JP2008021823A - Manufacturing equipment and method of substrate backing-up apparatus, and substrate backing-up apparatus manufactured by same method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing equipment and a method of a substrate backing-up apparatus whereby backing-up pins set in the outside of the apparatus can be set in the inside of the apparatus as they are, and the substrate backing-up apparatus manufactured by the manufacturing method. <P>SOLUTION: The manufacturing equipment of the substrate backing-up apparatus is constituted of a jig main body for positioning in its predetermined location a substrate having no mounted electronic component, a mountable transparent plate 22 on the jig main body and above the substrate wherein pin attaching holes are formed, backing-up pins 23 to be inserted into the pin attaching holes of the transparent plate, and an attachable backing-up base 21 to an electronic-component mounting apparatus which is so coupled to the transparent plate that an end of each backing-up pin abuts on it. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a manufacturing apparatus and a manufacturing method for a board backup apparatus used in an electronic component mounting apparatus for mounting an electronic component on a substrate such as a circuit board, and a board backup apparatus manufactured by the manufacturing method.

  In an electronic component mounting apparatus that mounts electronic components on a substrate such as a circuit board, the back side of the substrate is supported by a plurality of backup pins so that the substrate does not warp when the electronic component is mounted. In this type of electronic component mounting apparatus, there is a case where the electronic component is mounted on the front surface side of the substrate while the electronic component is already mounted on the back surface side of the substrate. Under these conditions, if the backup pin is set in the electronic component mounting apparatus, the position where the backup pin is set by the board becomes a blind spot, so the workability of the setup change is poor, and the setup change takes a lot of time. There was a problem that needed.

  As a technique for solving such a problem, for example, Patent Document 1 describes a technique that enables a position for setting a backup pin to be determined outside the apparatus. That is, in the device described in Patent Document 1, the transparent backup base (41) is positioned and fixed above the printed circuit board (8) positioned on the jig body (31), and is provided on the backup base (41). Insert a plurality of backup pins (26) into the mounting hole (43) while confirming the electronic component (51) mounted on the back surface of the printed circuit board (8), and in that state, form a transparent plate (45) on it. The mounting hole (47) of the transparent plate (45) that is positioned and placed on the backup base (41) so that the backup pin (26) is fitted in the mounting hole (47), and the backup pin (26) is inserted therethrough. A mark is added around the.

  Thereafter, the backup pin (26) is removed from the mounting hole (47) of the transparent plate (45), the transparent plate (45) is removed from the jig body (31), and only the transparent plate (45) is turned upside down. The electronic component mounting apparatus is positioned on the backup base (17).

According to the technique described in Patent Document 1, a plurality of backup pins (26) can be inserted into the mounting hole (43) of the backup base (41) outside the machine, and the time required for the setup change can be shortened. There are advantages.
JP 2005-268314 A (paragraphs 0036-0041, FIG. 6, FIG. 11)

  However, in the thing of patent document 1, the backup pin (26) inserted in the backup base (41) is removed after attaching a mark to the attachment hole (47) of a transparent plate (45), and backup is carried out. Since only the transparent plate (45) from which the pin (26) has been removed is positioned and placed on the backup base (17) of the electronic component mounting apparatus, the backup pin (26) is marked again in the machine. It is necessary to set it in the mounting hole (47) of the transparent plate (45) to which the mark is attached. For this reason, it takes a lot of time to change the backup device, resulting in a decrease in the machine operating rate. It was.

  The present invention has been made in order to solve the above-described conventional problems, and a substrate backup device manufacturing apparatus and manufacturing method, and a substrate manufactured by the manufacturing method, in which a backup pin set outside the apparatus can be set in the apparatus as it is. An object of the present invention is to provide a backup device.

  In order to solve the above-described problem, a feature of the invention according to claim 1 is that a jig body for positioning a board before mounting an electronic component at a predetermined position, and a pin mounting hole that can be mounted on the jig body above the board. A transparent plate formed in the transparent plate, a backup pin inserted into a pin mounting hole of the transparent plate, a backup base that can be attached to an electronic component mounting apparatus and is coupled to the transparent plate so as to abut one end of the backup pin; It is configured by.

  The invention according to claim 2 is characterized in that, in claim 1, the transparent plate and the backup base are each composed of a plurality of divided transparent plates and a plurality of divided backup bases each having a predetermined unit width, and the size of the substrate. A required number of divided transparent plates corresponding to the above are combined and mounted on the jig main body, and these divided transparent plates are combined by the divided backup base.

  According to a third aspect of the present invention, in the second aspect, the plurality of divided backup bases and the plurality of divided transparent plates include a plurality of divided backup bases and a plurality of divided transparent plates having the same width, the divided backup bases, and It consists of at least one divided backup base and a divided transparent plate having a width smaller than the width of the divided transparent plate.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the transparent plate is held so as to be position-adjustable with respect to the jig body, and the transparent plate is attached to the backup pin. It is possible to connect to the backup base at an arbitrary position according to the set position.

  According to a fifth aspect of the present invention, in any one of the first to third aspects, the end surface of the backup pin that comes into contact with the jig body is eccentric with respect to the axis of the backup pin. The eccentric shaft portion is provided, and the position of the eccentric shaft portion can be adjusted by the rotation of the backup pin with respect to the transparent plate.

  According to a sixth aspect of the present invention, in any one of the first to fifth aspects, an elastic ring is attached to an outer periphery of the backup pin, and the elastic ring is attached to the pin mounting hole of the transparent plate. And the backup pin is held on the transparent plate.

  A feature of the invention according to claim 7 is that the substrate before electronic component mounting is positioned at a predetermined position on the jig body, and a transparent plate in which pin mounting holes are formed above the substrate is mounted on the jig body. A backup pin whose one end is in contact with the surface of the substrate is inserted into the pin mounting hole of the plate, and then a backup base that can be mounted on the electronic component mounting apparatus is coupled to the transparent plate, and the backup pin is connected to the backup base. The other end is brought into contact, and then the transparent plate into which the backup pin is inserted and the backup base are removed from the jig body.

  The invention according to claim 8 is characterized in that, in claim 7, the transparent plate and the backup base are each composed of a plurality of divided backup bases and a plurality of divided transparent plates each having a predetermined unit width. A plurality of divided transparent plates are mounted according to the size of the substrate, and the same number of divided backup bases are coupled to these divided transparent plates.

  According to a ninth aspect of the invention, there is provided a backup base that can be attached to an electronic component mounting apparatus, and a plurality of holding bases that are held at required arrangement positions according to the positions of the electronic components mounted on the surface of the substrate. The backup base is configured by a plurality of divided backup bases having a predetermined unit width, and the backup base is configured by combining a required number of the divided backup bases according to the size of the substrate. .

  A feature of the invention according to claim 10 is that, in claim 9, backup plates having the same height as the backup pins are held on both sides of the backup base.

  According to an eleventh aspect of the present invention, there is provided a backup base that can be attached to an electronic component mounting apparatus, a transparent plate that is formed with a plurality of pin attachment holes and coupled to the backup base, and an electronic component that is mounted on the surface of the substrate. Backup pins inserted into a plurality of pin mounting holes of the transparent plate according to the position of the transparent plate, the backup base and the transparent plate are constituted by a plurality of divided backup bases and a divided transparent plate having a predetermined unit width, The backup base and the transparent plate are configured by combining the required number of the divided backup base and the divided transparent plate according to the size of the substrate.

