WO2020191650A1 - Ensemble de dissipation de chaleur et dispositif électronique - Google Patents

Ensemble de dissipation de chaleur et dispositif électronique Download PDF

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Publication number
WO2020191650A1
WO2020191650A1 PCT/CN2019/079843 CN2019079843W WO2020191650A1 WO 2020191650 A1 WO2020191650 A1 WO 2020191650A1 CN 2019079843 W CN2019079843 W CN 2019079843W WO 2020191650 A1 WO2020191650 A1 WO 2020191650A1
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WO
WIPO (PCT)
Prior art keywords
chip
heat dissipation
hole
circuit board
printed circuit
Prior art date
Application number
PCT/CN2019/079843
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English (en)
Chinese (zh)
Inventor
黄伦学
郭鹏
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201980017587.8A priority Critical patent/CN112005368A/zh
Priority to PCT/CN2019/079843 priority patent/WO2020191650A1/fr
Publication of WO2020191650A1 publication Critical patent/WO2020191650A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Definitions

  • This application relates to the field of electronic devices, and more specifically, to heat dissipation components and electronic devices.
  • the current chip power consumption is very high, if the chip cannot be effectively dissipated, it will cause the chip to fail to work normally and affect the operation of the entire system.
  • the chip 130 is arranged on the printed circuit board 140, and the heat dissipation of the chip 130 is usually achieved by arranging a heat sink 120 on the upper surface of the chip 130, wherein the surface of the chip 130 can be in contact with the heat sink 120 through a thermally conductive material 110 .
  • a heat sink 120 on the upper surface of the chip 130, wherein the surface of the chip 130 can be in contact with the heat sink 120 through a thermally conductive material 110 .
  • there should not be any heat dissipation materials for example, heat sinks and thermal conductive materials
  • the present application provides a heat dissipation component and an electronic device, which can realize heat dissipation of a chip on or on which a heat dissipation material cannot be provided.
  • the present application provides a heat dissipation assembly
  • the heat dissipation assembly includes: a printed circuit board, a heat dissipation device, and a chip arranged on the surface of the printed circuit board, wherein the The area covered by the chip is provided with a through hole penetrating the printed circuit board, and the through hole goes directly from the surface to the other surface of the printed circuit board opposite to the surface, and the heat sink passes through the The through hole dissipates heat to the chip.
  • the printed circuit board in the above technical solution has a through hole at the position where the chip is provided, so that the lower surface of the chip can be exposed, so that the chip can be dissipated under the chip by the heat sink, without the upper surface of the chip Or set heat dissipation material above.
  • the heat dissipation device is arranged on a side where the other surface of the printed circuit board is located.
  • the heat sink is arranged on the side of the printed circuit board where the other surface opposite to the surface where the chip is located, so that the chip can be dissipated on the side where the other surface is located, which can avoid A heat dissipation material is provided on or above the upper surface of the chip.
  • the heat dissipation device is in contact with the chip through the through hole.
  • the heat dissipation device in the above technical solution is in contact with the chip through the through hole on the printed circuit board, so that heat transfer between the chip and the chip can be realized under the chip, thereby realizing the heat dissipation of the chip, without the need for heat dissipation on the upper surface or above the chip material.
  • the requirement on the heat dissipation device is lower, and the solution is easier to implement.
  • the heat dissipation device is in contact with a thermally conductive material provided in the through hole through the through hole, and the thermally conductive material is in contact with the chip.
  • the heat dissipation device in the above technical solution is in contact with the thermally conductive material through the through holes on the printed circuit board, and the thermally conductive material is in contact with the chip, so that the heat transfer between the chip and the chip can be realized under the chip, so as to realize the heat dissipation of the chip.
  • a heat dissipation material is arranged on or above the chip.
  • the heat dissipation device includes a radiator or a semiconductor refrigeration fin.
  • the heat sink is a metal heat sink.
  • the heat dissipation component further includes a fan.
  • the above technical solution uses a heat sink to dissipate the heat of the chip and adds a fan to further heat the chip and the heat sink, which has a better heat dissipation effect.
  • the heat dissipation device includes a fan.
  • the printed circuit board is provided with through holes in the area covered by the chip, when a fan is used to dissipate the chip, the lower surface and the upper surface of the chip can be blown simultaneously, which has better heat radiation.
  • the fan is configured not to be in contact with the other surface.
  • the present application provides an electronic device that includes the heat dissipation component as described in the first aspect or any one of the possible implementation manners of the first aspect.
  • Fig. 1 is a schematic structural diagram of a heat dissipation assembly in the prior art.
  • Fig. 2 is a front view of the heat dissipation assembly of the embodiment of the present application.
  • Fig. 3 is a top view of a heat dissipation assembly of an embodiment of the present application.
  • Fig. 4 is a front view of a heat dissipation assembly according to another embodiment of the present application.
  • Fig. 5 is a front view of a heat dissipation assembly according to another embodiment of the present application.
  • Fig. 6 is a top view of a heat dissipation assembly according to another embodiment of the present application.
  • Fig. 7 is a front view of a heat dissipation assembly according to another embodiment of the present application.
  • Fig. 8 is a top view of a heat dissipation assembly according to another embodiment of the present application.
  • the heat dissipating assembly includes a printed circuit board, a heat sink, and a chip arranged on the surface of the printed circuit board, wherein a region of the surface covered by the chip is provided with a printed circuit board penetrating
