WO2020186517A1 - 电连接组件、电子设备及电连接组件的制备方法 - Google Patents

电连接组件、电子设备及电连接组件的制备方法 Download PDF

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Publication number
WO2020186517A1
WO2020186517A1 PCT/CN2019/079073 CN2019079073W WO2020186517A1 WO 2020186517 A1 WO2020186517 A1 WO 2020186517A1 CN 2019079073 W CN2019079073 W CN 2019079073W WO 2020186517 A1 WO2020186517 A1 WO 2020186517A1
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WIPO (PCT)
Prior art keywords
conductive adhesive
layer
electrical connection
stretchable
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/079073
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English (en)
French (fr)
Inventor
雷晓华
张瑶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2019/079073 priority Critical patent/WO2020186517A1/zh
Priority to CN201980073397.8A priority patent/CN113261392A/zh
Publication of WO2020186517A1 publication Critical patent/WO2020186517A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • the present invention relates to the field of electronic technology, in particular to an electrical connection assembly, an electronic device and a preparation method of the electrical connection assembly.
  • the embodiment of the present invention provides an electrical connection assembly, the electrical connection assembly includes a flexible substrate, a stretchable conductive layer, an elastic conductive adhesive layer, and a flexible circuit board stacked in sequence, the stretchable conductive layer and the flexible
  • the circuit board is electrically connected through the elastic conductive adhesive layer
  • the electrical connection component further includes a non-solid conductive adhesive, and the non-solid conductive adhesive is used to repair cracks generated during the stretching process of the stretchable conductive layer .
  • the electrical connection assembly provided by the embodiment of the present invention includes a flexible substrate, a stretchable conductive layer, an elastic conductive adhesive layer, and a flexible circuit board that are sequentially stacked.
  • the stretchable conductive layer is electrically connected to the flexible circuit board through the elastic conductive adhesive layer.
  • the connection component also includes non-solid conductive adhesive.
  • Non-solid conductive adhesive has the characteristics of standing thickening and shear thinning. When standing still, the viscosity is high and the fluidity is small.
  • the viscosity decreases and the fluidity increases.
  • the viscosity of the non-solid conductive adhesive decreases and the fluidity increases, and then it can flow into the cracks of the stretchable conductive layer.
  • the non-solid conductive adhesive is cured, it will be filled in the stretchable conductive layer. In the cracks of the layer, the cracks generated during the stretching process of the stretchable conductive layer can be repaired, and the problem of electrical connection failure of the stretchable conductive layer due to stretching can be avoided, and the electrical connection components can be maintained stable Electrical connection relationship.
  • An embodiment of the present invention also provides an electronic device, which includes the electrical connection component described in any of the above embodiments.
  • the embodiment of the present invention also provides a method for manufacturing an electrical connection assembly, the method for manufacturing the electrical connection assembly includes:
  • a non-solid conductive glue and an elastic conductive glue layer covering the stretchable conductive layer are formed, wherein the stretchable conductive layer and the elastic conductive glue layer are electrically connected, and the non-solid conductive glue is used to Repairing cracks generated in the stretching process of the stretchable conductive layer;
  • a flexible circuit board covering the elastic conductive adhesive layer is formed, wherein the elastic conductive adhesive layer is electrically connected to the flexible circuit board.
  • Fig. 1 is a schematic structural diagram of a first electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 2 is a schematic structural diagram of a second type of electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 3 is a schematic structural diagram of a third type of electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 4 is a schematic structural diagram of a fourth type of electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 5 is a schematic structural diagram of a fifth electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 6 is a schematic structural diagram of a sixth electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 7 is a schematic structural diagram of a seventh electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 8 is a schematic structural diagram of an eighth electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 9 is a schematic structural diagram of a ninth electrical connection assembly provided by an embodiment of the present invention.
  • Fig. 10 is a schematic structural diagram of a tenth type of electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 11 is a schematic structural diagram of a first electronic device provided by an embodiment of the present invention.
  • Fig. 12 is a first method of manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 13 is a schematic diagram of the structure corresponding to step S100 in FIG. 12.
  • FIG. 14 is a schematic diagram of the structure corresponding to step S200 in FIG. 12.
  • FIG. 15 is a schematic diagram of the structure corresponding to step S300 in FIG. 12.
  • FIG. 16 is a schematic diagram of the structure of a non-solid conductive adhesive in FIG. 12.
  • FIG. 17 is a schematic diagram of the structure corresponding to step S400 in FIG. 12.
  • Fig. 18 is a second method for preparing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 19 is a schematic diagram of the structure corresponding to step S310 in FIG. 18.
  • FIG. 20 is a schematic diagram of the structure corresponding to step S320 in FIG. 18.
  • Fig. 21 is a third method for preparing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 22 is a schematic diagram of the structure corresponding to step S330 in FIG. 21.
  • FIG. 23 is a schematic diagram of the structure corresponding to step S340 in FIG. 21.
  • FIG. 24 is a schematic diagram of the structure corresponding to step S350 in FIG. 21.
  • Fig. 25 is a fourth method for preparing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 26 is a schematic diagram of the structure corresponding to step S360 in FIG. 25.
  • FIG. 27 is a schematic diagram of the structure corresponding to step S370 in FIG. 25.
  • FIG. 28 is a schematic diagram of the structure corresponding to step S380 in FIG. 25.
  • Fig. 29 is a fifth method for preparing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 30 is a schematic diagram of the structure corresponding to step S301 in FIG. 29.
  • FIG. 31 is a schematic diagram of the structure corresponding to step S302 in FIG. 29.
  • FIG. 32 is a schematic diagram of the structure corresponding to step S303 in FIG. 29.
  • Fig. 33 is a sixth method for preparing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 34 is a schematic diagram of the structure corresponding to step S250 in FIG. 33.
  • Fig. 35 is a seventh method for preparing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 36 is a schematic diagram of the structure corresponding to step S270 in FIG. 35.
  • Fig. 37 is an eighth method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • FIG. 38 is a schematic diagram of the structure corresponding to step S500 in FIG. 37.
  • FIG. 1 is a schematic structural diagram of a first electrical connection assembly provided by an embodiment of the present invention.
  • the electrical connection assembly 10 includes a flexible substrate 100, a stretchable conductive layer 200, an elastic conductive adhesive layer 300, and a flexible circuit board 400 stacked in sequence.
  • the stretchable conductive layer 200 and the flexible circuit board 400 pass through
  • the elastic conductive adhesive layer 300 is electrically connected, and the electrical connection assembly 10 further includes a non-solid conductive adhesive 500, and the non-solid conductive adhesive 500 is used to perform cracks on the stretchable conductive layer 200 during the stretching process. repair.
  • the flexible substrate 100 may be an elastic base, such as high elongation silicone rubber.
  • the stretchable conductive layer 200 can be made of liquid silicone silver powder conductive ink.
  • the elastic conductive adhesive layer 300 is a conductive adhesive, such as liquid organic silicon silver powder conductive adhesive, room temperature vulcanized organic silicon conductive adhesive, the elastic conductive adhesive layer 300 has high elasticity, conductivity, and high adhesion, and may be liquid silicone Silver powder conductive adhesive, room temperature vulcanized organic silicon conductive adhesive, and elastic conductive adhesive layer 300 are arranged around non-solid conductive adhesive 500.
  • the elastic conductive adhesive layer 300 may form the elastic conductive adhesive layer 320 at the center and the edge of the binding area of the electrical connection assembly 10 by means of glue dispensing, printing, transfer, or the like.
  • the non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as organic silicon conductive silicone grease, conductive gel, liquid metal, etc. Or a partial mixture of it and the elastic conductive adhesive layer 300.
  • the non-solid conductive adhesive 500 is flowable after being stretched, and has a relatively high viscosity when standing. When the non-solid conductive adhesive 500 is stretched, it can flow into the cracks formed on the surface of the stretchable conductive layer 200 to repair the cracks formed on the surface of the stretchable conductive layer 200.
  • the non-solid conductive glue 500 When the non-solid conductive glue 500 is not stretched, the non-solid conductive glue 500 has greater adhesion, so that the stretchable conductive layer 200 and the flexible circuit board 400 are tightly bonded to make the stretchable The stretched conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship.
  • the flexible circuit board 400 is also called a "soft board", which is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as a substrate. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.
  • the stretchable conductive layer 200 is electrically connected to the flexible circuit board 400 through the elastic conductive adhesive layer 300. Due to the difference in the stretching rate of the stretchable conductive layer 200, the elastic conductive adhesive layer 300, and the flexible circuit board 400, the three will show different magnitudes of deformation when subjected to stretching, which will cause the three to appear Asynchronous stretching effect. In this process, when the stretchable conductive layer 200 is stretched, and the tensile force is greater than a certain threshold or the duration of the stretch is greater than the preset length, the stretchable conductive layer 200 may have cracks.
  • the technical means of the present invention is to cover the stretchable conductive layer 200 with a non-solid conductive adhesive 500.
  • the non-solid conductive adhesive 500 has the characteristics of standing thickening and shear thinning.
  • the non-solid conductive adhesive 500 When standing still, the viscosity is high and the fluidity is small. When it is under pressure or stretched, the viscosity decreases and the fluidity increases. When the stretchable conductive layer 200 is stretched and cracked, the non-solid conductive adhesive 500 has a reduced viscosity and increased fluidity, which can then flow into the cracks of the stretchable conductive layer 200, and then after curing Fill the cracks in the stretchable conductive layer 200 to repair the cracks. Since the non-solid conductive adhesive 500 has conductive properties, the problem of electrical connection failure of the stretchable conductive layer 200 can be avoided, thereby ensuring that the electrical connection assembly 10 maintains a stable electrical connection relationship.
  • the electrical connection assembly 10 provided by the embodiment of the present invention includes a flexible substrate 100, a stretchable conductive layer 200, an elastic conductive adhesive layer 300, and a flexible circuit board 400 stacked in sequence.
  • the stretchable conductive layer 200 is connected to the flexible circuit board through the elastic conductive adhesive layer 300.
  • the circuit board 400 forms an electrical connection, and the electrical connection assembly 10 also includes a non-solid conductive adhesive 500.
  • the stretchable conductive layer 200 is subjected to a tensile force, it will produce tensile deformation.
  • the non-solid conductive adhesive 500 has the characteristics of standing thickening and shear thinning. When standing still, the viscosity is high and the fluidity is small. When it is under pressure or stretched, the viscosity decreases and the fluidity increases. When cracks occur in the stretchable conductive layer 200, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity increases, and it can flow into the cracks of the stretchable conductive layer 200.
  • connection assembly 10 maintains a stable electrical connection relationship.
  • FIG. 2 is a schematic structural diagram of a second type of electrical connection assembly according to an embodiment of the present invention.
  • the structure of the second type of electrical connection component is basically the same as that of the first type of electrical connection component.
  • the difference is that the elastic conductive adhesive layer 300 has a receiving groove 300a on the side adjacent to the stretchable conductive layer 200, so The non-solid conductive adhesive 500 is received in the receiving groove 300a.
  • the opening of the receiving groove 300 a faces the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 is located in the receiving groove 300 a and directly contacts the stretchable conductive layer 200.
  • the part of the stretchable conductive layer 200 corresponding to the receiving groove 300a is electrically connected to the elastic conductive adhesive layer 300 through the non-solid conductive adhesive 500, and other parts of the stretchable conductive layer 200 are directly electrically connected to the elastic conductive adhesive layer 300.
  • the three will show different magnitudes of deformation when they are stretched, which will cause the three to have unsynchronized stretching effects.
  • the stretchable conductive layer 200 may have cracks.
  • the cross-sectional area of the stretchable conductive layer 200 decreases, which will cause the resistance of the stretchable conductive layer 200 to suddenly increase, and further cause the current passing through the stretchable conductive layer 200 to decrease. , It is not conducive to the transmission of electrical signals from the stretchable conductive layer 200.
  • the stretchable conductive layer 200 may be pulled off, destroying the electrical connection between the stretchable conductive layer 200 and the flexible circuit board 400, and blocking the signal passing through the flexible circuit board 400. transmission.