  According to the invention according to claim 1 configured as described above, a jig main body for positioning a substrate before mounting an electronic component at a predetermined position, and a transparent plate that can be mounted on the jig main body above the substrate and has pin mounting holes formed And a backup base inserted into the pin mounting hole of the transparent plate, and a backup base that can be attached to the electronic component mounting apparatus and is joined to the transparent plate so as to abut the joining end surface of the backup pin. Above, it is possible to easily obtain a manufacturing apparatus for manufacturing a substrate backup device composed of a transparent plate with a backup pin and a backup base, and the backup pin set outside the machine can be directly mounted on the electronic component mounting apparatus. It becomes like this. Thereby, the machine stop time accompanying replacement | exchange of a backup apparatus can be suppressed to the minimum, and a machine operation rate can be improved.

  According to the invention of claim 2 configured as described above, the transparent plate and the backup base are each composed of a plurality of divided transparent plates and a plurality of divided backup bases each having a predetermined unit width, and according to the size of the substrate. Since the backup device is manufactured with the required number of divided transparent plates and divided backup bases, transparent plates and backup bases corresponding to multiple types of substrates with different substrate dimensions can be easily realized. It can be easily manufactured in a backup device corresponding to the substrate.

  According to the invention according to claim 3 configured as described above, the plurality of divided backup bases and the plurality of divided transparent plates include a plurality of divided backup bases and a plurality of divided transparent plates having the same width, and a width smaller than that. Since it consists of at least one split backup base and split transparent plate, the small backup backup base and split transparent plate can complement the free space of the board, and the backup base that matches the size of the board and A transparent plate can be easily constructed.

  According to the invention according to claim 4 configured as described above, the transparent plate is held so that the position of the transparent plate can be adjusted, and the transparent plate can be used as a backup base at an arbitrary position according to the set position of the backup pin. Since it can be coupled, the degree of freedom of the position where the backup pin can be set can be greatly increased as compared with the case where the transparent plate is fixed.

  According to the invention according to claim 5 configured as described above, an eccentric shaft portion that is eccentric with respect to the axis of the backup pin is provided on the end surface of the backup pin that comes into contact with the jig body, and the The position of the eccentric shaft can be adjusted by rotating the backup pin, so even if the backup pin cannot be raised concentrically with the backup pin, the backup pin can be adjusted by adjusting the position of the eccentric shaft by rotating the backup pin. It is possible to raise the degree of freedom of arrangement of the backup pins.

  According to the invention according to claim 6 configured as described above, an elastic ring is mounted on the outer periphery of the backup pin, and the elastic ring is fitted into the pin mounting hole of the transparent plate to hold the backup pin on the transparent plate. As a result, the backup pin can be securely held on the transparent plate, preventing the backup pin from coming out of the pin mounting hole even when the backup device is removed from the jig device and transferred to the electronic component mounting device. can do.

  According to the invention according to claim 7 configured as described above, the substrate is positioned on the jig body, the transparent plate is mounted, and the backup pin that contacts the surface of the substrate is inserted into the pin mounting hole of the transparent plate. After the backup base that can be attached to the electronic component mounting device is joined to the transparent plate, the transparent plate and the backup base are removed from the jig body. From the transparent plate and the backup base with the backup pin inserted on the jig body A simple manufacturing method for manufacturing the substrate backup device can be obtained, and the backup pins set outside the machine can be directly mounted on the electronic component mounting apparatus. Thereby, the machine stop time accompanying replacement | exchange of a backup apparatus can be suppressed to the minimum, and a machine operation rate can be improved.

  According to the invention according to claim 8 configured as described above, each of the transparent plate and the backup base is composed of a plurality of divided backup bases and a plurality of divided transparent plates each having a predetermined unit width. Since a plurality of divided transparent plates are mounted according to the size, and the same number of divided backup bases are coupled to these divided transparent plates, a backup device corresponding to a plurality of types of substrates having different substrate dimensions can be easily manufactured. be able to.

  According to the invention according to claim 9 configured as described above, the backup base that can be attached to the electronic component mounting apparatus includes a plurality of divided backup bases having a predetermined unit width, and the required number corresponding to the size of the board. Since the backup base is configured by combining the divided backup bases, it is possible to easily cope with a plurality of types of substrates having different substrate dimensions, and to simplify the configuration of the substrate backup device.

  According to the invention according to claim 10 configured as described above, the backup plate having the same height as the backup pin is held on both sides of the backup base. The board backup function can be enhanced.

  According to the invention according to claim 11 configured as described above, the backup base that can be attached to the electronic component mounting apparatus, the transparent plate in which a plurality of pin attachment holes are formed, and the backup pin that is inserted into the pin attachment holes. Since the backup base and transparent plate are configured by combining the required number of divided backup bases and divided transparent plates according to the size of the board, it can easily accommodate multiple types of substrates with different board dimensions, A substrate backup device that can securely hold the backup pin by the transparent plate can be obtained.

  Embodiments of the present invention will be described below with reference to the drawings with respect to an example of manufacturing a backup device applied to an electronic component mounting apparatus that mounts chip-shaped electronic components on a substrate.

  In FIG. 1, the component mounting position of the electronic component mounting apparatus 10 is provided with a substrate positioning device 12 that positions and clamps both ends of the substrate 11 carried into the electronic component mounting apparatus 10. And a clamper 14. When the substrate 11 is transported to the component mounting position by the pair of transport conveyors 15 arranged at a predetermined distance in the direction orthogonal to the transport direction of the substrate 11, and the substrate 11 is transported to the component mounting position. The clamper 14 is raised so that the substrate 11 is sandwiched between the clamper 14 and the stopper 13 and clamped at a predetermined position of the component mounting position. Note that the interval in the direction orthogonal to the substrate conveyance direction of the conveyance conveyor 15 and the substrate positioning device 12 can be adjusted according to the substrate dimension (width direction dimension) of the substrate 11 carried into the electronic component mounting apparatus 10. .

  In addition, a lift 18 that is moved up and down by a cylinder 17 is provided at a component mounting position of the electronic component mounting apparatus 10, and a backup device 20 corresponding to the type (size) of the substrate 11 can be replaced on the lift 18. It comes to be attached to. As will be described in detail later, the substrate backup device 20 has a backup base 21 that is positioned and fixed on the lift 18, a transparent plate 22 that is fixed to the backup base 21, and a pin mounting that is provided on the transparent plate 22, which will be described later. The plurality of backup pins 23 are provided on the backup base 21 so as to pass through the holes. The backup pin 23 is in contact with the lower surface of the substrate 11 and supports the substrate 11 so as not to bend when the electronic component is mounted.

  In addition, as the board | substrate 11 before the electronic component mounting conveyed to a component mounting position, the board | substrate 11 with which the electronic component 25 was not mounted in one surface, and the board | substrate 11 with which the electronic component 25 was mounted in one surface In the following description, an example in which the electronic component 25 is already mounted on one surface of the substrate 11 in the previous process will be described.