  • the through hole is from the surface to the other surface of the printed circuit board opposite to the surface, and the heat dissipation device dissipates the chip through the through hole.
  • the printed circuit board has a through hole at the position where the chip is provided, so that the lower surface of the chip can be exposed, so that the chip can be dissipated under the chip through the heat dissipation device, without the need to be on the chip.
  • Heat dissipation materials are arranged on the surface or above.
  • the chips in the embodiments of the present application can generally refer to chips in various packaging forms.
  • the area covered by the chip is the area of the printed circuit board covered by the chip, and is the area on the printed circuit board corresponding to the chip.
  • the printed circuit board is provided with a through hole penetrating the printed circuit board, that is, the area of the printed circuit board corresponding to the chip has a through hole.
  • the through holes may also have other names, such as trenches, through grooves, hollow areas, etc., which are collectively referred to as through holes in the embodiments of the present application.
  • the embodiment of the present application does not specifically limit the position where the through hole is provided.
  • the through hole can be located at any position in the chip coverage area, for example, corresponding to the center position and edge position of the chip.
  • the embodiment of the present application does not specifically limit the shape of the through hole.
  • the through hole may be a square, a rectangle, a circle, a triangle, or an irregular pattern.
  • the embodiment of the present application does not specifically limit the size of the through hole.
  • the area of the through hole may be smaller than or equal to the area of the chip.
  • the area of the through hole can be close to the chip area but smaller than the chip area, so that as much of the chip can be exposed as possible to facilitate heat dissipation of the chip.
  • the embodiment of the present application does not specifically limit the number of through holes.
  • a through hole with an area smaller than but close to the chip area may be provided on the printed circuit board, or multiple through holes may be provided.
  • the heat dissipating device can be a metal radiator, a fan, a semiconductor cooling fin, and the like.
  • the chip involved in the embodiments of the application is a system manufactured on the same semiconductor substrate by an integrated circuit process, also called a semiconductor chip, which can be manufactured on the substrate by using an integrated circuit process (usually a semiconductor such as silicon)
  • the outer layer of the integrated circuit formed on the material) is usually encapsulated by a semiconductor packaging material.
  • the integrated circuit may include various types of functional devices, and each type of functional device includes transistors such as logic gate circuits, metal-oxide-semiconductor (MOS) transistors, bipolar transistors or diodes, and may also include capacitors and resistors. Or inductance and other components.
  • MOS metal-oxide-semiconductor
  • Each functional device can work independently or under the action of necessary driver software, and can realize various functions such as communication, calculation, or storage.
  • the heat sink may directly contact the chip through the through hole, so as to conduct heat transfer with the chip.
  • the heat sink is arranged on the side of the printed circuit board where the other surface opposite to the surface where the chip is located, and the heat sink is in contact with the chip through the through hole. Taking the heat sink as a heat sink as an example, the technical solutions of the embodiments of the present application will be described.
  • Fig. 2 is a front view of the heat dissipation assembly of the embodiment of the present application.
  • Fig. 3 is a top view of a heat dissipation assembly of an embodiment of the present application. As shown in FIG.
  • the heat dissipation assembly 200 includes a printed circuit board 240, a heat sink 220 and a chip 230 arranged on the surface of the printed circuit board 240, wherein the heat sink 220 includes a boss 221.
  • the printed circuit board 240 has a through hole 241, and the boss 221 of the heat sink 220 passes through the through hole 241 to contact the chip 230.
  • the heat sink 220 and the boss 221 may be integrally formed, or may be assembled together later.
  • the size, shape, and number of bosses 221 are related to the size, shape, and number of through holes 241.
  • the specific type and implementation of the radiator 220 can be referred to the prior art, which will not be repeated here.
  • the area of the boss 221 can be smaller than the area of the through hole 241; the shape of the boss 221 can be the same as the shape of the through hole 241, for example, both are rectangular; the number of the boss 221 can be less than or equal to The number of through holes 241.
  • the shape of the boss 221 may be different from the shape of the through hole 241 as long as the boss 221 can pass through the through hole 241 to contact the chip 230.
  • the upper surface of the boss 221 may be flat or not, as long as the boss 221 can contact 230.
  • the heat dissipation device in the above technical solution is arranged on the side of the printed circuit board opposite to the surface where the chip is arranged, and contacts the chip through the through hole on the printed circuit board, so that it can be located under the chip
  • the chip is dissipated without dissipating heat dissipation material on or above the chip.
  • the tolerance size of the heat dissipation device is lower, and the solution is easier to implement.
  • the heat dissipation assembly 200 may also include a fan.
  • a fan is added to further dissipate heat of the chip and the heat sink, so that the heat dissipation assembly 200 can have a better heat dissipation effect.
  • the heat dissipation device may indirectly transfer heat to the chip through the through hole.
  • the heat dissipating device is arranged on the side of the printed circuit board opposite to the surface on which the chip is arranged, and the heat dissipating device contacts the heat-conducting material arranged in the through-hole through the through hole, and the heat-conducting material is The chip is in contact, so that the heat sink can transfer heat to the chip through the thermally conductive material placed in the through hole, thereby dissipating the chip.
  • the embodiment of the present application does not specifically limit the type of the thermally conductive material.
