WO2020191891A1 - Appareil d'affichage à diodes électroluminescentes organiques et son procédé de fabrication, et dispositif électronique - Google Patents

Appareil d'affichage à diodes électroluminescentes organiques et son procédé de fabrication, et dispositif électronique Download PDF

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Publication number
WO2020191891A1
WO2020191891A1 PCT/CN2019/086953 CN2019086953W WO2020191891A1 WO 2020191891 A1 WO2020191891 A1 WO 2020191891A1 CN 2019086953 W CN2019086953 W CN 2019086953W WO 2020191891 A1 WO2020191891 A1 WO 2020191891A1
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WIPO (PCT)
Prior art keywords
isolation portion
light emitting
layer
organic light
emitting diode
Prior art date
Application number
PCT/CN2019/086953
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English (en)
Chinese (zh)
Inventor
张明
杨杰
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/495,402 priority Critical patent/US11282904B2/en
Publication of WO2020191891A1 publication Critical patent/WO2020191891A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • This application relates to the field of display technology, and in particular to an organic light emitting diode display device, a manufacturing method thereof, and electronic equipment.
  • OLED Organic Light-Emitting Diode
  • mobile phones For display devices such as mobile phones, increasing their screen-to-body ratio to improve their appearance has become a mainstream design.
  • mobile phones In addition to the display area for display, mobile phones also need components such as a camera, earpiece, and microphone to realize functions such as taking pictures and voice calls.
  • the camera, earpiece, and microphone reduce the screen-to-body ratio of the mobile phone.
  • laser cutting technology to realize an under-screen camera is one of the methods to increase the screen-to-body ratio.
  • laser cutting technology will cause the reliability of its packaging to deteriorate, thereby affecting the display effect of the organic light emitting diode display device.
  • the purpose of the present application is to provide an organic light emitting diode display device, a manufacturing method thereof, and electronic equipment.
  • the organic light emitting diode display device has a high screen-to-body ratio and good packaging reliability.
  • An organic light emitting diode display device comprising:
  • a substrate having a hollow area, a display area located on the periphery of the hollow area, and a non-display area between the hollow area and the display area;
  • the isolation portion is disposed on the substrate of the non-display area, and the isolation portion is used to isolate the first light-emitting device layer and the second light-emitting device layer;
  • a light-emitting device layer includes the first light-emitting device layer and the second light-emitting device layer, the first light-emitting device layer is formed on the side of the isolation portion close to the display area On the substrate, the second light emitting device layer is formed on the substrate on the side of the isolation portion close to the hollow area;
  • An encapsulation layer covering the light emitting device layer, the isolation portion and the substrate;
  • a through hole is located in the hollow area and penetrates the substrate, the second light emitting device layer and the packaging layer.
  • the isolation portion includes a first isolation portion and a second isolation portion, the first isolation portion is located on a side close to the display area, and the second isolation portion is located close to the One side of the through hole.
  • the distance between the first isolation portion and the second isolation portion is greater than 100 micrometers.
  • the organic light-emitting diode display device further includes a blocking portion disposed on the substrate of the non-display area, and the blocking portion and the isolation portion are disposed in the same layer and located in the same layer. Between the first isolation portion and the second isolation portion, the height of the blocking portion is smaller than the height of the first isolation portion and the second isolation portion.
  • the blocking parts there are a plurality of the blocking parts, and the plurality of blocking parts are alternately arranged between the first isolation part and the second isolation part.
  • the longitudinal section of the blocking portion is at least one of a triangle, a semicircle, a trapezoid, a rectangle, or an irregular pattern.
  • the encapsulation layer includes an inorganic layer, and the inorganic layer covers the light emitting device layer, the isolation portion, and the substrate.
  • the inorganic layer is formed by atomic layer deposition or atomic layer implantation.
  • the longitudinal section of the isolation portion is an inverted trapezoid.
  • a manufacturing method of an organic light emitting diode display device includes the following steps:
  • the substrate having a hollow area, a display area located at the periphery of the hollow area, and a non-display area between the hollow area and the display area;
  • a light-emitting device layer is formed on the substrate, the light-emitting device layer includes the first light-emitting device layer and the second light-emitting device layer, and the first light-emitting device layer is formed at the isolation portion close to the display On the substrate on the side of the region, the second light emitting device layer is formed on the substrate on the side of the isolation portion close to the hollow region;
  • a through hole penetrating through the substrate, the second light emitting device layer and the packaging layer is formed in the hollow area.
