JPH04159088A - Part mounting device - Google Patents

Abstract

PURPOSE:To prevent the warp of a substrate by providing a head with a substrate support pin chuck, locating a support pin containing base and a support pin support base to the vicinity of the substrate support pin chuck, and controlling operation of each part through a control mechanism. CONSTITUTION:A substrate support pin chuck 17 is lowered to grasp a substrate support pin 8 in a waiting state at a support pin containing base 12 and move the substrate support pin to the given position of a support base 13. The grasped substrate support pin 8 is placed in a position on the support pin support base 13. Thus, the substrate support pin 8 is automatically arranged in a spot where the warp of a substrate can be prevented from occurring, and the warp of the substrate can be prevented from occurring. Further, a limit on the size of a working substrate can be relaxed, production is improved, and erroneous setting of the substrate support pin 8 is prevented from occurring.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a device for mounting components such as electronic components.

"Prior Art" Conventionally, a component mounting device provided with a board support device has been used. This component mounting device operates in two directions (hereinafter referred to as "board guide bars") along the board surface of a printed circuit board (hereinafter simply referred to as "board") placed on a pair of work guide bars (board guide bars) that are provided on the same plane so as to be able to approach and separate from each other. By moving the head that holds the component in the X-axis direction and the Y-axis direction, the head and the component numbering part of the board are aligned relative to each other, and the head is moved to the board surface of the board. Components are attached by raising and lowering them in a direction perpendicular to the Z-axis direction (hereinafter referred to as the Z-axis direction). In addition, a support bin is fixed at the center between the pair of work guide bars when the mutual distance between the pairs of work guide bars is at its maximum, and is located below the board and supports the center or near the center of the board. It is set in the state. When mounting boards of various sizes using the board support device of the device, the distance between the pair of work guide bars is adjusted by moving the work kite bar according to the size of the boards. was adjusted, the substrate was kited by these pair of work guide bars, and this substrate was supported by the support pins.

However, in such conventional parts mounting devices,
Because the support bin position was fixed, depending on the size of the board, the support pin may not be located in the center between the pair of work guide bars, and the support pin may be biased toward one work guide bar. The problem is that the support pins cannot be supported, and as a result, various substrates warp in different ways, and the size of the substrates that can be used is severely limited.

Therefore, a predetermined location on the bottom surface of the board is supported by a plurality of board support bins from the bottom of the board, and parts are attached to the board by moving the head up and down in the Z-axis direction.
In high-mix, low-volume production, each time the type of board is changed,
Depending on the size of the board, the board support bins are manually replaced in the holes drilled in the bin support member at the bottom of the area where board support is required, and board support bins are set, and these board support bins are used to hold the board. It was supported from below.

``Invention or Problem to be Solved'' However, in such conventional parts mounting devices,
Every time the type of board used changes, the position of the board support bin has to be manually reset, which requires time and effort to change the setup due to a change in the type of board. As a result, the substrate support bins are easily set incorrectly, which may cause the substrate to warp and reduce productivity.

The present invention was developed in view of the above circumstances, and is capable of preventing board warpage and easing restrictions on the size of boards to be used, improving productivity, and preventing incorrect settings of board support bins. It is an object of the present invention to provide a component mounting device that can prevent this.

"Means for Solving the Problems" The present invention has the following configuration in order to achieve the above object. That is, in a component mounting device that has a moving mechanism that moves a head capable of detachably holding a component, and transports and attaches the held component to a preset mounting portion provided on a board, a substrate support pin chuck provided on the head so as to be movable up and down by a vertical movement mechanism; a support bin storage base provided in the vicinity of the substrate support pin chuck for holding a substrate support bin in an upright position; and the support bin. a support bin support base that is provided near the storage base and allows the substrate support bin to be installed in an upright position at a predetermined location; and a support bin support base that controls the operation of each part for installing the substrate support bin on the support pin storage base and the support bin support base. It is assumed that the system consists of a control mechanism that

"Operation" According to the above configuration, the substrate support pin chuck descends, grips the substrate support bin in a standby state on the support bin storage base, moves to a predetermined position on the support bin support base, and moves the substrate support bin to a predetermined position on the support bin support base. Place the gripped substrate support bottle in a predetermined position. Therefore, it is possible to prevent the board from warping by automatically arranging the board support bin at a location where it is possible to prevent the warping of the board, and to ease restrictions on the size of the board to be used, improving productivity. Prevents incorrect settings of the board support bin from occurring.

