JPS6241011A - Process of electromagnetic wave shield molding - Google Patents

Process of electromagnetic wave shield molding

Info

Publication number
JPS6241011A
JPS6241011A JP18030785A JP18030785A JPS6241011A JP S6241011 A JPS6241011 A JP S6241011A JP 18030785 A JP18030785 A JP 18030785A JP 18030785 A JP18030785 A JP 18030785A JP S6241011 A JPS6241011 A JP S6241011A
Authority
JP
Japan
Prior art keywords
conductive
base sheet
layer
bed
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18030785A
Other languages
Japanese (ja)
Inventor
Katsuhide Eguchi
江口 勝英
Keishi Hanamoto
恵嗣 花本
Takao Terauchi
孝夫 寺内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP18030785A priority Critical patent/JPS6241011A/en
Publication of JPS6241011A publication Critical patent/JPS6241011A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811Multilayered articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0011Electromagnetic wave shielding material

Abstract

PURPOSE:To manufacture a plastic molding having conductive bed integrally by preliminary preforming the base sheet by means of vacuum or compressed air according to the shape of product, painting the conducting paint inside of the product to be molded, and injection molding the molten plastic in the injection mold. CONSTITUTION:The ABC resin sheet of 0.6mm thickness is preformed in vacua, inside of which the paint mixture of copper dust and acrylic resin binder is sprayed to form a conductive bed of 50mu thickness. After being dried up, the molded conductive base sheet is placed in the injection mold, and ABC resin is injection molded in the cavity to produce an electromagnetic wave shield molding product. This molding product has the conductive bed not likely to peel or fall off, and is of a good capability of electromagnetic wave shielding. The said process can provide the conductive bed 2 having a uniform thickness and maintain a good contact of conducting particle in the bed. The conductive bed 2 is placed between the plastic bed 3 and the conductive bed 2 or the base sheet 1, which eliminates the peeling or falling off of conductive bed.

Description

【発明の詳細な説明】 及団の旦刀 [産業上の利用分野1 本発明は電磁波シールド性のすぐれた成形品を効率的に
製造する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a method for efficiently manufacturing a molded product with excellent electromagnetic shielding properties.

[従来の技術1 種々の電気または電子機器から発生する電磁波が他の機
器に悪影響を及ぼさないよう、また外部からの電磁波に
よって干渉されないようにするためには、これらの機器
のキャビネット類を電磁波シールドする必要がある。
[Prior art 1] In order to prevent the electromagnetic waves generated from various electrical or electronic devices from having a negative effect on other devices, and to prevent interference from external electromagnetic waves, the cabinets of these devices must be shielded from electromagnetic waves. There is a need to.

キャビネットをプラスチックで製造する場合、電磁波シ
ールドの目的で、導電性塗料をプラスチック成形品の表
面に塗着することが行なわれている。 しかし、塗装に
は、成形品に対する溶剤の影響が問題であるし、塗着し
た導電性塗料の剥離防止や美観を高めるための上塗りの
必要も伴う。
When manufacturing cabinets from plastic, conductive paint is applied to the surface of the plastic molded product for the purpose of shielding electromagnetic waves. However, painting is problematic because of the influence of the solvent on the molded product, and it is also necessary to apply a top coat to prevent the applied conductive paint from peeling off and to improve the aesthetic appearance.

溶剤の問題を解決した技術として、成形金型面に導電性
塗膜を被着しておいてプラスチックの射出成形を行ない
、表面に導電性塗膜を融着した筐体を製造する方法が提
案された(特開昭59−90994号)。
As a technology that solved the problem of solvents, a method was proposed in which a conductive coating was applied to the surface of the molding die and then plastic injection molding was performed to manufacture a housing with the conductive coating fused to the surface. (Japanese Patent Application Laid-Open No. 59-90994).

しかし、この方法は、作業能率が低い上に、導電層が表
面に出ているから、剥離脱落のおそれがあり、かつ体裁
がよくないという欠点がある。
However, this method has drawbacks such as low working efficiency, the risk of peeling off and falling off because the conductive layer is exposed on the surface, and poor appearance.

