WO2020210939A1 - 触控显示基板及其制作方法、显示装置 - Google Patents
触控显示基板及其制作方法、显示装置 Download PDFInfo
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- WO2020210939A1 WO2020210939A1 PCT/CN2019/082655 CN2019082655W WO2020210939A1 WO 2020210939 A1 WO2020210939 A1 WO 2020210939A1 CN 2019082655 W CN2019082655 W CN 2019082655W WO 2020210939 A1 WO2020210939 A1 WO 2020210939A1
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- touch
- electrode
- insulating layer
- signal line
- inorganic insulating
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
Definitions
- the present disclosure relates to the field of display technology, in particular to a touch display substrate, a manufacturing method thereof, and a display device.
- the common electrodes of the touch display substrate are multiplexed as touch electrodes, and the common electrode lines of the touch display substrate are multiplexed as touch signal lines.
- An organic resin layer is spaced between the control electrodes, and the touch signal line is connected to the touch electrode through a via hole penetrating the organic resin layer to realize the touch function.
- the touch electrode is located at the bottom of the via hole and overlaps with the touch signal line. Because the thickness of the organic resin layer is generally relatively large, it leads to the overlap resistance between the touch electrode and the touch signal at the via hole. It is relatively large.
- organic resins are prone to produce volatile matter under high temperature or plasma environment. The volatile matter will also be connected to the electrical connection at the via hole. This will cause a common voltage on the touch electrode when the touch display substrate is displayed. Uneven signal loading and abnormal common voltage signal affect the uniformity of the display.
- the embodiments of the present disclosure provide a touch display substrate, a manufacturing method thereof, and a display device.
- a touch display substrate in one aspect, includes a common electrode and a common electrode line connected to the common electrode, and further includes a touch electrode and a touch signal line connected to the touch electrode, so The common electrode of the touch display substrate is multiplexed as the touch electrode, the common electrode line of the touch display substrate is multiplexed as the touch signal line, and the method further includes: The inorganic insulating layer between the control signal lines, the touch electrode is electrically connected to the touch signal line through the via hole penetrating the inorganic insulating layer, the touch electrode, the inorganic insulating layer and the touch The control signal lines are stacked in sequence.
- the touch display substrate includes a plurality of touch signal lines
- the touch electrode includes a plurality of sub-touch electrodes independent of each other
- the touch signal line and the sub-touch electrode are one by one
- each of the sub touch electrodes is connected to the corresponding touch signal line.
- the thickness of the inorganic insulating layer is not greater than 1000 nanometers.
- the inorganic insulating layer is located on a side of the touch electrode away from the base substrate of the touch display substrate, and the touch signal line is located on a side of the inorganic insulating layer away from the touch electrode. side.
- the touch display substrate specifically includes:
- a thin film transistor array located on the base substrate
- the touch electrode located on the flat layer
- the pixel electrode of the touch display substrate and the touch signal line located on the inorganic insulating layer passes through a via hole penetrating the flat layer and the inorganic insulating layer and the drain of the thin film transistor Connected, the touch signal line is connected to the touch electrode through a via hole penetrating the inorganic insulating layer.
- the touch display substrate further includes:
- a conductive protection pattern located in the via hole and in direct contact with the touch electrode, the touch signal line is in direct contact with the conductive protection pattern, and is electrically connected to the touch electrode through the conductive protection pattern,
- the conductive protection pattern and the pixel electrode are formed through the same patterning process.
- the embodiment of the present disclosure also provides a display device, including the touch display substrate as described above.
- the embodiment of the present disclosure also provides a method for manufacturing a touch display substrate.
- the touch display substrate includes a common electrode and a common electrode line connected to the common electrode, and also includes a touch electrode and a touch electrode connected to the touch electrode.
- the common electrodes are multiplexed as the touch electrodes, and the common electrode lines are multiplexed as the touch signal lines.
- the manufacturing method includes:
- the other one of the touch electrode and the touch signal line is formed, and the touch electrode is electrically connected to the touch signal line through a via hole penetrating the inorganic insulating layer.
- the thickness of the inorganic insulating layer is not greater than 1000 nanometers.
- the manufacturing method specifically includes:
- a touch signal line is formed on the inorganic insulating layer, and the touch signal line is connected to the touch electrode through the via hole.
- the manufacturing method further includes:
- the formation of the touch electrode specifically includes:
- the manufacturing method further includes:
- a pixel electrode of the touch display substrate is formed on the inorganic insulating layer, and the pixel electrode is connected to the drain of the thin film transistor through a via hole penetrating the flat layer and the inorganic insulating layer.