  • the stretchable conductive layer 200 is stretched and cracked, because the non-solid conductive adhesive 500 covers the stretchable conductive layer 200 and is located in the receiving groove 300a of the elastic conductive adhesive layer 300, under the action of gravity, the non-solid conductive adhesive 500
  • the conductive glue 500 can flow into the cracks of the stretchable conductive layer 200, and then fill the cracks of the stretchable conductive layer 200 after curing. Since the non-solid conductive glue 500 has conductive properties, the stretchable conductive layer 200 can be avoided. The problem of electrical connection failure occurs, thereby ensuring that the electrical connection assembly 10 maintains a stable electrical connection relationship.
  • FIG. 3 is a schematic structural diagram of a third type of electrical connection assembly provided by an embodiment of the present invention.
  • the structure of the third type of electrical connection component is basically the same as that of the first type of electrical connection component.
  • the difference is that the elastic conductive adhesive layer 300 has a receiving hole 300b, the receiving hole 300b is a through hole, and the non-solid
  • the conductive glue 500 is received in the receiving hole 300b and is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 400 at the same time.
  • the non-solid conductive adhesive 500 is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 400 at the same time, so that an electrical connection relationship can be formed between the stretchable conductive layer 200 and the flexible circuit board 400 .
  • the elastic conductive adhesive layer 300 is also provided between the stretchable conductive layer 200 and the flexible circuit board 400, the elastic conductive adhesive layer 300 can form an electrical connection between the stretchable conductive layer 200 and the flexible circuit board 400. .
  • at least two electrical connection paths can be formed between the stretchable conductive layer 200 and the flexible circuit board 400.
  • the board 400, the non-solid conductive adhesive 500, the elastic conductive adhesive layer 300 and the stretchable conductive layer 200 form a stable electrical connection relationship, thereby ensuring a stable electrical connection relationship of the electrical connection group and ensuring the normality of the electrical connection assembly 10 use.
  • FIG. 4 is a schematic structural diagram of a fourth electrical connection assembly provided by an embodiment of the present invention.
  • the structure of the fourth type of electrical connection component is basically the same as that of the first type of electrical connection component.
  • the difference is that the elastic conductive adhesive layer 300 has a first receiving hole 301, and the flexible circuit board 400 is adjacent to the elastic conductive
  • One side of the glue layer 300 has a second receiving hole 401, the second receiving hole 401 is connected to the first receiving hole 301, the first receiving hole 301 is a through hole, and the second receiving hole 401 is a blind hole
  • the non-solid conductive glue 500 is contained in the first receiving hole 301 and the second receiving hole 401.
  • the first receiving hole 301 is disposed directly opposite to the second receiving hole 401, and the radial size of the first receiving hole 301 is consistent with the radial size of the second receiving hole 401. Since the first receiving hole 301 is connected to the second receiving hole 401, the first receiving hole 301 and the second receiving hole 401 can be formed at the same time during the preparation process, which helps to save processing steps.
  • the first receiving hole 301 may also be arranged offset from the second receiving hole 401, and the size of the first receiving hole 301 may also be the same as the size of the second receiving hole 401. Inconsistent. That is, the radial size of the first receiving hole 301 is larger than the radial size of the second receiving hole 401, or the radial size of the first receiving hole 301 is smaller than the radial size of the second receiving hole 401 .
  • the second receiving hole 401 is a blind hole, that is, the non-solid conductive adhesive 500 completely penetrates the elastic conductive adhesive layer 300, and the non-solid conductive adhesive 500 Partially penetrates the flexible circuit board 400. Since the non-solid conductive adhesive 500 partially penetrates the flexible circuit board 400, the flexible circuit board 400 generates a partial tensile force on the non-solid conductive adhesive 500, thereby forming a stable electrical connection relationship between the non-solid conductive adhesive 500 and the flexible circuit board 400 .
  • the non-solid conductive adhesive 500 completely penetrates the elastic conductive adhesive layer 300, the non-solid conductive adhesive 500 is not easy to fall out of the elastic conductive adhesive layer 300, so that the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300 maintain stability The electrical connection relationship.
  • a stable electrical connection relationship among the non-solid conductive adhesive 500, the elastic conductive adhesive layer 300, and the flexible circuit board 400 can be maintained.
  • the elastic conductive adhesive layer 300 covers the surface of the stretchable conductive layer 200
  • the elastic conductive adhesive layer 300 and the stretchable conductive layer 200 can maintain a stable electrical connection relationship, that is, The stretchable conductive layer 200 can directly form a stable electrical connection between the elastic conductive adhesive layer 300 and the flexible circuit board 400, and the stretchable conductive layer 200 can also be formed between the non-solid conductive adhesive 500 and the flexible circuit board 400.
  • Stable electrical connection that is, the stretchable conductive layer 200 can form a stable electrical connection with the flexible circuit board 400 through at least two paths, thereby ensuring smooth transmission of electrical signals from the stretchable conductive layer 200 to the flexible
  • the circuit board 400 ensures the normal electrical connection function of the electrical connection assembly 10.
  • FIG. 5 is a schematic structural diagram of a fifth electrical connection assembly according to an embodiment of the present invention.
  • the structure of the fifth electrical connection component is basically the same as that of the first electrical connection component, except that the elastic conductive adhesive layer 300 has a first through hole 302, and the flexible circuit board 400 has a second through hole. 402.
  • the second through hole 402 communicates with the first through hole 302, and the non-solid conductive glue 500 is contained in the first through hole 302 and the second through hole 402, and is electrically connected to the The stretchable conductive layer 200 and the flexible circuit board 400 are described.
  • the second through hole 402 can be in various shapes such as a square or a circle.
  • the non-solid conductive adhesive 500 is located in the first through hole 302 and the second through hole 402.
  • the elastic conductive adhesive layer 300 when it has cracks, it can prevent the cracks in the elastic conductive adhesive layer 300. Repairing, on the other hand, when the flexible circuit board 400 has cracks, the cracks generated by the flexible circuit board 400 can also be repaired.
  • the non-solid conductive glue 500 is located on the surface of the stretchable conductive layer 200, when the stretchable conductive layer 200 has cracks due to stretching, the non-solid conductive glue 500 can resist the stretchable conductive layer 200. Cracks generated during the stretching process are repaired.
  • the first through hole 302 is disposed directly opposite to the second through hole 402, and the radial size of the first through hole 302 is consistent with the radial size of the second through hole 402. Since the first through hole 302 communicates with the second through hole 402, the first through hole 302 and the second through hole 402 can be formed together in the preparation process, which helps to save processing steps.
  • the first through hole 302 may also be offset from the second through hole 402, and the size of the first through hole 302 may also be the same as the size of the second through hole 402. Inconsistent. That is, the radial dimension of the first through hole 302 is greater than the radial dimension of the second through hole 402, or the radial dimension of the first through hole 302 is smaller than the radial dimension of the second through hole 402 .
  • FIG. 6 is a schematic structural diagram of a sixth electrical connection assembly according to an embodiment of the present invention.
  • the structure of the sixth type of electrical connection component is basically the same as that of the first to fifth types of electrical connection components, except that the stretchable conductive layer 200 is provided with a microstructure at a portion corresponding to the non-solid conductive adhesive 500 600.
  • the microstructure 600 is used to increase the adhesion between the non-solid conductive adhesive 500 and the stretchable conductive layer 200.
  • the microstructure 600 may be a zigzag structure to increase the contact area between the non-solid conductive glue 500 and the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 has the characteristics of standing thickening and shear thinning. When standing still, the viscosity is high and the fluidity is small. When it is under pressure or stretched, the viscosity decreases and the fluidity increases. When cracks occur in the stretchable conductive layer 200, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity increases, and it can flow into the cracks of the stretchable conductive layer 200. When the non-solid conductive adhesive 500 is cured, it will be filled The cracks in the conductive layer 200 are stretched to repair the cracks.
  • the stretchable conductive layer 200 is provided with the microstructure 600 at the position corresponding to the non-solid conductive adhesive 500, more non-solid conductive adhesive 500 can be attached to the microstructure 600 of the stretchable conductive layer 200, thereby increasing the non-solid conductive layer 200.
  • the adhesion between the conductive adhesive 500 and the stretchable conductive layer 200 helps to repair the cracks generated in the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 can also exhibit part of the tensile force when the stretchable conductive layer 200 is stretched, which helps to improve the cracks of the stretchable conductive layer 200.
  • FIG. 7 is a schematic structural diagram of a seventh electrical connection assembly according to an embodiment of the present invention.
  • the structure of the seventh electrical connection component is basically the same as the structures of the first to fifth electrical connection components, except that the stretchable conductive layer 200 is provided with bumps in the portion corresponding to the non-solid conductive adhesive 500 The protrusion 210 is used to assist the non-solid conductive glue 500 to flow along the surface of the stretchable conductive layer 200.
  • the protruding portion 210 is arcuately arched.
  • the non-solid conductive adhesive 500 can be assisted to flow toward the connection between the stretchable conductive layer 200 and the elastic conductive adhesive layer 300, thereby allowing more non-solid conductive adhesive 500 to flow In the cracks generated in the stretchable conductive layer 200, the cracks generated in the stretchable conductive layer 200 can be better repaired.
  • FIG. 8 is a schematic structural diagram of an eighth type of electrical connection assembly according to an embodiment of the present invention.
  • the structure of the eighth type of electrical connection component is basically the same as that of the first to seventh types of electrical connection components.
  • the difference is that the non-solid conductive adhesive 500 has a first end 510 and a second end 520 opposite to each other.
  • the radial dimension of the non-solid conductive adhesive 500 gradually decreases from the first end 510 toward the second end 520, and the second end 520 is located on the surface of the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 has a tapered shape and includes a first end 510 and a second end 520 opposite to each other.
  • the second end 520 directly contacts the stretchable conductive layer 200.
  • the diameter of the first end 510 is The radial dimension is greater than the radial dimension of the second end 520.
  • the non-solid conductive glue 500 is easier to flow toward the stretchable conductive layer 200.
  • the stretchable conductive layer 200 is stretched to produce cracks, the non-solid conductive adhesive 500 will flow into the cracks generated by the stretchable conductive layer 200 due to gravity. After the non-solid conductive adhesive 500 is cured, it can be The cracks generated when the stretchable conductive layer 200 is stretched are filled.
  • the non-solid conductive adhesive 500 has conductive properties, when the non-solid conductive adhesive 500 is filled in the cracks of the stretchable conductive layer 200, the normal electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 can be ensured. Avoid the problem of electrical connection failure between the stretchable conductive layer 200 and the flexible circuit board 400, that is, the non-solid conductive adhesive 500 can protect the stretchable conductive layer 200, prevent the stretchable conductive layer 200 from cracking, and help To ensure that the electrical connection assembly 10 ensures a stable electrical connection relationship.
  • FIG. 9 is a schematic structural diagram of a ninth electrical connection assembly according to an embodiment of the present invention.
  • the structure of the ninth electrical connection component is basically the same as that of the first to eighth electrical connection components.
  • the electrical connection component 10 further includes a protective layer 600 located on the stretchable
  • the stretched conductive layer 200 is far away from the flexible substrate 100, and the protective layer 600 covers both the stretchable conductive layer 200 and the flexible circuit board 400.
  • the protective layer 600 is used to improve the stretchability.
  • the protective layer 600 can be an elastic packaging layer, such as silicone rubber.
  • the hardness of the protective layer 600 is greater than the hardness of the flexible substrate 100, and the stretching rate of the protective layer 600 is smaller than the stretching rate of the flexible substrate 100.
  • the protective layer 400 is made of silicone rubber with a hardness greater than 40 Shore A and the elongation at break ⁇ 300%.
  • the protective layer 600 Since the protective layer 600 has a relatively high hardness and a small stretch rate, when the electrical connection assembly 10 is subjected to a tensile force, the protective layer 600 can bear part of the tensile force, thereby increasing the stretchable conductive layer 200
  • the tensile strength of the flexible circuit board 400 ensures that the stretchable conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship, thereby ensuring the normal use of the electrical connection assembly 10.
  • the protective layer 600 includes a first part 610 and a second part 620 that are connected, the first part 610 covers the stretchable conductive layer 200, and the second part 620 covers the flexible circuit board 400.
  • the stretchable conductive layer 200 and the flexible circuit board 400 may be out of sync Of stretching. Covering the protective layer 600 on the stretchable conductive layer 200 and the flexible circuit board 400 can bear part of the stretching force between the stretchable conductive layer 200 and the flexible circuit board 400, which helps to improve the stretchable conductive layer 200 and the flexible circuit board 400.
  • the endurance of the flexible circuit board 400 when it is stretched further maintains the stable electrical connection relationship of the electrical connection assembly 10 and ensures the service life of the electrical connection assembly 10.
