WO2020152735A1 - Dispositif de transport - Google Patents

Dispositif de transport Download PDF

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Publication number
WO2020152735A1
WO2020152735A1 PCT/JP2019/001622 JP2019001622W WO2020152735A1 WO 2020152735 A1 WO2020152735 A1 WO 2020152735A1 JP 2019001622 W JP2019001622 W JP 2019001622W WO 2020152735 A1 WO2020152735 A1 WO 2020152735A1
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WO
WIPO (PCT)
Prior art keywords
pair
circuit board
pressing plate
plate
guide rail
Prior art date
Application number
PCT/JP2019/001622
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English (en)
Japanese (ja)
Inventor
貴規 ▲高▼木
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2019/001622 priority Critical patent/WO2020152735A1/fr
Priority to JP2020567671A priority patent/JP7133041B2/ja
Publication of WO2020152735A1 publication Critical patent/WO2020152735A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a transfer device that transfers a substrate by a pair of transfer lanes.
  • the substrate transferred to a predetermined position is held by a pair of transfer lanes as described in the following patent document. At this time, it is desired that the substrate be held in a state where the warp of the substrate is corrected.
  • JP 2007-311497 A Japanese Utility Model Publication No. 6-52197
  • An object of the present invention is to provide a transfer device that can appropriately correct the warp of the substrate.
  • the present specification includes a pair of transport lanes for transporting a substrate, and a plate for holding the substrate transported to the pair of transport lanes.
  • a transport device in which the plate connects the pair of transport lanes in a state where at least one of the lanes is movable.
  • a plate connects a pair of transport lanes, and at least one of the pair of transport lanes is in a movable state. Then, the substrate transported by the transport lane is pressed by the plate. Thereby, the warp of the substrate can be properly corrected.
  • FIG. 4 is a sectional view taken along the line BB in FIG. 3.
  • FIG. 4 is a sectional view taken along line CC of FIG. 3.
  • FIG. 6 is a plan view showing the substrate transport holding device with a distance between a pair of transport lanes changed.
  • FIG. 1 shows an electronic component mounting device 10.
  • the electronic component mounting apparatus 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12.
  • the direction in which the mounting machines 16 are arranged is referred to as the X direction
  • the horizontal direction perpendicular to the direction is referred to as the Y direction
  • the vertical direction perpendicular to the direction is referred to as the Z direction.
  • Each mounting machine 16 mainly includes a mounting machine main body 20, a pair of substrate transfer/holding devices 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 28, A control device (see FIG. 7) 30 is provided.
  • the mounting machine body 20 includes a frame 31 and a beam 32 mounted on the frame 31.
  • Each of the pair of substrate transport holding devices 22 has a conveyor device 50 and a substrate holding device 52, as shown in FIGS. 2 to 5.
  • FIG. 2 is a diagram showing the substrate transport holding device 22 from an obliquely upper perspective
  • FIG. 3 is a diagram showing the substrate transport holding device 22 from an upper perspective.
  • FIG. 4 is a diagram showing a perspective from the AA line of FIG. 3
  • FIG. 5 is a diagram showing a perspective from the BB line of FIG.
  • the conveyor device 50 is composed of a pair of transfer lanes 56 and 58, and each transfer lane 56 and 58 includes guide rails 60 and 62 and conveyor belts 66 and 68 provided on the guide rails 60 and 62. including.
  • the pair of guide rails 60, 62 are arranged in parallel to each other, and each guide rail 60, 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70.
  • the direction in which the guide rails 60 and 62 extend is called the X direction
  • the direction that is orthogonal to the X direction horizontally is called the Y direction
  • the Z direction the direction orthogonal to both the X direction and the Y direction.
  • two pulleys 74 and 76 are arranged on the side surfaces of the guide rails 60 and 62 with the Y direction as the axis center.
  • the two pulleys 74, 76 are arranged at both ends of each guide rail 60, 62.
  • the guide rail 60 and the guide rail 62 are arranged such that the surfaces on which the pulleys 74 and 76 are arranged face each other.
  • the conveyor belts 66 and 68 are wound around the pulleys 74 and 76 of the guide rails 60 and 62, and the conveyor belts 66 and 68 are rotated by driving an electromagnetic motor (see FIG. 7) 78.
  • the orbiting direction of the conveyor belts 66 and 68 is the clockwise direction in FIG.
