WO2020189778A1 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
WO2020189778A1
WO2020189778A1 PCT/JP2020/012472 JP2020012472W WO2020189778A1 WO 2020189778 A1 WO2020189778 A1 WO 2020189778A1 JP 2020012472 W JP2020012472 W JP 2020012472W WO 2020189778 A1 WO2020189778 A1 WO 2020189778A1
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Prior art keywords
resin
resin composition
mass
magnetic
epoxy resin
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PCT/JP2020/012472
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English (en)
French (fr)
Japanese (ja)
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正応 依田
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味の素株式会社
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Priority to JP2021507429A priority Critical patent/JP7552583B2/ja
Publication of WO2020189778A1 publication Critical patent/WO2020189778A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Definitions

  • the present invention relates to a resin composition and a magnetic sheet, an inductor substrate, and a circuit board obtained by using the resin composition.
  • inductor elements are installed in information terminals such as mobile phones and smartphones.
  • independent inductor components were mounted on a substrate, but in recent years, a method has been adopted in which a coil is formed by a conductor pattern of a substrate and an inductor element is provided inside the substrate.
  • Patent Document 1 a method of screen-printing a paste material containing a magnetic material on a substrate including wiring to form a magnetic layer is known (Patent Document 1, Patent). Reference 2).
  • the present invention has been made in view of the above circumstances, and is a resin composition capable of obtaining a cured product having excellent magnetic properties and mechanical properties, and a magnetic sheet obtained by using the resin composition; an inductor substrate; The purpose is to provide a circuit board.
  • the present inventors have made magnetic properties by containing a magnetic powder containing ferrite and a magnetic filler having a coating layer containing a silicon oxide that coats the magnetic powder. Further, they have found that a cured product having excellent mechanical properties can be obtained, and have completed the present invention.
  • the present invention includes the following contents.
  • a resin composition containing (A) a magnetic powder containing ferrite, a magnetic filler having a coating layer containing a silicon oxide for coating the magnetic powder, and (B) a resin component.
  • thermosetting resin contains an epoxy resin.
  • the content of the solid resin component is 25% by mass or less when the resin component (B) in the resin composition is 100% by mass, [1] to [6].
  • the resin composition according to any one of. [8] The resin composition according to any one of [1] to [7], which is in the form of a paste.
  • a magnetic sheet comprising a support and a resin composition layer provided on the support and formed of the resin composition according to any one of [1] to [8].
  • An inductor substrate including a magnetic layer which is a cured product of the resin composition according to any one of [1] to [8].
  • a circuit board including the inductor substrate according to [10].
  • the present invention it is possible to provide a resin composition capable of obtaining a cured product having excellent magnetic properties and mechanical properties, and a magnetic sheet; inductor substrate; and a circuit board obtained by using the resin composition.
  • FIG. 1 is a schematic plan view of an inductor substrate according to an embodiment of the present invention.
  • FIG. 1 merely schematically shows the shape, size, and arrangement of the components so that the invention can be understood.
  • the present invention is not limited to the following description, and each component can be appropriately modified without departing from the gist of the present invention. Further, the configuration according to the embodiment of the present invention is not always manufactured or used by the arrangement of the illustrated examples.
  • the resin composition of the present invention contains (A) a magnetic powder containing ferrite, a magnetic filler having a coating layer containing a silicon oxide for coating the magnetic powder, and (B) a resin component.
  • (A) a magnetic powder containing ferrite and a magnetic filler having a coating layer containing a silicon oxide that coats the magnetic powder may be simply referred to as a “magnetic filler”.
  • the resin composition By incorporating such a magnetic filler and a resin component in the resin composition, it is possible to obtain a cured product having excellent magnetic properties such as relative permeability and loss coefficient, and mechanical properties such as maximum point strength and elongation. .. Further, the resin composition usually has a low viscosity, and the cured product obtained from the resin composition usually has excellent insulating performance.
  • each component contained in the resin composition of the present invention will be described in detail.
  • the resin composition contains (A) a magnetic powder containing ferrite and a magnetic filler having a coating layer containing a silicon oxide, which coats the magnetic powder, as a component (A).
  • the magnetic filler (A) is a magnetic filler having a core-shell structure having a magnetic powder and a coating layer for coating the magnetic powder.
  • the magnetic filler having a core-shell structure may have a two-layer structure of a magnetic powder and a coating layer, but may further have a structure of three or more layers including an arbitrary layer. However, usually, the surface of the magnetic powder is directly coated with a coating layer, and no arbitrary layer is provided between the two.
  • the component (A) may be used alone or in combination of two or more.
  • the magnetic powder contained in the core in the core-shell structure preferably contains ferrite, and the magnetic powder is preferably ferrite. Therefore, a preferred embodiment of component (A) has ferrite and a coating layer containing silicon oxide that coats ferrite.
  • the ferrite examples include Mg-Zn-based ferrite, Fe-Mn-based ferrite, Mn-Zn-based ferrite, Mn-Mg-based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, and Ni-Zn-based ferrite.
  • the ferrite preferably contains at least one element selected from Ni, Cu, Mn, and Zn, and any of Fe-Mn-based ferrite and Mn-Zn-based ferrite is more preferable, and Fe-Mn-based ferrite is more preferable. Ferrite is more preferred.
  • ferrite a commercially available ferrite can be used.
  • specific examples of commercially available ferrites that can be used include “M05S” and “MZ05S” manufactured by Powdertech Co., Ltd .; “LD-M”, “LD-MH”, “KNI-106” and “KNI-106GSM” manufactured by JFE Chemical Co., Ltd. , “KNI-106GS”, “KNI-109”, “KNI-109GSM”, “KNI-109GS”; "KNS-415", “BSF-547”, “BSF-029”, “BSN” manufactured by Toda Kogyo Co., Ltd. -125, “BSN-714", “BSN-828", "FRX-146", “FRX-221", “FRX-503", “FRX-802”; and the like.
  • the magnetic powder in the component (A) is preferably spherical.
  • the value (aspect ratio) obtained by dividing the length of the major axis of the magnetic powder by the length of the minor axis is preferably 2 or less, more preferably 1.5 or less, and further preferably 1.2 or less. In general, it is easier to improve the relative magnetic permeability when the magnetic powder has a flat shape that is not spherical. However, it is usually preferable to use a spherical magnetic powder from the viewpoint of obtaining a paste having a preferable viscosity and a low magnetic loss.
  • the material constituting the shell (coating layer) in the core-shell structure is a silicon oxide capable of forming a film on the surface of the magnetic powder.
  • the silicon oxide include compounds represented by SiO x (x represents a number of 1 to 2) such as silicon dioxide; water-soluble alkali metal silicates such as sodium silicate, and SiO x.
  • the compound represented by (x represents a number of 1 to 2) is preferable, and silicon dioxide is more preferable.
  • Silicon oxide can be obtained by the so-called sol-gel method, in which the silica precursor is hydrolyzed and polycondensed under acidic or basic conditions.
  • the silica precursor include silicate esters such as tetraethyl orthosilicate; silicates such as sodium silicate. These may be used alone or in combination of two or more to form a sol.
  • the mass ratio of the magnetic powder to the coating layer is preferably 0.1 or more, more preferably 0.5 or more, still more preferably 1 or more, and preferably 20 or less. It is preferably 15 or less, more preferably 10 or less.
  • the mass ratio can be calculated from the ratio of the amount of magnetic powder charged when producing a magnetic filler having a core-shell structure to the total amount of the monomer and silica precursor forming the coating layer.