  • the first part 610 and the second part 620 are directly connected.
  • the first part 610 covers the stretchable conductive layer 200
  • the second part 620 covers the flexible circuit board 400
  • the first part 610 is directly connected to the second part 620.
  • the end surface of the first part 610 close to the flexible circuit board 400 is directly attached to the flexible circuit board 400.
  • the protective layer 600 is closely attached to the flexible circuit board 400 and covers the stretchable conductive layer 200 and the flexible circuit board 400, when the stretchable conductive layer 200 and the flexible circuit board 400 are simultaneously stretched, the protective layer 600 Part of the stretching force can be provided for the stretchable conductive layer 200 and the flexible circuit board 400 to reduce the asynchronous deformation generated between the stretchable conductive layer 200 and the flexible circuit board 400, thereby avoiding the stretchable conductive layer
  • the failure of the electrical connection between 200 and the flexible circuit board 400 due to unsynchronized stretching helps to ensure that the stretchable conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship, and ensure that the electrical connection assembly 10 can be used normally .
  • the protective layer 600 further includes a third portion 630 connected between the first portion 610 and the second portion 620, the first portion 610 covers the stretchable conductive layer 200, and the second portion 620 Covering the flexible circuit board 400, the third portion 630 does not cover the flexible circuit board 400, that is, there is a gap A between the third portion 630 and the stretchable conductive layer 200.
  • the gap A is used to eliminate the internal stress formed between the protective layer 600 and the stretchable conductive layer 200 and between the stretchable conductive layer 200 and the flexible circuit board 400. If the third part 630 also covers the flexible circuit board 400, that is to say, the protective layer 600 closely adheres to the stretchable conductive layer 200 and the flexible circuit board 400.
  • the stretch rates of the three materials are not the same, they are The tensile force will inevitably show different degrees of tensile deformation. In other words, when subjected to the tensile force, uneven internal deformation will occur between the protective layer 600, the stretchable conductive layer 200 and the flexible circuit board 400. Stress. When the inside of the electrical connection assembly 10 is subjected to such internal stress for a long time, cracks may be generated under the action of the internal stress, which may lead to the problem of electrical connection failure of the electrical connection assembly 10. Therefore, when a gap A is formed between the third portion 630 and the stretchable conductive layer 200, the stretchable conductive layer 200 in the portion corresponding to the gap A can undergo normal tensile deformation without being affected by the protective layer 600.
  • the uneven internal stress generated in the electrical connection assembly 10 can be released from the stretchable conductive layer 200 in the corresponding part of the gap A, so that the electrical connection assembly 10 maintains a uniform force. , Which helps to maintain a stable electrical connection relationship of the electrical connection assembly 10, thereby ensuring the normal use of the electrical connection assembly 10.
  • FIG. 11 is a schematic structural diagram of the first electronic device 1 according to an embodiment of the present invention.
  • the electronic device 1 may be any device with communication and storage functions.
  • tablet computers mobile phones, e-readers, remote controls, personal computers (Personal Computer, PC), notebook computers, in-vehicle devices, Internet TVs, wearable devices and other smart devices with network functions.
  • PC Personal Computer
  • the electronic device 1 is a flexible folding mobile phone as an example for description.
  • the electronic device 1 includes a middle frame 1000, a circuit board 1100 and a button 2000.
  • the button 2000 is a control button, which can be a power button, a volume button, or Buttons for other functions.
  • the electrical signal generated after the button 2000 is pressed is transmitted to the circuit board 1100 via the flexible circuit board 400, and then the circuit board 1100 implements corresponding control functions.
  • One end of the flexible circuit board 400 needs to be electrically connected to the circuit board 1100.
  • the electrical connection assembly 10 provided by the embodiment of the present invention can be used to bind one end of the flexible circuit board 400 to the circuit board 1100 to ensure Stable electrical connection within the electronic device 1.
  • FIG. 12 is a first method of manufacturing an electrical connection assembly according to an embodiment of the present invention.
  • the preparation method of the electrical connection assembly 10 includes but is not limited to steps S100, S200, S300, and S400.
  • the details of the steps S100, S200, S300 and S400 are as follows.
  • the flexible substrate 100 may be an elastic base, such as high elongation silicone rubber.
  • the stretchable conductive layer 200 can be made of liquid organic silicon silver powder conductive ink.
  • the elastic conductive adhesive layer 300 has high elasticity, conductivity and high adhesion, and can be liquid silicone silver powder conductive adhesive, room temperature vulcanized silicone conductive adhesive, and the elastic conductive adhesive layer 300 surrounds the non-solid Conductive glue 500 is set.
  • the elastic conductive adhesive layer 300 may form the elastic conductive adhesive layer 320 at the center and the edge of the binding area of the electrical connection assembly 10 by means of glue dispensing, printing, transfer, or the like.
  • the non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as organic silicon conductive silicone grease, conductive gel, liquid metal, or a partial mixture thereof with the elastic conductive adhesive layer 300.
  • the non-solid conductive adhesive 500 is flowable after being stretched, and has a relatively high viscosity when standing. When the non-solid conductive adhesive 500 is stretched, it can flow into the cracks formed on the surface of the stretchable conductive layer 200 to repair the cracks formed on the surface of the stretchable conductive layer 200.
  • the non-solid conductive glue 500 When the non-solid conductive glue 500 is not stretched, the non-solid conductive glue 500 has greater adhesion, so that the stretchable conductive layer 200 and the flexible circuit board 400 are tightly bonded to make the stretchable The stretched conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship.
  • the non-solid conductive glue 500 covering the stretchable conductive layer 200 is formed first, and then the elastic conductive glue layer 300 surrounding the non-solid conductive glue 500 is formed.
  • the elastic conductive adhesive layer 300 covering the stretchable conductive layer 200 is formed first, and then the non-solid conductive adhesive 500 penetrating the elastic conductive adhesive layer 300 and covering the stretchable conductive layer 200 is formed.
  • the non-solid conductive adhesive 500 has a first end 510 and a second end 520 opposite to each other, and the radial dimension of the non-solid conductive adhesive 500 is from the first end 520.
  • the end 510 gradually decreases toward the second end 520, and the second end 520 is located on the surface of the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 has a tapered shape and includes a first end 510 and a second end 520 opposite to each other.
  • the second end 520 directly contacts the stretchable conductive layer 200, and the first end
  • the radial dimension of 510 is greater than the radial dimension of the second end 520.
  • the non-solid conductive glue 500 is easier to flow toward the stretchable conductive layer 200.
  • the stretchable conductive layer 200 is stretched to produce cracks
  • the non-solid conductive adhesive 500 will flow into the cracks generated by the stretchable conductive layer 200 due to gravity.
  • the non-solid conductive adhesive 500 has conductive properties, when the non-solid conductive adhesive 500 is filled in the cracks of the stretchable conductive layer 200, the normal electrical connection relationship between the stretchable conductive layer 200 and the flexible circuit board 400 can be ensured. Avoid the problem of electrical connection failure between the stretchable conductive layer 200 and the flexible circuit board 400, that is, the non-solid conductive adhesive 500 can protect the stretchable conductive layer 200, prevent the stretchable conductive layer 200 from cracking, and help To ensure that the electrical connection assembly 10 ensures a stable electrical connection relationship.
  • the flexible circuit board 400 is also called a "soft board", which is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as a substrate. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.
  • the stretchable conductive layer 200 is electrically connected to the flexible circuit board 400 through the elastic conductive adhesive layer 300. Due to the difference in the stretching rate of the stretchable conductive layer 200, the elastic conductive adhesive layer 300, and the flexible circuit board 400, the three will show different magnitudes of deformation when subjected to stretching, which will cause the three to appear Asynchronous stretching effect. During this process, when the stretchable conductive layer 200 is stretched and the tensile force is greater than a certain threshold or the duration of the stretch is greater than a preset time, the stretchable conductive layer 200 may have cracks.
  • the cross-sectional area of the stretchable conductive layer 200 decreases, which will cause the resistance of the stretchable conductive layer 200 to suddenly increase, and further cause the current passing through the stretchable conductive layer 200 to decrease. , It is not conducive to the transmission of electrical signals from the stretchable conductive layer 200.
  • the stretchable conductive layer 200 may be pulled off, destroying the electrical connection between the stretchable conductive layer 200 and the flexible circuit board 400, and blocking the signal passing through the flexible circuit board 400. transmission.
  • the technical means of the present invention is to cover the stretchable conductive layer 200 with a non-solid conductive adhesive 500.
  • the non-solid conductive adhesive 500 can flow to In the cracks of the stretchable conductive layer 200, and then filled into the cracks of the stretchable conductive layer 200 after curing, since the non-solid conductive adhesive 500 has conductive properties, the problem of electrical connection failure of the stretchable conductive layer 200 can be avoided. This further ensures that the electrical connection assembly 10 maintains a stable electrical connection relationship.
  • FIG. 18 is a second method for manufacturing the electrical connection assembly according to an embodiment of the present invention.
  • the preparation method of the second electrical connection component is basically the same as the preparation method of the first electrical connection component.
  • the difference is that the "S300: forming a non-solid conductive adhesive 500 covering the stretchable conductive layer 200 and elastic
  • the conductive adhesive layer 300 includes but is not limited to steps S310 and S320, and details of steps S310 and S320 are described below.
  • the non-solid conductive adhesive 500 may be a non-solid film-forming conductive adhesive such as organic silicon conductive silicone grease, conductive gel, liquid metal, etc.
  • S320 forming an elastic conductive adhesive layer 300 covering the non-solid conductive adhesive 500 and the stretchable conductive layer 200. Refer to Figure 20.
  • the elastic conductive adhesive layer 300 has a receiving groove 300a on a side adjacent to the stretchable conductive layer 200, and the non-solid conductive adhesive 500 is received in the receiving groove 300a.
  • the opening of the receiving groove 300 a faces the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 is located in the receiving groove 300 a and directly contacts the stretchable conductive layer 200.
  • the part of the stretchable conductive layer 200 corresponding to the receiving groove 300 a is electrically connected to the elastic conductive adhesive layer 300 through the non-solid conductive adhesive 500, and other parts of the stretchable conductive layer 200 are directly electrically connected to the elastic conductive adhesive layer 300.
  • the stretchable conductive layer 200, the elastic conductive adhesive layer 300, and the flexible circuit board 400 are stretched, the stretch rate of the stretchable conductive layer 200, the elastic conductive adhesive layer 300, and the flexible circuit board 400 is There are differences.
  • the three will show different magnitudes of deformation when they are stretched, which will cause the three to have unsynchronized stretching effects.
  • the stretchable conductive layer 200 may have cracks.
  • the stretchable conductive layer 200 When cracks occur, the cross-sectional area of the stretchable conductive layer 200 decreases, which will cause the resistance of the stretchable conductive layer 200 to suddenly increase, and further cause the current passing through the stretchable conductive layer 200 to decrease. , It is not conducive to the transmission of electrical signals from the stretchable conductive layer 200. In addition, during this process, the stretchable conductive layer 200 may be pulled off, destroying the electrical connection between the stretchable conductive layer 200 and the flexible circuit board 400, and blocking the signal passing through the flexible circuit board 400. transmission.
  • the non-solid conductive adhesive 500 covers the stretchable conductive layer 200 and is located in the receiving groove 300a of the elastic conductive adhesive layer 300, under the action of gravity, the non-solid conductive adhesive 500
  • the conductive glue 500 can flow into the cracks of the stretchable conductive layer 200, and then fill the cracks of the stretchable conductive layer 200 after curing. Since the non-solid conductive glue 500 has conductive properties, the stretchable conductive layer 200 can be avoided. The problem of electrical connection failure occurs, thereby ensuring that the electrical connection assembly 10 maintains a stable electrical connection relationship.
  • FIG. 21 is a third method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • the preparation method of the third electrical connection assembly is basically the same as the preparation method of the first electrical connection assembly.
  • the difference is that the "S300: forming a non-solid conductive adhesive 500 covering the stretchable conductive layer 200 and elastic
  • the conductive adhesive layer 300 includes but is not limited to steps S330, S340, and S350. The steps S330, S340, and S350 are described in detail as follows.
  • S350 Form a flexible circuit board 400 simultaneously covering the elastic conductive adhesive layer 300 and the non-solid conductive adhesive 500. Refer to Figure 24.
