WO2020170610A1 - 窒化物圧電体およびそれを用いたmemsデバイス - Google Patents
窒化物圧電体およびそれを用いたmemsデバイス Download PDFInfo
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- 150000004767 nitrides Chemical class 0.000 title description 2
- 239000000126 substance Substances 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 14
- 229910052748 manganese Inorganic materials 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 229910052741 iridium Inorganic materials 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052762 osmium Inorganic materials 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052703 rhodium Inorganic materials 0.000 claims description 7
- 229910052707 ruthenium Inorganic materials 0.000 claims description 7
- 229910052713 technetium Inorganic materials 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052702 rhenium Inorganic materials 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract description 115
- 239000011777 magnesium Substances 0.000 description 42
- 239000011651 chromium Substances 0.000 description 30
- 229910052749 magnesium Inorganic materials 0.000 description 22
- 125000004429 atom Chemical group 0.000 description 16
- 238000006467 substitution reaction Methods 0.000 description 16
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 14
- 229910052706 scandium Inorganic materials 0.000 description 14
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 14
- 238000004088 simulation Methods 0.000 description 10
- 238000004364 calculation method Methods 0.000 description 9
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 239000011572 manganese Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 6
- 239000010948 rhodium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052984 zinc sulfide Inorganic materials 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- GKLVYJBZJHMRIY-UHFFFAOYSA-N technetium atom Chemical compound [Tc] GKLVYJBZJHMRIY-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0602—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with two or more other elements chosen from metals, silicon or boron
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/072—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with aluminium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
Definitions
- the present invention relates to a piezoelectric body of aluminum nitride in which a predetermined element is added together with magnesium, and a MEMS device using the piezoelectric body.
- FBAR Biharmonic Resonator
- the FBAR filter is a filter using a resonator that uses a thickness extensional vibration mode of a thin film exhibiting piezoelectric response, and has a characteristic that resonance in the gigahertz band is possible. Since the FBAR filter having such characteristics has low loss and can operate in a wide band, it is expected to contribute to further high frequency compatibility, downsizing and power saving of portable devices.
- the piezoelectric material of the piezoelectric thin film used for such FBAR for example, aluminum nitride containing scandium (see Patent Document 1), aluminum nitride containing inexpensive magnesium and niobium (see Non-Patent Document 1), etc. Is mentioned.
- scandium-added aluminum nitride has a high piezoelectric constant and is expected to be used in next-generation high-frequency filters.
- aluminum nitride added with scandium is expected to be used for various MEMS devices such as physical sensors such as pressure sensors, acceleration sensors, gyro sensors, actuators and the like.
- the present inventor has discovered that doping aluminum nitride with an element such as Sc tends to improve the piezoelectric constant and the like, and the higher the concentration of the element to be doped, the higher the piezoelectric constant and the like.
- the upper limit of the concentration of a single element that can be doped into aluminum nitride is low, and there is a problem that a piezoelectric body having a high piezoelectric constant or the like cannot be produced as it is.
- the piezoelectric body used in the MEMS device needs to be evaluated with a performance index according to the purpose of the MEMS device.
- the piezoelectric body when used as an actuator or a sensor, it is necessary to evaluate the piezoelectric constant d 33 indicating the magnitude of strain generated when a voltage is applied or g 33 indicating the voltage generated when a pressure is applied. ..
- k 2 which represents the conversion efficiency of electrical energy and mechanical energy is also an important figure of merit.
- these figures of merit there is a problem in that, including the aluminum nitride described in Non-Patent Document 1, there is no one that is as high as or exceeds the value of aluminum nitride to which scandium is added.
- the piezoelectric constant d 33 the stress e 33 generated when an electric field is applied to the piezoelectric body constrained so as not to be distorted and the proportional constant C 33 of the strain generated when the stress is applied to the piezoelectric body are calculated. Is required.
- the dielectric constant ⁇ 33 of the piezoelectric body is also necessary for calculating the piezoelectric output constant g 33 and the electromechanical coupling constant k 2 .
- the piezoelectric performance index of the c-axis component is important.
- an object of the present invention is to provide a nitride piezoelectric material having a structure and a MEMS device using the same.
- “high figure of merit” does not mean that the figure of the figure of merit is large, but that it is an excellent figure of merit.