  • the circuit board 80 is arranged from the side where the pulley 74 is arranged to the side where the pulley 76 is arranged. Is conveyed by conveyor belts 66 and 68.
  • the conveyor device 50 has a width changing device (see FIG. 7) 81 and can change the distance between the transport lane 56 and the transport lane 58.
  • the pair of support legs 70 that support the guide rails 62 of the transport lane 58 are slidable in the Y direction. Then, the pair of support legs 70 is moved to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 7) 82. At this time, the guide rails 62 supported by the pair of support legs 70 approach and separate from the guide rails 60 while being parallel to the guide rails 60. As a result, the distance between the transportation lane 56 and the transportation lane 58 is changed. In this way, by changing the distance between the transportation lane 56 and the transportation lane 58, it becomes possible to transport the circuit boards 80 of various sizes.
  • the substrate holding device 52 also includes a lifting table 86, a vacuum table 88, a table lifting mechanism 90, a clamp device 92, and a pair of holding plates 96.
  • the lifting table 86 has a generally rectangular shape, and is arranged below the guide rails 60 and 62 so as to extend between the pair of support legs 70 of each guide rail 60 and 62.
  • a vacuum table 88 is arranged on the upper surface of the lifting table 86.
  • the vacuum table 88 is generally in the shape of a box, and the dimension of the vacuum table 88 in the X direction is substantially the same as the dimension of the elevating table 86 in the X direction. It is smaller than the dimension of the lifting table 86 in the Y direction.
  • the vacuum table 88 is arranged on the elevating table 86 so as to be located between the pair of transport lanes 56 and 58 from the viewpoint from above. That is, the vacuum table 88 is arranged on the elevating table 86 so as not to overlap the pair of transport lanes 56 and 58 in the vertical direction.
  • the vacuum table 88 can be attached to and detached from the lifting table 86.
  • the upper surface of the vacuum base 88 is a flat surface, and a plurality of suction ports 97 are formed on the upper surface.
  • the plurality of suction ports 97 are connected to a suction pump (see FIG. 7) 98.
  • the vacuum base 88 sucks air from the plurality of suction ports 97 formed on the upper surface by the operation of the suction pump 98.
  • the elevating table 86 on which the vacuum table 88 is disposed is disposed on the upper surface of the support plate 72 via the table elevating mechanism 90, and the table elevating mechanism 90 includes an electromagnetic motor (see FIG. 7) 99.
  • the elevating table 86 is moved up and down together with the vacuum table 88 by driving.
  • the clamp device 92 also has a pair of clamp bars 100 and a pair of clamp plates 102.
  • the clamp bar 100 has a generally plate shape, and the length dimension of the clamp bar 100 is shorter than the length dimension of the vacuum base 88 in the X direction.
  • Each of the pair of clamp bars 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to be located between both ends of the vacuum table 88 in the X direction.
  • the clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to extend above the conveyor belts 66 and 68 arranged on the guide rails 60 and 62.
  • the clamp plate 102 has a generally rectangular plate shape, and the length dimension of the clamp plate 102 in the longitudinal direction is substantially the same as the length dimension of the clamp bar 100.
  • the clamp plate 102 extends in the same direction as the clamp bar 100 below the clamp bar 100 that extends above the conveyor belts 66 and 68, and vertically slides by the guide rails 60 and 62 in an upright state. Held possible. That is, as shown in FIG. 5, a holder 108 is arranged on the side surface of the guide rails 60 and 62 on the side where the conveyor belts 66 and 68 are arranged. Then, with the side surfaces of the guide rails 60 and 62 and the side surface of the clamp plate 102 facing each other, the clamp plate 102 is held by the holder 108 so as to be slidable in the vertical direction below the clamp bar 100.
  • the clamp plate 102 which is held slidably in the vertical direction by the guide rails 60 and 62, faces the side surface of the vacuum base 88. Then, when the clamp plate 102 slides to the lowermost position, the lower end of the clamp plate 102 is higher than the upper surface of the lifting table 86 in a state where the lifting table 86 on which the vacuum base 88 is disposed is not lifted. It is located above. Further, when the clamp plate 102 slides downward, the upper end of the clamp plate 102 is located below the upper surface of the conveyor belt 66.
  • each of the pair of pressing plates 96 has an elongated plate shape and is bridged over the pair of guide rails 60 and 62 in a posture extending in a direction orthogonal to the guide rails 60 and 62.