  • the thermally conductive material may be a thermally conductive pad, a thermally conductive gel, and the like.
  • Fig. 4 is a front view of a heat dissipation assembly according to another embodiment of the present application.
  • the heat dissipation assembly 400 includes a printed circuit board 440, a heat sink 420, a chip 430 arranged on the surface of the printed circuit board 440, and a thermally conductive material 410 arranged in a through hole.
  • the printed circuit board 440 has a through hole 441 in which a thermally conductive material 410 is disposed.
  • the upper surface of the thermally conductive material 410 is in contact with the chip, and the lower surface of the thermally conductive material 410 is in contact with the heat sink 420.
  • the surface of the heat sink 420 may be a plane as shown in FIG. 4.
  • the heat sink 420 may also have a boss 421.
  • the heat sink 420 and the boss 421 may be integrally formed, or may be assembled together later.
  • the upper surface of the boss 421 may be flat or not, as long as the boss 421 can contact the thermally conductive material 410.
  • the size, shape, and number of the thermally conductive material 410 are related to the size, shape, and number of the through holes 441.
  • the area of the thermally conductive material 410 may be smaller than the area of the through hole 441; the shape of the thermally conductive material 410 may be the same as the shape of the through hole 441, for example, both are rectangular; the number of the thermally conductive material 410 may be less than or equal to The number of through holes 441.
  • the shape of the thermally conductive material 410 may be different from the shape of the through hole 441, as long as the thermally conductive material 410 can be disposed in the through hole 441 and contact the chip 430 and the heat sink 420 respectively.
  • the heat dissipation device in the above technical solution is arranged on the side of the printed circuit board opposite to the surface where the chip is arranged, and contacts the thermally conductive material through the through hole on the printed circuit board, and the thermally conductive material and the chip Contact, so as to realize the heat dissipation of the chip under the chip.
  • the heat dissipation assembly 400 may also include a fan.
  • a fan is added to further dissipate heat to the chip and the heat sink, so that the heat dissipation assembly 400 can have a better heat dissipation effect.
  • FIGS. 2 to 6 only take the square shape of the heat sink as an example, and the heat sink can also have any other shape as long as the heat sink is arranged under the printed circuit board and the chip is dissipated through the through holes.
  • the radiator can also be round, diamond or other irregular shapes.
  • the heat dissipation device can generate flowing air, and the heat generated by the chip can be taken away by the flowing air.
  • the heat dissipation device may be a fan. Taking the heat dissipation device as a fan as an example, the technical solutions of the embodiments of the present application will be described.
  • Fig. 7 is a front view of a heat dissipation assembly according to another embodiment of the present application.
  • Fig. 8 is a top view of a heat dissipation assembly according to another embodiment of the present application.
  • the heat dissipation assembly 700 includes a printed circuit board 740, a fan 720 (not shown in FIGS.
  • the printed circuit board 740 has a through hole 741, and the fan 720 can air-cool the chip 750 through the through hole 741.
  • the fan 720 can be arranged at any position, as long as the wind generated by the fan 720 can air-cool the lower surface of the chip 730, for example, the fan can be arranged so as not to contact another surface opposite to the surface on which the chip is arranged.
  • the printed circuit board is provided with through holes in the area covered by the chip, when a fan is used to dissipate the chip, the lower surface and the upper surface of the chip can be blown simultaneously, which has better heat radiation.
  • top, top, bottom, etc. in the embodiments of the present application are only relative directions, and should not be understood as absolute top, top, bottom, etc., for example, the direction of the chip may be the top of the reference direction.
  • Upper surface, lower surface, etc., with the different setting directions of the chip, the upper surface, upper surface, and lower surface will also change accordingly.
  • An embodiment of the present application also provides an electronic device, which includes a printed circuit board and a heat dissipation device in any one of the possible implementation manners described above.
  • the electronic device may be any device including a chip and a printed circuit board, such as a terminal device, a network device, a computer, an air conditioner, a refrigerator, a printer, a fax machine, etc., which is not specifically limited in the embodiment of the present application.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ensemble de dissipation de chaleur (200) et un dispositif électronique. L'ensemble de dissipation de chaleur (200) comprend une carte de circuit imprimé (240), un dispositif de dissipation de chaleur (220), et une puce (230) disposée sur la surface de la carte de circuit imprimé (240) ; un trou traversant (241) pénétrant à travers la carte de circuit imprimé (240) est disposé dans une zone de la surface couverte par la puce (230) ; le trou traversant (241) s'étend de la surface à une autre surface de la carte de circuit imprimé (240) opposée à la surface ; le dispositif de dissipation de chaleur (220) réalise une dissipation de chaleur sur la puce (230) au moyen du trou traversant (241). Dans la solution technique, la carte de circuit imprimé (240) est pourvue du trou traversant (241) dans une position pourvue de la puce (230) de telle sorte que la surface inférieure de la puce (230) peut être exposée. Par conséquent, la puce (230) peut être soumise à une dissipation de chaleur sous la puce (230) par le dispositif de dissipation de chaleur (220) sans avoir besoin de disposer d'un matériau de dissipation de chaleur sur ou au-dessus de la surface supérieure de la puce (230).
PCT/CN2019/079843 2019-03-27 2019-03-27 Ensemble de dissipation de chaleur et dispositif électronique WO2020191650A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201980017587.8A CN112005368A (zh) 2019-03-27 2019-03-27 散热组件和电子设备
PCT/CN2019/079843 WO2020191650A1 (fr) 2019-03-27 2019-03-27 Ensemble de dissipation de chaleur et dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/079843 WO2020191650A1 (fr) 2019-03-27 2019-03-27 Ensemble de dissipation de chaleur et dispositif électronique