  Next, the configuration of the jig apparatus 30 for manufacturing the above-described substrate backup apparatus 20 outside the apparatus will be described with reference to FIGS. 2 and 3. In the following description, the left-right direction in FIG. 2 corresponding to the board conveyance direction in the electronic component mounting apparatus 10 is the X direction, and the front-rear direction orthogonal to the X direction is the Y direction.

  The jig device 30 includes a jig body 33 including a rectangular jig base 31 and a jig frame 32 supported by the jig base 31 so as to be opened and closed. The jig base 31 of the jig body 33 has a placement surface 31a for positioning and placing the substrate 11 to be backed up by the backup device 20, and the surface on which the electronic component 25 is mounted on the placement surface 31a is placed on the placement surface 31a. Is placed. A reference rail 31b is disposed along one side of the jig base 31, and a reference surface 11a formed at one end in the width direction (Y direction) of the substrate 11 is brought into contact with the reference rail 31b. Is positioned in the Y direction.

  As shown in FIG. 4, a pair of positioning members 34 and 35 that can be engaged with both ends in the front-rear direction (X direction) of the substrate 11 are guided to the reference rail 31b so as to be movable along the reference rail 31b. ing. A pair of pulleys (not shown) spaced in the moving direction of the positioning members 34 and 35 are supported on the reference rail 31b, and a belt 36 is stretched between these pulleys. One part (34) of a pair of positioning members 34, 35 is connected to a part of the belt 36 that moves in the left-right direction along the reference rail 31b via a connecting member 34a, and the other (35) is one part of the belt 36. It is connected to the other part of the belt 36 that always moves in the opposite direction to the part via a connecting member (not shown).

  As a result, the pair of positioning members 34 and 35 are moved in the opposite directions by the same amount due to the movement of the belt 36, and both sides of the substrate 11 are sandwiched between the pair of positioning members 34 and 35. Positioning (centering) is performed at the center position in the X direction.

  The jig frame 32 has a substantially frame shape including three frame portions 32 a to 32 c and a support shaft 32 d along the four sides of the jig base 31. Both ends of the support shaft 32d arranged along the Y direction are supported by a pair of support blocks 43 attached to the jig base 31 so that the jig frame 32 can be opened and closed around the support shaft 32d. ing. The first frame portion 32a facing the support shaft 32d in the Y direction is positioned at a position where the first frame portion 32a overlaps in parallel on the reference rail 31b of the jig base 31 as shown in FIG.

  A pair of positioning reference pins 45 and 46 for positioning the backup device 20 are attached to the first frame portion 32a of the jig frame 32 at a predetermined distance in the longitudinal direction (X direction) of the first frame portion 32a. Yes. In addition, a handle 47 for opening and closing the jig frame 32 is attached to the first frame portion 32a. By opening and closing the jig frame 32 by grasping the handle 47, the jig frame 32 stands up. The substrate setting position where the substrate 11 can be set on the jig base 31 (state shown in FIG. 2), and the horizontal position where the frame portions 32a to 32c of the jig frame 32 overlap horizontally on the jig base 31 (state shown in FIG. 3). And can be held at an arbitrary position upright by a link-type stand 44. In the following, a configuration in a state where the jig frame 32 is held in a horizontal position will be described.

  The second and third frame portions 32b and 32c that are coupled to both ends of the first frame portion 32a and the support shaft 32d of the jig frame 32 are made of a magnetic material, and the second and third frame portions. Positioning portions 51 and 52 for positioning the transparent plate 22 are provided at 32b and 32c. As shown in FIG. 6, each positioning portion 51, 52 is composed of a positioning hole 53 opened in the second and third frame portions 32 b, 32 c and a disk-shaped magnet body 54 that closes the positioning hole 53, The magnet body 54 is movably fixed on the second and third frame portions 32b and 32c by a magnetic force. A fitting hole 54 a having a smaller diameter than the positioning hole 53 is passed through the magnet body 54.

  As shown in FIGS. 5 and 8, the transparent plate 22 is configured by an acrylic plate that is formed by penetrating through a plurality of positions in the XY directions through circular pin mounting holes 55 for supporting backup pins. The transparent plate 22 is composed of a plurality of divided transparent plates 22A having a predetermined unit width B2 elongated in the X direction, and a required number of divided transparent plates 22A are arranged in accordance with the size (dimension in the width direction) of the substrate 11. Used in combination in the Y direction. For this reason, the positioning portions 51 and 52 provided in the second and third frame portions 32b and 32c are also spaced at an interval substantially corresponding to the unit width B2 of the divided transparent plate 22A, and the second and third frame portions 32b and 32c. A plurality of disc-like magnet bodies 54 similar to those described above are provided in the positioning portions 51 and 52 so as to block the positioning holes 53 (see FIG. 6). , 32c are fixed so as to be movable by magnetic force.

  As shown in FIG. 6, a metal cylindrical pedestal block 69 provided through the screw hole is engaged with the screw hole on the upper surface of both ends in the longitudinal direction (X direction) of each divided transparent plate 22 </ b> A. It is fixed by a fastening screw 70. In addition, positioning pins 57 that are fitted into the fitting holes 54a of the magnet body 54 without gaps are provided on the lower surfaces of both ends of the divided transparent plate 22A so as to protrude downward. The positioning pin 57 is formed integrally with the fastening screw 70. The positioning pin 57 passes through the fitting hole 54 a and is loosely fitted into the positioning holes 53 of the second and third frame portions 32 b and 32 c so that it can move by a predetermined amount in the positioning hole 53. As a result, the divided transparent plate 22A can be adjusted in the X and Y directions within a range in which the positioning pin 57 can move in the positioning hole 53. After the movement is adjusted, the divided transparent plate 22A can be freely moved by the magnet body 54 at an arbitrary position. The movement is restricted.

  As described above, when the substrate 11 is positioned on the jig base 31 and the required number of divided transparent plates 22A corresponding to the size (dimension in the width direction) of the substrate 11 is mounted on the jig frame 32, the division is performed. The transparent plate 22A is disposed above the substrate 11 at a height position that does not interfere with the electronic component 25. In this state, the backup pin 23 is vertically fitted into the plurality of pin mounting holes 55 of the divided transparent plate 22A and is erected. As shown in FIG. 7, the backup pin 23 is formed in a cylindrical shape in almost half of the axial direction opposite to the side supporting the substrate 11, and almost half in the axial direction on the side supporting the substrate 11 has a small diameter on the tip 23a. It is formed in a gentle truncated cone shape. An annular groove 23c is formed on the outer periphery of the substantially central portion in the axial direction of the backup pin 23 fitted in the pin mounting hole 55, and an O-ring 60 is fitted in the annular groove 23c. As shown in FIG. 8, the O-ring 60 is elastically engaged with the inner periphery of the pin mounting hole 55 so as to restrain the free movement of the backup pin 23 inserted in the pin mounting hole 55 in the axial direction. Yes.

