JP2009146945A - Board supporting method, board supporting device, backup pin drawing-out tool, component mounting device, coating device, and board inspecting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To set up a backup pin more securely and more accurately. <P>SOLUTION: The board supporting device 11 having a pin holder base 50 housing a plurality of backup pins (BP 56) in a predetermined array so that they can be freely drawn out is provided between a working place. After a BP 56 to suitably support a board P to be produced is selected out of the BPs 56, drawn out, and locked at a draw-out position by a shutter 52 to carry in a board P to the working place, the pin holder base 50 is elevated through the operation of an elevation mechanism 78 to support the board P with the BP 56 locked at the draw-out position. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention is applied to a manufacturing apparatus such as a component mounting apparatus for producing a component mounting board, and particularly relates to a technique of supporting a working board from the lower surface side by a backup pin.

  Conventionally, by driving a movable head for picking up components, electronic components are picked up from a component supply unit and mounted on a printed circuit board (PWB) or the like (hereinafter referred to as “substrate”) positioned at a work position. A component mounting apparatus is known. In this type of apparatus, a substrate support device is mounted in order to prevent the substrate from being bent during operation.

  The substrate support device includes a pin member called a backup pin on a base, and is configured to support a predetermined portion of the substrate positioned at the mounting work position with the backup pin. A plurality of pin support holes are drilled in a matrix, for example, on the base. By selectively inserting backup pins into these pin support holes, the optimum location of the board according to the size, type, etc. It is comprised so that it can support.

Note that the optimal backup pin arrangement differs depending on the size and type of the substrate as described above, and therefore, when the production lot is switched, an operation for changing the arrangement of the backup pins, that is, a setup operation is required. Conventionally, this work has been performed by an operator inserting and removing backup pins one by one from the base. However, since this work is complicated, this work has been automated in recent years. For example, in Patent Document 1, a backup pin having a built-in pedestal with a built-in magnet is provided so that the backup pin is fixed on the base by a magnetic force, while a backup claw having a gripping claw for gripping the backup pin. A pin holding unit is provided so as to be movable integrally with the head, and at the time of setup work, a backup pin is held and moved by the holding unit so that the work can be performed fully automatically. In the device of this document 1, the backup pin has a hollow structure, and the substrate is supported by the backup pin by supplying negative pressure to the tip of the backup pin through the base and the inside of the pin during the mounting operation. At the same time, the lower surface of the substrate is sucked, thereby correcting the warpage and bending of the substrate, so that the substrate can be stably supported in a horizontal state.
JP 2002-118399 A

  In the conventional apparatus disclosed in Patent Document 1, the setup work of the backup pin is automated, so that the burden on the operator can be reduced.

  However, since the backup pin is gripped and moved (conveyed) by the holding unit, the backup pin may be dropped during the movement or may be displaced from the gripping claw, thereby affecting the setup operation of the backup pin. In addition, a storage space for storing unused backup pins is required separately from the base on which the backup pins are mounted, and there is a difficulty in saving space. Furthermore, the point that the backup pins are moved one by one by the holding unit is the same as the work by the operator. Therefore, there is still room for improvement in reducing the board production time including the setup time of the backup pins.

  In addition, this conventional device is configured to support the substrate while sucking it with a backup pin, but at each pin mounting location in order to prevent negative pressure leakage at the non-pin mounting location among the pin mounting locations on the base. Each has a built-in on-off valve. Therefore, a large number of on-off valves corresponding to the pin mounting locations are required, which is disadvantageous in terms of cost.

  The present invention has been made in view of the circumstances as described above, and the first object is to enable a backup pin setup operation more reliably and accurately, and the second object is to Improving board productivity by shortening the time required for backup pin setup work, and a third object is to save space and reduce the cost of board support equipment and component mounting equipment in which the equipment is incorporated. It aims to plan.

  In order to solve the above-described problems, the present invention is a method for supporting a substrate carried into a predetermined work position by a backup pin, and a plurality of backup pins are previously arranged in a predetermined arrangement in a region below the work position. And a holding member that can be pulled out to the working position side, and a backup pin suitable for supporting the substrate is selected from the plurality of backup pins, the backup pin is pulled out from the holding member, and a predetermined The back-up pin locked to the pull-out position by locking the pull-out position by the locking means and displacing the holding member and the substrate relative to each other in the vertical direction after carrying the substrate into the working position. The substrate is supported.

  In this method, a plurality of backup pins are arranged in advance in the region below the work position, and only the backup pins at positions suitable for the production substrate are drawn out and used. Therefore, there is no room for troubles such as the backup pin falling off during transportation as in the conventional method in which the backup pin is inserted and removed and the pin is transported to and from the storage location. Further, it is not necessary to separately provide a space for storing unused backup pins other than the area below the work position.

  In the above method, the backup pins may be pulled out one by one and locked by the locking means. However, a jig member capable of pulling out the backup pins from the holding member is used, and the jig member is used as the work. It is preferable to place the backup pins suitable for supporting the substrate together with the jig member and to lock the backup pins together with the locking means.

  According to this method, since the backup pins suitable for supporting the substrate are pulled out and locked together, so-called backup pin setup work can be performed quickly. Therefore, as compared with the conventional method in which the backup pins are inserted into the predetermined positions one by one, it is possible to greatly reduce the time required for the backup pin setup work.

  When using a jig member, a method using a mechanism that pulls up the backup pin may be adopted. However, if the backup pin is pulled out from the holding member by a magnetic attraction force, the jig is used. It is possible to quickly and smoothly pull out the backup pin from the holding member by the tool member and to separate the backup pin and the jig member after the drawing, which is suitable for improving the efficiency of the backup pin setup work. is there.

  In the substrate support method as described above, the lower surface of the substrate may be simply supported by the backup pins. However, in order to support the substrate more appropriately, a negative pressure is applied to the tip through each backup pin. It is preferable to support the substrate in a state where the substrate is adsorbed by the backup pin.

  According to this method, the substrate can be supported in a more horizontal state by correcting the bending and warping of the substrate.

  The substrate support method as described above can be easily implemented by using the following substrate support device or backup pin drawing jig.

  That is, the substrate support device according to the present invention is a substrate support device that is disposed in a lower region of a work position where a predetermined work is performed on the substrate, and supports the substrate carried into the work position with a backup pin. The backup pins, holding the backup pins in a predetermined arrangement and holding the backup pins at the working position side so that they can be pulled out freely, and locking the backup pins drawn out from the holding members at the drawing position And a moving means for relatively displacing the substrate and the holding member disposed at the working position in the vertical direction.