  • the thickness of the coating layer is preferably 5 nm or less, more preferably 4 nm or less, still more preferably 3 nm or less, preferably 0.1 nm or more, and more preferably 0. nm or less from the viewpoint of obtaining a cured product having excellent magnetic properties. It is 5 nm or more, more preferably 1 nm or more.
  • the thickness of the coating layer can be calculated from the amount of the material constituting the coating layer and the specific surface area of the magnetic powder.
  • the component (A) can be produced, for example, by mixing a magnetic powder with a material constituting a coating layer or a precursor thereof, and subjecting it to a reaction such as hydrolysis or polymerization as necessary.
  • the average particle size of the component (A) is preferably 0.01 ⁇ m or more, more preferably 0.5 ⁇ m or more, still more preferably 1 ⁇ m or more, from the viewpoint of obtaining a cured product having excellent magnetic properties. Further, it is preferably 10 ⁇ m or less, more preferably 9 ⁇ m or less, and further preferably 8 ⁇ m or less.
  • the average particle size of the component (A) can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, it can be measured by creating a particle size distribution of magnetic powder on a volume basis with a laser diffraction / scattering type particle size distribution measuring device and using the median diameter as the average particle size.
  • a laser diffraction / scattering type particle size distribution measuring device As the measurement sample, one in which the component (A) is dispersed in water by ultrasonic waves can be preferably used.
  • the laser diffraction / scattering type particle size distribution measuring device "LA-500" manufactured by HORIBA, Ltd., "SALD-2200” manufactured by Shimadzu Corporation, or the like can be used.
  • (A) a specific surface area of the component, from the viewpoint of obtaining a cured product having excellent magnetic properties, preferably 0.05 m 2 / g or more, more preferably 0.1 m 2 / g or more, more preferably 0.3 m 2 / g That is all. Further, it is preferably 10 m 2 / g or less, more preferably 8 m 2 / g or less, and further preferably 5 m 2 / g or less.
  • the specific surface area of the component (A) can be measured by the BET method.
  • the component (A) may be treated with a surface treatment agent from the viewpoint of enhancing moisture resistance and dispersibility.
  • a surface treatment agent include vinylsilane-based coupling agents, (meth) acrylic-based coupling agents, fluorine-containing silane coupling agents, aminosilane-based coupling agents, epoxysilane-based coupling agents, and mercaptosilane-based coupling agents.
  • examples thereof include silane-based coupling agents, epoxysilanes, organosilazane compounds, and titanate-based coupling agents.
  • One type of surface treatment agent may be used alone, or two or more types may be used in any combination.
  • surface treatment agents include, for example, "KBM1003” (vinyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM503” (3-methacryloxypropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and Shin-Etsu Chemical Co., Ltd. "KBM403” (3-glycidoxypropyltrimethoxysilane), “KBM803” (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., “KBE903” (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.
  • the degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the component (A).
  • 100 parts by mass of the component (A) is preferably surface-treated with 0.2 parts by mass to 5 parts by mass of a surface treatment agent, and 0.2 parts by mass to 3 parts by mass is surface-treated. It is preferable that the surface is treated with 0.3 parts by mass to 2 parts by mass.
  • the degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the component (A).
  • Carbon content per unit surface area of the component (A), (A) from the viewpoint of improving dispersibility of the components preferably from 0.02 mg / m 2 or more, 0.1 mg / m 2 or more preferably, 0.2 mg / More than m 2 is more preferable, 1 mg / m 2 or less is preferable, 0.8 mg / m 2 or less is more preferable, and 0.5 mg / m 2 or less is further preferable.
  • the amount of carbon per unit surface area of the component (A) can be measured after the component (A) after the surface treatment is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the component (A) surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the component (A) can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by HORIBA, Ltd. or the like can be used.
  • EMIA-320V manufactured by HORIBA, Ltd.
  • the content (% by volume) of the component (A) is preferably 10% by volume or more, more preferably 20% by volume, when the non-volatile component in the resin composition is 100% by volume from the viewpoint of obtaining a cured product having excellent magnetic properties.
  • volume or more more preferably 30% by volume or more. Further, it is preferably 85% by volume or less, more preferably 80% by volume or less, and further preferably 75% by volume or less.
  • the content (% by mass) of the component (A) is preferably 70% by mass or more, more preferably 75, when the non-volatile component in the resin composition is 100% by mass from the viewpoint of obtaining a cured product having excellent magnetic properties. It is mass% or more, more preferably 80% by mass or more. Further, it is preferably 98% by mass or less, more preferably 95% by mass or less, and further preferably 90% by mass or less. In the present invention, the content of each component in the resin composition is a value when the non-volatile component in the resin composition is 100% by mass, unless otherwise specified.
  • the resin composition contains the (B) resin component as the (B) component.
  • the resin component (B) include (B-1) thermosetting resin, (B-2) dispersant, (B-3) thermoplastic resin, (B-4) curing accelerator and the like.
  • the component (B) preferably contains (B-1) a thermosetting resin, more preferably (B-1) a thermosetting resin, and (B-2) a dispersant, and (B-1). ) It is more preferable to contain a thermosetting resin, (B-2) dispersant, and (B-4) curing accelerator.
  • Thermosetting resin- may contain (B-1) a thermosetting resin. By containing the component (B-1) in the resin composition, it is possible to obtain a cured product having excellent mechanical properties and magnetic properties.
  • thermosetting resin for example, a thermosetting resin used when forming an insulating layer of a wiring board can be used.
  • thermosetting resins include epoxy resins, phenolic resins, naphthol resins, benzoxazine resins, active ester resins, cyanate ester resins, carbodiimide resins, amine resins, and acid anhydrides. Examples thereof include resins, and epoxy resins are particularly preferable.
  • thermosetting resin may be used alone or in combination of two or more. Here, it reacts with an epoxy resin such as a phenol-based resin, a naphthol-based resin, a benzoxazine-based resin, an active ester-based resin, a cyanate ester-based resin, a carbodiimide-based resin, an amine-based resin, and an acid anhydride-based resin.
  • an epoxy resin such as a phenol-based resin, a naphthol-based resin, a benzoxazine-based resin, an active ester-based resin, a cyanate ester-based resin, a carbodiimide-based resin, an amine-based resin, and an acid anhydride-based resin.
  • curing agents The components that can cure the resin composition are sometimes collectively referred to as "curing agents".
  • the epoxy resin is, for example, glycyrrole type epoxy resin; bisphenol A type epoxy resin; bisphenol F type epoxy resin; bisphenol S type epoxy resin; bisphenol AF type epoxy resin; dicyclopentadiene type epoxy resin; trisphenol type epoxy resin; phenol novolac.
  • Type epoxy resin tert-butyl-catechol type epoxy resin; naphthol novolac type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin and other epoxy resins having a fused ring structure; glycidylamine type epoxy resin; glycidyl Ester type epoxy resin; Cresol novolac type epoxy resin; Biphenyl type epoxy resin; Linear aliphatic epoxy resin; Epoxy resin having a butadiene structure; Alicyclic epoxy resin; Heterocyclic epoxy resin; Spirocycle-containing epoxy resin; Cyclohexanedi Methanol type epoxy resin; trimethylol type epoxy resin; tetraphenylethane type epoxy resin and the like can be mentioned.
  • One type of epoxy resin may be used alone, or two or more types may be used in combination.
  • the epoxy resin is preferably one or more selected from bisphenol A type epoxy resin and bisphenol F type epoxy resin.