  With the backup pin 23 inserted in the transparent plate 22 held on the jig frame 32, the transparent plate 22 is coupled to each other by the backup base 21 that can be attached to the electronic component mounting apparatus 10. As shown in FIG. 9, the backup base 21 includes a plurality of divided backup bases 21 </ b> A having a predetermined unit width B <b> 1 elongated in the X direction, like the divided transparent plate 22 </ b> A described above. Accordingly, the same number of divided backup bases 21A as the divided transparent plates 22A are used in combination in the Y direction above the divided transparent plates 22A.

  In this case, the unit width B1 in the Y direction of the divided backup base 21A is set slightly larger (B1> B2) than the unit width B2 of the divided transparent plate 22A, as is apparent from FIG. As a result, a gap is provided between the adjacent divided transparent plates 22A, and the above-described position adjustment of the divided transparent plate 22A is possible. Even if the position of the divided transparent plate 22A is adjusted, the divided transparent plate 22A is divided. The data can be stored in the area of the backup base 21A. Thereby, the position adjustment of the divided transparent plate 22A is allowed, and the divided transparent plate 22A can be coupled to the divided backup base 21A.

  As shown in FIG. 9, a pair of positioning reference holes 63 and 64 that can be engaged with the pair of positioning reference pins 45 and 46 of the jig frame 32 are formed in one of the plurality of divided backup bases 21A. Further, as shown in FIG. 10, a positioning key 65 is attached to the divided backup base 21A as a reference in which a pair of positioning reference holes 63 and 64 is formed, and one end of the positioning key 65 projects in the Y direction. It is installed. Each of the remaining divided backup bases 21A is provided with both a key slot 66 that engages with the positioning key 65 of the adjacent divided backup base 21A and a positioning key 65 that engages with the key slot 66 of the adjacent divided backup base 21A. It has been.

  Thus, when one divided backup base 21A in which the positioning reference holes 63 and 64 are formed is positioned in the XY direction by the positioning reference pins 45 and 46, the remaining divided backup bases 21A are used as reference divided backups. The X-direction relative movement is restricted by the positioning key 65 and the key slot 66 engaged with the positioning key 65 while being juxtaposed at a position where the base 21A is joined to the side surface 21Aa.

  At this time, in order to make the divided backup base 21A common, a pair of positioning reference holes 63 and 64 are formed in all the divided backup bases 21A, and both a positioning key 65 and a key slot 66 are provided. May be.

  As shown in FIG. 10, insertion holes 68 through which the threaded portions of the fastening bolts 67 are inserted are provided at both ends in the longitudinal direction (X direction) of the divided backup base 21A. The threaded portion of the tightening bolt 67 that passes through the insertion hole 68 is screw-engaged with the screw hole of the metal pedestal block 69 attached to the upper surface of both ends of the divided transparent plate 22A, and the divided transparent plate 22A is divided into the backup base. 21A can be integrally coupled.

  At this time, the insertion hole 68 of the divided backup base 21A is formed to have an inner diameter sufficiently larger than the outer diameter of the threaded portion of the tightening bolt 67, thereby allowing the position adjustment of the divided transparent plate 22A described above to be divided transparent. The plate 22A can be coupled to the divided backup base 21A. That is, relative to the divided backup base 21A positioned at a predetermined position of the jig frame 32 of the jig main body 33, the divided transparent plate 22A is relatively moved within a range in which the screw portion of the tightening bolt 67 can move in the insertion hole 68. In this state, the divided transparent plate 22A is integrally coupled to the divided backup base 21A by tightening the upper surface of the divided backup base 21A with the bottom surface of the head of the tightening bolt 67.

  In addition, a pair of magnet bodies 71 are embedded in the X direction in a predetermined amount on the upper surface (the lower surface when attached to the electronic component mounting apparatus 10) of each divided backup base 21A. These magnet bodies 71 fix the backup base 21 by magnetic force on the lifting platform 18 (see FIG. 1) made of a magnetic material provided at the component mounting position of the electronic component mounting apparatus 10. Thereby, the backup base 21 (divided backup base 21A) is positioned in the XY directions by fitting the positioning reference holes 63 and 64 to positioning reference pins (not shown) provided in the electronic component mounting apparatus 10, and It is fixed by the magnet body 71.

  Thus, by combining the plurality of divided backup bases 21A and the plurality of divided transparent plates 22A in accordance with the size of the substrate 11 (dimension in the width direction), a width dimension smaller than the dimension in the width direction of the substrate 11 is obtained. A backup device 20 including a backup base 21 and a transparent plate 22 is configured. As a result, when the backup device 20 is mounted at the component mounting position of the electronic component mounting device 10, the backup device 20 can be mounted without expanding the conveyor 15. It becomes possible to carry out in a short time and easily.

  By the way, when the dimension of the unit width B1 (B2) of the divided backup base 21A (divided transparent plate 22A) is set to be relatively large, the backup base corresponding to the dimension of the substrate 11 in the width direction depends on the dimension of the substrate 11 in the width direction. 21 (transparent plate 22) is difficult to manufacture, and an empty area that cannot be supported by the backup pin 23 may occur on one end side of the substrate 11 in the direction opposite to the reference surface 11a.

  For this purpose, the backup base 21 and the transparent plate 22 are composed of at least two types of divided backup bases 21A and divided transparent plates 22A having different unit widths. That is, as shown in FIGS. 9 and 11, the divided backup base 21A includes a plurality of first divided backup bases 21A having a predetermined unit width B1, and a unit width smaller than the unit width B1, for example, unit width B1. And a second divided backup base 21A1 having a unit width of about half of the unit width.

  Similarly, the divided transparent plate 22A includes a plurality of first divided transparent plates 22A having a predetermined unit width B2, and a unit width smaller than the unit width B2, for example, a unit width of about half of the unit width B2. 2 divided transparent plates 22A1.

  And, as shown in FIGS. 9 and 11, if necessary, by disposing the second divided backup base 21A1 and the second divided transparent plate 22A1, the above-mentioned empty area can be complemented, The backup base 21 and the transparent plate 22 corresponding to the width direction dimension of the substrate 11 can be configured.

  The second divided transparent plate 22A1 having a small unit width is positioned on the second and third frame portions 32b and 32c of the jig frame 32 by a method different from that of the first divided transparent plate 22A having the unit width B2. The In order to position the second divided transparent plate 22A1 having a small unit width, the second and third frame portions 32b and 32c are positioned close to the positioning portions 51 and 52 as shown in FIGS. Engagement grooves 32b1 and 32c1 are formed, and projections (not shown) formed on the second divided transparent plate 22A1 are engaged with the engagement grooves 32b1 and 32c1, thereby positioning the second divided transparent plate 22A1. Is called.

  Of course, a plurality of divided backup bases 21A (divided transparent plates 22A) having a predetermined unit width B1 (B2) may be combined to form a backup base 21 (transparent plate 22) larger than the width direction dimension of the substrate 11, In this case, the backup device 20 is replaced by changing the setup including movement adjustment work of the transfer conveyor 15 and the like.

  Next, a procedure (method) for manufacturing the backup device 20 to be mounted on the electronic component mounting apparatus 10 outside the apparatus using the jig apparatus 30 having the above-described configuration will be described.