  According to this apparatus, if the backup pin suitable for supporting the substrate is previously pulled out of the backup pins held by the holding member and locked by the locking means before the operation on the substrate, The substrate can be supported by the backup pin by relatively displacing the substrate and the holding member by the moving means at the stage where the substrate is carried into the working position. Therefore, it is possible to satisfactorily implement the above substrate support method.

  It is preferable that the locking means is configured to collectively lock the pulled-out backup pin at the pulled-out position and to release the locked state at once.

  According to this configuration, since the pulled-out backup pins can be locked together and the locked state can be released collectively, it is possible to improve the efficiency of the backup pin setup work.

  In the above-mentioned device, it is preferable that an internal passage opening at the tip of the pin is formed inside the backup pin, and further provided with a negative pressure supply means for supplying a negative pressure to the internal passage.

  According to this configuration, the substrate can be supported in a more horizontal state by correcting the bending and warping of the substrate.

  In this case, for example, the holding member is configured to accommodate each backup pin in a pin support hole so that the backup pin can be pulled out, and the negative pressure supply means supplies a negative pressure to each pin support hole. The backup pin and the pin support hole have a switching structure that switches the communication state between the internal passage and the negative pressure passage according to the position of the backup pin. It is preferable that the internal passage is blocked from the negative pressure passage in the state accommodated in the support hole, while the internal passage is communicated with the negative pressure passage in other states.

  According to this configuration, it is possible to automatically switch the communication state between the negative pressure inlet of the backup pin (internal passage) and the negative pressure passage according to the position of the backup pin without providing a dedicated on-off valve. It becomes possible.

  In the above apparatus, when a predetermined jig having a magnetic material is arranged at the working position, the backup pin generates a magnetic attraction force between the backup pin and the holding pin by the attraction force. It is suitable that it is configured to be pulled out from the member.

  According to this configuration, it is possible to quickly and smoothly pull out the backup pin from the holding member, which is advantageous in improving the efficiency of the backup pin setup work.

  On the other hand, a backup pin drawing jig is a jig that is used together with the substrate support device as described above and pulls out the backup pin accommodated in the substrate support device by being arranged at the working position, And a drawer member attached to the main body portion, and the main body portion is provided with a mounting portion on which the drawer member can be attached and detached in the same arrangement as a backup pin in the substrate support device. The member for use includes a portion made of a magnetic body, and is attached to the main body portion and arranged at the working position together with the main body portion, thereby generating the magnetic attraction force between the backup pin and the main body portion. The backup pin is configured to be pulled out from the substrate support device by the suction force.

  According to this jig, since the mounting portion of the jig main body and the arrangement of the backup pins of the substrate support device correspond to each other, the drawer member is mounted in advance on the mounting portion corresponding to the support position of the substrate, and the jig If the tool is arranged at the working position, a magnetic attraction force is generated between the drawing member and the backup pin, and only the desired backup pin is drawn at a time. Therefore, the backup pin can be pulled out quickly. Also, by changing the mounting position of the drawer member, it is possible to deal with a plurality of types of substrates with a common jig.

  On the other hand, the component mounting apparatus according to the present invention mounts a component on the upper surface of the substrate in a state where the substrate carried into the predetermined work position is supported by the substrate support device disposed in the lower region of the work position. In the component mounting apparatus, the board support apparatus as described above is provided as the board support apparatus.

  Further, the coating apparatus according to the present invention provides a paste such as solder on the upper surface of the substrate in a state where the substrate carried into the predetermined working position is supported by the substrate supporting device disposed in the lower region of the working position. A coating apparatus for coating includes the above-described substrate support device as the substrate support device.

  Further, the substrate inspection apparatus according to the present invention applies a paste such as solder on the substrate in a state where the substrate carried into a predetermined work position is supported by a substrate support device disposed in a lower region of the work position. A substrate inspection apparatus that inspects at least one of a state or a component mounting state includes the above-described substrate support device as a substrate support device.

  According to these apparatuses, since the substrate support apparatus as described above is provided, the backup pin setup work can be accurately and reliably performed in each apparatus, and the backup pin setup work time can be shortened. It is also possible to meet demands for space saving and cost reduction.

  According to the present invention, the backup pin is arranged in advance in the lower area of the work position, and only the backup pin at the desired position suitable for the substrate is pulled out and used. There is no room for troubles such as the backup pin falling off during the transport, unlike the conventional method (apparatus) for transporting the pin. Further, it is not necessary to separately provide a space for storing unused backup pins other than the area below the work position. Therefore, the setup operation of the backup pin can be performed accurately and reliably, and space saving can be achieved for the substrate support device and the component mounting device in which the device is incorporated. Moreover, since it is not necessary to transport the backup pins to and from the storage location as in the past, it is possible to shorten the setup work time. In particular, the backup pins are pulled out in a batch using a jig member. Further, according to the method (configuration) in which the pulled-out backup pins are collectively locked by the locking means, the setup work time can be greatly shortened and the productivity of the substrate can be improved.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a component mounting apparatus according to the present invention (a component mounting apparatus on which a substrate supporting apparatus according to the present invention is mounted: a component mounting apparatus in which the substrate supporting method according to the present invention is used). FIG. 1 is a plan view and FIG. 2 is a front view showing a component mounting apparatus.

  As shown in these drawings, a printed circuit board conveyor 12 is disposed on a base 10 of a component mounting apparatus, and a printed circuit board P (hereinafter simply referred to as a circuit board P) is transported at a predetermined work position. It is supposed to be stopped. A substrate support device 11 that supports the substrate P by the backup pins 56 during the mounting operation is disposed in a region below the work position. Details of the conveyor 12 and the substrate support apparatus 11 will be described later.

  Feeder installation areas 13 are provided on both sides of the conveyor 12 (upper and lower sides in FIG. 1). In these feeder installation areas 13, for example, component feeders such as a tape feeder 14 are arranged in parallel along the conveyor 12. Has been placed.

  A component mounting head unit 15 is provided above the base. The head unit 15 is perpendicular to the direction along the conveyor 12 (X-axis direction) and within a certain area so that components can be picked up from the tape feeder 14 and mounted on the substrate P at the work position. It is possible to move in each direction (Y-axis direction). That is, the support member 18 of the head unit 15 is disposed on the base so as to be movable along the fixed rail 17 in the Y-axis direction, and the head unit 15 is placed on the guide member 19 in the X-axis direction on the support member 18. It is supported so that it can move along. Then, the support member 18 is screwed and attached to the ball screw shaft 23 driven by the Y-axis servo motor 22, so that the support member 18 is moved in the Y-axis direction, while being driven by the X-axis servo motor 20. When the head unit 15 is screwed onto the ball screw shaft 21, the head unit 15 is configured to move in the X-axis direction.