  • the epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. Further, the epoxy resin preferably has an aromatic structure, and when two or more kinds of epoxy resins are used, it is more preferable that at least one of them has an aromatic structure.
  • the aromatic structure is a chemical structure generally defined as aromatic, and also includes polycyclic aromatics and aromatic heterocycles.
  • the ratio of the epoxy resin having two or more epoxy groups in one molecule to 100% by mass of the non-volatile component of the epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass. % Or more.
  • the epoxy resin may be a liquid epoxy resin at a temperature of 25 ° C. (hereinafter sometimes referred to as “liquid epoxy resin”) or a solid epoxy resin at a temperature of 25 ° C. (hereinafter referred to as “solid epoxy resin”). ).
  • the epoxy resin may contain only the liquid epoxy resin or only the solid epoxy resin, and the liquid epoxy resin and the solid epoxy resin may be contained. Although it may be contained in combination, it is preferable to contain only the liquid epoxy resin from the viewpoint of reducing the viscosity of the resin composition.
  • liquid epoxy resin examples include glycyrrole type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, and phenol novolac type epoxy.
  • a resin, an alicyclic epoxy resin having an ester skeleton, a cyclohexanedimethanol type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and a glycylol type epoxy resin, a bisphenol A type epoxy resin, and a bisphenol F type epoxy resin are more preferable.
  • liquid epoxy resin examples include "HP4032”, “HP4032D”, and “HP4032SS” (naphthalene type epoxy resin) manufactured by DIC; “828US” and “jER828EL” (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. , “JER807” (bisphenol F type epoxy resin), “jER152” (phenol novolac type epoxy resin); “630", “630LSD” manufactured by Mitsubishi Chemical Co., Ltd., “ED-523T” (glycylol type epoxy resin) manufactured by ADEKA.
  • solid epoxy resin examples include naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, and naphthylene ether type epoxy resin.
  • Anthracene type epoxy resin, bisphenol A type epoxy resin, and tetraphenylethane type epoxy resin are preferable, and naphthalene type tetrafunctional epoxy resin, naphthol type epoxy resin, and biphenyl type epoxy resin are more preferable.
  • solid epoxy resin examples include "HP4032H” (naphthalene type epoxy resin), “HP-4700”, “HP-4710” (naphthalene type tetrafunctional epoxy resin), and “N-690” manufactured by DIC. Cresol novolac type epoxy resin), “N-695" (cresol novolac type epoxy resin), “HP-7200” (dicyclopentadiene type epoxy resin), “HP-7200HH”, “HP-7200H”, "EXA-7311” , “EXA-7311-G3", “EXA-7311-G4", “EXA-7311-G4S”, "HP6000” (naphthylene ether type epoxy resin); "EPPN-502H” manufactured by Nippon Kayakusha.
  • Trisphenol type epoxy resin "NC7000L” (naphthol novolac type epoxy resin), "NC3000H”, “NC3000”, “NC3000L”, “NC3100” (biphenyl type epoxy resin); "ESN475V” manufactured by Nittetsu Chemical & Materials Co., Ltd.
  • liquid epoxy resin and a solid epoxy resin are used in combination as the component (B-1), their quantity ratio (liquid epoxy resin: solid epoxy resin) is preferably 1: 0.1 to mass ratio. It is 1: 4, more preferably 1: 0.3 to 1: 3.5, and even more preferably 1: 0.6 to 1: 3.
  • the amount ratio of the liquid epoxy resin to the solid epoxy resin is within such a range, the desired effect of the present invention can be remarkably obtained.
  • the epoxy equivalent of the epoxy resin as the component (B-1) is preferably 50 g / eq. ⁇ 5000g / eq. , More preferably 50 g / eq. ⁇ 3000g / eq. , More preferably 80 g / eq. ⁇ 2000g / eq. , Even more preferably 110 g / eq. ⁇ 1000g / eq. Is. Within this range, the crosslink density of the cured product becomes sufficient, and a magnetic layer having a small surface roughness can be provided.
  • the epoxy equivalent can be measured according to JIS K7236, and is the mass of the resin containing 1 equivalent of the epoxy group.
  • the weight average molecular weight of the epoxy resin as the component (B-1) is preferably 100 to 5000, more preferably 250 to 3000, and even more preferably 400 to 1500.
  • the weight average molecular weight of the epoxy resin is a polystyrene-equivalent weight average molecular weight measured by a gel permeation chromatography (GPC) method.
  • the active ester resin a resin having one or more active ester groups in one molecule can be used.
  • the active ester-based resin has two or more ester groups with high reactive activity such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds in one molecule. Resin is preferred.
  • the active ester resin is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound.
  • an active ester resin obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester resin obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable.
  • carboxylic acid compound examples include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.
  • phenol compound or naphthol compound examples include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-.
  • the "dicyclopentadiene-type diphenol compound” refers to a diphenol compound obtained by condensing two phenol molecules with one dicyclopentadiene molecule.
  • the active ester-based resin examples include an active ester-based resin containing a dicyclopentadiene-type diphenol structure, an active ester-based resin containing a naphthalene structure, an active ester-based resin containing an acetylated product of phenol novolac, and a benzoyl of phenol novolac.
  • active ester-based resins containing compounds examples include active ester-based resins containing compounds. Of these, an active ester resin containing a naphthalene structure and an active ester resin containing a dicyclopentadiene type diphenol structure are more preferable.
  • the "dicyclopentadiene-type diphenol structure" represents a divalent structural unit composed of phenylene-dicyclopentylene-phenylene.
  • phenolic resin and the naphthol resin those having a novolak structure are preferable from the viewpoint of heat resistance and water resistance. Further, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferable, and a triazine skeleton-containing phenol-based resin is more preferable.
  • phenolic resin and the naphthol resin include "MEH-7700”, “MEH-7810", “MEH-7851” manufactured by Meiwa Kasei Co., Ltd., and “NHN” and “CBN” manufactured by Nippon Kayaku Co., Ltd. , "GPH”, “SN170”, “SN180”, “SN190”, “SN475", “SN485", “SN495", “SN-495V”, “SN375”, “SN395" manufactured by Nippon Steel Chemical & Materials Co., Ltd. , DIC Corporation "TD-2090", “LA-7052”, “LA-7054”, “LA-1356”, “LA-3018-50P”, “EXB-9500” and the like.
  • benzoxazine-based resin examples include "JBZ-OD100” (benzoxazine ring equivalent 218 g / eq.), “JBZ-OP100D” (benzoxazine ring equivalent 218 g / eq.), And “ODA-” manufactured by JFE Chemical Co., Ltd. "BOZ” (benzoxazine ring equivalent 218 g / eq.); “Pd” (benzoxazine ring equivalent 217 g / eq.), “FA” (benzoxazine ring equivalent 217 g / eq.) Manufactured by Shikoku Kasei Kogyo Co., Ltd. Examples thereof include “HFB2006M” manufactured by Showa Polymer Co., Ltd. (benzoxazine ring equivalent 432 g / eq.).
  • cyanate ester-based resin examples include bisphenol A disicianate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis (2,6-dimethylphenylcyanate), and 4,4'.
  • cyanate ester resin examples include “PT30” and “PT60” (phenol novolac type polyfunctional cyanate ester resin), “ULL-950S” (polyfunctional cyanate ester resin), and “BA230” manufactured by Ronza Japan. Examples thereof include “BA230S75” (a prepolymer in which part or all of bisphenol A disyanate is triazined to form a trimer).
