WO2020152735A1 - Transporting device - Google Patents

Transporting device Download PDF

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Publication number
WO2020152735A1
WO2020152735A1 PCT/JP2019/001622 JP2019001622W WO2020152735A1 WO 2020152735 A1 WO2020152735 A1 WO 2020152735A1 JP 2019001622 W JP2019001622 W JP 2019001622W WO 2020152735 A1 WO2020152735 A1 WO 2020152735A1
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WO
WIPO (PCT)
Prior art keywords
pair
circuit board
pressing plate
plate
guide rail
Prior art date
Application number
PCT/JP2019/001622
Other languages
French (fr)
Japanese (ja)
Inventor
貴規 ▲高▼木
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2020567671A priority Critical patent/JP7133041B2/en
Priority to PCT/JP2019/001622 priority patent/WO2020152735A1/en
Publication of WO2020152735A1 publication Critical patent/WO2020152735A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a transfer device that transfers a substrate by a pair of transfer lanes.
  • the substrate transferred to a predetermined position is held by a pair of transfer lanes as described in the following patent document. At this time, it is desired that the substrate be held in a state where the warp of the substrate is corrected.
  • JP 2007-311497 A Japanese Utility Model Publication No. 6-52197
  • An object of the present invention is to provide a transfer device that can appropriately correct the warp of the substrate.
  • the present specification includes a pair of transport lanes for transporting a substrate, and a plate for holding the substrate transported to the pair of transport lanes.
  • a transport device in which the plate connects the pair of transport lanes in a state where at least one of the lanes is movable.
  • a plate connects a pair of transport lanes, and at least one of the pair of transport lanes is in a movable state. Then, the substrate transported by the transport lane is pressed by the plate. Thereby, the warp of the substrate can be properly corrected.
  • FIG. 4 is a sectional view taken along the line BB in FIG. 3.
  • FIG. 4 is a sectional view taken along line CC of FIG. 3.
  • FIG. 6 is a plan view showing the substrate transport holding device with a distance between a pair of transport lanes changed.
  • FIG. 1 shows an electronic component mounting device 10.
  • the electronic component mounting apparatus 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12.
  • the direction in which the mounting machines 16 are arranged is referred to as the X direction
  • the horizontal direction perpendicular to the direction is referred to as the Y direction
  • the vertical direction perpendicular to the direction is referred to as the Z direction.
  • Each mounting machine 16 mainly includes a mounting machine main body 20, a pair of substrate transfer/holding devices 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 28, A control device (see FIG. 7) 30 is provided.
  • the mounting machine body 20 includes a frame 31 and a beam 32 mounted on the frame 31.
  • Each of the pair of substrate transport holding devices 22 has a conveyor device 50 and a substrate holding device 52, as shown in FIGS. 2 to 5.
  • FIG. 2 is a diagram showing the substrate transport holding device 22 from an obliquely upper perspective
  • FIG. 3 is a diagram showing the substrate transport holding device 22 from an upper perspective.
  • FIG. 4 is a diagram showing a perspective from the AA line of FIG. 3
  • FIG. 5 is a diagram showing a perspective from the BB line of FIG.
  • the conveyor device 50 is composed of a pair of transfer lanes 56 and 58, and each transfer lane 56 and 58 includes guide rails 60 and 62 and conveyor belts 66 and 68 provided on the guide rails 60 and 62. including.
  • the pair of guide rails 60, 62 are arranged in parallel to each other, and each guide rail 60, 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70.
  • the direction in which the guide rails 60 and 62 extend is called the X direction
  • the direction that is orthogonal to the X direction horizontally is called the Y direction
  • the Z direction the direction orthogonal to both the X direction and the Y direction.
  • two pulleys 74 and 76 are arranged on the side surfaces of the guide rails 60 and 62 with the Y direction as the axis center.
  • the two pulleys 74, 76 are arranged at both ends of each guide rail 60, 62.
  • the guide rail 60 and the guide rail 62 are arranged such that the surfaces on which the pulleys 74 and 76 are arranged face each other.
  • the conveyor belts 66 and 68 are wound around the pulleys 74 and 76 of the guide rails 60 and 62, and the conveyor belts 66 and 68 are rotated by driving an electromagnetic motor (see FIG. 7) 78.
  • the orbiting direction of the conveyor belts 66 and 68 is the clockwise direction in FIG.
  • the circuit board 80 is arranged from the side where the pulley 74 is arranged to the side where the pulley 76 is arranged. Is conveyed by conveyor belts 66 and 68.
  • the conveyor device 50 has a width changing device (see FIG. 7) 81 and can change the distance between the transport lane 56 and the transport lane 58.
  • the pair of support legs 70 that support the guide rails 62 of the transport lane 58 are slidable in the Y direction. Then, the pair of support legs 70 is moved to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 7) 82. At this time, the guide rails 62 supported by the pair of support legs 70 approach and separate from the guide rails 60 while being parallel to the guide rails 60. As a result, the distance between the transportation lane 56 and the transportation lane 58 is changed. In this way, by changing the distance between the transportation lane 56 and the transportation lane 58, it becomes possible to transport the circuit boards 80 of various sizes.
  • the substrate holding device 52 also includes a lifting table 86, a vacuum table 88, a table lifting mechanism 90, a clamp device 92, and a pair of holding plates 96.
  • the lifting table 86 has a generally rectangular shape, and is arranged below the guide rails 60 and 62 so as to extend between the pair of support legs 70 of each guide rail 60 and 62.
  • a vacuum table 88 is arranged on the upper surface of the lifting table 86.
  • the vacuum table 88 is generally in the shape of a box, and the dimension of the vacuum table 88 in the X direction is substantially the same as the dimension of the elevating table 86 in the X direction. It is smaller than the dimension of the lifting table 86 in the Y direction.
  • the vacuum table 88 is arranged on the elevating table 86 so as to be located between the pair of transport lanes 56 and 58 from the viewpoint from above. That is, the vacuum table 88 is arranged on the elevating table 86 so as not to overlap the pair of transport lanes 56 and 58 in the vertical direction.
  • the vacuum table 88 can be attached to and detached from the lifting table 86.
  • the upper surface of the vacuum base 88 is a flat surface, and a plurality of suction ports 97 are formed on the upper surface.
  • the plurality of suction ports 97 are connected to a suction pump (see FIG. 7) 98.
  • the vacuum base 88 sucks air from the plurality of suction ports 97 formed on the upper surface by the operation of the suction pump 98.
  • the elevating table 86 on which the vacuum table 88 is disposed is disposed on the upper surface of the support plate 72 via the table elevating mechanism 90, and the table elevating mechanism 90 includes an electromagnetic motor (see FIG. 7) 99.
  • the elevating table 86 is moved up and down together with the vacuum table 88 by driving.
  • the clamp device 92 also has a pair of clamp bars 100 and a pair of clamp plates 102.
  • the clamp bar 100 has a generally plate shape, and the length dimension of the clamp bar 100 is shorter than the length dimension of the vacuum base 88 in the X direction.
  • Each of the pair of clamp bars 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to be located between both ends of the vacuum table 88 in the X direction.
  • the clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to extend above the conveyor belts 66 and 68 arranged on the guide rails 60 and 62.
  • the clamp plate 102 has a generally rectangular plate shape, and the length dimension of the clamp plate 102 in the longitudinal direction is substantially the same as the length dimension of the clamp bar 100.
  • the clamp plate 102 extends in the same direction as the clamp bar 100 below the clamp bar 100 that extends above the conveyor belts 66 and 68, and vertically slides by the guide rails 60 and 62 in an upright state. Held possible. That is, as shown in FIG. 5, a holder 108 is arranged on the side surface of the guide rails 60 and 62 on the side where the conveyor belts 66 and 68 are arranged. Then, with the side surfaces of the guide rails 60 and 62 and the side surface of the clamp plate 102 facing each other, the clamp plate 102 is held by the holder 108 so as to be slidable in the vertical direction below the clamp bar 100.
  • the clamp plate 102 which is held slidably in the vertical direction by the guide rails 60 and 62, faces the side surface of the vacuum base 88. Then, when the clamp plate 102 slides to the lowermost position, the lower end of the clamp plate 102 is higher than the upper surface of the lifting table 86 in a state where the lifting table 86 on which the vacuum base 88 is disposed is not lifted. It is located above. Further, when the clamp plate 102 slides downward, the upper end of the clamp plate 102 is located below the upper surface of the conveyor belt 66.
  • each of the pair of pressing plates 96 has an elongated plate shape and is bridged over the pair of guide rails 60 and 62 in a posture extending in a direction orthogonal to the guide rails 60 and 62.
  • Each of the pair of pressing plates 96 is attached to the guide rail 62 via the connecting mechanism 110 at one end and is attached to the guide rail 60 via the connecting mechanism 112 at the other end.
  • an elongated hole 116 is formed at the end of the pressing plate 96 on the guide rail 62 side along the extending direction of the pressing plate 96.
  • a screw hole (see FIG. 6) 118 is formed at a position displaced from the end of the clamp bar 100 fixed to the upper surface of the guide rail 62.
  • the inside of the elongated hole 116 has a stepped shape and is continuous from the large diameter portion 120 opening to the upper surface of the pressing plate 96 and the lower end of the large diameter portion 120, and is pressed. It is divided into a small-diameter portion 122 that opens on the lower surface of the plate 96.
  • FIG. 6 is shown from the viewpoint of the CC line in FIG.
  • the connecting mechanism 110 has a bolt 124, and an annular collar 128 is externally fitted to the screw portion 126 of the bolt 124.
  • the outer diameter of the collar 128 is smaller than the inner diameter of the small diameter portion 122 of the long hole 116, but the outer diameter of the head portion 130 of the bolt 124 is larger than the inner diameter of the small diameter portion 122 of the long hole 116.
  • the outer diameter of the head portion 130 of the bolt 124 is smaller than the inner diameter of the large diameter portion 120 of the elongated hole 116.
  • the height of the collar 128 is longer than the height of the small diameter portion 122.
  • the bolts 124 are fastened to the screw holes 118 formed on the upper surface of the guide rail 62 via the elongated holes 116 of the pressing plate 96.
  • the pressing plate 96 is attached to the guide rail 62 by the bolt 124 in the coupling mechanism 110 in a state where there is looseness in the radial direction and the axial direction of the bolt 124, that is, a state where there is a gap.
  • the clearance in the radial direction of the bolt 124 that is, the clearance in the left-right direction corresponds to a value obtained by subtracting the outer diameter of the collar 128 from the inner diameter of the small diameter portion 122 of the elongated hole 116.
  • the gap in the axial direction of the bolt 124 that is, the gap in the up-down direction corresponds to the value obtained by subtracting the height dimension of the small diameter portion 122 from the height dimension of the collar 128.
  • the connecting mechanism 110 has a ball plunger 136, and an insertion hole 138 for inserting the ball plunger 136 is formed on the upper surface of the guide rail 62.