  • Each of the pair of pressing plates 96 is attached to the guide rail 62 via the connecting mechanism 110 at one end and is attached to the guide rail 60 via the connecting mechanism 112 at the other end.
  • an elongated hole 116 is formed at the end of the pressing plate 96 on the guide rail 62 side along the extending direction of the pressing plate 96.
  • a screw hole (see FIG. 6) 118 is formed at a position displaced from the end of the clamp bar 100 fixed to the upper surface of the guide rail 62.
  • the inside of the elongated hole 116 has a stepped shape and is continuous from the large diameter portion 120 opening to the upper surface of the pressing plate 96 and the lower end of the large diameter portion 120, and is pressed. It is divided into a small-diameter portion 122 that opens on the lower surface of the plate 96.
  • FIG. 6 is shown from the viewpoint of the CC line in FIG.
  • the connecting mechanism 110 has a bolt 124, and an annular collar 128 is externally fitted to the screw portion 126 of the bolt 124.
  • the outer diameter of the collar 128 is smaller than the inner diameter of the small diameter portion 122 of the long hole 116, but the outer diameter of the head portion 130 of the bolt 124 is larger than the inner diameter of the small diameter portion 122 of the long hole 116.
  • the outer diameter of the head portion 130 of the bolt 124 is smaller than the inner diameter of the large diameter portion 120 of the elongated hole 116.
  • the height of the collar 128 is longer than the height of the small diameter portion 122.
  • the bolts 124 are fastened to the screw holes 118 formed on the upper surface of the guide rail 62 via the elongated holes 116 of the pressing plate 96.
  • the pressing plate 96 is attached to the guide rail 62 by the bolt 124 in the coupling mechanism 110 in a state where there is looseness in the radial direction and the axial direction of the bolt 124, that is, a state where there is a gap.
  • the clearance in the radial direction of the bolt 124 that is, the clearance in the left-right direction corresponds to a value obtained by subtracting the outer diameter of the collar 128 from the inner diameter of the small diameter portion 122 of the elongated hole 116.
  • the gap in the axial direction of the bolt 124 that is, the gap in the up-down direction corresponds to the value obtained by subtracting the height dimension of the small diameter portion 122 from the height dimension of the collar 128.
  • the connecting mechanism 110 has a ball plunger 136, and an insertion hole 138 for inserting the ball plunger 136 is formed on the upper surface of the guide rail 62.
  • the insertion hole 138 is formed next to the screw hole 118, and the formation position of the insertion hole 138 is covered by a holding plate 96 attached to the guide rail 62.
  • the ball plunger 136 is fixedly inserted into the insertion hole 138 with the ball 140 protruding from the upper surface of the guide rail 62.
  • the amount of projection of the ball 140 from the upper surface of the guide rail 62 is slightly larger than the vertical gap of the pressing plate 96.
  • the edge of the connecting mechanism 110 on the side where the ball plunger 136 is disposed is directed upward by the elastic force of the ball plunger 136. Is being urged. Therefore, in the connecting mechanism 110, the pressing plate 96 is inclined so as to descend from the edge portion on the side on which the ball plunger 136 is disposed toward the edge portion on the side on which the ball plunger 136 is not disposed. There is.
  • the connecting mechanism 112 for attaching each of the pair of pressing plates 96 to the guide rail 60 has substantially the same structure as the connecting mechanism 110. Therefore, in the description of the connecting mechanism 112, the components of the connecting mechanism 110, that is, the reference numerals of the bolt 124, the ball plunger 136, and the like are used, and the description will be simplified.
  • a circular hole, that is, a round hole 150 is formed at the end of the pressing plate 96 on the guide rail 60 side.
  • a screw hole 152 is formed at a position displaced from the end of the clamp bar 100 fixed to the upper surface in a direction away from the end.
  • the bolt 124 having the collar 128 fitted on the screw portion 126 is fastened to the screw hole 152 formed on the upper surface of the guide rail 60 via the round hole 150 of the pressing plate 96.
  • the pressing plate 96 is attached to the guide rail 60 by the bolts 124 in the connecting mechanism 112 with a gap in the radial direction and the axial direction of the bolt 124.
  • the ball plunger 136 is arranged at the same position as the connecting mechanism 110.