  • the non-solid conductive adhesive 500 is electrically connected to the stretchable conductive layer 200 and the flexible circuit board 400 at the same time, so that an electrical connection relationship can be formed between the stretchable conductive layer 200 and the flexible circuit board 400 .
  • the elastic conductive adhesive layer 300 is also provided between the stretchable conductive layer 200 and the flexible circuit board 400, the elastic conductive adhesive layer 300 can form an electrical connection between the stretchable conductive layer 200 and the flexible circuit board 400. .
  • at least two electrical connection paths can be formed between the stretchable conductive layer 200 and the flexible circuit board 400.
  • the board 400, the non-solid conductive adhesive 500, the elastic conductive adhesive layer 300 and the stretchable conductive layer 200 form a stable electrical connection relationship, thereby ensuring a stable electrical connection relationship of the electrical connection group and ensuring the normality of the electrical connection assembly 10 use.
  • FIG. 25 is a fourth method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • the preparation method of the fourth electrical connection component is basically the same as the preparation method of the first electrical connection component.
  • the difference is that the "S300: forming a non-solid conductive adhesive 500 covering the stretchable conductive layer 200 and elastic
  • the conductive adhesive layer 300 includes but is not limited to steps S360, S370, and S380. The steps S360, S370, and S380 are described in detail as follows.
  • S380 Form a flexible circuit board 400 covering the elastic conductive adhesive layer 300, the flexible circuit board 400 has a second receiving hole 401, the second receiving hole 401 is a blind hole, and the flexible circuit board 400 covers the Non-solid conductive glue 500.
  • the flexible circuit board 400 covers the Non-solid conductive glue 500.
  • the first receiving hole 301 is disposed directly opposite to the second receiving hole 401, and the radial size of the first receiving hole 301 is consistent with the radial size of the second receiving hole 401. Since the first receiving hole 301 is connected to the second receiving hole 401, the first receiving hole 301 and the second receiving hole 401 can be formed at the same time during the preparation process, which helps to save processing steps.
  • the first receiving hole 301 may also be arranged offset from the second receiving hole 401, and the size of the first receiving hole 301 may also be the same as the size of the second receiving hole 401. Inconsistent. That is, the radial size of the first receiving hole 301 is larger than the radial size of the second receiving hole 401, or the radial size of the first receiving hole 301 is smaller than the radial size of the second receiving hole 401 .
  • the second receiving hole 401 is a blind hole, that is, the non-solid conductive adhesive 500 completely penetrates the elastic conductive adhesive layer 300, and the non-solid conductive adhesive 500 Partially penetrates the flexible circuit board 400. Since the non-solid conductive adhesive 500 partially penetrates the flexible circuit board 400, the flexible circuit board 400 generates a partial tensile force on the non-solid conductive adhesive 500, thereby forming a stable electrical connection relationship between the non-solid conductive adhesive 500 and the flexible circuit board 400 .
  • the non-solid conductive adhesive 500 completely penetrates the elastic conductive adhesive layer 300, the non-solid conductive adhesive 500 is not easy to fall off from the elastic conductive adhesive layer 300, so that the non-solid conductive adhesive 500 and the elastic conductive adhesive layer 300 maintain stability The electrical connection relationship.
  • a stable electrical connection relationship among the non-solid conductive adhesive 500, the elastic conductive adhesive layer 300, and the flexible circuit board 400 can be maintained.
  • the elastic conductive adhesive layer 300 covers the surface of the stretchable conductive layer 200
  • the elastic conductive adhesive layer 300 and the stretchable conductive layer 200 can maintain a stable electrical connection relationship, that is, The stretchable conductive layer 200 can directly form a stable electrical connection between the elastic conductive adhesive layer 300 and the flexible circuit board 400, and the stretchable conductive layer 200 can also be formed between the non-solid conductive adhesive 500 and the flexible circuit board 400.
  • Stable electrical connection that is, the stretchable conductive layer 200 can form a stable electrical connection with the flexible circuit board 400 through at least two paths, thereby ensuring smooth transmission of electrical signals from the stretchable conductive layer 200 to the flexible
  • the circuit board 400 ensures the normal electrical connection function of the electrical connection assembly 10.
  • FIG. 29 is a fifth method for manufacturing an electrical connection assembly according to an embodiment of the present invention.
  • the preparation method of the fifth electrical connection assembly is basically the same as the preparation method of the first electrical connection assembly, except that the "S300: forming a non-solid conductive adhesive 500 covering the stretchable conductive layer 200 and elastic
  • the conductive adhesive layer 300 includes but is not limited to steps S301, S302, and S303. The steps S301, S302, and S303 are described in detail as follows.
  • S303 Form a flexible circuit board 400 covering the elastic conductive adhesive layer 300, and the flexible circuit board 400 has a second through hole 402 to expose the non-solid conductive adhesive 500. Refer to Figure 32.
  • the second through hole 402 can be in various shapes such as a square or a circle.
  • the non-solid conductive adhesive 500 is located in the first through hole 302 and the second through hole 402.
  • the elastic conductive adhesive layer 300 when it has cracks, it can prevent the cracks in the elastic conductive adhesive layer 300. Repairing, on the other hand, when the flexible circuit board 400 has cracks, the cracks generated by the flexible circuit board 400 can also be repaired.
  • the non-solid conductive glue 500 is located on the surface of the stretchable conductive layer 200, when the stretchable conductive layer 200 has cracks due to stretching, the non-solid conductive glue 500 can resist the stretchable conductive layer 200. Cracks generated during the stretching process are repaired.
  • the first through hole 302 is disposed directly opposite to the second through hole 402, and the radial size of the first through hole 302 is consistent with the radial size of the second through hole 402. Since the first through hole 302 communicates with the second through hole 402, the first through hole 302 and the second through hole 402 can be formed together in the preparation process, which helps to save processing steps.
  • the first through hole 302 may also be offset from the second through hole 402, and the size of the first through hole 302 may also be the same as the size of the second through hole 402. Inconsistent. That is, the radial dimension of the first through hole 302 is greater than the radial dimension of the second through hole 402, or the radial dimension of the first through hole 302 is smaller than the radial dimension of the second through hole 402 .
  • FIG. 33 is a sixth method for manufacturing an electrical connection assembly according to an embodiment of the present invention.
  • the preparation method of the sixth electrical connection component is basically the same as the preparation methods of the first to fifth electrical connection components. The difference is that the preparation method of the electrical connection component 10 further includes but is not limited to step S250. The details are as follows.
  • a microstructure 600 is formed at a portion of the stretchable conductive layer 200 corresponding to the non-solid conductive glue 500, and the microstructure 600 is used to enlarge the non-solid conductive glue 500 and the stretchable conductive layer Adhesion between 200. Refer to Figure 34.
  • the microstructure 600 may be a zigzag structure to increase the contact area between the non-solid conductive glue 500 and the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 has the characteristics of standing thickening and shear thinning. When standing still, the viscosity is high and the fluidity is small. When it is under pressure or stretched, the viscosity decreases and the fluidity increases. When cracks occur in the stretchable conductive layer 200, the viscosity of the non-solid conductive adhesive 500 decreases and the fluidity increases, and it can flow into the cracks of the stretchable conductive layer 200. When the non-solid conductive adhesive 500 is cured, it will be filled The cracks in the conductive layer 200 are stretched to repair the cracks.
  • the stretchable conductive layer 200 is provided with the microstructure 600 at the position corresponding to the non-solid conductive adhesive 500, more non-solid conductive adhesive 500 can be attached to the microstructure 600 of the stretchable conductive layer 200, thereby increasing the non-solid
  • the adhesion between the conductive adhesive 500 and the stretchable conductive layer 200 helps to repair the cracks generated in the stretchable conductive layer 200.
  • the non-solid conductive adhesive 500 can also exhibit part of the tensile force when the stretchable conductive layer 200 is stretched, which helps to improve the cracks of the stretchable conductive layer 200.
  • FIG. 35 is a seventh method for manufacturing an electrical connection assembly according to an embodiment of the present invention.
  • the preparation method of the seventh electrical connection assembly is basically the same as the preparation methods of the first to fifth electrical connection assemblies, except that the preparation method of the electrical connection assembly 10 further includes but is not limited to step S270.
  • the details are as follows.
  • the protruding portion 210 is arcuately arched.
  • the non-solid conductive adhesive 500 can be assisted to flow toward the connection between the stretchable conductive layer 200 and the elastic conductive adhesive layer 300, thereby allowing more non-solid conductive adhesive 500 to flow In the cracks generated in the stretchable conductive layer 200, the cracks generated in the stretchable conductive layer 200 can be better repaired.
  • FIG. 37 is an eighth method for manufacturing an electrical connection assembly provided by an embodiment of the present invention.
  • the preparation method of the eighth electrical connection component is basically the same as the preparation methods of the first to seventh electrical connection components, except that in “S400: forming a flexible circuit board 400 covering the elastic conductive adhesive layer 300 Afterwards, the preparation method of the electrical connection assembly 10 further includes but is not limited to step S500.
  • step S500 is as follows.
  • S500 forming a protective layer 600 on the side of the stretchable conductive layer 200 away from the flexible substrate 100, the protective layer 600 simultaneously covers the stretchable conductive layer 200 and the flexible circuit board 400, so The protective layer 600 is used to improve the tensile strength between the stretchable conductive layer 200 and the flexible circuit board 400 when stretched.
  • the protective layer 600 can be an elastic packaging layer, such as silicone rubber.
  • the hardness of the protective layer 600 is greater than the hardness of the flexible substrate 100, and the stretching rate of the protective layer 600 is smaller than the stretching rate of the flexible substrate 100.
  • the protective layer 400 is made of silicone rubber with a hardness greater than 40 Shore A and the elongation at break ⁇ 300%.
  • the protective layer 600 Since the protective layer 600 has a relatively high hardness and a small stretch rate, when the electrical connection assembly 10 is subjected to a tensile force, the protective layer 600 can bear part of the tensile force, thereby increasing the stretchable conductive layer 200
  • the tensile strength of the flexible circuit board 400 ensures that the stretchable conductive layer 200 and the flexible circuit board 400 maintain a stable electrical connection relationship, thereby ensuring the normal use of the electrical connection assembly 10.