- the manufacturing method further includes:
- Forming the touch signal line includes:
- the touch signal line is formed on the inorganic insulating layer on which the pixel electrode and the conductive protection pattern are formed, and the touch signal line is in direct contact with the conductive protection pattern.
- the touch electrodes are electrically connected.
- FIG. 1 is a schematic diagram of the structure of a conventional touch display substrate
- FIG. 2 is a schematic diagram of the distance between the touch electrode and the pixel electrode in the conventional touch display substrate
- FIG. 3 is a schematic diagram of the connection between touch electrodes and touch signal lines in an embodiment of the disclosure.
- FIG. 4 is a schematic plan view of a touch display substrate according to an embodiment of the disclosure.
- FIG. 5 is a schematic cross-sectional view of a touch display substrate according to an embodiment of the disclosure.
- the existing touch display substrate sequentially includes: a base substrate 1, a light shielding layer 2 located on the base substrate 1, and a light shielding layer 2
- the organic resin layer 8 is the touch electrode 9 located on the organic resin layer 8.
- the touch electrode 9 is connected to the touch signal line 12 through the through hole penetrating the organic resin layer 8; the passivation layer 10 covering the touch electrode 9,
- the pixel electrode 11 is located on the passivation layer 10.
- the pixel electrode 11 is connected to the drain of the thin film transistor through a via hole penetrating the passivation layer 10, the organic resin layer 8 and the planarization layer 7.
- the touch electrode 9 It is also multiplexed as a common electrode, the touch signal line 12 is also multiplexed as a common electrode line, where the touch electrode 9 is multiplexed as a common electrode, that is, the touch electrode 9 is also used as a common electrode, and the touch signal line 12 is multiplexed as The common electrode line, that is, the touch signal line 12 is also used as a common electrode line.
- the touch signal line 12 is arranged between the touch electrode 9 and the base substrate 1. Since the touch electrode 9 needs to be formed on a flat surface, The organic resin layer 8 needs to be provided on the touch signal line 12 to provide a flat surface for the subsequent formation of the touch electrode 9. In addition, in order to insulate the pixel electrode 11 from the touch electrode 9, it is also necessary to provide a covering touch electrode 9 ⁇ Passivation layer 10.
- the touch electrode 9 is located at the bottom of the through hole and overlaps the touch signal line 12. Since the thickness of the organic resin layer 8 is generally relatively large, for example, the thickness is 1.5 um ⁇ 3.0um, resulting in a relatively large overlap resistance between the touch electrode 9 and the touch signal line 12 at the via hole, so that the common voltage signal on the touch electrode 9 will be caused when the touch display substrate performs display Uneven loading and abnormal common voltage signal affect the uniformity of the display.
- the pixel electrode 11 is located on the side of the touch electrode 9 away from the touch signal line 12.
- the distance between the touch electrode 9 and the pixel electrode 11 is D1 is much larger than the distance D2 between the touch electrode 9 and the pixel electrode 11 in other areas, so when the touch display substrate performs display, the driving electric field formed between the touch electrode 9 and the pixel electrode 11 at the via hole is weak.
- the liquid crystal control ability is insufficient, and the color display is prone to be abnormal, and the macroscopic appearance is oblique Mura (bright spot).
- the embodiments of the present disclosure provide a touch display substrate, a manufacturing method thereof, and a display device, which can improve the display effect of the touch display substrate.
- An embodiment of the present disclosure provides a touch display substrate, the touch display substrate includes a common electrode and a common electrode line connected to the common electrode, and also includes a touch electrode and a touch signal line connected to the touch electrode ,
- the common electrode is multiplexed as the touch electrode
- the common electrode line is multiplexed as the touch signal line, further comprising: inorganic insulation between the touch electrode and the touch signal line Layer, the touch electrode is electrically connected to the touch signal line through a via hole penetrating the inorganic insulating layer, and the touch electrode, the inorganic insulating layer and the touch signal line are stacked in sequence.
- the common electrode is multiplexed as touch electrodes, that is, the common electrodes are used as touch electrodes at the same time, and the common electrode lines are multiplexed as touch signal lines, that is, the common electrode lines are used as touch signal lines at the same time.
- the touch electrode is electrically connected to the touch signal line through a via hole penetrating the inorganic insulating layer.
- the thickness of the inorganic insulating layer is smaller.
- the lap resistance between the wires is relatively small, and the inorganic insulating layer will not produce volatile matter under high temperature or plasma environment to affect the electrical connection at the via hole, which can improve the touch control when the touch display substrate performs display.
- the uniformity of the common voltage signal loaded on the electrode improves the display effect of the touch display substrate; and when the touch display substrate performs touch detection, the uniformity of the touch signal loaded on the touch electrode can also be improved to ensure the touch Control the touch effect of the display substrate.