  First, in a state where the jig frame 32 of the jig main body 33 is opened, the substrate 11 on which the electronic component is mounted by the electronic component mounting apparatus 10 is positioned and placed at a predetermined position on the jig base 31. That is, the reference surface 11a of the substrate 11 before electronic component mounting is brought into contact with the reference rail 31b of the jig base 31 and positioned in the Y direction, and the belt 36 is operated to bring the pair of positioning members 34 and 35 closer to each other. Are moved in the same direction by the same amount, and the both sides of the substrate 11 are sandwiched between the pair of positioning members 34 and 35 and centered in the X direction. As a result, the substrate 11 is positioned in the XY directions, and a positioning state similar to that in the electronic component mounting apparatus 10 is realized on the jig apparatus 30.

  With the substrate 11 positioned at a predetermined position on the jig base 31, the handle 47 of the jig frame 32 is grasped to close the jig frame 32 to a position where it overlaps with the jig base 31. A required number of divided transparent plates 22A are mounted on the jig frame 32. At this time, as shown in FIG. 6, positioning pins 57 provided at both ends of each of the divided transparent plates 22A are fitted into the fitting holes 54a of the magnet body 54 so as to pass therethrough, and are freely inserted into the positioning holes 53 of the jig frame 32, respectively. Fit. Thus, the required number of divided transparent plates 22A are arranged above the substrate 11 with a predetermined interval.

  Subsequently, while confirming the position of the electronic component 25 mounted on the substrate 11, the backup pin 23 is inserted into the plurality of pin mounting holes 55 of the divided transparent plate 22 </ b> A so as not to interfere with the electronic component 25. The small diameter tip 23 a is brought into contact with the surface of the substrate 11. At this time, since the positioning pin 57 of the divided transparent plate 22A is loosely fitted in the positioning hole 53 of the jig frame 32 and the movement of the divided transparent plate 22A can be adjusted, it is delicate whether the backup pin 23 can be raised. The position of each divided transparent plate 22A is individually adjusted in the XY direction against the magnetic force of the magnet body 54 by inserting the backup pin 23 into the pin mounting hole 55 so as to avoid the electronic component 25 on the substrate 11. Can be made.

  Thereby, compared with the case where the pin attachment hole 55 is fixed, the freedom degree of the position which can set the backup pin 23 is raised significantly. Moreover, after the divided transparent plate 22A is adjusted in the X and Y directions, the divided transparent plate 22A is held at the position adjusted by the magnetic force of the magnet body 54, so that no special external force acts on the divided transparent plate 22A. As long as the movement of the divided transparent plate 22A is restricted.

  At this time, the upper surfaces of the plurality of backup pins 23 that are in contact with the surface of the substrate 11 have the same height, but the height position changes according to the thickness of the substrate 11.

  Subsequently, as described above, the same number of divided backup bases 21A as the divided transparent plates 22A are combined in the XY directions on the contact end surfaces 23b of the plurality of backup pins 23 inserted into the pin mounting holes 55 of the divided transparent plates 22A. Arrange. That is, the divided backup base 21A serving as a reference is positioned in the XY direction by fitting the positioning reference holes 63 and 64 to the pair of positioning reference pins 45 and 46 of the jig frame 32, and is mounted on the plurality of backup pins 23. Put. Then, with reference to the side surface 21Aa of the reference divided backup base 21A and the positioning key 65, the other divided backup base 21A is positioned in the XY direction and placed on the joining end face 23b of the backup pin 23. At this time, between the plurality of divided backup bases 21A placed on the backup pins 23 and the metal pedestal blocks 69 attached to the upper surfaces of both ends of the divided transparent plate 22A, the thickness of the substrate 11 is determined. There is a gap.

  In this state, the screw portion of the tightening bolt 67 is inserted into the insertion hole 68 of each divided backup base 21A, and is screwed into the screw hole of the base block 69 on the divided transparent plate 22A, thereby tightening the tightening bolt 67. . By tightening the tightening bolt 67, the bottom surface of the head of the tightening bolt 67 is brought into contact with the upper surface of the divided backup base 21A, and when the tightening bolt 67 is further tightened, the divided backup base is brought into contact with the upper surface of the backup pin 23. The divided transparent plate 22A is raised relative to 21A. Then, the divided transparent plate 22A is coupled to the divided backup base 21A by tightening the fastening bolts 67 until the pedestal block 69 on the divided transparent plate 22A is joined to the lower surface of the divided backup base 21A. At this time, since the threaded portion of the tightening bolt 67 is loosely fitted in the insertion hole 68, the divided transparent plate 22A is coupled to the divided backup base 21A with its position adjusted.

  In this way, the backup device 20 to be mounted on the electronic component mounting apparatus 10 is manufactured outside the apparatus by the transparent plate 22 including the required number of divided transparent plates 22A and the backup base 21 including the required number of divided backup bases 21A. The

  Next, a procedure for mounting the backup device 20 manufactured as described above to the electronic component mounting apparatus 10 will be described. The backup device 20 is mounted by dividing the backup device 20 from the jig device 30 with the divided backup base 21A and the divided transparent plate 22A coupled to each other as one unit, and sequentially dividing the divided backup base 21A into electronic components. This is done by assembling the mounting apparatus 10.

  That is, first, the divided backup base 21A serving as a reference (having the positioning reference holes 63 and 64) is lifted from the jig body 33, and the positioning reference holes 63 and 64 of the divided backup base 21A and the divided transparent plate 22A coupled thereto are arranged. The positioning pin 57 is detached from the positioning reference pins 45 and 46 of the jig frame 32 and the fitting hole 54 a of the magnet body 54. As a result, the reference divided backup base 21A is separated from the other divided backup base 21A.

  At this time, since the backup pin 23 is fitted into the pin mounting hole 55 of the transparent plate 22 via the O-ring 60, the backup pin 23 is backed up when the divided backup base 21A and the divided transparent plate 22A are detached from the jig frame 32. The pin 23 does not come out of the pin mounting hole 55, and the contact end face 23 b of the backup pin 23 is maintained in contact with the backup base 21.

  The divided backup base 21 </ b> A separated from the jig frame 32 is turned upside down and positioned and fixed at the component mounting position of the electronic component mounting apparatus 10. That is, the positioning reference holes 63 and 64 of the reference divided backup base 21A are fitted to a pair of positioning pins (not shown) provided at the component mounting position to be positioned in the X and Y directions, and the magnetic force of the magnet body 70 By this, it is fixed on the elevator 18 at the component mounting position.

  Subsequently, the second divided backup base 21 </ b> A is lifted from the jig main body 33, separated in the same manner as described above, inverted upside down, and positioned and fixed at the component mounting position of the electronic component mounting apparatus 10. In other words, the second divided backup base 21A is joined to the side surface 21Aa of the reference divided backup base 21A, and the key slot 66 is engaged with the positioning key 65 of the reference divided backup base 21A, so that the second divided backup base 21A is engaged. The base 21A is positioned and fixed at a predetermined position of the component mounting position.

  In this way, the backup device 20 manufactured on the jig device 30 is reproduced at the component mounting position of the electronic component mounting device 10. FIG. 11 shows an attached state of the backup device 20 positioned and fixed at the component mounting position of the electronic component mounting apparatus 10.