  The head unit 15 is provided with a plurality of component suction heads 16, and in this embodiment, eight heads 16 are mounted in a state of being arranged in the X-axis direction. Each head 16 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle axis (R-axis) with respect to the head unit 15, and a Z-axis servomotor 27 (shown in FIG. 8) is used as a drive source. The lift drive means and the R-axis servomotor 27 (shown in FIG. 8) are driven by the rotational drive means. Each head 16 is provided with a component suction nozzle 16a at its tip (lower end). By supplying a negative pressure to the tip of this nozzle 16a, the component is removed by the suction force of this negative pressure. It comes to adsorb.

  The head unit 15 is further provided with a first imaging unit 24. The first imaging unit 24 includes a CCD camera, an illumination device, and the like, and can capture various marks such as a fiducial mark of a substrate P carried into a work position and an ID mark of a jig substrate 120 described later. Yes.

  On the other hand, on the base 10, a second imaging unit 25 for recognizing an image of the suction component by the head unit 15 is provided. Similarly to the first imaging unit 24, the second imaging unit 25 also includes a CCD camera, an illumination device, and the like. After the components are sucked, the head unit 15 is disposed above the second imaging unit 25, whereby each nozzle 16a. Therefore, it is possible to image the suction component from below.

  FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1, and schematically shows configurations of the conveyor 12 and the substrate support device 11. Note that the lower side in FIG. 1 (left side in FIG. 3) is the front side of the component mounting apparatus.

  As shown in the figure, the conveyor 12 has a pair of front and rear support bodies 30A and 30B arranged at intervals in the Y-axis direction. A plurality of driven rollers 32 arranged in a line at predetermined intervals in the X-axis direction along the upper end portion, and driving rollers 33 supported below the driven rollers 32 are provided on the opposing surfaces of the supports 30A and 30B, respectively. In addition, an endless conveying belt 34 that is stretched over the rollers 32 and 33 and a tension mechanism (not shown) that stretches the conveying belt 34 are assembled, and the driving roller 33 is driven to rotate. Thus, the conveyor 12 is configured so that each conveyor belt 34 moves around the driven roller 32. Therefore, when the front and rear ends of the substrate P are placed on the respective conveyor belts 34 and the conveyor 12 is driven, the substrate P is conveyed in the X-axis direction.

  The drive mechanism of the drive roller 33 includes a drive shaft 35 extending in the Y-axis direction and penetrating both the drive rollers 33, a drive motor 36 fixed to the front support 30A, and the rotational drive force of the drive motor 36 as the drive. It comprises pulleys 37, 38 that transmit to the shaft 35, a drive belt 39, and the like. The rear support 30 </ b> B is configured to be displaceable in the Y-axis direction, so that the conveyor width can be adjusted according to the size of the substrate P. Therefore, the drive shaft 35 is spline-coupled so that it can be displaced relative to the rear drive roller 33 in the axial direction and can rotate integrally.

  At the upper end of each of the supports 30A and 30B, a guide rail 41 for further restricting the position of the substrate P being transferred in the front-rear direction, and both front and rear ends of the substrate P projecting inward from each other are provided. A pressing piece 42 covered from above, and a clamping device 43 (shown in FIG. 8) that clamps the substrate P by pushing the substrate P upward from the conveyor 12 and pressing both front and rear ends thereof against the pressing piece 42. Is provided. The holding piece 42 and the clamp device 43 are provided at locations corresponding to the work positions in the supports 30A and 30B. FIG. 3 shows a state in which the substrate P is clamped by the clamp device 43. Although the detailed configuration of the clamp device 43 is not shown, for example, it includes a clamp piece that can be moved up and down and an actuator such as an air cylinder that drives the clamp piece to move up and down so that the substrate P is pushed up by the clamp piece. It is configured.

  On the other hand, the substrate support device 11 schematically includes a pin holder base 50 that holds a backup pin 56 for supporting the substrate P, a horizontal table 76 that supports the base 50, and a lifting mechanism that lifts and lowers the table. 78 etc.

  As shown in FIGS. 4 and 5, the pin holder base 50 includes a base body 51, a shutter 52, and the like. The base body 51 has a rectangular block shape that is slightly elongated in the Y-axis direction, and a plurality of pin support holes 54 are arranged in a matrix at regular intervals in the X-axis and Y-axis directions. It is drilled in a shape. Each pin support hole 54 is a bottomed hole that extends in the Z-axis direction and opens upward, and a backup pin 56 (hereinafter referred to as BP 56) can be projected and retracted in each pin support hole 54, and It is inserted so that it cannot be extracted. Specifically, as shown in FIG. 6, each pin support hole 54 has a stepped structure in which the pores 54 a and the thick holes 54 b are arranged vertically in the axial direction, and the BP 56 is a portion of the pore 54 a. And is inserted into the pin support hole 54 so as to be displaceable in the axial direction. In the vicinity of the lower end of the BP 56, a flange 57 is formed on the outer peripheral surface thereof. When the BP 56 is pulled upward from the base body 51 by a predetermined dimension, the flange 57 is engaged with the stepped portion of the pin support hole 54. Accordingly, the extraction of the BP 56 from the pin support hole 54 is prevented. As a result, each BP 56 can be pulled out over a predetermined drawing position where the flange portion 57 engages with the stepped portion of the pin support hole 54 and a receiving position where the pin tip slightly protrudes upward from the pin support hole 54. Is provided.

  The shutter 52 is a plate-like member that locks the BP 56 held by the base main body 51 that has been pulled out to the pull-out position at the pull-out position. The shutter 52 traverses a middle portion of the pin support hole 54, specifically, a portion of the pin support hole 54 slightly below the upper end of the thick hole portion 54b in the horizontal direction. The base body 51 is incorporated so as to be slidable in the X-axis direction.

  As shown in FIGS. 4 to 7, the shutter 52 has a plurality of slit-like openings 70 extending in the vertical direction and extending in the X-axis direction at regular intervals in the Y-axis direction. . The openings 70 are provided corresponding to the pin support holes 54 aligned in the X-axis direction, and the BPs 56 are inserted into the pin support holes 54 in a state of passing through the openings 70. Yes. Each opening 70 has a narrow width portion 71 that allows passage of only the portion other than the flange portion 57 of the BP 56 and a wide width portion 72 that allows passage of the BP 56 including the portion of the flange portion 57 in the longitudinal direction ( Alternately in the Y-axis direction), the pitch of the wide portions 72 is formed to be equal to the arrangement pitch of the pin support holes 54 in the Y-axis direction.