"Embodiment" An embodiment of the present invention will be described below with reference to FIGS. 1 to 6. Figure 1 is a perspective view of the parts mounting device, in which 1 is a base, 2 is a controller that controls the operation of each part, and 3 is a controller installed on the base 1 to hold parts (chips). A head that moves in the arrow XYZ directions shown in the same figure, 4 a tape feeder for feeding chips to the spatula 3, 5 a chuck upper and lower cylinder provided on the spatula 3, 6 an arrow Y shown in the same figure 1 A conveyor 7 conveys substrates (not shown) horizontally held between a pair of work guide bars (not shown) whose mutual spacing can be adjusted in the direction of the arrow X shown in FIG. 9 is an operation panel, and 10 is an XY robot.

Next, the substrate support device 7 will be explained with reference to FIGS. 2 and 3. The board support device 7 includes a frame 11 provided on the base 1, a support pin storage base 12 consisting of a U-shaped stand provided on the frame 11, and a support pin storage base 12 provided adjacent to the support pin storage base 12. It consists of a support pin support base 13. The support pin support base 13 is made up of a support pin vertical movement printer 14 mounted on the frame 11 and a base 15. The board support pin 8 includes a pin base 8a, a pin 8b fixed upwardly of the pin base 8a perpendicular to the lower surface of the bottle base 8a, and a pin 8b fixed perpendicularly to the lower surface of the bottle base 8a.
and a positioning pin 8C coaxially fixed downwardly of the pin base 8a. The upper plate of the support pin storage base 12 and the support pin support base 13 each have pin holes positioned at the intersections of the vertical and horizontal lines of the grid shown in FIG. 3, into which the positioning pins 8C are slidably fitted. 12a
, 13a are formed. Note that the bottle hole 13a marked with * shown in Fig. 3 is the origin of the coordinates ○, and the X shown in Fig. 3 is
Coordinates and X coordinates are determined.

On the other hand, the head 3 consists of a head portion 3a and a nozzle 3b provided at the bottom thereof, and a chuck opening/closing/linter 16 is attached to the lower end of the piston rod 5a of the chuck upper/lower/linter 5 provided on the head 3. . This chuck opening/closing/linter 16 is provided with a substrate support pin chuck 17 in a hanging shape. The substrate support pin chuck 17 is movable together with the head 3 in the X and Y directions shown in FIG.

Note that the board support pins 8 (total number m) are already arranged on the support pin storage base 12 in the initial state of component mounting. The positions of the board support pins 8 at this time are stored in the storage device 22 shown in FIG. 4 as a board support pin storage position table shown in Table 1. In addition, mounting components on the board (
During component mounting), the positions of the board support pins 8 are determined for each mounting program, and are stored in the storage device 22 as a board support pin position table shown in Table 2.

Note that the number of substrate support pins used is n (05 m).

Table 1 Board support pin storage position table Table 2 Board support pin position table Next, the control configuration will be explained.

FIG. 4 is a block diagram showing the control configuration of the component mounting device. The controller 2 includes a component mounting device control section 21, a storage device 22 connected to the component mounting device control section 21,
It has an X-Y Roho control unit 23, an I10 control unit 24,
An operation panel 9 is connected to the component mounting device control section 21 .

Board support pin data (described later) created by the operation panel 9 is stored in the storage device 22 via the component mounting device control section 21.
is memorized. Further, the X-Y robot control section 23°I10 control section 24 is controlled by the component mounting device control section 21. Mo and X-Y.

The X-Y robot 10 is controlled by the hot control section 23, and the head section 3a, the vertical movement cylinder 14 of the substrate support pin 8, and the chuck opening/closing cylinder 1 are controlled by the l/○ control section 24.
6. The chuck upper and lower cylinders 5 are controlled.

Next, the control (processing) procedures of various parts of the apparatus will be explained using the PAD shown in FIG.

S (Step) 1: Read the required number n of substrate support bins from the substrate support pin position table.

S2: Attach the board support pins 8 from the 1st grain to the nth grain to the position of the one board support pin read in Sl on the support pin support base 13 of the board support device 7 (the pin hole 12a of the support pin support base 13 Push positioning pin 8C into.

).

To perform this task, S3. The first board support pin storage positions xs(i) and ys(i) for supporting the board are read from the board support pin storage position table.

S4: Move 3 to above the first board support pin storage position xs(+), ys(+) read in S3.

S5. The chuck opening/closing cylinder 16 is operated to open the substrate support pin chuck 17, and the chuck up/down/linda 5 is operated to lower the substrate support pin chuck 17.

S6: Operate the chuck opening/closing cylinder 16 to leave the substrate support pin chuck 17 idle, and
), and operate the chuck up/down/linda 5 to raise the substrate support pin chuck 17.

87. 1st board support pin position xp(i), 3'p(
1) is read from the board support pin position table.

S8: i-th board support pin position xp read in S7
(+), move head 3 above yp(+).

