JPH1051197A - Electronic component mounting apparatus and method for setting board support pin for electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which easily and quickly sets double-sided mounting board support pins and a method for setting the board support pins for the electronic component mounting apparatus. SOLUTION: A board 1 is mounted on the support bodies 5 and 7 of a supporting means 3. Electronic components are mounted on the top plane of the board 1. A perforated board 10 is mounted on the support bodies 5 and 7, and support pins 12 are inserted into the holes 11 of the perforated board 10. The perforated board 10 is a transparent acrylic board, and the support pins 12 are inserted at the positions where the pins do not touch the electronic components by seeing from above through the board 1. Then, a support board 13 is mounted on the top plane of the perforated board 10 to prevent the support pins 12 from removing. When the support pins 12 are inserted into the perforated board 10, a support unit provided by integrating the perforated board 10, support pins and the support board 13 is removed from the supporting means 3 and is set at the board positioning part of an electronic component mounting apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and a method of setting a support pin under a board in the electronic component mounting apparatus.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus for mounting an electronic component on a substrate, if the substrate is bent, the electronic component cannot be mounted on the substrate correctly. To a horizontal position.

In the case of a double-sided mounting substrate on which electronic components are mounted on the upper and lower surfaces of the substrate, after mounting the electronic components on one surface of the substrate, the substrate is turned upside down and the electronic components are mounted on the other surface. However, in this case, the support pins must be arranged so as not to hit the electronic components mounted on the lower surface of the substrate.

[0004] As a jig for arranging the support pins for supporting such a double-sided mounting board, one described in Japanese Patent Application Laid-Open No. 5-206699 is known. This uses a plate in which a large number of pins are formed in a matrix. Then, a pin is inserted into a position where the operator does not seem to hit the electronic component, and the pin is set on the board positioning portion of the electronic component mounting apparatus.

[0005]

However, according to the above-mentioned conventional method, when the plate is set on the board positioning portion of the electronic component mounting apparatus and the board is positioned, the lower receiving pins, which are considered not to hit the electronic component, are actually placed. Often hit electronic components. Therefore, the above-mentioned setting work must be repeated through trial and error until all the support pins do not hit the electronic components, so that there is a problem that the labor burden on the operator is large and a large amount of time is required. Was.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electronic component mounting apparatus and a method of setting a board supporting pin in an electronic component mounting apparatus which can easily and quickly set an underpin.

[0007]

According to the first aspect of the present invention, a lower receiving unit for supporting a substrate from below includes a perforated plate that can be seen through, and a plurality of lower receiving pins inserted into the perforated plate. There is provided a lower support pin drop-off preventing means for preventing the lower support unit from falling off from the board, and the lower support unit is detachably set to a setting portion of the electronic component mounting apparatus.

According to a second aspect of the present invention, there is provided a step of holding a substrate by holding means with the electronic component mounting surface facing upward, mounting a see-through perforated plate above the substrate held by the holding means, Inserting a plurality of support pins into the perforated plate while seeing through the perforated plate from above so as not to hit the electronic components mounted on the component mounting surface; separating the perforated plate from the holding means; And turning the board upside down so that the lower receiving pins are directed upward and mounted on the board positioning portion of the electronic component mounting apparatus.

[0009]

According to the first and second aspects of the present invention, while using a substrate on which electronic components have already been mounted on one surface, a large number of underpins can be accurately and quickly applied to locations where they do not contact the electronic components. Can be set to