  The shutter 52 is connected to a cylinder rod of an air cylinder 74 assembled to the base body 51 via a joint 75, and air to the air cylinder 74 based on a switching operation of a shutter switching valve 73 (shown in FIG. 8). In response to the supply / discharge switching, each of the wide portions 72 is aligned with the pin support holes 54, and each of the wide portions 72 is shifted from the pin support holes 54 by a certain amount. It is configured to slide. In the state where the shutter 52 is set at the unlocking position, as shown in FIG. 7A, the wide width portion 72 and the pin support hole 54 are aligned with each other, and the BP 56 extends between the drawing position and the accommodation position. While free insertion / extraction is allowed, when the shutter 52 is set to the locking position with the BP 56 pulled out to the extraction position, as shown in the right view of FIG. The portion covers the flange portion 57 of the BP 56 from the lower side thereof, so that the BP 56 is locked at the drawer position.

  In this embodiment, the base body 51 corresponds to the holding member according to the present invention, and the shutter 52, the air cylinder 74, and the like correspond to the locking means according to the present invention.

  Each BP 56 is entirely made of a magnetic material (iron in this example). Each BP 56 has a hollow structure having an internal passage 56a penetrating in the axial direction, supports the lower surface of the substrate P at the tip, and supplies the lower surface to the tip of the pin through the internal passage 56a. It is comprised so that it can adsorb | suck by a negative pressure. Accordingly, each base body 51 is further provided with negative pressure supply means such as a negative pressure passage 64 for supplying a negative pressure to the internal passage 56a. More specifically, a plurality of negative pressure passages 64 extending linearly in the X-axis direction and arranged at regular intervals in the Y-axis direction are formed inside the base body 51 and in the vicinity of the bottom surface portion. As shown in FIGS. 5 to 7, each negative pressure passage 64 is provided so as to penetrate through the pin support holes 54 formed in a matrix in a row in the X-axis direction. The negative pressure generating device 66 is connected to a negative pressure supply pipe 65 through a negative pressure supply pipe 65 connected to the rear end face of 51. As a result, a negative pressure can be supplied to each pin support hole 54. In addition, a seal member mounting portion 58 including a pair of flange portions 58a and 58b different from the flange portion 57 is formed at the lower end portion of each BP 56. The outer peripheral surface of the BP 56 and a pin support hole are formed in the attachment portion 58. A Y packing 60 that seals between the inner peripheral surface of 54 (thick hole portion 54b) is fitted. Further, a concave portion 55 is formed in the inner bottom portion of each pin support hole 54, and an O-ring 62 that seals between the lower end portion of the BP 56 and the inner bottom portion of the pin support hole 54 is fitted therein. With this structure (corresponding to the switching structure according to the present invention), the communication state of the internal passage 56a and the negative pressure passage 64 is automatically switched according to the position of the BP 56, and is locked to the drawing position among the plurality of BPs 56. Negative pressure is supplied only to the existing BP 56. That is, as shown in the right diagram of FIG. 6, in the state where the BP 56 is locked at the drawing position, the opening on the lower end side of the BP 56 in the internal passage 56 a is connected to the negative pressure passage 64 via the pin support hole 54. Thus, a negative pressure is supplied to the tip of the BP 56 through the internal passage 56a. On the other hand, when the BP 56 is in the storage position, as shown in the left diagram of FIG. 6, the space between the lower end surface of the BP 56 and the inner bottom portion of the pin support hole 54 is sealed by the O-ring 62. The passage 56a and the negative pressure passage 64 are cut off, and thereby the supply of negative pressure to the BP 56 is cut off.

  As shown in the left diagram of FIG. 6, even when the BP 56 is in the storage position, the outer periphery of the lower end of the BP 56 (the outer periphery of the lower portion than the seal portion by the Y packing 60) and the inner peripheral surface of the pin support hole 54 A minute gap is formed between them. Therefore, even when, for example, the BP 56 in the middle portion among the plurality of BPs 56 arranged in the Y-axis direction is in the accommodation position, the supply of negative pressure to the BP 56 positioned in front of the BP 56 is not delayed.

  As shown in FIG. 3, the horizontal table 76 is a mounting table for installing the pin holder base 50. In the present embodiment, the upper table 76a and the lower table 76b have two upper and lower stages. Yes. Although the upper table 76a and the lower table 76b are not shown in detail, they are connected to each other vertically via height adjusting mechanisms 77 provided at a plurality of locations. Accordingly, the height in the surface of the upper table 76a is set to each height. By performing fine adjustment with the adjustment mechanism 77, the level of the upper table 76a, that is, the level of the pin holder base 50 can be secured more appropriately.

  The lifting mechanism 78 has a ball screw shaft 80 and a slide column 89 that support the horizontal table 76. The ball screw shaft 80 is supported by a bearing member 82 provided on the base 10 so as to be vertically displaceable, and is screwed and inserted into a nut member (not shown) that is rotatably supported by the bearing member 82. The tip (upper end) is fixed to the lower surface of the horizontal table 76 (lower table 76b). A driving pulley 84 is fitted on the nut member, and a driving belt 88 extends between the driving pulley 84 and a pulley 86 attached to a table (TB) driving motor 85 fixed to the base 10. It is installed. That is, the nut screw is rotationally driven by the table drive motor 85 via the drive belt 88 and the like, whereby the ball screw shaft 80 is displaced in the vertical direction, and the pin holder base 50 is moved up and down integrally with the horizontal table 76 by this displacement. An elevating mechanism 78 is configured so as to make it. The slide column 89 maintains the stability of the horizontal table 76, and is configured to expand and contract following the vertical movement of the horizontal table 76.

  FIG. 8 schematically shows a control system of the above-described component mounting apparatus in a block diagram. As shown in this figure, the component mounting apparatus has a controller 100 that comprehensively controls component mounting operations.

  The controller 100 includes an arithmetic processing unit 102 constituted by a CPU or the like, and also has functional configurations such as a program storage unit 104, a conveyance system data storage unit 106, a motor control unit 108, an external input / output unit 110, and an image processing unit 112. I have.