  • carbodiimide-based resin examples include carbodilite (registered trademark) V-03 (carbodiimide group equivalent: 216 g / eq.), V-05 (carbodiimide group equivalent: 262 g / eq.), V-07 manufactured by Nisshinbo Chemical Co., Ltd. (Carbodiimide group equivalent: 200 g / eq.), V-09 (carbodiimide group equivalent: 200 g / eq.); Stavaxol® P (carbodiimide group equivalent: 302 g / eq.) Manufactured by Rheinchemy.
  • amine-based resin examples include resins having one or more amino groups in one molecule, and examples thereof include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. Of these, aromatic amines are preferable from the viewpoint of achieving the desired effects of the present invention.
  • the amine-based resin is preferably a primary amine or a secondary amine, more preferably a primary amine.
  • Specific examples of amine-based curing agents include 4,4'-methylenebis (2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'.
  • amine resin for example, "KAYABOND C-200S”, “KAYABOND C-100", “Kayahard AA”, “Kayahard AB”, “Kayahard” manufactured by Nippon Kayaku Corporation.
  • examples include “AS” and “Epicure W” manufactured by Mitsubishi Chemical Corporation.
  • the acid anhydride-based resin examples include resins having one or more acid anhydride groups in one molecule.
  • Specific examples of the acid anhydride-based resin include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, and methylnadic hydride anhydride.
  • the amount ratio of the epoxy resin to all the curing agents is [total number of epoxy groups in the epoxy resin]: [total number of reactive groups in the curing agent]. ],
  • the range is preferably 1: 0.01 to 1: 5, more preferably 1: 0.5 to 1: 3, and even more preferably 1: 1 to 1: 2.
  • the "number of epoxy groups in the epoxy resin” is a total value obtained by dividing the mass of the non-volatile component of the epoxy resin present in the resin composition by the epoxy equivalent.
  • the "number of active groups of the curing agent” is a total value obtained by dividing the mass of the non-volatile component of the curing agent present in the resin composition by the active group equivalent.
  • thermosetting resin a thermosetting resin is contained as a component (B)
  • the content of the (B-1) thermosetting resin is determined in the resin composition from the viewpoint of obtaining a cured product having excellent mechanical properties and magnetic properties.
  • the non-volatile component of the above is 100% by mass, it is preferably 1% by mass or more, more preferably 5% by mass or more, and further preferably 10% by mass or more.
  • the upper limit is not particularly limited as long as the effect of the present invention is exhibited, but is preferably 30% by mass or less, more preferably 20% by mass or less, and further preferably 15% by mass or less.
  • the component (B) may contain a dispersant (B-2).
  • B-2 Dispersants include, for example, phosphate ester dispersants such as polyoxyethylene alkyl ether phosphoric acid; ammonium salts of sodium dodecylbenzel sulfonate, sodium laurate, polyoxyethylene alkyl ether sulfate and the like.
  • Anionic dispersants organosiloxane-based dispersants, acetylene glycols, polyoxyethylene alkyl ethers, polyoxyethylene alkyl esters, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl amines, polyoxyethylene alkyl Examples thereof include nonionic dispersants such as amides. Of these, anionic dispersants are preferred. (B-2) The dispersant may be used alone or in combination of two or more.
  • a commercially available product can be used as the phosphoric acid ester-based dispersant.
  • Examples of commercially available products include "RS-410", “RS-610", “RS-710” and the like of the "Phosphanol” series manufactured by Toho Chemical Industry Co., Ltd.
  • organosiloxane-based dispersant examples include “BYK347” and “BYK348” manufactured by Big Chemie.
  • polyoxyalkylene-based dispersants As commercially available polyoxyalkylene-based dispersants, "AKM-0531”, “AFB-1521”, “SC-0505K”, “SC-1015F” and “SC-” of the "Marialim” series manufactured by NOF CORPORATION “0708A”, "HKM-50A” and the like can be mentioned.
  • the polyoxyalkylene dispersant includes polyoxyethylene alkyl ether, polyoxyethylene alkyl ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene alkyl phenyl ether, polyoxyethylene alkyl amine, polyoxyethylene alkyl amide and the like. It is a generic term.
  • acetylene glycol As a commercially available product, Air Products and Chemicals Inc. Examples thereof include “82”, “104", “440”, “465" and “485", and "Olefin Y" of the "Surfinol” series manufactured by Japan.
  • the content of the dispersant (B-2) is 100 mass by mass of the non-volatile component in the resin composition from the viewpoint of exerting the effect of the present invention remarkably.
  • it is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, still more preferably 0.5% by mass or more, and the upper limit is preferably 5% by mass or less, more preferably 3%. It is mass% or less, more preferably 1.5 mass% or less.
  • the component (B) may contain (B-3) a thermoplastic resin.
  • the thermoplastic resin (B-3) include phenoxy resin, acrylic resin, polycarbonate resin, polyvinyl acetal resin, polyolefin resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, and polyphenylene. Examples thereof include ether resin, polyether ether ketone resin, polyester resin and the like. Of these, a phenoxy resin is preferable from the viewpoint of remarkably obtaining the desired effect of the present invention. Further, the (B-3) thermoplastic resin may be used alone by one type, or may be used in combination of two or more types.
  • polyimide resin a resin having an imide structure can be used.
  • a resin having an imide structure examples include a linear polyimide (polyimide described in JP-A-2006-37083) obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride, and a polysiloxane skeleton.
  • modified polyimides such as contained polyimides (polyimides described in JP-A-2002-12667 and JP-A-2000-319386).
  • a commercially available product can be used as the polyimide resin.
  • Examples of commercially available products include "Rikacoat SN20” and “Rikacoat PN20” manufactured by New Japan Chemical Co., Ltd.
  • a resin having a carbonate structure can be used as the polycarbonate resin.
  • a resin having a carbonate structure examples include a hydroxy group-containing carbonate resin, a phenolic hydroxyl group-containing carbonate resin, a carboxy group-containing carbonate resin, an acid anhydride group-containing carbonate resin, an isocyanate group-containing carbonate resin, and a urethane group-containing carbonate resin.
  • phenoxy resin examples include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetphenone skeleton, novolak skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantan skeleton, and terpen
  • the terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.
  • phenoxy resin examples include "1256” and “4250” manufactured by Mitsubishi Chemical Co., Ltd. (both are bisphenol A skeleton-containing phenoxy resins); “YX8100” manufactured by Mitsubishi Chemical Co., Ltd. (bisphenol S skeleton-containing phenoxy resin); “YX6954” (bisphenol acetophenone skeleton-containing phenoxy resin); “FX280” and “FX293” manufactured by Nittetsu Chemical &Materials; "YL7500BH30", “YX6954BH30", “YX7553”, “YX7553BH30” manufactured by Mitsubishi Chemical Co., Ltd. , "YL7769BH30", “YL6794", "YL7213", “YL7290”, “YL7553BH30", “YL7482”; and the like.
  • the acrylic resin a functional group-containing acrylic resin is preferable, and an epoxy group-containing acrylic resin having a glass transition temperature of 25 ° C. or less is more preferable, from the viewpoint of remarkably obtaining the effect of the present invention.
  • the functional group of the functional group-containing acrylic resin include a phenolic hydroxyl group and an epoxy group.
  • the number average molecular weight (Mn) of the functional group-containing acrylic resin is preferably 10,000 to 1,000,000, and more preferably 30,000 to 900,000.