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. 2, 3, 4, 5, 6, 7, 8, 9, and 10 are process diagrams of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention. Here, the operation until the lower receiving pin is set to the board positioning portion of the electronic component mounting apparatus is shown in the order of steps.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a pair of rail-shaped guide bodies 26 for transporting the substrate 1 and clamping and positioning the substrate 1 are provided at the center of the upper surface of the base 30. On both sides of the upper surface of the base 30, a large number of parts feeders 31 provided with electronic components are arranged side by side. Base 30
Y tables 32A and 32B are erected on both sides of the X-axis, and an X table 33 is erected on the Y tables 32A and 32B. A transfer head 34 is mounted on the X table 33. X table 33 and Y table 32A,
When the drive 32B is driven, the transfer head 34 moves horizontally in the X and Y directions. The transfer head 34 is the parts feeder 31
The electronic component provided on the substrate 35 is picked up by vacuum suction at the lower end of the nozzle 35, and transferred and mounted at a predetermined coordinate position on the substrate 1. The substrate 1 is provided with the lower receiving pins 12 of the lower receiving unit 14.
Is supported from below. Next, a jig for setting the lower support pin and a method of setting the jig will be described with reference to FIGS.

In FIG. 2, a large number of electronic components 2 are mounted on one surface of a substrate 1. Numeral 3 denotes holding means for the substrate 1, which comprises a bottom plate 4, a support 5 standing on one side of the bottom plate 4, and two supports 6, 7 standing on the other side. The support 5 has a first support portion 5a for supporting an end portion of the substrate 1 and a second support portion 5b for supporting an end portion of a perforated plate (to be described later) 10. It is formed as a key-shaped shoulder. On the upper part of the support 6, a support part 6b for supporting the end of the perforated plate 10 is formed. The support 7 is inside the support 6 and has a lower height than the supports 5 and 6, and the support portion 7a for supporting the end of the substrate 1 is formed in a key shape. Further, the support 7 is provided with a bottom plate 4 so as to correspond to the width of the substrate 1.
The upper part can be adjusted horizontally.

First, as shown in FIG. 2, the surface on which the electronic component 2 is already mounted (the electronic component mounting surface) is the upper surface, and the substrate 1 is supported by the support portions 5a and 7a of the supports 5 and 7 in a horizontal posture. Let it. Since the substrate 1 serves as a master substrate for determining the positions of the support pins, it is desirable to select a substrate having a good mounting state.

Next, as shown in FIG. 3, the perforated plate 10 is placed in a horizontal posture on the supporting portions 5b and 6b above the substrate 1.
The perforated plate 10 has a large number of holes 11 formed in a matrix. The perforated plate 10 is made of a material such as a transparent acrylic plate that allows the substrate 1 and the electronic component 2 to be seen from above.

Next, as shown in FIG. 4, the lower receiving pins 12 are inserted into the holes 11 of the perforated plate 10. In this case, the lower support pins 12 are inserted into appropriate holes while the electronic component 2 is viewed through the transparent perforated plate 10 from above so that the lower support pins 12 do not hit the electronic components 2 mounted on the substrate 1. It is inserted into the part 11.

After the sufficient number of support pins 12 for supporting the substrate 1 have been inserted, the support plate 13 is mounted on the surface of the perforated plate 10 as shown in FIG. This support plate 13
Is a means for preventing the support pins 12 from falling off the perforated plate 10 even when the perforated plate 10 is turned upside down (described later).

Next, as shown in FIG. 6, the lower receiving unit 14 in which the perforated plate 10 in which the lower receiving pins 12 are inserted and the lower receiving plate 13 are integrated is taken out from the holding means 3, and the substrate 1 is also taken out. . Next, the lower receiving unit 14 is turned upside down (FIG. 7), and the lower receiving pin 12 is turned upward.

Next, the lower receiving unit 14 is removably set in a horizontal position on the lower receiving unit setting section 20 provided in the board positioning section of the electronic component mounting apparatus (FIG. 8). The setting unit 20 includes a bottom 21, support stands 22 and 23 erected on both sides of the bottom 21, and a lifting unit 24 that supports the bottom 21 from below. Elevating unit 24 of this example
Is a cylinder, and its base moves up and down as its rod moves up and down. Reference numeral 26 denotes a guide body provided on both upper sides of the setting section 20. A belt 27 of a belt conveyor is provided inside the guide body 26, and a pressing plate 28 is provided on the upper surface thereof.