  • the insertion hole 138 is formed next to the screw hole 118, and the formation position of the insertion hole 138 is covered by a holding plate 96 attached to the guide rail 62.
  • the ball plunger 136 is fixedly inserted into the insertion hole 138 with the ball 140 protruding from the upper surface of the guide rail 62.
  • the amount of projection of the ball 140 from the upper surface of the guide rail 62 is slightly larger than the vertical gap of the pressing plate 96.
  • the edge of the connecting mechanism 110 on the side where the ball plunger 136 is disposed is directed upward by the elastic force of the ball plunger 136. Is being urged. Therefore, in the connecting mechanism 110, the pressing plate 96 is inclined so as to descend from the edge portion on the side on which the ball plunger 136 is disposed toward the edge portion on the side on which the ball plunger 136 is not disposed. There is.
  • the connecting mechanism 112 for attaching each of the pair of pressing plates 96 to the guide rail 60 has substantially the same structure as the connecting mechanism 110. Therefore, in the description of the connecting mechanism 112, the components of the connecting mechanism 110, that is, the reference numerals of the bolt 124, the ball plunger 136, and the like are used, and the description will be simplified.
  • a circular hole, that is, a round hole 150 is formed at the end of the pressing plate 96 on the guide rail 60 side.
  • a screw hole 152 is formed at a position displaced from the end of the clamp bar 100 fixed to the upper surface in a direction away from the end.
  • the bolt 124 having the collar 128 fitted on the screw portion 126 is fastened to the screw hole 152 formed on the upper surface of the guide rail 60 via the round hole 150 of the pressing plate 96.
  • the pressing plate 96 is attached to the guide rail 60 by the bolts 124 in the connecting mechanism 112 with a gap in the radial direction and the axial direction of the bolt 124.
  • the ball plunger 136 is arranged at the same position as the connecting mechanism 110.
  • the pressing plate 96 is inclined so as to descend from the edge portion on the side where the ball plunger 136 is disposed to the edge portion on the side where the ball plunger 136 is not disposed. ing.
  • each of the pair of pressing plates 96 is attached to the guide rail 62 via the connecting mechanism 110 at one end in a posture extending in the direction orthogonal to the guide rails 60 and 62, and the other end is provided.
  • the guide rail 60 is attached via the connecting mechanism 112.
  • each of the pair of holding plates 96 has the pair of guide rails 60, 62 in the state of being bridged over the pair of guide rails 60, 62 via the connecting mechanisms 110, 112 at both ends. It is connected.
  • the pair of pressing plates 96 are arranged so as to sandwich the clamp bar 100 fixed to the upper surfaces of the guide rails 60 and 62.
  • the distance between the pair of holding plates 96 that is, the distance between the pair of holding plates 96 in the X direction is longer than the length dimension of the clamp bar 100.
  • the distance between the pair of pressing plates 96 in the X direction is shorter than the length dimension of the vacuum base 88 in the X direction. Therefore, the pair of pressing plates 96 are located above both edges in the X direction of the vacuum base 88 arranged between the pair of guide rails 60 and 62.
  • each of the pair of pressing plates 96 is inclined so as to descend from the edge portion on the side on which the ball plunger 136 is disposed toward the edge portion on the side on which the ball plunger 136 is not disposed. .. That is, the pressing plate 96 is inclined in the X direction so as to descend toward the center of the substrate transport holding device 22.
  • the lower surface of the edge of the inclined pressing plate 96 on the side where the ball plunger 136 is disposed is located at substantially the same height as the lower surface of the clamp bar 100.
  • the lower surface of the edge of the pressing plate 96 in the inclined state on the side where the ball plunger 136 is not arranged is located slightly below the lower surface of the clamp bar 100.
  • the moving device 24 is an XY robot type moving device.
  • the moving device 24 includes an electromagnetic motor (see FIG. 7) 162 that slides the slider 160 in the X direction and an electromagnetic motor (see FIG. 7) 164 that slides the slider 160 in the Y direction.
  • the mounting head 26 is attached to the slider 160, and the mounting head 26 is moved to an arbitrary position on the frame 31 by the operation of the two electromagnetic motors 162 and 164.
  • the mounting head 26 mounts electronic components on the circuit board 80.
  • the mounting head 26 has a suction nozzle 170 provided on the lower end surface.
  • the suction nozzle 170 communicates with the positive/negative pressure supply device (see FIG. 7) 172 via the negative pressure air and positive pressure air passages.
  • the suction nozzle 170 sucks and holds an electronic component by negative pressure, and separates the held electronic component by positive pressure.
  • the mounting head 26 has a nozzle lifting device (see FIG. 7) 174 for lifting the suction nozzle 170.
  • the mounting head 26 changes the vertical position of the electronic component held by the nozzle lifting device 174.
  • the supply device 28 is a feeder-type supply device, and is arranged at the front end of the frame 31.
  • the supply device 28 has a tape feeder 180.
  • the tape feeder 180 accommodates the taped parts in a wound state.
  • the tape component is a taped electronic component.
  • the tape feeder 180 feeds the tape-formed component by the feeding device (see FIG. 7) 182.
  • the feeder-type supply device 28 supplies the electronic component at the supply position by feeding the tape-formed component.
  • the control device 30 has a controller 190 and a plurality of drive circuits 192.
  • the plurality of drive circuits 192 are connected to the electromagnetic motors 78, 82, 99, 162, 164, the positive/negative pressure supply device 172, the nozzle elevating device 174, and the delivery device 182.
  • the controller 190 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 192. As a result, the operations of the substrate transport holding device 22, the moving device 24, etc. are controlled by the controller 190.
  • the electronic component mounting apparatus 10 is capable of mounting the circuit board 80 held by the board transfer and holding apparatus 22 by the mounting head 26.
  • the circuit board 80 is carried into the electronic component mounting apparatus 10, and the conveyor device 50 conveys the circuit board 80 to the work position according to a command from the controller 190.
  • both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 that is, both edges extending in the transport direction (hereinafter, “both in the transport direction”). (Described as “edge”) is located between the clamp bar 100 and the clamp plate 102 in the vertical direction, as shown in FIG.
  • both edges of the circuit board 80 other than both edges in the transport direction that is, both edges extending in a direction orthogonal to the transport direction (hereinafter, referred to as “both edges orthogonal to the transport direction”). (Described) is located below the pair of holding plates 96.
  • the lifting/lowering table 86 is lifted by the operation of the table lifting/lowering mechanism 90.
  • the lower end of the clamp plate 102 contacts the upper surface of the elevating table 86, and the clamp plate 102 also rises as the elevating table 86 rises.
  • the upper end of the clamp plate 102 contacts the lower surface of the circuit board 80 supported by the conveyor belts 66 and 68.
  • the height dimension of the vacuum table 88 arranged on the upper surface of the lifting table 86 is the same as the vertical dimension of the clamp plate 102.
  • the upper end of the clamp plate 102 comes into contact with the lower surface of the circuit board 80 supported by the conveyor belts 66 and 68
  • the upper surface of the vacuum table 88 also comes into contact with the lower surface of the circuit board 80.
  • the elevating table 86 rises
  • the circuit board 80 supported by the conveyor belts 66 and 68 is lifted from the conveyor belts 66 and 68 by the clamp plate 102 and the vacuum table 88 and rises.
  • the dimension of the circuit board 80 in the X direction is made slightly smaller than the dimension of the vacuum table 88 in the X direction
  • the dimension of the circuit board 80 in the Y direction is made somewhat smaller than the dimension of the vacuum table 88 in the Y direction. .. Therefore, the circuit board 80 is supported by the vacuum table 88 at portions other than both edges in the transport direction, and lifted while being supported by the clamp plate 102 at both edges in the transport direction.
  • the table elevating mechanism 90 operates until the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, and the circuit board 80 is lifted by the clamp plate 102 and the vacuum table 88. ..
  • the circuit board 80 is sandwiched between the clamp bar 100 and the clamp plate 102 at both edges in the transport direction while being supported from the lower surface by the vacuum base 88 at portions other than the both edges in the transport direction.
  • the circuit board 80 is pressed by the pair of pressing plates 96 on both edges of the direction orthogonal to the transport direction.
  • both edges of the circuit board 80 conveyed to the working position in the direction perpendicular to the conveyance direction are located below the pair of pressing plates 96.
  • the lower surface of the edge of the pressing plate 96 in the inclined state on the side where the ball plunger 136 is not arranged is located slightly below the lower surface of the clamp bar 100. Therefore, as the circuit board 80 rises, the ball plungers 136 of the pressing plate 96 are arranged at both edges in the conveyance direction before the circuit board 80 contacts the clamp bar 100 at both edges in the conveyance direction. Touch the underside of the edge that is not on. Further, the pressing plate 96 is biased upward by the elastic force of the ball plunger 136 and is inclined. Therefore, when the circuit board 80 further rises, the pressing plate 96 swings against the elastic force of the ball plunger 136, and the inclination angle of the pressing plate 96 becomes smaller.
  • the circuit board 80 rises to the position where the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, but the lower surface of the clamp bar 100 has the ball plunger 136 of the pressing plate 96 in the inclined state.
  • the height is substantially the same as the lower surface of the edge portion on the side where is disposed. Therefore, when the circuit board 80 rises to the position where the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, the inclination of the pressing plate 96 is almost eliminated and becomes parallel to the circuit board 80, as shown in FIG. Become.
  • the circuit board 80 is pressed by the elastic force of the ball plunger 136 and the own weight of the pair of pressing plates 96 by the pair of pressing plates 96 at both edges orthogonal to the transport direction. That is, the circuit board 80 is sandwiched between the pressing plate 96 and the vacuum base 88 on both edges of the direction perpendicular to the transport direction.
  • the circuit board 80 is clamped by the clamp bar 100 and the clamp plate 102 at both edges in the carrying direction, and is clamped by the pressing plate 96 and the vacuum base 88 at both edges in the carrying direction. That is, the circuit board 80 is fixedly held by the board holding device 52 at all four edges. Then, when the circuit board 80 is fixedly held by the board holding device 52, air is sucked from the plurality of suction ports 97 in the vacuum table 88 by the operation of the suction pump 98. As a result, the circuit board 80 comes into close contact with the vacuum table 88.
  • the taped parts are sent out and the electronic parts are supplied at the supply position.
  • the mounting head 26 moves above the supply position of the electronic component, and the suction nozzle 170 sucks and holds the electronic component.
  • the mounting head 26 moves above the circuit board 80 and mounts the held electronic component on the circuit board 80.
  • the circuit board 80 conveyed to the work position is clamped by the board holding device 52, and the mounting work of the electronic component is performed on the circuit board 80 in the clamped state. It Further, in the board holding device 52, the circuit board 80 is pressed against the vacuum base 88 by the pressing plates 96 at both edges in the direction perpendicular to the carrying direction, so that the circuit board 80 appropriately adheres to the vacuum base 88 without air leakage. As a result, even with a thin circuit board 80 or the like, it is possible to properly eliminate warpage of the circuit board 80 and ensure proper mounting work. In particular, since the circuit board 80 is pressed by the plate-shaped pressing plate 96, the circuit board 80 can be preferably brought into close contact with the vacuum table 88.