  The program storage unit 104 stores a mounting program for executing a series of mounting operations by the head unit 15 and the like, a setup program for executing the setup operation of the BP 56 at the previous stage, and the like. The storage means 106 stores various data relating to the setup of the transport system such as the size of the substrate P and the interval of the conveyor 12 corresponding to the jig substrate 120 described later.

  The motor control unit 108 controls driving of the motors 20, 22 and the like according to the program, and the external input / output unit 110 controls input / output of various signals between the controller 100 and external devices. The external input / output unit 110 is connected to the clamp device 43, the negative pressure generator 66, the shutter switching valve 73, and various sensors.

  The image processing unit 112 performs predetermined processing on the image data output from the imaging units 24 and 25, and the arithmetic processing unit 102 performs fiducial marks and post-processing on the substrate P based on the image data. It is configured to recognize the ID mark on the component substrate 120.

  Note that a display unit 114 such as a liquid crystal display panel is connected to the controller 100, and various types of information associated with component mounting operations are notified to the operator via the display unit 114.

  With the above configuration, the controller 100 reads various programs and data from the storage means 104 and 106 according to the situation and executes predetermined operations. That is, during the mounting operation, the X-axis and Y-axis servomotors 20 and 22 are driven and controlled based on the mounting program to mount components on the board P, and the board P is changed to the type and size. If this occurs, as described below, the drive motor 85 is driven based on the setup program, or the setup (change) operation of the BP 56 is executed by switching the shutter switching valve 73. It has become.

  Hereinafter, the setup work operation of the BP 56 based on the control of the controller 100 will be described with reference to the flowchart of FIG.

  In this process, first, the setup program and various data necessary for the setup are read from the program storage means 104 and 106, and the width of the conveyor 12 is automatically set to a width corresponding to the jig substrate 120 (step S1). ). At this stage, it is assumed that the pin holder base 50 of the substrate support device 11 is disposed at the lowered end position, and the shutter 52 is set at the locking release position. Accordingly, all the BPs 56 are lowered by their own weight and are set in the accommodation position.

  Then, when the operator places the jig substrate 120 on the conveyor 12 and performs a predetermined input operation, the conveyor 12 is activated and the jig substrate 120 is carried into the work position (step S3).

  Here, the jig substrate 120 is a jig (corresponding to the backup pin pull-out jig according to the present invention) for pulling out the BP 56 accommodated in the substrate support device 11 to the pull-out position. As schematically shown, for example, a substrate main body 121 (corresponding to a main body portion) made of, for example, aluminum or a resin board, and a pin member 124 (corresponding to a drawer member) detachably attached to the substrate main body 121; It is composed of A plurality of pin holes 122 (corresponding to mounting portions) penetrating in the thickness direction are formed in the substrate body 121. These pin holes 122 are arranged in the same manner as the pin support holes 54 of the pin holder base 50. Therefore, when the jig substrate 120 (substrate body 121) is positioned at the above-described working position according to a predetermined condition, The holes 122 and the pin support holes 54 of the pin holder base 50 are configured so as to correspond vertically.

  The pin member 124 is a metal pin with a permanent magnet 126 assembled at the front end, and a hook-shaped stopper 125 is provided at the rear end. Then, as shown in the figure, it is inserted into the pin hole 122 from above the jig substrate 120, and is inserted into the substrate body 121 with the magnet 126 side protruding below the jig substrate 120. ing.

  In step S3, the jig substrate 120 having the pin member 124 inserted into the substrate body 121 in advance so as to have the same arrangement as the BP 56 suitable for the production substrate P is put into the conveyor 12. 11, the jig substrate 120 is carried into the work position.

  When the jig substrate 120 is carried into the work position, the head unit 15 is moved, and an ID mark written on the jig substrate 120 is imaged by the first imaging unit 24, and ID recognition of the jig substrate 120 is performed. Then, based on the ID, it is determined whether or not the jig substrate 120 is appropriate, that is, whether or not the jig is used in the component mounting apparatus (step S7). Here, when it determines with NO, it transfers to step S17 and the jig | tool board | substrate 120 is carried out by the conveyor 12. FIG.

  On the other hand, when it determines with YES by step S7, BP56 accommodated in the pin holder base 50 of the board | substrate support apparatus 11 is pulled out. Specifically, the horizontal table 76 is moved up and down by the operation of the drive motor 85, and accordingly, the pin holder base 50 is placed at a predetermined height position, that is, at the tip of the pin member 124 inserted into the jig substrate 120. Are disposed at a height position where the front ends of the two abut or approach each other, and then immediately descend to be disposed at a predetermined shutter operating height position (steps S9 and S11). When the pin holder base 50 moves up and down in this way, as shown in FIGS. 12 and 13, the BP 56 housed in the pin holder base 50 that faces the pin member 124 of the jig substrate 120, that is, the production substrate Only the BP 56 suitable for P is attracted to the pin member 124 by the magnetic force of the magnet 126, and the BP 56 is pulled out from the pin support hole 54 as the pin holder base 50 is lowered. The shutter operating height position is a height position at which the collar portion 57 of the BP 56 to be pulled out and the stepped portion of the pin support hole 54 abut each other.

  When the pin holder base 50 is disposed at the shutter operating height position, the shutter 52 is displaced from the locking release position to the locking position by switching air supply / discharge to the air cylinder 74. As a result, the BP 56 drawn out is locked together at the drawing position (step S13).

  Next, the horizontal table 76 is lowered by the operation of the drive motor 85, and the pin holder base 50 is disposed at the lowered end position (step S15). Along with this lowering, the BP 56 is separated from the jig substrate 120 (pin member 124) as shown in FIG. Thereafter, the conveyor 12 is operated and the jig substrate 120 is unloaded from the work position (step S17), whereby the drawing of the BP 56 corresponding to the production substrate P, that is, a series of setup operations is completed.

  Although the drawing operation of the BP 56 has been described here, for example, after the mounting operation is completed, the position of the shutter 52 is switched from the locking position to the locking release position by switching air supply / discharge to the air cylinder 74. When the shutter 52 is switched to the unlocking position, the wide width portion 72 of the opening 70 and the pin support hole 54 are matched, so that the BP 56 set at the drawing position is lowered by its own weight, and the BP 56 is collectively moved. Will be reset to the accommodation position.

  When the setup work of the BP 56 is completed as described above, the parts mounting work on the board P is started. Hereinafter, a mounting operation based on the control of the controller 100 will be briefly described.

  First, the production substrate P is carried into the work position by the operation of the conveyor 12, and the substrate P is fixed to the work position by the operation of the clamp device 43. Specifically, by the operation of the clamp device 43, the substrate P is lifted from the conveyor 12, and the substrate P is pressed against the pressing piece 42 from below.

