JPH02102600A

JPH02102600A - Substrate support mechanism

Info

Publication number: JPH02102600A
Application number: JP63255654A
Authority: JP
Inventors: Takashi Sunaga; 須長　隆
Original assignee: Sanyo Electric Co Ltd
Current assignee: Sanyo Electric Co Ltd
Priority date: 1988-10-11
Filing date: 1988-10-11
Publication date: 1990-04-16

Abstract

PURPOSE:To enable the simplification of setting a substrate width and the reduction of working time by a method wherein a slope formed on underside of a substrate support device and bendable backup pins which support and back up the rear side of a substrate placed on a table are provided. CONSTITUTION:A backup pin 22 itself is partially formed of for instance a spring 23, and a pin head 24 becomes bendable through the spring 23 section. And, the pins 22 are installed upright on the whole face of an X-Y table 6, and the almost whole underside of a substrate support device 10 is sloped. When the support device 10 is made to descend as the backup pins 22 are below the underside of the device 10, the backup pins 22 are bent down along the slope of the support device 10 and then the device 10 stops descending. By this setup, even if the support device 10 is located on the backup pins 22 due to the change of a substrate width to use, the device 10 can be made to move up or down, so that a substrate support mechanism of this design can be improved in workability.

Description

【発明の詳細な説明】イ）産業上の利用分野本発明は電子部品装着装置や接着材塗布装置でのプリン
ト基板支持固定を行う基板支持機構に関する。DETAILED DESCRIPTION OF THE INVENTION A) Field of Industrial Application The present invention relates to a board support mechanism for supporting and fixing a printed circuit board in an electronic component mounting device or an adhesive coating device.

口）従来のの技術一般に、電子部品自動装着機においては、第８図に示す
ように、チップ状の電子部品（１）を装着する基板（２
）は、その両端が基板搬送シュート（３）で支持され、
この搬送シュート（３）がＸＹ子テーブル４）に載置さ
れる。このため、基板（２）が反っていると、チップ状
の電子部品（１）を装着できなくなったり、又、薄い基
板を用いると部品吸着コレット（５）の下がる力で基板
が下側に反ってしまい、電子部品の装着が確実に行えな
いという欠点があった。Conventional technology In general, in automatic electronic component mounting machines, as shown in FIG.
) is supported at both ends by the substrate transport chute (3),
This conveyance chute (3) is placed on the XY child table 4). Therefore, if the board (2) is warped, chip-shaped electronic components (1) cannot be mounted, and if a thin board is used, the board will warp downward due to the downward force of the component suction collet (5). This has the disadvantage that electronic parts cannot be mounted reliably.

このため、最近では、特開昭５９−２９４９２号に示す
ようにバックアップピンを設けるものが考えられている
。この構成について第９図、第１０図を用いて説明する
。同図において、（６）は平面上ＸＹ移動可能なＸＹ子
テーブル（７ｉ（８）は。For this reason, recently, it has been considered to provide a backup pin as shown in Japanese Patent Application Laid-Open No. 59-29492. This configuration will be explained using FIGS. 9 and 10. In the same figure, (6) is an XY child table (7i (8) is an XY child table that can be moved in XY on a plane.

このＸＹ子テーブル６）の両端面に設けられ、このＸＹ
子テーブル６）に対して上下動可能なシュート支持台で
あり、その上に基板両端を保持するためのシュート（９
）　（１０１が互に対向するように設けられている。ま
た、シュート（９）（１０）の内一方のシュート（１０
）はＢ−Ｂ’の断面である第１１１１７１に示すように
他方のシュート（９）に対して接雛自在に設けられてい
る。　（１１）（１２）はＸＹ子テーブル６）に取り付
けられ、一端が上記シュート支持台（７）（８）に当接
したシュート昇降レバーを示し、互いに連結棒（１３）
で結合され、この棒（１３）を軸として同時に回動する
ようになっている。（１４）はこの昇降レバー（１１）
　（１２）に作用してシュート支持台（７）（８）を上
下するためのシリンダであって、電子部品装着装置等の
本体側に取り付けられている。（１５）　（１５）・・
・は上記ＸＹ子テーブル６）上面に設けられた穴（＋６
１　（＋６１・・・に嵌め込まれたバックアップピンで
あり、第１２図のように（１６＋　（１６１・・・への
嵌め込みを行う嵌め込み部（２０）と、ピン先（２１）
と、から成る。Provided on both end faces of this XY child table 6),
This is a chute support stand that can be moved up and down relative to the child table 6), on which a chute (9) for holding both ends of the substrate is mounted.
) (101 are provided so as to face each other. Also, one of the chutes (9) and (10)
) is provided so that it can be freely attached to the other chute (9), as shown in No. 111171, which is a cross section taken along line B-B'. (11) and (12) indicate chute lifting levers attached to the XY child table 6), one end of which is in contact with the chute support bases (7) and (8), and connected to the connecting rod (13).
The rods (13) are connected together so that they can simultaneously rotate around this rod (13). (14) is this lift lever (11)
(12) to move the chute support bases (7) and (8) up and down, and is attached to the main body of an electronic component mounting device or the like. (15) (15)...
・ indicates the hole (+6) provided on the top surface of the XY child table 6) above.
1 (+61...) As shown in Fig. 12, it is a backup pin that is fitted into (16+ (161...) and has a fitting part (20) and a pin tip (21).
It consists of and.