  • the pressing plate 96 is inclined so as to descend from the edge portion on the side where the ball plunger 136 is disposed to the edge portion on the side where the ball plunger 136 is not disposed. ing.
  • each of the pair of pressing plates 96 is attached to the guide rail 62 via the connecting mechanism 110 at one end in a posture extending in the direction orthogonal to the guide rails 60 and 62, and the other end is provided.
  • the guide rail 60 is attached via the connecting mechanism 112.
  • each of the pair of holding plates 96 has the pair of guide rails 60, 62 in the state of being bridged over the pair of guide rails 60, 62 via the connecting mechanisms 110, 112 at both ends. It is connected.
  • the pair of pressing plates 96 are arranged so as to sandwich the clamp bar 100 fixed to the upper surfaces of the guide rails 60 and 62.
  • the distance between the pair of holding plates 96 that is, the distance between the pair of holding plates 96 in the X direction is longer than the length dimension of the clamp bar 100.
  • the distance between the pair of pressing plates 96 in the X direction is shorter than the length dimension of the vacuum base 88 in the X direction. Therefore, the pair of pressing plates 96 are located above both edges in the X direction of the vacuum base 88 arranged between the pair of guide rails 60 and 62.
  • each of the pair of pressing plates 96 is inclined so as to descend from the edge portion on the side on which the ball plunger 136 is disposed toward the edge portion on the side on which the ball plunger 136 is not disposed. .. That is, the pressing plate 96 is inclined in the X direction so as to descend toward the center of the substrate transport holding device 22.
  • the lower surface of the edge of the inclined pressing plate 96 on the side where the ball plunger 136 is disposed is located at substantially the same height as the lower surface of the clamp bar 100.
  • the lower surface of the edge of the pressing plate 96 in the inclined state on the side where the ball plunger 136 is not arranged is located slightly below the lower surface of the clamp bar 100.
  • the moving device 24 is an XY robot type moving device.
  • the moving device 24 includes an electromagnetic motor (see FIG. 7) 162 that slides the slider 160 in the X direction and an electromagnetic motor (see FIG. 7) 164 that slides the slider 160 in the Y direction.
  • the mounting head 26 is attached to the slider 160, and the mounting head 26 is moved to an arbitrary position on the frame 31 by the operation of the two electromagnetic motors 162 and 164.
  • the mounting head 26 mounts electronic components on the circuit board 80.
  • the mounting head 26 has a suction nozzle 170 provided on the lower end surface.
  • the suction nozzle 170 communicates with the positive/negative pressure supply device (see FIG. 7) 172 via the negative pressure air and positive pressure air passages.
  • the suction nozzle 170 sucks and holds an electronic component by negative pressure, and separates the held electronic component by positive pressure.
  • the mounting head 26 has a nozzle lifting device (see FIG. 7) 174 for lifting the suction nozzle 170.
  • the mounting head 26 changes the vertical position of the electronic component held by the nozzle lifting device 174.
  • the supply device 28 is a feeder-type supply device, and is arranged at the front end of the frame 31.
  • the supply device 28 has a tape feeder 180.
  • the tape feeder 180 accommodates the taped parts in a wound state.
  • the tape component is a taped electronic component.
  • the tape feeder 180 feeds the tape-formed component by the feeding device (see FIG. 7) 182.
  • the feeder-type supply device 28 supplies the electronic component at the supply position by feeding the tape-formed component.
  • the control device 30 has a controller 190 and a plurality of drive circuits 192.
  • the plurality of drive circuits 192 are connected to the electromagnetic motors 78, 82, 99, 162, 164, the positive/negative pressure supply device 172, the nozzle elevating device 174, and the delivery device 182.
  • the controller 190 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 192. As a result, the operations of the substrate transport holding device 22, the moving device 24, etc. are controlled by the controller 190.
  • the electronic component mounting apparatus 10 is capable of mounting the circuit board 80 held by the board transfer and holding apparatus 22 by the mounting head 26.
  • the circuit board 80 is carried into the electronic component mounting apparatus 10, and the conveyor device 50 conveys the circuit board 80 to the work position according to a command from the controller 190.
  • both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 that is, both edges extending in the transport direction (hereinafter, “both in the transport direction”). (Described as “edge”) is located between the clamp bar 100 and the clamp plate 102 in the vertical direction, as shown in FIG.