  • the functional group equivalent of the functional group-containing acrylic resin is preferably 1000 to 50,000, and more preferably 2500 to 30,000.
  • an epoxy group-containing acrylic acid ester copolymer resin having a glass transition temperature of 25 ° C. or lower is preferable, and a specific example thereof is “SG” manufactured by Nagase ChemteX Corporation.
  • polyvinyl acetal resin examples include polyvinyl formal resin and polyvinyl butyral resin, and polyvinyl butyral resin is preferable.
  • Specific examples of polyvinyl acetal resin include Denka's electrified butyral "4000-2", “5000-A”, “6000-C”, “6000-EP”, Sekisui Chemical's Eslek BH series, and BX. Examples include a series (for example, BX-5Z), a KS series (for example, KS-1), a BL series, and a BM series.
  • polyamide-imide resin examples include "Vilomax HR11NN” and “Vilomax HR16NN” manufactured by Toyobo Co., Ltd.
  • polyamide-imide resin examples include modified polyamide-imides such as “KS9100” and “KS9300” (polysiloxane skeleton-containing polyamide-imide) manufactured by Hitachi Chemical Co., Ltd.
  • polyether sulfone resin examples include "PES5003P” manufactured by Sumitomo Chemical Co., Ltd.
  • polyetherimide resin examples include "Ultem” manufactured by GE.
  • polyphenylene ether resin examples include oligophenylene ether styrene resin "OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Company.
  • polyetheretherketone resin examples include "Sumiproi K” manufactured by Sumitomo Chemical Co., Ltd.
  • polysulfone resin examples include polysulfones “P1700” and “P3500” manufactured by Solvay Advanced Polymers Co., Ltd.
  • polystyrene resin examples include ethylene-based copolymers such as low-density polyethylene, ultra-low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer.
  • Resin Polyolefin-based elastomers such as polypropylene and ethylene-propylene block copolymers can be mentioned.
  • polyester resin examples include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, polycyclohexanedimethyl terephthalate resin and the like.
  • the weight average molecular weight (Mw) of the thermoplastic resin is preferably 8,000 or more, more preferably 10,000 or more, and particularly preferably 20, from the viewpoint of significantly obtaining the desired effect of the present invention. It is 000 or more, preferably 1,000,000 or less, more preferably 750,000 or less, and particularly preferably 500,000 or less.
  • thermoplastic resin a thermoplastic resin is contained as the component (B), the content of the (B-3) thermoplastic resin is 100, which is a non-volatile component in the resin composition from the viewpoint of remarkably obtaining the effect of the present invention.
  • mass% it is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, further preferably 0.1% by mass or more, preferably 3% by mass or less, and more preferably 1% by mass.
  • mass% it is more preferably 0.5% by mass or less.
  • the component (B) may contain a curing accelerator (B-4).
  • the curing accelerator include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, and the like, and phosphorus-based curing accelerators and amine-based curing accelerators.
  • a curing accelerator, an imidazole-based curing accelerator, and a metal-based curing accelerator are preferable, an amine-based curing accelerator, an imidazole-based curing accelerator, and a metal-based curing accelerator are more preferable, and an imidazole-based curing accelerator is further preferable.
  • the curing accelerator may be used alone or in combination of two or more.
  • Examples of the phosphorus-based curing accelerator include triphenylphosphine, phosphonium borate compound, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, and (4-methylphenyl) triphenylphosphonium thiocyanate.
  • Tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate and the like, and triphenylphosphine and tetrabutylphosphonium decanoate are preferable.
  • amine-based curing accelerator examples include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl) phenol, and 1,8-diazabicyclo. Examples thereof include (5,4,0) -undecene, and 4-dimethylaminopyridine and 1,8-diazabicyclo (5,4,5) -undecene are preferable.
  • imidazole-based curing accelerator examples include 2-methylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazole, 1,2-dimethyl imidazole, 2-ethyl-4-methyl imidazole, 1,2-dimethyl imidazole, and the like.
  • imidazole-based curing accelerator a commercially available product may be used, and examples thereof include “2P4MZ” manufactured by Shikoku Chemicals Corporation and "P200-H50” manufactured by Mitsubishi Chemical Corporation.
  • guanidine-based curing accelerator examples include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, diphenylguanidine, and trimethylguanidine.
  • the metal-based curing accelerator examples include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin.
  • organic metal complex examples include an organic cobalt complex such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, an organic copper complex such as copper (II) acetylacetonate, and zinc (II) acetylacetonate.
  • organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, and organic manganese complexes such as manganese (II) acetylacetonate.
  • organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate and the like.
  • the content of the (B-4) curing accelerator is 100 non-volatile components in the resin composition from the viewpoint of obtaining a cured product having better mechanical properties.
  • mass% it is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, still more preferably 0.5% by mass or more, preferably 5% by mass or less, and more preferably 3% by mass.
  • mass% it is more preferably 1.5% by mass or less.
  • the content of the solid resin component is preferably 25% by mass or less, more preferably 20% by mass or less, when the (B) resin component in the resin composition is 100% by mass. It is more preferably 15% by mass or less, 10% by mass or less, or 8% by mass or less, preferably 0.1% by mass or more, more preferably 0.5% by mass or more, still more preferably 1% by mass. That is all.
  • the "solid resin component” refers to a solid resin component having a viscosity of 20 Pa ⁇ s or more at 25 ° C. By adjusting the content of the solid resin component so as to be within such a range, it is possible to reduce the viscosity of the resin composition.
  • the resin composition may further contain any additive, if desired.
  • additives include organic metal compounds such as flame retardants, organic copper compounds, organozinc compounds and organocobalt compounds, and thickeners, defoaming agents, leveling agents, adhesion-imparting agents, and adhesion agents.
  • resin additives such as colorants.
  • the resin composition can be produced, for example, by a method of stirring the compounding components using a stirring device such as a three-roll or rotary mixer.
  • Resin compositions usually exhibit the property of having a low viscosity. Therefore, the resin composition has the property of being in the form of a paste (paste-like resin composition).
  • the viscosity of the resin composition is usually 20 Pa ⁇ s or more, preferably 30 Pa ⁇ s or more, and usually 200 Pa ⁇ s or less, preferably 180 Pa ⁇ s or less at 25 ° C.
  • the viscosity can be measured using an E-type viscometer while keeping the temperature of the resin composition at 25 ⁇ 2 ° C., and the details can be measured according to the method described in Examples described later.
  • the resin composition usually has a low viscosity, so it is usually in the form of a paste. Therefore, the content of the solvent contained in the resin composition is preferably less than 1.0% by mass, more preferably 0.8% by mass or less, still more preferably 0.5, based on the total mass of the resin composition. It is mass% or less, particularly preferably 0.1 mass% or less. The lower limit is 0.001% by mass or more, or no content, without particular limitation.
  • the viscosity of the resin composition can be lowered by using a normally liquid resin component or the like even if it does not contain a solvent. Since the amount of the solvent in the resin composition is small, it is possible to suppress the generation of voids due to the volatilization of the solvent, and it is also possible to adapt to vacuum printing.
  • the cured product obtained by thermosetting the resin composition at 190 ° C. for 90 minutes exhibits a characteristic of high relative magnetic permeability at a frequency of 100 MHz.
  • the specific magnetic permeability at a frequency of 100 MHz is preferably 3 or more, more preferably 5 or more, and even more preferably 7 or more.
  • the upper limit is not particularly limited, but may be 30 or less.
  • the specific magnetic permeability can be measured according to the method described in Examples described later.