- the inventor of the present invention shows that a high performance index can be obtained by adding (doping) a predetermined element (substitution element M) together with magnesium (Mg) to aluminum nitride (AlN).
- substitution element M a predetermined element
- Mg magnesium
- AlN aluminum nitride
- a first aspect of the present invention for solving the above-described problems is represented by a chemical formula Al 1-X-Y Mg X M Y N, where X+Y is smaller than 1, and X is larger than 0 and smaller than 1 and Y is
- the piezoelectric body is characterized by being in the range of more than 0 and less than 1.
- M represents any one of Cr, Mn, Fe, Co, Ni, Mo, Tc, Ru, Rh, Pd, Ag, W, Re, Os, Ir, Pt, and Au.
- the figure of merit (d 33 , e 33 , C 33 , g 33 and k 2 is higher than that of aluminum nitride added with scandium in the same concentration as the added (doped) element (magnesium and the substitution element M). It is possible to provide a piezoelectric body having a value of at least one of the above.
- a second aspect of the present invention is characterized in that X+Y is 0.65 or less, X is larger than 0 and smaller than 0.65, and Y is larger than 0 and smaller than 0.65.
- the piezoelectric body according to the aspect is characterized in that X+Y is 0.65 or less, X is larger than 0 and smaller than 0.65, and Y is larger than 0 and smaller than 0.65.
- At least one of the performance indexes (d 33 , e 33 , C 33 , g 33, and k 2 ) higher than that of aluminum nitride added with scandium having the same concentration as the added element (magnesium and the substitution element M). It is possible to provide a piezoelectric body having a value of 1).
- a third aspect of the present invention is characterized in that X+Y is 0.375 or less, and X is in the range of more than 0 and not more than 0.1875 and Y is more than 0 and not more than 0.1875.
- At least one of the performance indexes (d 33 , e 33 , C 33 , g 33, and k 2 ) higher than that of aluminum nitride added with scandium having the same concentration as the added element (magnesium and the substituting element M). It is possible to provide a piezoelectric body having a value of 1).
- a fourth aspect of the present invention is characterized in that X+Y is 0.125 or less, X is in a range of more than 0 and 0.0625 or less, and Y is in a range of more than 0 and 0.0625 or less.
- the piezoelectric body according to the aspect is characterized in that X+Y is 0.125 or less, X is in a range of more than 0 and 0.0625 or less, and Y is in a range of more than 0 and 0.0625 or less.
- At least one of the performance indexes (d 33 , e 33 , C 33 , g 33, and k 2 ) higher than that of aluminum nitride to which scandium having the same concentration as the added element (magnesium and the substitution element M) is added. It is possible to provide a piezoelectric body having a value of 1).
- M is any one of Cr, Mn, Fe, Co, Ni, Mo, Tc, Ru, Rh, Pd, Ag, W, Os, Ir, Pt, Au.
- the piezoelectric body according to any one of the first to fourth aspects is characterized.
- the performance index (d 33 , e 33 , C 33 , g 33 and k 2 ) is higher than that of aluminum nitride added with scandium in the same concentration as the added element (magnesium and the substitution element M).
- a piezoelectric body having a value of at least any one can be provided.
- a sixth aspect of the present invention is the piezoelectric body according to any one of the first to fourth aspects, wherein M is Cr or Mn.
- the mixing enthalpy is higher than that of Al 1-x Sc x N added with scandium having the same concentration X (mol %) as the concentration (mol %) of the added element (magnesium and the substituting element M). It is possible to provide a piezoelectric body having a lower temperature and being easier to manufacture. Further, since the mixing enthalpy of aluminum nitride added with the elements (magnesium and the substitution element M) is smaller than that of aluminum nitride added with the same concentration of scandium, the solid solution of the elements (magnesium and the substitution element M) is more than that of scandium. The concentration can be increased. As a result, it is possible to provide a piezoelectric body having a higher figure of merit value than existing piezoelectric bodies.
- a seventh aspect of the present invention is a MEMS device using the piezoelectric body according to any one of the first to sixth aspects.
- the “MEMS device” is not particularly limited as long as it is a microelectromechanical system, and examples thereof include physical sensors such as pressure sensors, acceleration sensors, gyro sensors, actuators, microphones, fingerprint authentication sensors, vibration power generators, and the like. Can be mentioned.