- the thickness of the inorganic insulating layer is relatively small, the distance between the touch electrode and the pixel electrode at the through hole of the inorganic insulating layer is not much different from the distance between the touch electrode and the pixel electrode in other regions, so When the touch display substrate performs display, it can ensure the strength of the driving electric field formed between the touch electrode and the pixel electrode at the via hole, ensure the liquid crystal control ability, avoid color display abnormalities, and solve the oblique mura problem.
- the thickness of the inorganic insulating layer is not greater than 1000 nanometers, and can be tens of nanometers or hundreds of nanometers, so that the overlap resistance between the touch electrode and the touch signal line at the through hole of the inorganic insulating layer is relatively small
- the uniformity of the common voltage signal loaded on the touch electrode can be improved, and the display effect of the touch display substrate can be improved; and when the touch display substrate performs touch detection, the touch The uniformity of the touch signal loaded on the control electrode ensures the touch effect of the touch display substrate. If the thickness of the inorganic insulating layer is too small, it will affect the insulation between the touch electrode and the touch signal line.
- the thickness of the inorganic insulating layer is too large, it will cause the touch electrode and the touch signal at the through hole of the inorganic insulating layer.
- the overlap resistance between the wires is relatively large.
- the thickness of the inorganic insulating layer may be 50-500 nanometers.
- the thickness of the inorganic insulating layer is not limited to be less than 1000 nanometers. If the thickness of the inorganic insulating layer is equal to 1000 nanometers, or slightly greater than 1000 nanometers, as long as the thickness is smaller than the existing organic resin layer, Both can improve the overlap resistance between the touch electrode and the touch signal line at the via hole, and thus can improve the uniformity of the common voltage signal loaded on the touch electrode when the touch display substrate performs display.
- the touch display substrate includes a plurality of touch signal lines
- the touch electrodes include a plurality of sub-touch electrodes independent of each other
- the touch signal lines correspond to the sub-touch electrodes one-to-one
- Each of the sub touch electrodes is connected to the corresponding touch signal line.
- the inorganic insulating layer may be located on a side of the touch electrode away from the base substrate of the touch display substrate, and the touch signal line may be located on a side of the inorganic insulating layer away from the touch electrode.
- the inorganic insulating layer is not limited to be located on the side of the touch electrode away from the base substrate of the touch display substrate, and may also be located on the side of the touch electrode close to the base substrate, and the touch signal line is located on the inorganic The insulating layer is close to the side of the base substrate.
- the arrangement sequence of the inorganic insulating layer, the touch electrode, and the touch signal line is: touch electrode, inorganic insulating layer, touch Signal line.
- touch electrodes need to be formed on a flat surface, a flat layer covering the thin film transistor array is provided on the touch display substrate. According to the above arrangement sequence, the touch electrodes can be formed on the touch display substrate. On the flat layer.
- touch electrode and touch signal line is: touch signal line, inorganic insulating layer, touch electrode, then the touch signal line is formed on the flat layer, and then the inorganic insulating layer is formed , And the touch electrode is formed on the inorganic insulating layer. Due to the small thickness of the inorganic insulating layer, the flatness requirement of the touch electrode may not be met.
- the touch display substrate specifically includes:
- a thin film transistor array located on the base substrate
- the touch electrode located on the flat layer
- the pixel electrode of the touch display substrate and the touch signal line located on the inorganic insulating layer passes through a via hole penetrating the flat layer and the inorganic insulating layer and the drain of the thin film transistor Connected, the touch signal line is connected to the touch electrode through a via hole penetrating the inorganic insulating layer.
- the positions of the pixel electrode and the touch signal line do not conflict, that is, the orthographic projection of the pixel electrode on the base substrate and the touch
- the orthographic projection of the control signal line on the base substrate does not overlap, so that the pixel electrode and the touch signal line can be insulated without layering the pixel electrode and the touch signal line.
- the pixel electrode and the touch signal line can be They are all arranged on the inorganic insulating layer, so that the inorganic insulating layer can isolate the pixel electrode and the touch electrode, as well as the touch electrode and the touch signal line, eliminating the need for an insulating film layer that separates the pixel electrode and the touch signal line. It can simplify the structure of the touch display substrate, reduce the number of patterning processes for manufacturing the touch display substrate, and reduce the manufacturing cost of the touch display substrate.
- the touch display substrate further includes:
- a conductive protection pattern located in the via hole and in direct contact with the touch electrode, the touch signal line is in direct contact with the conductive protection pattern, and is electrically connected to the touch electrode through the conductive protection pattern,
- the conductive protection pattern and the pixel electrode are formed through the same patterning process.
- the pixel electrode is formed before forming the touch signal line, when the pixel electrode is etched, the etching solution of the pixel electrode is likely to damage the touch electrode exposed at the via hole.