  • the isolation portion includes a first isolation portion and a second isolation portion, the first isolation portion is located on a side close to the display area, and the second isolation portion is located Close to the side of the through hole.
  • the distance between the first isolation portion and the second isolation portion is greater than 100 micrometers.
  • the manufacturing method further includes: forming a barrier portion between the first isolation portion and the second isolation portion, and the barrier portion is in the same layer as the isolation portion Is arranged and located between the first isolation portion and the second isolation portion, and the height of the blocking portion is smaller than the height of the first isolation portion and the second isolation portion.
  • the longitudinal section of the blocking portion is at least one of a triangle, a semicircle, a trapezoid, a rectangle, or an irregular pattern.
  • the manufacturing method further includes: forming a first inorganic insulating layer covering the light emitting device layer, the isolation portion, and the substrate.
  • the first inorganic insulating layer is formed by atomic layer deposition or atomic layer implantation.
  • the longitudinal section of the isolation portion is an inverted trapezoid.
  • An electronic device comprising the above-mentioned organic light emitting diode display device and a camera, the camera being embedded in the through hole of the organic light emitting diode display device.
  • the present application provides an organic light-emitting diode display device, a manufacturing method thereof, and electronic equipment.
  • the first light-emitting device layer located on the side of the isolation portion close to the display area and the second light-emitting device located on the side of the isolation portion close to the through hole are provided by the isolation portion.
  • the layers are isolated, and then the encapsulation layer is used to cover the light-emitting device layer, the isolation part and the substrate so that the organic light-emitting diode display device has a high screen-to-body ratio and good packaging reliability.
  • FIG. 1 is a top view of an organic light emitting diode display device according to an embodiment of the application
  • FIG. 2 is a first cross-sectional view taken along the A-A tangent line of the organic light emitting diode display device shown in FIG. 1;
  • FIG. 3 is a top view of an isolation part in the organic light emitting diode display device shown in FIG. 2;
  • FIG. 4 is a second cross-sectional view taken along the A-A tangent line of the organic light emitting diode display device shown in FIG. 1;
  • FIG. 5 is a third cross-sectional view taken along the A-A tangent line of the organic light emitting diode display device shown in FIG. 1;
  • Figure 6 is a fourth cross-sectional view taken along the A-A tangent line of the organic light emitting diode display device shown in Figure 1;
  • FIG. 7 is a flowchart of a manufacturing method of an organic light emitting diode display device according to an embodiment of the application.
  • FIG. 1 is a top view of an organic light emitting diode display device according to an embodiment of the application.
  • the organic light emitting diode display device has a hollow area 100a, a display area 100b, and a non-display area 100c.
  • the display area 100b is used for displaying images, and the display area 100b is located at the periphery of the hollow area 100a.
  • the hollow area 100a may be located in the middle of the display area 100b or at the corner of the display area 100b.
  • the hollow area 100a has a through hole 100d that penetrates the thickness direction of the organic light emitting diode display device.
  • the organic light emitting diode display device realizes a high screen-to-body ratio.
  • the non-display area 100c is located between the hollow area 100a and the display area 100b.
  • FIG. 2 is a first cross-sectional view taken along the line A-A in the organic light emitting diode display device shown in FIG. 1.
  • the organic light emitting diode display device includes a substrate 10, a light emitting device layer 11, an isolation part, an encapsulation layer 13, a barrier wall 14, an anti-crack part 15 and a through hole 100d.
  • the substrate 10 has a hollow area 100a, a display area 100b located at the periphery of the hollow area 100a, and a non-display area 100c located between the hollow area 100a and the display area 100b.
  • the substrate 10 may be a glass substrate, a flexible substrate, and a flexible substrate.
  • the flexible substrate may be a polyimide substrate or a polyethylene terephthalate substrate.
  • the light emitting device layer 11 is used to generate visible light to display an image. Before forming the light-emitting device layer 11, an isolation portion is formed on the substrate 10, and the isolation portion divides the light-emitting device layer 11 into a first light-emitting device layer 111 and a second light-emitting device layer 112. The device layer 112 is formed by the same process and the same layer.