  If an appropriate coupling means for coupling adjacent divided backup bases 21A to each other is provided, the component mounting of the electronic component mounting apparatus 10 can be performed without disassembling the backup apparatus 20 assembled on the jig apparatus 33. It can also be installed in position.

  In this way, on the jig device 30, the backup pin 23 inserted into the required pin mounting hole 55 of the transparent plate 22 is used as it is, and the backup base 21 combined with the transparent plate 22 is used as the electronic component mounting device 10. Therefore, it is not necessary to reinsert the backup pin 23 in the electronic component mounting apparatus 10 as in the prior art. Therefore, it is possible to minimize the time that the operation of the electronic component mounting apparatus 10 must be stopped for the replacement (setup change) of the backup device 20 due to the change of the type of the substrate 11, and to prevent the machine operation rate from being lowered as much as possible. It becomes like this.

  According to the above-described embodiment, the jig main body 33 that positions the substrate 11 before electronic component mounting at a predetermined position, and the transparent plate 22 that can be mounted on the jig main body 33 above the substrate 11 and that has the pin attachment holes 55 formed thereon. The backup pin 23 inserted into the pin mounting hole 55 of the transparent plate 22, and the backup base 23 that can be attached to the electronic component mounting apparatus 10 and is joined to the transparent plate 22 so as to abut the joining end surface of the backup pin 23. Therefore, it is possible to easily obtain a manufacturing apparatus for manufacturing the substrate backup device 20 including the transparent plate 22 to which the backup pin 23 is attached and the backup base 21 on the jig body 33, and the backup pin set outside the machine. 23 can be mounted on the electronic component mounting apparatus 10 as it is.Thereby, the machine stop time accompanying replacement of the backup device 20 can be minimized, and the machine operation rate can be improved.

  Further, according to the above-described embodiment, the transparent plate 22 and the backup base 21 are each composed of a plurality of divided transparent plates 22A and a plurality of divided backup bases 21 each having a predetermined unit width, depending on the size of the substrate 11. Since the backup device 20 is manufactured with the required number of divided transparent plates 22A and divided backup bases 21A, the transparent plates 22 and the backup bases 21 corresponding to a plurality of types of substrates 11 having different dimensions in the width direction can be easily realized. Therefore, the backup device 20 corresponding to a plurality of types of substrates 11 can be easily manufactured.

  Further, according to the above-described embodiment, the plurality of divided backup bases 21A and the plurality of divided transparent plates 22A are divided into the plurality of divided backup bases 21A and the plurality of divided transparent plates 22A having the same width (B1, B2). Since it has at least one divided backup base 21A1 and divided transparent plate 22A1 having a smaller width, the empty area of the substrate 11 can be complemented by the divided backup base 21A1 and divided transparent plate 22A1 having a smaller width. The backup base 21 and the transparent plate 22 corresponding to the width direction dimensions of 11 can be easily configured.

  Further, according to the above-described embodiment, the transparent plate 22 (divided transparent plate 22A) is held so that the position of the transparent plate 22 can be adjusted with respect to the jig body 33, and the transparent plate 22 can be arbitrarily set according to the set position of the backup pin 23. Since the position can be coupled to the backup base 21 (divided backup base 21A) at a position, the degree of freedom of the position where the backup pin 23 can be set can be greatly increased as compared with the case where the transparent plate 22 is fixed.

  Further, according to the above-described embodiment, the elastic ring 60 is attached to the outer periphery of the backup pin 23, and the elastic ring 60 is fitted into the pin mounting hole 55 of the transparent plate 22 so that the backup pin 23 is attached to the transparent plate 22. Thus, the backup pin 23 can be reliably held on the transparent plate 22, and the backup pin 23 is also provided when the backup device 20 is removed from the jig device 30 and transferred to the electronic component mounting device 10. It is possible to prevent the pin from being removed from the pin mounting hole 55.

  In addition, according to the above-described embodiment, the substrate 11 is positioned on the jig body 33, the transparent plate 22 is mounted, and the backup pin 23 that contacts the surface of the substrate 11 in the pin mounting hole 55 of the transparent plate 22. Since the backup base 21 that can be attached to the electronic component mounting apparatus 10 is joined to the transparent plate 22 after being inserted, the transparent plate 22 and the backup base 21 are removed from the jig main body 33. A simple manufacturing method for manufacturing the substrate backup device 20 including the transparent plate 22 and the backup base 21 with the 23 inserted therein can be realized, and the backup pins 23 set outside the machine can be mounted on the electronic component mounting apparatus 10 as they are. Thereby, the machine stop time accompanying replacement of the backup device 20 can be minimized, and the machine operation rate can be improved.

  Further, according to the above-described embodiment, the backup base 21 that can be attached to the electronic component mounting apparatus 10, the transparent plate 22 in which the plurality of pin attachment holes 55 are formed, and the backup pin 23 that is inserted into the pin attachment holes 55. And the backup base 21 and the transparent plate 22 are configured by combining the required number of divided backup bases 21A and divided transparent plates 22A in accordance with the size of the substrate 11, so that a plurality of types of substrates 11 having different widthwise dimensions can be used. It is possible to obtain the substrate backup device 20 that can be easily handled and that can securely hold the backup pin 23 by the transparent plate 22.

  FIG. 12 shows a second embodiment of the present invention and shows another example in which the degree of freedom of the arrangement position of the backup pins 23 is increased.

  In FIG. 12, an eccentric shaft portion 123 having a diameter smaller than the diameter of the backup pin 23 and eccentric by a predetermined amount ε with respect to the axis of the backup pin 23 is provided at the tip of the backup pin 23 that contacts the surface of the substrate 11. Is provided. After the backup pin 23 is inserted into the pin mounting hole 55 of the transparent plate 22, the backup shaft 23 is rotated by the pin mounting hole 55, thereby adjusting the position of the eccentric shaft portion 123 so as to avoid the electronic component 25 on the substrate 11. In this position, the backup pin 23 is held by an O-ring 60 fitted in an annular groove 23c formed on the outer periphery thereof.

  According to the second embodiment, even when the position of the eccentric shaft portion 123 is adjusted and the backup pin 23 cannot be erected on the concentricity with the backup pin 23 due to interference with the electronic component 25, the rotation of the backup pin 23 can be performed. The backup pin 23 can be raised by the adjustment, and the degree of freedom of the position where the backup pin 23 can be set can be increased.

  The position adjustment of the backup pin 23 by the eccentric shaft portion 123 is performed in place of the position adjustment function of the transparent plate 22 by the loose fitting (free fitting) between the positioning hole 53 and the positioning pin 57 as shown in FIG. Although it can be used, the degree of freedom of the backup pin 23 can be further improved by using it together with the position adjusting function by loosely fitting the positioning hole 53 and the positioning pin 57.

  FIG. 13 shows a third embodiment of the present invention, and a backup plate 73 made of a thin iron plate is added to both ends of the backup base 21 so as to improve the backup function of the substrate 11 by the backup device 20. It is a thing. After manufacturing the backup device 20 as described above, the backup plate 73 is positioned and fixed in the vertical direction on the outer end surfaces of the divided backup base 21A at both ends of the backup base 21 using a magnet or the like.