出願人は、導電性塗膜の保護層として基材シートを用い
、その上に導電性塗料を塗布したものを金型内に置き、
真空・圧空成形によって上記基材シートと導電性塗料の
層とを変形させたのち射出成型し、それらを一体化した
プラスチック成形品を得る技術を開発した。
The applicant uses a base sheet as a protective layer for the conductive coating, coats it with conductive paint, and places it in a mold.
We developed a technique to obtain a plastic molded product by deforming the base sheet and the conductive paint layer by vacuum/pressure forming and then injection molding them into one piece.

ただし、成形品の伸びの大きい部分では導電性層の固有
抵抗が塗装時より高まりやすく、期待したシールド性能
を得るには高度の技術を要することが経験された。
However, in areas where the molded product has a large elongation, the specific resistance of the conductive layer tends to be higher than when it is painted, and it has been experienced that advanced technology is required to obtain the expected shielding performance.

[発明が解決しようとする問題点] 本発明の目的は、従来技術の欠点を解消し、電磁波シー
ルド性能が確実なプラスチック成形品を効率的に製造す
る方法を提供することにある。
[Problems to be Solved by the Invention] An object of the present invention is to eliminate the drawbacks of the prior art and provide a method for efficiently manufacturing a plastic molded product with reliable electromagnetic shielding performance.

発明の構成 [問題点を解決するための手段] 本発明の電磁波シールド成形品の製造方法は、第1図に
示すように、基材シート1を真空および(または)圧空
成形により成形品の内形または外形に応じた形状に予備
成形し、第2図に示すように、基材シート予備成形体の
内面に導電性塗料を塗布して、第3図に示すように、射
出成形金型5内に置いて溶融プラスチックを射出成形す
ることにより、第4図に示すように、導電層2を一体に
有するプラスチック成形品を得ることを特徴とする。
Structure of the Invention [Means for Solving the Problems] As shown in FIG. 1, the method for manufacturing an electromagnetic shielding molded product of the present invention is to form a base sheet 1 into a molded product by vacuum and/or pressure forming. The base sheet preform is preformed into a shape according to its shape or external shape, and as shown in FIG. 2, a conductive paint is applied to the inner surface of the base sheet preform, and as shown in FIG. By injection molding molten plastic within the mold, a plastic molded product having an integral conductive layer 2 is obtained, as shown in FIG.

基材シートは、予備成形において十分な変形をし、射出
成形に当って、必要な耐熱性を有するものをえらぶ。 
具体例をあげれば、ポリ塩化ビニル、ナイロン、ポリ塩
化ビニリデン、ポリエチレンテレフタレート、ポリエチ
レン、ポリプロピレン、ポリウレタン、ポリビニルアル
コール、ポリカーボネート、アセテート、ポリスチレン
、ポリフェニレンオキサイド樹脂、アクリル樹脂、AS
樹脂、ABS樹脂、PPO樹脂、変性PPO樹脂、ポリ
イミドなどのプラスチックのフィルムまたはシートであ
る。 これらのうちで好ましいものは、ナイロン、ポリ
塩化ビニリデン、ポリプロピレンおよびABS樹脂であ
る。 フィルムの厚さは、0.02〜0.8#が適当で
あって、使用条件に応じてこの範囲から選択する。
The base sheet is selected to be sufficiently deformed during preforming and to have the necessary heat resistance for injection molding.
Specific examples include polyvinyl chloride, nylon, polyvinylidene chloride, polyethylene terephthalate, polyethylene, polypropylene, polyurethane, polyvinyl alcohol, polycarbonate, acetate, polystyrene, polyphenylene oxide resin, acrylic resin, and AS.
It is a plastic film or sheet made of resin, ABS resin, PPO resin, modified PPO resin, polyimide, etc. Preferred among these are nylon, polyvinylidene chloride, polypropylene and ABS resin. The appropriate thickness of the film is 0.02 to 0.8 #, and is selected from this range depending on the conditions of use.

導電性塗料としては、カーボンブラック、グラフフィト
、銀、銅、ニッケルなどの金属粉末とアクリル系または
ウレタン系のバインダー樹脂と助剤および溶剤とを混合
したものを使用する。 この塗料をスプレーそのほかの
手段で塗布することにより、導電層を形成する。
As the conductive paint, a mixture of metal powder such as carbon black, graphite, silver, copper, or nickel, an acrylic or urethane binder resin, an auxiliary agent, and a solvent is used. A conductive layer is formed by applying this paint by spraying or other means.