- the piezoelectric body having these high piezoelectric constants d 33 has low loss and can operate in a wide band. Therefore, by using these piezoelectric materials, it is possible to provide a MEMS device that can contribute to further high frequency compatibility, size reduction, and power saving of portable equipment.
- FIG. 1 is a graph showing the values of the mixed enthalpies of Al 0.875 Mg 0.0625 Cr 0.0625 N, Al 0.875 Sc 0.125 N and Al 0.875 Cr 0.125 N.
- FIG. 2 is a diagram showing an example of a calculation model of doped AlN used in the simulation according to the first embodiment.
- FIG. 3 is a graph showing the relationship between non-doped AlN, AlN doped with only Sc and each doped AlN, and the lattice constant ratio c/a.
- FIG. 4 is a graph showing the relationship between non-doped AlN, AlN doped only with Sc and each doped AlN, and the piezoelectric stress constant e 33 .
- FIG. 1 is a graph showing the values of the mixed enthalpies of Al 0.875 Mg 0.0625 Cr 0.0625 N, Al 0.875 Sc 0.125 N and Al 0.875 Cr 0.125 N.
- FIG. 2 is a diagram showing an example of a calculation model of doped AlN
- FIG. 5 is a graph showing the relationship between non-doped AlN, AlN doped only with Sc and each doped AlN, and the elastic constant C 33 .
- FIG. 6 is a graph showing the relationship between non-doped AlN, AlN doped with only Sc, and each doped AlN, and the enthalpy of mixing.
- FIG. 7 is a graph showing the relationship between non-doped AlN, AlN doped only with Sc and each doped AlN, and the electromechanical coupling coefficient k 2 .
- FIG. 8 is a graph showing the relationship between non-doped AlN, AlN doped only with Sc and each doped AlN, and the piezoelectric constant d 33 .
- FIG. 6 is a graph showing the relationship between non-doped AlN, AlN doped only with Sc and each doped AlN, and the elastic constant C 33 .
- FIG. 6 is a graph showing the relationship between non-doped AlN, AlN doped with only Sc, and
- FIG. 9 is a graph showing the relationship between non-doped AlN, AlN doped only with Sc and each doped AlN, and the piezoelectric output constant g 33 .
- FIG. 10 is a graph showing the relationship between the concentrations X(Sc), X+Y(Mg+Cr) and the mixing enthalpy of the piezoelectric material.
- FIG. 11 is a graph showing the relationship between the concentrations X(Sc), X+Y(Mg+Cr) and the lattice constant ratio c/a of the piezoelectric body.
- FIG. 12 is a graph showing the relationship between the concentration X+Y (Mg+Cr) and the piezoelectric stress constant e 33 of the piezoelectric body.
- VASP Vehicle Ab initio Simulation Package
- first-principles calculation is a general term for electronic state calculation methods that do not use fitting parameters, etc., and the electronic state can be calculated only by the atomic number and coordinates of each atom constituting a unit cell or molecule. It is a technique that can be done.
- a unit cell composed of two aluminum atoms and two nitrogen atoms is doubled in the a-axis, b-axis, and c-axis directions to obtain 16 aluminum atoms and 16 nitrogen atoms, respectively.
- Non-doped AlN having a wurtzite crystal structure of a super cell composed of atoms was used for the simulation. Then, for AlN having this wurtzite crystal structure, the atomic coordinates, the cell volume, and the cell shape were all moved at the same time to perform the first-principles calculation, and the electronic state of non-doped AlN having a stable structure was calculated.
- Table 1 shows the lattice constant in the a-axis direction, the lattice constant in the c-axis direction, and the lattice constant in the a-axis direction and the lattice constant in the c-axis direction calculated from the electronic state of AlN having a stable structure obtained by the first principle calculation. It is the value (calculated value) of the ratio (c/a).
- Table 1 also shows experimental values obtained by actually forming a non-doped AlN film by a sputtering method and measuring the AlN film by an X-ray diffraction method.
- the substitution element M (M is Cr, Mn, Fe, Co, Ni, Mo, Tc, Ru, Rh, Pd, Ag, W, Re, Os, together with magnesium (Mg) is added to aluminum nitride (AlN).
- AlN aluminum nitride
- FIG. 1 shows a mixed enthalpy of aluminum nitride (Al 0.875 Mg 0.0625 Cr 0.0625 N) doped with Cr as a substitution element M together with Mg, and doped with only Sc of the same concentration.