- the pixel electrode is formed At the same time, the material of the pixel electrode is used to form a conductive protection pattern that directly contacts the touch electrode at the via hole.
- the conductive protection pattern can protect the touch electrode exposed at the via hole so that the etching solution forming the pixel electrode will not Contact with the touch electrode to avoid damage to the touch electrode exposed at the via hole, and to ensure the electrical connection state of the touch signal line and the touch electrode.
- the embodiment of the present disclosure also provides a display device, including the touch display substrate as described above.
- the display device may be any product or component with a display function such as LCD TV, LCD, digital photo frame, mobile phone, tablet computer, etc., wherein the display device also includes flexible circuit board, printed circuit board, backplane, radio frequency Unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, power supply and other components.
- the structure of the above display device does not constitute a limitation on the display device, and the display device may include more or less of the above components, or combine some components, or arrange different components.
- the embodiment of the present disclosure also provides a method for manufacturing a touch display substrate.
- the touch display substrate includes a common electrode and a common electrode line connected to the common electrode, and also includes a touch electrode and a touch electrode connected to the touch electrode.
- the common electrodes are multiplexed as the touch electrodes, and the common electrode lines are multiplexed as the touch signal lines.
- the manufacturing method includes:
- the other one of the touch electrode and the touch signal line is formed, and the touch electrode is electrically connected to the touch signal line through a via hole penetrating the inorganic insulating layer.
- the common electrode is multiplexed as touch electrodes, that is, the common electrodes are used as touch electrodes at the same time, and the common electrode lines are multiplexed as touch signal lines, that is, the common electrode lines are used as touch signal lines at the same time.
- the touch electrode is electrically connected to the touch signal line through a via hole penetrating the inorganic insulating layer.
- the thickness of the inorganic insulating layer is smaller.
- the lap resistance between the wires is relatively small, and the inorganic insulating layer will not produce volatile matter under high temperature or plasma environment to affect the electrical connection at the via hole, which can improve the touch control when the touch display substrate performs display.
- the uniformity of the common voltage signal loaded on the electrode improves the display effect of the touch display substrate; and when the touch display substrate performs touch detection, the uniformity of the touch signal loaded on the touch electrode can also be improved to ensure the touch Control the touch effect of the display substrate.
- the manufacturing method specifically includes:
- a touch signal line is formed on the inorganic insulating layer, and the touch signal line is connected to the touch electrode through the via hole.
- the thickness of the inorganic insulating layer is relatively small, the distance between the touch electrode and the pixel electrode at the through hole of the inorganic insulating layer is not much different from the distance between the touch electrode and the pixel electrode in other regions, so When the touch display substrate performs display, it can ensure the strength of the driving electric field formed between the touch electrode and the pixel electrode at the via hole, ensure the liquid crystal control ability, avoid color display abnormalities, and solve the oblique mura problem.
- the thickness of the inorganic insulating layer is not greater than 1000 nanometers, and can be tens of nanometers or hundreds of nanometers, so that the overlap resistance between the touch electrode and the touch signal line at the through hole of the inorganic insulating layer is relatively small
- the uniformity of the common voltage signal loaded on the touch electrode can be improved, and the display effect of the touch display substrate can be improved; and when the touch display substrate performs touch detection, the touch The uniformity of the touch signal loaded on the control electrode ensures the touch effect of the touch display substrate. If the thickness of the inorganic insulating layer is too small, it will affect the insulation between the touch electrode and the touch signal line.
- the thickness of the inorganic insulating layer is too large, it will cause the touch electrode and the touch signal at the through hole of the inorganic insulating layer.
- the overlap resistance between the wires is relatively large.
- the thickness of the inorganic insulating layer may be 50-500 nanometers.
- the thickness of the inorganic insulating layer is not limited to be less than 1000 nanometers. If the thickness of the inorganic insulating layer is equal to 1000 nanometers, or slightly greater than 1000 nanometers, as long as the thickness is smaller than the existing organic resin layer, Both can improve the overlap resistance between the touch electrode and the touch signal line at the via hole, and thus can improve the uniformity of the common voltage signal loaded on the touch electrode when the touch display substrate performs display.
- the inorganic insulating layer may be located on a side of the touch electrode away from the base substrate of the touch display substrate, and the touch signal line may be located on a side of the inorganic insulating layer away from the touch electrode.
- the inorganic insulating layer is not limited to be located on the side of the touch electrode away from the base substrate of the touch display substrate, and may also be located on the side of the touch electrode close to the base substrate, and the touch signal line is located on the inorganic The insulating layer is close to the side of the base substrate.