  • the first light emitting device layer 111 is formed on the substrate 10 on the side of the isolation portion close to the display area 100b
  • the second light emitting device layer 112 is formed on the substrate 10 on the side of the isolation portion close to the hollow area 100a.
  • the first light-emitting device layer 111 covers the substrate 10 of the display area 100b and partially covers the substrate 10 of the non-display area 100c
  • the second light-emitting device layer 112 covers the substrate 10 of the non-display area 100c and is formed on the barrier wall 14.
  • the light emitting device layer 11 further includes a third light emitting device layer 113a formed on the substrate 10 between the first isolation portion 121 and the second isolation portion 122, and a fourth light emitting device layer 113b formed on the isolation portion.
  • the light emitting device layer 11 is an organic light emitting diode layer.
  • the organic light emitting diode includes an anode, a cathode, and an organic light emitting layer between the anode and the cathode.
  • a hole transport layer and/or a hole injection layer can also be provided between the anode and the organic light emitting layer, and an electron transport layer and/or an electron injection layer can also be provided between the cathode and the organic light emitting layer.
  • the anode can be made of metal and/or indium tin oxide.
  • the cathode can be made of metal and/or indium tin oxide.
  • Metals include but are not limited to silver and magnesium.
  • the organic light emitting layer may include a red organic light emitting material, a green organic light emitting material, a blue organic light emitting material, and a white organic light emitting material. Since organic light-emitting materials and metals constituting the cathode or anode are sensitive to water vapor and oxygen, it is necessary to isolate the light-emitting device layer from water vapor and oxygen to increase the service life of the organic light-emitting diode display device.
  • FIG. 3 is a top view of the isolation portion in the organic light emitting diode display device shown in FIG. 2.
  • the isolation part is used to isolate the first light-emitting device layer 111 and the second light-emitting device layer 112 to prevent water vapor and oxygen from being transmitted through the second light-emitting device layer 112 in the non-display area 100c to the first light-emitting device in the display area 100b
  • the layer 111 affects the service life and display effect of the organic light emitting diode display device.
  • the number of the isolation parts may be multiple, the isolation parts are arranged around the hollow area 100a, the longitudinal section of the isolation parts is an inverted trapezoid, and the isolation parts may also be other structures with a wide vertical section and a narrow bottom.
  • the isolation portion is disposed on the substrate 10 in the non-display area 100c.
  • the isolation portion includes a first isolation portion 121 and a second isolation portion 122.
  • the first isolation portion 121 is located on a side close to the display area 100b, and the second isolation portion 122 is located close to One side of the through hole 100d.
  • the heights of the first isolation portion 121 and the second isolation portion 122 are the same.
  • the first isolation portion 121 and the second isolation portion 122 are both ring-shaped, the second isolation portion 122 is disposed around the hollow area 100 a, and the first isolation portion 121 is disposed around the second isolation portion 122.
  • the distance between the first isolation portion 121 and the second isolation portion 122 is greater than 100 micrometers to ensure an effective lateral encapsulation path of the encapsulation layer 13 encapsulating the light-emitting device layer 11.
  • the second isolation portion 122 also functions to block water vapor and oxygen.
  • the preparation material of the isolation part is an organic material, and the isolation part is made of a negative photoresist material through exposure and development, and its height is 0.5 micrometers to 10 micrometers.
  • the encapsulation layer 13 is used to encapsulate the light emitting device layer 11.
  • the encapsulation layer 13 covers the light emitting device layer 11, the isolation portion, and the substrate 10.
  • the encapsulation layer 13 includes a first inorganic insulating layer 131, a first organic insulating layer 132 and a second inorganic insulating layer 133.
  • the first inorganic insulating layer 131 is formed by a process with excellent step cover, so that the first inorganic insulating layer 131 can cover the light-emitting device layer 11 and at the same time cover the entire isolation portion, including the sides of the isolation portion.
  • the continuous first inorganic insulating layer 131 is formed, thereby improving the packaging reliability of the light emitting device layer 11.
  • the first inorganic insulating layer 131 is formed by a process with excellent step coverage such as atomic layer deposition or atomic implantation.
  • the first inorganic insulating layer 131 is at least one of a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, and an aluminum oxide layer.
