a thickness of 4 nm, and the metal total reflection layer 31, Both the optical film layer 32 and the metal semi-reflective layer 33 are plated on the corresponding surface by sputtering. After the completion of the embodiment, the coating film 3 will be green, and the resistance of the nichrome film having a thickness of 400 nm or more is 4.4 Ω, which is lower than 5 Ω, which means that the design of the embodiment can achieve shielding electromagnetic waves. The required conductivity.

As shown in FIG. 8, the seventh preferred embodiment of the non-metallic substrate having both surface decoration and electromagnetic wave shielding of the present invention is substantially the same as the first preferred embodiment, and the same is no longer a rumor, wherein no The substrate 2 is made of acryl. The metal total reflection layer 31 is a gold film having a thickness of 400 nm, and the optical film layer 32 is a ruthenium film having a thickness of 10 nm. In the example, the metal semi-reflective layer 33 is not required to produce color, and the metal total reflection layer 31 and the optical film layer 32 are all deposited on the corresponding surface by evaporation. After the completion of the embodiment, the coating film 3 will be yellow, and the thickness of the gold film having a thickness of 400 nm or more has a resistance value of 2.1 Ω, which is less than 5 Ω, which means that the design of the embodiment can achieve the shielding of electromagnetic waves. Conductivity.

In the above embodiments, the material of the substrate 2 is only a small part of a plurality of non-conductive materials, and may also be made of other non-conductive materials (for example, polycarbonate, etc.), so the above embodiments are not used. The description is limited.

In the above embodiments, the sputtering process of the oxide can be prepared by reactive sputtering using a metal target by a DC sputtering or evaporation apparatus, or by depositing a film by using a metal oxide as a target. When the metal total reflection layer 31, the optical film layer 32, and the metal semi-reflective layer 33 are sequentially completed, the optical interference phenomenon is caused by the change of the thickness of the optical film layer 32, thereby producing various colors, which are suitable for The decoration of the appearance of the product, and the reflectance of the visible light of the metal total reflection layer 31 is average, so that the interference light is not too prominent or suppressed by the difference of the reflectance.

In each of the embodiments, the coating film 3 has the functions of color generation (surface decoration) and electromagnetic wave shielding after being formed by sputtering or vapor deposition, and it is not necessary to have electromagnetic waves after sputtering as is conventional. After the metal film of the shielding function, an additional painting operation is required to obtain the required surface decoration, which can effectively reduce the process cost. Furthermore, the present invention achieves the purpose of surface decoration by sputtering or vapor deposition of such environmentally-friendly processes, without the need for a highly contaminated process that adversely affects the environment.

In summary, the non-metallic substrate of the present invention having both surface decoration and electromagnetic wave shielding utilizes a metal total reflection layer 31, an optical film layer 32, and a metal semi-reflective layer 33 of different thicknesses and materials to cooperate with each other to produce different colors. Thereby, the purpose of surface decoration is achieved, and the formation method by sputtering or vapor deposition can also replace the polluting paint painting process, which meets the requirements of environmental protection regulations, and the metal total reflection layer 31 also has sufficient conductivity at the same time. Providing the electromagnetic wave shielding required, it is indeed possible to achieve the object of the present invention.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

2. . . Substrate

3. . . Coating

31. . . Metal total reflection layer

32. . . Optical film layer

33. . . Metal semi-reflective layer

1 is a schematic view showing a conventional electronic component housing; FIG. 2 is a schematic view showing a first preferred embodiment of the non-metallic substrate of the present invention having both surface decoration and electromagnetic wave shielding; FIG. 3 is a schematic view. A second preferred embodiment of a non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the present invention; FIG. 4 is a schematic view showing a third preferred embodiment of the non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the present invention. FIG. 5 is a schematic view showing a fourth preferred embodiment of the non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the present invention; FIG. 6 is a schematic view showing the non-metal of the present invention having both surface decoration and electromagnetic wave shielding. A fifth preferred embodiment of the substrate; FIG. 7 is a schematic view showing a sixth preferred embodiment of the non-metallic substrate having both surface decoration and electromagnetic wave shielding of the present invention; and FIG. 8 is a schematic view showing the present invention A seventh preferred embodiment of a non-metallic substrate having surface decoration and electromagnetic wave shielding.

2. . . Substrate

3. . . Coating

31. . . Metal total reflection layer

32. . . Optical film layer

33. . . Metal semi-reflective layer

Claims (9)

A non-metallic substrate having both surface decoration and electromagnetic wave shielding, comprising: a substrate made of a non-conductive material; and a coating film having a metal total reflection layer overlying the substrate and covering the metal An optical film layer on the reflective layer and a metal semi-reflective layer overlying the optical film layer. A non-metallic substrate having both surface decoration and electromagnetic wave shielding according to claim 1, wherein the material of the substrate is selected from the group consisting of glass, polycarbonate, acrylonitrile-butyl A combination of a diene-styrene copolymer, acryl, plastic, and one of these elements. A non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the second aspect of the patent application, wherein the material of the metal total reflection layer of the coating is selected from the group consisting of aluminum, silver, gold , chromium, molybdenum, nickel, titanium, tungsten, copper and a combination of these elements. A non-metallic substrate having both surface decoration and electromagnetic wave shielding according to claim 3, wherein the material of the optical film layer of the coating is selected from the group consisting of titanium, tantalum, niobium, An oxide of an element such as cerium or zirconium, and cerium or zinc sulfide. A non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the fourth aspect of the patent application, wherein the metal semi-reflective layer material of the coating is selected from the group consisting of aluminum, silver, gold, Chromium, molybdenum, nickel, titanium, tungsten and a combination of these elements. A non-metallic substrate having both surface decoration and electromagnetic wave shielding, comprising: a substrate made of a non-conductive material; and a coating having a metal total reflection layer overlying the substrate and covering the metal An optical film layer on the total reflection layer. A non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the scope of claim 6 wherein the material of the substrate is selected from the group consisting of glass, polycarbonate, acrylonitrile-butyl A combination of a diene-styrene copolymer, acryl, plastic, and one of these elements. A non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the scope of claim 7 wherein the material of the metal total reflection layer of the coating is selected from the group consisting of aluminum, silver, gold , chromium, molybdenum, nickel, titanium, tungsten, copper and a combination of these elements. A non-metallic substrate having both surface decoration and electromagnetic wave shielding according to the scope of claim 8 wherein the material of the optical film layer of the coating is selected from the group consisting of titanium, tantalum, niobium, An oxide of an element such as cerium or zirconium, and cerium or zinc sulfide.