- the arrangement sequence of the inorganic insulating layer, the touch electrode, and the touch signal line is: touch electrode, inorganic insulating layer, touch Signal line.
- touch electrodes need to be formed on a flat surface, a flat layer covering the thin film transistor array is provided on the touch display substrate. According to the above arrangement sequence, the touch electrodes can be formed on the touch display substrate. On the flat layer.
- touch electrode and touch signal line is: touch signal line, inorganic insulating layer, touch electrode, then the touch signal line is formed on the flat layer, and then the inorganic insulating layer is formed , And the touch electrode is formed on the inorganic insulating layer. Due to the small thickness of the inorganic insulating layer, the flatness requirement of the touch electrode may not be met.
- the manufacturing method further includes:
- the formation of the touch electrode specifically includes:
- the manufacturing method further includes:
- a pixel electrode of the touch display substrate is formed on the inorganic insulating layer, and the pixel electrode is connected to the drain of the thin film transistor through a via hole penetrating the flat layer and the inorganic insulating layer.
- the positions of the pixel electrode and the touch signal line do not conflict, that is, the orthographic projection of the pixel electrode on the base substrate and the touch
- the orthographic projection of the control signal line on the base substrate does not overlap, so that the pixel electrode and the touch signal line can be insulated without layering the pixel electrode and the touch signal line.
- the pixel electrode and the touch signal line can be They are all arranged on the inorganic insulating layer, so that the inorganic insulating layer can isolate the pixel electrode and the touch electrode, as well as the touch electrode and the touch signal line, eliminating the need for an insulating film layer that separates the pixel electrode and the touch signal line. It can simplify the structure of the touch display substrate, reduce the number of patterning processes for manufacturing the touch display substrate, and reduce the manufacturing cost of the touch display substrate.
- the manufacturing method further includes:
- Forming the touch signal line includes:
- the touch signal line is formed on the inorganic insulating layer on which the pixel electrode and the conductive protection pattern are formed, and the touch signal line is in direct contact with the conductive protection pattern.
- the touch electrodes are electrically connected.
- the pixel electrode is formed before forming the touch signal line, when the pixel electrode is etched, the etching solution of the pixel electrode is likely to damage the touch electrode exposed at the via hole.
- the pixel electrode is formed At the same time, the material of the pixel electrode is used to form a conductive protection pattern that directly contacts the touch electrode at the via hole.
- the conductive protection pattern can protect the touch electrode exposed at the via hole so that the etching solution forming the pixel electrode will not Contact with the touch electrode to avoid damage to the touch electrode exposed at the via hole, and to ensure the electrical connection state of the touch signal line and the touch electrode.
- the manufacturing method of the touch display substrate of this embodiment includes the following steps:
- Step 1 Provide a base substrate 1 and form a light-shielding layer 2 on the base substrate 1;
- the base substrate 1 may be a glass substrate or a quartz substrate.
- the light shielding layer 2 can be made of opaque metal or light shielding insulating material to shield the active layer of the thin film transistor.
- the orthographic projection of the active layer of the thin film transistor on the base substrate 1 falls into the light shielding layer 2 on the base substrate.
- the light shielding layer 2 can prevent the light emitted by the backlight module from irradiating the active layer of the thin film transistor, which affects the performance of the thin film transistor.
- Step 2 Form a buffer layer 3;
- the buffer layer 3 can be made of inorganic insulating materials, and the inorganic insulating materials can be oxides, nitrides or oxynitride compounds.
- the buffer layer 3 can prevent the metal ions in the base substrate 1 from moving into the thin film transistors and affect the performance of the thin film transistors.
- Step 3 Form the active layer 4;
- a layer of semiconductor material can be deposited on the buffer layer 3, the semiconductor material can be a-Si, a layer of photoresist is coated on the semiconductor material, and a mask is used to expose the photoresist to make the photoresist Forming a photoresist unreserved area and a photoresist fully reserved area, wherein the photoresist fully reserved area corresponds to the area where the pattern of the active layer is located, and the unreserved photoresist area corresponds to the area outside the pattern of the active layer; After the development process, the photoresist in the unreserved area of the photoresist is completely removed, the thickness of the photoresist in the completely reserved area of the photoresist remains unchanged, and the semiconductor material in the unreserved area of the photoresist is completely etched by the etching process , Forming the pattern of the active layer 4, which serves as the active layer of the thin film transistor switch in the pixel area and the GOA area.
- Step 4 Form a gate insulating layer 5;
- a plasma-enhanced chemical vapor deposition (PECVD) method can be used to deposit a thickness of
- the gate insulating layer 5 can be selected from oxides, nitrides or oxynitride compounds, and the corresponding reaction gas is SiH 4 , NH 3 , N 2 or SiH 2 Cl 2 , NH 3 , N 2 .