  • the pressing plate 96 is attached to the guide rails 60 and 62 with a gap, and the gap is utilized to urge the elastic force of the ball plunger 136.
  • the circuit board 80 is pressed by the pressing plate 96 by the elastic force of the ball plunger 136. Thereby, even if the thickness of the circuit board 80 is different, the circuit board 80 can be pressed with a substantially uniform force.
  • the guide rail 60 is slidable in the direction of approaching/separating from the guide rail 62, and the distance between the transfer lane 56 and the transfer lane 58 is changed.
  • the size of the circuit board 80 to be transported can be changed.
  • the distance between the transportation lane 56 and the transportation lane 58 can be easily changed.
  • the pressing plate 96 is attached to the pair of guide rails 60 and 62 at both ends via the connecting mechanism 112, the pressing plate 96 has both ends through the round holes 150. Bolted to the pair of guide rails 60 and 62.
  • the pressing plate 96 is removed, and a pressing plate having a different length from the pressing plate 96 is attached to the pair of pressing plates 96. It is necessary to attach the bolts or to reattach the bolts when the pressing plate 96 is changed.
  • the pressing plate 96 is attached to the guide rail 60 at one end via the connecting mechanism 112, and is attached to the guide rail 62 at the other end via the connecting mechanism 110. ing. That is, the pressing plate 96 is bolted to the guide rail 60 through the round hole 150 at one end, but is bolted to the guide rail 62 through the elongated hole 116 at the other end. Therefore, for example, when the work of mounting the circuit board of the small size is performed after the work of mounting the circuit board of the large size, as shown in FIG. 10, the guide rail 62 is slid in the direction of approaching the guide rail 60. Then, the bolt 124 fastened to the guide rail 62 moves inside the elongated hole 116.
  • the distance between the transportation lane 56 and the transportation lane 58 can be easily changed without removing the pressing plate 96.
  • the bolts 124 are fastened with a gap through the elongated holes 116, the guide rails 62 can be slid without loosening the bolts 124. Therefore, the distance between the transportation lane 56 and the transportation lane 58 can be easily changed without using a tool or the like.
  • the pressing plate 96 is attached to the guide rail 62 while being in contact with the ball 140 of the ball plunger 136, the sliding resistance between the pressing plate 96 and the guide rail 62 is very small. This makes it possible to change the distance between the transportation lane 56 and the transportation lane 58 more easily without the pressing plate 96 rattling.
  • the substrate transfer/holding device 22 is an example of the transfer device.
  • the transport lanes 56 and 58 are examples of the transport lane.
  • the circuit board 80 is an example of a board.
  • the pressing plate 96 is an example of a plate.
  • the ball plunger 136 is an example of an elastic member.
  • the present invention is not limited to the above-described embodiments, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art.
  • the pressing plate 96 is bolted to the guide rail 62 through the elongated hole 116 so that the guide rail 62 can move in the extending direction of the pressing plate 96.
  • the guide rail 62 may be movable by various structures.
  • the guide rail 62 may be attached so as to be slidable in the extending direction of the holding plate 96, or the guide rail 62 may be attached so as to be movable along the extending direction of the holding plate 96.
  • the holding plate 96 may be formed with a guide groove, an engaging portion, or the like, and even if the guide groove or the like is not formed, a member for sandwiching the holding plate 96 is provided. It may be provided on the guide rail 62.
  • the transport lanes 56 and 58 using the conveyor belts 66 and 68 are adopted, but if the circuit board 80 can be transported, various transport lanes can be adopted. Good.
  • a transport lane having a structure in which a plurality of rollers are arranged side by side and the circuit board 80 is transported by the plurality of rollers may be adopted.
  • the pressing plate 96 is attached to the guide rails 62 through the elongated holes 116 only at one end, but is attached to the guide rails 60 and 62 through the elongated holes 116 at both ends. You may be asked. That is, the pressing plate 96 may be attached to the guide rails 60 and 62 at both ends via the connecting mechanism 110.
  • the vacuum table 88 is provided on the lifting table 86, but a different table from the vacuum table 88, for example, a backup pin may be provided. In such a case, the circuit board 80 is pressed by the pressing plate 96 toward the backup pin.
  • the ball plunger 136 is used as the elastic member, but various elastic members such as springs and rubbers can be used as the elastic member. Further, it is not essential to attach the pressing plate 96 to the guide rail 62 via the elastic member, and the pressing plate 96 may be attached to the guide rail 62 without using the elastic member.
  • both ends of the pressing plate 96 are attached to the pair of guide rails 60 and 62 via the elastic members with a gap, but only one end of the pressing plate 96 is It may be attached to one of the guide rails 60 and 62 via an elastic member with a gap. In such a case, one end portion of the pressing plate 96 is attached to the slidably arranged guide rail 62 via an elastic member with a gap.
  • one end of the pressing plate 96 is fixedly fastened with bolts in the vertical direction and in the longitudinal direction without a gap, and the other end is similar to that of the coupling mechanism 110 side of the present embodiment. In some cases, the bolts are slidably fastened in the vertical direction and with a gap in the longitudinal direction.
  • Substrate transfer holding device (transfer device) 56: Transfer lane 58: Transfer lane 80: Circuit board (board) 96: Holding plate (plate) 136: Ball plunger (elastic member)

Abstract

This transporting device is provided with: a pair of transporting lanes for transporting a substrate; and a plate for pressing the substrate transported on the pair of transporting lanes, wherein while at least one among the pair of transporting lanes is in a movable state, the plate connects the pair of transporting lanes.

Description

搬送装置Transport device
　本発明は、１対の搬送レーンにより基板を搬送する搬送装置に関するものである。 The present invention relates to a transfer device that transfers a substrate by a pair of transfer lanes.
　１対の搬送レーンにより基板を搬送する搬送装置では、下記特許文献に記載されているように、１対の搬送レーンにより所定の位置まで搬送された基板が保持される。この際、基板の反りを矯正した状態で保持されることが望まれる。 In a transfer device that transfers a substrate by a pair of transfer lanes, the substrate transferred to a predetermined position is held by a pair of transfer lanes as described in the following patent document. At this time, it is desired that the substrate be held in a state where the warp of the substrate is corrected.
特開２００７－３１１４９７号公報JP 2007-311497 A 実開平６－５２１９７号公報Japanese Utility Model Publication No. 6-52197
　本発明の課題は、基板の反りを適切に矯正することが可能な搬送装置を提供することである。 An object of the present invention is to provide a transfer device that can appropriately correct the warp of the substrate.
　上記課題を解決するために、本明細書は、基板を搬送する１対の搬送レーンと、前記１対の搬送レーンに搬送された前記基板を押さえるためのプレートとを備え、前記１対の搬送レーンの少なくとも一方が移動可能な状態で、前記プレートが前記１対の搬送レーンを連結する搬送装置を開示する。 In order to solve the above problems, the present specification includes a pair of transport lanes for transporting a substrate, and a plate for holding the substrate transported to the pair of transport lanes. Disclosed is a transport device in which the plate connects the pair of transport lanes in a state where at least one of the lanes is movable.
　本開示によれば、プレートが、１対の搬送レーンを連結しており、それら１対の搬送レーンの少なくとも一方が移動可能な状態とされている。そして、搬送レーンにより搬送された基板が、そのプレートによって押さえられる。これにより、基板の反りを適切に矯正することができる。 According to the present disclosure, a plate connects a pair of transport lanes, and at least one of the pair of transport lanes is in a movable state. Then, the substrate transported by the transport lane is pressed by the plate. Thereby, the warp of the substrate can be properly corrected.
電子部品装着装置を示す斜視図である。It is a perspective view which shows an electronic component mounting apparatus. 基板搬送保持装置を示す斜視図である。It is a perspective view showing a substrate transportation holding device. 基板搬送保持装置を示す平面図である。It is a top view which shows a board|substrate conveyance holding device. 図３のＡＡ線における断面図である。It is sectional drawing in the AA line of FIG. 図３のＢＢ線における断面図である。FIG. 4 is a sectional view taken along the line BB in FIG. 3. 図３のＣＣ線における断面図である。FIG. 4 is a sectional view taken along line CC of FIG. 3. 制御装置を示すブロック図である。It is a block diagram which shows a control apparatus. 回路基板をクランプした状態のクランプ装置を示す図である。It is a figure which shows the clamp apparatus in the state which clamped the circuit board. 回路基板をクランプした状態の押さえプレートを示す図である。It is a figure which shows the pressing plate in the state which clamped the circuit board. 1対の搬送レーンの間の距離を変更した状態の基板搬送保持装置を示す平面図である。FIG. 6 is a plan view showing the substrate transport holding device with a distance between a pair of transport lanes changed.
　以下、本発明を実施するための形態として、本発明の実施例を、図を参照しつつ詳しく説明する。 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings as a mode for carrying out the present invention.
　図１に、電子部品装着装置１０を示す。電子部品装着装置１０は、１つのシステムベース１２と、そのシステムベース１２の上に並んで配設された２つの装着機１６とを有している。なお、以下の説明では、装着機１６の並ぶ方向をＸ方向と称し、その方向に直角な水平の方向をＹ方向と称し、その方向に直角な鉛直方向をＺ方向と称する。 FIG. 1 shows an electronic component mounting device 10. The electronic component mounting apparatus 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12. In the following description, the direction in which the mounting machines 16 are arranged is referred to as the X direction, the horizontal direction perpendicular to the direction is referred to as the Y direction, and the vertical direction perpendicular to the direction is referred to as the Z direction.
　各装着機１６は、主に、装着機本体２０、１対の基板搬送保持装置２２、装着ヘッド移動装置（以下、「移動装置」と略す場合がある）２４、装着ヘッド２６、供給装置２８、制御装置（図７参照）３０を備えている。装着機本体２０は、フレーム３１と、そのフレーム３１に上架されたビーム３２とによって構成されている。 Each mounting machine 16 mainly includes a mounting machine main body 20, a pair of substrate transfer/holding devices 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 28, A control device (see FIG. 7) 30 is provided. The mounting machine body 20 includes a frame 31 and a beam 32 mounted on the frame 31.
　１対の基板搬送保持装置２２の各々は、図２乃至図５に示すように、コンベア装置５０と、基板保持装置５２とを有している。図２は、基板搬送保持装置２２を斜め上方からの視点において示す図であり、図３は、基板搬送保持装置２２を上方からの視点において示す図である。また、図４は、図３のＡＡ線からの視点において示す図であり、図５は、図３のＢＢ線からの視点において示す図である。 Each of the pair of substrate transport holding devices 22 has a conveyor device 50 and a substrate holding device 52, as shown in FIGS. 2 to 5. FIG. 2 is a diagram showing the substrate transport holding device 22 from an obliquely upper perspective, and FIG. 3 is a diagram showing the substrate transport holding device 22 from an upper perspective. Further, FIG. 4 is a diagram showing a perspective from the AA line of FIG. 3, and FIG. 5 is a diagram showing a perspective from the BB line of FIG.