射出成形によるプラスチック層は、ABS、アクリル、
ポリカーボネート、ポリイミド、ポリ塩化ビニル、ポリ
エチレン、ポリスチレン、ポリプロピレン、ポリアセタ
ールなどの熱可塑性樹脂を使用して形成する。
The injection molded plastic layer is made of ABS, acrylic,
It is formed using thermoplastic resins such as polycarbonate, polyimide, polyvinyl chloride, polyethylene, polystyrene, polypropylene, and polyacetal.

導電層は一般に黒色またはそれに近い暗色のものとなる
ので、成形品の意匠上の要求からそれが好ましくない場
合には、表面に適宜の化粧層を設けたい。 この目的に
は、基材シートの表面に化粧層を設けておけばよい。 
化粧は、模様の印刷そのほか任意である。
Since the conductive layer is generally black or a dark color close to black, if this is not desirable due to the design requirements of the molded product, it is desirable to provide an appropriate decorative layer on the surface. For this purpose, a decorative layer may be provided on the surface of the base sheet.
Makeup can be optional, such as printing a pattern.

別の変更態様においては、基材シート1と導電層2との
間に剥離層4を設けておいて射出成形を行なったのち、
基材シート1を剥離する転写方式をとることが可能であ
る。 得られた製品は、第5図に示すような断面構造と
なる。 この場合、必要に応じて、剥離層と導電層の間
に化粧層または絶縁層を設けるとよい。 もちろん、基
材シートを剥離せず、残したまま使用してもよい。
In another modification, after injection molding is performed with a release layer 4 provided between the base sheet 1 and the conductive layer 2,
It is possible to use a transfer method in which the base sheet 1 is peeled off. The obtained product has a cross-sectional structure as shown in FIG. In this case, a decorative layer or an insulating layer may be provided between the release layer and the conductive layer, if necessary. Of course, the base sheet may be used without being peeled off and left as it is.

転写方式を採用する場合に設ける剥離層4の材料は、基
材シート1および導電層2との密着性を考慮して、ポリ
メタクリル酸エステル、ポリ塩化ビニル、ポリ塩化ビニ
リデン、塩化ゴム、ポリスチレン、As樹脂、ABS樹
脂などからえらぶ。
In consideration of the adhesion between the base sheet 1 and the conductive layer 2, the materials for the release layer 4 provided when the transfer method is adopted include polymethacrylic acid ester, polyvinyl chloride, polyvinylidene chloride, chlorinated rubber, polystyrene, Choose from As resin, ABS resin, etc.

導電層とプラスチック層との間の接着を十分にとりたい
場合は、前者の表面に接着剤の層を設けて射出成形する
とよい。
If sufficient adhesion between the conductive layer and the plastic layer is desired, it is preferable to provide a layer of adhesive on the surface of the former and perform injection molding.

この接着剤は、ポリ塩化ビニル、ナイロン、アクリル樹
脂、ポリプロピレン、ポリウレタン、ポリビニルアルコ
ール、ポリイミド、アセテートなどの樹脂を選択使用す
る。
This adhesive is selected from resins such as polyvinyl chloride, nylon, acrylic resin, polypropylene, polyurethane, polyvinyl alcohol, polyimide, and acetate.

以上の説明は、射出成形品のプラスチック層の表側に導
電層がある場合を対象にしているが、裏側に導電層があ
ってもよく、そのような場合も本発明包含されることは
もちろんである。
The above explanation is for the case where there is a conductive layer on the front side of the plastic layer of the injection molded product, but there may be a conductive layer on the back side, and such cases are of course included in the present invention. be.

[作 用] さきに開発した技術によって製造した電磁波シールド成
形品において、シールド性能が低い場合をしらべたとこ
ろ、導電性塗料の囮が成形に際して強くひきのばされて
薄くなっていたことが、ひとつの原因であるとわかった
。 また、導電性塗料は成形性がよくなく、塗膜が成形
時にひきのばされると導電性粒子相互の接触が失われて
、固有抵抗が増し、これがシールド性能の低下を招くも
うひとつの原因であることがわかった。
[Function] When we investigated cases where the shielding performance was low in the electromagnetic shielding molded products manufactured using the technology developed earlier, we found that one of the findings was that the conductive paint decoy was strongly stretched during molding and became thin. It turned out to be the cause. In addition, conductive paints do not have good moldability, and when the paint film is stretched during molding, the conductive particles lose contact with each other, increasing the specific resistance, which is another cause of deterioration in shielding performance. It turned out to be.