- Step 5 Form a gate metal layer pattern 15;
- the gate metal layer can be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W and other metals and alloys of these metals.
- the gate metal layer can be a single layer structure or multiple layers Structure, multilayer structure such as Cu ⁇ Mo, Ti ⁇ Cu ⁇ Ti, Mo ⁇ Al ⁇ Mo, etc.
- the photoresist Coat a layer of photoresist on the gate metal layer, and use a mask to expose the photoresist so that the photoresist forms a photoresist unreserved area and a photoresist reserved area, where the photoresist reserved area corresponds to In the area where the gate metal layer pattern 15 is located, the unreserved area of the photoresist corresponds to the area other than the above pattern; the development process is performed, the photoresist in the unreserved area of the photoresist is completely removed, and the photoresist in the remaining area of the photoresist The thickness remains unchanged; the gate metal film in the unreserved area of the photoresist is completely etched by an etching process, and the remaining photoresist is stripped to form a gate metal layer pattern 15, which includes a gate line and a gate electrode, It can control the conduction of thin film transistors.
- Step 6 Form an interlayer insulating layer 6;
- the interlayer insulating layer 6 can be selected from oxides, nitrides or oxynitride compounds, and the corresponding reaction gases are SiH 4 , NH 3 , N 2 or SiH 2 Cl 2 , NH 3 , N 2 .
- the interlayer insulating layer 6 is used to achieve insulation between the gate metal pattern 15 and the source/drain metal layer 13.
- Step 7 Form source and drain metal layer patterns 13;
- the source and drain metal layers can be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W and other metals and alloys of these metals.
- the source/drain metal layer may be a single-layer structure or a multilayer structure, such as Cu ⁇ Mo, Ti ⁇ Cu ⁇ Ti, Mo ⁇ Al ⁇ Mo, etc.
- the unreserved photoresist area corresponds to the area other than the above pattern; the development process is performed, the photoresist in the unreserved photoresist area is completely removed, and the photoresist in the remaining area is completely removed.
- the thickness of the resist remains unchanged; the source and drain metal layers in the unreserved areas of the photoresist are completely etched by the etching process, and the remaining photoresist is stripped to form a source and drain metal layer pattern 13, which includes leakage Electrode, source electrode and data line.
- Step 8 Form a flat layer 7;
- a layer of organic resin can be coated on the base substrate 1 after step 7 as the flat layer 7, and the flat layer formed by the organic resin has better flatness.
- Step 9 Form touch electrodes 9;
- the deposition thickness on the flat layer 7 by sputtering or thermal evaporation is about
- the transparent conductive layer can be ITO, IZO or other transparent metal oxides
- a layer of photoresist is coated on the transparent conductive layer, and the photoresist is exposed with a mask to form the photoresist
- the photoresist unreserved area and the photoresist reserved area where the photoresist reserved area corresponds to the area where the touch electrode 9 is located, and the photoresist unreserved area corresponds to the area outside the above pattern; the development process is performed, and the photoresist The photoresist in the unreserved area is completely removed, and the thickness of the photoresist in the reserved area of the photoresist remains unchanged; the transparent conductive layer film in the unreserved area of the photoresist is completely etched by the etching process, and the remaining photoresist is stripped Glue is used to form touch electrodes 9, which are
- Step 10 Form a passivation layer 10
- the passivation layer can be selected from oxides, nitrides or oxynitride compounds.
- the passivation layer material can be SiNx, SiOx or Si(ON)x, and the passivation layer can also be Al 2 O 3 .
- the passivation layer can be a single-layer structure or a two-layer structure composed of silicon nitride and silicon oxide.
- the reaction gas corresponding to the silicon oxide may be SiH 4 , N 2 O; the corresponding gas of the nitride or oxygen nitrogen compound may be SiH 4 , NH 3 , N 2 or SiH 2 Cl 2 , NH 3 , N 2 .
- the passivation layer 10 and the flat layer 7 are patterned to form pixel electrode via holes exposing the drain electrode and touch electrode via holes exposing the touch electrode.
- Step 11 Form the pixel electrode 11 and the conductive protection pattern 16;
- the deposition thickness on the base substrate 1 after step 10 is about
- the transparent conductive layer the transparent conductive layer can be ITO, IZO or other transparent metal oxides
- a layer of photoresist is coated on the transparent conductive layer, and the photoresist is exposed by a mask to form the photoresist
- the photoresist unreserved area and the photoresist reserved area wherein the photoresist reserved area corresponds to the area where the pattern of the pixel electrode 11 and the conductive protection pattern 16 are located, and the photoresist unreserved area corresponds to the area other than the aforementioned pattern;
- the photoresist in the unreserved area of the photoresist is completely removed, and the thickness of the photoresist in the reserved area of the photoresist remains unchanged;
- the transparent conductive layer film in the unreserved area of the photoresist is completely etched by the etching process , Peeling off the remaining photoresist to form patterns of the
- Step 12 forming a touch signal line 12.