　コンベア装置５０は、１対の搬送レーン５６，５８により構成されており、各搬送レーン５６，５８は、ガイドレール６０，６２と、各ガイドレール６０，６２に設けられたコンベアベルト６６，６８とを含む。１対のガイドレール６０，６２は、互いに平行に配設されており、各ガイドレール６０，６２は、１対の支持脚７０を介して支持プレート７２の上面において支持されている。なお、ガイドレール６０，６２の延びる方向をＸ方向、そのＸ方向に水平に直行する方向をＹ方向、Ｘ方向及びＹ方向の両方に直交する方向をＺ方向と称する。 The conveyor device 50 is composed of a pair of transfer lanes 56 and 58, and each transfer lane 56 and 58 includes guide rails 60 and 62 and conveyor belts 66 and 68 provided on the guide rails 60 and 62. including. The pair of guide rails 60, 62 are arranged in parallel to each other, and each guide rail 60, 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70. The direction in which the guide rails 60 and 62 extend is called the X direction, the direction that is orthogonal to the X direction horizontally is called the Y direction, and the direction orthogonal to both the X direction and the Y direction is called the Z direction.
　また、各ガイドレール６０，６２の側面には２個のプーリ７４，７６がＹ方向を軸心として配設されている。それら２個のプーリ７４，７６は、各ガイドレール６０，６２の両端部に配設されている。なお、ガイドレール６０とガイドレール６２とは、互いのプーリ７４，７６の配設面が対向する状態で配設されている。そして、コンベアベルト６６，６８が、各ガイドレール６０，６２のプーリ７４，７６に巻き掛けられており、コンベアベルト６６，６８は、電磁モータ（図７参照）７８の駆動により周回する。 Also, two pulleys 74 and 76 are arranged on the side surfaces of the guide rails 60 and 62 with the Y direction as the axis center. The two pulleys 74, 76 are arranged at both ends of each guide rail 60, 62. The guide rail 60 and the guide rail 62 are arranged such that the surfaces on which the pulleys 74 and 76 are arranged face each other. The conveyor belts 66 and 68 are wound around the pulleys 74 and 76 of the guide rails 60 and 62, and the conveyor belts 66 and 68 are rotated by driving an electromagnetic motor (see FIG. 7) 78.
　なお、コンベアベルト６６，６８の周回方向は、図４での時計回りの方向とされている。これにより、コンベアベルト６６，６８の上に回路基板（図５参照）８０を載置することで、回路基板８０は、プーリ７４が配設されている側からプーリ７６が配設されている側に向かって、コンベアベルト６６，６８によって搬送される。 The orbiting direction of the conveyor belts 66 and 68 is the clockwise direction in FIG. As a result, by placing the circuit board (see FIG. 5) 80 on the conveyor belts 66, 68, the circuit board 80 is arranged from the side where the pulley 74 is arranged to the side where the pulley 76 is arranged. Is conveyed by conveyor belts 66 and 68.
　また、コンベア装置５０は、幅変更装置（図７参照）８１を有しており、搬送レーン５６と搬送レーン５８との間の距離を変更することが可能とされている。詳しくは、搬送レーン５８のガイドレール６２を支持する１対の支持脚７０は、Ｙ方向にスライド可能とされている。そして、それら１対の支持脚７０は、電磁モータ（図７参照）８２の駆動によりＹ方向の任意の位置に移動する。この際、それら１対の支持脚７０により支持されているガイドレール６２は、ガイドレール６０と平行な状態で、ガイドレール６０に対して接近・離間する。これにより、搬送レーン５６と搬送レーン５８との間の距離が変更される。このように、搬送レーン５６と搬送レーン５８との間の距離が変更されることで、種々のサイズの回路基板８０を搬送することが可能となる。 Further, the conveyor device 50 has a width changing device (see FIG. 7) 81 and can change the distance between the transport lane 56 and the transport lane 58. Specifically, the pair of support legs 70 that support the guide rails 62 of the transport lane 58 are slidable in the Y direction. Then, the pair of support legs 70 is moved to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 7) 82. At this time, the guide rails 62 supported by the pair of support legs 70 approach and separate from the guide rails 60 while being parallel to the guide rails 60. As a result, the distance between the transportation lane 56 and the transportation lane 58 is changed. In this way, by changing the distance between the transportation lane 56 and the transportation lane 58, it becomes possible to transport the circuit boards 80 of various sizes.
　また、基板保持装置５２は、昇降テーブル８６と、バキューム台８８と、テーブル昇降機構９０と、クランプ装置９２と、１対の押さえプレート９６とを有している。昇降テーブル８６は、概して矩形をなし、各ガイドレール６０，６２の１対の支持脚７０の間に延びだすように、ガイドレール６０，６２の下方に配置されている。また、昇降テーブル８６の上面に、バキューム台８８が配設されている。バキューム台８８は、概して箱形状をなしており、バキューム台８８のＸ方向の寸法は、昇降テーブル８６のＸ方向の寸法と略同じとされているが、バキューム台８８のＹ方向の寸法は、昇降テーブル８６のＹ方向の寸法より小さくされている。そして、バキューム台８８は、図３に示すように、上方からの視点において、１対の搬送レーン５６，５８の間に位置するように、昇降テーブル８６の上に配設されている。つまり、バキューム台８８は、上下方向において、１対の搬送レーン５６，５８と重ならないように、昇降テーブル８６の上に配設されている。なお、バキューム台８８は、昇降テーブル８６に着脱可能とされている。 The substrate holding device 52 also includes a lifting table 86, a vacuum table 88, a table lifting mechanism 90, a clamp device 92, and a pair of holding plates 96. The lifting table 86 has a generally rectangular shape, and is arranged below the guide rails 60 and 62 so as to extend between the pair of support legs 70 of each guide rail 60 and 62. A vacuum table 88 is arranged on the upper surface of the lifting table 86. The vacuum table 88 is generally in the shape of a box, and the dimension of the vacuum table 88 in the X direction is substantially the same as the dimension of the elevating table 86 in the X direction. It is smaller than the dimension of the lifting table 86 in the Y direction. Then, as shown in FIG. 3, the vacuum table 88 is arranged on the elevating table 86 so as to be located between the pair of transport lanes 56 and 58 from the viewpoint from above. That is, the vacuum table 88 is arranged on the elevating table 86 so as not to overlap the pair of transport lanes 56 and 58 in the vertical direction. The vacuum table 88 can be attached to and detached from the lifting table 86.
　そのバキューム台８８の上面は、平面とされており、その上面に複数の吸引口９７が形成されている。そして、複数の吸引口９７は、吸引ポンプ（図７参照）９８に接続されている。これにより、バキューム台８８は、吸引ポンプ９８の作動により、上面に形成された複数の吸引口９７からエアを吸引する。なお、バキューム台８８が配設される昇降テーブル８６は、テーブル昇降機構９０を介して、支持プレート７２の上面に配設されており、テーブル昇降機構９０は、電磁モータ（図７参照）９９の駆動により昇降テーブル８６を、バキューム台８８とともに昇降させる。 The upper surface of the vacuum base 88 is a flat surface, and a plurality of suction ports 97 are formed on the upper surface. The plurality of suction ports 97 are connected to a suction pump (see FIG. 7) 98. As a result, the vacuum base 88 sucks air from the plurality of suction ports 97 formed on the upper surface by the operation of the suction pump 98. The elevating table 86 on which the vacuum table 88 is disposed is disposed on the upper surface of the support plate 72 via the table elevating mechanism 90, and the table elevating mechanism 90 includes an electromagnetic motor (see FIG. 7) 99. The elevating table 86 is moved up and down together with the vacuum table 88 by driving.
　また、クランプ装置９２は、１対のクランプバー１００と、１対のクランププレート１０２とを有している。クランプバー１００は、概して板状をなし、クランプバー１００の長さ寸法が、バキューム台８８のＸ方向における長さ寸法より短くされている。そして、１対のクランプバー１００の各々は、Ｘ方向においてバキューム台８８の両端の間に位置するように、ガイドレール６０，６２の上面に固定されている。なお、クランプバー１００は、ガイドレール６０，６２に配設されているコンベアベルト６６，６８の上方に延びだすように、ガイドレール６０，６２の上面に固定されている。 The clamp device 92 also has a pair of clamp bars 100 and a pair of clamp plates 102. The clamp bar 100 has a generally plate shape, and the length dimension of the clamp bar 100 is shorter than the length dimension of the vacuum base 88 in the X direction. Each of the pair of clamp bars 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to be located between both ends of the vacuum table 88 in the X direction. The clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to extend above the conveyor belts 66 and 68 arranged on the guide rails 60 and 62.
　また、クランププレート１０２は、概して矩形の板状をなし、クランププレート１０２の長手方向における長さ寸法が、クランプバー１００の長さ寸法と略同じとされている。クランププレート１０２は、コンベアベルト６６，６８の上方に延びだすクランプバー１００の下方において、クランプバー１００と同じ方向に延び出しており、立設した状態で、ガイドレール６０，６２により上下方向にスライド可能に保持されている。つまり、ガイドレール６０，６２のコンベアベルト６６，６８が配設された側の側面に、図５に示すように、保持具１０８が配設されている。そして、そのガイドレール６０，６２の側面と、クランププレート１０２の側面とが対向した状態で、クランプバー１００の下方において、クランププレート１０２が保持具１０８により上下方向にスライド可能に保持されている。 The clamp plate 102 has a generally rectangular plate shape, and the length dimension of the clamp plate 102 in the longitudinal direction is substantially the same as the length dimension of the clamp bar 100. The clamp plate 102 extends in the same direction as the clamp bar 100 below the clamp bar 100 that extends above the conveyor belts 66 and 68, and vertically slides by the guide rails 60 and 62 in an upright state. Held possible. That is, as shown in FIG. 5, a holder 108 is arranged on the side surface of the guide rails 60 and 62 on the side where the conveyor belts 66 and 68 are arranged. Then, with the side surfaces of the guide rails 60 and 62 and the side surface of the clamp plate 102 facing each other, the clamp plate 102 is held by the holder 108 so as to be slidable in the vertical direction below the clamp bar 100.
　なお、ガイドレール６０，６２により上下方向にスライド可能に保持されたクランププレート１０２は、バキューム台８８の側面と対抗している。そして、クランププレート１０２が、最も下方にスライドした際に、クランププレート１０２の下端は、そのバキューム台８８が配設されている昇降テーブル８６が上昇していない状態において、その昇降テーブル８６の上面より上方に位置している。また、クランププレート１０２が、最も下方にスライドした際に、クランププレート１０２の上端は、コンベアベルト６６の上面より下方に位置している。 The clamp plate 102, which is held slidably in the vertical direction by the guide rails 60 and 62, faces the side surface of the vacuum base 88. Then, when the clamp plate 102 slides to the lowermost position, the lower end of the clamp plate 102 is higher than the upper surface of the lifting table 86 in a state where the lifting table 86 on which the vacuum base 88 is disposed is not lifted. It is located above. Further, when the clamp plate 102 slides downward, the upper end of the clamp plate 102 is located below the upper surface of the conveyor belt 66.