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Abstract

本发明提供一种电连接组件(10)、电子设备(1)及电连接组件(10)的制备方法。所述电连接组件(10)包括依次层叠设置的柔性基板(100)、可拉伸导电层(200)、弹性导电胶层(300)和柔性电路板(400)，所述可拉伸导电层(200)与所述柔性电路板(400)通过所述弹性导电胶层(300)电连接，所述电连接组件(10)还包括非固态导电胶(500)，所述非固态导电胶(500)用于对所述可拉伸导电层(200)在拉伸过程中产生的裂纹进行修复，可以保证电连接组件(10)维持稳定的电连接关系。

Description

电连接组件、电子设备及电连接组件的制备方法 技术领域
本发明涉及电子技术领域，尤其涉及一种电连接组件、电子设备及电连接组件的制备方法。
背景技术
为了将两个电子器件进行电连接，相关技术中，通常采用硬质连接的方式，如导线焊接、导电胶粘接或者插接等。但是针对柔性电子设备而言，由于电子设备的不同部位拉伸率不同，此时就会出现拉伸不同步的情况，容易导致可拉伸导电层出现裂纹，进而引起电连接失效的问题。
发明内容
本发明实施例提供一种电连接组件，所述电连接组件包括依次层叠设置的柔性基板、可拉伸导电层、弹性导电胶层和柔性电路板，所述可拉伸导电层与所述柔性电路板通过所述弹性导电胶层电连接，所述电连接组件还包括非固态导电胶，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复。
本发明实施例提供的电连接组件包括依次层叠的柔性基板、可拉伸导电层、弹性导电胶层和柔性电路板，可拉伸导电层通过弹性导电胶层与柔性电路板形成电连接，电连接组件还包括非固态导电胶，当可拉伸导电层受到拉力作用时，会产生拉伸形变，当拉力作用较大或者拉力作用持续时间较长时，就可能使得可拉伸导电层产生裂纹，非固态导电胶具有静置增稠和剪切变稀的特性。在静置的时候，粘度大，流动性小，在受到压力或者被拉伸时，粘度变小，流动性增加。当可拉伸导电层产生裂纹时，非固态导电胶粘度变小，流动性增加，进而可以流动至可拉伸导电层的裂纹中，当非固态导电胶固化后会填充于可拉伸导电层的裂纹中，进而可以修复可拉伸导电层在拉伸过程中产生的裂纹，可以避免可拉伸导电层由于拉伸作用而出现电连接失效的问题，进而可以保证电连接组件维持稳定的电连接关系。
本发明实施例还提供一种电子设备，所述电子设备包括如上任意实施例所述的电连接组件。
本发明实施例还提供一种电连接组件的制备方法，所述电连接组件的制备方法包括：
提供柔性基板；
形成覆盖所述柔性基板的可拉伸导电层；
形成覆盖所述可拉伸导电层的非固态导电胶以及弹性导电胶层，其中，所述可拉伸导电层与所述弹性导电胶层之间电连接，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复；
形成覆盖所述弹性导电胶层的柔性电路板，其中，所述弹性导电胶层与所述柔性电路板之间电连接。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的第一种电连接组件的结构示意图。
图2是本发明实施例提供的第二种电连接组件的结构示意图。
图3是本发明实施例提供的第三种电连接组件的结构示意图。
图4是本发明实施例提供的第四种电连接组件的结构示意图。
图5是本发明实施例提供的第五种电连接组件的结构示意图。
图6是本发明实施例提供的第六种电连接组件的结构示意图。
图7是本发明实施例提供的第七种电连接组件的结构示意图。
图8是本发明实施例提供的第八种电连接组件的结构示意图。
图9是本发明实施例提供的第九种电连接组件的结构示意图。
图10是本发明实施例提供的第十种电连接组件的结构示意图。
图11是本发明实施例提供的第一种电子设备的结构示意图。
图12是本发明实施例提供的第一种电连接组件的制备方法。
图13是图12中步骤S100对应的结构示意图。
图14是图12中步骤S200对应的结构示意图。
图15是图12中步骤S300对应的结构示意图。
图16是图12中一种非固态导电胶的结构示意图。
图17是图12中步骤S400对应的结构示意图。
图18是本发明实施例提供的第二种电连接组件的制备方法。
图19是图18中步骤S310对应的结构示意图。
图20是图18中步骤S320对应的结构示意图。
图21是本发明实施例提供的第三种电连接组件的制备方法。
图22是图21中步骤S330对应的结构示意图。
图23是图21中步骤S340对应的结构示意图。
图24是图21中步骤S350对应的结构示意图。
图25是本发明实施例提供的第四种电连接组件的制备方法。
图26是图25中步骤S360对应的结构示意图。
图27是图25中步骤S370对应的结构示意图。
图28是图25中步骤S380对应的结构示意图。
图29是本发明实施例提供的第五种电连接组件的制备方法。
图30是图29中步骤S301对应的结构示意图。
图31是图29中步骤S302对应的结构示意图。
图32是图29中步骤S303对应的结构示意图。
图33是本发明实施例提供的第六种电连接组件的制备方法。
图34是图33中步骤S250对应的结构示意图。
图35是本发明实施例提供的第七种电连接组件的制备方法。
图36是图35中步骤S270对应的结构示意图。
图37是本发明实施例提供的第八种电连接组件的制备方法。
图38是图37中步骤S500对应的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1是本发明实施例提供的第一种电连接组件的结构示意图。所述电连接组件10包括依次层叠设置的柔性基板100、可拉伸导电层200、弹性导电胶层300和柔性电路板400，所述可拉伸导电层200与所述柔性电路板400通过所述弹性导电胶层300电连接，所述电连接组件10还包括非固态导电胶500，所述非固态导电胶500用于对所述可拉伸导电层200在拉伸过程中产生的裂纹进行修复。
其中，所述柔性基板100可以为弹性基底，如高延伸率有机硅橡胶。所述可拉伸导电层200可以为液体有机硅银粉导电油墨制备而成。所述弹性导电胶层300为导电胶，如液体有 机硅银粉导电胶，室温硫化有机硅导电胶，所述弹性导电胶层300具有高弹性、导电性和高粘接性，可以为液体有机硅银粉导电胶，室温硫化有机硅导电胶，弹性导电胶层300环绕非固态导电胶500设置。具体的，弹性导电胶层300可通过点胶、印刷、转印等方式将弹性导电胶层320形成电连接组件10的绑定区的中心以及边缘。所述非固态导电胶500可以为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶。或是其与弹性导电胶层300的部分混合物。非固态导电胶500在拉伸后是可以流动的，静置时的粘性较大。当非固态导电胶500受到拉伸时，可以流入可拉伸导电层200表面形成的裂纹中，进而对可拉伸导电层200表面形成的裂纹进行修复。当非固态导电胶500没有被拉伸时，非固态导电胶500具有较大的粘性，从而将所述可拉伸导电层200和所述柔性电路板400紧密粘结，以使得所述可拉伸导电层200和所述柔性电路板400维持稳定的电连接关系。
所述柔性电路板400又称为“软板”，是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板。具有配线密度高、重量轻、厚度薄、弯折性好的特点。
在本实施例中，所述可拉伸导电层200通过弹性导电胶层300与柔性电路板400之间形成电连接。由于可拉伸导电层200、弹性导电胶层300以及柔性电路板400三者的拉伸率存在差异，三者在受到拉伸作用时会呈现出不同大小的形变量，进而会导致三者出现不同步的拉伸效果。在此过程中，当可拉伸导电层200受到拉伸作用，且拉力大小大于某个阈值或者拉伸作用持续时间长度大于预设长度时，可拉伸导电层200就可能会产生裂纹。当裂纹出现时，可拉伸导电层200的横截面积减小，进而会导致可拉伸导电层200的电阻突然增大的情况，进一步的会导致经过可拉伸导电层200的电流减小，不利于电信号从可拉伸导电层200上传输。且在此过程中，可能会导致可拉伸导电层200被拉断的情况，破坏了可拉伸导电层200与柔性电路板400之间的电连接关系，阻断了信号经柔性电路板400传输。为了解决这个问题，本发明的技术手段是采用非固态导电胶500覆盖于可拉伸导电层200，非固态导电胶500具有静置增稠和剪切变稀的特性。在静置的时候，粘度大，流动性小，在受到压力或者被拉伸时，粘度变小，流动性增加。当可拉伸导电层200受到拉伸作用出现裂纹时，非固态导电胶500非固态导电胶500粘度变小，流动性增加，进而可以流动至可拉伸导电层200的裂纹中，进而固化后填充于可拉伸导电层200的裂纹中，对进行裂纹修复。由于非固态导电胶500具有导电性能，从而可以避免可拉伸导电层200出现电连接失效的问题，进而保证电连接组件10维持稳定的电连接关系。
本发明实施例提供的电连接组件10包括依次层叠的柔性基板100、可拉伸导电层200、弹性导电胶层300和柔性电路板400，可拉伸导电层200通过弹性导电胶层300与柔性电路板400形成电连接，电连接组件10还包括非固态导电胶500，当可拉伸导电层200受到拉力作用时，会产生拉伸形变，当拉力作用较大或者拉力作用持续时间较长时，就可能使得可拉伸导电层200产生裂纹，非固态导电胶500具有静置增稠和剪切变稀的特性。在静置的时候，粘度大，流动性小，在受到压力或者被拉伸时，粘度变小，流动性增加。当可拉伸导电层200产生裂纹时，非固态导电胶500粘度变小，流动性增加，进而可以流动至可拉伸导电层200的裂纹中，当非固态导电胶500固化后会填充于可拉伸导电层200的裂纹中，进而修复可拉伸导电层200在拉伸过程中产生的裂纹，可以避免可拉伸导电层200由于拉伸作用而出现电连接失效的问题，进而可以保证电连接组件10维持稳定的电连接关系。
请继续参阅图2，图2是本发明实施例提供的第二种电连接组件的结构示意图。第二种电连接组件的结构与第一种电连接组件的结构基本相同，不同之处在于，所述弹性导电胶层300邻近所述可拉伸导电层200的一侧具有收容槽300a，所述非固态导电胶500收容于所述收容槽300a内。
具体的，在本实施例中，所述收容槽300a的开口朝向可拉伸导电层200。非固态导电胶500位于收容槽300a内，且直接接触于可拉伸导电层200。可拉伸导电层200对应所述 收容槽300a的部位通过非固态导电胶500与弹性导电胶层300形成电连接，可拉伸导电层200的其他部位直接与弹性导电胶层300形成电连接。当可拉伸导电层200、弹性导电胶层300和柔性电路板400三者受到拉伸作用时，由于可拉伸导电层200、弹性导电胶层300以及柔性电路板400三者的拉伸率存在差异，三者在受到拉伸作用时会呈现出不同大小的形变量，进而会导致三者出现不同步的拉伸效果。在此过程中，当可拉伸导电层200受到拉伸作用，且拉力大小大于某个阈值或者拉伸作用持续时间大于预设时间时，可拉伸导电层200就可能会产生裂纹。当裂纹出现时，可拉伸导电层200的横截面积减小，进而会导致可拉伸导电层200的电阻突然增大的情况，进一步的会导致经过可拉伸导电层200的电流减小，不利于电信号从可拉伸导电层200上传输。且在此过程中，可能会导致可拉伸导电层200被拉断的情况，破坏了可拉伸导电层200与柔性电路板400之间的电连接关系，阻断了信号经柔性电路板400传输。当可拉伸导电层200受到拉伸作用出现裂纹时，由于非固态导电胶500覆盖于可拉伸导电层200，且位于弹性导电胶层300的收容槽300a内，在重力作用下，非固态导电胶500可以流动至可拉伸导电层200的裂纹中，进而固化后填充于可拉伸导电层200的裂纹中，由于非固态导电胶500具有导电性能，从而可以避免可拉伸导电层200出现电连接失效的问题，进而保证电连接组件10维持稳定的电连接关系。
请继续参阅图3，图3是本发明实施例提供的第三种电连接组件的结构示意图。第三种电连接组件的结构与第一种电连接组件的结构基本相同，不同之处在于，所述弹性导电胶层300具有容纳孔300b，所述容纳孔300b为通孔，所述非固态导电胶500收容于所述容纳孔300b内，且同时电连接于所述可拉伸导电层200和所述柔性电路板400。