S9 Operate the chuck upper and lower 7 linter 5 to lower the substrate support pin chuck 17, and insert the lower positioning pin 8 of the substrate support pin 8 into the bottle hole 13a at the xp (+), yp (1) position.
c, and operate the chuck opening/closing cylinder 16 to open the substrate support pin chuck 17.

The SIO substrate support pin chuck 17 is raised to complete the attachment of the required substrate support pins 8 to the support pin support base 13.

When the work of attaching the parts to the board is completed, each board support pin installed on the support bin support base 13 is moved by the control roller 2. Head 3. Chuck upper and lower cylinder 5. Said X-Y robot 10. Chuck opening/closing cylinder 16. Support bottle support base 1 by substrate support pin chuck 17 etc.
3, the board support pins 8 are transferred and installed at a predetermined location on the support pin storage base 13. During this movement, use the substrate support pinchers 17. The substrate support pin 8 held by the substrate support pin chuck 17 moves on a trajectory that avoids the substrate support pins 8 installed on the support pin support base 13 and the support pin storage base 12 so as not to touch the substrate support pins 8 installed on the support pin support base 13 and the support pin storage base 12. move through.

As described above, according to this embodiment, since the position of the board support pin 8 can be moved by the X-Y loft IQ, (1) the board is automatically supported at a location where the occurrence of warpage of the board can be prevented; By arranging the pins 8, warping of the board can be prevented and restrictions on the size of the board to be used can be relaxed.

(2) Setting of the board support pins 8 during setup can be automated.

(3) Since the board support position and the number of board support pins are memorized for each program, it is possible to prevent incorrect placement (attachment) of the board support pins 8, which may occur if done manually.

(4) Since the board support pins 8 are attached to the support bin support base 13 by the X-Y Roposo 1-10 which operates at high speed, the time required to set the board support pins can be shortened.

In the embodiment described above, the positioning pin 8C provided on the pin base 8a is attached to the support pin storage base 12. Whether the substrate support pins 8 are installed in the support pin storage base 12 or the support bottle support base 13 by fitting them into the respective pin holes 12a and 13a of the support bottle support base 13, or the positioning pins 8 and pin holes 13a are Not provided, pin base 8
If a is a magnet with appropriate magnetic force, the support pin storage base 12. The board support pin 8 can be installed at any location on the support pin support heath 13.

Further, in each of the above embodiments, the position of the board support pin 8 in the board support bin position table is set by inputting from the operation panel 9, but the present invention is not limited to this. The position setting of 8 uses the component mounting position data on the back side of the board on the support pin support base 13 (the surface that the board support pin 8 contacts) to connect the part on the back side of the board where no components are mounted to the controller. The substrate support bin position table may be automatically set based on the detection signal detected by a detector (not shown). Further, it is preferable that the number of substrate support pins used in this case is automatically determined based on the size of the substrate. In this way, it becomes possible to automate the component mounting device without requiring manual labor.

Effects of the Invention-1 According to the present invention, a board support pinch is provided at the bottom, a support bin storage base and a support bin support base are provided in the vicinity of the board support pinch, and the operation of each part is controlled. (1) It is possible to prevent warping of the board by automatically placing the board support pins in locations where warping of the board can be prevented, and the size of the board used can be controlled. It is possible to relax the restrictions.

(2) Setting of board support pins during setup can be automated.

(3) Since the board support position and the number of board support pins are memorized for each program, it is possible to prevent incorrect placement (attachment) of board support pins that may occur if done manually.

(4) Since the substrate support pins are attached to the support bin support base by an X-Y rotor that operates at high speed, the time required to set the substrate support pins can be shortened, and productivity is improved.

[Brief explanation of drawings]

1 to 5 show one embodiment of the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a front view of the substrate support device, and FIG. 3 is an illustration showing the arrangement of substrate support pins. FIG. 4 is a block diagram, and FIG. 5 is a PAD diagram showing a control processing procedure for each part of the apparatus. 1...Base, 2...Controller, 3
...Head, 5...Chuck upper and lower cylinders, 10...X/Y robot, 12...
Support pin storage base, 13...Support pin support base, 17...Substrate support pin chuck.

Claims (1)

[Scope of Claims] A component mounting device that has a moving mechanism that moves a head that can detachably hold a component, and that transports and mounts the component held by the head to a preset mounting portion provided on a board. A substrate support pin chuck provided on the head so as to be movable up and down by a vertical movement mechanism; a support pin storage base provided in the vicinity of the substrate support pin chuck to hold substrate support pins upright; A support pin support base provided near the support pin storage base and capable of installing the board support pins in an upright position at a predetermined location; and operations of each part for installing the board support pins in the support pin storage base and the support pin support base. A component mounting device characterized by comprising a control mechanism that controls.