　また、1対の押さえプレート９６の各々は、細長い板形状をなし、ガイドレール６０，６２と直行する方向に延びる姿勢で、１対のガイドレール６０，６２に架け渡されている。そして、1対の押さえプレート９６の各々は、一端部において、連結機構１１０を介してガイドレール６２に取り付けられ、他端部において、連結機構１１２を介して、ガイドレール６０に取り付けられている。詳しくは、押さえプレート９６のガイドレール６２側の端部には、押さえプレート９６の延びる方向に沿って、長穴１１６が形成されている。一方、ガイドレール６２の上面には、その上面に固定されたクランプバー１００の端から離間する方向にズレた位置に、ねじ穴（図６参照）１１８が形成されている。 Also, each of the pair of pressing plates 96 has an elongated plate shape and is bridged over the pair of guide rails 60 and 62 in a posture extending in a direction orthogonal to the guide rails 60 and 62. Each of the pair of pressing plates 96 is attached to the guide rail 62 via the connecting mechanism 110 at one end and is attached to the guide rail 60 via the connecting mechanism 112 at the other end. Specifically, an elongated hole 116 is formed at the end of the pressing plate 96 on the guide rail 62 side along the extending direction of the pressing plate 96. On the other hand, on the upper surface of the guide rail 62, a screw hole (see FIG. 6) 118 is formed at a position displaced from the end of the clamp bar 100 fixed to the upper surface of the guide rail 62.
　なお、長穴１１６の内部は、図６に示すように、段付き形状とされており、押さえプレート９６の上面に開口する大径部１２０と、その大径部１２０の下端から連続し、押さえプレート９６の下面に開口する小径部１２２とに区分けされる。なお、図６は、図３のＣＣ線からの視点において示すものである。また、連結機構１１０は、ボルト１２４を有しており、ボルト１２４のねじ部１２６には、円環状のカラー１２８が外嵌されている。そのカラー１２８の外径は、長穴１１６の小径部１２２の内径より小さいが、ボルト１２４の頭部１３０の外径は、長穴１１６の小径部１２２の内径より大きい。また、ボルト１２４の頭部１３０の外径は、長穴１１６の大径部１２０の内径より小さい。なお、カラー１２８の高さ寸法は、小径部１２２の高さ寸法より長くされている。 As shown in FIG. 6, the inside of the elongated hole 116 has a stepped shape and is continuous from the large diameter portion 120 opening to the upper surface of the pressing plate 96 and the lower end of the large diameter portion 120, and is pressed. It is divided into a small-diameter portion 122 that opens on the lower surface of the plate 96. Note that FIG. 6 is shown from the viewpoint of the CC line in FIG. Further, the connecting mechanism 110 has a bolt 124, and an annular collar 128 is externally fitted to the screw portion 126 of the bolt 124. The outer diameter of the collar 128 is smaller than the inner diameter of the small diameter portion 122 of the long hole 116, but the outer diameter of the head portion 130 of the bolt 124 is larger than the inner diameter of the small diameter portion 122 of the long hole 116. The outer diameter of the head portion 130 of the bolt 124 is smaller than the inner diameter of the large diameter portion 120 of the elongated hole 116. The height of the collar 128 is longer than the height of the small diameter portion 122.
　そして、ボルト１２４が、押さえプレート９６の長穴１１６を介して、ガイドレール６２の上面に形成されたねじ穴１１８に締結されている。これにより、押さえプレート９６は、連結機構１１０において、ボルト１２４の径方向及び軸方向においてガタのある状態、つまり、隙間のある状態で、ボルト１２４によりガイドレール６２に取り付けられる。ちなみに、ボルト１２４の径方向における隙間、つまり、左右方向における隙間は、長穴１１６の小径部１２２の内径からカラー１２８の外径を減じた値に相当する。一方、ボルト１２４の軸方向における隙間、つまり、上下方向おける隙間は、カラー１２８の高さ寸法から小径部１２２の高さ寸法を減じた値に相当する。 Then, the bolts 124 are fastened to the screw holes 118 formed on the upper surface of the guide rail 62 via the elongated holes 116 of the pressing plate 96. As a result, the pressing plate 96 is attached to the guide rail 62 by the bolt 124 in the coupling mechanism 110 in a state where there is looseness in the radial direction and the axial direction of the bolt 124, that is, a state where there is a gap. By the way, the clearance in the radial direction of the bolt 124, that is, the clearance in the left-right direction corresponds to a value obtained by subtracting the outer diameter of the collar 128 from the inner diameter of the small diameter portion 122 of the elongated hole 116. On the other hand, the gap in the axial direction of the bolt 124, that is, the gap in the up-down direction corresponds to the value obtained by subtracting the height dimension of the small diameter portion 122 from the height dimension of the collar 128.
　また、連結機構１１０は、ボールプランジャ１３６を有しており、ガイドレール６２の上面には、ボールプランジャ１３６を挿入するための挿入穴１３８が形成されている。挿入穴１３８は、ねじ穴１１８の隣に形成されており、挿入穴１３８の形成位置は、ガイドレール６２に取り付けられた押さえプレート９６により覆われている。そして、その挿入穴１３８に、ボールプランジャ１３６が、ボール１４０をガイドレール６２の上面から突出させた状態で固定的に挿入されている。なお、ボール１４０のガイドレール６２の上面からの突出量は、押さえプレート９６の上下方向における隙間より僅かに大きくされている。このような構造により、ガイドレール６２の上面に取り付けられた押さえプレート９６では、連結機構１１０において、ボールプランジャ１３６が配設されている側の縁部が、ボールプランジャ１３６の弾性力により上方に向って付勢されている。このため、押さえプレート９６は、連結機構１１０において、ボールプランジャ１３６が配設されている側の縁部からボールプランジャ１３６が配設されていない側の縁部に向って下降するように傾斜している。 Further, the connecting mechanism 110 has a ball plunger 136, and an insertion hole 138 for inserting the ball plunger 136 is formed on the upper surface of the guide rail 62. The insertion hole 138 is formed next to the screw hole 118, and the formation position of the insertion hole 138 is covered by a holding plate 96 attached to the guide rail 62. The ball plunger 136 is fixedly inserted into the insertion hole 138 with the ball 140 protruding from the upper surface of the guide rail 62. The amount of projection of the ball 140 from the upper surface of the guide rail 62 is slightly larger than the vertical gap of the pressing plate 96. With such a structure, in the pressing plate 96 attached to the upper surface of the guide rail 62, the edge of the connecting mechanism 110 on the side where the ball plunger 136 is disposed is directed upward by the elastic force of the ball plunger 136. Is being urged. Therefore, in the connecting mechanism 110, the pressing plate 96 is inclined so as to descend from the edge portion on the side on which the ball plunger 136 is disposed toward the edge portion on the side on which the ball plunger 136 is not disposed. There is.
　また、１対の押さえプレート９６の各々をガイドレール６０に取り付けるための連結機構１１２は、連結機構１１０と略同じ構造をしている。このため、連結機構１１２の説明において、連結機構１１０の構成要素、つまり、ボルト１２４，ボールプランジャ１３６等の符号を用い、簡略して説明を行う。押さえプレート９６のガイドレール６０側の端部には、円形の穴、つまり、丸穴１５０が形成されている。一方、ガイドレール６０の上面には、その上面に固定されたクランプバー１００の端から離間する方向にズレた位置に、ねじ穴１５２が形成されている。そして、ねじ部１２６にカラー１２８が外嵌されたボルト１２４が、押さえプレート９６の丸穴１５０を介して、ガイドレール６０の上面に形成されたねじ穴１５２に締結されている。これにより、押さえプレート９６は、連結機構１１０と同様に、連結機構１１２においても、ボルト１２４の径方向及び軸方向において隙間のある状態で、ボルト１２４によりガイドレール６０に取り付けられる。また、連結機構１１２において、連結機構１１０と同様の位置にボールプランジャ１３６が配設されている。これにより、連結機構１１２においても、押さえプレート９６は、ボールプランジャ１３６が配設されている側の縁部からボールプランジャ１３６が配設されていない側の縁部に向って下降するように傾斜している。 Further, the connecting mechanism 112 for attaching each of the pair of pressing plates 96 to the guide rail 60 has substantially the same structure as the connecting mechanism 110. Therefore, in the description of the connecting mechanism 112, the components of the connecting mechanism 110, that is, the reference numerals of the bolt 124, the ball plunger 136, and the like are used, and the description will be simplified. A circular hole, that is, a round hole 150 is formed at the end of the pressing plate 96 on the guide rail 60 side. On the other hand, on the upper surface of the guide rail 60, a screw hole 152 is formed at a position displaced from the end of the clamp bar 100 fixed to the upper surface in a direction away from the end. Then, the bolt 124 having the collar 128 fitted on the screw portion 126 is fastened to the screw hole 152 formed on the upper surface of the guide rail 60 via the round hole 150 of the pressing plate 96. As a result, similarly to the connecting mechanism 110, the pressing plate 96 is attached to the guide rail 60 by the bolts 124 in the connecting mechanism 112 with a gap in the radial direction and the axial direction of the bolt 124. Further, in the connecting mechanism 112, the ball plunger 136 is arranged at the same position as the connecting mechanism 110. As a result, also in the coupling mechanism 112, the pressing plate 96 is inclined so as to descend from the edge portion on the side where the ball plunger 136 is disposed to the edge portion on the side where the ball plunger 136 is not disposed. ing.
　このような構造により、1対の押さえプレート９６の各々は、ガイドレール６０，６２と直行する方向に延びる姿勢で、一端部において、連結機構１１０を介してガイドレール６２に取り付けられ、他端部において、連結機構１１２を介して、ガイドレール６０に取り付けられている。つまり、1対の押さえプレート９６の各々は、両端部において、連結機構１１０，１１２を介して、1対のガイドレール６０，６２に架け渡された状態で、1対のガイドレール６０，６２を連結している。また、１対の押さえプレート９６は、ガイドレール６０，６２の上面に固定されたクランプバー１００を挟むように配設されている。このため、１対の押さえプレート９６の間の距離、つまり、１対の押さえプレート９６のＸ方向における離間距離は、クランプバー１００の長さ寸法より長くされている。ただし、１対の押さえプレート９６のＸ方向における離間距離は、バキューム台８８のＸ方向における長さ寸法より短くされている。このため、１対のガイドレール６０，６２の間に配設されているバキューム台８８のＸ方向における両縁部の上方に、１対の押さえプレート９６が位置している。 With such a structure, each of the pair of pressing plates 96 is attached to the guide rail 62 via the connecting mechanism 110 at one end in a posture extending in the direction orthogonal to the guide rails 60 and 62, and the other end is provided. In, the guide rail 60 is attached via the connecting mechanism 112. In other words, each of the pair of holding plates 96 has the pair of guide rails 60, 62 in the state of being bridged over the pair of guide rails 60, 62 via the connecting mechanisms 110, 112 at both ends. It is connected. Further, the pair of pressing plates 96 are arranged so as to sandwich the clamp bar 100 fixed to the upper surfaces of the guide rails 60 and 62. Therefore, the distance between the pair of holding plates 96, that is, the distance between the pair of holding plates 96 in the X direction is longer than the length dimension of the clamp bar 100. However, the distance between the pair of pressing plates 96 in the X direction is shorter than the length dimension of the vacuum base 88 in the X direction. Therefore, the pair of pressing plates 96 are located above both edges in the X direction of the vacuum base 88 arranged between the pair of guide rails 60 and 62.