本発明の電磁波シールド成形品の製造方法によれば、導
電層2の厚さを均一にするとともに、層内の導電性粒子
の接触をよく保つことが可能である。 導電層2が基材
シート1または剥離層4とプラスチック層3との間にあ
るので、導電層2の剥離脱落や摩耗がない。
According to the method for manufacturing an electromagnetic shielding molded product of the present invention, it is possible to make the thickness of the conductive layer 2 uniform and to maintain good contact between the conductive particles in the layer. Since the conductive layer 2 is located between the base sheet 1 or the release layer 4 and the plastic layer 3, the conductive layer 2 is not peeled off or worn out.

好ましい態様においては、基材シートの表面上に化粧層
を設けることにより、意匠的にすぐれた成形品を得るこ
とか可能である。 転写方式をとることも可能であり、
その場合、剥離層と導電層の間に化粧層または絶縁層を
設けることにより、意匠的にすぐれかつ絶縁性にすぐれ
た成形品を得ることができる。
In a preferred embodiment, by providing a decorative layer on the surface of the base sheet, it is possible to obtain a molded article with an excellent design. It is also possible to use the transcription method,
In that case, by providing a decorative layer or an insulating layer between the release layer and the conductive layer, a molded article with excellent design and excellent insulation properties can be obtained.

[実施例] ABS樹脂の厚さ0.68のシートを真空成形により予
備成形して、その内面に銅粉末をアクリル樹脂のバイン
ダーと混合してなる塗料をスプレー塗布し、厚さ50μ
の導電層を形成した。 乾燥後、この成形された導電性
基材シートを射出成形金型内に置いてキャビティ内にA
BS樹脂を射出成形し、電磁波シールド成形品を得た。
[Example] A sheet of ABS resin with a thickness of 0.68 mm was preformed by vacuum forming, and a paint made by mixing copper powder with an acrylic resin binder was sprayed on the inner surface of the sheet to form a sheet with a thickness of 50 μm.
A conductive layer was formed. After drying, this molded conductive base sheet is placed in an injection mold and A is placed in the cavity.
BS resin was injection molded to obtain an electromagnetic shield molded product.

得られた成形品は、導電層の剥離脱落がなく、良好な電
磁波シールド性能を示した。
The obtained molded product exhibited good electromagnetic shielding performance with no peeling or falling of the conductive layer.

発明の効果 本発明の電磁波シールド成形品の製造方法は、シートの
予備成形と導電性塗料の塗布とを射出成形とは別個に行
ない、射出成形金型は射出成形だけに使用することがで
きるから、金型に導電性塗料を被着する既知の技術より
生産性が高い。 製品は、導電層の厚さが均一で固有抵
抗が低いから、電磁波シールド性能が確実である。 導
電層が基材シートまたは剥離胴により保護されているの
で、剥@脱落がなく、i′l摩耗性がよく、シールド性
能が長く保たれる。
Effects of the Invention In the method for producing an electromagnetic shielding molded product of the present invention, the preforming of the sheet and the application of the conductive paint are performed separately from the injection molding, and the injection mold can be used only for injection molding. , which is more productive than known techniques of applying conductive paint to molds. The product has a uniform conductive layer thickness and low specific resistance, ensuring reliable electromagnetic shielding performance. Since the conductive layer is protected by a base sheet or a peeling cylinder, there is no peeling or falling off, good i'l abrasion resistance, and shielding performance is maintained for a long time.