  That is, in order to position and fix the backup plate 73, although not shown, a magnet body is embedded in each side surface of the divided backup base 21A and engages with an engagement portion attached to the backup plate 73. An engagement groove is formed. Thus, the upper surface of the backup plate 73 is positioned in the X direction and the vertical direction so as to coincide with the heights of the plurality of backup pins 23 arranged in the backup device 20, and the backup of the substrate 11 in the electronic component mounting apparatus 10 is performed. Sometimes, in cooperation with the backup pin 23, both sides of the substrate 11 are backed up.

  According to the third embodiment, since both sides of the substrate 11 can be backed up by the backup plate 73, the width of the backup base 21 is smaller than the width dimension of the substrate 11, and the backup pin 23 is provided on one end side of the substrate 11. Even when an unsupported empty area occurs, the substrate 11 can be stably supported by the cooperation of the backup pin 23 and the backup plate 73.

  FIG. 14 shows a fourth embodiment of the present invention. When a plurality of divided transparent plates 22A are mounted on the jig device 30 in accordance with the width dimension of the substrate 11, how many divided transparent plates are provided. The plate 22A can be easily identified by the color to be combined.

  In FIG. 14, on the second and third frame portions 32b and 32c of the jig frame 32 of the jig body 33, a plurality of positioning marks 51 and 52 for positioning the divided transparent plate 22A are provided with different colors, respectively. 75a, 75b, 75c, 75d... Are applied. There are, for example, three types of colors. For example, a blue installation mark 75a is provided at the front positioning portions 51 and 52, a green installation mark 75b is provided at the second position, and a yellow installation mark 75c is provided at the third position. Similarly, all of the positioning portions 51 and 52 are color-coded, such as blue for the fourth, green for the fifth, and yellow for the sixth.

  On the other hand, on the placement surface 31a of the jig base 31 on which the substrate 11 is placed, the reference marks 76a, 76b, 76c in which the above-described three kinds of colors are sequentially applied to the center position in the X direction for positioning the substrate 11. 76d are arranged along the Y direction. Although the Y-direction dimensions of the installation marks 75a... Of the same color and the reference marks 76a... Are the same, the arrangement position is slightly shifted in the Y-direction, and the reference marks 76a. Are slightly displaced in the Y direction opposite to the reference rail 31b.

  As a result, when the substrate 11 is positioned and placed on the jig base 31, the installation position where the divided transparent plate 22A can be installed can be identified according to the color of the reference mark 76a ... exposed from the substrate 11. ing. Specifically, when the substrate 11 is positioned and placed on the placement surface 31a of the jig base 31, for example, if the blue reference mark 76d is exposed from the end of the substrate 11, the blue installation mark 75d is When the divided transparent plate 22A is installed up to the installed position, it informs the operator that the width of the backup device 20 may be larger than the width of the substrate 11, and as described above, When the blue reference mark 76d is exposed from the end portion of the substrate 11, the operator can easily recognize that the number of the divided transparent plates 22A to be installed is three. As described above, the operator can determine the number of the divided transparent plates 22A to be installed according to the color of the reference marks 76a ... exposed from the end of the substrate 11, and the width of the backup device 20 does not become too large. I am doing so.

  In FIG. 14, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  According to the fourth embodiment, the number of divided transparent plates 22A to be installed according to the width direction dimension of the substrate 11 can be easily known from the color, and the backup device 20 corresponding to the size of the substrate 11 can be obtained. Can be easily manufactured.

  15 and 16 show a fifth embodiment of the present invention. The transparent plate 222 is not regularly arranged with respect to the jig body 33 as shown in FIG. 5, and a magnet or the like is used. The jig main body 33 can be freely arranged.

  15 and 16, the transparent plate 222 has a disk shape with a plurality of pin attachment holes 55, and a magnet stand 225 is attached to the center, and the magnet stand 225 is at an arbitrary position with respect to the substrate 11. It is fixed on the jig body 33 by magnetic force. A backup pin 223 made of a magnet is inserted into the pin mounting hole 55 of the transparent plate 222, and the tip is brought into contact with the substrate 11. At this time, the O-ring (60) is not used for the backup pin 223, and the backup pin 223 is held by a magnetic force on a backup base (not shown) joined to the rear end.

  Then, after the backup pin 223 is mounted at a required position of the pin mounting hole 55, the backup pin 223 is detached from the transparent plate 222 and mounted on the electronic component mounting apparatus in a state where the backup base is held by magnetic force. Note that the transparent plate 222 may have a rectangular shape instead of a disc shape.

  According to the fifth embodiment, since the transparent plate 222 can be freely arranged on the jig main body 33 using a magnet or the like, the degree of freedom in arranging the backup pins 223 can be improved.

  In the above-described embodiment, the backup base 21 and the transparent plate 22 are respectively configured by the plurality of divided backup bases 21A and the divided transparent plates 22A having a predetermined unit width, and thus the width of the substrate 11 on which electronic components are to be mounted. Although effective in that the backup base 21 and the transparent plate 22 can be easily configured according to the directional dimensions, in the apparatus (the jig apparatus 30) and the manufacturing method for manufacturing the backup apparatus 20 according to the present invention, the backup base It is not always necessary for the present invention to divide 21 and the transparent plate 22 into a plurality. For example, a plurality of types of backup bases 21 and transparent plates 22 corresponding to the width-direction dimensions of the substrate 11 are prepared. Also good.

  In the above-described embodiment, the backup device 20 to be mounted on the electronic component mounting apparatus 10 is configured by the transparent plate 22 and the backup base 21 into which the backup pins 23 are inserted. The transparent plate 22 may be detached from the backup pin 23 after the backup pin 23 is attached to a required position of the pin attachment hole 55, which is not necessarily a necessary requirement. In this case, for example, the backup pin 23 is fixedly held on the backup base 21 by a magnetic force, or the transparent plate 22 is easily detached from the backup pin 23 so that the position of the backup pin 23 attached at a required position does not shift. In addition, appropriate measures such as abolishing the O-ring (60) described in the embodiment may be taken.

  Moreover, in the above-described embodiment, an example in which the present invention is applied to an electronic component mounting apparatus that mounts chip-shaped electronic components on a substrate has been described. The electronic component mounting apparatus includes a solder screen printing apparatus and an adhesive application. A device is also included.

  Further, in the above-described embodiment, when the backup pin 23 is inserted on the jig device 30, the position of the transparent plate 22 in which the pin mounting hole 55 is formed can be adjusted. Although it is effective in that the degree of freedom can be increased, it is not always necessary for the present invention to configure the transparent plate 22 so that the position of the transparent plate 22 can be adjusted, and the transparent plate 22 is made of the jig body 33 (the jig frame 32). It may be fixedly mounted using positioning pins or the like.

  Furthermore, in the above-described embodiment, the jig main body 33 is configured by the jig base 31 and the jig frame 32 that can be opened and closed with respect to the jig base 31. The thing of the structure raised / lowered so that it can approach / separate with respect to 31 may be sufficient.