　また、1対の押さえプレート９６の各々は、ボールプランジャ１３６が配設されている側の縁部からボールプランジャ１３６が配設されていない側の縁部に向って下降するように傾斜している。つまり、押さえプレート９６は、Ｘ方向において、基板搬送保持装置２２の中央に向かうほど下降するように傾斜している。なお、傾斜した状態の押さえプレート９６のボールプランジャ１３６が配設されている側の縁部の下面は、クランプバー１００の下面と略同じ高さに位置している。一方、傾斜した状態の押さえプレート９６のボールプランジャ１３６が配設されていない側の縁部の下面は、クランプバー１００の下面より僅かに下方に位置している。 Further, each of the pair of pressing plates 96 is inclined so as to descend from the edge portion on the side on which the ball plunger 136 is disposed toward the edge portion on the side on which the ball plunger 136 is not disposed. .. That is, the pressing plate 96 is inclined in the X direction so as to descend toward the center of the substrate transport holding device 22. The lower surface of the edge of the inclined pressing plate 96 on the side where the ball plunger 136 is disposed is located at substantially the same height as the lower surface of the clamp bar 100. On the other hand, the lower surface of the edge of the pressing plate 96 in the inclined state on the side where the ball plunger 136 is not arranged is located slightly below the lower surface of the clamp bar 100.
　また、図１に示すように、移動装置２４は、ＸＹロボット型の移動装置である。移動装置２４は、スライダ１６０をＸ方向にスライドさせる電磁モータ（図７参照）１６２と、Ｙ方向にスライドさせる電磁モータ（図７参照）１６４とを備えている。スライダ１６０には、装着ヘッド２６が取り付けられており、その装着ヘッド２６は、２つの電磁モータ１６２，１６４の作動によって、フレーム３１上の任意の位置に移動する。 Further, as shown in FIG. 1, the moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (see FIG. 7) 162 that slides the slider 160 in the X direction and an electromagnetic motor (see FIG. 7) 164 that slides the slider 160 in the Y direction. The mounting head 26 is attached to the slider 160, and the mounting head 26 is moved to an arbitrary position on the frame 31 by the operation of the two electromagnetic motors 162 and 164.
　装着ヘッド２６は、回路基板８０に対して電子部品を装着するものである。装着ヘッド２６は、下端面に設けられた吸着ノズル１７０を有している。吸着ノズル１７０は、負圧エア，正圧エア通路を介して、正負圧供給装置（図７参照）１７２に通じている。吸着ノズル１７０は、負圧によって電子部品を吸着保持し、保持した電子部品を正圧によって離脱する。また、装着ヘッド２６は、吸着ノズル１７０を昇降させるノズル昇降装置（図７参照）１７４を有している。そのノズル昇降装置１７４によって、装着ヘッド２６は、保持する電子部品の上下方向の位置を変更する。 The mounting head 26 mounts electronic components on the circuit board 80. The mounting head 26 has a suction nozzle 170 provided on the lower end surface. The suction nozzle 170 communicates with the positive/negative pressure supply device (see FIG. 7) 172 via the negative pressure air and positive pressure air passages. The suction nozzle 170 sucks and holds an electronic component by negative pressure, and separates the held electronic component by positive pressure. Further, the mounting head 26 has a nozzle lifting device (see FIG. 7) 174 for lifting the suction nozzle 170. The mounting head 26 changes the vertical position of the electronic component held by the nozzle lifting device 174.
　供給装置２８は、フィーダ型の供給装置であり、フレーム３１の前方側の端部に配設されている。供給装置２８は、テープフィーダ１８０を有している。テープフィーダ１８０は、テープ化部品を巻回させた状態で収容している。テープ化部品は、電子部品がテーピング化されたものである。そして、テープフィーダ１８０は、送出装置（図７参照）１８２によって、テープ化部品を送り出す。これにより、フィーダ型の供給装置２８は、テープ化部品の送り出しによって、電子部品を供給位置において供給する。 The supply device 28 is a feeder-type supply device, and is arranged at the front end of the frame 31. The supply device 28 has a tape feeder 180. The tape feeder 180 accommodates the taped parts in a wound state. The tape component is a taped electronic component. Then, the tape feeder 180 feeds the tape-formed component by the feeding device (see FIG. 7) 182. As a result, the feeder-type supply device 28 supplies the electronic component at the supply position by feeding the tape-formed component.
　制御装置３０は、図７に示すように、コントローラ１９０と複数の駆動回路１９２とを有している。複数の駆動回路１９２は、上記電磁モータ７８，８２，９９，１６２，１６４、正負圧供給装置１７２、ノズル昇降装置１７４、送出装置１８２に接続されている。コントローラ１９０は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１９２に接続されている。これにより、基板搬送保持装置２２、移動装置２４等の作動が、コントローラ１９０によって制御される。 As shown in FIG. 7, the control device 30 has a controller 190 and a plurality of drive circuits 192. The plurality of drive circuits 192 are connected to the electromagnetic motors 78, 82, 99, 162, 164, the positive/negative pressure supply device 172, the nozzle elevating device 174, and the delivery device 182. The controller 190 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 192. As a result, the operations of the substrate transport holding device 22, the moving device 24, etc. are controlled by the controller 190.
　電子部品装着装置１０では、上述した構成によって、基板搬送保持装置２２に保持された回路基板８０に対して、装着ヘッド２６によって装着作業を行うことが可能とされている。具体的には、回路基板８０が電子部品装着装置１０に搬入され、コントローラ１９０の指令により、コンベア装置５０が、回路基板８０を作業位置まで搬送する。なお、回路基板８０が作業位置まで搬送されると、コンベア装置５０のコンベアベルト６６の上に載置される回路基板８０の両縁、つまり、搬送方向に延びる両縁（以下、「搬送方向両縁」と記載する）は、図５に示すように、上下方向においてクランプバー１００とクランププレート１０２との間に位置する。また、回路基板８０が作業位置まで搬送されると、回路基板８０の搬送方向両縁以外の両縁、つまり、搬送方向と直行する方向に延びる両縁（以下、「搬送方向直行両縁」と記載する）は、１対の押さえプレート９６の下方に位置する。 With the configuration described above, the electronic component mounting apparatus 10 is capable of mounting the circuit board 80 held by the board transfer and holding apparatus 22 by the mounting head 26. Specifically, the circuit board 80 is carried into the electronic component mounting apparatus 10, and the conveyor device 50 conveys the circuit board 80 to the work position according to a command from the controller 190. When the circuit board 80 is transported to the work position, both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50, that is, both edges extending in the transport direction (hereinafter, “both in the transport direction”). (Described as “edge”) is located between the clamp bar 100 and the clamp plate 102 in the vertical direction, as shown in FIG. Further, when the circuit board 80 is transported to the working position, both edges of the circuit board 80 other than both edges in the transport direction, that is, both edges extending in a direction orthogonal to the transport direction (hereinafter, referred to as “both edges orthogonal to the transport direction”). (Described) is located below the pair of holding plates 96.
　次に、回路基板８０が作業位置まで搬送されると、テーブル昇降機構９０の作動により、昇降テーブル８６が上昇する。この際、クランププレート１０２の下端が昇降テーブル８６の上面に接触し、昇降テーブル８６の上昇に伴って、クランププレート１０２も上昇する。そして、クランププレート１０２の上昇に伴って、クランププレート１０２の上端が、コンベアベルト６６，６８により支持されている回路基板８０の下面に接触する。また、昇降テーブル８６の上面に配設されているバキューム台８８の高さ寸法は、クランププレート１０２の上下方向の長さ寸法と同じとされている。 Next, when the circuit board 80 is transported to the work position, the lifting/lowering table 86 is lifted by the operation of the table lifting/lowering mechanism 90. At this time, the lower end of the clamp plate 102 contacts the upper surface of the elevating table 86, and the clamp plate 102 also rises as the elevating table 86 rises. Then, as the clamp plate 102 moves up, the upper end of the clamp plate 102 contacts the lower surface of the circuit board 80 supported by the conveyor belts 66 and 68. The height dimension of the vacuum table 88 arranged on the upper surface of the lifting table 86 is the same as the vertical dimension of the clamp plate 102.
　このため、クランププレート１０２の上端が、コンベアベルト６６，６８により支持されている回路基板８０の下面に接触したタイミングで、バキューム台８８の上面も、回路基板８０の下面に接触する。そして、昇降テーブル８６が上昇することで、コンベアベルト６６，６８により支持されていた回路基板８０が、クランププレート１０２とバキューム台８８とによりコンベアベルト６６，６８から持ち上げられ、上昇する。なお、回路基板８０のＸ方向の寸法は、バキューム台８８のＸ方向の寸法より僅かに小さくされ、回路基板８０のＹ方向の寸法は、バキューム台８８のＹ方向の寸法よりある程度小さくされている。このため、回路基板８０は、搬送方向両縁以外の部分において、バキューム台８８により支持され、搬送方向両縁において、クランププレート１０２により支持された状態で持ち上げられる。 Therefore, when the upper end of the clamp plate 102 comes into contact with the lower surface of the circuit board 80 supported by the conveyor belts 66 and 68, the upper surface of the vacuum table 88 also comes into contact with the lower surface of the circuit board 80. Then, when the elevating table 86 rises, the circuit board 80 supported by the conveyor belts 66 and 68 is lifted from the conveyor belts 66 and 68 by the clamp plate 102 and the vacuum table 88 and rises. The dimension of the circuit board 80 in the X direction is made slightly smaller than the dimension of the vacuum table 88 in the X direction, and the dimension of the circuit board 80 in the Y direction is made somewhat smaller than the dimension of the vacuum table 88 in the Y direction. .. Therefore, the circuit board 80 is supported by the vacuum table 88 at portions other than both edges in the transport direction, and lifted while being supported by the clamp plate 102 at both edges in the transport direction.