具体的，在本实施例中，非固态导电胶500同时电连接于可拉伸导电层200和柔性电路板400，从而可以在可拉伸导电层200和柔性电路板400之间形成电连接关系。此外，由于可拉伸导电层200和柔性电路板400之间还设置有弹性导电胶层300，弹性导电胶层300又可以在可拉伸导电层200和柔性电路板400之间形成电连接关系。也就是说，由于非固态导电胶500以及弹性导电胶层300的存在，可以在可拉伸导电层200和柔性电路板400之间形成至少两条电连接的通路。且由于非固态导电胶500位于弹性导电胶层300形成的容纳孔300b内，使得非固态导电胶500与弹性导电胶层300之间又形成的稳定的电连接关系，因此，就可以使得柔性电路板400、非固态导电胶500、弹性导电胶层300和可拉伸导电层200四者之间形成稳定的电连接关系，进而保证电连接组稳定的电连接关系，保证电连接组件10的正常使用。
请继续参阅图4，图4是本发明实施例提供的第四种电连接组件的结构示意图。第四种电连接组件的结构与第一种电连接组件的结构基本相同，不同之处在于，所述弹性导电胶层300具有第一收容孔301，所述柔性电路板400邻近所述弹性导电胶层300的一侧具有第二收容孔401，所述第二收容孔401连通所述第一收容孔301，所述第一收容孔301为通孔，所述第二收容孔401为盲孔，所述非固态导电胶500收容于所述第一收容孔301以及所述第二收容孔401内。
在一实施方式中，所述第一收容孔301正对所述第二收容孔401设置，且第一收容孔301的径向尺寸与第二收容孔401的径向尺寸大小保持一致。由于第一收容孔301连通第二收容孔401，因此，可以在制备工艺中一并形成第一收容孔301和第二收容孔401，有助于节省加工工序。
可以理解的，在其他实施方式中，所述第一收容孔301也可以偏离所述第二收容孔401设置，且所述第一收容孔301的大小也可以与第二收容孔401的大小保持不一致。即所述第一收容孔301的径向尺寸大于所述第二收容孔401的径向尺寸，或者，所述第一收容孔301的径向尺寸小于所述第二收容孔401的径向尺寸。
进一步的，由于所述第一收容孔301为通孔，所述第二收容孔401为盲孔，即所述非固 态导电胶500完全贯穿所述弹性导电胶层300，且非固态导电胶500部分贯穿所述柔性电路板400。由于非固态导电胶500部分贯穿柔性电路板400，柔性电路板400会对非固态导电胶500产生部分拉伸力，从而使得非固态导电胶500与柔性电路板400之间形成稳定的电连接关系。且由于非固态导电胶500完全贯穿弹性导电胶层300，因此，非固态导电胶500不容易从弹性导电胶层300中脱落出来，使得非固态导电胶500与弹性导电胶层300之间维持稳定的电连接关系。也就是说，采用本实施例的方式，可以使得非固态导电胶500、弹性导电胶层300以及柔性电路板400三者之间维持稳定的电连接关系。且更进一步的，由于弹性导电胶层300覆盖于可拉伸导电层200的表面，因此，弹性导电胶层300与可拉伸导电层200之间可以保持稳定的电连接关系，也就是说，可拉伸导电层200可以直接通过弹性导电胶层300与柔性电路板400之间形成稳定的电连接关系，可拉伸导电层200也可以通过非固态导电胶500与柔性电路板400之间形成稳定的电连接关系，即可拉伸导电层200可以通过至少两个路径与柔性电路板400之间形成稳定的电连接关系，从而可以确保电信号顺利的从可拉伸导电层200传输至柔性电路板400，保证了电连接组件10的正常电连接功能。
请继续参阅图5，图5是本发明实施例提供的第五种电连接组件的结构示意图。第五种电连接组件的结构与第一种电连接组件的结构基本相同，不同之处在于，所述弹性导电胶层300具有第一通孔302，所述柔性电路板400具有第二通孔402，所述第二通孔402连通所述第一通孔302，所述非固态导电胶500收容于所述第一通孔302以及所述第二通孔402内，且同时电连接于所述可拉伸导电层200和所述柔性电路板400。
其中，第二通孔402可为方形、圆形等各式形状。
具体的，在本实施例中，非固态导电胶500位于第一通孔302和第二通孔402内，一方面当弹性导电胶层300产生裂纹时，可以对弹性导电胶层300产生的裂纹进行修复，另一方面当柔性电路板400产生裂纹时，还可以对柔性电路板400产生的裂纹进行修复。此外，由于非固态导电胶500位于可拉伸导电层200的表面，因此，当可拉伸导电层200由于拉伸作用而产生裂纹时，非固态导电胶500可以对可拉伸导电层200在拉伸过程中产生的裂纹进行修复。
在一实施方式中，所述第一通孔302正对所述第二通孔402设置，且第一通孔302的径向尺寸与第二通孔402的径向尺寸大小保持一致。由于第一通孔302连通第二通孔402，因此，可以在制备工艺中一并形成第一通孔302和第二通孔402，有助于节省加工工序。
可以理解的，在其他实施方式中，所述第一通孔302也可以偏离所述第二通孔402设置，且所述第一通孔302的大小也可以与第二通孔402的大小保持不一致。即所述第一通孔302的径向尺寸大于所述第二通孔402的径向尺寸，或者，所述第一通孔302的径向尺寸小于所述第二通孔402的径向尺寸。
请继续参阅图6，图6是本发明实施例提供的第六种电连接组件的结构示意图。第六种电连接组件的结构与第一至第五种电连接组件的结构基本相同，不同之处在于，所述可拉伸导电层200对应所述非固态导电胶500的部位设置有微结构600，所述微结构600用于增大所述非固态导电胶500与所述可拉伸导电层200之间的附着力。
其中，所述微结构600可以为锯齿状结构，以增大非固态导电胶500与可拉伸导电层200之间的接触面积。非固态导电胶500具有静置增稠和剪切变稀的特性。在静置的时候，粘度大，流动性小，在受到压力或者被拉伸时，粘度变小，流动性增加。当可拉伸导电层200产生裂纹时，非固态导电胶500粘度变小，流动性增加，进而可以流动至可拉伸导电层200的裂纹中，当非固态导电胶500固化后会填充于可拉伸导电层200的裂纹中，进而对裂纹进行修复。由于可拉伸导电层200对应非固态导电胶500的部位设置有微结构600，可以促使更多的非固态导电胶500附着于可拉伸导电层200的微结构600上，进而增大非固态导电胶500与可拉伸导电层200之间的附着力，从而有助于对可拉伸导电层200产生的裂纹形 成修复。此外，非固态导电胶500也可以呈现可拉伸导电层200被拉伸时的部分拉伸力，有助于改善可拉伸导电层200出现裂纹的情况。
请继续参阅图7，图7是本发明实施例提供的第七种电连接组件的结构示意图。第七种电连接组件的结构与第一至第五种电连接组件的结构基本相同，不同之处在于，所述可拉伸导电层200对应所述非固态导电胶500的部位设置有凸起部210，所述凸起部210用于辅助所述非固态导电胶500沿着所述可拉伸导电层200的表面流动。
其中，所述凸起部210呈弧形拱起状。当凸起部210对应非固态导电胶500设置时，可以辅助非固态导电胶500朝向可拉伸导电层200与弹性导电胶层300的连接处流动，进而使得更多的非固态导电胶500流动至可拉伸导电层200产生的裂纹中，从而可以更好的对可拉伸导电层200产生的裂纹进行修复。
请继续参阅图8，图8是本发明实施例提供的第八种电连接组件的结构示意图。第八种电连接组件的结构与第一至第七种电连接组件的结构基本相同，不同之处在于，所述非固态导电胶500具有相对的第一端510和第二端520，所述非固态导电胶500的径向尺寸自所述第一端510朝向所述第二端520逐渐减小，所述第二端520位于所述可拉伸导电层200的表面。
具体的。在本实施例中，所述非固态导电胶500呈现锥形，包括相对的第一端510和第二端520，第二端520直接接触于可拉伸导电层200，第一端510的径向尺寸大于第二端520的径向尺寸。此时，由于重力作用，所述非固态导电胶500更容易朝向可拉伸导电层200流动。当可拉伸导电层200受到拉伸产生裂纹时，非固态导电胶500会由于重力作用流动至可拉伸导电层200产生的裂纹中，当非固态导电胶500固化后，就可以对可拉伸导电层200受到拉伸作用时产生的裂纹进行填充。由于非固态导电胶500具有导电性能，当非固态导电胶500填充于可拉伸导电层200的裂纹中时，可以保证可拉伸导电层200与柔性电路板400之间正常的电连接关系，避免可拉伸导电层200与柔性电路板400之间出现电连接失效的问题，即非固态导电胶500可以对可拉伸导电层200形成保护，防止可拉伸导电层200产生裂纹，有助于保证电连接组件10保证稳定的电连接关系。
请继续参阅图9，图9是本发明实施例提供的第九种电连接组件的结构示意图。第九种电连接组件的结构与第一至第八种电连接组件的结构基本相同，不同之处在于，所述电连接组件10还包括保护层600，所述保护层600位于所述可拉伸导电层200远离所述柔性基板100的一侧，所述保护层600同时覆盖于所述可拉伸导电层200以及所述柔性电路板400，所述保护层600用于提高所述可拉伸导电层200与所述柔性电路板400之间拉伸时的承受力。
其中，所述保护层600可以为弹性封装层，如有机硅橡胶。所述保护层600的硬度大于所述柔性基板100的硬度，且所述保护层600的拉伸率小于所述柔性基板100的拉伸率。例如，当柔性基板100的硬度为30邵氏A，断裂延伸率为500％时，则保护层400采用硬度大于40邵氏A，断裂延伸率<300％的有机硅橡胶。由于保护层600具有较高的硬度，且具有较小的拉伸率，因此，当电连接组件10受到拉力作用时，保护层600可以承受部分拉伸力，从而可以提高可拉伸导电层200与柔性电路板400拉伸时的承受力，确保可拉伸导电层200与柔性电路板400之间保持稳定的电连接关系，进而保证电连接组件10的正常使用。
所述保护层600包括相连的第一部分610和第二部分620，所述第一部分610覆盖于所述可拉伸导电层200，所述第二部分620覆盖于所述柔性电路板400。当可拉伸导电层200和柔性电路板400同时受到拉伸时，由于可拉伸导电层200和柔性电路板400的材料特性不同，可拉伸导电层200和柔性电路板400会产生不同步的拉伸。将保护层600覆盖于可拉伸导电层200以及柔性电路板400，可以承担可拉伸导电层200和柔性电路板400之间的部分拉伸力，有助于提高可拉伸导电层200与柔性电路板400拉伸时的承受力，进而维持电连接 组件10稳定的电连接关系，保证电连接组件10的使用寿命。
在一种可能的实施方式中，所述第一部分610与所述第二部分620直接相连。
具体的，在本实施例中，第一部分610覆盖可拉伸导电层200，第二部分620覆盖柔性电路板400，且第一部分610直接相连于第二部分620。此时，第一部分610靠近柔性电路板400的端面与柔性电路板400直接贴合。由于保护层600紧密贴合于柔性电路板400，且覆盖于可拉伸导电层200以及柔性电路板400，当可拉伸导电层200与柔性电路板400同时受到拉伸作用时，保护层600可以为可拉伸导电层200以及柔性电路板400提供部分拉伸力，以减小可拉伸导电层200以及柔性电路板400之间产生的不同步的形变，从而可以避免可拉伸导电层200与柔性电路板400由于拉伸不同步导致电连接失效的情况，有助于确保可拉伸导电层200与柔性电路板400之间维持稳定的电连接关系，确保电连接组件10可以正常使用。
请继续参阅图10，在另一种可能的实施方式中，所述第一部分610靠近所述柔性电路板400的端面与所述柔性电路板400之间具有间隙A。
具体的，在本实施例中，所述保护层600还包括连接于第一部分610和第二部分620之间的第三部分630，第一部分610覆盖于可拉伸导电层200，第二部分620覆盖于柔性电路板400，第三部分630未覆盖柔性电路板400，即第三部分630与可拉伸导电层200之间具有间隙A。所述间隙A用于消除所述保护层600与所述可拉伸导电层200以及所述可拉伸导电层200与所述柔性电路板400之间形成的内应力。假如第三部分630也覆盖柔性电路板400，也就是说保护层600紧密贴合于可拉伸导电层200以及柔性电路板400，由于三者材料的拉伸率均不相同，那么在受到拉伸力的作用时必然会表现出不同程度的拉伸形变，换言之，在受到拉伸力的作用时，保护层600、可拉伸导电层200以及柔性电路板400之间会产生不均匀的内应力，当电连接组件10的内部长期受到这种内应力的作用时就可能会在内应力的作用下产生裂纹，进而导致电连接组件10出现电连接失效的问题。因此，当第三部分630与可拉伸导电层200之间形成间隙A时，所述间隙A对应部分的可拉伸导电层200可以产生正常的拉伸形变，不会受到保护层600的第三部分630的干扰，那么电连接组件10内部产生的不均匀的内应力就可以从所述间隙A对应部分的可拉伸导电层200处释放出去，使得电连接组件10内部保持均匀的受力，有助于使得电连接组件10维持稳定的电连接关系，进而保证电连接组件10的正常使用。
请继续参阅图11，图11是本发明实施例提供的第一种电子设备1的结构示意图。