  • both edges of the circuit board 80 other than both edges in the transport direction that is, both edges extending in a direction orthogonal to the transport direction (hereinafter, referred to as “both edges orthogonal to the transport direction”). (Described) is located below the pair of holding plates 96.
  • the lifting/lowering table 86 is lifted by the operation of the table lifting/lowering mechanism 90.
  • the lower end of the clamp plate 102 contacts the upper surface of the elevating table 86, and the clamp plate 102 also rises as the elevating table 86 rises.
  • the upper end of the clamp plate 102 contacts the lower surface of the circuit board 80 supported by the conveyor belts 66 and 68.
  • the height dimension of the vacuum table 88 arranged on the upper surface of the lifting table 86 is the same as the vertical dimension of the clamp plate 102.
  • the upper end of the clamp plate 102 comes into contact with the lower surface of the circuit board 80 supported by the conveyor belts 66 and 68
  • the upper surface of the vacuum table 88 also comes into contact with the lower surface of the circuit board 80.
  • the elevating table 86 rises
  • the circuit board 80 supported by the conveyor belts 66 and 68 is lifted from the conveyor belts 66 and 68 by the clamp plate 102 and the vacuum table 88 and rises.
  • the dimension of the circuit board 80 in the X direction is made slightly smaller than the dimension of the vacuum table 88 in the X direction
  • the dimension of the circuit board 80 in the Y direction is made somewhat smaller than the dimension of the vacuum table 88 in the Y direction. .. Therefore, the circuit board 80 is supported by the vacuum table 88 at portions other than both edges in the transport direction, and lifted while being supported by the clamp plate 102 at both edges in the transport direction.
  • the table elevating mechanism 90 operates until the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, and the circuit board 80 is lifted by the clamp plate 102 and the vacuum table 88. ..
  • the circuit board 80 is sandwiched between the clamp bar 100 and the clamp plate 102 at both edges in the transport direction while being supported from the lower surface by the vacuum base 88 at portions other than the both edges in the transport direction.
  • the circuit board 80 is pressed by the pair of pressing plates 96 on both edges of the direction orthogonal to the transport direction.
  • both edges of the circuit board 80 conveyed to the working position in the direction perpendicular to the conveyance direction are located below the pair of pressing plates 96.
  • the lower surface of the edge of the pressing plate 96 in the inclined state on the side where the ball plunger 136 is not arranged is located slightly below the lower surface of the clamp bar 100. Therefore, as the circuit board 80 rises, the ball plungers 136 of the pressing plate 96 are arranged at both edges in the conveyance direction before the circuit board 80 contacts the clamp bar 100 at both edges in the conveyance direction. Touch the underside of the edge that is not on. Further, the pressing plate 96 is biased upward by the elastic force of the ball plunger 136 and is inclined. Therefore, when the circuit board 80 further rises, the pressing plate 96 swings against the elastic force of the ball plunger 136, and the inclination angle of the pressing plate 96 becomes smaller.
  • the circuit board 80 rises to the position where the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, but the lower surface of the clamp bar 100 has the ball plunger 136 of the pressing plate 96 in the inclined state.
  • the height is substantially the same as the lower surface of the edge portion on the side where is disposed. Therefore, when the circuit board 80 rises to the position where the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, the inclination of the pressing plate 96 is almost eliminated and becomes parallel to the circuit board 80, as shown in FIG. Become.
  • the circuit board 80 is pressed by the elastic force of the ball plunger 136 and the own weight of the pair of pressing plates 96 by the pair of pressing plates 96 at both edges orthogonal to the transport direction. That is, the circuit board 80 is sandwiched between the pressing plate 96 and the vacuum base 88 on both edges of the direction perpendicular to the transport direction.
  • the circuit board 80 is clamped by the clamp bar 100 and the clamp plate 102 at both edges in the carrying direction, and is clamped by the pressing plate 96 and the vacuum base 88 at both edges in the carrying direction. That is, the circuit board 80 is fixedly held by the board holding device 52 at all four edges. Then, when the circuit board 80 is fixedly held by the board holding device 52, air is sucked from the plurality of suction ports 97 in the vacuum table 88 by the operation of the suction pump 98. As a result, the circuit board 80 comes into close contact with the vacuum table 88.
  • the taped parts are sent out and the electronic parts are supplied at the supply position.
  • the mounting head 26 moves above the supply position of the electronic component, and the suction nozzle 170 sucks and holds the electronic component.