- the metal layer can be Cu, Al, Ag, Mo, Cr, Nd, Ni, Mn, Ti, Ta, W and other metals and alloys of these metals.
- the metal layer can be a single-layer structure or a multilayer structure, such as Cu ⁇ Mo, Ti ⁇ Cu ⁇ Ti, Mo ⁇ Al ⁇ Mo, etc.
- the unreserved photoresist area corresponds to the area other than the above-mentioned pattern; the development process is performed, the photoresist in the unreserved photoresist area is completely removed, and the photoresist remaining area is photoetched The thickness of the glue remains unchanged; the metal layer in the unreserved area of the photoresist is completely etched by the etching process, and the remaining photoresist is stripped to form the touch signal line 12, which is connected to the touch signal line through the conductive protection pattern 16
- the control electrode 9 is electrically connected.
- each touch signal line 12 is connected to one sub touch electrode, and each touch signal line 12 can be connected to one sub touch electrode through a plurality of touch electrode vias 14.
- the touch display substrate of this embodiment sequentially includes: a base substrate 1, a light shielding layer 2 on the base substrate 1, and The buffer layer 3 located on the light shielding layer 2, the active layer 4 located on the buffer layer 3, the gate insulating layer 5, the interlayer insulating layer 6, the flat layer 7, the touch electrode 9 located on the flat layer 7, covering the touch
- the passivation layer 10 of the electrode 9 that is, the above-mentioned inorganic insulating layer
- the pixel electrode 11 and the conductive protection pattern 16 on the passivation layer 10
- the touch electrode is electrically connected to the touch signal line through the via hole penetrating the passivation layer.
- the thickness of the passivation layer is relatively small, generally less than 1 micron, ranging from tens of nanometers to hundreds of nanometers.
- the uniformity of the common voltage signal loaded on the touch electrode can be improved, and the display effect of the touch display substrate can be improved; and when the touch display substrate performs touch detection, it can also improve The uniformity of the touch signal loaded on the touch electrode ensures the touch effect of the touch display substrate.
- the thickness of the passivation layer is relatively small, the distance between the touch electrode and the pixel electrode at the via hole of the passivation layer is not much different from the distance between the touch electrode and the pixel electrode in other regions, so that When the touch display substrate performs display, it can ensure the strength of the driving electric field formed between the touch electrode and the pixel electrode at the via hole, ensure the liquid crystal control ability, avoid color display abnormalities, and solve the oblique mura problem.
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Abstract
Description
Claims (12)
- 一种触控显示基板,所述触控显示基板包括公共电极和与公共电极连接的公共电极线,还包括触控电极和与所述触控电极连接的触控信号线,所述公共电极复用为所述触控电极,所述公共电极线复用为所述触控信号线,其中,还包括:位于所述触控电极和所述触控信号线之间的无机绝缘层,所述触控电极通过贯穿所述无机绝缘层的过孔与所述触控信号线电连接,所述触控电极、所述无机绝缘层和所述触控信号线依次层叠设置。
- 根据权利要求1所述的触控显示基板,其中,所述触控显示基板包括有多条触控信号线,所述触控电极包括多个相互独立的子触控电极,所述触控信号线与所述子触控电极一一对应,每一所述子触控电极与对应的所述触控信号线连接。
- 根据权利要求1所述的触控显示基板,其中,所述无机绝缘层的厚度不大于1000纳米。