其中，所述电子设备1可以是任何具备通信和存储功能的设备。例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。
具体的，以电子设备1为柔性折叠手机为例进行说明，电子设备1包括中框1000、电路板1100和按键2000，按键2000为控制按钮，可以为电源键，也可以为音量键，还可以为其他的功能按键。按键2000被按压后产生的电信号经由柔性电路板400传递至电路板1100，然后由电路板1100实现相应的控制功能。柔性电路板400的一端需要与电路板1100之间进行电连接，此时就可以采用本发明实施例提供的电连接组件10，将柔性电路板400的一端与电路板1100进行绑定，以确保电子设备1内部稳定的电连接关系。
请继续参阅图12，图12是本发明实施例提供的第一种电连接组件的制备方法。所述电连接组件10的制备方法包括但不限于步骤S100、S200、S300和S400，关于步骤S100、S200、S300和S400的详细介绍如下。
S100：提供柔性基板100。请参阅图13。
其中，所述柔性基板100可以为弹性基底，如高延伸率有机硅橡胶。
S200：形成覆盖所述柔性基板100的可拉伸导电层200。请参阅图14。
其中，所述可拉伸导电层200可以为液体有机硅银粉导电油墨制备而成。
S300：形成覆盖所述可拉伸导电层200的非固态导电胶500以及弹性导电胶层300，其中，所述可拉伸导电层200与所述弹性导电胶层300之间电连接，所述非固态导电胶500用于对所述可拉伸导电层200在拉伸过程中产生的裂纹进行修复。请参阅图15。
其中，弹性导电胶层300所述弹性导电胶层300具有高弹性、导电性和高粘接性，可以为液体有机硅银粉导电胶，室温硫化有机硅导电胶，弹性导电胶层300环绕非固态导电胶500设置。具体的，弹性导电胶层300可通过点胶、印刷、转印等方式将弹性导电胶层320形成电连接组件10的绑定区的中心以及边缘。
非固态导电胶500可以为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶，或是其与弹性导电胶层300的部分混合物。非固态导电胶500在拉伸后是可以流动的，静置时的粘性较大。当非固态导电胶500受到拉伸时，可以流入可拉伸导电层200表面形成的裂纹中，进而对可拉伸导电层200表面形成的裂纹进行修复。当非固态导电胶500没有被拉伸时，非固态导电胶500具有较大的粘性，从而将所述可拉伸导电层200和所述柔性电路板400紧密粘结，以使得所述可拉伸导电层200和所述柔性电路板400维持稳定的电连接关系。
在一实施方式中，先形成覆盖可拉伸导电层200的非固态导电胶500，再形成环绕非固态导电胶500的弹性导电胶层300。在另一实施方式中，先形成覆盖可拉伸导电层200的弹性导电胶层300，在形成贯穿弹性导电胶层300且覆盖于可拉伸导电层200的非固态导电胶500。
请参阅图16，在一种可能的实施方式中，所述非固态导电胶500具有相对的第一端510和第二端520，所述非固态导电胶500的径向尺寸自所述第一端510朝向所述第二端520逐渐减小，所述第二端520位于所述可拉伸导电层200的表面。
具体的，在本实施例中，所述非固态导电胶500呈现锥形，包括相对的第一端510和第二端520，第二端520直接接触于可拉伸导电层200，第一端510的径向尺寸大于第二端520的径向尺寸。此时，由于重力作用，所述非固态导电胶500更容易朝向可拉伸导电层200流动。当可拉伸导电层200受到拉伸产生裂纹时，非固态导电胶500会由于重力作用流动至可拉伸导电层200产生的裂纹中，当非固态导电胶500固化后，就可以对可拉伸导电层200受到拉伸作用时产生的裂纹进行填充。由于非固态导电胶500具有导电性能，当非固态导电胶500填充于可拉伸导电层200的裂纹中时，可以保证可拉伸导电层200与柔性电路板400之间正常的电连接关系，避免可拉伸导电层200与柔性电路板400之间出现电连接失效的问题，即非固态导电胶500可以对可拉伸导电层200形成保护，防止可拉伸导电层200产生裂纹，有助于保证电连接组件10保证稳定的电连接关系。
S400：形成覆盖所述弹性导电胶层300的柔性电路板400，其中，所述弹性导电胶层300与所述柔性电路板400之间电连接。请参阅图17。
其中，所述柔性电路板400又称为“软板”，是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板。具有配线密度高、重量轻、厚度薄、弯折性好的特点。
在本实施例中，所述可拉伸导电层200通过弹性导电胶层300与柔性电路板400之间形成电连接。由于可拉伸导电层200、弹性导电胶层300以及柔性电路板400三者的拉伸率存在差异，三者在受到拉伸作用时会呈现出不同大小的形变量，进而会导致三者出现不同步的拉伸效果。在此过程中，当可拉伸导电层200受到拉伸作用，且拉力大小大于某个阈值或者拉伸作用持续时间大于预设时间时，可拉伸导电层200就可能会产生裂纹。当裂纹出现时，可拉伸导电层200的横截面积减小，进而会导致可拉伸导电层200的电阻突然增大的情况，进一步的会导致经过可拉伸导电层200的电流减小，不利于电信号从可拉伸导电层200上传输。且在此过程中，可能会导致可拉伸导电层200被拉断的情况，破坏了可拉伸导电层200 与柔性电路板400之间的电连接关系，阻断了信号经柔性电路板400传输。为了解决这个问题，本发明的技术手段是采用非固态导电胶500覆盖于可拉伸导电层200，当可拉伸导电层200受到拉伸作用出现裂纹时，非固态导电胶500可以流动至可拉伸导电层200的裂纹中，进而固化后填充于可拉伸导电层200的裂纹中，由于非固态导电胶500具有导电性能，从而可以避免可拉伸导电层200出现电连接失效的问题，进而保证电连接组件10维持稳定的电连接关系。
请继续参阅图18，图18是本发明实施例提供的第二种电连接组件的制备方法。第二种电连接组件的制备方法与第一种电连接组件的制备方法基本相同，不同之处在于，所述“S300：形成覆盖所述可拉伸导电层200的非固态导电胶500以及弹性导电胶层300”包括但不限于步骤S310和S320，关于步骤S310和S320详细介绍如下。
S310：形成覆盖所述可拉伸导电层200的非固态导电胶500。请参阅图19。
其中，非固态导电胶500可以为有机硅导电硅脂、导电凝胶、液态金属等非固态成膜导电胶。
S320：形成覆盖所述非固态导电胶500以及所述可拉伸导电层200的弹性导电胶层300。请参阅图20。
具体的，在本实施例中，所述弹性导电胶层300邻近所述可拉伸导电层200的一侧具有收容槽300a，所述非固态导电胶500收容于所述收容槽300a内。所述收容槽300a的开口朝向可拉伸导电层200。非固态导电胶500位于收容槽300a内，且直接接触于可拉伸导电层200。可拉伸导电层200对应所述收容槽300a的部位通过非固态导电胶500与弹性导电胶层300形成电连接，可拉伸导电层200的其他部位直接与弹性导电胶层300形成电连接。当可拉伸导电层200、弹性导电胶层300和柔性电路板400三者受到拉伸作用时，由于可拉伸导电层200、弹性导电胶层300以及柔性电路板400三者的拉伸率存在差异，三者在受到拉伸作用时会呈现出不同大小的形变量，进而会导致三者出现不同步的拉伸效果。在此过程中，当可拉伸导电层200受到拉伸作用，且拉力大小大于某个阈值或者拉伸作用持续时间长度大于预设长度时，可拉伸导电层200就可能会产生裂纹。当裂纹出现时，可拉伸导电层200的横截面积减小，进而会导致可拉伸导电层200的电阻突然增大的情况，进一步的会导致经过可拉伸导电层200的电流减小，不利于电信号从可拉伸导电层200上传输。且在此过程中，可能会导致可拉伸导电层200被拉断的情况，破坏了可拉伸导电层200与柔性电路板400之间的电连接关系，阻断了信号经柔性电路板400传输。当可拉伸导电层200受到拉伸作用出现裂纹时，由于非固态导电胶500覆盖于可拉伸导电层200，且位于弹性导电胶层300的收容槽300a内，在重力作用下，非固态导电胶500可以流动至可拉伸导电层200的裂纹中，进而固化后填充于可拉伸导电层200的裂纹中，由于非固态导电胶500具有导电性能，从而可以避免可拉伸导电层200出现电连接失效的问题，进而保证电连接组件10维持稳定的电连接关系。
请继续参阅图21，图21是本发明实施例提供的第三种电连接组件的制备方法。第三种电连接组件的制备方法与第一种电连接组件的制备方法基本相同，不同之处在于，所述“S300：形成覆盖所述可拉伸导电层200的非固态导电胶500以及弹性导电胶层300”包括但不限于步骤S330、S340和S350，关于步骤S330、S340和S350详细介绍如下。
S330：形成覆盖所述可拉伸导电层200的非固态导电胶500。请参阅图22。
S340：形成覆盖所述可拉伸导电层200的弹性导电胶层300，所述弹性导电胶层300具有容纳孔300b，所述容纳孔300b为通孔，以将所述非固态导电胶500显露出来。请参阅图23。
S350：形成同时覆盖所述弹性导电胶层300以及所述非固态导电胶500的柔性电路板400。请参阅图24。
具体的，在本实施例中，非固态导电胶500同时电连接于可拉伸导电层200和柔性电路板400，从而可以在可拉伸导电层200和柔性电路板400之间形成电连接关系。此外，由于可拉伸导电层200和柔性电路板400之间还设置有弹性导电胶层300，弹性导电胶层300又可以在可拉伸导电层200和柔性电路板400之间形成电连接关系。也就是说，由于非固态导电胶500以及弹性导电胶层300的存在，可以在可拉伸导电层200和柔性电路板400之间形成至少两条电连接的通路。且由于非固态导电胶500位于弹性导电胶层300形成的容纳孔300b内，使得非固态导电胶500与弹性导电胶层300之间又形成的稳定的电连接关系，因此，就可以使得柔性电路板400、非固态导电胶500、弹性导电胶层300和可拉伸导电层200四者之间形成稳定的电连接关系，进而保证电连接组稳定的电连接关系，保证电连接组件10的正常使用。
请继续参阅图25，图25是本发明实施例提供的第四种电连接组件的制备方法。第四种电连接组件的制备方法与第一种电连接组件的制备方法基本相同，不同之处在于，所述“S300：形成覆盖所述可拉伸导电层200的非固态导电胶500以及弹性导电胶层300”包括但不限于步骤S360、S370和S380，关于步骤S360、S370和S380详细介绍如下。
S360：形成覆盖所述可拉伸导电层200的非固态导电胶500。请参阅图26。
S370：形成覆盖所述可拉伸导电层200的弹性导电胶层300，所述弹性导电胶层300具有第一收容孔301，所述第一收容孔301为通孔，以将所述非固态导电胶500显露出来。请参阅图27。
S380：形成覆盖所述弹性导电胶层300的柔性电路板400，所述柔性电路板400具有第二收容孔401，所述第二收容孔401为盲孔，所述柔性电路板400覆盖所述非固态导电胶500。请参阅图28。
在一实施方式中，所述第一收容孔301正对所述第二收容孔401设置，且第一收容孔301的径向尺寸与第二收容孔401的径向尺寸大小保持一致。由于第一收容孔301连通第二收容孔401，因此，可以在制备工艺中一并形成第一收容孔301和第二收容孔401，有助于节省加工工序。
可以理解的，在其他实施方式中，所述第一收容孔301也可以偏离所述第二收容孔401设置，且所述第一收容孔301的大小也可以与第二收容孔401的大小保持不一致。即所述第一收容孔301的径向尺寸大于所述第二收容孔401的径向尺寸，或者，所述第一收容孔301的径向尺寸小于所述第二收容孔401的径向尺寸。
进一步的，由于所述第一收容孔301为通孔，所述第二收容孔401为盲孔，即所述非固态导电胶500完全贯穿所述弹性导电胶层300，且非固态导电胶500部分贯穿所述柔性电路板400。由于非固态导电胶500部分贯穿柔性电路板400，柔性电路板400会对非固态导电胶500产生部分拉伸力，从而使得非固态导电胶500与柔性电路板400之间形成稳定的电连接关系。且由于非固态导电胶500完全贯穿弹性导电胶层300，因此，非固态导电胶500不容易从弹性导电胶层300中脱落出来，使得非固态导电胶500与弹性导电胶层300之间维持稳定的电连接关系。也就是说，采用本实施例的方式，可以使得非固态导电胶500、弹性导电胶层300以及柔性电路板400三者之间维持稳定的电连接关系。且更进一步的，由于弹性导电胶层300覆盖于可拉伸导电层200的表面，因此，弹性导电胶层300与可拉伸导电层200之间可以保持稳定的电连接关系，也就是说，可拉伸导电层200可以直接通过弹性导电胶层300与柔性电路板400之间形成稳定的电连接关系，可拉伸导电层200也可以通过非固态导电胶500与柔性电路板400之间形成稳定的电连接关系，即可拉伸导电层200可以通过至少两个路径与柔性电路板400之间形成稳定的电连接关系，从而可以确保电信号顺利的从可拉伸导电层200传输至柔性电路板400，保证了电连接组件10的正常电连接功能。