  • the cured product obtained by thermosetting the resin composition at 190 ° C. for 90 minutes exhibits a characteristic of having a low loss coefficient at a frequency of 100 MHz.
  • the loss factor at a frequency of 100 MHz is preferably 0.2 or less, more preferably 0.15 or less, still more preferably 0.1 or less, or 0.09 or less.
  • the lower limit is not particularly limited, but may be 0.0001 or more.
  • the loss factor can be measured according to the method described in Examples described later.
  • the cured product obtained by thermosetting the resin composition at 190 ° C. for 90 minutes exhibits a characteristic of high maximum point strength.
  • the maximum point strength is preferably 60 MPa or more, more preferably 65 MPa or more, still more preferably 70 MPa or more.
  • the upper limit is not particularly limited, but may be 200 MPa or less.
  • the maximum point strength can be measured according to the method described in Examples described later.
  • the cured product obtained by thermosetting the resin composition at 190 ° C. for 90 minutes exhibits a characteristic of high elongation.
  • the elongation is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.2% or more.
  • the upper limit is not particularly limited, but may be 5% or less. Elongation can be measured according to the method described in Examples described below.
  • the magnetic sheet includes a support and a resin composition layer provided on the support and formed of the resin composition of the present invention.
  • the thickness of the resin composition layer is preferably 250 ⁇ m or less, more preferably 200 ⁇ m or less, from the viewpoint of thinning.
  • the lower limit of the thickness of the resin composition layer is not particularly limited, but may be usually 5 ⁇ m or more, 10 ⁇ m or more, or the like.
  • Examples of the support include a film made of a plastic material, a metal foil, and a paper pattern, and a film made of a plastic material and a metal foil are preferable.
  • the plastic material may be, for example, polyethylene terephthalate (hereinafter abbreviated as "PET”) or polyethylene naphthalate (hereinafter abbreviated as “PEN”).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • Etc. polyester, polycarbonate (hereinafter sometimes abbreviated as “PC”), acrylic such as polymethylmethacrylate (PMMA), cyclic polyolefin, triacetylcellulose (TAC), polyethersulfide (PES), polyether. Examples thereof include ketones and polyimides.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • Etc. polyester, polycarbonate (hereinafter sometimes abbreviated as “PC”), acrylic such as polymethylmethacrylate (PMMA), cyclic polyolefin, triacetylcellulose (TAC), polyethersulfide (PES), polyether. Examples thereof include ketones and polyimides.
  • PC poly
  • the metal foil When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, and copper foil is preferable.
  • the copper foil a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. You may use it.
  • the support may be matted or corona-treated on the surface to be joined to the resin composition layer.
  • a support with a release layer having a release layer on the surface to be joined with the resin composition layer may be used.
  • the release agent used for the release layer of the support with the release layer include one or more release agents selected from the group consisting of alkyd resin, polyolefin resin, urethane resin, and silicone resin. ..
  • a commercially available product may be used. For example, "PET501010” and "SK-" manufactured by Lintec Corporation, which are PET films having a release layer containing an alkyd resin-based release agent as a main component.
  • the thickness of the support is not particularly limited, but is preferably in the range of 5 ⁇ m to 75 ⁇ m, and more preferably in the range of 10 ⁇ m to 60 ⁇ m.
  • the thickness of the entire support with a release layer is preferably in the above range.
  • a protective film similar to the support can be further laminated on the surface of the resin composition layer that is not bonded to the support (that is, the surface opposite to the support).
  • the thickness of the protective film is not particularly limited, but is, for example, 1 ⁇ m to 40 ⁇ m.
  • the inductor substrate of the present invention contains a magnetic layer which is a cured product of the resin composition of the present invention.
  • a coil is formed by the conductor pattern of the board, and not only the inductor board provided with the inductor on the board but also the board provided with the inductor is mounted on the board such as a circuit board as a component such as a chip inductor.
  • the inductor substrate is also included.
  • FIG. 1 is a schematic plan view of an inductor substrate according to an embodiment of the present invention.
  • the inductor substrate 1 includes a substrate 11, a magnetic layer 12, and a wiring 13 formed of a conductor.
  • the wiring 13 is covered with the magnetic layer 12, and the wiring 13 is formed in a spiral shape around the core portion 14. Has been done. Further, a magnetic layer 12 is embedded in the core portion 14.
  • the manufacturing method of the inductor substrate is (1) A step of discharging a resin composition onto a substrate, thermosetting the resin composition, and forming a first magnetic layer. (2) A process of forming wiring on the first magnetic layer, (3) A step of discharging a resin composition onto a first magnetic layer, a core portion and wiring, and thermosetting the resin composition to form a second magnetic layer. including.
  • the magnetic layer 12 includes the first and second magnetic layers.
  • the resin composition is discharged onto the substrate and the resin composition is thermoset to form the first magnetic layer.
  • a step of preparing the resin composition may be included.
  • the substrate is usually an insulating substrate.
  • the substrate material include insulating substrates such as glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates.
  • the substrate may be an inner layer circuit board in which wiring or the like is built within the thickness thereof.
  • the resin composition is filled in a syringe, a needle, a cartridge, or the like, and is applied onto the substrate by discharging the resin composition with a discharge device such as a dispenser. Further, the resin composition may be applied onto the substrate by full-face printing or pattern printing. After coating, it is thermoset to obtain a first magnetic layer.
  • the thermosetting conditions of the resin composition differ depending on the composition and type of the resin composition, but the curing temperature is preferably 120 ° C. or higher, more preferably 130 ° C. or higher, still more preferably 150 ° C. or higher, preferably 240 ° C. or higher. Below, it is more preferably 220 ° C. or lower, still more preferably 200 ° C. or lower.
  • the curing time of the resin composition is preferably 5 minutes or more, more preferably 10 minutes or more, further preferably 15 minutes or more, preferably 120 minutes or less, more preferably 100 minutes or less, still more preferably 90 minutes or less. is there.
  • the resin composition Before the resin composition is thermosetting, the resin composition may be subjected to a preheat treatment in which the resin composition is heated at a temperature lower than the curing temperature.
  • the temperature of the preheat treatment is preferably 50 ° C. or higher, preferably 60 ° C. or higher, more preferably 70 ° C. or higher, preferably less than 120 ° C., preferably 110 ° C. or lower, and more preferably 100 ° C. or lower.
  • the time of the preheat treatment is usually preferably 5 minutes or more, more preferably 15 minutes or more, preferably 150 minutes or less, and more preferably 120 minutes or less.
  • the wiring is formed on the first magnetic layer formed in the step (1).
  • the wiring forming method include a plating method, a sputtering method, and a vapor deposition method, and the plating method is particularly preferable.
  • the surface of the first magnetic layer is plated by an appropriate method such as a semi-additive method or a full additive method to form a wiring having a spiral wiring pattern.
  • Wiring materials include, for example, single metals such as gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium; gold, platinum, palladium, silver, Examples include alloys of two or more metals selected from the group of copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Above all, from the viewpoint of versatility, cost, ease of patterning, etc., it is possible to use chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or nickel-chromium alloy, copper nickel alloy, copper titanium alloy. It is preferable to use chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy, and it is even more preferable to use copper.
  • single metals such as gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium
  • a plating seed layer is formed on the surface of the first magnetic layer by electroless plating.
  • an electrolytic plating layer is formed on the formed plating seed layer by electrolytic plating, and if necessary, an unnecessary plating seed layer is removed by a treatment such as etching to form a wiring having a desired wiring pattern. it can.