Publications (1)

Publication Number Publication Date
WO2020191650A1 true WO2020191650A1 (fr) 2020-10-01

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PCT/CN2019/079843 WO2020191650A1 (fr) 2019-03-27 2019-03-27 Ensemble de dissipation de chaleur et dispositif électronique

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2494524Y (zh) * 2001-07-11 2002-06-05 神基科技股份有限公司 球网格阵列型的cpu的散热结构
US6816375B2 (en) * 2001-08-03 2004-11-09 Texas Instruments Incorporated Heat sink attachment
CN201273486Y (zh) * 2008-08-22 2009-07-15 深圳市幻景光电科技有限公司 大功率的led光条
CN101601131A (zh) * 2007-02-15 2009-12-09 日本电气株式会社 用于安装半导体封装的结构
CN106129024A (zh) * 2016-08-16 2016-11-16 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块
CN205900524U (zh) * 2016-08-16 2017-01-18 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2494524Y (zh) * 2001-07-11 2002-06-05 神基科技股份有限公司 球网格阵列型的cpu的散热结构
US6816375B2 (en) * 2001-08-03 2004-11-09 Texas Instruments Incorporated Heat sink attachment
CN101601131A (zh) * 2007-02-15 2009-12-09 日本电气株式会社 用于安装半导体封装的结构
CN201273486Y (zh) * 2008-08-22 2009-07-15 深圳市幻景光电科技有限公司 大功率的led光条
CN106129024A (zh) * 2016-08-16 2016-11-16 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块
CN205900524U (zh) * 2016-08-16 2017-01-18 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块

Also Published As

Publication number Publication date
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