  • the first organic insulating layer 132 is formed on the surface of the first inorganic insulating layer 131.
  • the first organic insulating layer 132 is used to make the surface of the encapsulation layer 13 flatter.
  • the first organic insulating layer 132 can be formed by inkjet printing.
  • the second inorganic insulating layer 133 is formed on the surface of the first organic insulating layer 132.
  • the second inorganic insulating layer 133 may be at least one of a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, and an aluminum oxide layer.
  • the inorganic insulating layer 133 may be formed by any one of chemical vapor deposition, atomic layer deposition, atomic layer implantation, sputtering deposition, pulsed laser deposition, and plasma enhanced vapor deposition.
  • the barrier wall 14 is used to block the organic insulating layer in the encapsulation layer 13 to avoid over flow of the organic insulating layer, such as the first organic insulating layer 132 in the encapsulation layer 13.
  • the barrier wall 14 is disposed on the substrate 10 of the non-display area 100c and is located on the side of the isolation portion close to the hollow area 100a.
  • the longitudinal section of the retaining wall 14 is trapezoidal, and the retaining wall 14 is ring-shaped, which is arranged around the hollow area 100a.
  • the preparation material of the retaining wall 14 can be an inorganic material or an organic material.
  • the anti-crack portion 15 is used to prevent the film layer on the substrate 10 from breaking, and is made of an inorganic material and formed by patterning the inorganic layer.
  • the anti-crack portion 15 is disposed on the substrate 10 of the non-display area 100c and is located on the side of the barrier wall 14 close to the hollow area 100a.
  • the through hole 100d is used to accommodate components such as a camera.
  • the shape of the through hole 100d may be a circle or other shapes.
  • the through hole 100 d is located in the hollow area 100 a and penetrates the substrate 10, the second light emitting device layer 112 and the packaging layer 13.
  • the through hole 100 d is formed by laser ablating the substrate of the hollow area 100 a, the second light emitting device layer 112 and the packaging layer 13.
  • the anti-crack portion 15 can prevent the crack extension in the inorganic layer in the encapsulation layer 13.
  • the organic light-emitting diode display device of the embodiment of the present application uses an isolation portion to isolate the first light-emitting device layer located on the side of the isolation portion near the display area and the second light-emitting device layer located on the side of the isolation portion near the through hole, and then uses an encapsulation layer Covering the light emitting device layer, the isolation part and the substrate so that the organic light emitting diode display device has a high screen-to-body ratio and good packaging reliability.
  • FIG. 4 is a second cross-sectional view taken along the A-A tangent line of the organic light emitting diode display device shown in FIG.
  • the organic light emitting diode display device shown in FIG. 4 is basically similar to the organic light emitting diode display device shown in FIG. 2, except that the organic light emitting diode display device further includes a blocking portion 16 disposed on the substrate 10 in the non-display area 100c.
  • the blocking portion 16 is arranged in the same layer as the isolation portion and is located between the first isolation portion 121 and the second isolation portion 122.
  • the height of the blocking portion 16 is smaller than the height of the first isolation portion 121 and the second isolation portion 122.
  • the barrier 16 is used to increase the lateral diffusion path of water vapor and oxygen, and the lateral direction is parallel to the surface of the substrate 10 provided with the isolation portion, thereby improving the packaging reliability of the organic light emitting diode display device.
  • the blocking portion 16 is annular, and the blocking portion 16 is disposed around the second isolation portion 122.
  • the longitudinal cross-sectional shape of the blocking portion 16 may be at least one of a triangle, a semicircle, a trapezoid, a rectangle, or an irregular pattern. Specifically, the blocking portion is triangular.
  • FIG. 5 is a third cross-sectional view taken along the A-A tangent line of the organic light emitting diode display device shown in FIG.
  • the organic light-emitting diode display device shown in FIG. 5 is basically similar to the organic light-emitting diode display device shown in FIG. 4, except that there are two blocking portions 16 and the longitudinal cross-sections of the two blocking portions 16 are both semicircular. The lateral diffusion path of water vapor and oxygen is increased, thereby further improving the packaging reliability of the organic light emitting diode display device.
  • Both blocking portions 16 are ring-shaped. It can be understood that there may also be multiple blocking portions 16, and the multiple blocking portions 16 are all ring-shaped, and the longitudinal cross-sectional shapes of the multiple blocking portions 16 may be the same or different.