  • annealing treatment may be performed if necessary for the purpose of improving the peel strength of the wiring. The annealing treatment can be performed, for example, by heating the substrate at 150 to 200 ° C. for 20 to 90 minutes.
  • a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to the spiral pattern.
  • the mask pattern is removed after forming an electrolytic plating layer by electrolytic plating on the exposed plating seed layer. Then, the unnecessary plating seed layer is removed by a treatment such as etching to form a wiring having a desired pattern.
  • the thickness of the wiring is preferably 70 ⁇ m or less, more preferably 60 ⁇ m or less, still more preferably 50 ⁇ m or less, even more preferably 40 ⁇ m or less, particularly preferably 30 ⁇ m or less, 20 ⁇ m or less, 15 ⁇ m from the viewpoint of thinning. It is less than or equal to 10 ⁇ m or less.
  • the lower limit is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, still more preferably 5 ⁇ m or more.
  • the resin composition is discharged onto the first magnetic layer, the core portion and the wiring, and the resin composition is thermoset to form the second magnetic layer.
  • the method for forming the second magnetic layer is the same as that for the first magnetic layer.
  • the resin composition forming the first magnetic layer and the resin composition forming the second magnetic layer may be the same or different from each other.
  • a step of forming an insulating layer on the first magnetic layer may be provided. Further, after the step (2), a step of forming an insulating layer on the wiring may be provided.
  • the insulating layer may be formed in the same manner as the insulating layer of the circuit board, or the same material as the insulating layer of the circuit board may be used.
  • the circuit board includes the inductor board of the present invention.
  • the circuit board can be used as a board for mounting an electronic component such as a semiconductor chip, and can also be used as a multi-layer circuit board (multi-layer printed wiring board) in which such a circuit board is used as an inner layer board. Further, the circuit board can be used as an individualized chip inductor component, or the chip inductor component can be used as a surface-mounted circuit board.
  • various types of semiconductor devices can be manufactured by using such a circuit board.
  • the semiconductor device including such a circuit board can be suitably used for electric products (for example, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (for example, motorcycles, automobiles, trains, ships, aircraft, etc.) and the like. ..
  • a nitrogen flow (60 ml / min) and a cooling tube were attached to a three-necked flask, and a mixed solution of 20 ml of ethanol and ammonia water (16 mass% ammonia water consisting of 23.7 g of water and 4.59 g of ammonia) was added, and 25 The mixture was stirred at 300 rpm for 1 hour in an oil bath at ° C. 2.2 g of tetraethyl orthosilicate diluted with 300 mL of ethanol was added with a dropping funnel, and the mixture was reacted at 25 ° C. for 3 hours while stirring at 500 rpm with a forced stirrer.
  • a core-shell structure magnetic filler A in which silicon dioxide was formed as a coating layer on the surface of the magnetic core particles.
  • the core particles were coated with a coating layer having a thickness of 2.5 nm.
  • ⁇ Manufacturing Example 2 Fabrication of Magnetic Filler B>
  • the amount of tetraethyl orthosilicate was changed from 2.2 g to 1.1 g.
  • a magnetic filler B was produced in the same manner as in Production Example 1 except for the above items.
  • the core particles were coated with a coating layer having a thickness of 1 nm.
  • ⁇ Manufacturing Example 4 Fabrication of Magnetic Filler D> As core particles, 300 g of magnetic powder (Fe-Mn-based ferrite, "M05S", average particle size 3 ⁇ m, manufactured by Powder Tech Co., Ltd.) is put into a 3 liter separable flask, 1400 g of mineral spirit is added, and then stirring is performed. To make a slurry. While continuing stirring, nitrogen gas was purged into the system to create a nitrogen atmosphere, and then the temperature was raised to 80 ° C., and while maintaining this condition, 0.019 g of acrylic acid and trimethylolpropane triacrylate 0. 18 g, 0.17 g of tricyclodecanedimethanol dimethacrylate and 0.021 g of azobisisobutyronitrile (AIBN) were added to the above slurry.
  • AIBN azobisisobutyronitrile
  • Magnetic Filler E As magnetic particles, 300 g of magnetic powder (Fe-Mn-based ferrite, "M05S", average particle size 3 ⁇ m, manufactured by Powder Tech) was added to a coffee mill, and a silane coupling agent ("KBM-103", phenyltri) was added. After adding 0.5 g of methoxysilane (manufactured by Shinetsu Chemical Industry Co., Ltd.), the mixture was stirred for 1 minute. After stirring, the mixture was stored at 40 ° C. for 1 day to obtain a magnetic filler E surface-treated with a silane coupling agent.
  • Magnetic Filler G As core particles, 100 g of magnetic powder (Mn—Zn-based ferrite, “MZ05S”, average particle size 3 ⁇ m, manufactured by Powder Tech) was put into a 1500 mL three-necked flask, 60 ml of ethanol was added, and ultrasonic dispersion was performed for 53 minutes. Was done.
  • Mn—Zn-based ferrite, “MZ05S”, average particle size 3 ⁇ m, manufactured by Powder Tech 100 g of magnetic powder (Mn—Zn-based ferrite, “MZ05S”, average particle size 3 ⁇ m, manufactured by Powder Tech) was put into a 1500 mL three-necked flask, 60 ml of ethanol was added, and ultrasonic dispersion was performed for 53 minutes. Was done.
  • a nitrogen flow (60 ml / min) and a cooling tube were attached to a three-necked flask, and a mixed solution of 20 ml of ethanol and ammonia water (16 mass% ammonia water consisting of 23.7 g of water and 4.59 g of ammonia) was added, and 25 The mixture was stirred at 300 rpm for 1 hour in an oil bath at ° C. 2.2 g of tetraethyl orthosilicate diluted with 300 mL of ethanol was added with a dropping funnel, and the mixture was reacted at 25 ° C. for 3 hours while stirring at 500 rpm with a forced stirrer.
  • a core-shell structure magnetic filler G in which silicon dioxide was formed as a coating layer on the surface of the magnetic core particles.
  • the core particles were coated with a coating layer having a thickness of 2.5 nm.
  • Epoxy resin (“ZX-1059", a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin, manufactured by Nittetsu Chemical & Materials Co., Ltd.) 8.8 parts by mass, epoxy resin ("ED-523T”, low viscosity epoxy Resin, 5 parts by mass of ADEKA), dispersant ("RS-710", phosphoric acid ester dispersant, manufactured by Toho Kagaku Co., Ltd.), 1 part by mass, curing accelerator (“2P4MZ”, imidazole curing accelerator, Shikoku (Manufactured by Kasei Co., Ltd.) 1 part by mass and 100 parts by mass of the magnetic filler A were mixed and uniformly dispersed by three rolls to prepare a paste-like resin composition.
  • Example 2 In Example 1, 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic filler B. A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Example 3 In Example 1, 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic filler C. A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Epoxy resin (“ZX-1059", a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin, manufactured by Nittetsu Chemical & Materials Co., Ltd.) 8.8 parts by mass, epoxy resin ("ED-523T”, low viscosity epoxy Resin, manufactured by ADEKA, 4.1 parts by mass, dispersant ("RS-710", phosphate ester dispersant, manufactured by Toho Kagaku Co., Ltd.), 1 part by mass, epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd.
