JPWO2020189778A1 - - Google Patents

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Publication number
JPWO2020189778A1
JPWO2020189778A1 JP2021507429A JP2021507429A JPWO2020189778A1 JP WO2020189778 A1 JPWO2020189778 A1 JP WO2020189778A1 JP 2021507429 A JP2021507429 A JP 2021507429A JP 2021507429 A JP2021507429 A JP 2021507429A JP WO2020189778 A1 JPWO2020189778 A1 JP WO2020189778A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021507429A
Other languages
Japanese (ja)
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JP7552583B2 (ja
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Publication date
Application filed filed Critical
Publication of JPWO2020189778A1 publication Critical patent/JPWO2020189778A1/ja
Application granted granted Critical
Publication of JP7552583B2 publication Critical patent/JP7552583B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2021507429A 2019-03-20 2020-03-19 樹脂組成物 Active JP7552583B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019053604 2019-03-20
JP2019053604 2019-03-20
PCT/JP2020/012472 WO2020189778A1 (ja) 2019-03-20 2020-03-19 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2020189778A1 true JPWO2020189778A1 (enrdf_load_stackoverflow) 2020-09-24
JP7552583B2 JP7552583B2 (ja) 2024-09-18

Family

ID=72520363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021507429A Active JP7552583B2 (ja) 2019-03-20 2020-03-19 樹脂組成物

Country Status (3)

Country Link
JP (1) JP7552583B2 (enrdf_load_stackoverflow)
TW (1) TWI850353B (enrdf_load_stackoverflow)
WO (1) WO2020189778A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7510888B2 (ja) * 2021-01-22 2024-07-04 Tdk株式会社 積層コイル部品およびその製造方法
TW202239616A (zh) * 2021-03-26 2022-10-16 日商太陽油墨製造股份有限公司 硬化性樹脂組成物
JP2023077268A (ja) * 2021-11-24 2023-06-05 味の素株式会社 樹脂組成物
JP7619247B2 (ja) * 2021-11-25 2025-01-22 味の素株式会社 樹脂シート
EP4475147A4 (en) * 2022-01-31 2025-04-30 FUJIFILM Corporation METHOD FOR PRODUCING A COMPOSITION, MAGNETIC MATERIAL AND ELECTRONIC COMPONENT

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283357A (ja) * 1993-03-30 1994-10-07 Nippon Steel Corp 絶縁被覆Ｍｎ−Ｚｎ系フェライトコアおよびその製造方法
JP2007134465A (ja) * 2005-11-09 2007-05-31 Toda Kogyo Corp 電波吸収材用球状複合体粒子粉末及びその製造方法、該複合体粒子粉末を含む半導体封止用樹脂組成物
JP2015187260A (ja) * 2014-03-11 2015-10-29 味の素株式会社 接着フィルム
WO2016121744A1 (ja) * 2015-01-28 2016-08-04 パウダーテック株式会社 磁性フィラー
JP2016216575A (ja) * 2015-05-18 2016-12-22 堺化学工業株式会社 顔料用酸化チタン系複合粒子、及びそれを含有する組成物
WO2018194100A1 (ja) * 2017-04-19 2018-10-25 味の素株式会社 樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7393856B2 (ja) * 2017-10-02 2023-12-07 味の素株式会社 インダクタ基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283357A (ja) * 1993-03-30 1994-10-07 Nippon Steel Corp 絶縁被覆Ｍｎ−Ｚｎ系フェライトコアおよびその製造方法
JP2007134465A (ja) * 2005-11-09 2007-05-31 Toda Kogyo Corp 電波吸収材用球状複合体粒子粉末及びその製造方法、該複合体粒子粉末を含む半導体封止用樹脂組成物
JP2015187260A (ja) * 2014-03-11 2015-10-29 味の素株式会社 接着フィルム
WO2016121744A1 (ja) * 2015-01-28 2016-08-04 パウダーテック株式会社 磁性フィラー
JP2016216575A (ja) * 2015-05-18 2016-12-22 堺化学工業株式会社 顔料用酸化チタン系複合粒子、及びそれを含有する組成物
WO2018194100A1 (ja) * 2017-04-19 2018-10-25 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
WO2020189778A1 (ja) 2020-09-24
TW202104408A (zh) 2021-02-01
TWI850353B (zh) 2024-08-01
JP7552583B2 (ja) 2024-09-18

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