このような基板支持機構においては、第９１のようにシ
ュート（９）　（ＩＱ）を上昇させた状態で基板市／Ｊに応じてシュート（１０）をシュート（９）に対し
て移動しその間隔を調整する。そして、シュート（９）
　（１０）で囲まれるＸＹ子テーブル６）上の領域にの
みにバックアップビン＋１５）　（Ｉ５）を立てる。こ
うした状態で、基板（Ｐ）をシュートｆ９１　（１０）
の渭（１７ｉ　＋１８１に送り込んでシリンダ（１４）
の操作棒（１９）を降下させて第１０図のようにシュー
ト（９）　（１０）を降下させると基板（Ｐ）裏面はバ
ックアップピン（１５１＋１５）・・・により支持され
る。この状態でＸＹ子テーブル６）は所定のプログラム
に従ってＸＹ力方向自在に動かされ１部品吸着コレット
によって基板（Ｐ）上に供給される電子部品は基板（Ｐ
）上の所定の場所に取り付けられる。In such a substrate support mechanism, the chute (10) is moved relative to the chute (9) according to the substrate city/J with the chute (9) (IQ) raised as shown in No. 91, and the distance between the chute (10) and the chute (9) is Adjust. And shoot (9)
Set up a backup bin +15) (I5) only in the area above the XY child table 6) surrounded by (10). In this state, shoot the board (P) f91 (10)
(17i +181) and cylinder (14)
When the operating rod (19) is lowered to lower the chutes (9) and (10) as shown in FIG. 10, the back surface of the board (P) is supported by the backup pins (151+15). In this state, the XY child table 6) is freely moved in the XY force directions according to a predetermined program, and the electronic components supplied onto the board (P) by the one-component suction collet are
) is mounted in place on the top.

ハ）発明が解決しようとする課題ところで、こうした支持機構では、基板中の異なる基板
を使用する場合は一対のシュート間隔を調整するととも
にシュートの上下動をパンクアップピンが邪魔をしない
ようにバックアップピンの取り付は状態を変更しなけれ
ばならず、作業性の悪いものであった。C) Problems to be Solved by the Invention By the way, with such a support mechanism, when using different substrates among the substrates, the distance between the pair of chutes must be adjusted, and the backup pin must be set so that the puncture-up pin does not interfere with the vertical movement of the chutes. The installation required changing conditions and was difficult to work with.

二）課題を解決するだめの手段本発明はこのような点に鑑みて為されたものであって、
テーブルと、このテーブル上にテーブルに対して接匪可
能に設けられ、基板の両端を支持する一対の基板支持具
と、この支持具下面に形成された傾斜面と、この一対の
基板支持具間間隔を調節する調節機構と、上記テーブル
上に設けられ、基板裏面をバンクアップ支持する可倒式
のバックアップピンと、を有している。2) Means for solving the problem The present invention has been made in view of the above points,
A table, a pair of substrate supports provided on the table so as to be able to touch the table and supporting both ends of the substrate, an inclined surface formed on the lower surface of the supports, and a gap between the pair of substrate supports. It has an adjustment mechanism that adjusts the interval, and a retractable backup pin that is provided on the table and supports the back surface of the substrate in a banked manner.

ホ）作用下面にバックアップピンが存在する状態で支持具が降下
されると、バックアップビンは支持具の斜面に沿って倒
される。e) When the support is lowered with the backup pin present on the lower surface, the backup bin falls along the slope of the support.

へ）実施例本発明においては、バックアップピン（２２）自体を第
２図に示すように部分的にスプリング（２３）で形成し
、第３図のようにこのスプリング（２３）部分でピン先
（２４）が可倒な状態になっている。そして、こうした
ピン（２２）を第１０図に示すＸＹ子テーブル６）上全
面に立設しておく。また、第１０図のＡ−Ａ’断面であ
る第４図に示すようにシュート（１０）の下面略全域に
傾斜が付けられている。f) Embodiment In the present invention, the backup pin (22) itself is partially formed of a spring (23) as shown in FIG. 2, and the pin tip ( 24) is in a foldable state. These pins (22) are erected on the entire surface of the XY child table 6) shown in FIG. Further, as shown in FIG. 4, which is a cross section taken along line AA' in FIG. 10, substantially the entire lower surface of the chute (10) is sloped.

従って、こうした形態の支持機構においては、ピン＜２
２１　（２２）・・・がシュート（１０）の下方に存在
する状態でシュート（１０）の上下動がされると、第１
図のようにピン（２２）が倒れるようにして、シュート
（１０）の下降が完了する。このときのシュート（ｌＯ
）下面とピン（２２）の状態を第５図に示す。Therefore, in this type of support mechanism, pins < 2
21 (22)... is below the chute (10) and when the chute (10) is moved up and down, the first
The lowering of the chute (10) is completed by allowing the pin (22) to fall down as shown in the figure. Shoot at this time (lO
) The state of the lower surface and the pin (22) is shown in FIG.