  • Example 5 In Example 1, 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic filler G. A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Example 1 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic powder (“M05S”, Fe—Mn-based ferrite, average particle size 3 ⁇ m, manufactured by Powder Tech Co., Ltd.). A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Example 2 In Example 1, 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic filler D. A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Example 3 In Example 1, 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic filler E. A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Example 4 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic powder (“M05S”, Fe—Mn-based ferrite, average particle size 3 ⁇ m, manufactured by Powder Tech Co., Ltd.). A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Example 1 100 parts by mass of magnetic filler A is changed to 100 parts by mass of magnetic powder (“AW2-08PF3F”, Fe—Cr—Si alloy (amorphous), average particle size 3 ⁇ m, manufactured by Epson Atmix). It was. A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • Example 6 In Example 1, 100 parts by mass of magnetic filler A was changed to 100 parts by mass of magnetic filler F. A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items. Since the resin composition of Comparative Example 6 did not become a paste, it was diluted with methyl ethyl ketone to prepare a cured product. Moreover, since it was not in the form of a paste, the viscosity could not be measured.
  • Example 7 100 parts by mass of the magnetic filler G was changed to 100 parts by mass of the magnetic powder (“MZ05S”, Mn—Zn-based ferrite, average particle size 3 ⁇ m, manufactured by Powder Tech Co., Ltd.). A paste-like resin composition was prepared in the same manner as in Example 1 except for the above items.
  • a polyethylene terephthalate (PET) film (“PET501010” manufactured by Lintec Corporation, thickness 50 ⁇ m) treated with a silicone-based release agent was prepared.
  • the resin compositions prepared in each Example and each Comparative Example were uniformly applied on the release surface of the PET film with a doctor blade so that the thickness of the resin composition layer after drying was 100 ⁇ m, and a magnetic sheet was applied.
  • Got The obtained magnetic sheet was heated at 190 ° C. for 90 minutes to thermally cure the resin composition layer, and the support was peeled off to obtain a sheet-like cured product.
  • the obtained cured product was cut into test pieces having a width of 5 mm and a length of 18 mm to prepare an evaluation sample.
  • this evaluation sample was measured at a measurement frequency of 100 MHz by a 3-turn coil method, and the specific magnetic permeability ( ⁇ ') and magnetic loss ( ⁇ ') were set at room temperature of 23 ° C. '') was measured to obtain the loss coefficient.
  • a polyethylene terephthalate (PET) film (“PET501010” manufactured by Lintec Corporation, thickness 50 ⁇ m) treated with a silicone-based release agent was prepared.
  • the resin compositions prepared in each Example and each Comparative Example were uniformly applied on the release surface of the PET film with a doctor blade so that the thickness of the resin composition layer after drying was 100 ⁇ m, and a magnetic sheet was applied.
  • Got The obtained magnetic sheet was heated at 190 ° C. for 90 minutes to thermally cure the resin composition layer, and the support was peeled off to obtain a sheet-like cured product.
  • the obtained cured product was subjected to a tensile test using a Tensilon universal testing machine (manufactured by A & D Co., Ltd.) in accordance with the Japanese Industrial Standards (JIS K7127), and the maximum point strength and elongation were measured.
  • a Tensilon universal testing machine manufactured by A & D Co., Ltd.
  • JIS K7127 Japanese Industrial Standards
  • ⁇ Measurement of viscosity of resin composition Keep the temperature of the resin composition of each example and each comparative example at 25 ⁇ 2 ° C, and use an E-type viscometer (“RE-80U” manufactured by Toki Sangyo Co., Ltd., 3 ° ⁇ R9.7 cone, rotation speed 5 rpm). The viscosity was measured using.
  • E-type viscometer (“RE-80U” manufactured by Toki Sangyo Co., Ltd., 3 ° ⁇ R9.7 cone, rotation speed 5 rpm). The viscosity was measured using.
  • the loss coefficient could be reduced without significantly reducing the relative magnetic permeability in the magnetic characteristics. Furthermore, it was found that the mechanical properties were also improved.
  • the component (A) in the resin composition it has become possible to achieve both a decrease in the loss coefficient in the magnetic characteristics and an improvement in the mechanical characteristics.

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823046A (zh) * 2021-01-22 2022-07-29 Tdk株式会社 层叠线圈部件及其制造方法
JPWO2022202939A1 (enrdf_load_stackoverflow) * 2021-03-26 2022-09-29
JP2023077268A (ja) * 2021-11-24 2023-06-05 味の素株式会社 樹脂組成物
JP2023078006A (ja) * 2021-11-25 2023-06-06 味の素株式会社 樹脂シート
EP4475147A4 (en) * 2022-01-31 2025-04-30 FUJIFILM Corporation METHOD FOR PRODUCING A COMPOSITION, MAGNETIC MATERIAL AND ELECTRONIC COMPONENT

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283357A (ja) * 1993-03-30 1994-10-07 Nippon Steel Corp 絶縁被覆Ｍｎ−Ｚｎ系フェライトコアおよびその製造方法
JP2007134465A (ja) * 2005-11-09 2007-05-31 Toda Kogyo Corp 電波吸収材用球状複合体粒子粉末及びその製造方法、該複合体粒子粉末を含む半導体封止用樹脂組成物
WO2016121744A1 (ja) * 2015-01-28 2016-08-04 パウダーテック株式会社 磁性フィラー
WO2018194100A1 (ja) * 2017-04-19 2018-10-25 味の素株式会社 樹脂組成物
JP2019067960A (ja) * 2017-10-02 2019-04-25 味の素株式会社 インダクタ基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI653312B (zh) 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
JP6443215B2 (ja) 2015-05-18 2018-12-26 堺化学工業株式会社 顔料用酸化チタン系複合粒子、及びそれを含有する組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283357A (ja) * 1993-03-30 1994-10-07 Nippon Steel Corp 絶縁被覆Ｍｎ−Ｚｎ系フェライトコアおよびその製造方法
JP2007134465A (ja) * 2005-11-09 2007-05-31 Toda Kogyo Corp 電波吸収材用球状複合体粒子粉末及びその製造方法、該複合体粒子粉末を含む半導体封止用樹脂組成物
WO2016121744A1 (ja) * 2015-01-28 2016-08-04 パウダーテック株式会社 磁性フィラー
WO2018194100A1 (ja) * 2017-04-19 2018-10-25 味の素株式会社 樹脂組成物
JP2019067960A (ja) * 2017-10-02 2019-04-25 味の素株式会社 インダクタ基板の製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823046A (zh) * 2021-01-22 2022-07-29 Tdk株式会社 层叠线圈部件及其制造方法
US12300409B2 (en) 2021-01-22 2025-05-13 Tdk Corporation Multilayer coil device and method of manufacturing the same
JPWO2022202939A1 (enrdf_load_stackoverflow) * 2021-03-26 2022-09-29
JP7295506B2 (ja) 2021-03-26 2023-06-21 太陽ホールディングス株式会社 硬化性樹脂組成物
CN117120553A (zh) * 2021-03-26 2023-11-24 太阳控股株式会社 固化性树脂组合物
JP2023077268A (ja) * 2021-11-24 2023-06-05 味の素株式会社 樹脂組成物
JP2023078006A (ja) * 2021-11-25 2023-06-06 味の素株式会社 樹脂シート
JP7619247B2 (ja) 2021-11-25 2025-01-22 味の素株式会社 樹脂シート
EP4475147A4 (en) * 2022-01-31 2025-04-30 FUJIFILM Corporation METHOD FOR PRODUCING A COMPOSITION, MAGNETIC MATERIAL AND ELECTRONIC COMPONENT

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