  • FIG. 6 is a fourth cross-sectional view taken along the A-A tangent line of the organic light emitting diode display device shown in FIG.
  • the organic light-emitting diode display device shown in FIG. 6 is basically similar to the organic light-emitting diode display device shown in FIG. 4, except that there are a plurality of blocking portions 16 and the plurality of blocking portions 16 are alternately arranged in the first isolation portion 121 and Between the second isolation portions 122, the plurality of blocking portions 16 are ring-shaped.
  • the plurality of blocking portions 16 includes a first blocking portion 161, a second blocking portion 162, a third blocking portion 163, and a fourth blocking portion 164.
  • the first blocking portion 161 is disposed close to the first isolation portion 121, and the fourth blocking portion 164 is disposed close to the second isolation portion 122, the second blocking portion 162 and the third blocking portion 163 are located between the first blocking portion 161 and the fourth blocking portion 164, the second blocking portion 162 is disposed close to the first blocking portion 161, and the third blocking portion 162 is disposed close to the first blocking portion 161.
  • the blocking portion 163 is disposed close to the fourth blocking portion 164.
  • the height of the first blocking portion 161 is greater than the height of the third blocking portion 163, the height of the second blocking portion 162 is greater than the height of the first blocking portion 161, and the height of the fourth blocking portion 164 is greater than the height of the second blocking portion 162.
  • the longitudinal sections of the first blocking portion 161, the second blocking portion 162, the third blocking portion 163, and the fourth blocking portion 164 are all rectangular.
  • the multiple barriers 16 are arranged alternately in height to further increase the lateral diffusion paths of water vapor, oxygen, etc., thereby further improving packaging reliability.
  • FIG. 7 is a flowchart of a manufacturing method of an organic light emitting diode display device according to an embodiment of the application.
  • the manufacturing method includes the following steps:
  • a substrate is provided.
  • the substrate can be a glass substrate, a flexible substrate, and a flexible substrate.
  • the flexible substrate may be a polyimide substrate or a polyethylene terephthalate substrate.
  • the substrate has a hollow area, a display area located at the periphery of the hollow area, and a non-display area between the hollow area and the display area.
  • a negative photoresist on the entire surface is formed on the substrate, and the negative photoresist is exposed to light and developed to form an isolation portion.
  • the isolation part is ring-shaped, and the isolation part is arranged around the hollow area.
  • the longitudinal section of the partition is a shape with a wide top and a narrow bottom, such as an inverted trapezoid.
  • the isolation part is used to disconnect the subsequently formed light emitting device layer to prevent water vapor and oxygen from being transmitted to the light emitting device layer of the display area through the light emitting device layer close to the hollow area and affect the service life and display effect of the organic light emitting diode display device.
  • the isolation portion includes a first isolation portion and a second isolation portion, the first isolation portion is located on a side close to the display area, and the second isolation portion is located on a side close to the hollow area.
  • the height of the first isolation portion and the second isolation portion are the same.
  • the first isolation portion and the second isolation portion are both ring-shaped, the second isolation portion is arranged around the hollow area, and the first isolation portion is arranged around the second isolation portion.
  • the distance between the first isolation portion and the second isolation portion is greater than 100 micrometers to ensure an effective packaging path of the packaging layer encapsulating the light-emitting device layer in a lateral direction, which is parallel to the surface of the substrate provided with the isolation portion.
  • the second isolation part also functions to block water vapor and oxygen.
  • the anode is formed by sputtering deposition and yellowing process, and then the organic light-emitting layer is formed by vacuum evaporation or inkjet printing, and then the cathode is formed by sputtering deposition or vacuum evaporation.
  • the isolation portion is formed on the substrate, the light emitting device layer is divided into a first light emitting device layer and a second light emitting device layer.
  • the first light emitting device layer is formed on the substrate on the side of the isolation portion close to the display area, and the second light emitting device layer
  • the device layer is formed on the substrate on the side of the isolation portion close to the hollow area.
  • the present application can use the vapor deposition mask corresponding to the panel outline to complete the vapor deposition of the corresponding film layer, and the corresponding lining on the vapor deposition mask The position of the bottom hollow area does not need to be avoided.