  Thereafter, the substrate support device 11 is operated, whereby the substrate P is supported by the BP 56. Specifically, the horizontal table 76 is raised by the operation of the drive motor 85, and accordingly, the pin holder base 50 is disposed at a predetermined support height position. That is, as shown in FIG. 3, the leading end of the drawn BP 56 is arranged at a height position where it abuts against the lower surface of the substrate P fixed at the working position. Thereby, a predetermined portion of the substrate P is supported by the BP 56 from the lower surface side.

  When the pin holder base 50 is disposed at the support height position, negative pressure is supplied from the negative pressure generating device 66 to each negative pressure passage 64 through the negative pressure supply pipe 65, and the BP 56 locked at the drawing position. Negative pressure is supplied to the tip of the tube. Thereby, the lower surface of the substrate P is adsorbed by the BP56. Thus, by adsorb | sucking the board | substrate P, the curvature and bending of the said board | substrate P are corrected, and the board | substrate P is supported in a horizontal state.

  When negative pressure is supplied to each negative pressure passage 64 as described above, as shown in FIG. 6, the BP 56 (BP 56 on the right side in the drawing) that is locked at the drawing position of the BP 56 The internal passage 56a and the negative pressure passage 64 communicate with each other. Therefore, negative pressure is supplied to the tip of the BP 56 through the negative pressure passage 64, the pin support hole 54, and the internal passage 56a. On the other hand, for the other BP 56 (BP 56 in the storage position: BP 56 on the left side in the figure), the lower end surface of the BP 56 abuts against the O-ring 62, whereby the internal passage 56a is blocked from the negative pressure passage 64, and The pin support hole 54 (pore portion 54 a) is blocked from the negative pressure passage 64 by the Y packing 60 fitted on the BP 56. Therefore, the negative pressure is supplied only to the tip of the BP 56 locked at the drawing position, and the negative pressure is prevented from leaking from the other BP 56 and the pin support hole 54 in which it is accommodated.

  When the substrate P is thus supported by the substrate support device 11, the head unit 15 moves to the feeder installation region 13 and the components are adsorbed by the heads 16. Specifically, the head 16 is disposed above the tape feeder 14, and components in the tape are picked up and taken out by the nozzle 16 a as the head 16 moves up and down. At this time, if possible, the components are simultaneously removed from the plurality of tape feeders 14 by the plurality of heads 16.

  When the suction of the components is completed, the head unit 15 moves from the feeder installation area 13 onto the substrate P at the work position. During this movement, the parts adsorbed to each head 16 are imaged by the head unit 15 passing over the second imaging unit 25, and the adsorbing state (adsorption deviation) of the parts by each head 16 based on the image data. And the target position (the movement target of the head unit 15) is corrected based on this suction deviation. When the head unit 15 reaches the substrate P, the first component is mounted on the substrate P as the head 16 moves up and down, and thereafter the remaining suction components are sequentially moved while the head unit 15 intermittently moves to the mounting point. Is mounted on the substrate P. At this time, as a result of the substrate P being supported in a horizontal state by the BP 56 as described above, the component sucked by the head 16 is disposed at an appropriate height position with respect to the mounting surface on the substrate P. Accordingly, damage to components due to the collision with the substrate P and occurrence of mounting defects due to the release of the suction state of the components above the substrate P are effectively prevented, and the component mounting operation is appropriately advanced. .

  As described above, in this component mounting apparatus (board support method), the board support apparatus 11 that accommodates a plurality of BPs 56 so as to be drawable is disposed in the lower region of the work position, and among these BPs 56, the production board P is supported. Since only the BP 56 suitable for use is pulled out to the drawer position and used, the backup pin is removed during transportation as in the conventional apparatus (method) in which the backup pin is inserted and removed to carry the pin to and from the storage location. There is no room for problems such as falling off. In addition, unlike the conventional apparatus (method), it is not necessary to provide a separate space for storing unused backup pins other than the area below the work position. Therefore, according to this component mounting apparatus (board support method), the setup work of the BP 56 can be performed accurately and reliably, and space saving of the board support apparatus 11 and the component mounting apparatus can be achieved.

  In the above component mounting apparatus (board support method), the BP 56 corresponding to the board to be produced P is drawn at a time by using the jig substrate 120 in the setup work of the BP 56, and the BP 56 is further moved by the operation of the shutter 52. They are locked together at the drawer position. At the end of production of the substrate P, the shutter 52 is reset from the locking position to the locking release position, so that the plurality of BPs 56 locked at the drawing position are collectively reset to the receiving position. Therefore, the setup work time of the BP 56 can be greatly reduced as compared with the conventional apparatus (method) in which the backup pins are inserted and removed and the pins are conveyed one by one from the storage location. Therefore, according to this component mounting apparatus (board support method), there is an advantage that the productivity of the board can be improved.

  Moreover, with respect to the jig substrate 120, as described above, the magnetic adsorption force is generated between the jig substrate 120 and the BP 56 so that the BP 56 is pulled out. There is also an advantage that the subsequent BP 56 and the jig substrate 120 can be separated very quickly and smoothly. In addition, the jig substrate 120 includes a substrate body 121 having a pin hole 122 formed in the same arrangement as that of the BP 56 and a pin member 124 removably inserted into the pin hole 122. Accordingly, since the pin member 124 is selectively inserted into the pin hole 122, the jig substrate 120 can be shared with a plurality of sizes or types of substrates P. There are also advantages.

  Further, in the substrate support apparatus 11 described above, the substrate P is supported in a state where the warp and the deflection of the substrate P are corrected by supplying a negative pressure to the tip of the BP 56 formed at the drawing position to attract the substrate P. However, in the substrate support device 11, as described above, the negative pressure is supplied to each pin support hole 54 through the negative pressure passage 64, and the BP 56 is naturally locked in the pulled-out position. While the internal passage 56a and the negative pressure passage 64 communicate with each other, the lower end portion of the BP 56 contacts the O-ring 62 and the internal passage 56a is cut off from the negative pressure passage 64 when the BP 56 is accommodated in the accommodation position. It has a structure. That is, the BP 56 itself has a structure that functions as an on-off valve that switches between supplying and shutting off the negative pressure to the tip of the BP 56. Therefore, as compared with the conventional device in which a dedicated opening / closing valve is provided for each pin support hole to switch the supply and shutoff of the negative pressure to each backup pin, it is not necessary to provide a dedicated opening / closing valve for each pin support hole 54. There is also an advantage that the substrate support device 11 and the component mounting device on which the substrate support device 11 is mounted can be configured inexpensively and compactly.