- 2 shows mixed enthalpies of aluminum nitride (Al 0.875 Sc 0.125 N) and aluminum nitride (Al 0.875 Cr 0.125 N) doped with only the same concentration of Cr.
- the mixing enthalpy ( ⁇ H mixing ) of each aluminum nitride can be obtained by substituting each numerical value calculated by VASP into the following mathematical expression 1.
- the mixing enthalpy of AlN codoped with Mg and Cr is lower than the mixing enthalpy of AlN doped with only Sc at the same concentration or AlN doped with only Cr.
- the mixed enthalpy of aluminum nitride Al 0.875 Mg 0.0625 Cr 0.0625 N
- Cr is doped together with Mg
- the enthalpy of mixing of aluminum nitride doped with M (excluding Re) is likewise low. Therefore, AlN can be doped with a larger amount of elements (Mg+substitution element M (excluding Re)) than scandium (at a high concentration).
- FIG. 2 is a diagram showing an example of a crystal structure of doped AlN doped with magnesium and a substitution element M used in the simulation according to the present embodiment.
- the crystal structure of this doped AlN has a unit cell consisting of 16 Al atoms and 16 N atoms, in which one Al atom is replaced with Mg atom and one Al atom is replaced with Mg atom. It has a wurtzite crystal structure in which an atom is replaced with a substitution element M atom.
- Mg atoms and substitution element M atoms when the total number of Al atoms, Mg atoms and substitution element M atoms is 1, the number of Mg atoms is X and the number of substitution element M atoms is Y. Then, the Mg atom concentration X and the substitutional element M concentration Y of the doped AlN used in this simulation are both 0.0625. Note that these doped AlNs can be actually manufactured by the manufacturing method described in Non-Patent Document 1 described above.
- substitutional element M chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), molybdenum (Mo), technetium (Tc), ruthenium (Ru), Rhodium (Rh), palladium (Pd), silver (Ag), tungsten (W), rhenium (Re), osmium (Os), iridium (Ir), platinum (Pt), and gold (Au) were used.
- the electronic state of the stable structure can be calculated by the first principle calculation, as in the case of non-doped AlN. Then, the values of the lattice constant in the a-axis direction, the lattice constant in the c-axis direction, and the lattice constant ratio c/a can be calculated from this electronic state.
- the piezoelectric stress constant e 33 , elastic constant C 33, and dielectric constant ⁇ 33 of non-doped AlN, AlN doped with only Sc, and doped AlN can be calculated from the minute change in total energy at that time. That is, the first principle calculation can be used to calculate the piezoelectric stress constant e 33 , elastic constant C 33, and dielectric constant ⁇ 33 of non-doped AlN, AlN doped with only Sc, and doped AlN, respectively.
- Table 2 shows the lattice constant c, lattice constant a, lattice constant ratio c/a, piezoelectric stress constant e 33 , elastic constant C 33, and dielectric constant ⁇ of the obtained non-doped AlN, AlN doped only with Sc, and each doped AlN. 33 is shown.
- the larger the piezoelectric stress constant e 33 the higher the figure of merit.
- FIG. 3 is a graph showing the relationship between the non-doped AlN, AlN doped with only Sc and each doped AlN and the lattice constant ratio c/a
- FIG. 3 shows the non-doped AlN, AlN doped with only Sc and each doped AlN and the piezoelectric stress constant
- FIG. 4 shows a graph showing the relationship with e 33
- FIG. 5 shows a graph showing the relationship between non-doped AlN, AlN doped with only Sc and each doped AlN, and elastic constant C 33 .
- the electromechanical coupling coefficient k 2 , the piezoelectric constant d 33, and the piezoelectric output constant g 33 of AlN and doped AlN can be calculated, respectively.
- the elastic constants C 11 , C 12 , C 13 and the piezoelectric stress constant e 31 can be calculated in the same manner as the piezoelectric stress constant e 33 and the elastic constant C 33 .
- Table 3 shows the mixed enthalpies, the electromechanical coupling coefficient k 2 , the piezoelectric constant d 33, and the piezoelectric output constant g 33 of the obtained non-doped AlN, AlN doped with only Sc, and each doped AlN.