请继续参阅图29，图29是本发明实施例提供的第五种电连接组件的制备方法。第五种 电连接组件的制备方法与第一种电连接组件的制备方法基本相同，不同之处在于，所述“S300：形成覆盖所述可拉伸导电层200的非固态导电胶500以及弹性导电胶层300”包括但不限于步骤S301、S302和S303，关于步骤S301、S302和S303详细介绍如下。
S301：形成覆盖所述可拉伸导电层200的非固态导电胶500。请参阅图30。
S302：形成覆盖所述可拉伸导电层200的弹性导电胶层300，所述弹性导电胶层300具有第一通孔302，以将所述非固态导电胶500显露出来。请参阅图31。
S303：形成覆盖所述弹性导电胶层300的柔性电路板400，所述柔性电路板400具有第二通孔402，以将所述非固态导电胶500显露出来。请参阅图32。
其中，第二通孔402可为方形、圆形等各式形状。
具体的，在本实施例中，非固态导电胶500位于第一通孔302和第二通孔402内，一方面当弹性导电胶层300产生裂纹时，可以对弹性导电胶层300产生的裂纹进行修复，另一方面当柔性电路板400产生裂纹时，还可以对柔性电路板400产生的裂纹进行修复。此外，由于非固态导电胶500位于可拉伸导电层200的表面，因此，当可拉伸导电层200由于拉伸作用而产生裂纹时，非固态导电胶500可以对可拉伸导电层200在拉伸过程中产生的裂纹进行修复。
在一实施方式中，所述第一通孔302正对所述第二通孔402设置，且第一通孔302的径向尺寸与第二通孔402的径向尺寸大小保持一致。由于第一通孔302连通第二通孔402，因此，可以在制备工艺中一并形成第一通孔302和第二通孔402，有助于节省加工工序。
可以理解的，在其他实施方式中，所述第一通孔302也可以偏离所述第二通孔402设置，且所述第一通孔302的大小也可以与第二通孔402的大小保持不一致。即所述第一通孔302的径向尺寸大于所述第二通孔402的径向尺寸，或者，所述第一通孔302的径向尺寸小于所述第二通孔402的径向尺寸。
请继续参阅图33，图33是本发明实施例提供的第六种电连接组件的制备方法。第六种电连接组件的制备方法与第一至第五种电连接组件的制备方法基本相同，不同之处在于，所述电连接组件10的制备方法还包括但不限于步骤S250，关于步骤S250详细介绍如下。
S250：在所述可拉伸导电层200对应所述非固态导电胶500的部位形成微结构600，所述微结构600用于增大所述非固态导电胶500与所述可拉伸导电层200之间的附着力。请参阅图34。
其中，所述微结构600可以为锯齿状结构，以增大非固态导电胶500与可拉伸导电层200之间的接触面积。非固态导电胶500具有静置增稠和剪切变稀的特性。在静置的时候，粘度大，流动性小，在受到压力或者被拉伸时，粘度变小，流动性增加。当可拉伸导电层200产生裂纹时，非固态导电胶500粘度变小，流动性增加，进而可以流动至可拉伸导电层200的裂纹中，当非固态导电胶500固化后会填充于可拉伸导电层200的裂纹中，进而对裂纹进行修复。由于可拉伸导电层200对应非固态导电胶500的部位设置有微结构600，可以促使更多的非固态导电胶500附着于可拉伸导电层200的微结构600上，进而增大非固态导电胶500与可拉伸导电层200之间的附着力，从而有助于对可拉伸导电层200产生的裂纹形成修复。此外，非固态导电胶500也可以呈现可拉伸导电层200被拉伸时的部分拉伸力，有助于改善可拉伸导电层200出现裂纹的情况。
请继续参阅图35，图35是本发明实施例提供的第七种电连接组件的制备方法。第七种电连接组件的制备方法与第一至第五种电连接组件的制备方法基本相同，不同之处在于，所述电连接组件10的制备方法还包括但不限于步骤S270，关于步骤S270详细介绍如下。
S270：在所述可拉伸导电层200对应所述非固态导电胶500的部位形成凸起部210，所述凸起部210用于辅助所述非固态导电胶500沿着所述可拉伸导电层200的表面流动。请参阅图36。
其中，所述凸起部210呈弧形拱起状。当凸起部210对应非固态导电胶500设置时，可以辅助非固态导电胶500朝向可拉伸导电层200与弹性导电胶层300的连接处流动，进而使得更多的非固态导电胶500流动至可拉伸导电层200产生的裂纹中，从而可以更好的对可拉伸导电层200产生的裂纹进行修复。
请继续参阅图37，图37是本发明实施例提供的第八种电连接组件的制备方法。第八种电连接组件的制备方法与第一至第七种电连接组件的制备方法基本相同，不同之处在于，在所述“S400：形成覆盖所述弹性导电胶层300的柔性电路板400”之后，所述电连接组件10的制备方法还包括但不限于步骤S500，关于步骤S500详细介绍如下。
S500：在所述可拉伸导电层200远离所述柔性基板100的一侧形成保护层600，所述保护层600同时覆盖于所述可拉伸导电层200以及所述柔性电路板400，所述保护层600用于提高所述可拉伸导电层200与所述柔性电路板400之间拉伸时的承受力。请参阅图38。
其中，所述保护层600可以为弹性封装层，如有机硅橡胶。所述保护层600的硬度大于所述柔性基板100的硬度，且所述保护层600的拉伸率小于所述柔性基板100的拉伸率。例如，当柔性基板100的硬度为30邵氏A，断裂延伸率为500％时，则保护层400采用硬度大于40邵氏A，断裂延伸率<300％的有机硅橡胶。由于保护层600具有较高的硬度，且具有较小的拉伸率，因此，当电连接组件10受到拉力作用时，保护层600可以承受部分拉伸力，从而可以提高可拉伸导电层200与柔性电路板400拉伸时的承受力，确保可拉伸导电层200与柔性电路板400之间保持稳定的电连接关系，进而保证电连接组件10的正常使用。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以权利要求的保护范围为准。

Claims (19)

  1. 一种电连接组件，其特征在于，所述电连接组件包括依次层叠设置的柔性基板、可拉伸导电层、弹性导电胶层和柔性电路板，所述可拉伸导电层与所述柔性电路板通过所述弹性导电胶层电连接，所述电连接组件还包括非固态导电胶，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复。
  2. 如权利要求1所述的电连接组件，其特征在于，所述弹性导电胶层邻近所述可拉伸导电层的一侧具有收容槽，所述非固态导电胶收容于所述收容槽内。
  3. 如权利要求1所述的电连接组件，其特征在于，所述弹性导电胶层具有容纳孔，所述容纳孔为通孔，所述非固态导电胶收容于所述容纳孔内，且同时电连接于所述可拉伸导电层和所述柔性电路板。
  4. 如权利要求1所述的电连接组件，其特征在于，所述弹性导电胶层具有第一收容孔，所述柔性电路板邻近所述弹性导电胶层的一侧具有第二收容孔，所述第二收容孔连通所述第一收容孔，所述第一收容孔为通孔，所述第二收容孔为盲孔，所述非固态导电胶收容于所述第一收容孔以及所述第二收容孔内。
  5. 如权利要求1所述的电连接组件，其特征在于，所述弹性导电胶层具有第一通孔，所述柔性电路板具有第二通孔，所述第二通孔连通所述第一通孔，所述非固态导电胶收容于所述第一通孔以及所述第二通孔内，且同时电连接于所述可拉伸导电层和所述柔性电路板。
  6. 如权利要求1-5任一项所述的电连接组件，其特征在于，所述可拉伸导电层对应所述非固态导电胶的部位设置有微结构，所述微结构用于增大所述非固态导电胶与所述可拉伸导电层之间的附着力。
  7. 如权利要求1-5任一项所述的电连接组件，其特征在于，所述可拉伸导电层对应所述非固态导电胶的部位设置有凸起部，所述凸起部用于辅助所述非固态导电胶沿着所述可拉伸导电层的表面流动。
  8. 如权利要求1-7任一项所述的电连接组件，其特征在于，所述非固态导电胶具有相对的第一端和第二端，所述非固态导电胶的径向尺寸自所述第一端朝向所述第二端逐渐减小，所述第二端位于所述可拉伸导电层的表面。
  9. 如权利要求1-8任一项所述的电连接组件，其特征在于，所述电连接组件还包括保护层，所述保护层位于所述可拉伸导电层远离所述柔性基板的一侧，所述保护层同时覆盖于所述可拉伸导电层以及所述柔性电路板，所述保护层用于提高所述可拉伸导电层与所述柔性电路板之间拉伸时的承受力。
  10. 一种电子设备，其特征在于，所述电子设备包括如权利要求1-9任一项所述的电连接组件。
  11. 一种电连接组件的制备方法，其特征在于，所述电连接组件的制备方法包括：
    提供柔性基板；
    形成覆盖所述柔性基板的可拉伸导电层；
    形成覆盖所述可拉伸导电层的非固态导电胶以及弹性导电胶层，其中，所述可拉伸导电层与所述弹性导电胶层之间电连接，所述非固态导电胶用于对所述可拉伸导电层在拉伸过程中产生的裂纹进行修复；
    形成覆盖所述弹性导电胶层的柔性电路板，其中，所述弹性导电胶层与所述柔性电路板之间电连接。
  12. 如权利要求11所述的电连接组件的制备方法，其特征在于，所述“形成覆盖所述可拉伸导电层的非固态导电胶以及弹性导电胶层”包括：
    形成覆盖所述可拉伸导电层的非固态导电胶；
    形成覆盖所述非固态导电胶以及所述可拉伸导电层的弹性导电胶层。
  13. 如权利要求11所述的电连接组件的制备方法，其特征在于，所述“形成覆盖所述可拉伸导电层的非固态导电胶以及弹性导电胶层”还包括：
    形成覆盖所述可拉伸导电层的非固态导电胶；
    形成覆盖所述可拉伸导电层的弹性导电胶层，所述弹性导电胶层具有容纳孔，所述容纳孔为通孔，以将所述非固态导电胶显露出来；
    形成同时覆盖所述弹性导电胶层以及所述非固态导电胶的柔性电路板。
  14. 如权利要求11所述的电连接组件的制备方法，其特征在于，所述“形成覆盖所述可拉伸导电层的非固态导电胶以及弹性导电胶层”还包括：
    形成覆盖所述可拉伸导电层的非固态导电胶；
    形成覆盖所述可拉伸导电层的弹性导电胶层，所述弹性导电胶层具有第一收容孔，所述第一收容孔为通孔，以将所述非固态导电胶显露出来；
    形成覆盖所述弹性导电胶层的柔性电路板，所述柔性电路板具有第二收容孔，所述第二收容孔为盲孔，所述柔性电路板覆盖所述非固态导电胶。
  15. 如权利要求11所述的电连接组件的制备方法，其特征在于，所述“形成覆盖所述可拉伸导电层的非固态导电胶以及弹性导电胶层”还包括：
    形成覆盖所述可拉伸导电层的非固态导电胶；
    形成覆盖所述可拉伸导电层的弹性导电胶层，所述弹性导电胶层具有第一通孔，以将所述非固态导电胶显露出来；
    形成覆盖所述弹性导电胶层的柔性电路板，所述柔性电路板具有第二通孔，以将所述非固态导电胶显露出来。
  16. 如权利要求11-15任一项所述的电连接组件的制备方法，其特征在于，所述电连接组件的制备方法还包括：
    在所述可拉伸导电层对应所述非固态导电胶的部位形成微结构，所述微结构用于增大所述非固态导电胶与所述可拉伸导电层之间的附着力。
  17. 如权利要求11-15任一项所述的电连接组件的制备方法，其特征在于，所述电连接组件的制备方法还包括：
    在所述可拉伸导电层对应所述非固态导电胶的部位形成凸起部，所述凸起部用于辅助所述非固态导电胶沿着所述可拉伸导电层的表面流动。
  18. 如权利要求11-17任一项所述的电连接组件的制备方法，其特征在于，所述非固态导电胶具有相对的第一端和第二端，所述非固态导电胶的径向尺寸自所述第一端朝向所述第二端逐渐减小，所述第二端位于所述可拉伸导电层的表面。
  19. 如权利要求11-18任一项所述的电连接组件的制备方法，其特征在于，在所述“形成覆盖所述弹性导电胶层的柔性电路板”之后，所述电连接组件的制备方法还包括：
    在所述可拉伸导电层远离所述柔性基板的一侧形成保护层，所述保护层同时覆盖于所述可拉伸导电层以及所述柔性电路板，所述保护层用于提高所述可拉伸导电层与所述柔性电路板之间拉伸时的承受力。
PCT/CN2019/079073 2019-03-21 2019-03-21 电连接组件、电子设备及电连接组件的制备方法 Ceased WO2020186517A1 (zh)

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