　そして、図８に示すように、回路基板８０の上面がクランプバー１００の下面に接触する位置まで、テーブル昇降機構９０が作動し、回路基板８０が、クランププレート１０２とバキューム台８８とにより持ち上げられる。これにより、回路基板８０は、搬送方向両縁以外の部分において、バキューム台８８により下面から支持された状態で、搬送方向両縁において、クランプバー１００とクランププレート１０２とによって挟持される。この際、回路基板８０は、搬送方向直行両縁において、１対の押さえプレート９６により押さえられる。 Then, as shown in FIG. 8, the table elevating mechanism 90 operates until the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, and the circuit board 80 is lifted by the clamp plate 102 and the vacuum table 88. .. As a result, the circuit board 80 is sandwiched between the clamp bar 100 and the clamp plate 102 at both edges in the transport direction while being supported from the lower surface by the vacuum base 88 at portions other than the both edges in the transport direction. At this time, the circuit board 80 is pressed by the pair of pressing plates 96 on both edges of the direction orthogonal to the transport direction.
　詳しくは、上述したように、作業位置に搬送された回路基板８０の搬送方向直行両縁は、１対の押さえプレート９６の下方に位置している。一方、傾斜した状態の押さえプレート９６のボールプランジャ１３６が配設されていない側の縁部の下面は、クランプバー１００の下面より僅かに下方に位置している。このため、回路基板８０の上昇に伴って、回路基板８０が、搬送方向両縁において、クランプバー１００に接触する前に、搬送方向直行両縁において、押さえプレート９６のボールプランジャ１３６が配設されていない側の縁部の下面に接触する。また、押さえプレート９６は、ボールプランジャ１３６の弾性力により上方に向って付勢され、傾斜している。このため、回路基板８０がさらに上昇することで、押さえプレート９６が、ボールプランジャ１３６の弾性力に抗して揺動し、押さえプレート９６の傾斜角度が小さくなる。 Specifically, as described above, both edges of the circuit board 80 conveyed to the working position in the direction perpendicular to the conveyance direction are located below the pair of pressing plates 96. On the other hand, the lower surface of the edge of the pressing plate 96 in the inclined state on the side where the ball plunger 136 is not arranged is located slightly below the lower surface of the clamp bar 100. Therefore, as the circuit board 80 rises, the ball plungers 136 of the pressing plate 96 are arranged at both edges in the conveyance direction before the circuit board 80 contacts the clamp bar 100 at both edges in the conveyance direction. Touch the underside of the edge that is not on. Further, the pressing plate 96 is biased upward by the elastic force of the ball plunger 136 and is inclined. Therefore, when the circuit board 80 further rises, the pressing plate 96 swings against the elastic force of the ball plunger 136, and the inclination angle of the pressing plate 96 becomes smaller.
　そして、上述したように、回路基板８０の上面がクランプバー１００の下面に接触する位置まで、回路基板８０は上昇するが、クランプバー１００の下面は、傾斜した状態の押さえプレート９６のボールプランジャ１３６が配設されている側の縁部の下面と略同じ高さとされている。このため、回路基板８０の上面がクランプバー１００の下面に接触する位置まで、回路基板８０が上昇すると、図９に示すように、押さえプレート９６の傾斜は概ね解消され、回路基板８０と平行となる。この際、回路基板８０は、搬送方向直行両縁において、１対の押さえプレート９６によって、ボールプランジャ１３６の弾性力及び、１対の押さえプレート９６の自重によって押さえられる。つまり、回路基板８０は、搬送方向直行両縁において、押さえプレート９６とバキューム台８８とによって挟持される。 Then, as described above, the circuit board 80 rises to the position where the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, but the lower surface of the clamp bar 100 has the ball plunger 136 of the pressing plate 96 in the inclined state. The height is substantially the same as the lower surface of the edge portion on the side where is disposed. Therefore, when the circuit board 80 rises to the position where the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, the inclination of the pressing plate 96 is almost eliminated and becomes parallel to the circuit board 80, as shown in FIG. Become. At this time, the circuit board 80 is pressed by the elastic force of the ball plunger 136 and the own weight of the pair of pressing plates 96 by the pair of pressing plates 96 at both edges orthogonal to the transport direction. That is, the circuit board 80 is sandwiched between the pressing plate 96 and the vacuum base 88 on both edges of the direction perpendicular to the transport direction.
　これにより、回路基板８０は、搬送方向両縁において、クランプバー１００とクランププレート１０２とにより挟持され、搬送方向直行両縁において、押さえプレート９６とバキューム台８８とにより挟持される。つまり、回路基板８０は、４つの縁部の全てにおいて、基板保持装置５２によって固定的に保持される。そして、回路基板８０が基板保持装置５２により固定的に保持されると、バキューム台８８において、吸引ポンプ９８の作動により、複数の吸引口９７からエアが吸引される。これにより、回路基板８０がバキューム台８８に密着する。 As a result, the circuit board 80 is clamped by the clamp bar 100 and the clamp plate 102 at both edges in the carrying direction, and is clamped by the pressing plate 96 and the vacuum base 88 at both edges in the carrying direction. That is, the circuit board 80 is fixedly held by the board holding device 52 at all four edges. Then, when the circuit board 80 is fixedly held by the board holding device 52, air is sucked from the plurality of suction ports 97 in the vacuum table 88 by the operation of the suction pump 98. As a result, the circuit board 80 comes into close contact with the vacuum table 88.
　また、テープフィーダ１８０では、テープ化部品が送り出され、電子部品が供給位置において供給される。そして、装着ヘッド２６が、電子部品の供給位置の上方に移動し、吸着ノズル１７０によって電子部品を吸着保持する。続いて、装着ヘッド２６は、回路基板８０の上方に移動し、保持している電子部品を回路基板８０に装着する。 Further, in the tape feeder 180, the taped parts are sent out and the electronic parts are supplied at the supply position. Then, the mounting head 26 moves above the supply position of the electronic component, and the suction nozzle 170 sucks and holds the electronic component. Subsequently, the mounting head 26 moves above the circuit board 80 and mounts the held electronic component on the circuit board 80.
　このように、電子部品装着装置１０では、作業位置まで搬送された回路基板８０が、基板保持装置５２によってクランプされ、そのクランプされた状態の回路基板８０に対して電子部品の装着作業が実行される。そして、基板保持装置５２では、回路基板８０が、搬送方向直行両縁において、押さえプレート９６によりバキューム台８８に押さえ付けられているため、エア漏れもなく、バキューム台８８に適切に密着する。これにより、薄い回路基板８０等であっても、回路基板８０の反りを適切に解消し、適切な装着作業を担保することができる。特に、板形状の押さえプレート９６により回路基板８０が押さえられることで、好適に回路基板８０をバキューム台８８に密着させることができる。 As described above, in the electronic component mounting apparatus 10, the circuit board 80 conveyed to the work position is clamped by the board holding device 52, and the mounting work of the electronic component is performed on the circuit board 80 in the clamped state. It Further, in the board holding device 52, the circuit board 80 is pressed against the vacuum base 88 by the pressing plates 96 at both edges in the direction perpendicular to the carrying direction, so that the circuit board 80 appropriately adheres to the vacuum base 88 without air leakage. As a result, even with a thin circuit board 80 or the like, it is possible to properly eliminate warpage of the circuit board 80 and ensure proper mounting work. In particular, since the circuit board 80 is pressed by the plate-shaped pressing plate 96, the circuit board 80 can be preferably brought into close contact with the vacuum table 88.
　また、基板保持装置５２では、押さえプレート９６が、隙間のある状態で、ガイドレール６０，６２に取り付けられており、その隙間を利用して、ボールプランジャ１３６の弾性力により付勢されている。そして、ボールプランジャ１３６の弾性力により、回路基板８０が押さえプレート９６に押さえられている。これにより、回路基板８０の厚さが異なる場合であっても、概ね均一な力で回路基板８０を押さえることができる。 Further, in the substrate holding device 52, the pressing plate 96 is attached to the guide rails 60 and 62 with a gap, and the gap is utilized to urge the elastic force of the ball plunger 136. The circuit board 80 is pressed by the pressing plate 96 by the elastic force of the ball plunger 136. Thereby, even if the thickness of the circuit board 80 is different, the circuit board 80 can be pressed with a substantially uniform force.
　また、基板搬送保持装置２２では、上述したように、ガイドレール６０をガイドレール６２に接近・離間させる方向にスライド可能とされており、搬送レーン５６と搬送レーン５８との間の距離を変更することで、搬送する回路基板８０のサイズを変更することが可能とされている。このように、搬送する回路基板８０のサイズを変更する際に、容易に、搬送レーン５６と搬送レーン５８との間の距離を変更することができる。詳しくは、例えば、押さえプレート９６が、両端部において、１対のガイドレール６０，６２に、連結機構１１２を介して取り付けられる場合には、押さえプレート９６は、両端部において、丸穴１５０を介して１対のガイドレール６０，６２にボルト締結される。このような場合に、搬送レーン５６と搬送レーン５８との間の距離を変更するためには、押さえプレート９６を取り外し、押さえプレート９６と異なる長さの押さえプレートを、１対の押さえプレート９６に取り付けたり、押さえプレート９６の変更に伴ってボルト締結の取り付けをやり直したりする必要がある。 Further, in the substrate transfer/holding device 22, as described above, the guide rail 60 is slidable in the direction of approaching/separating from the guide rail 62, and the distance between the transfer lane 56 and the transfer lane 58 is changed. As a result, the size of the circuit board 80 to be transported can be changed. In this way, when changing the size of the circuit board 80 to be transported, the distance between the transportation lane 56 and the transportation lane 58 can be easily changed. Specifically, for example, when the pressing plate 96 is attached to the pair of guide rails 60 and 62 at both ends via the connecting mechanism 112, the pressing plate 96 has both ends through the round holes 150. Bolted to the pair of guide rails 60 and 62. In such a case, in order to change the distance between the transportation lane 56 and the transportation lane 58, the pressing plate 96 is removed, and a pressing plate having a different length from the pressing plate 96 is attached to the pair of pressing plates 96. It is necessary to attach the bolts or to reattach the bolts when the pressing plate 96 is changed.