  • the mounting head 26 moves above the circuit board 80 and mounts the held electronic component on the circuit board 80.
  • the circuit board 80 conveyed to the work position is clamped by the board holding device 52, and the mounting work of the electronic component is performed on the circuit board 80 in the clamped state. It Further, in the board holding device 52, the circuit board 80 is pressed against the vacuum base 88 by the pressing plates 96 at both edges in the direction perpendicular to the carrying direction, so that the circuit board 80 appropriately adheres to the vacuum base 88 without air leakage. As a result, even with a thin circuit board 80 or the like, it is possible to properly eliminate warpage of the circuit board 80 and ensure proper mounting work. In particular, since the circuit board 80 is pressed by the plate-shaped pressing plate 96, the circuit board 80 can be preferably brought into close contact with the vacuum table 88.
  • the pressing plate 96 is attached to the guide rails 60 and 62 with a gap, and the gap is utilized to urge the elastic force of the ball plunger 136.
  • the circuit board 80 is pressed by the pressing plate 96 by the elastic force of the ball plunger 136. Thereby, even if the thickness of the circuit board 80 is different, the circuit board 80 can be pressed with a substantially uniform force.
  • the guide rail 60 is slidable in the direction of approaching/separating from the guide rail 62, and the distance between the transfer lane 56 and the transfer lane 58 is changed.
  • the size of the circuit board 80 to be transported can be changed.
  • the distance between the transportation lane 56 and the transportation lane 58 can be easily changed.
  • the pressing plate 96 is attached to the pair of guide rails 60 and 62 at both ends via the connecting mechanism 112, the pressing plate 96 has both ends through the round holes 150. Bolted to the pair of guide rails 60 and 62.
  • the pressing plate 96 is removed, and a pressing plate having a different length from the pressing plate 96 is attached to the pair of pressing plates 96. It is necessary to attach the bolts or to reattach the bolts when the pressing plate 96 is changed.
  • the pressing plate 96 is attached to the guide rail 60 at one end via the connecting mechanism 112, and is attached to the guide rail 62 at the other end via the connecting mechanism 110. ing. That is, the pressing plate 96 is bolted to the guide rail 60 through the round hole 150 at one end, but is bolted to the guide rail 62 through the elongated hole 116 at the other end. Therefore, for example, when the work of mounting the circuit board of the small size is performed after the work of mounting the circuit board of the large size, as shown in FIG. 10, the guide rail 62 is slid in the direction of approaching the guide rail 60. Then, the bolt 124 fastened to the guide rail 62 moves inside the elongated hole 116.
  • the distance between the transportation lane 56 and the transportation lane 58 can be easily changed without removing the pressing plate 96.
  • the bolts 124 are fastened with a gap through the elongated holes 116, the guide rails 62 can be slid without loosening the bolts 124. Therefore, the distance between the transportation lane 56 and the transportation lane 58 can be easily changed without using a tool or the like.
  • the pressing plate 96 is attached to the guide rail 62 while being in contact with the ball 140 of the ball plunger 136, the sliding resistance between the pressing plate 96 and the guide rail 62 is very small. This makes it possible to change the distance between the transportation lane 56 and the transportation lane 58 more easily without the pressing plate 96 rattling.
  • the substrate transfer/holding device 22 is an example of the transfer device.
  • the transport lanes 56 and 58 are examples of the transport lane.
  • the circuit board 80 is an example of a board.
  • the pressing plate 96 is an example of a plate.
  • the ball plunger 136 is an example of an elastic member.
  • the present invention is not limited to the above-described embodiments, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art.
  • the pressing plate 96 is bolted to the guide rail 62 through the elongated hole 116 so that the guide rail 62 can move in the extending direction of the pressing plate 96.
  • the guide rail 62 may be movable by various structures.
  • the guide rail 62 may be attached so as to be slidable in the extending direction of the holding plate 96, or the guide rail 62 may be attached so as to be movable along the extending direction of the holding plate 96.
  • the holding plate 96 may be formed with a guide groove, an engaging portion, or the like, and even if the guide groove or the like is not formed, a member for sandwiching the holding plate 96 is provided. It may be provided on the guide rail 62.
  • the transport lanes 56 and 58 using the conveyor belts 66 and 68 are adopted, but if the circuit board 80 can be transported, various transport lanes can be adopted. Good.