- the electromechanical coupling coefficient k 2 , the piezoelectric constant d 33, and the piezoelectric output constant g 33 indicate that the larger the numerical value, the higher the figure of merit.
- FIG. 7 is a graph showing the relationship between FIG. 7, non-doped AlN, Sc-only AlN and graphs showing the relationship between each doped AlN and the piezoelectric constant d 33
- FIG. 8 is shown as non-doped AlN, Sc-only AlN
- each FIG. 9 is a graph showing the relationship between the doped AlN and the piezoelectric output constant g 33 .
- these piezoelectric bodies having a high figure of merit have low loss and can operate in a wide band. Therefore, by using these piezoelectric bodies, it is possible to provide a MEMS device that can contribute to further high frequency compatibility, size reduction, and power saving of portable equipment.
- the present invention is not limited to this, and it is sufficient that X+Y is smaller than 1, X is larger than 0 and smaller than 1, and Y is larger than 0 and smaller than 1.
- these variables X and Y are such that X+Y is 0.65 or less, X is larger than 0 and smaller than 0.65, and Y is larger than 0 and smaller than 0.65.
- the piezoelectric body can be reliably manufactured.
- the mixing enthalpy increases as the concentration X+Y increases. Becomes smaller.
- the mixing enthalpy increases as the concentration X increases. Therefore, it is understood that the piezoelectric body doped with Cr together with Mg is easier to manufacture than the piezoelectric body doped with Sc of the same concentration.
- FIG. 11 shows the relationship between the concentration X+Y (Mg and Cr are added at the same concentration (mol %)) and the lattice constant ratio c/a of the piezoelectric body.
- concentration X+Y Mg and Cr are added at the same concentration (mol %)
- lattice constant ratio c/a decreases as X+Y (X in the case of Sc) increases, similarly to the piezoelectric body doped with Sc. I understand.
- FIG. 12 shows the relationship between the concentration X+Y (Mg and Cr are added at the same concentration (mol %)) and the piezoelectric stress constant e 33 of the piezoelectric body.
- the piezoelectric stress constant e 33 increases with increasing X+Y in the piezoelectric body doped with Cr as well as Mg.
- variables X and Y have X+Y of 0.375 or less, X of more than 0 and 0.1875 or less, and Y of more than 0 and 0.1875 or less.
- variables X and Y have X+Y of 0.125 or less, X of more than 0 and 0.0625 or less, and Y of more than 0 and 0.0625 or less.
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Abstract
Description
(実施形態1)
Claims (7)
- 化学式Al1-X-YMgXMYNで表され、X+Yが1より小さく、かつXは0より大きく1より小さく、Yは0より大きく1より小さい範囲にあることを特徴とする圧電体。
(Mは、Cr,Mn,Fe,Co,Ni,Mo,Tc,Ru,Rh,Pd,Ag,W,Re,Os,Ir,Pt,Auの何れか1つを示す。) - X+Yが0.65以下で、かつXは0より大きく0.65より小さく、Yは0より大きく0.65より小さい範囲にあることを特徴とする請求項1に記載の圧電体。
- X+Yが0.375以下で、かつXは0より大きく0.1875以下、Yは0より大きく0.1875以下の範囲にあることを特徴とする請求項1に記載の圧電体。
- X+Yが0.125以下で、かつXは0より大きく0.0625以下、Yは0より大きく0.0625以下の範囲にあることを特徴とする請求項1に記載の圧電体。
- Mが、Cr,Mn,Fe,Co,Ni,Mo,Tc,Ru,Rh,Pd,Ag,W,Os,Ir,Pt,Auの何れか1つであることを特徴とする請求項1~4の何れか1項に記載の圧電体。
- Mが、CrまたはMnであることを特徴とする請求項1~4の何れか1項に記載の圧電体。
- 請求項1~6の何れか1項に記載の圧電体を用いたMEMSデバイス。
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EP19916041.7A EP3865456B1 (en) | 2019-02-22 | 2019-12-27 | Nitride piezoelectric body and mems device using same |
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CN201980083625.XA CN113226982B (zh) | 2019-02-22 | 2019-12-27 | 氮化物压电体及使用其的mems器件 |
US17/415,691 US11999615B2 (en) | 2019-02-22 | 2019-12-27 | Nitride piezoelectric body and MEMS device using same |
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