  By the way, the above-described component mounting apparatus (substrate support method) is an example of a preferred embodiment of the component mounting apparatus according to the present invention (component mounting apparatus mounting the substrate support apparatus according to the present invention). The specific configuration of the substrate support device 11 and the specific support method of the substrate P can be changed as appropriate without departing from the scope of the present invention.

  For example, in the above embodiment, after the BP 56 is pulled out by the jig substrate 120 in the setup work of the BP 56 (see FIG. 9), the horizontal table 76 is lowered to separate the jig substrate 120 (pin member 124) from the BP 56. (Step S15), however, the detachment may be performed by the operation of the clamp device 43. Specifically, as shown in the flowchart of FIG. 16, after the shutter 52 is displaced from the locking release position to the locking position (step S13), the jig substrate 120 is clamped by the clamp device 43 as shown in FIG. Is lifted from the conveyor 12 and clamped (step S16), whereby the jig substrate 120 (pin member 124) and the BP 56 are separated, and then the clamp is released to return the conveyor 12 onto the conveyor 12 (step S16 ′). You may do it. In this case, there is a clearance (play) between the lower surface of the flange portion 57 of the BP 56 and the upper surface of the shutter 52. When the jig substrate 120 is lifted and the BP 56 is separated, the BP 56 is lowered by its own weight. Therefore, even if the jig substrate 120 is returned to the conveyor 12 again, the BP 56 is not attracted to the jig substrate 120 again. The jig substrate 120 (pin member 124) and the BP 56 may be separated by such a procedure. In FIG. 16, the processing operations in steps S1 to S13 and S17 are basically the same as the processing operations in FIG.

  In the above embodiment, the magnet 126 is provided on the pin member 124 and the BP 56 is pulled out by the magnetic force of the magnet 126 with respect to the jig substrate 120. Of course, instead of providing the magnet 126 on the pin member 124, a magnet is provided on the BP 56 side. You may make it provide. In short, the jig substrate 120 only needs to generate a magnetic attraction force between the jig substrate 120 and the desired BP 56. Note that the jig substrate 120 may be provided with a mechanism for picking up the BP 56 and pulling it up, for example, in addition to the one that generates the magnetic attractive force between the jig substrate 120 and the BP 56. .

  In the embodiment, as an example of mounting the substrate support device 11 (the substrate support device according to the present invention), a case where the substrate support device 11 is mounted on a component mounting device has been described. The present invention can be similarly applied to various application devices such as a printing device and a dispenser that apply various pastes such as the above on the substrate P, and a substrate inspection device that inspects the mounting state of components on the substrate P and the application state of the paste. .

  FIG. 18 schematically shows a screen printing apparatus which is one of such coating apparatuses. In the figure, reference numeral 210 denotes a base, and reference numeral 212 denotes a conveyor for transporting the substrate. A substrate support device 11 similar to the component mounting device is disposed in a lower region of the conveyance path of the conveyor 212.

  On the other hand, a mask 214 having a predetermined pattern of openings is held by a mask support frame 216 above the conveyor 212. The mask support frame 216 is fixed to a frame (not shown) integrated with the base 210. In the figure, reference numeral 218 denotes a squeegee head, and reference numeral 220 denotes a squeegee fixed to the squeegee head 218. The squeegee head 218 is configured to move in the Y-axis direction by a moving mechanism.

  In this screen printing apparatus, cream solder is printed (applied) on the substrate P as follows.

  In this apparatus as well, it is necessary to set up the BP 56 according to the size and type of the board P. Therefore, as in the case of the component mounting apparatus, the jig board 120 is first put into the conveyor 212, and the desired BP 56 is inserted into the pin holder. It is drawn from the base 50. When the setup of the BP 56 is completed, the substrate P is carried into the work position above the substrate support device 11 by the conveyor 212, and the substrate P is lifted from the conveyor 212 while being supported by the BP 56, and the mask 214 Is overloaded. At this time, the lower surface of the substrate P is adsorbed and supported by the BP 56, so that the substrate P is appropriately mounted on the mask 214 without a gap in a state where the warp and the deflection of the substrate P are corrected. Thereafter, cream solder is supplied onto the mask 214, and the cream solder is applied onto the substrate P through the mask opening while being expanded on the mask by the operation of the squeegee. And after application | coating of cream solder, the board | substrate P is returned on the conveyor 212 in the reverse procedure to the above, and is carried out by the action | operation of the said conveyor 212. FIG.

  Such a cream solder printing apparatus is also the same as the component mounting apparatus in that the substrate support apparatus 11 is applied as an apparatus for supporting the substrate P. Therefore, the same effects as the component mounting apparatus can be enjoyed. can do.

  In addition, although illustration is abbreviate | omitted about a dispenser and a board | substrate inspection apparatus, these apparatuses have the structure similar to the component mounting apparatus. That is, the substrate is carried into a predetermined working position by a conveyor, and the substrate is subjected to predetermined processing by a movable head in a state where the substrate is supported by the backup pin at the working position. Specifically, the dispenser includes a dispensing head having a paste coating nozzle as the head, and various pastes are spot-coated at predetermined positions on the substrate by the dispenser head. On the other hand, the board inspection apparatus includes an imaging unit as the head, images the substrate by the imaging unit, and executes predetermined inspections such as a component mounting state and a paste application state based on the image data. Therefore, even in such a dispenser and board inspection apparatus, the same effects as those of the component mounting apparatus can be obtained by applying the board support apparatus 11 as an apparatus for supporting the board.