- 根据权利要求1所述的触控显示基板,其中,所述无机绝缘层位于所述触控电极远离所述触控显示基板的衬底基板的一侧,所述触控信号线位于所述无机绝缘层远离所述触控电极的一侧。
- 根据权利要求4所述的触控显示基板,其中,所述触控显示基板具体包括:衬底基板;位于所述衬底基板上的薄膜晶体管阵列;覆盖所述薄膜晶体管阵列的平坦层;位于所述平坦层上的所述触控电极;覆盖所述触控电极的无机绝缘层;位于所述无机绝缘层上的所述触控显示基板的像素电极和所述触控信号线,所述像素电极通过贯穿所述平坦层和所述无机绝缘层的过孔与薄膜晶体管的漏极连接,所述触控信号线通过贯穿所述无机绝缘层的过孔与所述触控电极连接。
- 根据权利要求5所述的触控显示基板,其中,所述触控显示基板还包 括:位于所述过孔内、与所述触控电极直接接触的导电保护图形,所述触控信号线与所述导电保护图形直接接触,通过所述导电保护图形与所述触控电极电连接,所述导电保护图形与所述像素电极通过同一次构图工艺形成。
- 一种显示装置,其中,包括如权利要求1-6中任一项所述的触控显示基板。
- 一种触控显示基板的制作方法,所述触控显示基板包括公共电极和与公共电极连接的公共电极线,还包括触控电极和与所述触控电极连接的触控信号线,所述公共电极复用为所述触控电极,所述公共电极线复用为所述触控信号线,其中,所述制作方法包括:形成所述触控电极和所述触控信号线中的任一者;形成无机绝缘层,对所述无机绝缘层进行构图形成过孔;形成所述触控电极和所述触控信号线中的另一者,所述触控电极通过贯穿所述无机绝缘层的过孔与所述触控信号线电连接。
- 根据权利要求8所述的触控显示基板的制作方法,其中,所述无机绝缘层的厚度不大于1000纳米。
- 根据权利要求8所述的触控显示基板的制作方法,其中,所述制作方法具体包括:形成所述触控电极;形成覆盖所述触控电极的无机绝缘层,对所述无机绝缘层进行构图,形成暴露出所述触控电极的所述过孔;在所述无机绝缘层上形成触控信号线,所述触控信号线通过所述过孔与所述触控电极连接。
- 根据权利要求10所述的触控显示基板的制作方法,其中,形成所述触控电极之前,所述制作方法还包括:提供一衬底基板,在所述衬底基板上形成薄膜晶体管阵列;形成覆盖所述薄膜晶体管阵列的平坦层;形成所述触控电极具体为:在所述平坦层上形成所述触控电极;形成所述无机绝缘层之后,在所述无机绝缘层上形成触控信号线之前,所述制作方法还包括:在所述无机绝缘层上形成所述触控显示基板的像素电极,所述像素电极通过贯穿所述平坦层和所述无机绝缘层的过孔与薄膜晶体管的漏极连接。
- 根据权利要求11所述的触控显示基板的制作方法,其中,在形成所述像素电极的同一次构图工艺中,所述制作方法还包括:形成位于所述过孔内、与所述触控电极直接接触的导电保护图形;形成所述触控信号线包括:在形成有所述像素电极和所述导电保护图形的无机绝缘层上形成所述触控信号线,所述触控信号线与所述导电保护图形直接接触,通过所述导电保护图形与所述触控电极电连接。
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PCT/CN2019/082655 WO2020210939A1 (zh) | 2019-04-15 | 2019-04-15 | 触控显示基板及其制作方法、显示装置 |
US16/763,105 US20200348784A1 (en) | 2019-04-15 | 2019-04-15 | Touch display substrate, method of manufacturing the same and display device |
CN201980000498.2A CN112352316A (zh) | 2019-04-15 | 2019-04-15 | 触控显示基板及其制作方法、显示装置 |
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CN109192136B (zh) | 2018-10-25 | 2020-12-22 | 京东方科技集团股份有限公司 | 显示基板、光场显示装置及其驱动方法 |
US11727859B2 (en) | 2018-10-25 | 2023-08-15 | Boe Technology Group Co., Ltd. | Display panel and display device |
CN109461405B (zh) * | 2018-11-13 | 2021-01-26 | 京东方科技集团股份有限公司 | 阵列基板和光场显示装置 |
US11804514B2 (en) | 2018-11-13 | 2023-10-31 | Boe Technology Group Co., Ltd. | Array substrate and light field display device with overlapping signal lines |
CN113064505A (zh) * | 2021-03-01 | 2021-07-02 | 武汉华星光电半导体显示技术有限公司 | 触控显示面板及触控显示装置 |
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CN104600030A (zh) * | 2015-02-02 | 2015-05-06 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
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CN108598087A (zh) * | 2018-04-26 | 2018-09-28 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示面板、电子装置 |
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2019
- 2019-04-15 WO PCT/CN2019/082655 patent/WO2020210939A1/zh active Application Filing
- 2019-04-15 US US16/763,105 patent/US20200348784A1/en not_active Abandoned
- 2019-04-15 CN CN201980000498.2A patent/CN112352316A/zh not_active Withdrawn
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CN105405851A (zh) * | 2014-09-05 | 2016-03-16 | 乐金显示有限公司 | 薄膜晶体管基板及其制造方法 |
CN104600030A (zh) * | 2015-02-02 | 2015-05-06 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
US20180203313A1 (en) * | 2016-05-25 | 2018-07-19 | Boe Technology Group Co., Ltd. | Array substrate, display device and manufacturing method for the array substrate |
CN108598087A (zh) * | 2018-04-26 | 2018-09-28 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示面板、电子装置 |
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