好ましい態様においては、基材シートの表面上に化粧層
を設けることにより、意匠的にすぐれた成形品を得るこ
とが可能である。 変更態様においては、転写方式をと
ることが可能でおる。 この態様の場合、剥離層と導電
層との間に化粧層または絶縁層を設けることにより、意
匠的にすぐれかつ絶縁性にすぐれた成形品を得ることが
できる。
In a preferred embodiment, by providing a decorative layer on the surface of the base sheet, it is possible to obtain a molded article with excellent design. In a modified embodiment, a transfer method can be used. In this embodiment, by providing a decorative layer or an insulating layer between the release layer and the conductive layer, a molded article with excellent design and excellent insulation properties can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は、本発明の電磁波シールド成形品
の製造工程を説明するだめの断面図であって、第1図は
、基材シートを予備成形したところを、第2図は、基材
シートの内面に導電層を設けたところを、第3図は、導
電層を有する基材シートを金型内に置いたところを、そ
れぞれ示す。 第4図は、第1図ないし第3図の方法で製造した電磁波
シールド成形品の断面図である。 第5図は、本発明の電磁波シールド成形品の別の例を示
す、第4図と同様な断面図である。 1・・・基材シート 2・・・導電層 3・・・プラスチック層 4・・・剥離層 5・・・射出成形金型 特許出願人   大日本印刷株式会社 代理人  弁理士  須 賀 総 大 筒1図 第2図 第311 第4図
1 to 3 are cross-sectional views for explaining the manufacturing process of the electromagnetic shielding molded product of the present invention, in which FIG. 1 shows a preformed base sheet, and FIG. A conductive layer is provided on the inner surface of the base sheet, and FIG. 3 shows a base sheet having a conductive layer placed in a mold. FIG. 4 is a sectional view of an electromagnetic shield molded product manufactured by the method shown in FIGS. 1 to 3. FIG. 5 is a sectional view similar to FIG. 4, showing another example of the electromagnetic shielding molded product of the present invention. 1...Base material sheet 2...Conductive layer 3...Plastic layer 4...Peeling layer 5...Injection mold patent applicant Dainippon Printing Co., Ltd. agent Patent attorney Sou Suga Canister 1 Figure 2 Figure 311 Figure 4

Claims (5)

【特許請求の範囲】[Claims] (1)基材シートを真空および(または)圧空成形によ
り成形品の内形または外形に応じた形状に予備成形し、
基材シート予備成形体の内面に導電性塗料を塗布して、
射出成形金型内に置いて溶融プラスチックを射出成形す
ることにより、導電層を一体に有するプラスチック成形
品を得ることを特徴とする電磁波シールド成形品の製造
方法。
(1) Preforming the base sheet into a shape according to the internal or external shape of the molded product by vacuum and/or pressure forming,
Apply conductive paint to the inner surface of the base sheet preform,
1. A method for producing an electromagnetic shielding molded product, which comprises obtaining a plastic molded product integrally having a conductive layer by placing the molten plastic in an injection mold and injection molding the molded product.
(2)表面に化粧層を設けた基材シートを用いて実施す
る特許請求の範囲第1項に記載の方法。
(2) The method according to claim 1, which is carried out using a base sheet provided with a decorative layer on the surface.
(3)基材シートと導電層との間に剥離層を設けておき
、射出成形後、基材シートを剥離する特許請求の範囲第
1項に記載の方法。
(3) The method according to claim 1, wherein a release layer is provided between the base sheet and the conductive layer, and the base sheet is peeled off after injection molding.
(4)剥離層と導電層との間に化粧層または絶縁層を設
けて実施する特許請求の範囲第3項に記載の方法。
(4) The method according to claim 3, which is carried out by providing a decorative layer or an insulating layer between the release layer and the conductive layer.
(5)導電層のプラスチック胴に接する面に接着剤層を
設けて実施する特許請求の範囲第1項ないし第4項のい
ずれかに記載の方法。
(5) The method according to any one of claims 1 to 4, which is carried out by providing an adhesive layer on the surface of the conductive layer that contacts the plastic body.
JP18030785A 1985-08-16 1985-08-16 Process of electromagnetic wave shield molding Pending JPS6241011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18030785A JPS6241011A (en) 1985-08-16 1985-08-16 Process of electromagnetic wave shield molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18030785A JPS6241011A (en) 1985-08-16 1985-08-16 Process of electromagnetic wave shield molding

Publications (1)

Publication Number Publication Date
JPS6241011A true JPS6241011A (en) 1987-02-23

Family

ID=16080919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18030785A Pending JPS6241011A (en) 1985-08-16 1985-08-16 Process of electromagnetic wave shield molding

Country Status (1)