第６図、（ａ）（ｂ）はコイルバオ−ｆ２５ｉの伸張力
により、ワイヤ（２６）を引っ張ってピン先（２４）を
立たせる形態のバッファ・ツブピンであり、第７図（ａ
）（ｂ）は磁石（２８）と鉄（２９）の吸着力によりピ
ン先（２４）を立たせる方向に付勢する形態のバックア
ップビンであり、ピン先（２４）の底部がガイド部（２
７）によって保持されるようになっている。Figures 6, (a) and (b) show a buffer lug pin in which the wire (26) is pulled to make the pin tip (24) stand up using the stretching force of the coil bar f25i, and Figure 7 (a)
) (b) is a backup bottle in which the pin tip (24) is biased in the direction of standing up by the attraction force of the magnet (28) and iron (29), and the bottom of the pin tip (24) is attached to the guide part (2).
7).

ト）発明の効果以上述べた如く、本発明基板支持Ｖ＆楕では、バックア
ップビンを可倒式にしたので、電子部品装着装置や接着
剤塗布装置において、使用する基板中を変更して、基板
支持具がバ・ツクアップピン上に位置するようになって
もそのまま基板支持具の上下動が行え、基板中設定の簡
略化及び作業時間の短縮化が図れる。g) Effects of the invention As mentioned above, in the board support V&ellipse of the present invention, the backup bin is made collapsible, so the inside of the board used in the electronic component mounting device or adhesive coating device can be changed and the board support can be improved. Even when the tool is positioned on the back-up pin, the substrate support can be moved up and down as it is, which simplifies the setting in the board and shortens the working time.

[Brief explanation of drawings]

第１図は本発明基板支持機構を示す側面図、第２図、第
３図は可倒式バックアップピンの斜視図、第４図はシュ
ートの要部断面図、第５図はシュートの下降によりバッ
クアップビンが倒れる状態を示す要部断面図、第６図（
ａ）及び（ｂ）はバックアップビンの池の実施例を示す
要部切欠断面図、第７図（ａ）及び（ｂ）はバックアッ
プビンのさらに異なる実施例を示す斜視図、第８図は従
来の基板支持機構を示す側面図、第９図はシュートが上
昇した状態における基板支持機構の斜視図、第１０図は
シュートが下降しな状態における基板支持機構の斜視図
、第１１図は第１０図におけるＢ−Ｂ’断面図、第１２
図は従来のバックアップビンの斜視図である。（６）・・・ＸＹ子テーブル（７）　ｆ８　）・・・シ
ュート支持台、（９）　（１０）・・・シュート、ＣＩ
Ｉ）　（１２１・・・シュート昇降レバー、（１３）・
・連結棒、（１４）・・・シリンダ、（１５）（１５）
　（２２）　（２２）・・・バックアップビン、（１６
）　（１６＞・・・穴、ｆ１７）　（１８）・・・講、
（１９）・・・操ｆｉＥ棒、　（２０）・・・嵌め込み
部、（２１）　（２４）・・・ピン先、（２３）・・・
スプリング、（２５）・・・コイルバネ、（２６）・・
・ワイヤ、（２７）・・・ガイド部。第６図第７図（ｂン第８図第９図Fig. 1 is a side view showing the substrate support mechanism of the present invention, Figs. 2 and 3 are perspective views of the retractable backup pin, Fig. 4 is a sectional view of the main part of the chute, and Fig. 5 is a Figure 6 is a sectional view of the main parts showing the state in which the backup bin falls down (
a) and (b) are main part cutaway sectional views showing an embodiment of a backup bin pond, FIGS. 7(a) and (b) are perspective views showing further different embodiments of the backup bin, and FIG. 8 is a conventional one. 9 is a perspective view of the substrate support mechanism when the chute is raised, FIG. 10 is a perspective view of the substrate support mechanism when the chute is not lowered, and FIG. 11 is a perspective view of the substrate support mechanism when the chute is not lowered. BB' sectional view in the figure, 12th
The figure is a perspective view of a conventional backup bin. (6)...XY child table (7) f8)...Chute support stand, (9) (10)...Chute, CI
I) (121... Chute lift lever, (13)
・Connecting rod, (14)...Cylinder, (15) (15)
(22) (22)... Backup bin, (16
) (16>...hole, f17) (18)...ko,
(19)...Operation fiE rod, (20)...Inset part, (21) (24)...Pin tip, (23)...
Spring, (25)...Coil spring, (26)...
- Wire, (27)...Guide part. Figure 6 Figure 7 (Figure 8 Figure 9

Claims

[Claims]

(1) A table, a pair of substrate supports that are provided on the table so as to be movable toward and away from the table and support both ends of the substrate, an inclined surface formed on the lower surface of the support, and a pair of substrate supports that support both ends of the substrate; A substrate support mechanism comprising: an adjustment mechanism for adjusting an interval between supports; and a retractable backup pin provided on the table for backing up the back surface of the substrate.