1 is a plan view showing a schematic configuration of a component mounting apparatus according to the present invention (a component mounting apparatus on which a substrate supporting apparatus according to the present invention is mounted: a component mounting apparatus to which a substrate supporting method according to the present invention is applied). It is a front view which shows schematic structure of a component mounting apparatus. It is sectional drawing (III-III sectional view taken on the line of FIG. 1) which shows schematic structure of a conveyor and a board | substrate support apparatus. It is an enlarged view of FIG. 3 which shows the structure of a board | substrate support apparatus. It is a top view (V arrow line view of FIG. 4) which shows the structure of a board | substrate support apparatus. FIG. 5 is an enlarged view of a main part of FIG. 4 showing the configuration of the substrate support device (enlarged view of a portion surrounded by a one-dot chain line in FIG. 4). It is sectional drawing (VII-VII sectional view taken on the line of FIG. 4) which shows the structure of a board | substrate support apparatus ((a) is a state in which the shutter was set to the latching release position, (b) is a shutter set to the latching position. Each state is shown). It is a block diagram which shows the control system of a component mounting apparatus. It is a flowchart which shows the procedure of the setup operation | work of a backup pin based on control of a controller. It is sectional drawing which shows schematic structure of a jig | tool board | substrate. It is a figure corresponding to FIG. 3 (cross-sectional view of a conveyor and a board | substrate support apparatus) explaining the setup operation | movement operation | work of a backup pin (The state where the jig | tool board | substrate was carried in to the work position is shown). FIG. 4 is a view corresponding to FIG. 3 (cross-sectional view of the conveyor and the substrate support device) for explaining the backup pin setup work operation (the pin holder at a height position where the tip of the backup pin abuts on the tip of the pin member of the jig substrate) (Indicates the base is in place). It is a figure corresponding to FIG. 3 (sectional drawing of a conveyor and a board | substrate support apparatus) explaining the setup operation | movement operation | work of a backup pin (The state in which the pin holder base is arrange | positioned in the shutter operation position is shown). It is a figure corresponding to FIG. 3 (cross-sectional view of a conveyor and a board | substrate support apparatus) explaining the setup work operation | movement of a backup pin (The state which the shutter was switched from the latch release position to the latch position) is shown. It is a figure corresponding to FIG. 3 (cross-sectional view of a conveyor and a board | substrate support apparatus) explaining the setup operation operation | movement of a backup pin (The state which the backup pin was cut away from the jig | tool board | substrate is shown). It is a flowchart which shows the other procedure of the setup work operation | movement of a backup pin. It is a figure corresponding to FIG. 3 (cross-sectional view of a conveyor and a board | substrate support apparatus) explaining the setup operation | movement operation | movement of a backup pin (The cutting-off operation of the backup pin from a jig | tool board | substrate is shown). It is a plane schematic diagram which shows schematic structure of a screen printing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Board | substrate support apparatus 12 Conveyor 14 Tape feeder 15 Head unit 16 Head 50 Pin holder base 51 Base main body 52 Shutter 54 Pin support hole 56 Backup pin (BP)
76 Horizontal table 78 Elevating mechanism P Printed circuit board

Claims (13)

A method of supporting a substrate carried into a predetermined work position with a backup pin,
A plurality of backup pins are preliminarily arranged in a region below the working position in a predetermined arrangement and are held by a holding member so as to be able to be pulled out toward the working position, and are suitable for supporting the substrate from among the plurality of backup pins. The backup pin is selected, and the backup pin is pulled out from the holding member and locked at the pull-out position by a predetermined locking means. After carrying the substrate into the working position, the holding member and the substrate are relatively moved. A substrate support method, wherein the substrate is supported by a backup pin locked at the drawing position by being displaced vertically. The substrate support method according to claim 1,
A jig member capable of pulling out a backup pin from the holding member is used, the jig member is disposed at the working position, and backup pins suitable for supporting the substrate are collectively pulled out by the jig member and the backup is performed. A substrate supporting method, wherein the pins are collectively locked by the locking means. The substrate support method according to claim 2,
A substrate support method, wherein the backup pins are pulled out from the holding member in a lump by a magnetic attractive force. The substrate supporting method according to any one of claims 1 to 3,
A substrate supporting method, wherein a negative pressure is supplied to the tip of each backup pin through the inside thereof to support the substrate in a state of being sucked by the backup pin. A substrate support device that is disposed in a lower region of a work position for performing a predetermined work on the substrate and supports the substrate carried into the work position by a backup pin,
A plurality of the backup pins, holding members that hold the backup pins in a predetermined arrangement and that can be pulled out to the working position side;
Locking means for locking the backup pin pulled out from the holding member to the pull-out position;
A substrate support apparatus, comprising: a moving unit that relatively displaces the substrate disposed at the working position and the holding member in a vertical direction. The substrate support apparatus according to claim 5,
The substrate supporting device is characterized in that the locking means is configured to collectively lock the pulled-out backup pins at the pulled-out position and to release the locked state at once. The substrate support apparatus according to claim 5 or 6,
An internal passage that opens to the tip end portion of the pin is formed inside the backup pin, and further includes negative pressure supply means for supplying a negative pressure to the internal passage. The substrate support apparatus according to claim 7, wherein
The holding member is configured to house each backup pin in a pin support hole so as to be freely drawn out, and the negative pressure supply means includes a negative pressure passage for supplying a negative pressure to each pin support hole, The backup pin and the pin support hole have a switching structure for switching the communication state between the internal passage and the negative pressure passage according to the position of the backup pin, and the switching pin is accommodated in the pin support hole. The substrate support apparatus is characterized in that the internal passage is blocked from the negative pressure passage in a state where the internal passage is provided, and the internal passage is communicated with the negative pressure passage in other states. The substrate support apparatus according to any one of claims 4 to 8,
When a predetermined jig having a magnetic material is disposed at the working position, the backup pin generates a magnetic attracting force with the jig member, and is pulled out of the holding member by the attraction force. It is comprised in the board support apparatus characterized by the above-mentioned. A jig that is used together with the substrate support device according to claim 9 and that pulls out the backup pin accommodated in the substrate support device by being disposed at the work position,
A main body portion and a drawer member attached to the main body portion, and the main body portion is provided with a mounting portion on which the drawer member can be attached and detached in the same arrangement as a backup pin in the substrate support device, The drawing member includes a portion made of a magnetic material, and is attached to the main body portion and disposed at the working position together with the main body portion, thereby generating the magnetic attraction force with the backup pin. The backup pin pulling jig is configured to pull out the backup pin from the substrate support device by the suction force. In a component mounting apparatus that mounts a component on the upper surface of the board in a state where the board carried into a predetermined work position is supported by a board support device disposed in a lower region of the work position.
A component mounting apparatus comprising the board support apparatus according to claim 5 as the board support apparatus. In a coating apparatus for applying a paste such as solder on the upper surface of the substrate in a state where the substrate carried into a predetermined working position is supported by a substrate supporting device disposed in a lower region of the working position,
A coating apparatus comprising the substrate support device according to claim 5 as the substrate support device. Inspecting at least one of a paste application state such as solder or a component mounting state on the substrate while the substrate carried into a predetermined operation position is supported by a substrate support device disposed in a region below the operation position. In board inspection equipment
9. A substrate inspection apparatus comprising the substrate support device according to claim 5 as the substrate support device.

Images