Country Link
JP (1) JPS6241011A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257298A (en) * 1987-04-15 1988-10-25 サカエ理研工業株式会社 Electromagnetic or radio frequency shielded product and manufacture of the same
WO1994014590A1 (en) * 1992-12-27 1994-07-07 Nissha Printing Co., Ltd. Insert molded article, and apparatus and method for producing the insert molded article
EP0633718A1 (en) * 1993-07-07 1995-01-11 Durmont Teppichbodenfabrik Ag Method for manufacturing of shielding of electrical or electronic components, devices, or equipment and shielding device made by said method
JP2006045383A (en) * 2004-08-05 2006-02-16 Mitsubishi Rayon Co Ltd Method for producing electrically-conductive molded product and the electrically-conductive molded product
JP2014060237A (en) * 2012-09-18 2014-04-03 Nec Corp Decorative film, housing including the same, and manufacturing method of housing including the same
KR20160021806A (en) * 2013-06-20 2016-02-26 미츠비시 가스 가가쿠 가부시키가이샤 Film, film molding method, mold, molding comprising film, and molding method therefor
WO2020032339A1 (en) * 2018-07-03 2020-02-13 주식회사 크린앤사이언스 Electromagnetic wave shielding material having metal thin film and liner and method for manufacturing same
CN111716084A (en) * 2020-07-01 2020-09-29 南京工程学院 Manufacturing method of copper/steel composite injection mold with honeycomb and embedded nail interface structure

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257298A (en) * 1987-04-15 1988-10-25 サカエ理研工業株式会社 Electromagnetic or radio frequency shielded product and manufacture of the same
WO1994014590A1 (en) * 1992-12-27 1994-07-07 Nissha Printing Co., Ltd. Insert molded article, and apparatus and method for producing the insert molded article
US5800759A (en) * 1992-12-27 1998-09-01 Nissha Printing Co., Ltd. Insert molded article, and apparatus and method for producing the insert molded article
EP0633718A1 (en) * 1993-07-07 1995-01-11 Durmont Teppichbodenfabrik Ag Method for manufacturing of shielding of electrical or electronic components, devices, or equipment and shielding device made by said method
JP2006045383A (en) * 2004-08-05 2006-02-16 Mitsubishi Rayon Co Ltd Method for producing electrically-conductive molded product and the electrically-conductive molded product
JP2014060237A (en) * 2012-09-18 2014-04-03 Nec Corp Decorative film, housing including the same, and manufacturing method of housing including the same
KR20160021806A (en) * 2013-06-20 2016-02-26 미츠비시 가스 가가쿠 가부시키가이샤 Film, film molding method, mold, molding comprising film, and molding method therefor
WO2020032339A1 (en) * 2018-07-03 2020-02-13 주식회사 크린앤사이언스 Electromagnetic wave shielding material having metal thin film and liner and method for manufacturing same
CN111716084A (en) * 2020-07-01 2020-09-29 南京工程学院 Manufacturing method of copper/steel composite injection mold with honeycomb and embedded nail interface structure
CN111716084B (en) * 2020-07-01 2021-07-27 南京工程学院 Manufacturing method of copper/steel composite injection mold with honeycomb and embedded nail interface structure

Similar Documents

Publication Publication Date Title
JPS6241011A (en) Process of electromagnetic wave shield molding
JP3333677B2 (en) Insert film and method for manufacturing insert molded product using the same
US6455110B1 (en) Electrostatic powder coating on non-conductive plastics
KR100303688B1 (en) Thermoformable Conductive Laminates and Methods
CN101856886B (en) Case
JPS5990994A (en) Method of producing electronic device plastic housing
JPS61225900A (en) Transfer sheet for shielding electromagnetic wave
JPH0636477B2 (en) Electromagnetic wave shielding layer transfer sheet
JPS60217121A (en) Manufacture of electromagnetic shielding plastic housing
JP2612520B2 (en) Method of manufacturing electromagnetic wave shielding molded body
JPS61132307A (en) Manufacture of plastic molded item with metal film
JP3011442B2 (en) Injection molding simultaneous transfer method
JPS60240418A (en) Preparation of plastic container with conductive film
JP2000052375A (en) Preparation of in-mold decorating molded article
JPS60139416A (en) Forming of electromagnetic shield
JPS59215813A (en) Electric conductive sheet and its formed product
JPS61208892A (en) Manufacture of plastic molding with wire network
JP3006906B2 (en) Manufacturing method of injection molded products
JPS60240197A (en) Plastic housing having electromagnetic wave shielding property and method of producing same
JPH07237243A (en) Electric wave shielding housing
JP3048419B2 (en) Manufacturing method of injection molded products
JPS60240198A (en) Plastic housing having electromagnetic wave shielding property and method of producing same
JPS63305596A (en) Electromagnetic shield plastic mold
JPH0490203A (en) Reflecting mirror for parabolic antenna and its manufacture
JPS60240417A (en) Preparation of plastic container with conductive film