  • a transport lane having a structure in which a plurality of rollers are arranged side by side and the circuit board 80 is transported by the plurality of rollers may be adopted.
  • the pressing plate 96 is attached to the guide rails 62 through the elongated holes 116 only at one end, but is attached to the guide rails 60 and 62 through the elongated holes 116 at both ends. You may be asked. That is, the pressing plate 96 may be attached to the guide rails 60 and 62 at both ends via the connecting mechanism 110.
  • the vacuum table 88 is provided on the lifting table 86, but a different table from the vacuum table 88, for example, a backup pin may be provided. In such a case, the circuit board 80 is pressed by the pressing plate 96 toward the backup pin.
  • the ball plunger 136 is used as the elastic member, but various elastic members such as springs and rubbers can be used as the elastic member. Further, it is not essential to attach the pressing plate 96 to the guide rail 62 via the elastic member, and the pressing plate 96 may be attached to the guide rail 62 without using the elastic member.
  • both ends of the pressing plate 96 are attached to the pair of guide rails 60 and 62 via the elastic members with a gap, but only one end of the pressing plate 96 is It may be attached to one of the guide rails 60 and 62 via an elastic member with a gap. In such a case, one end portion of the pressing plate 96 is attached to the slidably arranged guide rail 62 via an elastic member with a gap.
  • one end of the pressing plate 96 is fixedly fastened with bolts in the vertical direction and in the longitudinal direction without a gap, and the other end is similar to that of the coupling mechanism 110 side of the present embodiment. In some cases, the bolts are slidably fastened in the vertical direction and with a gap in the longitudinal direction.
  • Substrate transfer holding device (transfer device) 56: Transfer lane 58: Transfer lane 80: Circuit board (board) 96: Holding plate (plate) 136: Ball plunger (elastic member)

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Ce dispositif de transport comporte : une paire de voies de transport pour transporter un substrat ; et une plaque pour presser le substrat transporté sur la paire de voies de transport, la plaque reliant la paire de voies de transport tandis qu'au moins l'une des deux voies de transport est dans un état mobile.
PCT/JP2019/001622 2019-01-21 2019-01-21 Dispositif de transport WO2020152735A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/001622 WO2020152735A1 (fr) 2019-01-21 2019-01-21 Dispositif de transport
JP2020567671A JP7133041B2 (ja) 2019-01-21 2019-01-21 搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/001622 WO2020152735A1 (fr) 2019-01-21 2019-01-21 Dispositif de transport

Publications (1)

Publication Number Publication Date
WO2020152735A1 true WO2020152735A1 (fr) 2020-07-30

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PCT/JP2019/001622 WO2020152735A1 (fr) 2019-01-21 2019-01-21 Dispositif de transport

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JP (1) JP7133041B2 (fr)
WO (1) WO2020152735A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61140599U (fr) * 1985-02-21 1986-08-30
JPS6343497U (fr) * 1986-09-05 1988-03-23
JPH02102600A (ja) * 1988-10-11 1990-04-16 Sanyo Electric Co Ltd 基板支持機構
US20020005336A1 (en) * 1998-06-15 2002-01-17 Johannes Rehm Adjusting unit
JP2003078287A (ja) * 2001-09-05 2003-03-14 Matsushita Electric Ind Co Ltd 部品実装機の基板搬送方法及びその基板搬送装置
JP2014011247A (ja) * 2012-06-28 2014-01-20 Hitachi High-Tech Instruments Co Ltd 部品実装装置
US20150271962A1 (en) * 2014-03-22 2015-09-24 Quik-Tool Llc Circuit board suction assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61140599U (fr) * 1985-02-21 1986-08-30
JPS6343497U (fr) * 1986-09-05 1988-03-23
JPH02102600A (ja) * 1988-10-11 1990-04-16 Sanyo Electric Co Ltd 基板支持機構
US20020005336A1 (en) * 1998-06-15 2002-01-17 Johannes Rehm Adjusting unit
JP2003078287A (ja) * 2001-09-05 2003-03-14 Matsushita Electric Ind Co Ltd 部品実装機の基板搬送方法及びその基板搬送装置
JP2014011247A (ja) * 2012-06-28 2014-01-20 Hitachi High-Tech Instruments Co Ltd 部品実装装置
US20150271962A1 (en) * 2014-03-22 2015-09-24 Quik-Tool Llc Circuit board suction assembly

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