  Furthermore, in the above-described embodiment, the backup base 21 of the backup device 20 is positioned in the XY direction by the pair of positioning reference pins. However, the backup base 21 is positioned the same as the electronic component mounting device 10. What is necessary is just to be able to position by a reference | standard, and it is not limited to the positioning by a positioning reference pin. Similarly, in the positioning of the substrate 11, in addition to centering in the X direction as described in the embodiment, for example, two substrates that are perpendicular to each other can be positioned.

  Furthermore, in the above-described embodiment, the plurality of pin mounting holes 55 are regularly arranged in the XY direction on the transparent plate 22. However, the pin mounting holes 55 are arranged at different arrangement pitches depending on the position of the substrate 11. You may make it arrange.

  Thus, the specific configuration described in the above embodiment is merely an example of the present invention, and the present invention is not limited to such a specific configuration. Of course, various embodiments can be employed without departing from the scope.

1 is a schematic diagram of an electronic component mounting apparatus showing a state in which a substrate is supported by a backup apparatus according to an embodiment of the present invention. It is a perspective view which shows the open state of the jig apparatus which manufactures a backup device. It is a perspective view which shows the state which closed the jig apparatus. It is a perspective view which shows the state which positioned the board | substrate in the jig apparatus. It is a perspective view which shows the state which mounted | wore the transparent plate with the jig apparatus. It is sectional drawing cut | disconnected along 6-6 line of FIG. It is a perspective view which shows a backup pin. It is sectional drawing which shows the state which inserted the backup pin in the transparent plate. It is a perspective view which shows the state which mounted | wore the jig | tool apparatus with the backup base. It is sectional drawing cut | disconnected along the 10-10 line | wire of FIG. It is a perspective view which shows the state which mounted | wore the backup device in the component mounting position of the electronic component mounting apparatus. It is sectional drawing which shows the state which inserted the backup pin in the transparent plate which shows the 2nd Embodiment of this invention. It is a perspective view of the backup device which shows the 3rd Embodiment of this invention. It is a perspective view of the backup device manufacturing apparatus which shows the 4th Embodiment of this invention. It is the schematic of the backup device manufacturing apparatus which shows the 5th Embodiment of this invention. It is a top view of the transparent plate seen from 16 directions of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 11 ... Board | substrate, 15 ... Conveyor, 20 ... Backup device, 21 ... Backup base, 21A ... Divided backup base, 21Aa ... Side surface, 22 ... transparent plate, 22A ... divided transparent plate, 23 ... backup pin, 23a ... tip, 23b ... abutting end face, 25 ... electronic component, 30 ... jig device, 31 ... Jig base, 31a ... Placement surface, 31b ... Reference rail, 32 ... Jig frame, 32a-32c ... Frame part, 33 ... Jig body, 34, 35 ... Positioning member, 45, 46 ... positioning reference pin, 51, 52 ... positioning portion, 53 ... positioning hole, 54 ... magnet body, 54a ... fitting hole, 55 ... pin Mounting holes, 7 ... Positioning pin, 60 ... O-ring, 63, 64 ... Positioning reference hole, 65 ... Positioning key, 66 ... Key slot, 67 ... Clamping bolt, 68 ... Insertion hole, 71... Magnet body, 73... Backup plate, 123.

Claims (11)

  A jig main body for positioning a substrate before mounting electronic components at a predetermined position, a transparent plate that can be mounted on the jig main body above the substrate and that has a pin mounting hole, and a backup that is inserted into the pin mounting hole of the transparent plate An apparatus for manufacturing a substrate backup apparatus, comprising: a pin; and a backup base that is attachable to an electronic component mounting apparatus and is coupled to the transparent plate so as to abut one end of the backup pin.   2. The transparent plate and the backup base according to claim 1, each comprising a plurality of divided transparent plates and a plurality of divided backup bases each having a predetermined unit width, and a required number of divided transparent plates corresponding to the size of the substrate. An apparatus for manufacturing a substrate backup apparatus, wherein the divided transparent plates are combined and attached to the jig main body, and the divided transparent plates are joined by the divided backup base.   The plurality of divided backup bases and the plurality of divided transparent plates according to claim 2, wherein the plurality of divided backup bases and the plurality of divided transparent plates have the same width, and a width smaller than the width dimension of the divided backup base and the divided transparent plates. A substrate backup device manufacturing apparatus comprising at least one divided backup base and a divided transparent plate.   4. The transparent plate according to claim 1, wherein the transparent plate is held so as to be position-adjustable with respect to the jig body, and the transparent plate is held at an arbitrary position according to a set position of the backup pin. A substrate backup device manufacturing apparatus characterized in that it can be coupled to a backup base.   4. The transparent shaft according to claim 1, wherein an eccentric shaft portion that is eccentric with respect to an axis of the backup pin is provided on an end surface of the backup pin that is in contact with the jig body. An apparatus for manufacturing a substrate backup apparatus, wherein the position of the eccentric shaft portion can be adjusted by rotation of the backup pin with respect to a plate.   6. The elastic ring according to claim 1, wherein an elastic ring is attached to an outer periphery of the backup pin, and the elastic ring is fitted into the pin mounting hole of the transparent plate so that the backup pin is transparent. An apparatus for manufacturing a substrate backup apparatus, wherein the apparatus is held on a plate.   A board before electronic component mounting is positioned at a predetermined position on the jig body, a transparent plate having pin mounting holes formed above the board is mounted on the jig body, and the surface of the board is inserted into the pin mounting holes of the transparent plate. Then, a backup pin with one end abutting is inserted, and after that, a backup base that can be attached to an electronic component mounting apparatus is coupled to the transparent plate, and the other end of the backup pin is brought into contact with the backup base. A substrate backup device manufacturing method, wherein the transparent plate and backup base into which backup pins are inserted are removed from the jig body.   8. The transparent plate and the backup base according to claim 7, each comprising a plurality of divided backup bases and a plurality of divided transparent plates each having a predetermined unit width, and a plurality of divided backup bases according to the size of the substrate. A method for manufacturing a substrate backup apparatus, comprising: mounting a split transparent plate, and connecting the same number of split backup bases to the split transparent plate.   A backup base that can be attached to the electronic component mounting apparatus, and a plurality of backup pins held at a required arrangement position according to the position of the electronic components mounted on the surface of the substrate on the backup base, A substrate backup apparatus comprising a plurality of divided backup bases having a predetermined unit width, wherein the backup base is configured by combining a required number of the divided backup bases according to the size of the substrate.   10. The substrate backup apparatus according to claim 9, wherein backup plates having the same height as the backup pins are held on both sides of the backup base.   A backup base that can be attached to the electronic component mounting apparatus, a transparent plate that forms a plurality of pin mounting holes and is coupled to the backup base, and a plurality of the transparent plates according to the position of the electronic component mounted on the surface of the substrate Backup pins inserted into the pin mounting holes, and the backup base and the transparent plate are constituted by a plurality of divided backup bases and divided transparent plates having a predetermined unit width, and a required number corresponding to the size of the substrate. A substrate backup apparatus, wherein the backup base and the transparent plate are configured by combining the divided backup base and the divided transparent plate.

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