Next, as shown in FIG.
6 slides inward, and guide body 26 and guide body 2
The interval of 6 is adjusted to the width of the substrate 1 (FIG. 9). The means for shifting the width of the guide body 26 is well known.

Next, as shown in FIG.
After being conveyed onto the guide 7 and positioned between the guides 26, the rod 25 of the elevating unit 24 is protruded to raise the bottom 21. Then, the lower receiving unit 14 also moves up, supports the substrate 1 from below with the lower receiving pins 12, corrects the deflection of the substrate 1, and brings the substrate 1 to a completely horizontal posture. As described with reference to FIG. 4, the lower receiving pin 12 is inserted at a position that does not hit the electronic component 2.

The substrate 1 has a surface on which the electronic components 2 are mounted as a lower surface, and a surface on which the electronic components 2 are not mounted as an upper surface. The electronic components 2 are mounted on the upper surface by the transfer head 34. You. When the mounting of the electronic component 2 on the upper surface of the substrate 1 is completed, the rod 25 of the elevating unit 24 is pulled out, the lower receiving unit 14 is lowered, and the supporting state of the substrate 1 by the lower receiving pins 12 is released. Then, the substrate 1 is transported to the next step by the belt 27. Next, the next substrate 1 is transported above the lower receiving unit 14, and the above-described operation is repeated.

The present invention is not limited to the above-described embodiment. For example, as the means for preventing the lower receiving pin 12 from falling off the perforated plate 10, the lower receiving plate 1 is used.
The support pins may be held on the perforated plate 10 by other means such as a magnet means, for example.

[0023]

According to the present invention, it is possible to accurately and quickly set a large number of underpins at places where they do not hit the electronic components, while using the substrate on which the electronic components are already mounted on one surface.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a process diagram of a method for setting a support pin for a double-sided mounting board according to an embodiment of the present invention;

FIG. 3 is a process chart of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

FIG. 4 is a process chart of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

FIG. 5 is a process diagram of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

FIG. 6 is a process diagram of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

FIG. 7 is a process chart of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

FIG. 8 is a process diagram of a method for setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

FIG. 9 is a process chart of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

FIG. 10 is a process chart of a method of setting a support pin for a double-sided mounting board according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electronic component 3 Holding means 4 Bottom plate 5,6,7 Support body 10 Perforated plate 11 Hole 13 Lower support plate 14 Lower support unit 20 Set part 24 Elevating part 26 Guide body 31 Parts feeder 34 Transfer head

Claims (2)

[Claims] An electronic device in which a substrate on which electronic components are mounted on both sides is supported by a lower receiving unit from below, and an electronic component provided in a parts feeder is picked up by a transfer head and transferred and mounted on the substrate. The component mounting apparatus, wherein the lower receiving unit is a transparent perforated plate and a plurality of lower receiving pins for preventing a plurality of lower receiving pins inserted into the perforated plate from falling off the perforated plate. An electronic component mounting apparatus, comprising: a prevention unit; and a detachable set of the lower receiving unit in a setting portion of the electronic component mounting apparatus. 2. An electronic device wherein a substrate on which electronic components are mounted on both sides is supported from below by supporting pins, and an electronic component provided on a parts feeder is picked up by a transfer head and transferred and mounted on the substrate. A method of setting a board support pin in a component mounting apparatus, the method comprising: holding a board with an electronic component mounting surface on an upper surface by holding means; and mounting a transparent perforated plate above the board held by the holding means. And inserting a plurality of lower receiving pins into the perforated plate while seeing through the perforated plate from above so as not to hit the electronic component mounted on the electronic component mounting surface; And mounting the electronic component mounting apparatus on a substrate positioning portion of the electronic component mounting apparatus by turning the perforated plate upside down and turning the support pins upward. How to set the support pins under the board.