  • the first inorganic insulating layer covering the light emitting device layer, the isolation portion, and the encapsulation layer of the substrate is formed by atomic layer deposition or atomic layer implantation. Due to the good step coverage of the atomic layer deposition and the atomic layer implantation, the first inorganic insulating layer is continuously formed on the light emitting device layer, the isolation portion and the substrate, which can play a good encapsulation effect.
  • inkjet printing is used to form a first organic insulating layer on the first inorganic insulating layer.
  • the second inorganic insulating layer covering the first organic insulating layer is formed by any one of chemical vapor deposition, atomic layer deposition, atomic layer injection, sputtering deposition, pulsed laser deposition, and plasma enhanced vapor deposition.
  • the substrate, the second light-emitting device layer, and the encapsulation layer in the hollow area are ablated by laser to form the through hole.
  • the shape of the through hole can be circular or other shapes.
  • the manufacturing method of the organic light emitting diode display device further includes forming a barrier on the substrate in the non-display area to resist the crack.
  • the retaining wall is ring-shaped, the longitudinal section of the retaining wall is trapezoidal, and the retaining wall is located on the side of the isolation part close to the hollow area.
  • the anti-crack part is ring-shaped, and the anti-crack part is located on the side of the retaining wall close to the hollow area.
  • the manufacturing method of the organic light emitting diode display device further includes forming a barrier portion between the first isolation portion and the second isolation portion, the barrier portion and the isolation portion are provided in the same layer and are located between the first isolation portion and the second isolation portion, and the barrier portion
  • the height of is smaller than the height of the first isolation portion and the second isolation portion.
  • the blocking part is ring-shaped, and the longitudinal section of the blocking part is at least one of a triangle, a semicircle, a trapezoid, a rectangle, or an irregular pattern. There are multiple blocking portions, and the multiple blocking portions are alternately arranged between the first isolation portion and the second isolation portion.
  • the manufacturing method of the organic light emitting diode display device of the present application uses an isolation portion to isolate the first light emitting device layer located on the side of the isolation portion near the display area and the second light emitting device layer located on the side of the isolation portion near the through hole, and then adopts packaging
  • the layer covers the light emitting device layer, the isolation part and the substrate so that the organic light emitting diode display device has a high screen-to-body ratio and good packaging reliability.
  • This application also provides an electronic device, which can be a mobile phone, a portable notebook or a monitoring device.
  • the electronic device includes the above-mentioned organic light emitting diode display device and a camera.
  • the camera is embedded in the through hole of the organic light emitting diode display device.
  • the organic light-emitting diode display device of the electronic device in the embodiment of the present application isolates the first light-emitting device layer located on the side of the isolation portion close to the display area from the second light-emitting device layer located on the side of the isolation portion close to the through hole by using the isolation portion.
  • the encapsulation layer is then used to cover the light-emitting device layer, the isolation part and the substrate so that the organic light-emitting diode display device has a high screen-to-body ratio and good packaging reliability, so that the electronic device has a high screen-to-body ratio and extends the usage time.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un appareil d'affichage à diodes électroluminescentes organiques et son procédé de fabrication, et un dispositif électronique. Une unité d'isolation est utilisée pour isoler une première couche de dispositif électroluminescent située sur un côté de l'unité d'isolation à proximité d'une région d'affichage, à partir d'une seconde couche de dispositif électroluminescent située sur un côté de l'unité d'isolation à proximité d'un trou traversant, puis une couche de boîtier est utilisée pour recouvrir les couches de dispositif électroluminescent, l'unité d'isolation et un substrat de telle sorte que l'appareil d'affichage à diodes électroluminescentes organiques présente une bonne fiabilité d'encapsulation tout en ayant un rapport écran/corps élevé.
PCT/CN2019/086953 2019-03-27 2019-05-15 Appareil d'affichage à diodes électroluminescentes organiques et son procédé de fabrication, et dispositif électronique WO2020191891A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/495,402 US11282904B2 (en) 2019-03-27 2019-05-15 Organic light emitting diode display device, method of manufacturing the OLED display device, and electronic device

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CN201910236011.2 2019-03-27
CN201910236011.2A CN110034241B (zh) 2019-03-27 2019-03-27 有机发光二极管显示装置及其制造方法、电子设备

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WO2020191891A1 true WO2020191891A1 (fr) 2020-10-01

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