　一方、基板搬送保持装置２２では、押さえプレート９６が、一端部において、ガイドレール６０に、連結機構１１２を介して取り付けられ、他端部において、ガイドレール６２に、連結機構１１０を介して取り付けられている。つまり、押さえプレート９６は、一端部において、ガイドレール６０に丸穴１５０を介してボルト締結されているが、他端部において、ガイドレール６２に長穴１１６を介してボルト締結されている。このため、例えば、大きなサイズの回路基板の装着作業の後に、小さなサイズの回路基板の装着作業を実行する場合において、図１０に示すように、ガイドレール６２をガイドレール６０に接近させる方向にスライドさせると、ガイドレール６２に締結されたボルト１２４は、長穴１１６の内部を移動する。このため、押さえプレート９６を取り外すことなく、容易に、搬送レーン５６と搬送レーン５８との間の距離を変更することができる。特に、ボルト１２４は、長穴１１６を介して隙間のある状態で締結されているため、ボルト１２４を緩めることなく、ガイドレール６２をスライドさせることができる。このため、工具などを用いることなく、容易に搬送レーン５６と搬送レーン５８との間の距離を変更することができる。さらに言えば、押さえプレート９６は、ボールプランジャ１３６のボール１４０に接触した状態でガイドレール６２に取り付けられているため、押さえプレート９６とガイドレール６２との摺動抵抗は非常に小さい。これにより、押さえプレート９６がガタつくことなく、更に容易に搬送レーン５６と搬送レーン５８との間の距離を変更することができる。 On the other hand, in the substrate transfer/holding device 22, the pressing plate 96 is attached to the guide rail 60 at one end via the connecting mechanism 112, and is attached to the guide rail 62 at the other end via the connecting mechanism 110. ing. That is, the pressing plate 96 is bolted to the guide rail 60 through the round hole 150 at one end, but is bolted to the guide rail 62 through the elongated hole 116 at the other end. Therefore, for example, when the work of mounting the circuit board of the small size is performed after the work of mounting the circuit board of the large size, as shown in FIG. 10, the guide rail 62 is slid in the direction of approaching the guide rail 60. Then, the bolt 124 fastened to the guide rail 62 moves inside the elongated hole 116. Therefore, the distance between the transportation lane 56 and the transportation lane 58 can be easily changed without removing the pressing plate 96. In particular, since the bolts 124 are fastened with a gap through the elongated holes 116, the guide rails 62 can be slid without loosening the bolts 124. Therefore, the distance between the transportation lane 56 and the transportation lane 58 can be easily changed without using a tool or the like. Furthermore, since the pressing plate 96 is attached to the guide rail 62 while being in contact with the ball 140 of the ball plunger 136, the sliding resistance between the pressing plate 96 and the guide rail 62 is very small. This makes it possible to change the distance between the transportation lane 56 and the transportation lane 58 more easily without the pressing plate 96 rattling.
　ちなみに、上記実施例において、基板搬送保持装置２２は、搬送装置の一例である。搬送レーン５６，５８は、搬送レーンの一例である。回路基板８０は、基板の一例である。押さえプレート９６は、プレートの一例である。ボールプランジャ１３６は、弾性部材の一例である。 By the way, in the above embodiment, the substrate transfer/holding device 22 is an example of the transfer device. The transport lanes 56 and 58 are examples of the transport lane. The circuit board 80 is an example of a board. The pressing plate 96 is an example of a plate. The ball plunger 136 is an example of an elastic member.
　なお、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。具体的には、例えば、上記実施例では、押さえプレート９６が、長穴１１６を介してガイドレール６２にボルト締結されることで、ガイドレール６２が押さえプレート９６の延びる方向に移動可能とされているが、種々の構造により、ガイドレール６２が移動可能とされてもよい。例えば、押さえプレート９６の延びる方向にスライド可能にガイドレール６２が取り付けられてもよく、押さえプレート９６の延びる方向に沿って移動可能にガイドレール６２が取り付けられてもよい。このような場合に、押さえプレート９６には、長穴１１６以外に、ガイド溝，係合部等が形成されてもよく、ガイド溝などが形成されなくても、押さえプレート９６を挟持する部材をガイドレール６２に設けてもよい。 It should be noted that the present invention is not limited to the above-described embodiments, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the pressing plate 96 is bolted to the guide rail 62 through the elongated hole 116 so that the guide rail 62 can move in the extending direction of the pressing plate 96. However, the guide rail 62 may be movable by various structures. For example, the guide rail 62 may be attached so as to be slidable in the extending direction of the holding plate 96, or the guide rail 62 may be attached so as to be movable along the extending direction of the holding plate 96. In such a case, in addition to the elongated holes 116, the holding plate 96 may be formed with a guide groove, an engaging portion, or the like, and even if the guide groove or the like is not formed, a member for sandwiching the holding plate 96 is provided. It may be provided on the guide rail 62.
　また、上記実施例では、コンベアベルト６６，６８を用いた搬送レーン５６，５８が採用されているが、回路基板８０を搬送可能な構造であれば、種々の構造の搬送レーンを採用してもよい。例えば、複数のローラを並んで配設し、それら複数のローラにより回路基板８０を搬送する構造の搬送レーンを採用してもよい。 Further, in the above embodiment, the transport lanes 56 and 58 using the conveyor belts 66 and 68 are adopted, but if the circuit board 80 can be transported, various transport lanes can be adopted. Good. For example, a transport lane having a structure in which a plurality of rollers are arranged side by side and the circuit board 80 is transported by the plurality of rollers may be adopted.
　また、上記実施例では、押さえプレート９６が、一端部においてのみ、長穴１１６を介してガイドレール６２に取り付けられているが、両端部において、長穴１１６を介してガイドレール６０，６２に取り付けられてもよい。つまり、押さえプレート９６が、両端部において、連結機構１１０を介してガイドレール６０，６２に取り付けられてもよい。 Further, in the above-described embodiment, the pressing plate 96 is attached to the guide rails 62 through the elongated holes 116 only at one end, but is attached to the guide rails 60 and 62 through the elongated holes 116 at both ends. You may be asked. That is, the pressing plate 96 may be attached to the guide rails 60 and 62 at both ends via the connecting mechanism 110.
　また、上記実施例では、昇降テーブル８６の上にバキューム台８８が配設されているが、バキューム台８８と異なるもの、例えば、バックアップピンが配設されてもよい。このような場合には、バックアップピンに向って、回路基板８０が押さえプレート９６により押さえ付けられる。 Further, in the above-mentioned embodiment, the vacuum table 88 is provided on the lifting table 86, but a different table from the vacuum table 88, for example, a backup pin may be provided. In such a case, the circuit board 80 is pressed by the pressing plate 96 toward the backup pin.
　また、上記実施例では、弾性部材として、ボールプランジャ１３６が採用されているが、バネ，ゴム等の弾性変形可能なものであれば、種々のものを弾性部材として採用することができる。また、弾性部材を介して押さえプレート９６をガイドレール６２に取り付けることは必須ではなく、弾性部材を用いることなく、押さえプレート９６をガイドレール６２に取り付けてもよい。 Also, in the above embodiment, the ball plunger 136 is used as the elastic member, but various elastic members such as springs and rubbers can be used as the elastic member. Further, it is not essential to attach the pressing plate 96 to the guide rail 62 via the elastic member, and the pressing plate 96 may be attached to the guide rail 62 without using the elastic member.
　また、上記実施例では、押さえプレート９６の両端部が、隙間のある状態で弾性部材を介して、１対のガイドレール６０，６２に取り付けられているが、押さえプレート９６の一端部のみが、隙間のある状態で弾性部材を介して、ガイドレール６０，６２の一方に取り付けられてもよい。このような場合には、スライド可能に配設されたガイドレール６２に、押さえプレート９６の一端部が、隙間のある状態で弾性部材を介して、取り付けられる。例えば、押さえプレート９６の一端部が、上下方向に、かつ長手方向に隙間のない状態で固定的に、ボルトで締結されており、他端部が、本実施例の連結機構１１０側のように、上下方向に、かつ長手方向に隙間のある状態で、スライド可能にボルトで締結されている場合もある。 Further, in the above-described embodiment, both ends of the pressing plate 96 are attached to the pair of guide rails 60 and 62 via the elastic members with a gap, but only one end of the pressing plate 96 is It may be attached to one of the guide rails 60 and 62 via an elastic member with a gap. In such a case, one end portion of the pressing plate 96 is attached to the slidably arranged guide rail 62 via an elastic member with a gap. For example, one end of the pressing plate 96 is fixedly fastened with bolts in the vertical direction and in the longitudinal direction without a gap, and the other end is similar to that of the coupling mechanism 110 side of the present embodiment. In some cases, the bolts are slidably fastened in the vertical direction and with a gap in the longitudinal direction.
　２２：基板搬送保持装置（搬送装置）　　５６：搬送レーン　　５８：搬送レーン　　８０：回路基板（基板）　　９６：押さえプレート（プレート）　　１３６：ボールプランジャ（弾性部材） 22: Substrate transfer holding device (transfer device) 56: Transfer lane 58: Transfer lane 80: Circuit board (board) 96: Holding plate (plate) 136: Ball plunger (elastic member)

Claims (3)

  1. 　基板を搬送する１対の搬送レーンと、
    　前記１対の搬送レーンに搬送された前記基板を押さえるためのプレートと
    　を備え、
    　前記１対の搬送レーンの少なくとも一方が移動可能な状態で、前記プレートが前記１対の搬送レーンを連結する搬送装置。     A pair of transfer lanes for transferring the board,
    A plate for pressing the substrate transported to the pair of transport lanes,
    A transport device in which the plate connects the pair of transport lanes in a state in which at least one of the pair of transport lanes is movable.
  2. 　前記プレートが、
    　隙間のある状態で前記１対の搬送レーンの少なくとも一方に取り付けられた請求項１に記載の搬送装置。     The plate is
    The transport device according to claim 1, wherein the transport device is attached to at least one of the pair of transport lanes with a gap.
  3. 　前記プレートが、
    　弾性部材を介して前記１対の搬送レーンの少なくとも一方に取り付けられた請求項１または請求項２に記載の搬送装置。     The plate is
    The transport device according to claim 1 or 2, which is attached to at least one of the pair of transport lanes via an elastic member.
PCT/JP2019/001622 2019-01-21 2019-01-21 Transporting device WO2020152735A1 (en)

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Application Number Priority Date Filing Date Title
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61140599U (en) * 1985-02-21 1986-08-30
JPS6343497U (en) * 1986-09-05 1988-03-23
JPH02102600A (en) * 1988-10-11 1990-04-16 Sanyo Electric Co Ltd Substrate support mechanism
US20020005336A1 (en) * 1998-06-15 2002-01-17 Johannes Rehm Adjusting unit
JP2003078287A (en) * 2001-09-05 2003-03-14 Matsushita Electric Ind Co Ltd Method and apparatus for conveyance of board in component mounting machine
JP2014011247A (en) * 2012-06-28 2014-01-20 Hitachi High-Tech Instruments Co Ltd Component mounting device
US20150271962A1 (en) * 2014-03-22 2015-09-24 Quik-Tool Llc Circuit board suction assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61140599U (en) * 1985-02-21 1986-08-30
JPS6343497U (en) * 1986-09-05 1988-03-23
JPH02102600A (en) * 1988-10-11 1990-04-16 Sanyo Electric Co Ltd Substrate support mechanism
US20020005336A1 (en) * 1998-06-15 2002-01-17 Johannes Rehm Adjusting unit
JP2003078287A (en) * 2001-09-05 2003-03-14 Matsushita Electric Ind Co Ltd Method and apparatus for conveyance of board in component mounting machine
JP2014011247A (en) * 2012-06-28 2014-01-20 Hitachi High-Tech Instruments Co Ltd Component mounting device
US20150271962A1 (en) * 2014-03-22 2015-09-24 Quik-Tool Llc Circuit board suction assembly

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